EP3259708A1

EP3259708A1 - Method for producing a device comprising at least one electronic element associated with a substrate and an antenna

Info

Publication number: EP3259708A1
Application number: EP15706454.4A
Authority: EP
Inventors: François Droz
Original assignee: NID SA
Current assignee: NID SA
Priority date: 2015-02-20
Filing date: 2015-02-20
Publication date: 2017-12-27
Also published as: RU2017131527A; RU2685973C2; CN107567633A; BR112017017273A2; US10558905B2; RU2017131527A3; MX2017010502A; WO2016131499A1; US20180018548A1

Abstract

The invention relates to a method for producing a device comprising at least one electronic element (3) associated with a substrate (1) and an antenna (4). According to the invention, said method comprises the following steps: the antenna (2) is arranged on the upper face (6) of the substrate (1); the electronic element (3, 10) is at least partially introduced into the substrate (1); the assembly is laminated so as to allow the antenna (2) and the electronic element (3, 10) to entirely penetrate the substrate (1); and the press-laminated substrate (1) is cooled. The invention also relates to a the device obtained in this way, either as a finished product or a semi-finished product. The device is applicable as a chip card or in a passport.

Description

Method of manufacturing a device comprising at least one electronic element associated with a substrate and an antenna

Technical field of the invention

The present invention relates to a method of manufacturing a device comprising at least one electronic element associated with a substrate and an antenna, such a device can for example find applications as a smart card or in a passport.

The present invention also further relates to the device thus obtained, whether it is a finished product or a semi-finished product.

Background of the invention

It is known from International Application No. WO2004102469 a method of assembling an electronic component on a substrate.

Summary of the invention

The major aim of the present invention is to propose a method which makes it possible to produce a device of the same type as some of the assemblies obtained by the process proposed in the above-mentioned international application, but which notably has a lower thickness, an improved quality, in particular higher robustness, as well as lower manufacturing costs.

This object is achieved by means of a method of manufacturing a device comprising at least one electronic element associated with a substrate and an antenna, this method being unique in that it comprises the following steps:

an antenna is arranged on the upper face of a substrate; at least partially an electronic element is introduced into the substrate;

the assembly is laminated so as to allow the antenna and the electronic element to enter entirely into the substrate; and - the rolled substrate is cooled in press.

Thus, whereas in the processes of the prior art, the rolling operations serve to assemble at least two layers of material, according to the present invention, the rolling serves to introduce the antenna and the still emerging part of the electronic element entirely into the substrate, which has the advantage of providing a product consisting of a single layer in which are embedded the electronic element and the antenna. Indeed, unlike the case of standard rolling, known to date, in which the device obtained comprises an electronic element placed between the two layers of laminated material, the device according to the present invention comprises only one layer having the element fully enclosed electronics.

It follows that the device obtained is thinner than those obtained by implementing the methods of the prior art.

In addition, it uses fewer layers of material and therefore less material, which makes it easier to achieve and more economical.

In addition, it has been found better conductivity at the antenna - due to the temperature and compression of the ink particles as well as the connection between the antenna and the chip during rolling - which leads to better performance.

Brief description of the drawings

Other features and advantages of the invention will now be described in detail in the following description which is given with reference to the appended figures, which schematically represent: - Figure 1: an electronic element positioned for assembly in a substrate coated with an antenna;

FIG. 2: the electronic element-substrate-antenna assembly after assembly;

- Figure 3: the assembly of Figure 2 after rolling and before the optional application of a sealing sheet;

FIG. 4: a substrate similar to the substrate of FIG. 1;

- Figure 5: the substrate of Figure 4 after deposition of an antenna;

- Figure 6: the substrate of Figure 5 after making a hole;

FIG. 7: the introduction of an electronic element into the substrate of FIG. 6;

- Figure 8: the substrate of Figure 7 after rolling;

- Figure 9: the application of a sheet on the upper face of the substrate; and

- Figure 10: the establishment of a sealing layer on the underside of the substrate.

Detailed Description of the Invention First Embodiment

A first embodiment of the invention is shown in Figures 1 to 3. FIG. 1 shows an electronic element 3 composed of an electronic chip 4 with its connectors 5 situated above it and a support or substrate 1 having an upper face 6 on which it has been arranged in a known manner ( for example by printing) an antenna 2. The antenna 2 thus protrudes with respect to the upper face 6 of the substrate 1.

It generally has the shape of a sheet generally rectangular. Its thickness may for example be between 100 and 250 microns.

The thickness of the electronic chip 4 is generally from 75 to 150 microns and that of its connectors 5 from 8 to 50 microns. Such a set chip 4 -connectors 5 (the electronic element) is generally called "strap".

The antenna 2 generally also has a thickness of the order of 8 to 50 microns.

To move from Figure 1 to Figure 2, that is to say to remove the relief created by the antenna 2, the chip 4, connectors 5 and the insulating bridge (not shown in the figures) which serves to allow one end of the antenna 2 to reach the other end of the antenna 2 over turns of the antenna 2 in view of the connection thereof and the connectors 5 of the chip 4 without creating short circuit, the strap 3 is deposited in the substrate 1, then the assembly is laminated in a hot press which softens the substrate 1 and allows all the elements (the antenna 2, the strap 3 and the insulating bridge to penetrate). ) in the substrate 1. Then, everything is solidified by a cold press.

The rolling method therefore comprises first a pressure step at a high temperature, then a pressure step at a lower temperature).

Preferably, a pressure (or rather pressures) is used, while a hot pressure and generally followed by a pressure at cold) sufficiently strong (s) to fully penetrate the electronic element 3 in the substrate 1. In other words, the chip 4 and its connectors 5 are fully incorporated in the substrate 1.

Since the connectors 5 are in contact with a small part of the antenna 2, this part is then also driven inside the substrate 1.

To avoid that during rolling, some elements (eg the antenna 2) remain sticking on the devices that apply the pressure on the upper face 6 of the substrate 1, is generally used a sheet made of a non-stick material. Alternatively, it is also possible to use a "standard" sheet, but to have a non-stick sheet on this sheet to prevent adhesion of the rolled elements on the sheet.

This non-stick sheet, if it is used, is therefore a sheet that does not adhere to the upper face 6 of the substrate 1, nor when it is simply deposited on this face 6, nor because of the pressure exerted during rolling. . It is for example made of a teflon sheet.

Thus, after the rolling and removal of this release sheet (if it has been used), we obtain the device that can be seen in Figure 3. As can be seen, the electronic element 3 with its chip 4 and the connectors 5 and the antenna 2 are completely incorporated in the substrate 1.

Second embodiment

According to a second embodiment, an electronic element 10 generally called "electronic module" is used which is composed of an electronic chip connected to a "lead frame", the chip being coated with a mechanical protective coating.

We then proceed as shown in FIGS. 4 to 8: starting from a substrate 1 which can in this case consist in particular of plastic or cardboard of appropriate rigidity (FIG 4);

- As in the first embodiment, there is an antenna 2 (FIG 5) on the upper face 6 of the substrate 1, for example by printing;

in the upper face 6 of the substrate 1, a generally open hole 9 is made (FIG.6) in order to accommodate a portion of the electronic module 10;

the electronic module 10 is introduced in the opening hole 9 (FIG 7), a small portion of the antenna 2 in contact with the side plates of the lead frame then being also inserted into the substrate 1; the lead frame at least partially projecting from the upper face 6 of the substrate 1; and - rolling is carried out as explained in the first embodiment to drive or finish driving the lead frame and the rest of the antenna 2 in the substrate 1 (Figure 8).

This gives a substrate 1 with a perfectly smooth upper face 6, comprising completely the antenna 2 and the module

electronic 10.

It is important to note that, during the rolling step, the particles of the ink of the antenna 2 are compressed, which leads to better performance at the level of the conductivity.

As with the method according to the first embodiment of the present invention, it is again possible to use a sheet made of a non-stick material during rolling. Alternatively, it is also possible to use a "standard" sheet, but to have a non-stick sheet on this sheet to prevent adhesion of the rolled elements on the sheet.

The dimensions of the through hole 9 can be provided so that it only houses the chip of the electronic module 10 with its coating. It is also possible to provide an additional step to enable the electronic module 10 to be fixed on the substrate 1, in particular when the substrates 1 with the antennas 2 and the electronic modules 10 are moved towards the rolling machine (hence between FIG. and Fig. 8). In this case, for example, an adhesive layer may be applied between the substrate 1 and the electronic module 10. Alternatively, the electronic module 10 may also be forced into the through-hole 9 in order to remain attached thereto.

The device obtained as indicated in the aforementioned embodiments is a semi-finished product.

In an alternative variant of the method, the through hole 9 is not made in the substrate 1 before rolling. Indeed, in certain cases, it would also be possible to proceed with the rolling of the substrate 1 only with the antenna 2 and to use the plates with appropriate reliefs in order to create cavities (blind holes) in the places provided for the insertion of the electronic element 10.

In this case, the substrates 1 with the antenna 2 introduced into the substrate 1 and the housing cavities provided for the electronic elements 10 in the substrate 1 can be used as semi-finished products. Then, the electronic elements 10 can be inserted into the cavities and either rolled again or fixed in the cavities with an adhesive or the like.

In any case, the thickness of the substrate 1 is preferably slightly greater than that of the electronic element 3 or 10 so that during the rolling step, this electronic element 3 or 10 can fully penetrate into the substrate .

The semi-finished product is therefore without relief both on the side of the upper face 6 than on the lower face 8, this making it possible to produce thinner and more flexible products, which considerably increases their quality, in particular because such products are more resistant to bending and deformation. The incorporation, in the mass of the substrate, of the element 3 or 10 electronics as well as antenna 2 provides a semifinished product thinner, more robust and less expensive.

In some cases, the semi-finished product can be converted into a finished product, by providing an additional step of applying a sealing layer (or film) 7 (see Figs 3 and 10) on the upper face 6 and / or the lower face 8 of the substrate 1 to protect the latter against any penetration of moisture that could change the desired characteristics of the final product.

Thus, a smart card such as an RFID card can be made, which can be a card for transport, payment, access to a place, access to a service, or in a non-limiting manner an electronic passport, etc. ., the chip / antenna assembly forming a transponder.

One can also provide another additional step visible in Figure 9, which consists in depositing a layer of adhesive 12 on all or part of the upper face 6 of the substrate 1 before applying a cover 1 1 (for example for the realization an electronic document). The nature of this cover 1 1 depends on the intended use of the finished product, which may be for example an identity document such as a passport, an identity card or a residence permit.

By adding to the device of Figures 3 or 8 a sheet of paper on the upper face and another on the underside of the substrate, there is obtained for example an "electronic ticket" or other valuable document.

It goes without saying that the device may comprise several electrical elements each having an antenna or a common antenna.

The position of the element or elements can of course be adapted depending on the product to achieve to meet the mechanical stresses of the product. Although various embodiments have been described, it is well understood that it is not conceivable to exhaustively disclose all possible embodiments. It is of course conceivable to replace a means described by equivalent means without departing from the scope of the present invention. All these modifications are part of the common knowledge of a person skilled in the technological field of manufacturing the semi-finished products and end products described.

Claims

claims

1. A method of manufacturing a device comprising at least one electronic element (3, 10) associated with a substrate (1) and an antenna (2), comprising the following steps:

the antenna (2) is arranged on the upper face (6) of the substrate (1);

at least partially the electronic element (3, 10) is introduced into the substrate (1); the assembly is laminated so as to allow the antenna (2) and the electronic element (3, 10) to enter entirely into the substrate (1); and

the cooled substrate (1) is cooled in press.

2. The method of claim 1, wherein the antenna (2) is printed on said upper face (6) of the substrate (1).

3. The method of claim 2, wherein during the rolling step, the ink particles of the antenna (2) are compressed, resulting in better performance at the conductivity.

4. Method according to one of the preceding claims, wherein the electronic element (3) is a strap.

5. Method according to one of claims 1 to 3, wherein the electronic element (10) is an electronic module.

6. Method according to claim 4, wherein the introduction of the electronic element (3) into the substrate (1) is carried out by pressure at an elevated temperature.

7. Method according to one of claims 1 to 3, characterized in that it further comprises a step in which one carries out in the face upper (6) of the substrate (1) a hole (9) and in that the electronic element (3, 10) is introduced at least partially into this hole (9).

The method of claim 7, wherein the hole (9) is a through hole.

9. The method of claim 7 or 8, wherein the coating of the electronic element (3) is fixed in the hole (9) by force introduction.

10. Method according to one of the preceding claims, wherein before rolling, an anti-adherence sheet is applied to the upper face (6) of the substrate (1) and, after cooling, removing the anti-adhesion sheet.

1 1. The method of one of the preceding claims, wherein the release sheet is a polymer sheet or a teflonized sheet.

12. Method according to one of the preceding claims, comprising an additional step of applying a sealing layer (7) on the underside (9) and / or on the upper face (6) of the substrate (1). .

13. Method according to one of the preceding claims, comprising an additional step of applying a cover (1 1) on the upper face (6) of the substrate (1).

14. Product obtained by the implementation of the method according to one of claims 1 to 13.

A chip card comprising a product according to claim 14.

16. Smart card according to claim 15, this card being a transport card, a payment card, a card for access to a place or a card for access to a service.

17. Identity document or electronic ticket comprising a product according to claim 14.