EP3335250A1 - Production method for producing an electromechanical actuator and electromechanical actuator - Google Patents
Production method for producing an electromechanical actuator and electromechanical actuatorInfo
- Publication number
- EP3335250A1 EP3335250A1 EP16730355.1A EP16730355A EP3335250A1 EP 3335250 A1 EP3335250 A1 EP 3335250A1 EP 16730355 A EP16730355 A EP 16730355A EP 3335250 A1 EP3335250 A1 EP 3335250A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- stack
- insulating layer
- insulation layer
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000009413 insulation Methods 0.000 claims abstract description 79
- 230000005855 radiation Effects 0.000 claims description 21
- 238000002679 ablation Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 11
- 230000005670 electromagnetic radiation Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000004611 spectroscopical analysis Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 230000005684 electric field Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Connection electrodes of multilayer piezoelectric or electrostrictive devices, e.g. external electrodes
Definitions
- the invention relates to a manufacturing method for producing an electromechanical actuator and an electromechanical actuator, which has been produced in particular with such a manufacturing method.
- Electromechanical actuators are often used, for example in the form of piezo stacks, as actuators, for example in injection valves of various types of motor vehicle engines.
- Such electromechanical actuators generally have a plurality of piezoceramic layers which react with a longitudinal extent when an electric field is applied, and moreover comprise a plurality of electrode layers, wherein piezoceramic layers and electrode layers are arranged stacked alternately along a longitudinal axis.
- a stack is electrically contacted on two opposite side surfaces in order to be able to control the electrode layers in the stack, so that an electric field forms within the stack, to which the piezoceramic layers react by expansion.
- a Isola ⁇ tion layer which is then selectively removed in such a stack constructions are utilized to each second electrode layer to contact targeted.
- DE 10 2006 003 070 B3 describes, for example, that the insulation layer is removed at predetermined positions for contacting the electrode layers in a corresponding stack.
- Such an insulation layer on side surfaces of the stack usually has no continuous layer thickness, but has, especially when special coatings are used as insulation layers, across the side surfaces of the stack away a fluctuating layer thickness.
- electrode layers which are arranged under a greater layer thickness of the insulating layer, may not be completely exposed and thus a contact is not reliably possible.
- underlying insulation layer regions with a low layer thickness in turn damaged by an excessive erosion of the insulation layer, which is also undesirable.
- the object of the invention is therefore to propose an improved manufacturing process in this regard. This object is achieved with a production method with the feature combination of claim 1.
- An electromechanical actuator which has been produced in particular with such a manufacturing method, is the subject of the independent claim.
- an electrical component designed as a stack is first of all provided, which is formed from a plurality of piezoceramic layers and from a plurality of electrode layers, which are alternately stacked along a longitudinal axis of the stack. Then, an arranged parallel to the longitudinal axis of the stack Be ⁇ ten Design applied to at least an insulating layer, in such a manner that the electrode layers and the piezoelectric ceramic layers are covered by the insulating layer on the side surface. Subsequently, at least one of the electrode layers on the side surface of the stack is exposed by locally ablating a localized insulation layer region adjacent to the electrode layer to be exposed.
- a layer thickness of the ablated, localized insulation layer region is first detected perpendicular to the longitudinal axis, and then set a removal rate for removing the insulation ⁇ layer region of the detected film thickness of the insulating layer to be ablated area locally limited.
- the layer thickness of the insulating layer region which is located right next to the Elect ⁇ clear layer that should be exposed measured.
- a removal device in their Abtragungsparametern that is, in particular in the removal rate, be adjusted so that only the measured layer thickness of the insulation layer area is removed.
- the underlying electrode layer is reliably exposed, but not damaged, and also arranged adjacent to the exposed electrode layer
- Piezoceramic layers only slightly or not at all damaged.
- locally restricted is to be understood that there is a region of the insulation layer which is arranged directly be ⁇ nachbart to the electrode layer to be exposed. Along the longitudinal axis of the stack, this insulating layer region extends up to a maximum 30% in those adjacent to the electrode layer to be exposed
- the removal rate is also set locally limited, areas in which the layer thickness of the insulating layer is relatively large, can be reliably removed from the insulating layer, while other areas in which the layer thickness of the insulating layer is particularly small, in the
- Piezoceramic layers and the electrode layers are not damaged. That is, in insulating layers with widely varying layer thickness, as is typical for commonly used coatings, a removal method is used with a locally modulatable removal rate, so that the local ablation rate can be adapted to the local layer thickness.
- the parameters which determine the removal rate are locally resolved, that is to say adapted to the layer thickness of the insulation layer present at each location at which it is to be removed.
- the stack provided is preferably a fully active stack in which all electrode layers are advantageously brought to all side surfaces of the stack.
- the layer thicknesses of a plurality of locally limited insulation layer regions on the side surface are detected stepwise individually and the plurality of insulation layer regions are removed stepwise individually, the stepwise detection and the stepwise removal of the individual layer thicknesses being carried out directly in succession.
- the necessary local layer thickness information is preferably determined simultaneously to a stepwise removal of the insulation layer.
- the layer thicknesses can be detected in such a simultaneous operation by means of the so-called plasma spectroscopy.
- the insulating layer in the insulation ⁇ layer region wherein a plasma of the removed material is formed.
- the optical spectrum of plasma light includes spectral lines that allow one to deduce the material. As soon as the electromagnetic radiation strikes the piezoceramic layers or the electrode layers, the spectral lines change, so that it can be detected at which point the ablation process has to be stopped in order to prevent the piezoceramic layers or the electrode layers from being damaged.
- the layer thicknesses of a plurality of locally delimited insulation layer regions on the side surface of the stack are detected step by step and the plurality of insulation layer regions are removed step by step, wherein firstly all layer thicknesses of the plurality of insulation layer regions are detected step by step without removal steps therebetween and then the removal of the plurality of insulation layer regions step by step without detection steps in between.
- Layer thickness is determined in particular optically, for example ⁇ using an optical sensor device with an autofocus system. If the layer thickness of the respective insulation layer regions can be determined non-destructively, this is advantageous since more precisely the electrode layer to be exposed can be placed freely in the ⁇ ⁇ From transmission method.
- a material which is optically transparent in a predetermined wavelength range is used as the insulating layer material.
- This may be, for example, a polyimide.
- an optical path length of an electromagnetic radiation having a wavelength in the predetermined wavelength range is advantageously determined.
- the refractive index of the electromagnetic radiation in the known insulation layer material is advantageously known, so that the layer thickness of the insulation layer in the measured area can be calculated from the known refractive index and the detected optical path length of the electromagnetic radiation. If the insulation layer material is optically transparent, not only the insulation layer surface but also the surface of an underlying substrate can be detected, and the layer thickness can be determined from this difference using the known refractive index.
- a laser in particular ⁇ sondere an ultra short pulse laser, preferably used is advantageously a as a removing unit for removing the ablated insulating layer region
- Ultrashort pulse lasers have the advantage that due to their pulsed electromagnetic radiation, the laser parameters, on which the ablation rate depends, can be changed quite quickly and thus be adapted locally.
- the laser used can also be used as a sensor that emits electromagnetic radiation with which the layer thickness of isolati
- a modulatable optical mask and its image for structuring the insulation layer areas.
- a Intensi ⁇ tiquessmuster is generated by mapping in the form of a projection mask.
- a scanning device for stepwise guiding a laser radiation of the laser over an insulating layer surface is used for removing the insulation layer region.
- the ablation method is advantageously a scanning ablation method, since the ablation rate of the laser is rapidly modulated at each step and is thus adapted to the layer thickness of the insulation layer. The local removal can be adjusted at each position.
- the scanning device is not only used to guide the laser radiation of the laser, but in particular also for stepwise guiding a sensor device on the insulating layer surface for detecting the layer thickness of the insulation ⁇ layer region to be removed.
- the Sensorein ⁇ direction, the surface profile of the insulating layer in a scanning scan and determine the layer thickness for each step.
- the removal rate for removing the insulation layer area is advantageously set by changing a laser pulse number of the laser per area.
- the laser pulse rate can be the pitch adjusted by a scanning speed of the laser radiation on the insulating layer surface, that is the feed of the laser radiation, but also by a number of crossings over the same position on the insulating layer surface, or by a combination of both at ⁇ .
- the scanning speed of the scanning device moves before ⁇ geous in a range of 1.3 m / s to 2.0 m / s and can be varied in this area.
- the number of crossings can be set via one and the same point, so that a total of a predetermined number of laser pulses hits a point and ablates the insulating layer according to their layer thickness at this point.
- An electromechanical actuator which is produced in particular with the above-described manufacturing method, has an electrical component designed as a stack, which is formed from a plurality of piezoceramic layers and from a plurality of electrode layers which are arranged along one
- Longitudinal axis of the stack are alternately stacked.
- the stack has an iso ⁇ lations slaughter on at least one side surface.
- a trench is formed which extends entirely through the insulating layer of the electrical insulation layer adjacent ⁇ den slaughter region and in Electrode layer adjacent piezoceramic layers extends such that the electrode layer protrudes into the trench.
- the trench has trench walls arranged obliquely perpendicular to the longitudinal axis of the stack, wherein the trench tapers from the insulation layer surface in the direction of a stack center.
- Obliquely arranged trench walls have the advantage that a conductive adhesive chosen, for example, for contact can flow well into the trench from the outside, and thus an advantageous good contacting of the exposed electrode layer can be realized.
- the trench has ⁇ ben Scheme in the insulating layer a first Gra.
- Piezoceramic layers which are arranged along the longitudinal axis of the stack in each case adjacent to the exposed electrode layer, a second or third trench region.
- the trench walls in the first, second and third trench regions are each arranged obliquely perpendicular to the longitudinal axis of the stack. Overall, therefore, the trench in the longitudinal section through the stack advantageously has a W-shape.
- Fig. 1 shows a perspective view of an electromechanical actuator having an electrical component designed as a stack
- Fig. 2 is a longitudinal sectional view of the electrical component of FIG 1, which has in each case on two opposite side surfaces of an insulation layer ⁇
- Fig. 3 is a cut-tion layer of the electrical component of Figure 2 in the area of the side surface with the Isola ⁇ .
- Is available from insulating layer sections 4 is a longitudinal sectional view of the electrical component according to FIG 2, wherein a sensor ⁇ means for detecting a thickness of the insulating layer and a separate laser for parting wear..;
- FIG. 5 shows a longitudinal sectional illustration of the electrical component according to FIG. 2, wherein a laser is present, which is designed both as a sensor device for detecting the layer thickness of the insulation layer and as an ablation device;
- Fig. 6 is a schematic representation a) of detecting the
- FIG. 7 is a flow chart showing the steps involved in the FIG.
- Fig. 8 is an illustration of detecting the layer thickness
- Fig. 10 is a schematic sectional view, one from the
- Stack of the electrical component of FIG. 2 represents.
- Fig. 1 shows an electromechanical actuator 10, which has an electrical component 12, which is formed as a stack 14 ⁇ .
- a plurality of piezoceramic layers 16 that react with application of an electric field and a plurality of electrode layers 18 are alternately stacked in the stack 14 in such a way that each electrode layer 18 is arranged between two piezoceramic layers 16.
- the electrode layers 18 extend completely up to all side surfaces 20 of the stack 14, so that the electrical component 12 is a so-called fully active stack 14.
- At least one external contact in the form of an outer electrode 22 is applied, which electrically via a contacting element 24 with a
- Contacting pin 26 is connected. Via the contacting pin 26 and the contacting element 24 and the outer electrode 22, an electrical potential can be forwarded to the respective contacted electrode layer 18. Since mutually adjacent electrode layers 18 are to be subjected to different electrical potentials so as to generate an electric field in the stack 14 so that the piezoceramic layers 16 can change in length, two contacting pins 26 are present, each of which has a different electrical potential Potential is brought to the stack 14.
- an insulating layer 30 is usually applied to the side faces 20 to which an outer electrode 22 is applied.
- a stack 14 having such an insulating layer 30 on at least two side surfaces 20 extending parallel to a longitudinal axis 32 of the stack 14 is shown in FIG. 2 in a longitudinal section along the longitudinal axis 32 of the stack 14 of FIG.
- FIG. 3 shows a detail of the stack 14 in FIG. 2 in the region of the side surface 20 with the insulation layer 30 on a the piezoceramic layers 16, wherein it can be seen that a layer thickness D of the insulation layer 30 varies greatly locally along the longitudinal axis 32.
- a layer thickness D of the insulation layer 30 varies greatly locally along the longitudinal axis 32.
- Partial areas namely localized isolation layer areas 34, therefore, a laser 36, in particular a picosecond laser, is advantageously used, which emits a laser radiation 40 on the insulating layer 30 and thus ablates them, so that the underlying electrode layer 18 is exposed.
- the laser radiation 38 is guided over the insulating layer 30 by means of a scanning process by means of a scanning device 40, so that it is removed in regions.
- first device via a sensor prior to the removal of the insulating layer 30 is 42, the local layer thickness D layer region in the insulation ⁇ 34, which is to be removed, measured.
- the sensor device 42 is preferably an optical sensor device 42 having an autofocus system which emits an electromagnetic radiation EM, which, like the laser radiation 38, is guided stepwise over the insulation layer 30 on the side surface 20 via the scanning device 40.
- FIG. 4 the stack 14 of FIG. 2 together with a laser 36 and a sensor device 42 are shown, which are formed separately from each other, and their electromagnetic
- EM radiations are guided via a common scanning device 40 over the insulating layer 30 on one of the side surfaces 20 of the stack 14.
- Fig. 5 is an alternative Embodiment shown in which the laser 36 simultaneously forms the sensor device 42 and an ablation device 44 for removing the insulation layer region 34.
- the detection of the layer thickness D of the insulating layer 30 is advantageously carried out nondestructive. This is play as possible with ⁇ when an optically transparent material, such as polyimide 48 is used as the insulating layer material 46th
- the laser radiation 38 can penetrate the complete insulation layer 30 and thus also irradiate a surface of the piezoceramic layers 16 or of the electrode layers 18.
- an optical path length of the laser radiation 38 in the insulation layer material 46 can be detected, and then calculated back to the layer thickness D by the known refractive index.
- FIG. 7 is a corresponding flow chart illustrating the individual steps involved in exposing the exposed electrode layer 18 according to the procedure illustrated in FIG. 6.
- the stack 14 is provided and in a subsequent step, the insulation layer 30 is applied to at least one side face 20 of the stack 14. Thereafter, the insulating layer surface is completely scanned 50 in n steps with the sensor device 42, so as to detect all the layer thicknesses D of the insulation layer ⁇ 30th Only after the complete Isola ⁇ tion layer surface is scanned 50, the laser ⁇ radiation 38 is guided in n steps over the insulating layer surface 50, wherein the pulse number is set at every n-th step, the removal rate of the laser radiation 38, that is, and only then the insulation layer 30 is removed. The last two steps of setting and removing for each n-th step are thereby repeated until the isolati ⁇ onstikober Structure 50 is completely scanned.
- FIG. 8 shows an alternative procedure in which the detection of the layer thickness D at the individual insulation layer regions 34 as well as the removal of the insulation layer 30 at the insulation layer regions 34 are performed simultaneously.
- the layer thickness D is in each scanning step first measured and then directly ablating over the laser radiation 38 carried out, and then the electrostatic ⁇ magnetic radiation EM of the laser 36 and the sensor device conducted to the next position 42 where then also initially measured and then removed directly.
- FIG. 9 shows a corresponding flowchart which schematically illustrates the steps of such an approach.
- the stack 14 is provided and applied subsequently in a further step the insulation ⁇ layer 30 on at least one side surface 20 of the stack fourteenth
- the sensor device 42 under Using the scanning device 40 made a first step to measure a localized insulation layer region 34 according to its layer thickness D.
- the removal rate of the laser 36 is set to this measured layer thickness D and subsequently immediately the insulation ⁇ layer region 34, which has just been measured, removed.
- the last three steps, detecting a localized area, adjusting the removal rate corresponding to the detected value and immediate removal, are performed until the entire insulation layer surface 50 is scanned.
- FIG. 10 shows a section of the stack 14 from FIG. 2 after the insulation layer 30 has been removed in a locally limited insulation layer area 34 as described above.
- a trench 52 has been created which extends completely through the insulation layer 30.
- the trench 52 further extends very slightly into the piezoceramic layers 16 adjacent to the electrode layer 18 along the longitudinal axis 32, in such a way that the electrode layer 18 protrudes into the trench.
- Trench walls 54 of the trench 52 are arranged obliquely perpendicular to the longitudinal axis 32 of the stack 14, so that the trench 52, starting from the insulation layer surface 50, tapers towards a stack center 56.
- the trench 52 has a plurality of trench regions, namely a first trench region in the insulation layer 30, and a second or third trench region in each case in the adjacent to the electrode layer 18 piezoceramic layers 16. All trench walls 54 of the individual trench regions are arranged perpendicular to the longitudinal axis 82 obliquely. Therefore, a conductive adhesive used, for example, for contacting can flow well into the entire trench 52 and thus realize good contacting of the exposed electrode layer 18.
- the trench 52 has a shape corresponding to a W.
- This W-shape can be generated by the fact that the laser radiation 38, which removes the insulating layer 30 in the insulating layer region 34, as selectively adjusted, for example, in terms of their energy, that the insulating layer 30 there completely and the piezoceramic layers 16 are removed very slightly.
- the protrusion of the electrode layer 18 can be achieved, whereby a contacting of the electrode layer 18 can be realized not only on the side surface 20, but also on end faces 58 of the electrode layer 18, which is normally from the adjacent
- Piezoceramic layers 16 are covered.
- the removal rate can be set precisely and quickly. If the local layer thickness D of the polyimide 48 is known, the local ablation rate can be correspondingly adapted and an adaptive ablation can be realized by a correspondingly fast modulation of the laser or scan parameters.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015215204.9A DE102015215204A1 (en) | 2015-08-10 | 2015-08-10 | Manufacturing method for manufacturing an electromechanical actuator and electromechanical actuator. |
PCT/EP2016/063851 WO2017025228A1 (en) | 2015-08-10 | 2016-06-16 | Production method for producing an electromechanical actuator and electromechanical actuator |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3335250A1 true EP3335250A1 (en) | 2018-06-20 |
EP3335250B1 EP3335250B1 (en) | 2021-12-15 |
Family
ID=56137323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16730355.1A Active EP3335250B1 (en) | 2015-08-10 | 2016-06-16 | Production method for producing an electromechanical actuator |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3335250B1 (en) |
JP (1) | JP2018532257A (en) |
KR (1) | KR102120570B1 (en) |
CN (1) | CN107851709B (en) |
DE (1) | DE102015215204A1 (en) |
WO (1) | WO2017025228A1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203999A (en) * | 2000-11-06 | 2002-07-19 | Denso Corp | Laminated type piezoelectric-substance element and the manufacturing method thereof |
US6462460B1 (en) * | 2001-04-27 | 2002-10-08 | Nokia Corporation | Method and system for wafer-level tuning of bulk acoustic wave resonators and filters |
EP2012374B1 (en) * | 2003-09-24 | 2012-04-25 | Kyocera Corporation | Multi-layer piezoelectric element |
JP4934988B2 (en) * | 2004-07-27 | 2012-05-23 | 株式会社デンソー | Multilayer piezoelectric element and injector using the same |
US20080138637A1 (en) * | 2004-12-17 | 2008-06-12 | Masami Yanagida | Polyimide Multilayer Adhesive Film And Method For Producing The Same |
US7638731B2 (en) * | 2005-10-18 | 2009-12-29 | Electro Scientific Industries, Inc. | Real time target topography tracking during laser processing |
DE102006003070B3 (en) | 2006-01-20 | 2007-03-08 | Siemens Ag | Electrical contacting of stack of electronic components e.g. for piezo actuator, by covering insulating layers with electrically conductive material which also fills contact holes |
DE102008027115A1 (en) * | 2008-06-06 | 2009-12-24 | Continental Automotive Gmbh | Contact structure, electronic component with a contact structure and method for its production |
DE102012207598A1 (en) * | 2012-05-08 | 2013-11-14 | Continental Automotive Gmbh | Method for electrically contacting an electronic component as a stack and electronic component with a contacting structure |
-
2015
- 2015-08-10 DE DE102015215204.9A patent/DE102015215204A1/en not_active Withdrawn
-
2016
- 2016-06-16 EP EP16730355.1A patent/EP3335250B1/en active Active
- 2016-06-16 WO PCT/EP2016/063851 patent/WO2017025228A1/en active Application Filing
- 2016-06-16 JP JP2018506846A patent/JP2018532257A/en active Pending
- 2016-06-16 CN CN201680047000.4A patent/CN107851709B/en active Active
- 2016-06-16 KR KR1020187006808A patent/KR102120570B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2017025228A1 (en) | 2017-02-16 |
CN107851709B (en) | 2021-06-08 |
DE102015215204A1 (en) | 2017-02-16 |
EP3335250B1 (en) | 2021-12-15 |
JP2018532257A (en) | 2018-11-01 |
KR20180038039A (en) | 2018-04-13 |
CN107851709A (en) | 2018-03-27 |
KR102120570B1 (en) | 2020-06-16 |
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