EP3358608A4 - Thermal bonding sheet, and thermal bonding sheet with dicing tape - Google Patents

Thermal bonding sheet, and thermal bonding sheet with dicing tape Download PDF

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Publication number
EP3358608A4
EP3358608A4 EP16851600.3A EP16851600A EP3358608A4 EP 3358608 A4 EP3358608 A4 EP 3358608A4 EP 16851600 A EP16851600 A EP 16851600A EP 3358608 A4 EP3358608 A4 EP 3358608A4
Authority
EP
European Patent Office
Prior art keywords
thermal bonding
bonding sheet
dicing tape
sheet
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16851600.3A
Other languages
German (de)
French (fr)
Other versions
EP3358608A1 (en
Inventor
Yuki Sugo
Nao KAMAKURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority claimed from PCT/JP2016/078570 external-priority patent/WO2017057429A1/en
Publication of EP3358608A1 publication Critical patent/EP3358608A1/en
Publication of EP3358608A4 publication Critical patent/EP3358608A4/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0635—Acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/068—Polycarbonate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
EP16851600.3A 2015-09-30 2016-09-28 Thermal bonding sheet, and thermal bonding sheet with dicing tape Pending EP3358608A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015194206 2015-09-30
JP2016184505A JP6858520B2 (en) 2015-09-30 2016-09-21 Sheet for heat bonding and sheet for heat bonding with dicing tape
PCT/JP2016/078570 WO2017057429A1 (en) 2015-09-30 2016-09-28 Thermal bonding sheet, and thermal bonding sheet with dicing tape

Publications (2)

Publication Number Publication Date
EP3358608A1 EP3358608A1 (en) 2018-08-08
EP3358608A4 true EP3358608A4 (en) 2018-10-03

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EP16851600.3A Pending EP3358608A4 (en) 2015-09-30 2016-09-28 Thermal bonding sheet, and thermal bonding sheet with dicing tape

Country Status (5)

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US (1) US10707184B2 (en)
EP (1) EP3358608A4 (en)
JP (1) JP6858520B2 (en)
CN (1) CN108174617B (en)
TW (1) TWI695045B (en)

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JP6864505B2 (en) 2016-06-24 2021-04-28 日東電工株式会社 Heat-bonding sheet and heat-bonding sheet with dicing tape
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JP2023098498A (en) * 2021-12-28 2023-07-10 三菱マテリアル株式会社 Bonding sheet, and method for producing bonded body

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Publication number Publication date
EP3358608A1 (en) 2018-08-08
JP2017069560A (en) 2017-04-06
US10707184B2 (en) 2020-07-07
TW201720896A (en) 2017-06-16
US20180269175A1 (en) 2018-09-20
JP6858520B2 (en) 2021-04-14
CN108174617B (en) 2021-06-01
CN108174617A (en) 2018-06-15
TWI695045B (en) 2020-06-01

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