EP3329750A4 - Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques - Google Patents

Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques Download PDF

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Publication number
EP3329750A4
EP3329750A4 EP16831404.5A EP16831404A EP3329750A4 EP 3329750 A4 EP3329750 A4 EP 3329750A4 EP 16831404 A EP16831404 A EP 16831404A EP 3329750 A4 EP3329750 A4 EP 3329750A4
Authority
EP
European Patent Office
Prior art keywords
frequency selective
emi mitigation
selective structures
structures
emi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16831404.5A
Other languages
German (de)
English (en)
Other versions
EP3329750A1 (fr
Inventor
John Song
Paul Francis DIXON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/814,008 external-priority patent/US9622338B2/en
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of EP3329750A1 publication Critical patent/EP3329750A1/fr
Publication of EP3329750A4 publication Critical patent/EP3329750A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236—Electromagnetic band-gap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
    • H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
    • H01Q15/0026—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective said selective devices having a stacked geometry or having multiple layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/007—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with means for controlling the absorption
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
EP16831404.5A 2015-07-30 2016-07-29 Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques Withdrawn EP3329750A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/814,008 US9622338B2 (en) 2013-01-25 2015-07-30 Frequency selective structures for EMI mitigation
PCT/US2016/044672 WO2017019948A1 (fr) 2015-07-30 2016-07-29 Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques

Publications (2)

Publication Number Publication Date
EP3329750A1 EP3329750A1 (fr) 2018-06-06
EP3329750A4 true EP3329750A4 (fr) 2018-08-22

Family

ID=57884963

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16831404.5A Withdrawn EP3329750A4 (fr) 2015-07-30 2016-07-29 Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques

Country Status (4)

Country Link
EP (1) EP3329750A4 (fr)
CN (1) CN107852813A (fr)
DE (1) DE202016008742U1 (fr)
WO (1) WO2017019948A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4350442A2 (fr) * 2018-08-21 2024-04-10 Laird Technologies, Inc. Matériaux et films à motifs et systèmes et procédés de fabrication associés
CN113346249B (zh) * 2021-06-10 2022-07-12 西安电子科技大学 一种水基夹层超表面可调相干吸波体
SE545599C2 (en) * 2022-03-28 2023-11-07 Sweden Quantum Ab A filter arrangement for quantum processors
WO2024010603A1 (fr) * 2022-07-08 2024-01-11 Meta Materials Inc. Métamatériaux à micro-ondes de transformation d'ondes à structure interne optiquement invisible

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0711001A2 (fr) * 1994-11-04 1996-05-08 Mms Space Systems Limited Dispositifs à surface sélective en fréquence
CN103151619A (zh) * 2013-02-03 2013-06-12 北京工业大学 基于频率选择表面的宽频复合吸波结构
US20140209373A1 (en) * 2013-01-25 2014-07-31 Laird Technologies, Inc. Shielding Structures Including Frequency Selective Surfaces

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478197A (ja) * 1990-07-20 1992-03-12 Cmk Corp プリント配線板の製造方法
JPH08506696A (ja) * 1993-02-02 1996-07-16 エイ・エス・ティー・リサーチ・インコーポレイテッド 遮蔽グリッドを含む回路基板配列およびその構成
GB2328319B (en) * 1994-06-22 1999-06-02 British Aerospace A frequency selective surface
WO2004041306A2 (fr) 2001-12-14 2004-05-21 Laird Technologies, Inc. Protection contre une interference electromagnetique (emi) comprenant un milieu a perte
JP2006504272A (ja) 2002-10-21 2006-02-02 レアード テクノロジーズ，インコーポレーテッド 熱伝導性ｅｍｉシールド
WO2007053651A2 (fr) * 2005-11-01 2007-05-10 Laird Technologies, Inc. Panneaux d'event iem avec grilles et substrats poreux conducteurs de l'electricite
JP4846360B2 (ja) * 2005-12-27 2011-12-28 藤森工業株式会社 周波数選択透過型の電磁波シールド材およびその製造方法
US7990328B2 (en) * 2007-03-29 2011-08-02 The Board Of Regents, The University Of Texas System Conductor having two frequency-selective surfaces
JP5323970B2 (ja) * 2012-07-02 2013-10-23 藤森工業株式会社 周波数選択遮蔽型の電磁波シールド材およびその製造方法
US9307631B2 (en) 2013-01-25 2016-04-05 Laird Technologies, Inc. Cavity resonance reduction and/or shielding structures including frequency selective surfaces

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0711001A2 (fr) * 1994-11-04 1996-05-08 Mms Space Systems Limited Dispositifs à surface sélective en fréquence
US20140209373A1 (en) * 2013-01-25 2014-07-31 Laird Technologies, Inc. Shielding Structures Including Frequency Selective Surfaces
CN103151619A (zh) * 2013-02-03 2013-06-12 北京工业大学 基于频率选择表面的宽频复合吸波结构

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017019948A1 *

Also Published As

Publication number Publication date
DE202016008742U1 (de) 2019-07-31
WO2017019948A1 (fr) 2017-02-02
CN107852813A (zh) 2018-03-27
EP3329750A1 (fr) 2018-06-06

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