EP3302015B1 - Boîtier et dispositif électronique le comportant - Google Patents

Boîtier et dispositif électronique le comportant Download PDF

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Publication number
EP3302015B1
EP3302015B1 EP17173297.7A EP17173297A EP3302015B1 EP 3302015 B1 EP3302015 B1 EP 3302015B1 EP 17173297 A EP17173297 A EP 17173297A EP 3302015 B1 EP3302015 B1 EP 3302015B1
Authority
EP
European Patent Office
Prior art keywords
case
fan
guide slot
air inlet
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17173297.7A
Other languages
German (de)
English (en)
Other versions
EP3302015A1 (fr
Inventor
Qu'e CAI
Yonghong Li
Puyun Dong
Jianhua Mao
Long LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sungrow Power Supply Co Ltd
Original Assignee
Sungrow Power Supply Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sungrow Power Supply Co Ltd filed Critical Sungrow Power Supply Co Ltd
Publication of EP3302015A1 publication Critical patent/EP3302015A1/fr
Application granted granted Critical
Publication of EP3302015B1 publication Critical patent/EP3302015B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1428Housings for small modular apparatus with terminal block
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink

Definitions

  • This application relates to a case and an electronic device having the case.
  • US 4520425 A relates to a control apparatus such as an inverter including a hollow body having generally a rectangular cross-section, composed of sides of sheet metal with upper and lower open ends shielded by cast hollow frames, each having a similar cross-section. Electrical circuit elements are mounted to one of the sides of the hollow body through an opening therein. Ventilating fans are mounted to at least one of the hollow frames for cooling the electrical circuit elements.
  • the case has a fan mounted in a hidden manner, thus addressing the issues that the fan is apt to be invaded by sand wind and rain, and a mounting direction of the fan is from top to bottom which is exactly the same as the direction of gravity, therefore, it is difficult for dust to be accumulated on the fan, and the service life and reliability of the fan are ensured.
  • a lower end and an upper end of the same side wall of the case are respectively provided with at least one air inlet and at least one air outlet.
  • the air inlet of the fan is provided with a dust screen.
  • the mounting mechanism further includes a positioning plate, and the positioning plate has one end fixed to the mounting plate and another end configured to be fixed to a side wall of the case by several fasteners after the mounting plate is inserted into the guide slot.
  • the positioning plate and the mounting plate are configured as an integrally formed structure.
  • a heat dissipator is arranged in the air duct and between the fan and the air outlet.
  • the present application further relates to an electronic device, which includes a case, and a circuit part and a plurality of heat generating elements mounted in the case, and the case is the case according to any one of the above solutions.
  • the case is configured to include a front case body and a rear case body; the plurality of heat generating elements and the air duct of the case are arranged inside the rear case body, and the circuit part is arranged inside the front case body.
  • the present application has the following advantages.
  • an electronic device according to the present application is exemplarily illustrated by taking an inverter as an example.
  • the electronic device includes a case, and a circuit part (not illustrated) and several heat generating elements 14 mounted in the case.
  • a fan 7 and a mounting mechanism for mounting the fan 7 in the case are arranged on a case wall of the case, and an air inlet 5 and an air outlet 3 in communication with the air inlet 5 are arranged in the case wall of the case. It may be appreciated that, the number of the fan 7 is one or more, the number of the air inlet 5 is one or more, and the number of the air outlet 3 is one or more.
  • the fan 7 is arranged inside the case and is located between the air inlet 5 and the air outlet 3.
  • Each of the fan 7 is mounted in a bottom-to-top manner with its air inlet facing downwards and its air outlet facing upwards.
  • the air inlet 5 is located at a lower end of the case, and the air outlet 3 is located at an upper end of the case, and an air duct from bottom to top is formed by the air inlet 5, the fan 7 and the air outlet 3.
  • One or more heat dissipators 6 may be provided in the air duct and between the fan 7 and the air outlet 3.
  • the formed air duct is from bottom to top, which facilitates rapid and uniform heat dissipation of the heat dissipators 6.
  • the case may be configured to include a front case body 1 and a rear case body 2.
  • the heat dissipators 6, the heat generating elements 14 and the air duct of the case and the like have a low waterproofing grade and are thus arranged inside the rear case body 2.
  • the circuit part has a high waterproofing grade and is thus arranged inside the front case body 1.
  • a lower end and an upper end of the same side wall of the case may be respectively provided with at least one air inlet 5 and at least one air outlet 3.
  • the fan 7 is mounted at a lower middle part of the rear case body 2, the air inlet 5 is located at a lower part of the rear case body 2, and the air outlet 3 is located at two sides or an upper part of the rear case body 2, thereby forming the air duct from bottom to top, which facilitates uniform heat dissipation of the heat dissipators 6.
  • the air inlet of each of the fan 7 may be provided with a dust screen, and with the isolation by the dust screen, it is difficult for the sand wind and rain to invade the fan.
  • the mounting direction of the fan 7 is from top to bottom, which is exactly the same as the direction of gravity, therefore, it is difficult for dust to be accumulated on the fan 7, thus ensuring the service life and reliability of the fan 7.
  • the fan 7 can be mounted in various ways, and may be directly fixed or indirectly fixed. In the present application, for ensuring that the fan 7 can be detached and mounted rapidly, the fan 7 is mounted in the case via a mounting mechanism, and reference may be made to Figure 3 .
  • the mounting mechanism may include one mounting plate 8, one guide slot 10, each of the fan 7 is mounted on the mounting plate 8, and the mounting plate 8 is inserted into the guide slot 10 from one side of the guide slot 10.
  • the mounting mechanism may also include two mounting plates 8, one guide slot 10, and in the case that the number of the fan 7 is plural, the multiple fans 7 are divided into two groups and the two groups of the fans 7 are respectively mounted on the two mounting plates 8, and the two mounting plates 8 are inserted into the guide slot 10 respectively from two opposite sides of the guide slot 10, and this is the structure of this embodiment.
  • the mounting mechanism may further include a baffle 12.
  • the baffle 12 is mounted in the guide slot 10, and an end, inserted into the guide slot 10, of the mounting plate 8 is provided with a clamp slot 11.
  • the clamp slot 11 can be engaged with a side of the baffle 12 that is facing the corresponding clamp slot 11 after the mounting plate 8 is inserted into the guide slot 10.
  • the mounting mechanism may further include a positioning plate 13.
  • the positioning plate 13 has one end fixed to the mounting plate 8 and another end configured to be fixed to a side wall of the case by several fasteners (such as screws or bolts) after the mounting plate 8 is inserted into the guide slot 10.
  • the positioning plate 13 and the mounting plate 8 may be configured as an integrally formed structure, to increase the structural strength of the mounting structure.
  • the fan 7 and the mounting plate 8 may form an integrated fan assembly 9, and in the mounting and detaching processes, the fan assembly 9 is regarded as an integrated part, which facilitates the detaching process.
  • the fan assembly 9 is inserted in the guide slot 10 till the clamp slot 11 is engaged with the baffle 12.
  • the mounting plate 8 and the rear case body 2 are fixed by fasteners such as screws or buckles externally, thus ensuring the rapid detaching and mounting of the fan assembly 9.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (7)

  1. Boîtier, comprenant un ventilateur (7) agencé sur une paroi de boîtier du boîtier, une entrée d'air (5) et une sortie d'air (3) en communication avec l'entrée d'air (5) agencées dans la paroi de boîtier du boîtier ;
    sachant que le ventilateur (7) est agencé à l'intérieur du boîtier (4) et est situé entre l'entrée d'air (5) et la sortie d'air (3) ; le ventilateur (7) est monté de bas en haut, une entrée d'air du ventilateur (7) tournée vers le bas et une sortie d'air du ventilateur (7) tournée vers le haut ; l'entrée d'air (5) est située à une extrémité inférieure du boîtier (4), la sortie d'air (3) est située à une extrémité supérieure du boîtier (4), et un conduit d'air allant de bas en haut est formé par l'entrée d'air (5), le ventilateur (7) et la sortie d'air (3) ; et
    sachant que le ventilateur (7) est monté à l'intérieur du boîtier via un mécanisme de montage, et
    caractérisé en ce que le mécanisme de montage comprend une plaque de montage (8), une fente de guidage (10), chaque ventilateur (7) est monté sur la plaque de montage (8), et la plaque de montage (8) est insérée dans la fente de guidage (10) depuis un côté de la fente de guidage (10) ;
    ou
    le mécanisme de montage comprend deux plaques de montage (8) et une fente de guidage (10), dans un cas où le nombre de ventilateurs (7) est multiple, la pluralité de ventilateurs (7) est divisée en deux groupes et les deux groupes de ventilateurs (7) sont montés respectivement sur les deux plaques de montage (8), et les deux plaques de montage (8) sont insérées dans la fente de guidage (10) respectivement depuis deux côtés opposés de la fente de guidage (10) ; et
    sachant que le mécanisme de montage comprend en outre un soufflet (12), le soufflet (12) est monté dans la fente de guidage (10), et une extrémité, insérée dans la fente de guidage (10), de la plaque de montage (8) est pourvue d'une fente de serrage (11), et la fente de serrage (11) est mise en prise avec un côté du soufflet (12) tourné vers la fente de serrage (11) correspondante après que la plaque de montage (8) est insérée dans la fente de guidage (10).
  2. Le boîtier selon la revendication 1, sachant qu'une extrémité inférieure et une extrémité supérieure de la même paroi latérale du boîtier (4) sont respectivement pourvues d'au moins une entrée d'air (5) et d'au moins une sortie d'air (3).
  3. Le boîtier selon la revendication 1, sachant que l'entrée d'air du ventilateur (7) est pourvue d'un écran anti-poussière.
  4. Le boîtier selon la revendication 1, sachant que le mécanisme de montage comprend en outre une plaque de positionnement (13), la plaque de positionnement (13) comporte une extrémité fixée à la plaque de montage (8) et une autre extrémité configurée pour être fixée à une paroi latérale du boîtier (4) par une pluralité de fixations après que la plaque de montage (8) est insérée dans la fente de guidage (10).
  5. Le boîtier selon la revendication 4, sachant que la plaque de positionnement (13) et la plaque de montage (8) sont configurées comme structure formée d'un seul bloc.
  6. Le boîtier selon la revendication 1, sachant qu'un dissipateur de chaleur (6) est agencé dans le conduit d'air et entre le ventilateur (7) et la sortie d'air (3).
  7. Dispositif électronique, comprenant un boîtier, et une partie circuit et une pluralité d'éléments générateurs de chaleur (14) montés dans le boîtier, sachant que le boîtier est le boîtier (4) selon l'une quelconque des revendications 1 à 6 ; le boîtier (4) est configuré pour comprendre un corps de boîtier avant (1) et un corps de boîtier arrière (2) ; la pluralité d'éléments générateurs de chaleur (14) et le conduit d'air du boîtier (4) sont agencés à l'intérieur du corps de boîtier arrière (2), et la partie circuit est agencée à l'intérieur du corps de boîtier avant (1).
EP17173297.7A 2016-09-30 2017-05-29 Boîtier et dispositif électronique le comportant Active EP3302015B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621099885.6U CN206061354U (zh) 2016-09-30 2016-09-30 一种机箱及具有所述机箱的电子设备

Publications (2)

Publication Number Publication Date
EP3302015A1 EP3302015A1 (fr) 2018-04-04
EP3302015B1 true EP3302015B1 (fr) 2020-09-09

Family

ID=58363347

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17173297.7A Active EP3302015B1 (fr) 2016-09-30 2017-05-29 Boîtier et dispositif électronique le comportant

Country Status (3)

Country Link
US (1) US10643923B2 (fr)
EP (1) EP3302015B1 (fr)
CN (1) CN206061354U (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112601394A (zh) * 2020-11-17 2021-04-02 宜兴市鸿雁电器有限公司 一种工业用防水防尘铰链箱

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2343974A1 (fr) * 1976-03-10 1977-10-07 Honeywell Bull Soc Ind Enceinte de ventilation
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
US6115250A (en) * 1998-01-20 2000-09-05 Dell Usa, Lp Computer and an assembly and method for cooling a computer
JP2001148588A (ja) * 1999-11-24 2001-05-29 Olympus Optical Co Ltd 工作機械の放熱装置
CN2695701Y (zh) * 2004-04-27 2005-04-27 鸿富锦精密工业(深圳)有限公司 风扇固定装置
JP4935193B2 (ja) * 2006-05-31 2012-05-23 富士電機株式会社 インバータ装置
JP5344182B2 (ja) * 2010-02-02 2013-11-20 株式会社安川電機 電力変換装置
JP5527479B2 (ja) * 2011-03-30 2014-06-18 日本電気株式会社 ファンシャーシ、ファンユニット、及び通信装置
US8493734B2 (en) * 2011-04-01 2013-07-23 T-Win Systems, Inc. Multi-case rack for industrial computer
CN103687414B (zh) * 2012-08-30 2016-12-21 台达电子工业股份有限公司 大功率机柜散热系统及静止无功补偿系统
DE102013109575A1 (de) * 2013-09-03 2015-03-05 DESITECK Diez Energy Solutions GmbH Elektronische Spannungs- oder Stromversorgungseinheit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
US20180096911A1 (en) 2018-04-05
US10643923B2 (en) 2020-05-05
EP3302015A1 (fr) 2018-04-04
CN206061354U (zh) 2017-03-29

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