EP3373323A3 - System zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts - Google Patents
System zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts Download PDFInfo
- Publication number
- EP3373323A3 EP3373323A3 EP18165410.4A EP18165410A EP3373323A3 EP 3373323 A3 EP3373323 A3 EP 3373323A3 EP 18165410 A EP18165410 A EP 18165410A EP 3373323 A3 EP3373323 A3 EP 3373323A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- processing location
- process gas
- valve
- particle beam
- beam system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 4
- 239000002245 particle Substances 0.000 title abstract 2
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/02—Pipe-line systems for gases or vapours
- F17D1/04—Pipe-line systems for gases or vapours for distribution of gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210001267 DE102012001267A1 (de) | 2012-01-23 | 2012-01-23 | Partikelstrahlsystem mit Zuführung von Prozessgas zu einem Bearbeitungsort |
EP13000334.6A EP2618361B1 (de) | 2012-01-23 | 2013-01-23 | Verfahren zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
Related Parent Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13000334.6A Division EP2618361B1 (de) | 2012-01-23 | 2013-01-23 | Verfahren zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
EP13000334.6A Division-Into EP2618361B1 (de) | 2012-01-23 | 2013-01-23 | Verfahren zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3373323A2 EP3373323A2 (de) | 2018-09-12 |
EP3373323A3 true EP3373323A3 (de) | 2018-12-05 |
EP3373323B1 EP3373323B1 (de) | 2020-12-30 |
Family
ID=47623905
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18165410.4A Active EP3373323B1 (de) | 2012-01-23 | 2013-01-23 | System zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
EP13000334.6A Active EP2618361B1 (de) | 2012-01-23 | 2013-01-23 | Verfahren zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13000334.6A Active EP2618361B1 (de) | 2012-01-23 | 2013-01-23 | Verfahren zum zuführen von mehreren reaktiven prozessgasen zu einer verarbeitungsstelle eines teilchenstrahlgeräts |
Country Status (4)
Country | Link |
---|---|
US (1) | US8969835B2 (de) |
EP (2) | EP3373323B1 (de) |
JP (1) | JP6231280B2 (de) |
DE (1) | DE102012001267A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014014572B4 (de) | 2014-09-30 | 2023-08-17 | Carl Zeiss Microscopy Gmbh | Verfahren zum Strukturieren eines Objekts mit Hilfe eines Partikelstrahlgeräts |
DE102015204091B4 (de) | 2015-03-06 | 2023-06-07 | Carl Zeiss Microscopy Gmbh | Verfahren und Vorrichtungen zur Ladungskompensation |
WO2022175061A2 (en) | 2021-02-18 | 2022-08-25 | Carl Zeiss Smt Gmbh | System to inspect, modify or analyze a region of interest of a sample by charged particles, set of systems to inspect, modify or analyze a region of interest of a sample and method to inspect, modify or analyze a region of interest of a sample by charged particles |
US12044638B2 (en) | 2021-02-18 | 2024-07-23 | Carl Zeiss Smt Gmbh | System to inspect, modify or analyze a region of interest of a sample by charged particles, set of systems to inspect, modify or analyze a region of interest of a sample and method to inspect, modify or analyze a region of interest of a sample by charged particles |
WO2022184760A1 (en) | 2021-03-03 | 2022-09-09 | Carl Zeiss Smt Gmbh | Gas injection subsystem for use in an inspection system to inspect a sample by use of charged particles and inspection system having such gas injection subsystem |
DE102021202941A1 (de) | 2021-03-25 | 2022-09-29 | Carl Zeiss Smt Gmbh | Gasinjektionssubsystem zur Verwendung in einem Untersuchungssystem zum Untersuchen einer Probe unter Verwendung von geladenen Teilchen und Untersuchungssystem, das ein solches Gasinjektionssubsystem aufweist |
DE102021132833A1 (de) | 2021-12-13 | 2023-06-15 | Carl Zeiss Microscopy Gmbh | Gaszuführungseinrichtung, System mit einer Gaszuführungseinrichtung sowie Teilchenstrahlgerät mit einer Gaszuführungseinrichtung oder dem System |
DE102021132834B4 (de) | 2021-12-13 | 2024-08-08 | Carl Zeiss Microscopy Gmbh | Gasreservoir, Gaszuführungseinrichtung mit einem Gasreservoir und Teilchenstrahlgerät mit einer Gaszuführungseinrichtung |
DE102021132832A1 (de) | 2021-12-13 | 2023-06-15 | Carl Zeiss Microscopy Gmbh | Gaszuführungseinrichtung, Teilchenstrahlgerät mit einer Gaszuführungseinrichtung sowie Verfahren zum Betrieb der Gaszuführungseinrichtung und des Teilchenstrahlgeräts |
DE102021214447A1 (de) | 2021-12-15 | 2023-06-15 | Carl Zeiss Smt Gmbh | Elektronenmikroskop zum Untersuchen einer Probe |
WO2023151946A1 (en) | 2022-02-10 | 2023-08-17 | Carl Zeiss Smt Gmbh | Method to investigate a semiconductor sample layer by layer and investigation device to perform such method |
DE102022118006B3 (de) | 2022-07-19 | 2023-11-16 | Carl Zeiss Microscopy Gmbh | Verfahren zum Bearbeiten einer Probe, Teilchenstrahlsystem und Computerprogrammprodukt |
Citations (12)
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WO2001003145A1 (en) * | 1999-07-02 | 2001-01-11 | Applied Materials, Inc. | Apparatus and method for examining specimen with a charged particle beam |
US20030190423A1 (en) * | 2002-04-08 | 2003-10-09 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US6661005B1 (en) * | 1998-11-09 | 2003-12-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method of examining and/or modifying surface structures of a sample |
US20050103272A1 (en) * | 2002-02-25 | 2005-05-19 | Leo Elektronenmikroskopie Gmbh | Material processing system and method |
US20060147626A1 (en) * | 2004-12-30 | 2006-07-06 | Blomberg Tom E | Method of pulsing vapor precursors in an ALD reactor |
US20070187622A1 (en) * | 2006-01-31 | 2007-08-16 | Osamu Nagano | Charged particle beam apparatus, defect correcting method, etching method, deposition method, and charge preventing method |
US20070194228A1 (en) * | 2006-02-23 | 2007-08-23 | Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Mbh | Charged particle beam device |
US20070224708A1 (en) * | 2006-03-21 | 2007-09-27 | Sowmya Krishnan | Mass pulse sensor and process-gas system and method |
US20090059717A1 (en) * | 2007-08-31 | 2009-03-05 | Ckd Corporation | Fluid mixing system and fluid mixing apparatus |
US20090223451A1 (en) * | 2008-03-08 | 2009-09-10 | Omniprobe, Inc. | Method and apparatus for precursor delivery system for irradiation beam instruments |
WO2011060444A2 (en) * | 2009-11-16 | 2011-05-19 | Fei Company | Gas delivery for beam processing systems |
US20110183523A1 (en) * | 2008-08-14 | 2011-07-28 | Carl Zeiss Sms Gmbh | method for electron beam induced etching of layers contaminated with gallium |
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JP2715423B2 (ja) * | 1988-01-27 | 1998-02-18 | 日本電気株式会社 | 化学蒸着法による薄膜形成装置 |
JPH02248390A (ja) * | 1989-03-22 | 1990-10-04 | Nec Corp | 分子線発生装置 |
JPH09184080A (ja) * | 1995-12-27 | 1997-07-15 | Vacuum Metallurgical Co Ltd | 超微粒子による薄膜形成方法、およびその薄膜形成装置 |
JP3505987B2 (ja) * | 1997-12-22 | 2004-03-15 | 日新電機株式会社 | シリコン系薄膜の形成方法及び成膜装置 |
US6157662A (en) * | 1999-02-12 | 2000-12-05 | Lambda Physik Gmbh | F2 (157nm) laser employing neon as the buffer gas |
JP2000282241A (ja) * | 1999-04-01 | 2000-10-10 | Matsushita Electric Ind Co Ltd | 多層薄膜の製造方法 |
JP4350333B2 (ja) * | 1999-11-22 | 2009-10-21 | エスアイアイ・ナノテクノロジー株式会社 | 化合物蒸気吹付け装置およびそれを用いた集束イオンビーム装置 |
JP3736322B2 (ja) * | 2000-04-26 | 2006-01-18 | 昭和電工株式会社 | 気相成長装置 |
DE10042098A1 (de) * | 2000-08-26 | 2002-03-14 | Deutsche Telekom Ag | Gasversorgung für Additive Lithographie |
JP2002129337A (ja) * | 2000-10-24 | 2002-05-09 | Applied Materials Inc | 気相堆積方法及び装置 |
JP4178741B2 (ja) | 2000-11-02 | 2008-11-12 | 株式会社日立製作所 | 荷電粒子線装置および試料作製装置 |
DE10208043B4 (de) | 2002-02-25 | 2011-01-13 | Carl Zeiss Nts Gmbh | Materialbearbeitungssystem und Materialbearbeitungsverfahren |
EP1774538A4 (de) * | 2004-07-29 | 2012-06-06 | Omniprobe Inc | Multiples gasinjektionssystem für strahlinstrumente geladener teilchen |
JP4627682B2 (ja) | 2005-05-27 | 2011-02-09 | 株式会社日立ハイテクノロジーズ | 試料作製装置および方法 |
US20080078745A1 (en) * | 2006-09-29 | 2008-04-03 | Zyvex Corporation | RF Coil Plasma Generation |
JP2008218866A (ja) * | 2007-03-07 | 2008-09-18 | Elpida Memory Inc | パターン形成方法およびパターン形成装置 |
DE102007054074A1 (de) | 2007-11-13 | 2009-05-14 | Carl Zeiss Nts Gmbh | System zum Bearbeiten eines Objekts |
TWI479570B (zh) | 2007-12-26 | 2015-04-01 | Nawotec Gmbh | 從樣本移除材料之方法及系統 |
US20100068408A1 (en) | 2008-09-16 | 2010-03-18 | Omniprobe, Inc. | Methods for electron-beam induced deposition of material inside energetic-beam microscopes |
US8278224B1 (en) * | 2009-09-24 | 2012-10-02 | Novellus Systems, Inc. | Flowable oxide deposition using rapid delivery of process gases |
US9719169B2 (en) * | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
-
2012
- 2012-01-23 DE DE201210001267 patent/DE102012001267A1/de not_active Ceased
-
2013
- 2013-01-22 US US13/746,560 patent/US8969835B2/en active Active
- 2013-01-23 EP EP18165410.4A patent/EP3373323B1/de active Active
- 2013-01-23 EP EP13000334.6A patent/EP2618361B1/de active Active
- 2013-01-23 JP JP2013010160A patent/JP6231280B2/ja active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6661005B1 (en) * | 1998-11-09 | 2003-12-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method of examining and/or modifying surface structures of a sample |
WO2001003145A1 (en) * | 1999-07-02 | 2001-01-11 | Applied Materials, Inc. | Apparatus and method for examining specimen with a charged particle beam |
US20050103272A1 (en) * | 2002-02-25 | 2005-05-19 | Leo Elektronenmikroskopie Gmbh | Material processing system and method |
US20030190423A1 (en) * | 2002-04-08 | 2003-10-09 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US20060147626A1 (en) * | 2004-12-30 | 2006-07-06 | Blomberg Tom E | Method of pulsing vapor precursors in an ALD reactor |
US20070187622A1 (en) * | 2006-01-31 | 2007-08-16 | Osamu Nagano | Charged particle beam apparatus, defect correcting method, etching method, deposition method, and charge preventing method |
US20070194228A1 (en) * | 2006-02-23 | 2007-08-23 | Ict Integrated Circuit Testing Gesellschaft Fur Halbleiterpruftechnik Mbh | Charged particle beam device |
US20070224708A1 (en) * | 2006-03-21 | 2007-09-27 | Sowmya Krishnan | Mass pulse sensor and process-gas system and method |
US20090059717A1 (en) * | 2007-08-31 | 2009-03-05 | Ckd Corporation | Fluid mixing system and fluid mixing apparatus |
US20090223451A1 (en) * | 2008-03-08 | 2009-09-10 | Omniprobe, Inc. | Method and apparatus for precursor delivery system for irradiation beam instruments |
US20110183523A1 (en) * | 2008-08-14 | 2011-07-28 | Carl Zeiss Sms Gmbh | method for electron beam induced etching of layers contaminated with gallium |
WO2011060444A2 (en) * | 2009-11-16 | 2011-05-19 | Fei Company | Gas delivery for beam processing systems |
Also Published As
Publication number | Publication date |
---|---|
EP3373323B1 (de) | 2020-12-30 |
EP2618361A2 (de) | 2013-07-24 |
JP2013167018A (ja) | 2013-08-29 |
EP2618361B1 (de) | 2018-05-23 |
EP2618361A3 (de) | 2015-07-22 |
EP3373323A2 (de) | 2018-09-12 |
JP6231280B2 (ja) | 2017-11-15 |
US20130187064A1 (en) | 2013-07-25 |
DE102012001267A1 (de) | 2013-07-25 |
US8969835B2 (en) | 2015-03-03 |
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