EP3281499A1 - Subassembly - Google Patents

Subassembly

Info

Publication number
EP3281499A1
EP3281499A1 EP16715516.7A EP16715516A EP3281499A1 EP 3281499 A1 EP3281499 A1 EP 3281499A1 EP 16715516 A EP16715516 A EP 16715516A EP 3281499 A1 EP3281499 A1 EP 3281499A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
electrical
resistance element
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16715516.7A
Other languages
German (de)
French (fr)
Inventor
Andreas HAMMA
Daniel MOOSMANN
Matthias Reckermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marquardt GmbH
Original Assignee
Marquardt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt GmbH filed Critical Marquardt GmbH
Publication of EP3281499A1 publication Critical patent/EP3281499A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/047—Details concerning mounting a relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB

Definitions

  • the invention relates to an electrical assembly according to the preamble of
  • Such an electrical assembly can be in a battery or a
  • Accumulator can be used, especially in such a battery in which large currents occur and / or arises in the heat energy.
  • a circuit board can be contacted to the poles of the battery, wherein the circuit board can serve as a carrier for a switching element.
  • Such an assembly is particularly suitable for use in a motor vehicle.
  • Such an electrical assembly comprises a printed circuit board and an electrical
  • Resistance element wherein the resistance element may be configured in particular in the manner of a shunt for current measurement.
  • the resistance element is in communication with the circuit board. Due to the flowing current, heat is generated at the resistance element during operation of the assembly, which in turn can lead to impairment of the assembly.
  • the invention has for its object to design the electrical assembly such that the heat generated can be largely dissipated.
  • the resistance element is arranged with electrical and / or mechanical connection to the printed circuit board on the printed circuit board and / or in the printed circuit board.
  • an approximately U-shaped adapter element for electrical and / or mechanical connection of the resistance element with the
  • the adapter element can be fastened by means of soldering, in particular SMD soldering, to a contact point of the printed circuit board.
  • soldering in particular SMD soldering
  • mechanical stresses for example those which arise due to the effect of heat, can be absorbed in a reliable manner by the U-shaped adapter element.
  • an approximately L-shaped adapter element for electrical and / or mechanical connection of the resistive element to the printed circuit board can be arranged between the resistor element and the printed circuit board.
  • the resistance element and / or the adapter element can be equipped in a simple manufacturing technology by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly on the printed circuit board in a functionally reliable manner, the adapter element by soldering to Any mechanical stresses which occur, for example those which arise as a result of the action of heat, can thereby be reliably absorbed by the L-shaped adapter element.
  • the printed circuit board may be a high-current printed circuit board.
  • a high-current circuit board with in the circuit board be embedded embedded massive copper elements to conduct a high current.
  • the large heat energy that otherwise occurs in such high-current circuit boards due to the high currents is dissipated in the assembly according to the invention in a safe and reliable manner, so that destruction of the assembly is effectively prevented.
  • the reliability of such, comprising a high-current circuit board assembly is considerably improved by means of the invention.
  • At least one heat sink may be arranged in thermally conductive connection to a conductor track and / or a contact point of the circuit board to the circuit board.
  • the heat sink can consist of a metal plate.
  • a typical shunt resistor has a value of about 300 ⁇ . so that a considerable power dissipation of for example
  • the idea of the invention is to dissipate the resulting heat energy well and / or reliably. This can best be achieved by mechanically integrating these resistors into the system without stress.
  • the shunt resistor can be equipped as an SMD (Surfache Mounted Device) component and accordingly more valid as well reliable processes are soldered to the circuit board.
  • the shunt resistor may be designed as well as THT (Through Hole Technology) device, however, be fitted in a "pin-in-paste * '-version as a SMD component and, accordingly, a valid and reliable processes are soldered to the printed circuit board.
  • THT Thine Technology
  • the alternative solution is to integrate this resistor directly into the PCB, which achieves best and most efficient thermal properties. These resistors can then be completely electrically isolated, whereby one for the arrangement of
  • Heat sinks has complete freedom. What is thus created is a high-resistance circuit board comprising a resistance element and / or a circuit board with improved thermal properties.
  • the manufacture of the PCB assembly can be done with standard processes.
  • the electrical connection technology has defined contact resistance
  • the thermal management can be implemented well and product-specifically.
  • FIG. 1 is an electrical assembly in side view and in plan view, 2 shows a detailed detail from FIG. 1 according to a first exemplary embodiment
  • FIG. 3 is a detail of FIG. 1 according to a second exemplary embodiment
  • Fig. 4 shows the electrical assembly in side view and in plan view in a further embodiment.
  • FIG. 1 shows an electrical subassembly 1 comprising a printed circuit board 2 and an electrical resistance element 3.
  • the electrical subassembly 1 comprising a printed circuit board 2 and an electrical resistance element 3.
  • Resistance element 3 provided in the manner of a shunt for current measurement.
  • Resistance element 3 is connected to the circuit board 2 in connection. Here it is
  • Resistance element 3 with electrical and / or mechanical connection to the printed circuit board 2 on the printed circuit board 2 and / or arranged integrated in the printed circuit board 2. Further, a component 6 is connected to the printed circuit board 2, wherein the component 6 is an electromechanical component, namely an electrical switching contact, for example in the manner of a relay.
  • an approximately U-shaped adapter element 4 for the electrical and / or mechanical connection of the resistance element 3 with the printed circuit board 2 is arranged between the resistance element 3 and the printed circuit board 2.
  • an adapter element 4 is arranged on both sides of the resistance element 3.
  • the resistance element 3 and / or the adapter element 4 can then be equipped by SMD (Surface Mounted Device) assembly on the printed circuit board 2.
  • SMD Surface Mounted Device
  • Adapter element 4 is attached to a pad 5 of the circuit board 2 by means of soldering, preferably SMD soldering.
  • soldering preferably SMD soldering.
  • the resistance element 3 is arranged with electrical and / or mechanical connection to the printed circuit board 2 in the printed circuit board 2 integrated.
  • an approximately L-shaped adapter element 4 ' is arranged between the resistance element 3 and the printed circuit board 2 for electrical and / or mechanical connection of the resistance element 3 to the printed circuit board 2, in each case on both sides of the resistance element 3.
  • Das Resistance element 3 and / or the adapter element 4 ' can be equipped on the printed circuit board 2 by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly. Subsequently, the adapter element 4 'by means of soldering at a contact point 5 of the circuit board 2 can be fastened.
  • the printed circuit board 2 may be a high-current printed circuit board.
  • solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 6 and the resistance element 3.
  • the heat flow 7 can, as can be seen in Fig. 1, at least in part on the circuit board 2 and from there for example via heat sink 8 in the manner of Wännesenken be derived.
  • the heat sink 8 consists for example of a metal plate.
  • the module 1 according to the invention can be used in the battery system of a motor vehicle.
  • the invention is not limited to the one described and illustrated
  • Embodiment limited. On the contrary, it also includes all experts

Abstract

The invention relates to an electrical subassembly (1) having a printed circuit board (2) and having an electrical resistor element (3), particularly in the style of a shunt for current measurement. The resistor element (3) is electrically and/or mechanically connected to the printed circuit board (2). The resistor element (3) and the printed circuit board (2) have an approximately U-shaped adapter element (4) arranged between them for electrically and/or mechanically connecting the resistor element (3) to the printed circuit board (2), wherein preferably the adapter element (4) is soldered to a contact point (5) on the printed circuit board (2) by means of SMD soldering. In another embodiment, the resistor element (3) is arranged in a manner integrated in the printed circuit board (2).

Description

Baugruppe  module
Die Erfindung betrifft eine elektrische Baugruppe nach dem Oberbegriff des The invention relates to an electrical assembly according to the preamble of
Patentanspruchs 1 oder 4. Patent claim 1 or 4.
Eine solche elektrische Baugruppe kann in einer Batterie beziehungsweise einem Such an electrical assembly can be in a battery or a
Akkumulator verwendet werden, insbesondere in einer solchen Batterie, in der große Ströme auftreten und/oder in der Wärmeenergie entsteht. Beispielsweise kann bei der Baugruppe in vorteilhafter Weise eine Leiterplatte an die Pole der Batterie kontaktiert werden, wobei die Leiterplatte als Träger für ein Schaltelement dienen kann. Eine solche Baugruppe eignet sich insbesondere zum Einsatz in einem Kraftfahrzeug. Accumulator can be used, especially in such a battery in which large currents occur and / or arises in the heat energy. For example, in the assembly advantageously a circuit board can be contacted to the poles of the battery, wherein the circuit board can serve as a carrier for a switching element. Such an assembly is particularly suitable for use in a motor vehicle.
Eine solche elektrische Baugruppe umfasst eine Leiterplatte und ein elektrisches Such an electrical assembly comprises a printed circuit board and an electrical
Widerstandselement, wobei das Widerstandselement insbesondere in der Art eines Shunts zur Strommessung ausgestaltet sein kann. Das Widerstandselement steht mit der Leiterplatte in Verbindung. Am Widerstandselement entsteht während des Betriebs der Baugruppe aufgrund des fließenden Stroms Wärme, die wiederum zur Beeinträchtigung der Baugruppe führen kann. Resistance element, wherein the resistance element may be configured in particular in the manner of a shunt for current measurement. The resistance element is in communication with the circuit board. Due to the flowing current, heat is generated at the resistance element during operation of the assembly, which in turn can lead to impairment of the assembly.
Der Erfindung liegt die Aufgabe zugrunde, die elektrische Baugruppe derart auszugestalten, dass die entstehende Wärme weitgehend abgeführt werden kann. The invention has for its object to design the electrical assembly such that the heat generated can be largely dissipated.
Diese Aufgabe wird bei einer gattungsgemäßen elektrischen Baugruppe durch die kennzeichnenden Merkmale des Anspruchs 1 oder 4 gelöst. Ί This object is achieved in a generic electrical assembly by the characterizing features of claim 1 or 4. Ί
Bei der erfindungsgemäßen elektrischen Baugruppe ist das Widerstandselement mit elektrischer und/oder mechanischer Verbindung zur Leiterplatte auf der Leiterplatte und/oder in die Leiterplatte integriert angeordnet. In vorteilhafter Weise wird die am In the electrical assembly according to the invention, the resistance element is arranged with electrical and / or mechanical connection to the printed circuit board on the printed circuit board and / or in the printed circuit board. Advantageously, the am
Widerstandselement entstehende Wärme auf die Leiterplatte übergeleitet, wobei die Wärme anschließend in einfacher sowie effizienter Weise von der Leiterplatte abführbar ist. Weitere Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche. Resistance element resulting heat transferred to the circuit board, wherein the heat is then dissipated in a simple and efficient manner of the circuit board. Further embodiments of the invention are the subject of the dependent claims.
In einer weiteren Ausgestaltung kann ein in etwa U-förmiges Adapterelement zur elektrischen und/oder mechanischen Verbindung des Widerstandselements mit der In a further embodiment, an approximately U-shaped adapter element for electrical and / or mechanical connection of the resistance element with the
Leiterplatte zwischen dem Widerstandselement und der Leiterplatte angeordnet sein. Das Widerstandselement und/oder das Adapterelement können in einfacher Printed circuit board between the resistor element and the circuit board to be arranged. The resistance element and / or the adapter element can be simpler
fertigungstechnischer Weise mittels S D(Surface Mounted Device)-Bestückung auf der Leiterplatte bestückbar sein. In funktionssicherer Art und Weise kann das Adapterelement mittels Löten, insbesondere SMD-Löten, an einer Kontaktstelle der Leiterplatte befestigbar sein. Gegebenenfalls auftretende mechanische Spannungen, beispielsweise solche die durch die Wärmeeinwirkung entstehen, können dabei in zuverlässiger Art und Weise von dem U- förmigen Adapterelement aufgenommen werden. production technology way by S D (Surface Mounted Device) assembly can be fitted on the circuit board. In a functionally reliable manner, the adapter element can be fastened by means of soldering, in particular SMD soldering, to a contact point of the printed circuit board. Optionally occurring mechanical stresses, for example those which arise due to the effect of heat, can be absorbed in a reliable manner by the U-shaped adapter element.
In einer anderen Ausgestaltung, und zwar in einer Art von ,,Pin-in-Paste"-Ausführung, kann ein in etwa L-förmiges Adapterelement zur elektrischen und/oder mechanischen Verbindung des Widerstandselements mit der Leiterplatte zwischen dem Widerstandselement und der Leiterplatte angeordnet sein. Das Widerstandselement und/oder das Adapterelement können in einfacher fertigungstechnischer Weise mittels THT(Through Hole Technology)- Bestückung und/oder SMD(Surface Mounted Device)-Bestückung auf der Leiterplatte bestückbar sein. In funktionssicherer Art und Weise kann das Adapterelement mittels Löten an einer Kontaktstelle der Leiterplatte befestigbar sein. Gegebenenfalls auftretende mechanische Spannungen, beispielsweise solche die durch die Wärmeeinwirkung entstehen, können dabei in zuverlässiger Art und Weise von dem L-förmigen Adapterelement aufgenommen werden. In another embodiment, in a kind of "pin-in-paste" design, an approximately L-shaped adapter element for electrical and / or mechanical connection of the resistive element to the printed circuit board can be arranged between the resistor element and the printed circuit board The resistance element and / or the adapter element can be equipped in a simple manufacturing technology by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly on the printed circuit board in a functionally reliable manner, the adapter element by soldering to Any mechanical stresses which occur, for example those which arise as a result of the action of heat, can thereby be reliably absorbed by the L-shaped adapter element.
Bei der Leiterplatte kann es sich in weiterer Ausgestaltung um eine Hochstromleiterplatte handeln. Beispielsweise kann eine solche Hochstromleiterplatte mit in die Leiterplatte eingebetteten massiven Kupferelementen zur Leitung eines hohen Stroms versehen sein. Gerade die ansonsten bei solchen Hochstromleiterplatten aufgrund der hohen Ströme auftretende große Wärmeenergie wird bei der erfindungsgemäßen Baugruppe in sicherer und zuverlässiger Weise abgeführt, so dass eine Zerstörung der Baugruppe wirksam verhindert ist. Die Funktionssicherheit einer solchen, eine Hochstromleiterplatte umfassenden Baugruppe ist mit Hilfe der Erfindung beträchtlich verbessert. In a further embodiment, the printed circuit board may be a high-current printed circuit board. For example, such a high-current circuit board with in the circuit board be embedded embedded massive copper elements to conduct a high current. Especially the large heat energy that otherwise occurs in such high-current circuit boards due to the high currents is dissipated in the assembly according to the invention in a safe and reliable manner, so that destruction of the assembly is effectively prevented. The reliability of such, comprising a high-current circuit board assembly is considerably improved by means of the invention.
Zur weiteren Steigerung der Effizienz für die Wärmeabfuhr von der erfindungsgemäßen Baugruppe kann wenigstens eine Wärmesenke in wärmeleitender Verbindung zu einer Leiterbahn und/oder einer Kontaktstelle der Leiterplatte an der Leiterplatte angeordnet sein. In zweckmäßiger und kostengünstiger Weise kann die Wärmesenke aus einer Metallplatte bestehen. To further increase the efficiency for the heat dissipation of the assembly according to the invention, at least one heat sink may be arranged in thermally conductive connection to a conductor track and / or a contact point of the circuit board to the circuit board. In an expedient and cost-effective manner, the heat sink can consist of a metal plate.
Für eine besonders bevorzugte Ausgestaltung der erfindungsgemäßen elektrischen For a particularly preferred embodiment of the electrical according to the invention
Baugruppe ist nachfolgendes festzustellen. Assembly is to be determined below.
In elektromechanischen Steuergeräten ergibt sich oft die Situation, dass elektrische Ströme gemessen werden müssen. In elektrischen Anlagen fließen dann große elektrische Ströme, beispielsweise von bis zu 1 .000 A. Diese Ströme verursachen bereits bei sehr geringen elektrischen Widerständen deutliche Verlustleistungen. Ein typischer Shunt- Widerstand hat einen Wert von ca. 300 μθΐιτη. so dass eine beträchtliche Verlustleistung von beispielsweiseIn electromechanical control devices, the situation often arises that electrical currents must be measured. In electrical systems then flow large electrical currents, for example, up to 1, 000 A. These currents cause even at very low electrical resistance significant power losses. A typical shunt resistor has a value of about 300 μθΐιτη. so that a considerable power dissipation of for example
I2 * R =1.0002 A * 300 μθΐιηι = 300 W I 2 * R = 1.000 2 A * 300 μθΐιηι = 300 W
entsteht. Deshalb ist es wichtig, dass diese Widerstände in ein gutes Wärmemanagement integriert sind. arises. Therefore, it is important that these resistors are integrated into a good thermal management.
Die erfindungsgemäße Idee besteht darin, die entstehende Wärmeenergie gut und/oder zuverlässig abzuleiten. Dies kann man am besten erreichen, wenn man diese Widerstände mechanisch spannungsfrei in das System integriert. The idea of the invention is to dissipate the resulting heat energy well and / or reliably. This can best be achieved by mechanically integrating these resistors into the system without stress.
Es gibt zum einen die Möglichkeit, die Widerstände mit herkömmlichen Prozessen auf eine Hochstromleiterplatte zu platzieren und zu befestigen. Der Shunt-Widerstand kann als SMD(Surfache Mounted Device)-Bauteil bestückt und entsprechend gültiger sowie zuverlässiger Prozesse auf die Leiterplatte gelötet werden. Der Shunt-Widerstand kann ebenso als THT(Through Hole Technology)-Bauteil ausgestaltet sein, jedoch in einer„Pin- in-Paste*'-Ausführung wie ein SMD-Bauteil bestückt werden und entsprechend gültiger sowie zuverlässiger Prozesse auf die Leiterplatte gelötet werden. Die alternative Lösung dazu ist zum anderen, diesen Widerstand direkt in die Leiterplatte zu integrieren, wodurch man beste und leistungsfähige thermische Eigenschaften erzielt. Diese Widerstände kann man dann vollständig elektrisch isolieren, wodurch man für die Anordnung von On the one hand, there is the possibility of placing the resistors on a high-current printed circuit board using conventional processes. The shunt resistor can be equipped as an SMD (Surfache Mounted Device) component and accordingly more valid as well reliable processes are soldered to the circuit board. The shunt resistor may be designed as well as THT (Through Hole Technology) device, however, be fitted in a "pin-in-paste * '-version as a SMD component and, accordingly, a valid and reliable processes are soldered to the printed circuit board. The alternative solution, on the other hand, is to integrate this resistor directly into the PCB, which achieves best and most efficient thermal properties. These resistors can then be completely electrically isolated, whereby one for the arrangement of
Wärmesenken vollständige Freiheiten hat. Geschaffen ist somit eine ein Widerstandselement umfassende Hochstromleiterplatte und/oder Leiterplatte mit verbesserten thermischen Eigenschaften. Heat sinks has complete freedom. What is thus created is a high-resistance circuit board comprising a resistance element and / or a circuit board with improved thermal properties.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere in Folgendem: The advantages achieved by the invention are in particular in the following:
- Es wirken keine durch die Wärmeenergie erzeugten mechanischen Kräfte auf den Shunt-Widerstand.  - There are no mechanical forces generated by the heat energy on the shunt resistor.
Die Herstellung der Leiterplattenbaugruppe kann mit Standardprozessen erfolgen. The manufacture of the PCB assembly can be done with standard processes.
- Es ist eine gute elektrische Anbindung gegeben. - There is a good electrical connection.
- Die elektrische Verbindungstechnik hat definierte Übergangswiderstände, die  - The electrical connection technology has defined contact resistance, the
prozesssicher über die vollständige Produktlaufzeit sind.  reliable over the entire product life.
Es ist eine gute thermische Anbindung mit der SMD(Surface Mounted Device)- und/oder der THT(Through Hole Technology)-Lösung gegeben.  There is a good thermal connection with the SMD (Surface Mounted Device) and / or the THT (Through Hole Technology) solution given.
Es ist eine sehr gute thermische Anbindung bei der Shunt-Integration in die  There is a very good thermal connection in the shunt integration in the
Leiterplatte gegeben.  Printed circuit board given.
Das thermische Management kann gut und produktspezifisch umgesetzt werden. The thermal management can be implemented well and product-specifically.
- Es ist eine beständige Verbindungstechnik geschaffen. - It is created a durable connection technology.
Es bestehen gute Überwachungsmöglichkeiten in der Fertigung der Baugruppe.  There are good monitoring options in the production of the module.
Ausführungsbeispiele der Erfindung mit verschiedenen Weiterbildungen und Embodiments of the invention with various developments and
Ausgestaltungen sind in den Zeichnungen dargestellt und werden im folgenden näher beschrieben. Es zeigen Embodiments are illustrated in the drawings and will be described in more detail below. Show it
Fig. 1 eine elektrische Baugruppe in Seitenansicht sowie in Draufsicht, Fig. 2 einen Detailausschnitt aus Fig. 1 gemäß einem ersten Ausführungsbeispiel, 1 is an electrical assembly in side view and in plan view, 2 shows a detailed detail from FIG. 1 according to a first exemplary embodiment,
Fig. 3 einen Detailausschnitt aus Fig. 1 gemäß einem zweiten Ausfuhrungsbeispiel und Fig. 3 is a detail of FIG. 1 according to a second exemplary embodiment and
Fig. 4 die elektrische Baugruppe in Seitenansicht sowie in Draufsicht bei einer weiteren Ausführung. Fig. 4 shows the electrical assembly in side view and in plan view in a further embodiment.
In Fig. 1 ist eine elektrische Baugruppe 1 zu sehen, die eine Leiterplatte 2 und ein elektrisches Widerstandselement 3 umfasst. Insbesondere ist das elektrische FIG. 1 shows an electrical subassembly 1 comprising a printed circuit board 2 and an electrical resistance element 3. In particular, the electrical
Widerstandselement 3 in der Art eines Shunts zur Strommessung vorgesehen. Das Resistance element 3 provided in the manner of a shunt for current measurement. The
Widerstandselement 3 steht mit der Leiterplatte 2 in Verbindung. Hierbei ist das Resistance element 3 is connected to the circuit board 2 in connection. Here it is
Widerstandselement 3 mit elektrischer und/oder mechanischer Verbindung zur Leiterplatte 2 auf der Leiterplatte 2 und/oder integriert in die Leiterplatte 2 angeordnet. Weiter steht ein Bauelement 6 mit der Leiterplatte 2 in Verbindung, wobei es sich bei dem Bauelement 6 um ein elektromechanisches Bauelement, und zwar um einen elektrischen Schaltkontakt, beispielsweise in der Art eines Relais handelt. Resistance element 3 with electrical and / or mechanical connection to the printed circuit board 2 on the printed circuit board 2 and / or arranged integrated in the printed circuit board 2. Further, a component 6 is connected to the printed circuit board 2, wherein the component 6 is an electromechanical component, namely an electrical switching contact, for example in the manner of a relay.
In einer ersten Ausführung gemäß Fig. 2 ist ein in etwa U-förmiges Adapterelement 4 zur elektrischen und/oder mechanischen Verbindung des Widerstandselements 3 mit der Leiterplatte 2 zwischen dem Widerstandselement 3 und der Leiterplatte 2 angeordnet. In a first embodiment according to FIG. 2, an approximately U-shaped adapter element 4 for the electrical and / or mechanical connection of the resistance element 3 with the printed circuit board 2 is arranged between the resistance element 3 and the printed circuit board 2.
Vorliegend ist jeweils ein Adapterelement 4 beidseitig am Widerstandselement 3 angeordnet. Das Widerstandselement 3 und/oder das Adapterelement 4 ist dann mittels SMD(Surface Mounted Device)-Bestückung auf der Leiterplatte 2 bestückbar. Das In the present case, in each case an adapter element 4 is arranged on both sides of the resistance element 3. The resistance element 3 and / or the adapter element 4 can then be equipped by SMD (Surface Mounted Device) assembly on the printed circuit board 2. The
Adapterelement 4 ist mittels Löten, und zwar bevorzugterweise SMD-Löten, an einer Kontaktstelle 5 der Leiterplatte 2 befestigt. In einer zweiten Ausführung gemäß Fig. 3 ist das Widerstandselement 3 mit elektrischer und/oder mechanischer Verbindung zur Leiterplatte 2 in die Leiterplatte 2 integriert angeordnet. Adapter element 4 is attached to a pad 5 of the circuit board 2 by means of soldering, preferably SMD soldering. In a second embodiment according to FIG. 3, the resistance element 3 is arranged with electrical and / or mechanical connection to the printed circuit board 2 in the printed circuit board 2 integrated.
Eine nochmals weitere Ausführung ist in Fig. 4 zu sehen. Hier ist zur elektrischen und/oder mechanischen Verbindung des Widerstandselements 3 mit der Leiterplatte 2 ein in etwa L- förmiges Adapterelement 4' zwischen dem Widerstandselement 3 und der Leiterplatte 2 angeordnet, und zwar jeweils beidseitig am Widerstandselement 3. Das Widerstandselement 3 und/oder das Adapterelement 4' ist mittels THT(Through Hole Technology)-Bestückung und/oder SMD(Surface Mounted Device)-Bestückung auf der Leiterplatte 2 bestückbar. Anschließend ist das Adapterelement 4' mittels Löten an einer Kontaktstelle 5 der Leiterplatte 2 befestigbar. Yet another embodiment can be seen in Fig. 4. Here, an approximately L-shaped adapter element 4 'is arranged between the resistance element 3 and the printed circuit board 2 for electrical and / or mechanical connection of the resistance element 3 to the printed circuit board 2, in each case on both sides of the resistance element 3. Das Resistance element 3 and / or the adapter element 4 'can be equipped on the printed circuit board 2 by means of THT (Through Hole Technology) assembly and / or SMD (Surface Mounted Device) assembly. Subsequently, the adapter element 4 'by means of soldering at a contact point 5 of the circuit board 2 can be fastened.
Bei der Leiterplatte 2 kann es sich um eine Hochstromleiterplatte handeln. Hierfür können in die Leiterplatte 2 massive Kupferelemente zur Leitung eines hohen Stroms eingebettet sein. Aufgrund des hohen fließenden Stroms entsteht eine gewisse Wärme im Schaltkontakt 6 sowie im Widerstandselement 3. Der Wärmefluss 7 kann, wie in Fig. 1 zu sehen ist, zumindest zum Teil auf die Leiterplatte 2 und von dort beispielsweise über Kühlkörper 8 in der Art von Wännesenken abgeleitet werden. Hierfür ist wenigstens eine Wärmesenke 8 in wärmeleitender Verbindung zu einer Leiterbahn und/oder einer Kontaktstelle 5 der The printed circuit board 2 may be a high-current printed circuit board. For this purpose, solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 6 and the resistance element 3. The heat flow 7 can, as can be seen in Fig. 1, at least in part on the circuit board 2 and from there for example via heat sink 8 in the manner of Wännesenken be derived. For this purpose, at least one heat sink 8 in thermally conductive connection to a conductor track and / or a contact point 5 of
Leiterplatte 2 an der Leiterplatte 2 angeordnet. Die Wärmesenke 8 besteht beispielsweise aus einer Metallplatte. Printed circuit board 2 is arranged on the printed circuit board 2. The heat sink 8 consists for example of a metal plate.
Die erfindungsgemäße Baugruppe 1 kann im Batteriesystem eines Kraftfahrzeugs eingesetzt werden. Die Erfindung ist jedoch nicht auf das beschriebene und dargestellte The module 1 according to the invention can be used in the battery system of a motor vehicle. However, the invention is not limited to the one described and illustrated
Ausführungsbeispiel beschränkt. Sie umfasst vielmehr auch alle fachmännischen Embodiment limited. On the contrary, it also includes all experts
Weiterbildungen im Rahmen der durch die Patentansprüche definierten Erfindung. So kann die erfmdungsgemäße Baugruppe 1 auch in Hausgeräten, Audiogeräten, Videogeräten, Telekommunikationsgeräten o. dgl. Verwendung finden. Further developments within the scope of the invention defined by the claims. Thus, the erfmdungsgemäße module 1 in home appliances, audio equipment, video equipment, telecommunications equipment o. The like. Be used.
Bezugszeichen-Liste: : (elektrische) BaugruppeReference Number List:: (electrical) assembly
: Leiterplatte: Circuit board
: (elektrisches) Widerstandselement: Adapterelement (U-förmig) ': Adapterelement (L-förmig): Kontaktstelle: (electrical) resistive element: Adapter element (U-shaped) ': Adapter element (L-shaped): contact point
: Bauelement / Schaltkontakt: Wärmefl uss: Component / switching contact: heat flux
: Wärmesenke / Kühlkörper : Heat sink / heat sink

Claims

P a t e n t a n s p r ü c h e : Patent claim:
1 . Elektrische Baugruppe umfassend eine Leiterplatte (2) und ein elektrisches 1 . Electrical assembly comprising a printed circuit board (2) and an electrical
Widerstandselement (3), insbesondere in der Art eines Shunts zur Strommessung, wobei das Widerstandselement (3) mit der Leiterplatte (2) in Verbindung steht, dadurch Resistance element (3), in particular in the form of a shunt for current measurement, wherein the resistance element (3) with the circuit board (2) is in communication, characterized
gekennzeichnet, dass das Widerstandselement (3) mit elektrischer und/oder mechanischer Verbindung zur Leiterplatte (2) auf der Leiterplatte (2) angeordnet ist. in that the resistance element (3) is arranged with electrical and / or mechanical connection to the printed circuit board (2) on the printed circuit board (2).
2. Elektrische Baugruppe nach Anspruch 1 , dadurch gekennzeichnet, dass ein in etwa U-förmiges Adapterelement (4) zur elektrischen und/oder mechanischen Verbindung des Widerstandselements (3) mit der Leiterplatte (2) zwischen dem Widerstandselement (3) und der Leiterplatte (2) angeordnet ist. dass vorzugsweise das Widerstandselement (3) und/oder das Adapterelement (4) mittels SMD(Surface Mounted Device)-Bestückung auf der Leiterplatte (2) bestückbar ist. und dass weiter vorzugsweise das Adapterelement (4) mittels Löten, insbesondere SMD-Löten, an einer Kontaktstelle (5) der Leiterplatte (2) befestigbar ist. 2. Electrical assembly according to claim 1, characterized in that an approximately U-shaped adapter element (4) for electrical and / or mechanical connection of the resistance element (3) with the circuit board (2) between the resistance element (3) and the circuit board ( 2) is arranged. in that preferably the resistance element (3) and / or the adapter element (4) can be equipped on the printed circuit board (2) by means of SMD (Surface Mounted Device) assembly. and that further preferably, the adapter element (4) by means of soldering, in particular SMD soldering, at a contact point (5) of the circuit board (2) can be fastened.
3. Elektrische Baugruppe nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass ein in etwa L-förmiges Adapterelement (4') zur elektrischen und/oder mechanischen Verbindung des Widerstandselements (3) mit der Leiterplatte (2) zwischen dem Widerstandselement (3) und der Leiterplatte (2) angeordnet ist. dass vorzugsweise das Widerstandselement (3) und/oder das Adapterelement (4') mittels THT(Through Hole TechnoIogy)-Bestückung und/oder SMD(Surface Mounted Device)-Bestückung auf der Leiterplatte (2) bestückbar ist. und dass weiter vorzugsweise das Adapterelement (4') mittels Löten an einer Kontaktstelle (5) der Leiterplatte (2) befestigbar ist. 3. Electrical assembly according to claim 1 or 2, characterized in that an approximately L-shaped adapter element (4 ') for electrical and / or mechanical connection of the resistance element (3) with the circuit board (2) between the resistance element (3) and the circuit board (2) is arranged. in that preferably the resistance element (3) and / or the adapter element (4 ') can be equipped on the printed circuit board (2) by means of THT (Through Hole TechnoIogy) assembly and / or SMD (Surface Mounted Device) assembly. and that further preferably, the adapter element (4 ') by means of soldering at a contact point (5) of the printed circuit board (2) can be fastened.
4. Elektrische Baugruppe umfassend eine Leiterplatte (2) und ein elektrisches 4. Electrical assembly comprising a printed circuit board (2) and an electrical
Widerstandselement (3), insbesondere in der Art eines Shunts zur Strommessung, wobei das Widerstandselement (3) mit der Leiterplatte (2) in Verbindung steht, dadurch Resistance element (3), in particular in the form of a shunt for current measurement, wherein the resistance element (3) with the circuit board (2) is in communication, characterized
gekennzeichnet, dass das Widerstandselement (3) mit elektrischer und/oder mechanischer Verbindung zur Leiterplatte (2) in die Leiterplatte (2) integriert angeordnet ist. characterized in that the resistance element (3) with electrical and / or mechanical connection to the printed circuit board (2) in the printed circuit board (2) is arranged integrated.
5. Elektrische Baugruppe nach einem der Ansprüche 1 bis 4. dadurch gekennzeichnet, dass es sich bei der Leiterplatte (2) um eine Hochstromleiterplatte, insbesondere mit in die Leiterplatte (2) eingebetteten massiven Kupferelementen zur Leitung eines hohen Stroms, handelt. 5. Electrical assembly according to one of claims 1 to 4, characterized in that it is in the circuit board (2) to a high-current circuit board, in particular with in the printed circuit board (2) embedded solid copper elements for conducting a high current, is.
6. Elektrische Baugruppe nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass wenigstens eine Wärmesenke (8) in wänneleitender Verbindung zu einer Leiterbahn und/oder einer Kontaktstelle (5) der Leiterplatte (2) an der Leiterplatte (2) angeordnet ist, und dass vorzugsweise die Wärmesenke (8) aus einer Metallplatte besteht. 6. Electrical assembly according to one of claims 1 to 5, characterized in that at least one heat sink (8) in wänneleitender connection to a conductor track and / or a contact point (5) of the printed circuit board (2) on the printed circuit board (2) is arranged and that preferably the heat sink (8) consists of a metal plate.
EP16715516.7A 2015-04-10 2016-04-08 Subassembly Withdrawn EP3281499A1 (en)

Applications Claiming Priority (3)

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DE102015004375 2015-04-10
DE102015004377 2015-04-10
PCT/EP2016/057704 WO2016162460A1 (en) 2015-04-10 2016-04-08 Subassembly

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EP3281499A1 true EP3281499A1 (en) 2018-02-14

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EP16715516.7A Withdrawn EP3281499A1 (en) 2015-04-10 2016-04-08 Subassembly
EP16714938.4A Withdrawn EP3281497A1 (en) 2015-04-10 2016-04-08 Assembly comprising printed circuit board and electric component

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DE102017208147B4 (en) 2017-05-15 2021-12-30 Schweizer Electronic Ag Electronic component and circuit board with this electronic component

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FR2351513A1 (en) * 1976-05-13 1977-12-09 Cit Alcatel ELECTRICAL COMPONENT SUPPORT PLATE
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DE102006001188A1 (en) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Arrangement for cooling power components on printed circuit boards and method for producing the same
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US9140735B2 (en) * 2013-05-03 2015-09-22 Infineon Technologies Ag Integration of current measurement in wiring structure of an electronic circuit

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WO2016162460A1 (en) 2016-10-13
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EP3281497A1 (en) 2018-02-14
WO2016162459A1 (en) 2016-10-13

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