EP3255362B1 - Réfrigérateur de refroidissement à semi-conducteur - Google Patents

Réfrigérateur de refroidissement à semi-conducteur Download PDF

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Publication number
EP3255362B1
EP3255362B1 EP15880937.6A EP15880937A EP3255362B1 EP 3255362 B1 EP3255362 B1 EP 3255362B1 EP 15880937 A EP15880937 A EP 15880937A EP 3255362 B1 EP3255362 B1 EP 3255362B1
Authority
EP
European Patent Office
Prior art keywords
pipe
semiconductor refrigerator
main pipe
hot end
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15880937.6A
Other languages
German (de)
English (en)
Other versions
EP3255362A1 (fr
EP3255362A4 (fr
Inventor
Haibo TAO
Kui Zhang
Jianru Liu
Peng Li
Chunyang Li
Feifei QI
Lisheng JI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of EP3255362A1 publication Critical patent/EP3255362A1/fr
Publication of EP3255362A4 publication Critical patent/EP3255362A4/fr
Application granted granted Critical
Publication of EP3255362B1 publication Critical patent/EP3255362B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Definitions

  • EP0592044A2 discloses a refrigerator according to the preamble of claim 1.
  • One object of the present invention is to overcome at least one defect of an existing semiconductor refrigerator by providing a semiconductor refrigerator with high heat radiation efficiency.
  • the present invention provides a semiconductor refrigerator comprising a semiconductor cooling plate and a hot end heat radiating device, wherein the hot end heat radiating device comprises multiple sintered heat pipes, each having a main pipe with both ends closed, wherein the main pipe comprises a first pipe segment thermally connected with a hot end of the semiconductor cooling plate, and a second pipe segment, which is located above the first pipe segment, and from whose one or more portions extend one or more manifolds to radiate heat from the hot end of the semiconductor cooling plate to an ambient environment.
  • each plate fin is provided with a receiving through hole so that each fin group defines a receiving space extending along the axes of the receiving through holes;
  • the hot end heat radiating device further comprises one or two blowers respectively provided in the receiving spaces of the corresponding fin groups and configured such that air flow is sucked from an air inlet area of each blower and is blown to a gap between each two adjacent plate fins of the corresponding fin group.
  • the hot end heat radiating device is configured to radiate the heat from the hot end of the semiconductor cooling plate 150 to ambient air.
  • the hot end heat radiating device may comprise multiple sintered heat pipes 200, each having a main pipe 210 with both ends closed.
  • the main pipe 210 may comprise a first pipe segment 211 and a second pipe segment 212 located above the first pipe segment 211.
  • the first pipe segment 211 is thermally connected with a hot end of the semiconductor cooling plate 150.
  • one or more manifolds 220 extend from one or more portions of the second pipe segment 212 to radiate the heat from the hot end of the semiconductor cooling plate 150 to an ambient environment, which considerably improves the heat radiating efficiency of the semiconductor refrigerator.
  • the length of the connecting pipe segment 213 of one sintered heat pipe 200 at one side of the geometrical symmetry plane is smaller than that of the connecting pipe segment 213 of the other sintered heat pipe 200 at the same side of the geometrical symmetry plane, so that the four sintered heat pipes 200 are reasonably arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (10)

  1. Réfrigérateur à semi-conducteur, comprenant une plaque de refroidissement à semi-conducteur (150) et un dispositif de rayonnement de chaleur d'extrémité chaude, dans lequel le dispositif de rayonnement de chaleur d'extrémité chaude comprend de multiples caloducs frittés (200), ayant chacun un tuyau principal (210) avec les deux extrémités fermées,
    dans lequel le tuyau principal (210) comprend un premier segment de tuyau (211) raccordé thermiquement à une extrémité chaude de la plaque de refroidissement à semi-conducteur, et un second segment de tuyau (212), qui est situé au-dessus du premier segment de tuyau (211), et depuis une ou plusieurs portions de celui-ci s'étendent un ou plusieurs collecteurs (220) pour rayonner de la chaleur depuis l'extrémité chaude de la plaque de refroidissement à semi-conducteur (150) vers un environnement ambiant.
  2. Réfrigérateur à semi-conducteur selon la revendication 1, dans lequel le premier segment de tuyau (211) du tuyau principal (210) est formé en s'étendant depuis une extrémité inférieure du tuyau principal à la verticale vers le haut d'une longueur prédéterminée, et
    les premiers segments de tuyau (211) de multiples tuyaux principaux sont situés dans le même plan en parallèle et avec des écartements entre eux, le plan étant parallèle à une paroi arrière d'une cuve intérieure (100) du réfrigérateur à semi-conducteur.
  3. Réfrigérateur à semi-conducteur selon la revendication 1, dans lequel le dispositif de rayonnement de chaleur d'extrémité chaude comprend en outre :
    une plaque de dessous fixe (310) dont la surface avant est raccordée thermiquement à l'extrémité chaude de la plaque de refroidissement à semi-conducteur (150) et dont la surface arrière est pourvue d'une ou de plusieurs rainures ; et
    une plaque couvrante fixe (320) dont la surface avant est pourvue d'une ou de plusieurs rainures et qui est configurée pour coopérer avec la plaque de dessous fixe (310) pour serrer le premier segment de tuyau (211) du tuyau principal (210) entre les rainures de la plaque couvrante fixe et de la plaque de dessous fixe.
  4. Réfrigérateur à semi-conducteur selon la revendication 1, dans lequel le second segment de tuyau (212) du tuyau principal est formé en s'étendant depuis une extrémité supérieure du tuyau principal à la verticale vers le bas d'une longueur prédéterminée, et les seconds segments de tuyau (212) de multiples tuyaux principaux sont situés dans le même plan en parallèle et avec des écartements entre eux, le plan étant parallèle à la paroi arrière de la cuve intérieure (100) du réfrigérateur à semi-conducteur ; ou
    le second segment de tuyau (212) du tuyau principal est formé en s'étendant depuis l'extrémité supérieure du tuyau principal longitudinalement vers l'avant d'une longueur prédéterminée puis à la verticale vers le bas d'une longueur prédéterminée, les portions verticales des seconds segments de tuyau (212) des multiples tuyaux principaux sont situées dans le même plan en parallèle et avec des écartements entre elles, le plan étant parallèle à la paroi arrière de la cuve intérieure (100) du réfrigérateur à semi-conducteur, et une extrémité de départ du collecteur (220) du caloduc fritté (200) est située au niveau de la portion verticale d'un second segment de tuyau (212) correspondant.
  5. Réfrigérateur à semi-conducteur selon la revendication 1, dans lequel le collecteur (220) du caloduc fritté (200) est perpendiculaire à la paroi arrière de la cuve intérieure (100).
  6. Réfrigérateur à semi-conducteur selon la revendication 1, dans lequel les collecteurs de chaque caloduc fritté sont situés du même côté du tuyau principal (210) correspondant, ou sont situés des côtés opposés du tuyau principal (210) correspondant respectivement.
  7. Réfrigérateur à semi-conducteur selon la revendication 6, dans lequel le dispositif de rayonnement de chaleur d'extrémité chaude comprend en outre : un ou deux groupes d'ailettes (400), chaque groupe d'ailettes comprenant de multiples plaques-ailettes correspondantes qui sont agencées en parallèle et avec des écartements entre elles, et chaque groupe d'ailettes est installé au niveau d'un collecteur (220) sur un côté correspondant du tuyau principal via des orifices de tuyau des plaques-ailettes respectives.
  8. Réfrigérateur à semi-conducteur selon la revendication 7, dans lequel le dispositif de rayonnement de chaleur d'extrémité chaude comprend en outre : une soufflante (500) agencée d'un côté transversal des multiples collecteurs (220) ou au-dessus de ceux-ci et configurée de sorte qu'une zone d'entrée d'air de la soufflante aspire un flux d'air et le flux d'air est soufflé sur un écartement entre deux plaques-ailettes adjacentes, ou le flux d'air est aspiré depuis l'écartement entre deux plaques-ailettes adjacentes et est ensuite soufflé sur la zone d'entrée d'air.
  9. Réfrigérateur à semi-conducteur selon la revendication 7, dans lequel la portion milieu de chaque plaque-ailette est pourvue d'un trou traversant de réception de sorte que chaque groupe d'ailettes définisse un espace de réception s'étendant selon les axes des trous traversants de réception ; et
    le dispositif de rayonnement de chaleur d'extrémité chaude comprend en outre une ou deux soufflantes (500) prévues respectivement dans les espaces de réception des groupes d'ailettes (400) correspondants et configurées de sorte qu'un flux d'air soit aspiré depuis une zone d'entrée d'air de chaque soufflante (500) et soit soufflé sur un écartement entre deux plaques-ailettes adjacentes du groupe d'ailettes (400) correspondant.
  10. Réfrigérateur à semi-conducteur selon la revendication 5, dans lequel le dispositif de rayonnement de chaleur d'extrémité chaude comprend en outre : de multiples ailettes spiralées (450) installées chacune en spirale sur un collecteur (220) correspondant, et une soufflante (500) agencée d'un côté transversal des multiples collecteurs ou au-dessus de ceux-ci de sorte que les collecteurs de chaque caloduc fritté (200) soient situés au niveau d'une zone d'entrée d'air ou d'une zone d'aspiration d'air de la soufflante (500).
EP15880937.6A 2015-02-03 2015-09-29 Réfrigérateur de refroidissement à semi-conducteur Active EP3255362B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510055838.5A CN104729182B (zh) 2015-02-03 2015-02-03 半导体制冷冰箱
PCT/CN2015/091094 WO2016123995A1 (fr) 2015-02-03 2015-09-29 Réfrigérateur de refroidissement à semi-conducteur

Publications (3)

Publication Number Publication Date
EP3255362A1 EP3255362A1 (fr) 2017-12-13
EP3255362A4 EP3255362A4 (fr) 2018-08-29
EP3255362B1 true EP3255362B1 (fr) 2019-11-13

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EP15880937.6A Active EP3255362B1 (fr) 2015-02-03 2015-09-29 Réfrigérateur de refroidissement à semi-conducteur

Country Status (4)

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US (1) US20170328610A1 (fr)
EP (1) EP3255362B1 (fr)
CN (1) CN104729182B (fr)
WO (1) WO2016123995A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104729182B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 半导体制冷冰箱
US11136125B2 (en) * 2017-03-29 2021-10-05 Rockwell Collins, Inc. Liquid chilled galley bar unit
JP6640401B1 (ja) * 2019-04-18 2020-02-05 古河電気工業株式会社 ヒートシンク
CN112856615B (zh) * 2021-01-07 2022-06-24 施斌卿 除湿机防结冰控制方法及除湿机
CN115164493A (zh) * 2022-07-15 2022-10-11 青岛海容商用冷链股份有限公司 风冷式半导体冷冻柜及其控制方法

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Also Published As

Publication number Publication date
CN104729182A (zh) 2015-06-24
CN104729182B (zh) 2016-11-23
EP3255362A1 (fr) 2017-12-13
US20170328610A1 (en) 2017-11-16
EP3255362A4 (fr) 2018-08-29
WO2016123995A1 (fr) 2016-08-11

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