EP3240360A1 - Connecteur - Google Patents

Connecteur Download PDF

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Publication number
EP3240360A1
EP3240360A1 EP17168859.1A EP17168859A EP3240360A1 EP 3240360 A1 EP3240360 A1 EP 3240360A1 EP 17168859 A EP17168859 A EP 17168859A EP 3240360 A1 EP3240360 A1 EP 3240360A1
Authority
EP
European Patent Office
Prior art keywords
connector
substrate
mounting portion
solder
fragile substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17168859.1A
Other languages
German (de)
English (en)
Inventor
Richard Barton
Christoph Karl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Strip Tinning Ltd
Original Assignee
Strip Tinning Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Strip Tinning Ltd filed Critical Strip Tinning Ltd
Publication of EP3240360A1 publication Critical patent/EP3240360A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H01R4/625—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means

Definitions

  • This invention relates generally to a connector. More specifically, although not exclusively, this invention relates to a connector for facilitating electrical connection between a source of electrical power and a site of use of electrical power.
  • a busbar (for example a silver printed busbar) may be provided on the surface of a fragile substrate to provide an electrical pathway for the dispersal of electrical power.
  • a connector may be soldered to the busbar in order to provide an electrical connection to a source of electrical power and/or to electrical components. To effect the connection, solder is brought into contact with the busbar and it is heated, melts and re-solidifies. As the melt-solidification process is undertaken it is necessary to ensure that the thermal and mechanical stresses exerted upon the fragile substrate do not cause damage.
  • lead-based solders have been used to facilitate the solder connection between a fragile substrate such as glass (for example a windscreen) and a connector. Because lead-based solders are ductile the differences between the thermal expansion of the glass and the connector can be accommodated by the lead-based solder. However, in recent times there has been a move (or a desire to move) away from lead-based solder materials. Whilst non-lead-based (lead-free) solder materials are known and have been used it is understood that such materials are less ductile than the lead-based materials they are proposed to replace or have replaced. As such differences in the thermal expansion coefficients of the glass (8 - 10 x 10 -6 m/m°C) and the connector are exacerbated.
  • EP1942703 proposes a connector which uses titanium. However, in order to achieve adequate stability and processability it is proposed to use an excess of solder material which, in use can cause high mechanical stresses in the glass pane.
  • US2015/0296615 discloses a two-part connector, a bridge part formed of copper and a connection part for contacting the glass substrate fabricated from a chrome-containing steel with a coefficient of thermal expansion which is similar to that of glass. Clearly the use of different materials requires complex manufacturing steps.
  • the operating conditions experienced by a motor vehicle are harsh.
  • the expected lifetime of a motor vehicle is long and a motor vehicle has to be capable of operating in diverse environments.
  • it is subject to large seasonal and daily variations in temperature, humidity, as well as exposure to pollutants, cleaning products, salt (for example as a result of road clearing during winter) and so forth.
  • the components which are used in motor vehicles need to be able to withstand such environments and changing conditions across their lifespan, or at least in terms of the prevailing warranty.
  • This means that the components which are used in motor vehicles are rigorously tested and have to be fit-for-purpose, especially where those components are not easily changed after installation. It is a requirement that the components do not become susceptible to failure when exposed to environmental agents and/or the chemicals which are prevalent (salt, cleaning fluids and so on).
  • a first aspect of the invention provides a connector for providing an electrical connection to a fragile substrate, the connector comprising a first and a second mounting portion for engaging a fragile substrate and a connection portion between the first and second mounting portions and for making an electrical connection to the connector, each mounting portion comprising a first surface for facing the fragile substrate in use and, preferably, at least a pair of lugs or spacers extending from the first surface to space the first surface from the fragile substrate in use, the connector being formed from an alloy of iron having a coefficient of thermal expansion of from 10 x 10 -6 m/m°C to 16 x 10 -6 m/m°C and an electrical conductivity of greater than 4 x 10 6 S/m.
  • the material to have an electrical conductivity of less than 50 x 10 6 S/m.
  • connection portion provides a bridge between the first mounting portion and second mounting portion, the bridge preferably being spaced from the fragile substrate, in use.
  • a connector which is fit for purpose i.e. is suitable for use
  • which does not have a high failure rate, which is installable without causing damage, is readily processable and which is cheap to produce is desirable.
  • the connector of the invention fulfils at least most, if not all, of these desiderata.
  • a solder preform may be provided in friction fit engagement with the mounting portion.
  • the lugs or spacers may engage the solder preform. Frictional engagement between the mounting portion and the solder preform is beneficial because it means that a pre-determined amount of solder can be used, the location of the solder preform can be tightly controlled and the properties of the solder are known before installation and remain known once installed.
  • a connector for electrical connection to a fragile substrate comprising a first mounting portion for engaging a fragile substrate and a connection portion for making an electrical connection to the connector, the first mounting portion comprising a first surface for facing the fragile substrate in use and a solder preform in friction fit engagement with the first mounting portion.
  • the connector may comprise one or more lugs or spacers extending from the first surface to space the first surface from the fragile substrate in use and the solder preform may be in friction fit relations with the one or more lugs or spacers extending from the first surface.
  • the first surface may a surface area A and the solder preform may have a major surface with a surface area As and preferably A > As.
  • the volume of solder V s should preferably and advantageously be no more than twice the volume defined between the fragile substrate and the facing surface of the mounting portion (V), and preferably less than 1.9, 1.8, 1.7, 1.6 or 1.5 times.
  • the first mounting portion may be connected to the connecting portion via a ramp portion.
  • the connection portion may be located further from the fragile substrate than is the mounting portion.
  • Free ends of the mounting portion are preferably radiused. We have found this to be beneficial because it appears to spread stress in the fragile substrate (as compared to right angled junctures), for example when the connector is secured thereto by heating, melting and re-solidifying a solder material.
  • the connector may further comprise a second or further mounting portion.
  • the second or further mounting portion may be joined to the mounting portion by the connection portion.
  • the connection portion provides a bridge between the first mounting portion and second or further mounting portion, the bridge preferably being spaced from the fragile substrate, in use.
  • a yet further aspect of the invention comprises a connector for electrical connection to a fragile substrate, the connector comprising a first mounting portion and a second mounting portion connected together by a connection portion for making an electrical connection to the connector, the first and second mounting portion each comprising a first surface for facing the fragile substrate in use and plural lugs or spacers extending from each first surface to space each first surface from the fragile substrate in use.
  • the mounting portions and connection portion may be provided on the same axis, the principal axis.
  • Each mounting portion may comprise two lugs of spacers.
  • a line drawn through the lugs or spacers on one of the mounting portions may extend at an obtuse angle to the principal axis, e.g. at an angle of about 135°.
  • connection portion may comprise a pair of ramps, one of the ramps extending away from each of the first and second mounting portions to a central bridge.
  • Each of the first and second mounting portions may be provided with a solder preform, preferably in friction fit with the lugs or spacers, for example to retain the solder preform in place.
  • the free edges of the first and second mounting portions are preferably radiused.
  • the connector may be fabricated from a substrate material and coated in a solderable material, for example, silver.
  • the connector may be formed, at least principally, from steel, for example carbon steel
  • a carbon steel with a relatively high conductivity for example carbon steel designated as DC01, which typically has a maximum carbon content (C max ) of 0.08% to 0.13%.
  • Other carbon steels, such as CS1 (DC04) (C max 0.03 - 0.06%) or CS3 (DCO3) (C max 0.04 - 0.08%) grades may also be used.
  • the substrate is less than 5, 4, 3 or 2mm thick, for example less than 1 mm thick, and is provided with a top coat, preferably formed by a fine layer of silver.
  • a flash coat may be provided between the top coat and the substrate.
  • a flash coat may comprise a copper layer and/or a nickel layer.
  • the top coat is a solderable layer, for example silver, it is most preferred to friction fit the solder layer to the mounting portion. If the solder is installed on the mounting portion by heating and solidifying, it will tend to dissolve some of the silver from the top layer and thereby increase the proportion of silver within the solder, which will increase hardness and/or melting point.
  • the substrate may be greater than 0.1 mm thick, preferably greater than 0.2mm thick. For example the substrate may be greater than 0.3, 0.4, 0.5, 0.6 or 0.7mm thick.
  • the solder preform is preferably lead-free.
  • the solder preform may comprise one of more of silver, tin, bismuth, indium, copper.
  • the solder may be formed from tin and silver.
  • the solder preform may be formed of tin, silver and bismuth.
  • a further aspect of the invention provides a method of forming a connector, the method comprising the steps of providing a length of iron alloy with a coefficient of thermal expansion of from 10 x 10 -6 m/m°C to 16 x 10 -6 m/m°C and an electrical conductivity of greater than 4 x 10 6 S/m; forming the length of electrically conductive material into a connector comprising a first and second mounting portion and a connecting portion, where each mounting portion has a mounting surface defining a common plane and the connecting portion has a substrate facing surface which is spaced from the plane; and, preferably, providing one or more lugs or spacers on each mounting portion.
  • the method may further comprise step d) forming the length of electrically conductive material from a sheet of electrically conductive material.
  • the electrically conductive material or the connector is provided with a flash coat and/or a top coat.
  • the method may further comprise step e) providing a solder preform, and a step f) retaining the solder preform in position by a friction fit.
  • carbon steel is an eminently suitable material in terms of processability, performance, failure rate, low potential for damage to the underlying fragile substrate and cost. Indeed, we have found carbon steel DC01 to be a particularly suitable material for the connectors of the invention.
  • a connector 1 having a first and second mounting portion 2, 3 connected by a bridging portion 4.
  • the bridging portion 4 comprises a pair of ramp portions 4a and a connection portion 4b.
  • the connector 1 is integrally formed from a single sheet of substrate material S, which may be steel, for example carbon steel or another iron alloy having a coefficient of thermal expansion of from 10 x 10 -6 m/m°C to 16 x 10 -6 m/m°C and an electrical conductivity of greater than 4 x 10 6 S/m.
  • the CTE of carbon steel is about 11.7 x 10 -6 m/m°C and the electrical conductivity of some carbon steels is 5.9 x 10 6 S/m.
  • the sheet may be thin, for example less than 2 mm thick, say less than 1 mm thick and in some embodiments is about 0.8 mm thick.
  • the connector 1 may be 24 mm long by 4 mm wide in plan.
  • the outer surface of the substrate material S may be coated with a flash coat F and/or a top coat T.
  • the flash coat F may comprise a fine layer (e.g. 0.1 to 10 ⁇ m thick, for example less than 5 ⁇ m thick and preferably about 2 ⁇ m thick) of copper Cu, to which is coated a fine layer of nickel Ni
  • the top coat T may comprise a fine (e.g.
  • the copper layer Cu provides a surface to which the nickel layer Ni more readily bonds (with respect to a steel surface).
  • the nickel layer Ni provides enhanced protection from corrosion.
  • the silver layer Ag, on the outer surface, enhances the solderability of the connector 1 whilst providing further resistance to corrosion.
  • the use of steel is advantageous because of its cost and strength.
  • the use of a flash coat F and/or top coat T allows for the properties of the substrate material S to be modified so as to be fit for purpose.
  • the mounting portions 2, 3 each comprise a substantially flat substrate facing surface 2a, 3a and are generally rectangular in plan, each having a free end 2b, 3b, a connected end 2c, 3c and two sides 2d, 3d.
  • the corners 2e, 3e at the juncture of the free end 2b, 3b and respective sides 2d, 3d are radiused (in plan), which may be to a radius of less than 1.0mm, say 0.5 mm.
  • the substrate facing surfaces 2a, 3a of the mounting portions 2, 3 are positioned and aligned such that together they may define a plane P.
  • Each substrate facing surface 2a, 3a defines a first surface area.
  • the mounting portion 2, 3 may be 6 mm long from free end 2b, 3b to connected end 2c, 3c and may be 4 mm wide from side to side 2d, 3d.
  • each lug 5 Extending from the substantially flat substrate facing surface 2a, 3a are two lugs 5 which may be generally circular in plan and are each spaced from the sides 2d, 3d and from the ends 2b, 2c, 3b, 3c.
  • the centre of each lug 5 may be located 1.0 mm inboard of an adjacent edge 2d, 3d and/or 1.5 mm inboard of an adjacent end 2b; 3b; 2c; 3c.
  • the centre of a lug 5 is located about 20-40% along the length of the mounting portion 2, 3 from an adjacent end, 2b, 2c, 3b, 3c most preferably 20-30% (e.g. 25%) along the length of the mounting portion 2, 3 as measured from an adjacent end 2b; 2c; 3b; 3c.
  • the lugs 5 may extend from the substantially flat substrate facing surface 2a, 3a by a distance e of between 0.05 mm and 0.15 mm.
  • the lugs 5 are preferably integrally formed with the mounting portions 2, 3 and may be formed by pressing operation acting against the surface obverse to the substrate facing surface 2a, 3a.
  • lugs 5 (two on each mounting portion 2,3) provides a stable platform when positioned on a surface and that an inwardly (or outwardly) flaring arrangement (as shown) is both particularly stable and affords the connector 1 a degree of directionality.
  • the handedness or directionality is beneficial because in use a connector wire is connected by soldering to the connection portion 4b and having the lugs flaring inwardly ensures that the broadest platform at least helps to resist any rotational moment applied by the connector wire.
  • the use of two lugs is capable of providing a good frictional engagement with a solder preform and/or is readily fabricated.
  • the bridging portion 4 comprises a connection portion 4b or connection member 6 which is substantially rectangular in plan and is joined to the connected end 2c of the first mounting portion 2 by a first connecting arm 7a, as a ramp portion 4a, extending from the first end 6a of the connection member 6.
  • a second connecting arm 7b, as a ramp portion 4a extends from the second end 6b of the connection member 6 and joins the connection member 6 to the connected end 3c of the second mounting portion 3.
  • the joining locations between the first and second connecting arms 7a, 7b and the connection member 6 and the mounting portions 2, 3 may be radiused, where the radius may in each location be about 0.5 mm.
  • the bridging portion 4 may be 12 mm long in plan whist the connection member 6 may be 6 mm long in plan, with both preferably being 4 mm wide.
  • connection member 6 has a substantially flat substrate facing surface 6c which is parallel to the plane P of the substrate facing surfaces 2a, 3a of the mounting portions 2, 3, but is spaced therefrom by a distance d which may be 1 mm.
  • a connection surface 6d is defined obverse to the substrate facing surface 6c of the connection member 6.
  • solder preform 8 having a generally rectangular shape in plan and formed from a lead-free solder material (e.g. Sn3Ag).
  • the solder preform 8 has a first major surface 8a defining a solder surface area As, which is configured to be less than the first surface area of the mounting portions 2, 3.
  • the solder preform 8 may have a length of 5 mm and a width of 3.5 mm in plan and, say, a thickness of 0.2 mm.
  • FIG. 3 there is shown a connector 10 according to a second embodiment of the invention, the connector 10 comprising a connector 1 as shown in Figures 1A and 1B and solder preforms 8 as shown in Figure 2 .
  • the solder preforms 8 are retained in position on the mounting portions 2, 3 of the connector 1 by pushing a major surface 8a of the solder preforms 8 against the lugs 5 of the mounting portions 2, 3 (or vice versa).
  • the relatively soft material of the solder preforms 8 deforms against the lugs 5 until the major surface 8a of the solder preforms 8 are adjacent the substrate facing surface 2a, 3a of the mounting portions 2, 3.
  • the solder preforms 8 are, at least temporarily, held in place via friction against the lugs 5.
  • the solder preforms 8 are positioned so that their peripheral edges are preferably inboard of the free end 2b, 3b, connecting end 2c, 3c and sides 2d, 3d of the mounting portions 2, 3.
  • the connector 10 is presented against a fragile substrate FS, e.g. a glass substrate (see Figure 4A ). Heat is transmitted to the solder preforms 8 causing them to melt and flow between the fragile substrate FS and the substrate facing surface 2a, 3a of the mounting portions 2, 3. Heat is then removed from the solder material 8a causing it to solidify and hence secure the connector 10 to the fragile substrate FS (as shown in Figure 4B ).
  • a bead of solder BS may form adjacent the connected end 2c, 3c of the mounting portions 2, 3, where the bead of solder BS enhances the pull-off strength of the attachment of the connector 10 to the fragile substrate FS.
  • solder material 8' does not extend beyond the free end 2b, 3b, and sides 2d, 3d of the mounting portions 2, 3. This is achieved through a combination of: carefully selecting the volume of solder material 8' in the solder preform 8 relative to the first surface area of the substrate facing surface 2a, 3a of the mounting portions 2, 3; capillary forces acting upon the molten solder material 8'; and the distance e by which the lugs 5 extend, which provide a minimum clearance distance between the fragile substrate FS and the substrate facing surface 2a, 3a of the mounting portions 2, 3.
  • the "bridge" design of the connector 10 results in reduced localised temperatures being generated in an attached fragile substrate FS during the soldering of the connecting surface 6d of the connection member 6 to the fragile substrate FS. In such a way damage to the fragile substrate FS is beneficially reduced.
  • connection member 6 When secured to the fragile substrate FS the substrate facing surface 6c of the connection member 6 is spaced from said fragile substrate FS (as shown in Figure 4B ). Therefore, application of heat to the connection member 6 will not be directly conducted through the thickness of the connection member 6 and hence into the fragile substrate FS. Instead, a small portion of the heat will radiate from the connection member 6 whilst the remainder will conduct into the first and second mounting portions 2, 3 and thence into the fragile substrate FS. However, the combined surface area of contact between the mounting portions 2, 3 and the fragile substrate FS (via the solder material 8') is significantly larger than the surface area of the substrate facing surface 6c of the connection member 6.
  • the lugs 5 distance the connector 10 from the fragile substrate FS. This is beneficial because the connector 10 typically will have a higher coefficient of thermal expansion (CTE) than the fragile substrate FS and the spacing afforded by the lugs 5 reduces stress in the fragile substrate upon thermal cycling when heating and cooling the solder material 8 to secure the connector 10.
  • CTE coefficient of thermal expansion
  • the corners of the bridging member are radiused.
  • the value of the radius may be selected based upon the length and/or width of the connector. The applicant has found that by radiusing the corners, stresses generated in an attached fragile substrate are relatively reduced with respect to connectors with sharp corners. Without wishing to be bound by any theory it is believed that relatively sharp corners act as stress concentrators with respect to attached fragile substrate. Therefore, by radiusing the corners these stress concentrators are at least partially mitigated and hence stress generated in the fragile substrate is reduced.
  • connection i.e. a mechanically and/or electrically robust connection
  • materials are fit-for-purpose and there is sufficient material for the connector 10 to operate.
  • a fragile substrate FS such as a glass (and, in particular, a silvered glass surface) it is necessary to ensure that damage does not occur.
  • a more robust connection is likely to be provided using more solder and/or over a greater facing surface area.
  • the connector 1 is preferably manufactured by press forming a substrate material to the required shape, coating the substrate with a flash coat and a top coat and stamp forming the lugs.
  • the lugs may be formed prior to coating, for example as part of the press forming operation or shortly thereafter. It is also possible to form the connector 1 from a sheet of material which is provided with a protective coating, form individual connectors 1 from the sheet and then treat and newly exposed surfaces.
  • a solder preform 8 is then engaged with the lug 5 bearing surface of the mounting portions 2,3 to effect a frictional engagement.
  • the connector 10 is located at a site of use, which is typically a silvered portion of a fragile substrate FS (the silver acting as a busbar) and heat is conducted to the solder 8 whilst an engaging force may be applied to the connector 10 to ensure an intimate relation with the fragile substrate FS. Once the heat is reduced, and the solder 8' has solidified, the connector 10 is secured to the fragile substrate FS.
  • a lead, copper braid or other conducting member L and so on is preferably secured to the bridge portion 6 by solder Ls (or other securing means such as adhesive).
  • a series of 32 connectors1 was fabricated, in accordance with the above description and as shown in Figures 1A and 1B .
  • the connector was made from an iron alloy having a coefficient of thermal expansion of about 12 x 10 -6 m/m°C and an electrical conductivity of about 10 x 10 6 S/m.
  • the connectors 1 were provided with a solder preform 8 comprising Sn3.5Ag (T M - 221 °C) solder.
  • the connectors were secured to a double silver layer of automotive glass using either blown hot air (an indirect method) or resistive heating (a direct method).
  • the results demonstrate that the connector 1 of the invention are secureable to a fragile substrate FS without cracking or otherwise damaging the fragile substrate FS.
  • the results are positive irrespective of the method used to melt the solder 8 and to secure the connector 1 to the fragile substrate FS and thus show that a connector 1 fabricated from an iron alloy having the CTE within the range specified can be used to provide an effective connector on a fragile substrate.
  • the connector 20 comprises a platform 29 extending from one side of the connection member 26.
  • the platform 29 preferably extends from the connection member 26 such that a substrate facing surface (not shown) of the platform 29 is also spaced from the substrate facing surface (not shown) of the mounting portions 22, 23 (and hence spaced from a substantially flat region of a fragile substrate to which the connector 21 may subsequently be attached).
  • FIGS 6A /B, 7A/B, and 8A/B in each set of figures there is shown respectively upper and lower views of a mounting portion 2 provided with a pair of lugs 5 and provided with an identical solder preform within a computerised stress model.
  • the stress is shown 560s after solder re-flow.
  • Figures 8A/B demonstrated significantly less stress than that shown in Figures 6A /B (copper) or Figures 7A /B (stainless steel ss04).
  • the peak stress level is found to be in the area of the lugs 5.
  • solder preform 8 is shown as having a generally rectangular shape in plan this need not be the case and the solder preform 8 may have any other suitable shape, for example square, hexagonal, circular, oval, and the like. Where the solder preform 8 has a non-rectangular shape in plan it will be appreciated that the mounting portions 2, 3 may also be non-rectangular in plan and may have a similar shape to that of the solder preform 8.
  • solder preform may not be formed from Sn3Ag solder material but may instead be formed from any suitable solder material, for example a lead-based solder material or a different lead-free solder material.
  • solder preform 8 whilst it is convenient to secure the solder preform 8 to the connector 10 by way of a friction fit, it is also possible to secure the solder preform 8 by way of adhesive or other securing means.

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  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
EP17168859.1A 2016-04-28 2017-04-28 Connecteur Withdrawn EP3240360A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1607398.3A GB201607398D0 (en) 2016-04-28 2016-04-28 Connector

Publications (1)

Publication Number Publication Date
EP3240360A1 true EP3240360A1 (fr) 2017-11-01

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EP17168859.1A Withdrawn EP3240360A1 (fr) 2016-04-28 2017-04-28 Connecteur

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GB (2) GB201607398D0 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3696916B1 (fr) 2017-11-07 2022-07-13 Central Glass Company, Limited Ensemble vitre de fenêtre de voiture

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CN203589225U (zh) * 2013-05-16 2014-05-07 法国圣戈班玻璃厂 具有电气连接元件的窗板
WO2014079595A1 (fr) * 2012-11-21 2014-05-30 Saint-Gobain Glass France Vitre comprenant un élément de connexion électrique et des plaques compensatrices
WO2015165632A1 (fr) * 2014-04-29 2015-11-05 Saint-Gobain Glass France Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat

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Publication number Priority date Publication date Assignee Title
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008027167A1 (fr) * 2006-08-31 2008-03-06 Antaya Technologies Corporation Connecteur en aluminium plaqué
WO2012152542A1 (fr) * 2011-05-10 2012-11-15 Saint-Gobain Glass France Vitre pourvue d'un élément de connexion électrique
WO2012152543A1 (fr) * 2011-05-10 2012-11-15 Saint-Gobain Glass France Vitre munie d'un élément de raccordement électrique
WO2013004434A1 (fr) * 2011-07-04 2013-01-10 Saint-Gobain Glass France Procede pour fabriquer une vitre pourvue d'un element de raccordement electrique
DE202013006775U1 (de) * 2012-11-21 2013-09-10 Saint-Gobain Glass France Scheibe mit elektrischem Anschlusselement und Verbindungssteg
WO2014079595A1 (fr) * 2012-11-21 2014-05-30 Saint-Gobain Glass France Vitre comprenant un élément de connexion électrique et des plaques compensatrices
CN203589225U (zh) * 2013-05-16 2014-05-07 法国圣戈班玻璃厂 具有电气连接元件的窗板
WO2015165632A1 (fr) * 2014-04-29 2015-11-05 Saint-Gobain Glass France Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3696916B1 (fr) 2017-11-07 2022-07-13 Central Glass Company, Limited Ensemble vitre de fenêtre de voiture

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GB2549857A (en) 2017-11-01
GB2549857B (en) 2020-11-25
GB201706853D0 (en) 2017-06-14
GB201607398D0 (en) 2016-06-15

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