EP3317360A1

EP3317360A1 - Use of a composite material for heat management

Info

Publication number: EP3317360A1
Application number: EP16733916.7A
Authority: EP
Inventors: Thomas KÖCK; Werner Langer; Bastian Hudler
Original assignee: SGL Carbon SE
Current assignee: SGL Carbon SE
Priority date: 2015-06-30
Filing date: 2016-06-27
Publication date: 2018-05-09
Also published as: US20180187977A1; US10739080B2; KR20180022901A; WO2017001323A1; KR102058804B1; DE102015212132A1

Abstract

The invention relates to the use of a composite material for heat management in the electrical and/or electronic area, in particular in a car, comprising a grid-like structure filled with a phase change material (PCM), and to a composite material that consists of a grid-like structure filled with PCM, said filled grid-like structure being present on a cover layer or between two cover layers.

Description

Use of a composite material for thermal management

description

The present invention relates to the use of a composite material for heat management in the electrical and / or electronic field, in particular in the automobile, comprising a lattice-like structure filled with phase change material (PCM) and a composite consisting of a lattice structure provided with PCM is filled and this filled grid structure is on a cover layer or between two cover layers.

When using electrical and / or electronic components heat is generated, which must be dissipated to prevent overheating of the component - and thus the failure of the component.

It is known, among other things, to use PCMs (latent heat storage materials) for heat removal, since they can both store and release heat in the form of latent heat. PCMs undergo a phase transition when heat is applied or released. This can be, for example, a transition from the solid to the liquid phase or vice versa. During heat supply or heat removal from the PCM, when the phase transition point is reached, the temperature remains constant until the material is completely converted. The heat supplied or removed during the phase transition, which does not cause a temperature change in the material, is called latent heat.

Examples of possible phase change materials are paraffins, waxes, sugar alcohols, alcohols, sugars, polymers, in particular thermoplastic polymers, water, organic acids, such as fatty acids, aqueous salt solutions, such as salt hydrates, or amides (WO2008087032A1, US8580171 B2).

Due to the fact that the thermal conductivity of most PCM in the range of 0.3 to 0.4 W / (m-K) is rather low, the process of heat absorption or heat dissipation is very slow and therefore not technically relevant in most cases.

The problem that the process of heat dissipation when using PCMs is very slow can be overcome by the use of a latent heat storage composite, wherein the PCM is combined with an auxiliary component with high thermal conductivity, such as graphite, in particular expanded graphite. Expanded graphite is particularly suitable as an auxiliary component due to the high thermal conductivity and also has a good chemical resistance (US8580171 B2, WO2008087032A1).

For the application of a latent heat storage composite material leakage of the PCM must be avoided during the transition to the liquid phase. It is known to encapsulate PCM. The disadvantage here is the difficulty of encapsulation of the PCM. This is mainly due to the fact that the PCM undergoes a volume change of up to 15% during the phase change and thus results in a dimensional change of more than 5% in the composite material produced therefrom, resulting in fatigue of the capsule material after only a short period of use Failure of the encapsulation comes. In DE102013215255A1 the difficulty of encapsulating a PCM is solved by the use of an elastomeric matrix. Here the PCM is embedded in an elastomeric matrix. However, this results in other disadvantages. On the one hand, the elastomeric matrix also has a low thermal conductivity; furthermore, these materials can not be used to build up dimensionally stable components since the entire complex softens when the composite melts. The known PCM / graphite composite materials have the disadvantage that a relatively high (at least> 10% by weight) binder content must be used, since otherwise the integrity of the composite material is not given. With a high binder content, conductive additive mixtures of at least 20% by weight must be added, which reduces the storage capacity proportionally but by at least 25%.

The object of the invention is therefore to provide a composite material, which can be used for thermal management, with which the above-mentioned disadvantages of the prior art are overcome.

The object is achieved by the use of a composite material for heat management in the electrical and / or electronic field, such as in the automobile in the temperature range up to 600 ° C, preferably up to 150 ° C, comprising a grid structure filled with phase change material (PCM) is solved.

According to the invention, it has been recognized that with the use of such composite materials, the dimensional changes in all spatial directions, due to the PCM, can be reduced to less than 5%, in particular 3%, and thus composite materials can be manufactured with low skill tolerances. In addition, the heat capacity is less affected by the lattice structure, in contrast to the use of Leitadditiven, with less than 15% and the heat conductivity even due to directed heat flows due to continuous areas of high thermal conductivity, compared to the pure PCM improved by more than 300%.

As a lattice structure is understood in the context of the present invention, a kind of hole structure consisting of threads, ropes, wires, sheets or the like, which are interconnected so that between the individual nodes / intersections always a gap remains. The dimensions such as height, width, depth and shape of the structure is not limited. As forms come polygons, in particular squares, hexagons (such as honeycombs) or circles in question. The dimensions of the squares will be determined by the measurement of the length and width and advantageously each have a size of 1 to 40 mm, preferably 2 to 40 mm, particularly preferably 3 to 30 mm. The dimensions of the circles are determined by measuring the diameter and would advantageously have a size of 1 to 40 mm, preferably 2 to 40 mm, particularly preferably 3 to 30 mm. The dimensions of the honeycombs are determined according to DIN 29970 (1998-09) and advantageously has a size of 1 to 40 mm, preferably 2 to 40 mm, particularly preferably 3 to 30 mm.

Advantageously, the lattice structure of metal, ceramic, graphite or any mixtures thereof. Consequently, the grid structure may consist of a mixture of metal and ceramic, metal and graphite, ceramic and graphite or a mixture of metal, ceramic and graphite.

When the grid structure is metal, it is preferably selected from the group consisting of aluminum, copper or steel. Particularly preferably, the lattice structure consists of aluminum. When the lattice structure is made of ceramic, it is preferably selected from the group consisting of aluminum nitride, aluminum oxide, silicon carbide or carbon fiber reinforced silicon carbide (C / SiC). Particularly preferably, the lattice structure consists of C / SiC. When the lattice structure is graphite, the graphite is preferably selected from the group consisting of natural graphite, synthetic graphite or expanded graphite. Particularly preferably, the lattice structure consists of expanded graphite.

For producing expanded graphite having a vermiform structure, graphite such as natural graphite is usually mixed with an intercalate such as nitric acid or sulfuric acid and heat-treated at an elevated temperature of, for example, 600 ° C to 1200 ° C. (DE10003927A1)

Expanded graphite represents a graphite which, in comparison to natural graphite in the plane perpendicular to the hexagonal carbon layers, for example around the Factor 80 or more is expanded. Due to the expansion, expanded graphite is characterized by excellent formability and good intermeshability. Expanded graphite may be used in sheet form, preferably using a film having a density of 1.3 to 1.8 g / cm ³ . A film having this density range has thermal conductivities of 300 W / (mK) to 500 W / (mK). The thermal conductivity is determined by the Angstrom method ("Angström's Method of Measuring

Thermal Conductivity "; Amy L. Lytle; Physics Department, The College of Wooster, Theses).

Advantageously, the grid structure has a wall thickness of 0.01 to 2 mm, preferably 0.03 to 0.5 mm, particularly preferably 0.05 to 0.2 mm, since thereby the heat generated by operation of the electrical and / or electronic component can be derived faster and the influence on the heat capacity is still low.

Particularly good results are achieved with a horizontal thickness of the lattice structure of 0.5 to 50 mm, preferably 1 to 30 mm, particularly preferably 2 to 20 mm. The dimensioning of the thickness allows tailor-made thermal management for various electronic and / or electrical components. Electronic components are, for example, laptops, smartphones, LCDs (liquid crystal screens), LEDs (light-emitting diode screens), OLEDs, (organic light-emitting diode screens), etc. Electrical components are, for example, power modules, printed circuit boards or the like.

By using the lattice structure, the composite is divided into many small areas, each self-contained. This significantly reduces the leakage of large amounts of PCM in the event of damage. In addition, by the grid structure, the strength of the composite by more than 200% and the modulus of elasticity increased by more than 400%, while the amount of binder can be reduced to a maximum of 2 wt.% At the same time. Another advantage of the lattice structure is that, in addition to can be omitted and thus the heat capacity only slightly, but not more than 15%, is lowered. By dimensioning the grid structure and material of the grid structure, the thermal conductivity and thus the transmittable heat flow can be adjusted specifically. It is also possible to use unbalanced lattice structures. This allows the provision of a custom PCM material for the component.

Furthermore, by combining different materials and material thick customized lattice structures can be produced, which are adapted to the respective heat sources of the electrical / electronic component and thus maximize the heat dissipation and heat capacity respectively.

Particularly suitable PCMs are sugar alcohols, paraffins, waxes, salt hydrates, fatty acids, preferably paraffins, salt hydrates and waxes. As the sugar alcohols, there may be used, for example, pentaerythritol, trimethylolethane, erythritol, mannitol, neopentyl glycol and any mixture thereof. As paraffins, saturated hydrocarbons having the general empirical formula C _n H 2n + 2 may be used, where the number n may be between 18 and 32. The molar mass of such paraffins is thus between 275 and 600 grams per mole. The salt hydrates used can be, for example, calcium chloride hexahydrate, magnesium chloride hexahydrate, lithium nitrate trihydrate and sodium acetate trihydrate. For example, capric, lauric, myristic, palmitic, stearic and any mixture thereof may be used as fatty acids. The salt hydrates can be used, for example, calcium chloride hexahydrate, magnesium chloride hexahydrate, lithium nitrate trihydrate and sodium acetate trihydrate. The choice of PCM depends on the temperature range of the application.

The preferred use of the composite in the electrical and / or electronic field of the automobile is in the temperature range up to 600 ° C, preferably using salt hydrates. In the preferred application temperature range rich to 150 ° C paraffins and waxes are preferably used. In electronic applications, such as laptops, the preferred operating temperature range is up to 100 ° C, with paraffins and waxes preferably being used.

According to an advantageous embodiment, the PCM may be in free, bound, encapsulated or microencapsulated form. Suitable encapsulating materials are plastics such as polymethyl methacrylate. The encapsulating material forms a plastic sleeve for the PCM. By microencapsulated is meant an encapsulation of <5 mm.

According to an advantageous embodiment, the PCM in the form of microencapsulated particles has an average particle size of <5 mm, preferably 3 to 100 μm, particularly preferably 3 to 15 μm. If the particle sizes exceed 5 mm, there is a significant drop in the heat input into the capsule itself and the PCM inside the capsule only melts very slowly. This means that often the entire heat capacity can not be used. If the capsule is too small results in an unfavorable ratio of PCM and non-active capsule shell, which in turn adversely affects the heat capacity.

In a further advantageous embodiment, a binder is added to the PCM, i. the grid structure is filled with PCM and binder.

According to a further advantageous embodiment, the binder may be selected from the group consisting of epoxy resins (such as Araldite 2000 (2014)), silicone resins or acrylate resins.

According to a still further advantageous embodiment, the binder content is 2 to 40% by weight, preferably 5 to 30% by weight, more preferably 5 to 10% by weight. Due to the low binder content, the strength of the composite material can be compared increase the unbound by more than 100% and the heat capacity is only slightly affected. In the most preferred case, the heat capacity is reduced by only 10%.

In a further advantageous embodiment, a conductive additive is added to the PCM or the PCM and binder. This additionally increases the thermal conductivity. Depending on the conductive additive quantity, the thermal conductivities can be increased up to 20 W / (m-K).

Advantageously, this conductive additive is selected from the group consisting of synthetic graphite, expanded graphite, boron nitride, aluminum or copper. Expanded graphite is particularly preferably used as a conductive additive.

In a further advantageous embodiment, the proportion of the Leitadditives 0 to 90 wt.%, Preferably 5 to 30 wt.%, Particularly preferably 10 to 20 wt.%. The addition of a conductive additive increases the thermal conductivity in addition to the lattice structure and allows the transmission of larger heat fluxes. With a low admixture of up to 10% by weight, the influence on the heat capacity is still within an acceptable range of less than 10%.

The mixing ratios of PCM, binder and conductive additive can be adjusted as required, the minimum proportion of the binder being 2% by weight and the minimum amount of PCM being 60% by weight. There is no minimum percentage for the lead additive. In sum, these components always give 100 wt.%.

Another object of the present invention is a composite material comprising a grid structure filled with PCM, wherein the filled grid structure is on a cover layer or between two cover layers. Also for this composite material, the embodiments as described above for the lattice structure, the PCMs, the binders and the conductive additives can be used.

The cover layers of this composite material according to the invention can be selected from the group consisting of graphite foils, carbon fiber fabric, carbon fiber fabric, copper foil or aluminum foil, the graphite foils being preferably used.

Due to the cover layers, the heat is quickly distributed on the one hand because of the good thermal conductivity of graphite and also the filled grid structure is additionally encapsulated, which prevents leakage of the PCMs.

In a further preferred embodiment, the cover layers have a thickness of 10 μm to 3 mm, preferably from 0.2 to 2 mm, particularly preferably from 0.5 to 1 mm.

In a further preferred embodiment, the cover layers of graphite foils consist of expanded graphite with a density of 1.3 to 1.8 g / cm ³ .

Hereinafter, the present invention will be described purely by way of example with reference to advantageous embodiments and with reference to the accompanying drawings.

Figure 1 shows a schematic plan view of the PCM / lattice composite material according to the second embodiment of the present invention with broken surface, illustrating the internal, filled grid structure.

Figure 2 shows a schematic side view according to the second

Embodiment of the present invention. FIG. 1 shows a schematic plan view of the second exemplary embodiment. The sample size is 95 x 140 mm (Ixb). Clearly visible is the lattice structure (2), which here consists of aluminum, in which the PCM material (1) is filled. On the bottom and top of each graphite foil is attached as a cover layer (3).

Fig. 2 shows a schematic side view of the sample body of Figure 1 according to the second embodiment of the present invention. The thickness (h) of the sample basket is 1 1 mm. It can be clearly seen that the lattice structure (2) filled with PCM (1) is enclosed on both the upper side and the lower side by the cover layers (3).

Hereinafter, the present invention will be explained with reference to embodiments, wherein the embodiments are not limiting the invention.

Embodiment 1

A test specimen with the dimensions 140 x 95 x 1 1 mm is produced. For this purpose, a honeycomb structure made of 50 layers of aluminum foil with a thickness of 50 μηη by staggered selective connecting with a total of 2 g of adhesive (Araldit 2000 (2014)) and then pulled apart produced. The desired honeycomb height is cut to length from the resulting block. This structure is then filled with 120 g of PCM binder material (100 g Micronal, m.p. 28 ° C and 20 g Araldit 2000 (2014).

Embodiment 2

A test specimen with the dimensions 140 x 95 x 1 1 mm is produced. For this purpose, a honeycomb structure of 50 layers of aluminum foil with a thickness of 50 μηη each made by offset bonding with a total of 2 g of adhesive (Araldit 2000 (2014)) and then pulled apart. The desired honeycomb height is cut to length from the resulting block. This structure is then filled with 120 g of PCM binder material (100 g Micronal, melting point 28 ° C and 20 g Araldit 2000 (2014) and clamped between two layers of graphite foil (500 μηη thickness and 1, 8 g / cm ³ density).

Table 1

It has surprisingly been found that due to the aluminum honeycomb structure, the thermal conductivity perpendicular to the sample plane is 1.5 W / (mK), clearly above the pure PCM sample (reference sample: composition as in Example 1, but without aluminum honeycomb structure) with 0.3 W / (mK) is (see Table 1). If, according to the prior art, conductive additives were admixed, at least 30% by weight would be necessary to achieve the same thermal conductivity as the heat capacity of the But reduce the sample by at least 30%. By using the aluminum honeycomb, however, this is only reduced by 15%.

LIST OF REFERENCE NUMBERS

1 phase change material

2 grid structure

3 top layer

b width of the specimen

I length of the specimen

h thickness of the specimen

Claims

claims

1. Use of a composite material for heat management in the electrical and / or electronic field, comprising a grid structure which is filled with phase change material (PCM).

2. Use according to claim 1, wherein the grid structure has a polygon structure.

3. Use according to claim 1 or 2, wherein the lattice structure is made of metal,

Ceramics, graphite or any mixtures thereof.

4. Use according to claim 3, wherein the lattice structure of metal from the

Group consisting of aluminum, copper or steel is selected.

Use according to claim 3, wherein the lattice structure of graphite is selected from the group consisting of natural graphite, synthetic graphite or expanded graphite or mixtures thereof.

6. Use according to claim 3, wherein the grid structure has a wall thickness of 0.01 to 2 mm.

7. Use according to claim 1, wherein the phase change material (PCM) can be selected from the group consisting of sugar alcohols, paraffins, waxes, salt hydrates, fatty acids.

8. Use according to claim 7, wherein the PCM is in free, bound,

encapsulated or microencapsulated form may be present.

9. Use according to claim 7 or 8, wherein the microencapsulated PCM has a size of <5 mm.

10. Use according to claim 1, wherein the lattice structure is additionally filled with binder.

1 1. Use according to claim 10, wherein the binder is selected from the group consisting of epoxy resins, silicone resins and acrylate resins.

12. Use according to claim 10 or 1 1, wherein the binder content is 2 to 40 wt.%.

13. A composite material comprising a grid structure filled with PCM, wherein the filled grid structure is on a cover layer or between two cover layers.

14. A composite material according to claim 13, wherein the cover layers are selected from the group consisting of graphite foils, carbon fiber fabric, carbon fiber fabric,

Copper foil or aluminum foil can be selected.

15. A composite material according to claim 13 or 14, wherein the cover layers have a thickness of 10 μηη to 3 mm.