EP3281497A1 - Assembly comprising printed circuit board and electric component - Google Patents

Assembly comprising printed circuit board and electric component

Info

Publication number
EP3281497A1
EP3281497A1 EP16714938.4A EP16714938A EP3281497A1 EP 3281497 A1 EP3281497 A1 EP 3281497A1 EP 16714938 A EP16714938 A EP 16714938A EP 3281497 A1 EP3281497 A1 EP 3281497A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
web
component
electrical
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16714938.4A
Other languages
German (de)
French (fr)
Inventor
Andreas HAMMA
Günther Ebner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marquardt GmbH
Original Assignee
Marquardt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt GmbH filed Critical Marquardt GmbH
Publication of EP3281497A1 publication Critical patent/EP3281497A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/02—Bases; Casings; Covers
    • H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
    • H01H50/047—Details concerning mounting a relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10053—Switch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB

Definitions

  • the invention relates to an electrical assembly according to the preamble of
  • Such an electrical assembly can be in a battery or a
  • Accumulator can be used, especially in such a battery in which large currents are to be switched.
  • a circuit board can be contacted to the poles of the battery, wherein the circuit board serves as a carrier for a switching element.
  • the module is particularly suitable for use in a motor vehicle.
  • Such an electrical subassembly comprises a printed circuit board and a component, wherein the component is in electrical and / or mechanical connection with connection points located on and / or in the printed circuit board.
  • the component may be an electromechanical component such as an electrical switch contact, an electrical switch, a relay or the like. At the joints mechanical stresses can occur, which in turn can lead to impairment of the assembly.
  • the invention has for its object to design the connection point such that the mechanical stresses are reduced at the junction.
  • connection point has at least one recess located in the printed circuit board.
  • the connection point further comprises at least one web, wherein the connection point is formed by means of the web to the circuit board.
  • the connection point is deformable in at least one spatial direction.
  • the connection point can be elastically deformable. This makes it possible for forces acting between the printed circuit board and the component to be absorbed by the connection point. Such forces may arise due to tolerances and / or tolerance levels of the printed circuit board and the component, due to voltages due to heating in the printed circuit board and / or the component o. Since these forces are absorbed in the joint itself, the otherwise existing risk of impairment of the electrical and / or mechanical
  • the web can be formed in a straight line, such that the connection point is approximately perpendicular to the circuit board, ie in the z-direction, deformable.
  • the web can be formed spirally, so that the connection point is approximately perpendicular and approximately parallel to the circuit board, ie in the x and / or y direction and / or in the z direction, deformable.
  • connection point with the component can be screwed, riveted, welded, soldered o.
  • the printed circuit board may be a high current printed circuit board.
  • a high-current circuit board may be provided with solid copper elements embedded in the circuit board for conducting a high current.
  • Such a high-current circuit board may be provided with solid copper elements embedded in the circuit board for conducting a high current.
  • connection point may have a base area for fastening the component.
  • the base can be attached as an electrical contact point to an electrical connection of the device (3).
  • the attachment can be done in particular by means of a screw.
  • the bridge can go off in a simple way from the base to the circuit board.
  • Conductor be provided on the circuit board.
  • the recess by punching, milling, drilling o. The like. Be introduced into the circuit board.
  • the web can be dimensioned such that heat from the component via the web can be dissipated.
  • the web can be dimensioned such that the web interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board and the component electrical current in the manner of a fuse.
  • electromechanical switching elements are to be electrically connected to a central combination board. These compounds cause mechanical forces in the X, Y and / or Z directions. These forces in turn cause mechanical stresses that are different for each manufactured part. These mechanical stresses in turn cause these forces to act statically on all the components involved. This permanent stress can then lead to the destruction of the entire assembly.
  • the idea according to the invention for solving this problem is to relax the tolerance layers in a compatible manner. For all other solutions, residual power would affect the components involved. With the solution according to the invention you can
  • electromechanical assemblies consisting for example of relays and printed circuit board, connected to each other. Because of the manufacturing parameters, each one has
  • the degrees of freedom can be achieved in a straight and / or in a spiral execution. In the straight version, however, the degree of freedom is essentially present only in the Z direction. In the spiral version you have the degrees of freedom in the directions X, Y, and Z.
  • the straight and / or spiral connecting webs are designed so that the
  • Connecting webs are designed so that the heat can be optimally dissipated via the webs.
  • the straight and / or spiral connecting webs are designed so that the webs can also fulfill the function of electrical fuses. If an electric current flows permanently above the permissible current limit and all other safety measures are not effective, for example in the event of an accident, these bars fulfill the function of a fuse.
  • the required recesses can be milled and / or produced by stamping technology cost, ie. All recesses are made with one punch in one step.
  • the printed circuit board and the electromechanical module can be connected directly to each other.
  • the connecting webs can take over fuse tasks.
  • Fig. 1 is an electrical assembly in side view and in plan view
  • Fig. 2 is a detail of FIG. 1 according to a first embodiment
  • Fig. 3 is a detail of FIG. 1 according to a second embodiment.
  • FIG. 1 an electrical assembly 1 can be seen, a printed circuit board 2 and a
  • Component 3 comprises.
  • the component 3 is an electromechanical component, namely an electrical switching contact.
  • the electrical switching contact for example, part of an electrical switch, a relay o. The like. Be.
  • the Component 3 is connected to and / or located in the circuit board 2 connection points 4 in electrical and / or mechanical connection.
  • the connection point 4 has at least one recess 5 located in the printed circuit board 2.
  • connection point 4 is integrally formed by means of the web 6 to the circuit board 2.
  • the connection point 4 is deformable in at least one spatial direction.
  • connection point 4 is approximately perpendicular and approximately parallel to the printed circuit board 2, so in the x, y and z direction, deformable. However, it may also be sufficient if the connection point 4 is deformable only in one spatial direction.
  • the web 6 is formed in a straight line. As a result, the connection point 4 is approximately perpendicular to the printed circuit board 2, ie in the z-direction, deformable.
  • connection point 4 is a screw 7 for screwing the connection point 4 with the switching contact 3.
  • a screw connection point 4 can also be riveted to the component 3, welded, soldered o. The like be designed.
  • connection point 4 has a base surface 8 for fastening the component 3.
  • the fastening takes place in that the
  • Base 8 as electrical contact point on an electrical connection 1 1 of the
  • Component 3 is fixed by means of the screw 7.
  • the webs 6 go from the base 8 to the circuit board 2 from. Furthermore, an electrical connection from the base 8 via the web 6 to a not shown, associated conductor to the circuit board 2 is provided.
  • the recesses 5 are by means of stamping, milling, drilling o. The like.
  • the printed circuit board 2 may be a high-current printed circuit board.
  • solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 3.
  • the heat flow 9 can at least partially via the junction 4 on the
  • the web 6 is dimensioned such that the heat from the component 3 via the web 6 can be discharged.
  • the web 6 may be dimensioned such that the web 6 interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board 2 and the component 3 electrical current in the manner of a fuse.
  • connection point 4 according to the invention can be used in an assembly for the battery system of a motor vehicle.
  • the invention is not limited to the described and illustrated embodiment. Rather, it also encompasses all expert developments within the scope of the invention defined by the claims.
  • the junction 4 according to the invention can also be used in assemblies for household appliances, audio devices, video devices, telecommunication devices or the like.

Abstract

The invention relates to an electric assembly (1) comprising a printed circuit board (2) and a component (3). In particular, the component (3) can be an electromechanical component, such as an electric switch contact, an electric switch, a relay, or the like. The component (3) is electrically and/or mechanically connected to connection points (4) which can be found on and/or in the printed circuit board (2). The connection point (4) has at least one recess (5) in the printed circuit board (2) and is integrally formed on the printed circuit board (2) by means of at least one web (6) such that the connection point (4) can be deformed in at least one spatial direction.

Description

Baugruppe  module
Die Erfindung betrifft eine elektrische Baugruppe nach dem Oberbegriff des The invention relates to an electrical assembly according to the preamble of
Patentanspruchs 1. Patent claim 1.
Eine solche elektrische Baugruppe kann in einer Batterie beziehungsweise einem Such an electrical assembly can be in a battery or a
Akkumulator verwendet werden, insbesondere in einer solchen Batterie, in der große Ströme zu schalten sind. Beispielsweise kann bei der Baugruppe in vorteilhafter Weise eine Leiterplatte an die Pole der Batterie kontaktiert werden, wobei die Leiterplatte als Träger für ein Schaltelement dient. Die Baugruppe eignet sich insbesondere zum Einsatz in einem Kraftf ahrzeug. Accumulator can be used, especially in such a battery in which large currents are to be switched. For example, in the assembly advantageously a circuit board can be contacted to the poles of the battery, wherein the circuit board serves as a carrier for a switching element. The module is particularly suitable for use in a motor vehicle.
Eine solche elektrische Baugruppe umfasst eine Leiterplatte und ein Bauelement, wobei das Bauelement mit an und/oder in der Leiterplatte befindlichen Verbindungsstellen in elektrischer und/oder mechanischer Verbindung steht. Insbesondere kann es sich bei dem Bauelement um ein elektromechanisches Bauelement, wie einen elektrischen Schaltkontakt, einen elektrischen Schalter, ein Relais o. dgl., handeln. An den Verbindungsstellen können mechanische Spannungen auftreten, die wiederum zur Beeinträchtigung der Baugruppe führen können. Such an electrical subassembly comprises a printed circuit board and a component, wherein the component is in electrical and / or mechanical connection with connection points located on and / or in the printed circuit board. In particular, the component may be an electromechanical component such as an electrical switch contact, an electrical switch, a relay or the like. At the joints mechanical stresses can occur, which in turn can lead to impairment of the assembly.
Der Erfindung liegt die Aufgabe zugrunde, die Verbindungsstelle derart auszugestalten, dass die mechanischen Spannungen an der Verbindungsstelle verringert sind. The invention has for its object to design the connection point such that the mechanical stresses are reduced at the junction.
Diese Aufgabe wird bei einer gattungsgemäßen elektrischen Baugruppe durch die kennzeichnenden Merkmale des Anspruchs 1 gelöst. Bei der erfindungsgemäßen elektrischen Baugruppe weist die Verbindungsstelle wenigstens eine in der Leiterplatte befindliche Aussparung auf. Die Verbindungsstelle weist weiter wenigstens einen Steg auf, wobei die Verbindungsstelle mittels des Stegs an die Leiterplatte angeformt ist. Und zwar derart, dass die Verbindungsstelle in wenigstens eine Raumrichtung verformbar ist. Insbesondere kann die Verbindungsstelle elastisch verformbar sein. Dadurch ist ermöglicht, dass zwischen der Leiterplatte und dem Bauelement wirkende Kräfte von der Verbindungsstelle aufgenommen werden. Solche Kräfte können aufgrund von Toleranzen und/oder Toleranzlagen der Leiterplatte sowie dem Bauelement, durch Spannungen aufgrund von Erwärmung in der Leiterplatte und/oder dem Bauelement o. dgl. entstehen. Da diese Kräfte in der Verbindungsstelle selbst aufgenommen werden, ist die ansonsten bestehende Gefahr einer Beeinträchtigung der elektrischen und/oder mechanischen This object is achieved in a generic electrical assembly by the characterizing features of claim 1. In the electrical assembly according to the invention, the connection point has at least one recess located in the printed circuit board. The connection point further comprises at least one web, wherein the connection point is formed by means of the web to the circuit board. In such a way that the connection point is deformable in at least one spatial direction. In particular, the connection point can be elastically deformable. This makes it possible for forces acting between the printed circuit board and the component to be absorbed by the connection point. Such forces may arise due to tolerances and / or tolerance levels of the printed circuit board and the component, due to voltages due to heating in the printed circuit board and / or the component o. Since these forces are absorbed in the joint itself, the otherwise existing risk of impairment of the electrical and / or mechanical
Verbindung zwischen der Leiterplatte und dem Bauelement zumindest verringert. Weitere Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche. Connection between the circuit board and the component at least reduced. Further embodiments of the invention are the subject of the dependent claims.
In weiterer Ausgestaltung kann der Steg geradlinig ausgebildet sein, derart dass die Verbindungsstelle in etwa senkrecht zur Leiterplatte, also in z-Richtung, verformbar ist. In einer anderen Ausgestaltung kann der Steg spiralförmig ausgebildet sein, derart dass die Verbindungsstelle in etwa senkrecht sowie in etwa parallel zur Leiterplatte, also in x- und/oder y-Richtung und/oder in z-Richtung, verformbar ist. Dadurch sind Freiheitsgrade in die entsprechenden Raumrichtungen für die Verbindungsstelle geschaffen, womit ein Toleranzausgleich zur Vermeidung von Spannungen zwischen der Leiterplatte und dem Bauelement bewirkt ist. In a further embodiment, the web can be formed in a straight line, such that the connection point is approximately perpendicular to the circuit board, ie in the z-direction, deformable. In another embodiment, the web can be formed spirally, so that the connection point is approximately perpendicular and approximately parallel to the circuit board, ie in the x and / or y direction and / or in the z direction, deformable. As a result, degrees of freedom are created in the corresponding spatial directions for the connection point, whereby a tolerance compensation for avoiding tensions between the circuit board and the component is effected.
In weiterer Ausgestaltung kann die Verbindungsstelle mit dem Bauelement verschraubbar, vernietbar, verschweißbar, verlötbar o. dgl. ausgebildet sein. Dadurch ist eine In a further embodiment, the connection point with the component can be screwed, riveted, welded, soldered o. The like. Be formed. This is one
fertigungstechnisch einfache Verbindung geschaffen. production-technically simple connection created.
Bei der Leiterplatte kann es sich um eine Hochstromleiterplatte handeln. Beispielsweise kann eine solche Hochstromleiterplatte mit in die Leiterplatte eingebetteten massiven Kupferelementen zur Leitung eines hohen Stroms versehen sein. Gerade die ansonsten bei solchen Hochstromleiterplatten aufgrund der hohen Ströme auftretenden großen Wärmespannungen werden bei der erfmdungsgemäßen Baugruppe beträchtlich verringert, so dass eine Zerstörung der Baugruppe wirksam verhindert ist. Die Funktionssicherheit einer solchen, eine Hochstromleiterplatte umfassende Baugruppe ist mit Hilfe der Erfindung beträchtlich verbessert. The printed circuit board may be a high current printed circuit board. For example, such a high-current circuit board may be provided with solid copper elements embedded in the circuit board for conducting a high current. Just the otherwise occurring in such high current circuit boards due to the high currents large Thermal stresses are considerably reduced in the inventive assembly, so that destruction of the assembly is effectively prevented. The reliability of such, comprising a high-current circuit board assembly is considerably improved by means of the invention.
In einfacher Gestaltung kann es sich anbieten, dass die Verbindungsstelle eine Grundfläche zur Befestigung des Bauelements aufweist. Zweckmäßigerweise kann die Grundfläche als elektrische Kontaktstelle an einem elektrischen Anschluss des Bauelements (3) befestigt sein. Die Befestigung kann insbesondere mittels einer Schraube erfolgen. Der Steg kann in einfacher Art von der Grundfläche zur Leiterplatte abgehen. Zweckmäßigerweise kann eine elektrische Verbindung von der Grundfläche über den Steg zu einer zugeordneten In a simple design, it may be advantageous for the connection point to have a base area for fastening the component. Conveniently, the base can be attached as an electrical contact point to an electrical connection of the device (3). The attachment can be done in particular by means of a screw. The bridge can go off in a simple way from the base to the circuit board. Conveniently, an electrical connection from the base via the web to an associated
Leiterbahn an der Leiterplatte vorgesehen sein. In fertigungstechnisch einfacher Art und Weise kann die Aussparung mittels Stanzen, Fräsen, Bohren o. dgl. in die Leiterplatte eingebracht sein. Conductor be provided on the circuit board. In manufacturing technology simple way, the recess by punching, milling, drilling o. The like. Be introduced into the circuit board.
Zwecks weiterer Steigerung der Funktionssicherheit für die Baugruppe kann der Steg derart dimensioniert sein, dass Wärme vom Bauelement über den Steg abführbar ist. Ebenso kann in vorteilhafter Weise der Steg derart dimensioniert sein, dass der Steg bei Überschreiten eines vorgesehenen Grenzwertes für den zwischen der Leiterplatte und dem Bauelement fließenden elektrischen Strom in der Art einer Schmelzsicherung den Stromfluss unterbricht. To further increase the reliability of the assembly of the web can be dimensioned such that heat from the component via the web can be dissipated. Likewise, advantageously, the web can be dimensioned such that the web interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board and the component electrical current in the manner of a fuse.
Für eine besonders bevorzugte Ausgestaltung der erfindungsgemäßen elektrischen For a particularly preferred embodiment of the electrical according to the invention
Baugruppe ist nachfolgendes festzustellen. Assembly is to be determined below.
In elektromechanischen Steuergeräten ergibt sich oft die Situation, dass elektromechanische Schaltelemente elektrisch mit einem zentralen Kombiboard zu verbinden sind. Diese Verbindungen verursachen mechanische Kräfte in X-, Y- und/oder Z-Richtung. Diese Kräfte verursachen wiederum mechanische Spannungen, die für jedes gefertigte Teil anders gerichtet sind. Diese mechanischen Spannungen führen wiederum dazu, dass diese Kräfte statisch auf alle beteiligten Komponenten wirken. Dieser dauerhafte Stress kann dann zur Zerstörung der Gesamtbaugruppe führen. Die erfindungsgemäße Idee zur Lösung dieses Problems besteht darin, die Toleranzlagen verträglich zu entspannen. Bei allen anderen Lösungen würde eine Restkraft auf die beteiligten Komponenten wirken. Mit der erfindungsgemäßen Lösung kann man In electromechanical control devices, the situation often arises that electromechanical switching elements are to be electrically connected to a central combination board. These compounds cause mechanical forces in the X, Y and / or Z directions. These forces in turn cause mechanical stresses that are different for each manufactured part. These mechanical stresses in turn cause these forces to act statically on all the components involved. This permanent stress can then lead to the destruction of the entire assembly. The idea according to the invention for solving this problem is to relax the tolerance layers in a compatible manner. For all other solutions, residual power would affect the components involved. With the solution according to the invention you can
sicherstellen, dass alle Kräfte ausgeglichen sind innerhalb der definierten Toleranzlagen. Hierzu werden elektromechanische Baugruppen, bestehend beispielsweise aus Relais und Leiterplatte, miteinander verbunden. Aufgrund der Herstellungsparameter hat jede Ensure that all forces are balanced within the defined tolerance positions. For this purpose, electromechanical assemblies, consisting for example of relays and printed circuit board, connected to each other. Because of the manufacturing parameters, each one has
Baugruppe für sich Toleranzen, die immer vorhanden sind. Damit beim Befestigen der Leiterplatte mit dem Relais keine unzulässigen mechanischen Spannungen entstehen, besteht die Idee in einer modifizierten Leiterplatte, die an den Befestigungsstellen mechanische Freiheitsgrade in Z-Richtung und/oder auch in Z- und/oder X- und/oder Y- Richtung hat. Assembly itself Tolerances, which are always present. So that when mounting the circuit board with the relay no unacceptable mechanical stresses, the idea is in a modified circuit board, the mechanical freedom in the Z direction and / or in the Z and / or X and / or Y direction at the attachment points Has.
Geschaffen ist damit eine Leiterplatte, insbesondere eine Hochstrom-Leiterplatte mit Freiheitsgraden. Die Freiheitsgrade können in einer geraden und/oder auch in einer spiralen Ausführung erlangt werden. In der geraden Ausführung ist der Freiheitsgrad allerdings im Wesentlichen nur in Z-Richtung vorhanden. In der spiralen Ausführung hat man die Freiheitsgrade in den Richtungen X, Y, und Z. This creates a printed circuit board, in particular a high-current printed circuit board with degrees of freedom. The degrees of freedom can be achieved in a straight and / or in a spiral execution. In the straight version, however, the degree of freedom is essentially present only in the Z direction. In the spiral version you have the degrees of freedom in the directions X, Y, and Z.
Die geraden und/oder auch spiralen Verbindungsstege sind so ausgelegt, dass die The straight and / or spiral connecting webs are designed so that the
Verformung über den gesamten Steg erfolgt. Diese Auslegung ist wichtig, damit keine Material-Ermüdungserscheinungen auftreten. Die geraden und/oder auch spiralen Deformation takes place over the entire web. This design is important so that no material fatigue phenomena occur. The straight and / or spirals
Verbindungsstege sind so ausgelegt, dass die Wärme optimal über die Stege abgeleitet werden kann. Die geraden und/oder auch spiralen Verbindungsstege sind so ausgelegt, dass die Stege des Weiteren die Funktion von elektrischen Sicherungen erfüllen können. Wenn ein elektrischer Strom oberhalb der zulässigen Stromgrenze dauerhaft fließt und sämtliche sonstigen Sicherungsmaßnahmen nicht wirksam sind, beispielsweise bei einem Unfall, erfüllen diese Stege die Funktion einer Schmelzsicherung. Connecting webs are designed so that the heat can be optimally dissipated via the webs. The straight and / or spiral connecting webs are designed so that the webs can also fulfill the function of electrical fuses. If an electric current flows permanently above the permissible current limit and all other safety measures are not effective, for example in the event of an accident, these bars fulfill the function of a fuse.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, dass keine The advantages achieved by the invention are in particular that no
mechanischen Spannungen außerhalb der zulässigen Grenzen auf die einzelnen Baugruppen, wie beispielsweise die Leiterplatte, die Relais, die elektronischen Bauelemente o. dgl, wirken. Weitere mit der Erfindung erzielte Vorteile bestehen insbesondere in Folgendem: - Es sind keine Adapterelemente zwischen dem elektromechanischen Bauelement und der Leiterplatte erforderlich, wodurch Kosten eingespart werden. mechanical stresses outside the permissible limits on the individual modules, such as the circuit board, the relay, the electronic components o. The like. Act. Further advantages achieved with the invention consist in particular in the following: - There are no adapter elements between the electromechanical device and the circuit board required, thereby saving costs.
- Alle Kontaktstellen zur elektromechanischen Baugruppe können mit dem gleichen Konzept verbunden werden.  - All contact points to the electromechanical assembly can be connected to the same concept.
- Die erforderlichen Aussparungen können gefräst und/oder auch per Stanztechnik kostengünstig produziert werden, d.h. alle Aussparungen werden mit einer Stanzung in einem Schritt hergestellt.  - The required recesses can be milled and / or produced by stamping technology cost, ie. All recesses are made with one punch in one step.
- Die Leiterplatte und die elektromechanische Baugruppe können direkt miteinander verbunden werden.  - The printed circuit board and the electromechanical module can be connected directly to each other.
- Es ist eine gute elektrische Anbindung geschaffen.  - It has created a good electrical connection.
- Die Verbindungsstege können Schmelzsicherungsaufgaben übernehmen.  - The connecting webs can take over fuse tasks.
- Es ist eine gute thermische Anbindung gegeben.  - There is a good thermal connection.
- Es ist eine sichere Verbindungstechnik gegeben.  - There is a secure connection technology.
Es ist eine beständige Verbindungstechnik geschaffen.  It is created a durable connection technology.
- Es liegen Freiheitsgrade in X-, Y-, Z-Richtung oder falls ausreichend lediglich in Z- Richtung vor.  There are degrees of freedom in the X, Y, Z direction or, if sufficient, only in the Z direction.
- Es bestehen gute Überwachungsmöglichkeiten in der Fertigung der Baugruppe.  - There are good monitoring options in the production of the module.
Ein Ausführungsbeispiel der Erfindung mit verschiedenen Weiterbildungen und An embodiment of the invention with various developments and
Ausgestaltungen ist in den Zeichnungen dargestellt und wird im Folgenden näher beschrieben. Es zeigen Embodiments is illustrated in the drawings and will be described in more detail below. Show it
Fig. 1 eine elektrische Baugruppe in Seitenansicht sowie in Draufsicht, Fig. 2 einen Detailausschnitt aus Fig. 1 gemäß einer ersten Ausführung und Fig. 3 einen Detailausschnitt aus Fig. 1 gemäß einer zweiten Ausführung. Fig. 1 is an electrical assembly in side view and in plan view, Fig. 2 is a detail of FIG. 1 according to a first embodiment and Fig. 3 is a detail of FIG. 1 according to a second embodiment.
In Fig. 1 ist eine elektrische Baugruppe 1 zu sehen, die eine Leiterplatte 2 und ein In Fig. 1, an electrical assembly 1 can be seen, a printed circuit board 2 and a
Bauelement 3 umfasst. Bei dem Bauelement 3 handelt es sich um ein elektromechanisches Bauelement, und zwar um einen elektrischen Schaltkontakt. Der elektrische Schaltkontakt 3 kann beispielsweise Bestandteil eines elektrischen Schalters, eines Relais o. dgl. sein. Das Bauelement 3 steht mit an und/oder in der Leiterplatte 2 befindlichen Verbindungsstellen 4 in elektrischer und/oder mechanischer Verbindung. Die Verbindungsstelle 4 weist wenigstens eine in der Leiterplatte 2 befindliche Aussparung 5 auf. Weiter weist die Component 3 comprises. The component 3 is an electromechanical component, namely an electrical switching contact. The electrical switching contact 3, for example, part of an electrical switch, a relay o. The like. Be. The Component 3 is connected to and / or located in the circuit board 2 connection points 4 in electrical and / or mechanical connection. The connection point 4 has at least one recess 5 located in the printed circuit board 2. Next, the
Verbindungsstelle 4 wenigstens einen Steg 6 auf, wobei die Verbindungsstelle 4 mittels des Stegs 6 an die Leiterplatte 2 angeformt ist. Dadurch ist die Verbindungsstelle 4 in wenigstens eine Raumrichtung verformbar. Und zwar ist zweckmäßigerweise die Joint 4 at least one web 6, wherein the connection point 4 is integrally formed by means of the web 6 to the circuit board 2. As a result, the connection point 4 is deformable in at least one spatial direction. And that is expediently the
Verbindungsstelle 4 elastisch verformbar. Joint 4 elastically deformable.
Bei einer ersten Ausführung, die näher in Fig. 2 zu sehen ist, ist der Steg 6 spiralförmig ausgebildet. Dadurch ist die Verbindungsstelle 4 in etwa senkrecht sowie in etwa parallel zur Leiterplatte 2, also in x-, y- und z-Richtung, verformbar. Es kann jedoch auch ausreichen, wenn die Verbindungsstelle 4 lediglich in eine Raumrichtung verformbar ist. Bei einer solchen zweiten Ausführung, die näher in Fig. 3 gezeigt ist, ist der Steg 6 geradlinig ausgebildet. Dadurch ist die Verbindungsstelle 4 in etwa senkrecht zur Leiterplatte 2, also in z-Richtung, verformbar. In a first embodiment, which can be seen in more detail in Fig. 2, the web 6 is formed spirally. As a result, the connection point 4 is approximately perpendicular and approximately parallel to the printed circuit board 2, so in the x, y and z direction, deformable. However, it may also be sufficient if the connection point 4 is deformable only in one spatial direction. In such a second embodiment, which is shown in more detail in Fig. 3, the web 6 is formed in a straight line. As a result, the connection point 4 is approximately perpendicular to the printed circuit board 2, ie in the z-direction, deformable.
Die Verbindungsstelle 4 ist mit dem Bauelement 3 verschraubbar, und zwar dient gemäß Fig. 1 eine Schraube 7 zur Verschraubung der Verbindungsstelle 4 mit dem Schaltkontakt 3. Anstelle einer Verschraubung kann die Verbindungsstelle 4 auch mit dem Bauelement 3 vernietbar, verschweißbar, verlötbar o. dgl. ausgestaltet sein. 1 is a screw 7 for screwing the connection point 4 with the switching contact 3. Instead of a screw connection point 4 can also be riveted to the component 3, welded, soldered o. The like be designed.
Wie weiter anhand von Fig. 1 zu sehen ist, besitzt die Verbindungsstelle 4 eine Grundfläche 8 zur Befestigung des Bauelements 3. Die Befestigung erfolgt dadurch, dass die As can be seen further with reference to FIG. 1, the connection point 4 has a base surface 8 for fastening the component 3. The fastening takes place in that the
Grundfläche 8 als elektrische Kontaktstelle an einem elektrischen Anschluss 1 1 des Base 8 as electrical contact point on an electrical connection 1 1 of the
Bauelements 3 mittels der Schraube 7 befestigt ist. Die Stege 6 gehen von der Grundfläche 8 zur Leiterplatte 2 ab. Weiterhin ist eine elektrische Verbindung von der Grundfläche 8 über den Steg 6 zu einer nicht weiter gezeigten, zugeordneten Leiterbahn an der Leiterplatte 2 vorgesehen. Die Aussparungen 5 sind mittels Stanzen, Fräsen, Bohren o. dgl. in die Component 3 is fixed by means of the screw 7. The webs 6 go from the base 8 to the circuit board 2 from. Furthermore, an electrical connection from the base 8 via the web 6 to a not shown, associated conductor to the circuit board 2 is provided. The recesses 5 are by means of stamping, milling, drilling o. The like. In the
Leiterplatte 2 eingebracht. PCB 2 introduced.
Bei der Leiterplatte 2 kann es sich um eine Hochstromleiterplatte handeln. Hierfür können in die Leiterplatte 2 massive Kupferelemente zur Leitung eines hohen Stroms eingebettet sein. Aufgrund des hohen fließenden Stroms entsteht eine gewisse Wärme im Schaltkontakt 3. Der Wärmefluss 9 kann zumindest zum Teil über die Verbindungsstelle 4 auf die The printed circuit board 2 may be a high-current printed circuit board. For this purpose, solid copper elements can be embedded in the printed circuit board 2 for conducting a high current. Due to the high current flowing creates a certain amount of heat in the switch contact 3. The heat flow 9 can at least partially via the junction 4 on the
Leiterplatte 2 und von dort beispielsweise über Kühlkörper 10 in der Art von Wärmesenken abgeleitet werden. Zu diesem Zweck ist der Steg 6 derart dimensioniert, dass die Wärme vom Bauelement 3 über den Steg 6 abführbar ist. Ebenso kann der Steg 6 derart dimensioniert sein, dass der Steg 6 bei Überschreiten eines vorgesehenen Grenzwertes für den zwischen der Leiterplatte 2 und dem Bauelement 3 fließenden elektrischen Strom in der Art einer Schmelzsicherung den Stromfluss unterbricht. Printed circuit board 2 and from there, for example via heat sink 10 in the manner of heat sinks. For this purpose, the web 6 is dimensioned such that the heat from the component 3 via the web 6 can be discharged. Likewise, the web 6 may be dimensioned such that the web 6 interrupts the flow of current when exceeding a prescribed limit for the current flowing between the circuit board 2 and the component 3 electrical current in the manner of a fuse.
Die erfindungsgemäße Verbindungsstelle 4 kann in einer Baugruppe für das Batteriesystem eines Kraftfahrzeugs eingesetzt werden. Die Erfindung ist jedoch nicht auf das beschriebene und dargestellte Ausführungsbeispiel beschränkt. Sie umfasst vielmehr auch alle fachmännischen Weiterbildungen im Rahmen der durch die Patentansprüche definierten Erfindung. So kann die erfmdungsgemäße Verbindungsstelle 4 auch in Baugruppen für Hausgeräte, Audiogeräte, Videogeräte, Telekommunikationsgeräte o. dgl. Verwendung finden. The connection point 4 according to the invention can be used in an assembly for the battery system of a motor vehicle. However, the invention is not limited to the described and illustrated embodiment. Rather, it also encompasses all expert developments within the scope of the invention defined by the claims. Thus, the junction 4 according to the invention can also be used in assemblies for household appliances, audio devices, video devices, telecommunication devices or the like.
Bezugszeichen-Liste: Reference numeral list:
(elektrische) Baugruppe(electrical) assembly
Leiterplatte circuit board
Bauelement / Schaltkontakt Component / switching contact
Verbindungsstelle junction
Aussparung  recess
Steg  web
Schraube  screw
Grundfläche  Floor space
Wärmefluss heat flow
: Kühlkörper: Heat sink
: (elektrischer) Anschluss : (electrical) connection

Claims

P a t e n t a n s p r ü c h e Patent claims
1. Elektrische Baugruppe umfassend eine Leiterplatte (2) und ein Bauelement (3), insbesondere ein elektromechanisches Bauelement, wie einen elektrischen Schaltkontakt, einen elektrischen Schalter, ein Relais o. dgl., wobei das Bauelement (3) mit wenigstens einer an und/oder in der Leiterplatte (2) befindlichen Verbindungsstelle (4) in elektrischer und/oder mechanischer Verbindung steht, dadurch gekennzeichnet, dass die 1. Electrical assembly comprising a printed circuit board (2) and a component (3), in particular an electromechanical component, such as an electrical switching contact, an electrical switch, a relay o. The like., Wherein the component (3) with at least one of and / or in the circuit board (2) located connection point (4) is in electrical and / or mechanical connection, characterized in that the
Verbindungsstelle (4) wenigstens eine in der Leiterplatte (2) befindliche Aussparung (5) aufweist, und dass die Verbindungsstelle (4) wenigstens einen Steg (6) aufweist, wobei die Verbindungsstelle (4) mittels des Stegs (6) an die Leiterplatte (2) angeformt ist, derart dass die Verbindungsstelle (4) in wenigstens eine Raumrichtung verformbar, insbesondere elastisch verformbar, ist. Connecting point (4) has at least one in the circuit board (2) located recess (5), and that the connection point (4) at least one web (6), wherein the connection point (4) by means of the web (6) to the circuit board ( 2) is formed, such that the connection point (4) in at least one spatial direction deformable, in particular elastically deformable, is.
2. Elektrische Baugruppe nach Anspruch l, dadurch gekennzeichnet, dass der Steg (6) geradlinig ausgebildet ist, derart dass die Verbindungsstelle (4) in etwa senkrecht zur Leiterplatte (2) verformbar ist. 2. Electrical assembly according to claim l, characterized in that the web (6) is rectilinear, such that the connection point (4) is approximately perpendicular to the printed circuit board (2) deformable.
3. Elektrische Baugruppe nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Steg (6) spiralförmig ausgebildet ist, derart dass die Verbindungsstelle (4) in etwa senkrecht sowie in etwa parallel zur Leiterplatte (2) verformbar ist. 3. Electrical assembly according to claim 1 or 2, characterized in that the web (6) is formed spirally, such that the connection point (4) in approximately perpendicular and approximately parallel to the printed circuit board (2) is deformable.
4. Elektrische Baugruppe nach Anspruch 1 , 2 oder 3, dadurch gekennzeichnet, dass die Verbindungsstelle (4) mit dem Bauelement (3) verschraubbar, vernietbar, verschweißbar, verlötbar o. dgl. ist. 4. Electrical assembly according to claim 1, 2 or 3, characterized in that the connection point (4) with the component (3) screwed, riveted, welded, soldered o. The like. Is.
5. Elektrische Baugruppe nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass es sich bei der Leiterplatte (2) um eine Hochstromleiterplatte, insbesondere mit in die Leiterplatte (2) eingebetteten massiven Kupferelementen zur Leitung eines hohen Stroms, handelt. 5. Electrical assembly according to one of claims 1 to 4, characterized in that it is the printed circuit board (2) to a high-current circuit board, in particular with in the printed circuit board (2) embedded solid copper elements for conducting a high current is.
6. Elektrische Baugruppe nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Verbindungsstelle (4) eine Grundfläche (8) zur Befestigung des Bauelements (3) aufweist, dass vorzugsweise die Grundfläche (8) als elektrische Kontaktstelle an einem elektrischen Anschluss (11) des Bauelements (3), insbesondere mittels einer Schraube (7), befestigt ist. 6. Electrical assembly according to one of claims 1 to 5, characterized in that the connection point (4) has a base surface (8) for fastening the component (3). has, that preferably the base surface (8) as an electrical contact point on an electrical connection (11) of the component (3), in particular by means of a screw (7), is attached.
7. Elektrische Baugruppe nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass der Steg (6) von der Grundfläche (8) zur Leiterplatte (2) abgeht, dass vorzugsweise eine elektrische Verbindung von der Grundfläche (8) über den Steg (6) zu einer zugeordneten Leiterbahn an der Leiterplatte (2) vorgesehen ist, und dass weiter vorzugsweise die 7. Electrical assembly according to one of claims 1 to 6, characterized in that the web (6) from the base (8) to the circuit board (2) goes off, that preferably an electrical connection from the base (8) via the web (6 ) is provided to an associated conductor track on the circuit board (2), and further preferably that
Aussparung (5) mittels Stanzen, Fräsen, Bohren o. dgl. in die Leiterplatte (2) eingebracht ist. Recess (5) by means of stamping, milling, drilling o. The like. In the circuit board (2) is introduced.
8. Elektrische Baugruppe nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass der Steg (6) derart dimensioniert ist, dass Wärme vom Bauelement (3) über den Steg (6) abführbar ist und/oder dass der Steg (6) bei Überschreiten eines vorgesehenen 8. Electrical assembly according to one of claims 1 to 7, characterized in that the web (6) is dimensioned such that heat from the component (3) via the web (6) can be discharged and / or that the web (6) at Exceeding a designated
Grenzwertes für den zwischen der Leiterplatte (2) und dem Bauelement (3) fließenden elektrischen Strom in der Art einer Schmelzsicherung den Stromfluss unterbricht. Limit value for between the printed circuit board (2) and the component (3) flowing electric current in the manner of a fuse interrupts the flow of current.
EP16714938.4A 2015-04-10 2016-04-08 Assembly comprising printed circuit board and electric component Withdrawn EP3281497A1 (en)

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DE102015004375 2015-04-10
DE102015004377 2015-04-10
PCT/EP2016/057703 WO2016162459A1 (en) 2015-04-10 2016-04-08 Assembly comprising printed circuit board and electric component

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FR2351513A1 (en) * 1976-05-13 1977-12-09 Cit Alcatel ELECTRICAL COMPONENT SUPPORT PLATE
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DE102006001188A1 (en) * 2006-01-10 2007-07-12 Robert Bosch Gmbh Arrangement for cooling power components on printed circuit boards and method for producing the same
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RU2009117638A (en) * 2006-10-10 2010-11-20 ТиАйАр ТЕКНОЛОДЖИ ЭлПи (CA) LOCAL FLEXIBILITY
JP2010508653A (en) * 2006-10-31 2010-03-18 ティーアイアール テクノロジー エルピー Light emitting device light source and temperature management system for light emitting device light source
WO2010126410A1 (en) * 2009-04-28 2010-11-04 Telefonaktiebolaget L M Ericsson (Publ) Assembly for carrying electronic components
US9140735B2 (en) * 2013-05-03 2015-09-22 Infineon Technologies Ag Integration of current measurement in wiring structure of an electronic circuit

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EP3281499A1 (en) 2018-02-14

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