EP3265254A1 - Verfahren zur aushärtung von polyurethan-bindemitteln in formstoffmischungen durch einleiten tertiärer amine und lösungsmittel und kit zur durchführung des verfahrens - Google Patents
Verfahren zur aushärtung von polyurethan-bindemitteln in formstoffmischungen durch einleiten tertiärer amine und lösungsmittel und kit zur durchführung des verfahrensInfo
- Publication number
- EP3265254A1 EP3265254A1 EP16722038.3A EP16722038A EP3265254A1 EP 3265254 A1 EP3265254 A1 EP 3265254A1 EP 16722038 A EP16722038 A EP 16722038A EP 3265254 A1 EP3265254 A1 EP 3265254A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- solvent
- molding material
- isocyanate
- weight
- material mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 239000002904 solvent Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000011230 binding agent Substances 0.000 title claims abstract description 31
- 150000003512 tertiary amines Chemical class 0.000 title claims abstract description 26
- 238000000465 moulding Methods 0.000 title claims abstract description 16
- 239000004814 polyurethane Substances 0.000 title abstract description 10
- 229920002635 polyurethane Polymers 0.000 title abstract description 6
- 239000003054 catalyst Substances 0.000 claims abstract description 44
- 239000000443 aerosol Substances 0.000 claims abstract description 10
- -1 polyol compounds Chemical class 0.000 claims description 54
- 239000012778 molding material Substances 0.000 claims description 49
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 39
- 239000012948 isocyanate Substances 0.000 claims description 23
- ZUHZZVMEUAUWHY-UHFFFAOYSA-N n,n-dimethylpropan-1-amine Chemical compound CCCN(C)C ZUHZZVMEUAUWHY-UHFFFAOYSA-N 0.000 claims description 23
- 239000005011 phenolic resin Substances 0.000 claims description 19
- 229920001568 phenolic resin Polymers 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 17
- 239000005056 polyisocyanate Substances 0.000 claims description 17
- 229920001228 polyisocyanate Polymers 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 229920005862 polyol Polymers 0.000 claims description 15
- 150000002989 phenols Chemical class 0.000 claims description 14
- 150000002513 isocyanates Chemical class 0.000 claims description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 239000012159 carrier gas Substances 0.000 claims description 10
- 150000002905 orthoesters Chemical class 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 8
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- GKASDNZWUGIAMG-UHFFFAOYSA-N triethyl orthoformate Chemical compound CCOC(OCC)OCC GKASDNZWUGIAMG-UHFFFAOYSA-N 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 7
- 150000003077 polyols Chemical class 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 150000001343 alkyl silanes Chemical class 0.000 claims description 6
- PYOKUURKVVELLB-UHFFFAOYSA-N trimethyl orthoformate Chemical compound COC(OC)OC PYOKUURKVVELLB-UHFFFAOYSA-N 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 claims description 2
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 claims description 2
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 claims description 2
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 2
- 229910001570 bauxite Inorganic materials 0.000 claims description 2
- 239000011324 bead Substances 0.000 claims description 2
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims description 2
- 239000010450 olivine Substances 0.000 claims description 2
- 229910052609 olivine Inorganic materials 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- 239000001569 carbon dioxide Substances 0.000 claims 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims 1
- IIFFFBSAXDNJHX-UHFFFAOYSA-N 2-methyl-n,n-bis(2-methylpropyl)propan-1-amine Chemical compound CC(C)CN(CC(C)C)CC(C)C IIFFFBSAXDNJHX-UHFFFAOYSA-N 0.000 claims 1
- 239000003570 air Substances 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims 1
- 229940106691 bisphenol a Drugs 0.000 claims 1
- 150000001723 carbon free-radicals Chemical group 0.000 claims 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims 1
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 claims 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 claims 1
- YZYKBQUWMPUVEN-UHFFFAOYSA-N zafuleptine Chemical compound OC(=O)CCCCCC(C(C)C)NCC1=CC=C(F)C=C1 YZYKBQUWMPUVEN-UHFFFAOYSA-N 0.000 claims 1
- 150000003752 zinc compounds Chemical group 0.000 claims 1
- 150000001412 amines Chemical class 0.000 abstract description 44
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000011819 refractory material Substances 0.000 abstract description 5
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 16
- VMOWKUTXPNPTEN-UHFFFAOYSA-N n,n-dimethylpropan-2-amine Chemical compound CC(C)N(C)C VMOWKUTXPNPTEN-UHFFFAOYSA-N 0.000 description 14
- 239000004215 Carbon black (E152) Substances 0.000 description 11
- 229930195733 hydrocarbon Natural products 0.000 description 11
- 150000001299 aldehydes Chemical class 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000003849 aromatic solvent Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 230000003197 catalytic effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 150000005676 cyclic carbonates Chemical class 0.000 description 3
- 150000003997 cyclic ketones Chemical class 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- PCHXZXKMYCGVFA-UHFFFAOYSA-N 1,3-diazetidine-2,4-dione Chemical compound O=C1NC(=O)N1 PCHXZXKMYCGVFA-UHFFFAOYSA-N 0.000 description 2
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- XQDNFAMOIPNVES-UHFFFAOYSA-N 3,5-Dimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1 XQDNFAMOIPNVES-UHFFFAOYSA-N 0.000 description 2
- LPCJHUPMQKSPDC-UHFFFAOYSA-N 3,5-diethylphenol Chemical compound CCC1=CC(O)=CC(CC)=C1 LPCJHUPMQKSPDC-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- RCNCKKACINZDOI-UHFFFAOYSA-N 4,5-dimethylbenzene-1,3-diol Chemical compound CC1=CC(O)=CC(O)=C1C RCNCKKACINZDOI-UHFFFAOYSA-N 0.000 description 2
- ZSBDGXGICLIJGD-UHFFFAOYSA-N 4-phenoxyphenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC=C1 ZSBDGXGICLIJGD-UHFFFAOYSA-N 0.000 description 2
- GHVHDYYKJYXFGU-UHFFFAOYSA-N Beta-Orcinol Chemical compound CC1=CC(O)=C(C)C(O)=C1 GHVHDYYKJYXFGU-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- OIPPWFOQEKKFEE-UHFFFAOYSA-N orcinol Chemical compound CC1=CC(O)=CC(O)=C1 OIPPWFOQEKKFEE-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical class O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- HRUHVKFKXJGKBQ-UHFFFAOYSA-N 3,5-dibutylphenol Chemical compound CCCCC1=CC(O)=CC(CCCC)=C1 HRUHVKFKXJGKBQ-UHFFFAOYSA-N 0.000 description 1
- PEZSSBYAUDZEMO-UHFFFAOYSA-N 3,5-dicyclohexylphenol Chemical compound C=1C(O)=CC(C2CCCCC2)=CC=1C1CCCCC1 PEZSSBYAUDZEMO-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- CHQPRDVSUIJJNP-NSCUHMNNSA-N 4-[(e)-but-2-enyl]phenol Chemical compound C\C=C\CC1=CC=C(O)C=C1 CHQPRDVSUIJJNP-NSCUHMNNSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- ZNPSUQQXTRRSBM-UHFFFAOYSA-N 4-n-Pentylphenol Chemical compound CCCCCC1=CC=C(O)C=C1 ZNPSUQQXTRRSBM-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- MSFGJICDOLGZQK-UHFFFAOYSA-N 5-ethylbenzene-1,3-diol Chemical compound CCC1=CC(O)=CC(O)=C1 MSFGJICDOLGZQK-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 125000001743 benzylic group Chemical group 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000003426 co-catalyst Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 235000019387 fatty acid methyl ester Nutrition 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 229960004337 hydroquinone Drugs 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 231100000616 occupational exposure limit Toxicity 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/2273—Polyurethanes; Polyisocyanates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/02—Sand moulds or like moulds for shaped castings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/10—Cores; Manufacture or installation of cores
Definitions
- the present invention relates to a method for the production of cores and casting molds by exposure to molding material mixtures comprising at least one refractory material and at least one polyurethane-based binder with gaseous material or tertiary amines present in aerosol form and gaseous or aerosolized solvents for the amine catalysts and a kit for carrying out the process comprising tertiary amines as catalysts and a solvent for the amines as a component of the kit.
- the method of core production known as the "cold-box process” or “ashland process” has become very important in the foundry industry.
- Two-component polyurethane systems are used for bonding a refractory molding base material.
- the polyol component consists of a polyol having at least two OH groups per molecule, the isocyanate component of a polyisocyanate having at least two NCO groups per molecule. The curing of the mixture of u.a.
- Molding base material and binder also referred to as molding material mixture for short, is carried out with the aid of tertiary amines which are passed through in gaseous form or as an aerosol through the molding material mixture after shaping (US Pat. No. 3,409,579).
- a carrier gas e.g. Air, nitrogen or CO2, into which the amines are metered.
- the binders Upon contact with the catalyst, i. when this is passed through the molding material mixture by means of the carrier gas, the binders should cure as quickly as possible. It is advantageous to minimize the need for amine. There are the following reasons for this:
- the amines currently used as PU catalysts in foundries are classified as toxic and the permitted occupational exposure limit values are correspondingly very low.
- the amines are characterized by a very unpleasant odor.
- CONFIRMATION COPY This makes it necessary to collect the amines by suction after leaving the mold, whether at the designated or leaking points, and then remove them again from the exhaust air. This is usually done with the aid of waste gas scrubbers, in which the laden with the amine air is passed through a sulfuric acid solution and thereby freed from the amine. The amine can then be recovered from the solution in a recycling plant and recycled. - The saving of amine is also of economic interest, as the extraction system can be designed smaller, which has a positive effect on both the acquisition and the ongoing operating costs.
- the invention relates to a method for producing a shaped article as a casting part or as a core, comprising
- the gaseous tertiary amine is introduced into the molding material mixture and subsequently at least one gaseous solvent (B), or
- gaseous solvent (B) is introduced into the molding material mixture and subsequently the gaseous tertiary amine
- the invention further relates to a kit for producing a binder for molding material mixtures comprising the following components separately from one another:
- TMA trimethylamine
- DMEA dimethylethylamine
- DMPA dimethyl-n-propylamine
- DMIPA dimethylisopropylamine
- DEMA diethylmethylamine
- TEA triethylamine
- DMEA dimethylethylamine
- DMPA dimethyl-n-propylamine
- DMIPA dimethylisopropylamine
- DEMA diethylmethylamine
- TEA triethylamine
- tertiary amines can all be used as catalysts according to the invention, as are the mixtures of at least two tertiary amines known from EP 1955792 A1.
- Solvents in the sense of the invention are those which are liquid at 25 ° C. and have a boiling point of 20 ° C. to 220 ° C.
- Solvent furthermore means that the catalyst dissolves completely in the solvent at room temperature (25 ° C). Furthermore, solvent means that the solvent is not a catalyst for the PU reaction and is different from a catalyst for the PU reaction. In addition, solvent means that the solvent is inert to an amine catalyst. However, it may well be desirable that the solvent reacts with components of the molding material mixture, for example at temperatures of 5 ° C to 80 ° C, especially with water in the molding material mixture.
- Suitable solvents for these amines are in principle all solvents which are miscible with the tertiary amines, they take up homogeneously in solution at room temperature and can bring under the conditions prevailing in the gassing conditions together with the amines in the gaseous state or in aerosol form.
- Polar solvents such as esters are preferred.
- Orthoesters or alkylsilanes, alkoxysilanes or mixed alkyalkyloxysilanes are preferred, but also aromatic, cycloaliphatic and aliphatic hydrocarbon solvents and mixtures of the mentioned classes of substances can be used.
- R H or a C1 to C8 hydrocarbon radical, in particular a C1 to C3 hydrocarbon radical and especially a corresponding alkyl radical or H, and
- R 1 to R 3 independently of one another are a C 1 to C 8 hydrocarbon radical, in particular a C 1 to C 3 hydrocarbon radical and in particular a corresponding alkyl radical.
- orthoesters are, for example, trimethyl orthoformate or triethyl orthoformate.
- alkylsilanes (optionally also bonded with H), alkoxysilanes (bonded with at least one H) or mixed alkylalkoxysilanes (optionally also bonded with H) are compounds of the general formula:
- R 1 H or
- a C1 to C8 hydrocarbon radical in particular a C1 to C6 hydrocarbon radical, more preferably a C1 to C4 hydrocarbon radical, and in particular a corresponding alkyl radical, and
- R 2 to R 4 independently of one another
- a C1 to C8 hydrocarbon radical in particular a C1 to C3 hydrocarbon radical and in particular a corresponding alkyl radical or H,
- R C1 to C8 hydrocarbon radical, in particular a C1 to C4 hydrocarbon radical and in particular a corresponding alkyl radical,
- R 1 to R 4 are all equal to H.
- Particularly suitable alkylsilanes or alkylalkoxysilanes are: methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxylsilane and / or propyltrimethoxysilane.
- the weight ratio of (A) to (B) is between 95: 5 and 5:95, preferably between 80:20 and 20:80, and more preferably between 70:30 and 30:70.
- the catalyst mixture according to the invention can be metered into the carrier gas (which may be air or an inert gas or gas mixture) as a component (mixture of A + B), but (A) and (B) can also be added individually to the carrier gas stream at the same time.
- the addition of components (A) and (B) does not necessarily have to be done simultaneously.
- An improvement in catalysis is also observed when (A) and (B) or (B) and (A) are dosed sequentially, the results being particularly good when first the non-catalytic solvent (B) and then the amine catalyst (A) is injected or gassed.
- the invention relates to a method for producing a core or a casting mold, comprising
- step (b) introducing the molding material mixture obtained in step (a) into a molding tool;
- the amount of amine or amines used is preferably from 3 to 50% by weight relative to the binder used.
- the gassing pressure is preferably from 0.5 to 7 bar.
- the time interval for the gassing process with amine and solvent is from 5 sec 300 sec.
- the temperature of the gassing stream can be from 20 ° C to 240 ° C, an aerosol is used but also ambient temperature (eg 25 ° C). Preferred is a temperature of 40 to 200 ° C for both modes (aerosol and gaseous).
- a refractory molding base material (hereinafter also abbreviated molding material) can be used for the production of molds usual and known materials and mixtures thereof.
- Suitable examples are quartz, zirconium or chrome ore, olivine, vermiculite, bauxite, chamotte and so-called artificial mold bases, ie mold bases, which have been brought into spherical or approximately spherical (for example ellipsoidal) shape by industrial molding processes.
- Examples include glass beads, glass granules or artificial, spherical, ceramic sands - so-called Cerabeads® but also Spherrichome®, SpherOX® or "Carboaccucast”, as well as hollow microspheres, which can be isolated as components from flyashes, such as aluminum silicate hollow spheres (so-called microspheres) Mixtures of the mentioned refractories are also possible.
- a refractory base molding material is understood to mean substances which have a high melting point (melting temperature).
- the melting point of the refractory base molding material is greater than 600 ° C, preferably greater than 900 ° C, more preferably greater than 1200 ° C and particularly preferably greater than 1500 ° C.
- the refractory molding base material preferably makes up more than 80% by weight, in particular greater than 90% by weight, particularly preferably greater than 95% by weight, of the molding material mixture.
- the average diameter of the refractory mold base materials is generally between 100 pm and 600 pm, preferably between 120 pm and 550 ⁇ m, and particularly preferably between 150 ⁇ m and 500 ⁇ m.
- the particle size can be determined, for example, by sieving according to DIN ISO 3310.
- Particularly preferred are particle shapes with the greatest length extension to the smallest length extension (perpendicular to one another and in each case for all spatial directions) of 1: 1 to 1: 5 or 1: 1 to 1: 3, ie those which are not fibrous, for example.
- the refractory molding base material preferably has a free-flowing state, in particular in order to be able to process the molding material mixture according to the invention in conventional core shooting machines.
- the components of the binder system can first be combined and then added to the refractory molding material. However, it is also possible to add the components of the binder simultaneously or sequentially in any order to the refractory base molding material.
- the Polvolkomponente has phenol-aldehyde resins, here shortened called phenolic resins.
- phenolic resins for the preparation of the phenolic resins, all conventionally used phenolic compounds are suitable.
- substituted phenols or mixtures thereof can be used.
- the phenolic compounds are preferably unsubstituted either in both ortho positions or in an ortho and in the para position. The remaining ring carbon atoms may be substituted.
- the choice of the substituent is not particularly limited. However, the substituent should not adversely affect the reaction of the phenol with the aldehyde.
- substituted phenols are alkyl-substituted, alkoxy-substituted, aryl-substituted and aryloxy-substituted phenols.
- the abovementioned substituents have, for example, 1 to 26, preferably 1 to 15, carbon atoms.
- suitable phenols are o-cresol, m-cresol, p-cresol, 3,5-xylenol, 3,4-xylenol, 3,4,5-trimethylphenol, 3-ethylphenol, 3,5-diethylphenol, p- Butylphenol, 3,5-dibutylphenol, p-amylphenol, cyclohexylphenol, p-octylphenol, p-nonylphenol, cardanol, 3,5-dicyclohexylphenol, p-crotylphenol, p-phenylphenol, 3,5-dimethoxyphenol and p-phenoxyphenol.
- Particularly preferred is phenol itself.
- higher condensed phenols, such as bisphenol A are suitable.
- polyhydric phenols having more than one phenolic hydroxyl group are also suitable.
- Preferred polyhydric phenols have 2 to 4 phenolic hydroxyl groups.
- suitable polyhydric phenols are pyrocatechol, resorcinol, hydroquinone, pyrogallol, phloroglucinol, 2,5-dimethylresorcinol, 4,5-dimethylresorcinol, 5-methylresorcinol or 5-ethylresorcinol.
- Mixtures of various mono- and polyhydric and / or substituted and / or condensed phenolic components can also be used for the preparation of the polyol component.
- phenols of general formula I are phenols of general formula I:
- A, B and C are independently selected from: a hydrogen atom, a branched or unbranched alkyl radical, which may have, for example 1 to 26, preferably 1 to 15 carbon atoms, a branched or unbranched alkoxy radical, the for example, from 1 to 26, preferably from 1 to 15 carbon atoms, a branched or unbranched alkenoxy, which may for example have 1 to 26, preferably 1 to 15 carbon atoms, an aryl or alkylaryl radical, for example 6 (7 in aryl) to 26, preferably from 6 (7) to 15 carbon atoms, such as bisphenols
- Suitable aldehydes for the production of the phenolic resin component are aldehydes of the formula: R-CHO, wherein R is a hydrogen atom or a carbon atom radical having preferably 1 to 8, particularly preferably 1 to 3 carbon atoms.
- R is a hydrogen atom or a carbon atom radical having preferably 1 to 8, particularly preferably 1 to 3 carbon atoms.
- Specific examples are formaldehyde, acetaldehyde, propionaldehyde, furfuraldehyde and benzaldehyde.
- formaldehyde is used, either in its aqueous form, as para-formaldehyde, or trioxane.
- the molar ratio of aldehyde to phenol is preferably 1: 1, 0 to 2.5: 1, particularly preferably 1.1: 1 to 2.2: 1, particularly preferably 1.2: 1 to 2.0: 1.
- aliphatic monoalcohols having from one to eight carbon atoms may be added according to EP 0177871 A2.
- the phenolic resins should have increased thermal stability.
- the preparation of the phenolic resin is carried out by methods known in the art.
- the phenol and the aldehyde are reacted under substantially water-free conditions, in particular in the presence of a divalent metal ion, at temperatures of preferably less than 130.degree.
- the resulting water is distilled off.
- a suitable entraining agent may be added, for example toluene or xylene, or the distillation is carried out at reduced pressure.
- the phenolic resin is selected so that crosslinking with the polyisocyanate component is possible.
- phenolic resins comprising molecules having at least two hydroxyl groups in the molecule are necessary.
- Particularly suitable phenolic resins are known by the name "ortho-ortho" or “high-ortho” novolaks or benzyl ether resins. These are obtainable by condensation of phenols with aldehydes in weakly acidic medium using suitable catalysts.
- Suitable catalysts for the preparation of benzylic ether resins are salts of divalent ions of metals such as Mn, Zn, Cd, Mg, Co, Ni, Fe, Pb, Ca and Ba.
- zinc acetate is used.
- the amount used is not critical. Typical amounts of metal catalyst are 0.02 to 0.3% by weight, preferably 0.02 to 0.15% by weight, based on the total amount of phenol and aldehyde.
- the isocyanate component of the binder system comprises an aliphatic, cycloaliphatic or aromatic isocyanate having at least 2 isocyanate groups per molecule (polyisocyanates), preferably having 2 to 5 isocyanate groups per molecule. Depending on the desired properties, it is also possible to use mixtures of isocyanates. In addition to the polyisocyanates, monoisocyanates can also be used according to an embodiment with a smaller proportion by weight.
- Suitable polyisocyanates include aliphatic polyisocyanates such as hexamethylene diisocyanate, alicyclic polyisocyanates such as 4,4'-dicyclohexylmethane diisocyanate and dimethyl derivatives thereof.
- suitable aromatic polyisocyanates are toluene-2,4-diisocyanate, toluene-2,6-diisocyanate, 1,5-naphthalene diisocyanate, triphenylmethane triisocyanate, xylylene diisocyanate and methyl derivatives thereof, as well as polymethylene polyphenyl isocyanates.
- polyisocyanates are aromatic polyisocyanates, particularly preferred are polymethylene polyphenyl polyisocyanates, such as, for example, technical 4,4'-diphenylmethane diisocyanate, ie 4,4'-diphenylmethane diisocyanate with a proportion of isomers and higher homologs.
- the polyisocyanates may also be derivatized by reacting dihydric isocyanates with one another such that some of their isocyanate groups are derivatized to isocyanurate, biuret, allophanate, uretdione or carbodiimide groups.
- dimerization products containing uretdione groups for example MDI or TDI.
- the polyisocyanate is used in an amount such that the number of isocyanate groups is from 80 to 120%, based on the number of free hydroxyl groups of the resin.
- the phenolic resin component or the isocyanate component of the binder system is preferably used as a solution in an organic solvent or a combination of organic solvents.
- solvents may be required to maintain the components of the binder in a sufficiently low viscosity state. This is necessary, inter alia, in order to obtain a uniform cross-linking of the refractory molding material and its flowability.
- the solvent for the phenolic resin and the phenol resin component besides the e.g. known as solvent naphtha aromatic solvents continue to be used oxygen-rich polar, organic solvents.
- dicarboxylic acid esters e.g. known as solvent naphtha aromatic solvents
- glycol ether esters glycol diesters, glycol diethers
- cyclic ketones cyclic esters (lactones), cyclic carbonates or silicic acid esters or mixtures thereof.
- Dicarboxylic acid esters, cyclic ketones and cyclic carbonates are preferably used.
- the proportion of oxygen-rich polar solvents in the total binder can be up to 30%.
- Typical dicarboxylic acid esters have the formula R1OOC-R2-COOR1, wherein each R1 is independently an alkyl group having 1 to 12, preferably 1 to 6, carbon atoms and R2 is an alkylene group having 1 to 4 carbon atoms.
- R1 is independently an alkyl group having 1 to 12, preferably 1 to 6, carbon atoms
- R2 is an alkylene group having 1 to 4 carbon atoms.
- dimethyl esters of carboxylic acids having 4 to 6 carbon atoms e.g. available under the name Dibasic Ester from DuPont.
- Typical glycol ether esters are compounds of the formula R3-0-R4-OOCR5 wherein R3 is an alkyl group of 1 to 4 carbon atoms, R4 is an alkylene group of 2 to 4 carbon atoms and R5 is an alkyl group of 1 to 3 carbon atoms, eg butyl glycol acetate glycol ether acetates.
- Typical glycol diesters accordingly have the general formula R 3 COO-R 4 -OOCR 5 where R 3 to R 5 are as defined above and the radicals are each independently selected (eg, propylene glycol diacetate). Preferred are glycol diacetates.
- Glycol diethers can be characterized by the formula R3-O-R4-O-R5 in which R3 to R5 are as defined above and the radicals are each selected independently of one another (for example dipropylene glycol dimethyl ether).
- Typical cyclic ketones, cyclic esters and cyclic carbonates of 4 to 5 carbon atoms are also suitable (e.g., propylene carbonate).
- the alkyl and alkylene groups may each be branched or unbranched.
- fatty acid esters e.g. Rapeseed oil fatty acid methyl ester or oleic acid butyl ester.
- the solvents used for the polyisocyanate or the polyisocyanate component are either aromatic solvents, the abovementioned polar solvents or mixtures thereof. Also fatty acid esters and silicic acid esters are suitable.
- the binder systems may contain additives, for. Silanes (e.g., according to EP 1137500 B1), internal release agents, e.g. For example, fatty alcohols (e.g., U.S. 4,606,069), drying oils (e.g., U.S. 4,268,425), chelating agents (e.g., U.S. 4,547,968), and processing time extension additives (e.g., U.S. 4,540,724) or mixtures thereof.
- Silanes e.g., according to EP 1137500 B1
- internal release agents e.g.
- fatty alcohols e.g., U.S. 4,606,069
- drying oils e.g., U.S. 4,268,42
- chelating agents e.g., U.S. 4,547,968
- processing time extension additives e.g., U.S. 4,540,724
- the molding material mixture may optionally contain sand additives for casting defect prevention.
- the curing takes place by the PU cold box process.
- the catalyst of the invention i.d.R. passed through the molded molding material mixture by means of a carrier gas in gaseous form or as an aerosol. All known gassing apparatuses can be used
- the molded articles produced by the process according to the invention may per se have any shape customary in the field of foundry.
- the shaped bodies are in the form of foundry molds or cores. These are characterized by a high mechanical stability.
- the invention relates to the use of this molding for metal casting, in particular iron and aluminum casting. The invention will be explained in more detail below with reference to preferred embodiments or test examples, without being limited thereto.
- TEA TEAZTEOF
- TEA / MTMS TEA / MTMS
- DMEA (h) DMEA / TEOF (i) DMEA / MTMS (k)
- TEA TEA TEOF
- TEA / MTMS TEA / MTMS
- DMEA (h) DMEA / TEOF (i) DMEA / MTMS (k)
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mold Materials And Core Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102015102952.9A DE102015102952A1 (de) | 2015-03-02 | 2015-03-02 | Verfahren zur Aushärtung von Polyurethan-Bindemitteln in Formstoffmischungen durch Einleiten tertiärer Amine und Lösungsmittel und Kit zur Durchführung des Verfahrens |
PCT/DE2016/000092 WO2016138886A1 (de) | 2015-03-02 | 2016-03-02 | Verfahren zur aushärtung von polyurethan-bindemitteln in formstoffmischungen durch einleiten tertiärer amine und lösungsmittel und kit zur durchführung des verfahrens |
Publications (2)
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EP3265254A1 true EP3265254A1 (de) | 2018-01-10 |
EP3265254B1 EP3265254B1 (de) | 2022-02-02 |
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EP16722038.3A Active EP3265254B1 (de) | 2015-03-02 | 2016-03-02 | Verfahren zur aushärtung von polyurethan-bindemitteln in formstoffmischungen durch einleiten tertiärer amine und lösungsmittel und kit zur durchführung des verfahrens |
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EP (1) | EP3265254B1 (de) |
DE (1) | DE102015102952A1 (de) |
WO (1) | WO2016138886A1 (de) |
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CN108467279A (zh) * | 2018-05-31 | 2018-08-31 | 武汉钢铁有限公司 | 用于中间包包盖的轻量化保温浇注料及其制备方法 |
Family Cites Families (17)
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US3485797A (en) | 1966-03-14 | 1969-12-23 | Ashland Oil Inc | Phenolic resins containing benzylic ether linkages and unsubstituted para positions |
US3429848A (en) | 1966-08-01 | 1969-02-25 | Ashland Oil Inc | Foundry binder composition comprising benzylic ether resin,polyisocyanate,and tertiary amine |
FR2031636A5 (en) * | 1969-01-16 | 1970-11-20 | Plastimer | Composition for foundry sand binders and - preparation of cores and moulds by cold rapid |
GB1365094A (en) * | 1971-08-03 | 1974-08-29 | Ciba Geigy Ag | Synthetic resin compositions |
US4268425A (en) | 1979-05-14 | 1981-05-19 | Ashland Oil, Inc. | Phenolic resin-polyisocyanate binder systems containing a drying oil and use thereof |
US4540724A (en) | 1984-01-30 | 1985-09-10 | Ashland Oil Inc. | Phenolic resin-polyisocyanate binder systems containing a phosphorus halide and use thereof |
US4602069A (en) | 1984-04-11 | 1986-07-22 | Ashland Oil, Inc. | Phenolic resin-polyisocyanate binder systems containing a phosphorus based acid |
US4546124A (en) | 1984-10-12 | 1985-10-08 | Acme Resin Corporation | Polyurethane binder compositions |
US5447968A (en) | 1993-07-23 | 1995-09-05 | Ashland Inc. | Polyurethane-forming binder systems containing 2,2'-dipyridyl, 1,10-phenanthroline, and their substituted alkyl derivatives |
DE19713096A1 (de) | 1997-03-27 | 1998-10-01 | Sueddeutsche Kalkstickstoff | Ölfreie Glycerophospholipid-Formulierungen und Verfahren zu deren Herstellung |
DE19850833C2 (de) | 1998-11-04 | 2001-06-13 | Ashland Suedchemie Kernfest | Bindemittelsystem zur Herstellung von Kernen und Gießformen auf Polyurethanbasis, deren Verwendung und Verfahren zur Herstellung eines Gießformteils auf Polyurethanbasis |
DE19925115A1 (de) | 1999-06-01 | 2000-12-07 | Huettenes Albertus | Bindemittelsystem für Formstoff-Mischungen zur Herstellung von Formen und Kernen |
US6365646B1 (en) * | 1999-12-08 | 2002-04-02 | Borden Chemical, Inc. | Method to improve humidity resistance of phenolic urethane foundry binders |
WO2002060985A1 (en) * | 2001-01-31 | 2002-08-08 | Borden Chemical, Inc. | Phenolic urethane foundry binders containing methyl benzoate |
US20050020723A1 (en) | 2003-07-24 | 2005-01-27 | Chia-Hung Chen | Stabilized phenolic resole resin compositions and their use |
PL1955792T3 (pl) | 2007-01-22 | 2019-11-29 | Arkema France | Sposób wytwarzania kształtowanych rdzeni odlewniczych i odlewania metali |
EP2734320B1 (de) | 2011-07-19 | 2016-11-16 | Ask Chemicals L. P. | Verfahren zur härtung einer kaltgussform mit einem gasförmigen katalysator |
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- 2016-03-02 WO PCT/DE2016/000092 patent/WO2016138886A1/de active Application Filing
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WO2016138886A1 (de) | 2016-09-09 |
EP3265254B1 (de) | 2022-02-02 |
DE102015102952A1 (de) | 2016-09-08 |
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