EP3334845A1

EP3334845A1 - Oven device for heat treatment of a metal blank

Info

Publication number: EP3334845A1
Application number: EP16750855.5A
Authority: EP
Inventors: Gerald Eckertsberger; Thomas Fuchs; Fritz Josef Ebner; Heribert Lochner; Robert Ebner
Original assignee: Ebner Industrieofenbau GmbH
Current assignee: Ebner Industrieofenbau GmbH
Priority date: 2015-08-13
Filing date: 2016-08-12
Publication date: 2018-06-20
Also published as: CN108138248A; CA2995307A1; WO2017025632A1; KR20180041698A; US20180237871A1; JP2018528380A; US11131001B2; DE102015113407B4; MX2018001742A; DE102015113407A1; CN108138248B

Abstract

The invention relates to an oven device (100) for heat treatment of a blank (101). The oven device (100) comprises an oven housing (102) having an oven chamber (113) in which the blank (101) can be heat treated at a defined temperature, and a temperature control member (103) which is arranged in the oven chamber (113). The oven device (100) further comprises a temperature control member (103) and a temperature control unit. The temperature control unit is arranged inside the oven chamber (113), able to be displaced between a first position and a second position, such that the temperature control unit is, at least in the first position, in thermal contact with the temperature control member (103) and in the second position can be brought into thermal contact with the blank (101).

Description

Furnace apparatus for heat treating a metal board

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Technical area

The present invention relates to a furnace apparatus for heat-treating a metal plate, and a method for heat-treating a

Metal board.

Background of the invention

In bodywork for motor vehicles components are preferred which have a low weight while maintaining the desired strength and desired deformation behavior. In areas of the body, which may be exposed to particularly high loads in the event of a crash, press-hardened components are used, which are produced from high-strength steels and have different ductile areas. Examples of such components include the A and B pillars, the bumper and door bumper of a motor vehicle. For example, components having different ductile areas are made by having metal boards having areas that are heat treated differently. This different heat treatment of different areas of the metal blanks is controlled for example by means of a targeted adjustment of different temperature or cooling profiles.

DE 10 2012 216 468 discloses, for example, the production of a

Metal component, wherein different areas of the metal component cooled with different cooling profiles or cooling rates so that the two areas have different ductile properties.

Presentation of the invention

It is an object of the present invention to provide a furnace apparatus which enables flexible and efficient heat treatment of a metal board.

This object is achieved with a furnace apparatus for heat treating a metal plate and a method for heat treating a metal plate according to the independent claims. According to a first aspect of the present invention, a

Oven apparatus for heat treating a circuit board (e.g., a metal pillar). The furnace device has a furnace housing with a furnace space in which the board with a certain temperature

is heat treatable. Furthermore, the furnace device has a

Temperature control, which is arranged in the furnace chamber. Furthermore, the furnace device has a tempering device, wherein the

Tempering device is disposed within the furnace chamber between a first position and a second position such that the

Tempering device is at least in the first position in thermal contact with the tempering and in the second position with the board in thermal contact can be brought.

In an exemplary embodiment, the tempering device is designed as a band element and / or with a multiplicity of tempering pins. Both training will be explained in more detail below. The band member has a first portion. The tempering body has a tempering surface, wherein the band element is arranged so movable within the furnace space between the first position and the second position, that the first portion in the first position in thermal Konta kt with the tempering and that the first section in the second Position can be brought into thermal contact with the board.

In the exemplary embodiment with a plurality of tempering pins, the tempering body accordingly has a multiax of

Receiving bores, in each of which one of the temperature control is introduced. The plurality of tempering pins between the first position and a second position is arranged such that the plurality of tempering pins in the first position is in thermal contact with the tempering body and in the second position can be brought into thermal contact with the board.

In accordance with another aspect of the present invention, a method of heat treating a board is described. According to the method, the board is provided in a furnace room of an oven housing of a furnace apparatus in which the board is heat-treated at a certain temperature. A band member is moved within the furnace space between a first position and a second position, wherein in the first position, a first portion in thermal contact with a

Temperierfläche a tempering, which in the furnace chamber

is disposed, and in the second position, the first portion is in thermal contact with the board.

The board describes a metal workpiece or a semi-finished product, from which a component having a desired shape and ductility is produced. The board is, for example, a metal sheet having a thickness of less than about 2 cm, more preferably less than about 1 cm. By means of the metal component can For example, a metal device such as a motor vehicle component can be manufactured. For example, the motor vehicle component may represent an A or B pillar of a motor vehicle, a bumper or a door impact beam of a motor vehicle.

The board can consist of a steel, in addition to iron

may have production-related impurities. Further, the metal member may have alloying components such as (in weight%) C: 0.02-0.6%, Mn: 0.5-2.0%, Al: 0.01-0.06%, Si : 0, 1% up to 0.4%, Cr: 0% up to 1.2%, P: 0 up to 0.035%, S: 0 up to 0.035%. Further, the metal member may include one or more of Ti, B, Mo, Ni, Cu, and / or N, wherein Ti is in a content of 0 to 0.05%, Cu in a content of 0 to 0 , 01%, B in contents of 0.0008 to 0.005%, Mo in contents of 0 up to 0.4%, Ni in contents of 0 up to 0.4%, IM in

Ranged from 0 to 0.01%, can be included.

The oven device is designed to heat the board. The board is heated in the oven device to a desired temperature, e.g. on

Austenitizing temperature, heated or cooled. The

For example, austenitizing temperature is about 750 ° C to about 1000 ° C, and the lower limit of the austenitizing temperature depends on the material of the metal component (steel and alloy portions). Above the austenitizing temperature, a complete austenitic structure is present in the metal component.

The furnace device has the furnace space or a plurality of different furnace spaces. For example, a certain temperature may be set in each furnace room so that the board in each of the furnace rooms is exposed to a certain temperature for heating or cooling. The furnace device can in particular be designed such that a predetermined, temporally variable temperature profile in the furnace chamber can be adjusted. The temperature profile acts on the board while it is in the furnace chamber of the furnace housing of the furnace device. For example, the furnace device may be designed such that the board is stationarily stationary throughout the tempering process in the furnace housing and thus in one and the same furnace chamber. Alternatively, the furnace device, for example, a type

Durchlaufofens be formed so that the Piatine is conveyed by a conveying direction sequentially or continuously through the furnace chamber or by several, entiang the conveying direction of successively arranged furnace chambers.

A predetermined, time-varying temperature profile (e.g., warm-up or cool-down profile) describes a local and / or temporal

Temperature profile of a temperature which is adjustable in a certain oven space and acts on the entire board or on predetermined areas of the board. Thus, for example, in the furnace device, the board in a first furnace chamber can be heated to a predetermined temperature and at another time or in another second furnace chamber another temperature can be set, which acts on the board and this cools or further heated.

For this purpose, in the furnace room, for example, heating elements or

Cooling elements are arranged to set a desired temperature profile in the furnace chamber, so that the Piatine is specifically heated, cooled or kept the same temperature. For example, the temperature in a furnace chamber of the furnace device may be set between about 100 ° C to about 1000 ° C.

In order to selectively set different ductile areas of a board, specific areas of the board are specifically heated in time differently and in particular cooled differently in time, thus different To adjust microstructure areas in the various areas of the board.

In particular, in a heating of the metal component, the

Heating rate of about 1 K / s to about 20 K / s. By means of the temperature control of the furnace chamber and in particular the tempering of the band element described in detail below, areas of the metal component can also be cooled, for example also. that

Cooling rate of about 1 K / s to about 40 K / s can be achieved.

The microstructure in the board during heating, holding or cooling can be seen from a time-temperature conversion diagram (ZTU diagram). In a ZTU diagram, the structure development at different temperature gradients or

Cooling rates are read during cooling. By means of the present invention, in particular predetermined

Areas of the board are cooled slowly or rapidly by a first portion of the band member and / or the tempering pins in thermal contact with a predetermined surface area of the board, which is to be cooled, is brought. Alternatively, in particular, predetermined areas of the board may be heated quickly by bringing a first portion of the ribbon member and / or the tempering pins in thermal contact with a predetermined surface area of the board to be heated rapidly. In addition, the term "thermal contact" is understood to mean a thermal interaction between two corresponding elements, for example the first section of the band element and / or the tempering pins on the one hand and the board on the other hand, so that a rapid temperature exchange between the corresponding two elements is made possible. Such a rapid temperature exchange between the corresponding two elements (eg the corresponding portion of the band member and / or the Temperierstifte one hand, and the board on the other hand) can be achieved in particular by the first element, for example, the corresponding portion of the band member and / or the tempering, in physical contact with the second element, or the desired area of the board, is present or is , This means, for example, that the corresponding one

Section of the band member and / or the tempering touches the desired area of the board, so that fast thermal energy can be exchanged between the two elements. This results in cooling or heating of the desired area of the board.

Alternatively, thermal contact can be understood as meaning that there is a small distance between two elements, e.g., the corresponding portion of the band member and / or the tempering pins on the one hand and the corresponding portion of the board on the other. a distance between about 1 mm and about 2 cm.

In particular, the tempering body has a high heat storage capacity, so that it has several cooling cycles of the first section of the

Band element and / or the tempering pins can perform. As described in detail below with respect to various exemplary embodiments, the tempering body may be interchangeably disposed in the furnace space and / or provided with a cooling or heating means (i.e., a tempering means). The tempering, for example, be a hollow body, which is filled with a cooling medium. The cooling medium may be, for example, a liquid medium, such as water or other suitable liquids. The walls of the

Temperierkörpers can be made of a material with a high

Thermal conductivity, such as a metallic material exist. The band member may be made of a flexible or deformable material and by means of a drive means between the first position and the second position to be movably arranged. The band element may for example be formed from a sheet-like band. Furthermore, the band element may consist of a ring fabric, in particular of a metallic ring fabric.

The ability to rapidly cool or heat the board or a particular area of the board can be achieved by the use of a pre-cooled or heated portion of the tape element of the present invention. In other words, in a preferred embodiment, the tempering body is a heat sink which has a temperature which is significantly cooler than the temperature in the oven space, in particular less than half the temperature in the oven space.

After cooling the board, the first section of the strip element can be moved into a first position, in which the first section is in thermal contact with a tempering surface of the tempering body. This means that in the first position, the first portion rests on the tempering surface or a distance smaller than e.g. two centimeters from the tempering surface. In the first position, the first portion of the band member may thus be pre-cooled and then moved to the second position, in which the first portion is in thermal contact with the board to quench (or heat). Then the first section can be moved back to the first position

Pre-cooling or preheating are moved.

Thus, effectively a particular area of the board or the entire board can be cooled with the first portion of the tape element or alternatively heated. At the same time, the first section can be done by means of the

Temperierkörpers are cooled several times to temper a variety of boards or areas of boards without a high constructive effort or a time-consuming conversion of

Oven Vorrichtu g is required.

According to another exemplary embodiment, this forms

Band element from a band loop, which encloses the tempering.

The band element as a band loop may, for example, extend over one or more rollers, at least one roller being e.g. acts as a drive roller and drives the band member to reciprocate the first portion between the first position and the second position. The

Band element as a band loop can for example be arranged loosely over a drive roller or biased to be arranged around a drive roller. The band element can be driven, for example, in the manner of a belt drive. For example, the band element may have toothed elements in the manner of a toothed belt, which may be correspondingly arranged

Tooth elements engage a drive roller, thus driving the band element. In other words, a V-belt or toothed belt operation can be enabled. Alternatively, a flat belt drive can be made possible when the band element is biased about the drive roller.

Further, the band member may be formed as an open band with two free end portions, wherein a first end of the band member is rolled up, for example, on a first drive roller and a second, formed opposite the first end end to be rolled on another second drive roller. Accordingly, by controlling the first drive roller and the second drive roller, the band member can be reciprocated between the first position and the second position.

According to a further exemplary embodiment, in the second position, the first portion is spaced from the tempering body. The band element is arranged such that in the second position, the first Section between the Temperierkörper and the board can be arranged and the first portion is spaced from the Temperierkörper.

According to another exemplary embodiment, the band member further includes a second portion spaced from the first portion. The second section is designed such that, in the second position, the second section can be arranged at a distance from the board.

In particular, in a further exemplary embodiment, the second section is designed such that in the second position, the second section is in thermal contact with the temperature control surface of the temperature control body.

By forming the second portion of the band member, the board or a plurality of boards can more effectively be tempered, in particular cooled, by means of the band element. While the first section is heated or cooled, for example, in the second position by a board, the second section is cooled or heated by means of the tempering body. In a subsequent production step, the band element is moved from the second position to the first position, so that the first portion is tempered by the tempering and the second section tempered the board or another board.

Accordingly, the band element can have further third sections, which are arranged between the first section and the second section and which are in thermal contact, for example, in a third position of the band element either with the temperature control surface of the temperature control element and / or a circuit board.

Thus, the flow rate through the furnace apparatus can be increased and thus the entire furnace apparatus can be made more efficient. According to a further exemplary embodiment, the band element is designed to be placed on the circuit board in such a way that movement of the band element relative to the temperature control body can be generated when the circuit board moves. By applying the band member on the board, a frictional force between the band member and the board is generated. If the board is moved along the conveying direction, the board takes with its movement, the band member, so that the band member moves and optionally move from the first position to the second and vice versa. On further drive devices can be dispensed with. These

Embodiment is particularly advantageous if the Band! Ement as a band loop, as explained above, is formed, so that in one and the same direction of movement of the band member, the first portion and the second portion alternately on different areas of the board or along the conveying direction arranged one behind the other PCBs are placed.

The temperature control pins consist for example of a high temperature conductive material, such as magnesium, copper or aluminum. For example, the tempering pins may have a diameter of about 4 to about 15 millimeters. For example, the tempering pins have a length of about 5 to about 50 centimeters, more preferably about 10 to about 20 centimeters.

The tempering body consists e.g. also made of a temperature-conductive material, such as copper. In an exemplary

Embodiment, the tempering, for example, a diameter of about 4, 8 millimeters. Accordingly, the

Receiving holes have a diameter of, for example, about 5 millimeters. For better guidance of the temperature control pins, the temperature control body may have a thickness of approximately 20 to approximately 50 centimeters. According to a further exemplary embodiment, the tempering pins are arranged displaceably in the respective receiving bores such that the tempering pins can be placed on a surface of the board in the second position and can be adapted to a contour of the surface of the board.

The tempering pins can rest directly on the surface of the board. Elevations of the contour of the surface of the board shift the

corresponding tempering in the direction of tempering and depressions in the contour of the surface of the board move the corresponding

Temperierstifte away from the tempering. Thus, even with an uneven design of the board, the tempering pins rest on the surface of the board. Thus, even on uneven boards, a homogeneous temperature control (heating or cooling) of the board can be implemented.

In a further exemplary embodiment, the temperature control pins may be formed, for example, with a corresponding spring mechanism, so that the temperature control pins with respect to a neutral position on the

Temperierkörper can be biased. An uneven surface of the board shifts the tempering pins relative to that

Temperierkörper, after removing the board, the Temperierstifte be moved back into the neutral position due to their bias. The spring mechanism, for example, appropriate train or

Have compression springs, each one of the tempering

is assigned accordingly.

According to a further exemplary embodiment, the

Furnace device further comprises a drive device. The drive device is set up, the tempering device between the first position and the to move to the second position. As already explained above, the drive device may have one or more drive rollers which move the band element between the first position and the second position. Furthermore, the drive device can be a lifting device, by means of which the temperature control pins and / or the temperature control body can be moved in the direction of the circuit board.

According to a further exemplary embodiment, the tempering body is arranged exchangeably in the furnace chamber. The tempering body may thus be after tempering the first portion and / or the second portion of the band member or the tempering pins, e.g. after a certain number of tempering cycles for maintenance or for their own tempering be replaced. For example, the tempering may be formed as a passive tempering. This means that the tempering a high

Has heat storage capacity and is not actively tempered when placed in the oven room. This means that the tempering body itself warms up or cools down after several heating or cooling of the corresponding sections of the band element or the tempering pins.

After a predetermined limit temperature of the tempering is reached, this can be exchanged and replaced, for example, with another, preheated tempering. Thus, the

Oven device without long set-up continue to temper appropriate boards.

According to another exemplary embodiment, the

Temperierkörper a tempering, ie a cooling device or a heating device, on. The tempering device tempered, ie, cooled or heated, the tempering, so that corresponding to that portion of the band member or the tempering, which in thermal contact with the tempering surface is tempered at a desired temperature. After tempering, the corresponding section is brought into thermal contact with the board and thus tempered. In a further preferred embodiment of the present invention, the temperature control device has a tube, which within the

Temperierkörpers runs. The medium for tempering the

Temperierkörpers is in the pipe (especially from outside the

Furnace housing) can be fed. The medium for tempering is in particular gaseous or liquid. For example, the medium may be a coolant or a cooling liquid for cooling the tempering. Thus, a liquid cooling of the tempering be implemented, so that those sections of the band member or the Temperierstifte, which are in thermal contact with the Temperierfläche, are permanently cooled to then again temper the board.

According to another exemplary embodiment, an insulating housing is provided, which is arranged in the furnace chamber. The insulating housing encloses the tempering and the band member or the

Tempering at least partially such that the insulating thermally shields the tempering and the band member or the Temperierstifte of a portion of the oven chamber, which surrounds the insulating housing. For example, the area of the furnace chamber, which surrounds the insulating housing, have a high temperature and thus be used for heating the board. Within the insulating then prevail lower temperatures, since the insulating thermally insulated the interior of the insulating housing from the environment of the insulating housing. Thus, a temperature control of the board by means of the band member or the Temperierstifte be performed more efficiently, since lower thermal influences from other areas of the furnace chamber disturbing act. According to a further exemplary embodiment, the

Furnace to an insulating (insulating block), which is selectively introduced between the tempering and the board. In particular, the insulating element may be present in the first position of the tempering device between the tempering body and the circuit board. Thus, the tempering can more effectively from the tempering on a

desired temperature brought (warmed or cooled), since the tempering is isolated by the insulating element of the thermal action of the board. The insulating element has in particular good

Insulation properties. The insulating element consists for example of ceramic or ceramic composite materials. The insulating element can

For example, by means of a further conveyor selectively between the tempering and the tempering on the one hand and the board on the other hand are introduced.

According to a further exemplary embodiment, the

Furnace device further comprises a conveyor for conveying the board within the furnace chamber. The conveyor has, for example, a plurality of conveyor rollers, which can be driven. A arranged on the conveyor rollers board can be transported by rotation of the conveyor rollers along a conveying direction through the furnace chamber. Alternatively, the conveyor may comprise a conveyor belt on which the circuit board rests. The conveyor belt is driven so that the circuit board in

Conveying direction is conveyed through the oven room. By means of

In particular, the furnace device can be designed as a through-hole furnace in an exemplary embodiment.

It should be noted that embodiments of the invention have been described with reference to different subject matters.

In particular, some embodiments of the invention are with

Device claims and other embodiments of the invention with Process claims described. However, it will be apparent to those skilled in the art upon reading this application that, unless expressly stated otherwise, in addition to a combination of features associated with a type of subject matter, any and all of them

Combination of features that belong to different types of invention objects is possible.

Brief description of the drawings

In the following, for further explanation and for better understanding of the present invention, embodiments will be described in detail with reference to the accompanying drawings. 1 shows a schematic representation of a furnace device with a

Band element according to an exemplary embodiment of the present invention,

FIG. 2 shows a schematic illustration of a further furnace device with a band element according to an exemplary embodiment of the present invention, and FIG

3 is a perspective view of a furnace apparatus having a furnace housing according to an exemplary embodiment of the present invention;

Fig. 4 is a schematic representation of a furnace device with

Temperierstiften according to an exemplary embodiment of the

present invention and Fig. 5 is a schematic representation of a furnace apparatus with tempering pins and an insulating member according to an exemplary

Embodiment of the present invention.

Detailed Description of Exemplary Embodiments

The same or similar components in different figures are provided with the same reference numerals. The illustrations in the figures are schematic.

1 shows a furnace apparatus 100 for heat-treating a circuit board 101, in particular a metal circuit board. The oven apparatus 100 includes

Oven housing 102 with a furnace chamber 113 in which the metal plate 101 is heat treatable with a certain temperature and a

Temperature control body 103, which is arranged in the furnace chamber 113, wherein the temperature control body 103 has a temperature control surface 104.

Furthermore, the furnace device 100 has a tempering device 105, 405, wherein the tempering device 105, 405 is disposed within the furnace chamber 113 between a first position and a second position such that the tempering device 105, 405 at least in the first position in thermal contact with the tempering 103 and in the second position with the metal plate 101 can be brought into thermal contact.

In an exemplary embodiment, the tempering device is designed as a band element 105 (see FIGS. 1 and 2) and / or with a plurality of tempering pins (see FIGS. 4 and 5). According to the exemplary embodiment in FIG. 1, the oven apparatus 100 comprises a band member 105 having a first portion 106. The

Band member 105 is movably disposed within furnace chamber 113 between a first position and a second position such that first portion 106 is in thermal contact with tempering surface 104 in the first position and that first portion 106 is in the second position with metal plate 101 can be brought into thermal contact.

The furnace apparatus 100 is configured to heat the metal board 101. The metal plate 101 is heated in the oven apparatus 100 to a desired temperature, e.g. at austenitizing temperature, heated or cooled. The austenitizing temperature is, for example, about 750 ° C to about 1000 ° C, and the lower limit of the austenitizing temperature depends on the material of the metal component (steel and alloy portions).

The furnace apparatus 100 has the furnace space (see FIG. 1) or a plurality of different furnace spaces. For example, in each furnace room, a certain temperature may be set so that the metal plate 101 in each of the furnace rooms is exposed to a certain temperature for heating or cooling. The furnace device 100 may in particular be designed such that a predetermined, temporally variable

Temperature profile can be adjusted in the oven room. The

Temperature profile acts on the metal plate 101 while it is in the furnace chamber of the furnace housing 102 of the furnace device.

In Fig. 1, the furnace device 100, for example, a type

Continuous furnace formed so that the metal plate 101 is conveyed along a conveying direction 114 sequentially or continuously through the furnace chamber or through a plurality of along the conveying direction 114 successively arranged furnace chambers. For example, tempering elements 111, eg

Heating elements or cooling elements can be arranged to set a desired temperature profile in the furnace chamber, so that the metal plate 101 is specifically heated, cooled or kept the same temperature. The

Temperature in a furnace room of the furnace apparatus 100 may be set, for example, between about 100 ° C to about 1000 ° C.

To selectively different ductile areas of a metal plate 101

to be set, specific areas of the metal plate 101 are specifically heated differently in time and in particular cooled differently in time, so as to set different structural areas in the different areas of the metal plate 101.

In the furnace apparatus 100, in particular, predetermined portions of the metal plate 101 may be cooled by bringing a first portion 106 of the band member 105 into thermal contact with a predetermined one

Surface area of the metal plate 101, which is to be cooled, is brought. In the exemplary embodiment in FIG. 1, the second section 107 rests on the metal plate 101.

The tempering body 103 has in particular a high

Heat storage capacity, so that it can perform several cooling cycles of the first portion 106 or a second portion 107 of the band member.

The band element 105 may consist of a flexible or deformable material and be movably arranged between the first position and the second position by means of a drive device 201 (see FIG. 2). The band member 105 may for example consist of a sheet-like band

be educated. Furthermore, the band element 105 may consist of a ring fabric, in particular of a metallic ring fabric. The band member 105 further includes a second portion 107 which is spaced from the first portion 106. The second section 107 is, for example, designed such that in the second position the second section 107 can be arranged at a distance from the metal plate 101. In particular, the second section 107 is designed such that in the second position the second section 107 is in thermal contact with the tempering surface 104 of the tempering body 103 or rests on the tempering surface 104. While the first portion 106 in the second position cools, for example, a metal plate 101, the second portion 107 is replaced by means of the

Cooling body 103 cooled and vice versa. In a following

Production step, the band member 105 is then moved from the second position to the first position, so that the first portion 106 of the

Temperierkörper 103 is tempered and the second portion 107, the metal plate 101 or another metal plate tempered.

Accordingly, the band element 105 may have further third sections which are arranged between the first section 106 and the second section 107 and which, for example, in a third position of the band element 105 either with the temperature control surface 104 of the

Temperature control body 103 and / or a metal plate 101 are in thermal contact. The first portion 106 (or the second portion 107) of the band member 105 can be moved after cooling of the metal plate 101 in the first position in which the first portion 106 is in thermal contact with the tempering surface 104 of the tempering 103. This means that in the first position of the first section 106, for example, it rests on the tempering surface 104. In the first position, the first portion 106 of the band member 105 can thus be pre-cooled and then into the second Position be moved, in which the first portion 106 is in thermal contact with the metal plate 101, to quench them.

Subsequently, the first section 106 can again be moved to the first position for pre-cooling.

Thus, effectively, a specific area of the metal board 101 or the entire metal board 101 with the first portion 106 (or the second portion 107) of the band member 105 may be cooled or alternatively heated. At the same time, the first portion 106 may be replaced by means of

Temperierkörpers 103 are cooled several times to temper a plurality of metal plates 101 and areas of metal plates 101, without a high design complexity or a time-consuming conversion of the furnace device 100 is required. The temperature control body 103 in FIG. 1 has a temperature control device 108, i. a cooling device or a heating device. The

Temperature control 108 tempered, i. cools or heats the

Temperierkörper 103, so that corresponding to that portion 106, 107 of the band member 105, which is not in thermal contact with the

Temperature control surface 104 is tempered at a desired temperature. After tempering, the corresponding section 106, 107 brought into thermal contact with the metal plate 101 and thus tempered. The tempering device 108 has a tube 109, which extends within the tempering 103. The medium for tempering the

Temperierkörpers is in the tube 109 (in particular from outside the furnace housing 102) can be fed. The medium for tempering is

in particular gaseous or liquid. For example, the medium can be a cooling center! or a cooling liquid for cooling the temperature control device 108. Thus, a liquid cooling of the tempering 103th be implemented so that permanently those portions 106, 107 of the band member 105, which in thermal contact with the

Tempering surface 104 are cooled, then again to temper the metal plate 101. In a preferred embodiment, the tempering body 103 is in other words a heat sink which has a temperature that is significantly cooler than the temperature in the oven space, in particular less than half the temperature in the oven

Oven room, is. In the Ausführungsbeispiei in Fig. 1, the band member 105 forms a

Bandschiinge, which encloses the tempering 105. In the second position, the first portion 106 is spaced from the tempering body 103. In the first position, the second portion 107 is spaced from the tempering 103. The band member 105 is arranged such that in the second position, the first portion 106 between the tempering 103rd and the metal plate 101 can be arranged and the first portion 106 is spaced from the tempering 103.

In the embodiment in Fig. 1, the band member 105 is on the

Metal plate 101 can be placed so placed that during movement of the

Metal plate 101, a movement of the band member 105 relative to the

Temperature control body 103 can be generated. By laying the band member 105 on the metal plate 101, a frictional force is generated between the band member 105 and the metal plate 101. When the metal plate 101 is moved along the conveying direction 114, the metal plate 101 takes on its

Moving due to the frictional force the band member 105, so that the band member 105 moves and move from the first position to the second position and vice versa. In one and the same direction of movement of the band member 105, the first portion 106 and the second portion 107 is alternately on different areas of the metal plate 101 or along the conveying direction 114 of metal plates 101 arranged one behind the other.

Further, an insulating housing 110 is disposed in the furnace room. The

Insulating housing 110 encloses at least partially the tempering body 103 and the band member 105 such that the insulating housing 110 the

Temperature control body 103 and the band member 105 from a portion of the furnace chamber, which surrounds the insulating housing 110, thermally shielded. The insulating housing 110 may, for example, have a hood shape and be slipped over the tempering body 103, the insulating housing 110 having an opening in the direction of metal plate 101 so that the band element 105 can be brought into contact with the metal plate 101 with a section 106, 107. For example, the area of the furnace chamber which surrounds the insulating housing 110 may have a high temperature and thus be used for heating the metal circuit board 101. Within the insulating housing 110 then prevail lower temperatures, since the

Insulating housing 110 the interior of the insulating housing 110 of the

Environment of the insulating housing 110 thermally insulated. Thus, a tempering of the metal plate 101 by means of the band member 105 can be performed more efficiently, since lower thermal influences of others

Intervene areas of the oven room disturbing.

The furnace device 100 further has a conveyor 112 for conveying the metal plate 101 within the furnace chamber along the conveying direction 114. The conveyor 112 has, for example, a plurality of

On conveyor rollers, which can be driven. One on the

Conveyor rollers arranged metal plate 101 can by means of rotation of the

Conveyor rollers along a conveying direction 114 are conveyed through the oven chamber. Instead of the band member 105 as tempering can in the

Furnace device 100 of FIG. 1, the plurality of tempering pins 405 are used with a corresponding design of the tempering 103.

FIG. 2 shows a furnace apparatus 100 according to another exemplary embodiment. Additionally or alternatively to the features of

Furnace device 100 of FIG. 1, the furnace device 100 of FIG. 2, a drive device 201 on. The drive device 201 is configured to move the band member 105 between the first position and the second position. The drive device 201 has one or more drive rollers 202 which move the belt element 105 between the first position and the second position. The band member 105 as a band loop may, for example, extend over one or more drive rollers 202, wherein at least one drive roller is driven and thus drives the band member to reciprocate the portions 106, 107 between the first position and the second position

reciprocate. The band element 105 as a band loop can be arranged, for example, loosely about a drive roller 202 or pretensioned about a drive roller 202. The band member 105 may be driven, for example, in the manner of a belt drive. Thus, the band member 105

For example, tooth elements in the manner of a toothed belt, which engage in corresponding tooth elements, a drive roller 202, so as to drive the band member 105. In other words, a V-belt or toothed belt operation can be enabled. Alternatively, a biasing of the belt member 105 to the drive roller 202, a flat belt drive can be made possible. FIG. 3 shows a perspective view of an oven device 100 from FIG. 1 or FIG. 2. In the oven device 100 from FIG shown that also several tempering 103, 103 'z. B. along the conveying direction 114 can be arranged. For example, one band element 105 can run around each temperature control body 103, 103 '. Furthermore, a band element 105 can also run around a plurality of tempering bodies 103, 103 ¹ .

Furthermore, the tempering 103, 103 ^* interchangeable in the

Furnace housings 102 are arranged and / or provided by means of a cooling or heating device (i.e., by means of the tempering device 108).

The tempering bodies 103, 103 ^Λ can thus be exchanged for tempering of the first section 106 and / or of the second section 107 or after a certain number of tempering cycles for maintenance or for their own tempering.

For example, the tempering 103, 103 'as passive

Temperierkörper 103, 103 ^{v be} formed. This means that the

Temperature control body 103, 103 ^{1 have} a high heat storage capacity and is not actively tempered when placed in the oven chamber. This means that the temperature control bodies 103, 103 'themselves warm up or cool down after repeated heating or cooling of the corresponding sections 106 and 107 of the belt element 105. After a predetermined

Limit temperature of the respective tempering 103, 103 ^{1 is} reached, this can be exchanged and, for example, with another,

Pre-tempered tempering 103, 103 'are replaced. Thus, the furnace apparatus 100 can continue without corresponding long makeready times

Temperate metal boards 101.

FIGS. 4 and 5 show further exemplary embodiments of FIGS

Furnace apparatus 100 for heat-treating the board 101. The

Oven device 100 has the furnace housing 102 with the furnace chamber 113, in which the metal plate 101 at a certain temperature

is heat treatable, and the tempering 103, which in the

Furnace space 113 is arranged on. Furthermore, the furnace device 100 has a multiplicity of tempering pins 405. The tempering body 103 has correspondingly a multiplicity of receiving bores 501 (see FIG. 5), into each of which one of the tempering pins 405 can be inserted. The plurality of tempering pins 405 are movably disposed between the first position and a second position such that the plurality of tempering pins 405 are in thermal contact with the tempering body 103 in the first position and in thermal contact with the board 101 in the second position ,

The tempering body 103 can be moved together with the temperature control pins 405 relative to the circuit board 101. Alternatively, the plurality of tempering pins 405 may move relative to the tempering body 103 and the board 101 (see embodiment in FIG. 5). The tempering pins 405 are guided in the receiving bores 501 of the tempering body 103. The temperature control pins 405 are thermally coupled to the temperature control body 501 and can thus be heated or cooled accordingly.

The temperature control pins 405 are displaceable in the respective

Receiving holes 501 arranged that the tempering pins 405 are placed in the second position on a surface of the board 101 and can be adapted to a contour of the surface of the board 101.

The tempering pins 405 are in the second position directly on the surface of the board 101. Elevations of the contour of the surface of the board 101 shifts the corresponding temperature control pins 405 in the direction

Temperierkörper 103 and depressions in the contour of the surface of the board 101 move the corresponding Temperierstifte 405 of the

Temperature control body 103 continues. Thus, even with an uneven finish of the board 101 (see FIG. 4), the tempering pins 405 rest on the surface of the board 101.

The tempering pins 405 and / or the tempering bodies 103 can be moved by means of a drive device 401 along a stroke direction 402 to the board 101 or be removed therefrom. The drive device 401 may, for example, have a pneumatically or hydraulically operated lifting device. As illustrated in FIG. 5, the tempering body 103 may have a central area with the plurality of receiving bays 501. The central region is cooled, for example, by an integrated tube 109, which runs around the central region and through which a cooling medium flows. Thus, the Zentrafbereich of Temperierkörpers 103 is on a

desired temperature maintained.

As further illustrated in FIG. 5, the oven apparatus 100 includes

Insulating element 502 (insulating block), which selectively between the

Temperierkörper 103 and the board 101 can be introduced. In particular, the insulating element 502 may be present in the first position of the tempering device 105, 405 between the tempering body 103 and the circuit board 101. Thus, the temperature control 105, 405 can be brought more effectively by the tempering 103 to a desired temperature, since the

Temperierkörper 103 by means of the insulating member 502 from the thermal action of the board 101 and the surrounding furnace chamber 113 is isolated. The insulating element 502 can be selectively introduced, for example, by means of a further conveying device between the tempering body 103 and the tempering device 105, 405 on the one hand and the circuit board 11 on the other hand, and moved along a traversing device 503, for example. The travel direction 503 is formed, for example, orthogonal to the conveying direction 114 of the board 101 in the furnace device 100. In addition, it should be noted that "encompassing" does not exclude other elements or steps, and "a" or "an" does not exclude a multitude. It should also be appreciated that features or steps described with reference to one of the above embodiments may also be used in combination with other features or steps of others above

described embodiments can be used. Reference signs in the claims are not to be considered as limiting.

LIST OF REFERENCES:

100 oven device

101 metal board

102 furnace housing

103 tempering body

104 tempering surface

105 band element

106 first section

107 second section

108 tempering device

109 pipe

110 insulating housing

111 tempering elements

112 conveyor

113 oven room

114 conveying direction

201 drive device

202 drive roller

401 drive device

402 drive direction

405 tempering pen

501 locating hole

502 insulating element

503 travel direction insulating element

Claims

claims

An oven apparatus (100) for heat treating a circuit board (101), in particular a metal circuit board, comprising the oven apparatus (100)

a furnace housing (102) having a furnace space (113) in which the

Board (101) is heat treatable with a certain temperature,

a tempering body (103), which is arranged in the furnace chamber (113),

wherein the tempering body (103) has a tempering surface (104),

a tempering device,

wherein the tempering device is arranged movably between the first position and a second position within the furnace chamber (113) in such a way that the tempering device is in thermal contact with the tempering body (103) at least in the first position and in the second position with the board (101 ) can be brought into thermal contact.

2. oven apparatus (100) according to claim 1,

wherein the tempering direction is formed as a band element (105), wherein the band element (105) has a first portion (106), wherein the tempering (103) has a tempering surface (104), wherein the band element (105) within the furnace chamber (113) between the first position and the second position is arranged so that the first portion (106) in the first position in thermal contact with the tempering surface (104) and that the first portion (106) in the second position with the board ( 101) can be brought into thermal contact.

3. oven apparatus (100) according to claim 2,

wherein the band member (105) forms a band loop, which the

Encloses tempering body (103), wherein the band element (105) is arranged such that in the second position of the first portion (106) between the tempering (103) and the board (101) can be arranged.

4. oven apparatus (100) according to claim 2 or 3,

wherein in the second position, the first portion (106) is spaced from the tempering body (103).

5. oven apparatus (100) according to any one of claims 2 to 4,

wherein the band member (105) further comprises a second portion (107) spaced from the first portion (106), and

wherein the second portion (107) is formed such that in the second position, the second portion (107) spaced from the board (101) can be arranged.

6. oven apparatus (100) according to claim 5,

wherein the second portion (107) is formed such that in the second position, the second portion (107) is in thermal contact with the second portion (107)

Temperature control surface (104) of the tempering (103).

7. oven apparatus (100) according to any one of claims 2 to 6,

wherein the band element (105) on the circuit board (101) is designed to be placed in such a way that upon movement of the board (101), a movement of the band member (105) relative to the tempering (103) can be generated.

8. oven apparatus (100) according to any one of claims 2 to 7,

wherein the band element (105) comprises a ring fabric, in particular a metallic ring fabric.

9. oven apparatus (100) according to any one of claims 1 to 8, further comprising a drive device (201),

wherein the drive means (201) is arranged to move the tempering means between the first position and the second position.

10. oven apparatus (100) according to any one of claims 1 to 9,

wherein the tempering device has a plurality of tempering pins (405),

wherein the tempering (103) has a plurality of receiving bores (501), in each of which one of the tempering pins (405) can be introduced, wherein the plurality of tempering pins (405) between the first position and a second position is arranged movable such that the Variety of tempering pins (405) in the first position in thermal contact with the tempering (103) and in the second position with the board (101) is brought into thermal contact.

11. oven apparatus (100) according to claim 10,

wherein the tempering pins (405) are displaceable in the respective

Receiving holes (501) are arranged such that the tempering pins (405) in the second position on a surface of the board (101) can be placed and adapted to a contour of the surface of the board (101).

12. oven apparatus (100) according to any one of claims 1 to 11,

wherein the tempering (103) is arranged interchangeably in the furnace chamber (113).

13. oven apparatus (100) according to any one of claims 1 to 12,

wherein the tempering (103) in the direction of the board (101) is arranged movable.

14. Oven device (100) according to one of claims 1 to 13,

wherein the temperature control body (103) has a tempering device (108).

15. oven apparatus (100) according to claim 14,

wherein the tempering device (108) has a tube (109) which runs within the tempering body (103),

wherein a medium for tempering the tempering is fed into the tube.

16. oven apparatus (100) according to any one of claims 1 to 15, further comprising

an insulating housing (110) which is arranged in the furnace chamber (113),

wherein the insulating housing (110) the tempering (103) and the

Band element (105) at least partially encloses such that the

Insulating housing (110) thermally shields the tempering body (103) and the band element (105) from a region of the furnace chamber (113) which surrounds the insulating housing (110).

17. Oven device (100) according to one of claims 1 to 16, further comprising

an insulating member (502) selectively connected between the

Temperierkörper (103) and the board (101) can be introduced.

18. oven apparatus (100) according to one of claims 1 to 17, further comprising

a conveyor (112) for conveying the board (101) within the oven space (113)

19. A method of heat treating a board (101) comprising the method Providing the board (101) in a furnace chamber (113) of a

Furnace housing (102) of a furnace device (100) in which the board (101) is heat-treated at a certain temperature,

Moving a tempering device (105) within the furnace chamber (113) between a first position and a second position,

wherein in the first position the tempering device is in thermal contact with a tempering body (103) which is arranged in the furnace chamber (113), and

wherein in the second position, the tempering device is in thermal contact with the circuit board (101).