EP3327291B1 - Electrical coolant pump with ecu cooling - Google Patents

Description

The present invention relates to an electrical coolant pump on which cooling of the control unit or ECU of the pump is provided, and which in particular provides improved heat exchange between power electronics of the ECU and the coolant.

Due to the flexible control options, electrical coolant pumps are preferably used for thermal management of internal combustion engines in vehicle construction. The coolant pump as disclosed, for example, in DE19943577A1 , is exposed to numerous environmental influences, such as temperature fluctuations, moisture and dirt, in the engine compartment of a vehicle. For this reason, coolant pumps including the electric drive are designed in an externally sealed or encapsulated design that is sealed against external influences.

Such a closed design of an electric drive brings with it the problem that only a small amount of heat exchange with the surroundings is possible, as a result of which a loss line of the electric drive may be insufficiently dissipated. In the event of high power demands on the internal combustion engine and a high ambient temperature, the control of the thermal management calls for maximum cooling output for the internal combustion engine. The electrical drive of the coolant pump and the power electronics as part of the ECU also experience maximum throughput of electrical power and generate heat. Here, the components of an electric motor, which are usually arranged in close proximity to the ECU, but also an ambient temperature of the coolant pump near the internal combustion engine reach critical temperatures which, if the additional heat generation in the power electronics of the ECU is inadequate, lead to failure of the electric drive Overheating of the ECU. The operability of the coolant pump and consequently the entire driving operation of the vehicle would thus be endangered.

Efforts have been made in various constructive configurations to integrate the power electronics in a heat exchange with the coolant, which is promoted by the coolant pump. The coolant takes on a target temperature of about 110 ° while driving and can rise briefly to 120 ° or up to 130 ° under special load conditions. As long as a thermal window of the power electronics is tightly coupled to this temperature range of the coolant, overheating of the ECU can be prevented. Since a temperature of just a few ten degrees above can cause permanent damage to the electronics, only a small temperature difference remains to cause heat transfer.

An example from the prior art, which addresses the problem of a sufficient heat exchange between an ECU of a coolant pump and the conveyed coolant flow, is shown in FIG DE 10 2015 114 783 B3 described.

The German patent of the same applicant describes an electric radial pump with a central axially extending inlet, which leads to a radially accelerating pump impeller, and a tangentially diverting outlet. An ECU of the pump is located on a side of the pump housing that faces the electric motor and is arranged within a cover in the form of a donut or in a ring around the central inlet. The front of the pump chamber, which faces the ECU, is closed off by a pump cover made of a material with high thermal conductivity, which enables improved heat exchange between the coolant in the pump chamber and the ECU.

However, the above-mentioned pump construction has the economic disadvantage in the production of large quantities that the production of such an unconventional shape and dimension of the ECU has standard formats of Excludes printed circuit boards or circuit boards, requires more complex assembly processes, is therefore more expensive.

In addition, when assembling the inlet and outlet for different vehicle models, in particular when redesigning the radial dimensioning of the inlet, pump chamber and the like, a change and subsequent production of an individual ECU design is always necessary. The same applies even if the same specifications of the electric drive of the coolant pump could otherwise be used in different vehicle models or internal combustion engines of the same performance class.

Accordingly, it is an object of the present invention to provide an electrical coolant pump that ensures thermal stabilization of the ECU using standard formats and assembly processes, regardless of the configuration of an inlet or outlet.

The object is achieved by an electric coolant pump with the features of claim 1.

The electric coolant pump comprises a pump housing with a pump chamber in which a pump impeller is rotatably received, a pump cover which closes the pump chamber on one side of the pump impeller, and at least one inlet and one outlet which are connected to the pump chamber; an electric motor having a rotor and a stator, which is arranged on a side of the pump chamber, which is opposite to the pump cover, on the pump housing; a pump shaft, rotatably supported on the pump housing, extending from the electric motor into the pump chamber, the rotor and the pump impeller being fixed thereon; and an electronic power circuit for controlling the stator with a power from an external power supply, which can be connected to the power circuit; wherein the pump housing has a receptacle for the electronic power circuit, which with respect to the pump shaft, radially outside the pump chamber and axially overlapping with an outer edge of the pump impeller, which faces the power circuit.

Thus, the invention provides for the first time to integrate an ECU in an electrical coolant pump, as in a known radial pump, in direct heat exchange with the pump housing at a position where convection by the coolant is strongest.

At the intended axial overlap with the pump impeller, the coolant accelerated radially outwards by the blades of the pump impeller strikes the peripheral wall of the pump chamber or a spiral housing and is diverted into a circulating stream. The convection of the impinging mass flow is thus further enhanced by convection due to the centrifugal pressure of a spiral current against the housing wall. Therefore, an arrangement according to the invention of the power circuit at a position in an axial overlap with the pump impeller achieves the best convection-related heat transfer on the housing wall between the electronic components and the mass flow of the coolant passed.

As a result, heat dissipation from the ECU is improved, which comes into play, for example, in the case of a maximum coolant temperature at which only a small temperature difference of a few degrees is available to effect heat transfer.

Apart from the coolant temperature or temperature difference, the intensive convection of the mass flow at the positioning according to the invention and the correspondingly large heat transfer, which is removed from the coolant and transported away by the power circuitry on the inner wall of the pump chamber, generate heat when there are strong increases in power in the electronics dissipated faster. As a result, a temperature rise in the ECU occurs earlier counteracted before the effect of a larger temperature difference to the coolant comes into play, which favors a delayed heat flow.

Thus, even below a maximum cooling water temperature, i.e. in a moderate temperature range, which exists over most of the operating time, the advantage of a higher thermal stability of the ECU is achieved, which has a positive effect on the life of the ECU due to a lower number and intensity of temperature fluctuations.

In addition, the positioning of the circuitry of the power electronics takes place on a circumferential area on which the shape of the ECU remains essentially unaffected by a configuration of an inlet and an outlet and by radial dimensions of the pump. In the case of a conventionally dimensioned pump housing, for example of the radial pump type, there is a sufficiently large area available to accommodate the area of a printed circuit board in standard dimensions and rectangular shape, which is assembled in a conventional manner.

Advantageous further developments, which further promote thermal stabilization of the ECU, are the subject of the dependent claims.

According to one aspect of the invention, the axial overlap between the power circuit and the pump impeller can be at least 10%, preferably 25% and particularly preferably 50% or more with respect to an axial dimension of the pump impeller or the pump chamber or a portion of the pump shaft on which the pump impeller is fixed.

According to the definition of this disclosure, the maximum effective range in the sense of the knowledge according to the invention is achieved from reaching an overlap range over the entire axial dimension of the pump impeller. The dimensions of the overlap area thus correspond to an approximation to this optimum.

According to one aspect of the invention, a circumference of the pump chamber can be designed in the form of a spiral housing from which the outlet emerges tangentially, and the receptacle for the electronic power circuit and the outlet can be arranged adjacent to one another.

Due to an adjacent proximity of the receptacle to the tangentially emerging pump outlet, as is generally present in spiral housings, the bypassing of the mass flow of the coolant is used in an even more advantageous manner for heat dissipation on the basis of an enlarged convection-effective area.

According to one aspect of the invention, the receptacle for the electronic power circuit can comprise a base section, which forms a receptacle area for receiving the electronic power circuit, which runs essentially tangentially to the circumference of the pump chamber.

This configuration creates a flat surface for receiving the ECU, which compensates for curvatures or other configurations of the contour of the pump housing.

According to one aspect of the invention, a circuit board of the power circuit can be in close contact with the receiving surface of the base section.

The heat transfer of the electronic power circuit to the pump housing is maximized by a large-area contact between the circuit board and the receptacle.

According to one aspect of the invention, the base section can be formed in one piece together with the pump housing.

With this configuration, the previously mentioned compensation of the contours of the pump housing to a flat surface by a molded part, e.g. is made from a die-cast, technically inexpensive to implement. Furthermore, the one-piece design of the base section, regardless of the material used, achieves the best possible thermal conductivity due to the fact that material transitions are omitted, the interfaces of which basically represent a resistance in a heat flow between a temperature difference.

According to one aspect of the invention, the base section can have an internal rib structure with ribs and cavities therebetween that run essentially perpendicular to the receiving surface.

By forming a rib structure, it is possible to save material on a molded part as long as sufficient heat dissipation is guaranteed. In order not to adversely affect the heat dissipation, the ribs preferably run perpendicularly between the power circuit and the pump chamber or at least in such a way that the cavities do not interrupt a direct connection of the ribs between the power circuit and the pump chamber.

According to one aspect of the invention, the base section can consist of aluminum or an aluminum alloy, which is suitable for production technology for a die casting process, injection molding process or 3D printing process.

By using aluminum or an aluminum alloy, good thermal conductivity is achieved in view of sufficient corrosion resistance, suitable manufacturing properties for the production of molded parts, as well as economical material costs and a favorable weight ratio.

According to one aspect of the invention, a plate-shaped heat sink made of a solid material can be provided between the receiving surface of the base section and the electronic power circuit.

The plate shape of the heat sink enables heat to spread in the plane of the large-area contact with the circuit board, which favors a compensation of the temperature difference between the positions of electronic components with different amounts of power consumption.

According to one aspect of the invention, the plate-shaped heat sink can be made from a solid material made of aluminum.

By providing a plate-shaped heat sink made of a solid material, the thermal conductivity in the plane of the same and between the power circuit and the pump housing is increased in comparison to a die-cast alloy.

According to one aspect of the invention, the plate-shaped heat sink can have at least one internal flow channel for the conveyed coolant, the at least one flow channel being connected to a circuit which branches off from a conveying flow in the coolant pump.

By providing an internal flow channel in the heat sink, further heat dissipation of a small mass flow of coolant is brought very close to the power circuit, as a result of which the distance of the present temperature difference is greatly shortened and is guided within the solid aluminum material with good thermal conductivity.

According to one aspect of the invention, the base section can have at least one reservoir for the conveyed coolant, the at least one reservoir being connected to a circuit which is branched off from a conveying flow in the coolant pump.

The design of a reservoir with coolant increases the heat capacity based on the volume of the base section. Although the heat capacity of the Reservoirs stores the waste heat from the electronic power circuit, the connection to a circulation with coolant at the same time prevents an increase in the temperature of this heat store in the base section beyond the temperature of the coolant.

According to one aspect of the invention, the at least one reservoir for the conveyed coolant can be designed to be open to the receiving surface of the base section and to be closed there by the plate-shaped heat sink.

This configuration combines the advantages of good thermal conductivity and heat dissipation in the plane, as well as an increased heat capacity with a limited rise in temperature, as explained in detail above.

According to one aspect of the invention, the electronic power circuit can comprise capacitors and FETs, and the capacitors and / or FETs can be positioned in the receptacle within an axial overlap with the pump impeller.

Due to their power consumption, electronic components such as capacitors and field effect transistors (FETs) represent the largest heat generators in a power circuit. At the position of the axial overlap, according to the knowledge according to the invention, the strongest convection-related heat transfer into the flow rate of the coolant is available. With such an arrangement, the positions at which the greatest heat is introduced are combined with the position of the locally maximum heat dissipation, viewed over the area of the power circuit. This shortens a distance of a heat flow due to the temperature difference, i.e. heat dissipation from the power circuit is further optimized.

According to one aspect of the invention, the pump housing and at least one of the base section, the heat sink, the pump cover, or a further section of the pump housing can be connected by a weld seam which is introduced by means of atmospheric electron beam welding.

Through this manufacturing step, the construction of the pump assembly according to the invention can be realized in an economically advantageous and technically reliable manner with regard to strength and tightness, since such welded connections make a prior introduction of fits, threads and grooves for seals, as well as a conventional assembly effort for screws and seals obsolete .

Fig. 1

eine axiale Schnittansicht der Pumpe, in der ein Zulauf aus dem Förderstrom in einen abgezweigten Kreislauf für die Leistungsbeschaltung ersichtlich ist;

Fig. 2

eine axiale Schnittansicht der Pumpe, in der ein Rücklauf aus dem abgezweigten Kreislauf für die Leistungsbeschaltung in den Förderstrom ersichtlich ist;

Fig. 3

eine perspektivische Ansicht, in der eine schematisch vereinfachte Leistungsbeschaltung einer ECU in einer Aufnahme des Pumpengehäuses dargestellt ist;

Fig. 4

eine perspektivische Ansicht, in der eine plattenförmige Wärmesenke auf einem Sockelabschnitt in der Aufnahme dargestellt ist;

Fig. 5

eine perspektivische Ansicht, in der eine Innenstruktur des Sockelabschnitts mit einem Reservoir mit dem Zulauf und Rücklauf des abgezweigten Kreislaufs dargestellt ist; und

Fig. 6

eine perspektivische Ansicht auf die Pumpenkammer ohne Pumpenlaufrad, in welcher der Zulauf und der Rücklauf des abgezweigten Kreislaufs ersichtlich sind.

The invention is described in detail below using an exemplary embodiment with reference to the drawings. In these show:

Fig. 1

an axial sectional view of the pump, in which an inlet from the flow into a branched circuit for the power circuit can be seen;

Fig. 2

an axial sectional view of the pump, in which a return from the branched circuit for the power circuit in the flow can be seen;

Fig. 3

a perspective view, in which a schematically simplified power circuit of an ECU is shown in a receptacle of the pump housing;

Fig. 4

a perspective view in which a plate-shaped heat sink is shown on a base portion in the receptacle;

Fig. 5

a perspective view showing an inner structure of the base portion with a reservoir with the inlet and outlet of the branched circuit; and

Fig. 6

a perspective view of the pump chamber without a pump impeller, in which the inlet and the return of the branched circuit can be seen.

The structure of an embodiment of the coolant pump according to the invention is described below with reference to FIG Figures 1 to 6 described.

Like the axial sectional views in the Figures 1 and 2 can be seen, a pump housing 1 comprises on one side a cavity in which an electric motor 3 is accommodated. A stator 33 with stator coils is fixed within the cavity on the pump housing 1 and surrounds a motor rotor 32 with permanent magnetic elements which are exposed to magnetic fields of the stator coils which are switched in operation during operation, as a result of which a torque is generated on the rotor 32. An open end of the cavity of the electric motor 3 is closed by a motor cover 14.

The motor rotor 32 is seated in a rotationally fixed manner on one end of a pump shaft 4, which is rotatably supported in the pump housing 1 in a central portion thereof and extends on the other side of the pump housing 1, which is opposite the electric motor 3, into a further cavity which has a pump chamber 10 forms. A pump impeller 2 is fixed in a rotationally fixed manner on the other end of the pump shaft 4 in the pump chamber 10 and is rotated in a flow-effective manner by the torque generated on the motor rotor 32 during operation.

A pump cover 11 is inserted into an open axial end of the pump housing and closes the pump chamber 10 at the end of the pump shaft 4 on the pump impeller 2. The pump cover 10 forms a centrally arranged suction port as a pump inlet 16, which axially feeds to an end face of the pump impeller 2. In the illustrated embodiment, the pump inlet 16 has another optional inlet for a separate cooling system.

The pump impeller 2, is a known radial pump impeller with a central opening adjacent to the intake port, which in the Figures 1 and 2 is not visible due to offset cutting planes to the shaft axis. The delivery flow, which flows axially through the pump inlet 16 through the pump inlet 16, is accelerated radially outward from the pump chamber 10 by the inner blades. At the periphery of the pump chamber 10 is a spiral housing 12, which is radial directed flow flows tangentially into a pressure port, which in the Figures 3 to 6 Pump outlet 17 shown forms.

At a peripheral area outside the cavity of the electric motor 3 and the pump chamber 10, a rectangularly delimited receptacle 13 is formed on the pump housing 1, in which a control unit or ECU of the pump including power electronics 30 of the electric motor 3 is embedded. An upwardly open side of the receptacle 13, which in Fig. 3 is shown, is closed by a protective cover when the pump is ready for operation.

Between an outer peripheral surface of the pump housing 1 or the spiral housing 12 and an interior of the receptacle 13 there is a base section 15 which compensates for an outer contour of the pump housing 1 and the spiral housing. The base section 15 has an upward receiving surface 50 for the ECU with power electronics 30, which extends tangentially to the circumference of the pump housing 1 and plane-parallel to the pump shaft 4. The contact surface 50 of the base section 15 thus forms a bottom surface of the receptacle 13. Fig. 4 shows that on the receiving surface 50 of the base section 15, a heat sink 5 is attached, which consists of an aluminum plate and the dimensions of which fill the inner surface of the receptacle 13.

A circuit board 31 of the ECU with power circuit 30 is applied to the heat sink 5 and is in surface contact with the heat sink 5. The structure of the circuitry on the printed circuit board 31 is shown schematically in simplified form on the basis of a section with electronic components of the ECU which are used for signal processing and electronic components which receive electrical power for supplying the electric motor 3. The latter form a power circuit 30 which controls the coils of the stator 33 and thus converts the drive power of the electric motor 3 from an external power source. The power electronics components that essentially contribute to heat generation are capacitors 35 and FETs (field effect transistors) 36, which in a typical configuration of a power circuit 30 in a plurality, such as, for example a number of the winding phases of the stator 33 are present. In the figures, the plurality of capacitors 35 and FETs 36 are represented in a simplified manner by a characteristic component.

A configuration of the power circuit 30 is arranged on an end section of the printed circuit board 31 on one side, which is aligned with the pump impeller 2 in an axial overlap region. Other electronic components of the ECU that are used for signal processing and do not consume any significant electrical power, i.e. generate essentially no heat are arranged on the mounting positions of the printed circuit board 31, which is on the other side in the direction of the electric drive 3. Connections for signal routing 37 and connections for connection to an external power source 38 are arranged on a front side of the printed circuit board 31 in the direction of the pump inlet 16. The power circuit 30 is connected to the stator 33 via leads 34 to one of the opposite rear sides of the printed circuit board 31.

As in the top view Fig. 5 is shown, the base section 15 does not fill the entire intermediate space between the receiving surface 50 and an outer contour of the pump housing 1 or spiral housing 12. The base section 15 consists of ribs 18 which are connected in a web-like manner, so that cavities are formed between the inner surfaces of the rectangular border of the receptacle 13 and the wall-like ribs 18 or webs. Furthermore, the ribs 18 are connected in such a way that they form a rectangular interior, which serves as a reservoir 55 and absorbs coolant. In this respect, the receiving surface 50 in this embodiment is rather formed by a plane of upper edges of the rib-like ribs 18 on which the plate-shaped heat sink 5 rests and which provides a continuous surface for receiving the ECU with power circuit 30. Threads are introduced at four corner points of the ribs 18 around the reservoir 55 in order to fasten the heat sink 5 by means of screws and to close off the reservoir 55 by means of a circumferential seal arranged on the receiving surface 50. The circuit board 31 lies on the heat sink 5 with surface contact, and can be mounted thereon, for example, with a thermal paste.

The reservoir 55 is traversed by a circuit of the coolant, which is branched off from the delivery flow of the coolant pump, in order to provide cooling of the power circuit 30 of the ECU via the heat sink 5 in between. A supply line 51 for supplying coolant to the reservoir 55 is provided through a through hole between a bottom surface of the reservoir 55 and the radial outer wall of the volute casing 12 at a position upstream of the pump outlet 17. A return 52 of the circuit for cooling the power circuit 30 is formed by two through holes tapering at right angles to one another in a central section of the pump housing between the cavity of the electric drive 3 and the pump chamber 10, as in FIG Fig. 2 is shown. The return 52 of the branched circuit leads from the reservoir 55 into an area of the pump chamber 10 behind the rear of the pump impeller 2.

Since an opening of the return 52 on the back of the pump impeller 2 lies away from the radially outward flow, there is less pressure at this position of the pump chamber 10 during operation than in a region of the radial outer wall of the volute casing 12, in which an opening of the Inlet 51 to the reservoir 55 is arranged. The branched circuit of the coolant is conveyed through the reservoir 55 by the pressure difference that exists between the inlet 51 and the return 52 in the pump chamber 10. Due to the branched circuit, the volume of the coolant in the reservoir 55, which receives heat input through the power circuit 30 via the heat sink 5, is continuously circulated and exchanged. As a result, stored heat is dissipated from the reservoir 55 into the total volume of the conveyed coolant based on the heat capacity of the coolant.

With an increase in the electrical drive power, heat generation in the power circuit 30 increases. At the same time, a flow rate through the pump chamber 10 increases and, as a result, a pressure difference between the Back of the rotating pump impeller 2 and the outer region of the volute casing 12. The increasing pressure difference increases the volume flow of the branched circuit, as a result of which the coolant in the reservoir 55 experiences a higher throughput. As a result, a temperature difference between the heat sink 5 and the branched-off coolant is maintained even with increasing heat input from the power circuit 30. A proportionally adapted heat dissipation is thus ensured and an excessive increase in temperature of the power circuit 30 can be counteracted with increased electrical power consumption.

It should be noted that the invention can also be implemented on the basis of simpler embodiments, not shown, as can be seen from the explanations in connection with the dependent claims.

For example, the coolant pump according to the invention can be designed without a branched circuit with the inlet 51 and the return 53 and the reservoir 55. The effect of heat dissipation from the power circuit 30 into the coolant is achieved in the axial overlap region with that of the pump impeller 2, in particular through good thermal conductivity of the base section 15 lying in between. The base section 15 of the receptacle 13 is preferably formed in one piece with the pump housing. Furthermore, an inner region of the base section 15 between a radial outer surface of the pump housing 1 or the spiral housing 12 and the receiving surface 50 is preferably completely filled with a material such as aluminum or an aluminum alloy or forms a rib structure with ribs 18 and cavities that are essentially perpendicular to one another extend the pump axis.

The same applies to an embodiment that does not include an aluminum plate as heat sink 5. The base section 15, with or without a reservoir, made of solid material or with a rib structure, can itself provide a continuously flat surface as the receiving surface 50, with which the circuit board 31 of the power circuit 30 is brought into contact for large-area heat transfer.

In addition, the plate-shaped heat sink 5 can be designed according to the invention in such a way that it has an internal flow channel 53. This embodiment can be realized, for example, by two halves of the heat sink 5 which are separated in the plane and in which a congruently shaped channel, e.g. through milled grooves, runs between the inlet 51 and the return 52. The internal flow channel 53 can, for example, run in a meandering manner, so that, comparable to a miniature form of underfloor heating, a heat exchanger for cooling the power circuit 30 is formed.

Claims (15)

1. Electric coolant pump, comprising:

   a pump housing (1) with a pump chamber (10), in which a pump impeller (2) is rotatably accommodated, a pump cover (11) that closes the pump chamber (10) to one side of the pump impeller (2), and at least one inlet (16) and one outlet (17) that are connected to the pump chamber (10);

   an electric motor (3) with a rotor (32) and a stator (33) which is arranged on a side of the pump chamber (10) which is opposite the pump cover (11), on the pump housing (1);

   a pump shaft (4) that is rotatably mounted on the pump housing (1) extends from the electric motor (3) into the pump chamber (10), wherein the rotor (32) and the pump impeller (2) are fixed thereon; and

   an electronic power circuit (30) for controlling the stator (33) with a power output from an external power supply that can be connected to the power circuit (30); wherein

   the pump housing (1) possesses a receiver (13) for the electronic power circuit (30) which, in relation to the pump shaft (4), is arranged radially outside the pump chamber (10);

   characterised in that

   at least one end section of a circuit board (31) of the electronic power circuit (30) is aligned inwards to one side in an axial overlapping area with an outer edge of the pump impeller (2) facing the electronic power circuit (30).
2. Electric coolant pump according to claim 1, wherein the axial overlap between the power circuit (30) and the pump impeller (2) is at least 10%, preferably 25% and particularly preferably 50% or more with respect to an axial dimension of the pump impeller (2) or the pump chamber (10) or a section of the pump shaft (4) on which the pump impeller (2) is fixed.
3. Electric coolant pump according to claim 1 or 2, wherein a perimeter of the pump chamber (10) is designed in the form of a spiral housing (12) from which the outlet (17) emerges tangentially, and the receiver (13) for the electronic power circuit (30) and the outlet (17) are arranged adjacent to one another.
4. Electric coolant pump according to one of the preceding claims, wherein the receiver (13) for the electronic power circuit (30) comprises a base section (15) that forms a receiving surface (50) for receiving the electronic power circuit (30) which extends essentially tangentially to the perimeter of the pump chamber (10).
5. Electric coolant pump according to claim 4, wherein a circuit board (31) of the power circuit (30) is in close contact with the receiving surface (50) of the base section (15).
6. Electric coolant pump according to claim 4 or 5, wherein the base section (15) is integrally formed with the pump housing (1).
7. Electric coolant pump according to one of claims 4 to 6, wherein the base section (15) has an internal rib structure with ribs (18) and intermediate cavities that run substantially perpendicular to the receiving surface (50).
8. Electric coolant pump according to one of claims 4 to 7, wherein the base section (15) consists of aluminium or an aluminium alloy, which from the manufacturing point of view is suitable for a die casting process, injection moulding process or 3D printing process.
9. Electric coolant pump according to one of claims 4 to 8, wherein a heat sink (5) sheet made of a solid material is provided between the receiving surface (50) of the base section (15) and the electronic power circuit (30).
10. Electric coolant pump according to claim 9, wherein the heat sink (5) sheet manufactured from a solid material is made of aluminium.
11. Electric coolant pump according to claim 9 or 10, wherein the heat sink (5) sheet has at least one internal flow channel (53) for the pumped coolant, wherein the at least one flow channel (53) is connected to a circuit (51, 52) that branches off the supplied flow in the coolant pump.
12. Electric coolant pump according to one of claims 4 to 11, wherein the base section (15) has at least one reservoir (55) for the pumped coolant, wherein the at least one reservoir (55) is connected to a circuit (51, 52) that branches off the supplied flow in the coolant pump.
13. Electric coolant pump according to claim 12, wherein the at least one reservoir (55) for the pumped coolant is open to the receiving surface (50) of the base section (15) and is closed off by the heat sink (5) sheet.
14. Electric coolant pump according to one of the preceding claims, wherein the electronic power circuit (30) comprises capacitors (35) and FETs (36), and the capacitors (35) and / or FETs (36) are positioned within an axial overlap with the pump impeller (2) in the receiver (13).
15. Electric coolant pump according to one of the preceding claims, wherein the pump housing (1) and at least one of the base section (15), the heat sink (5), the pump cover (11), or a further section of the pump housing (1) are connected by a weld seam that is introduced by means of atmospheric electron beam welding.

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