EP3224909A1 - Elektrisches kontaktelement, einpressstift, buchse und leadframe - Google Patents
Elektrisches kontaktelement, einpressstift, buchse und leadframeInfo
- Publication number
- EP3224909A1 EP3224909A1 EP15797081.5A EP15797081A EP3224909A1 EP 3224909 A1 EP3224909 A1 EP 3224909A1 EP 15797081 A EP15797081 A EP 15797081A EP 3224909 A1 EP3224909 A1 EP 3224909A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- outer layer
- layer
- inner layer
- coating
- electrical contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000576 coating method Methods 0.000 claims abstract description 65
- 239000011248 coating agent Substances 0.000 claims abstract description 63
- 229910052709 silver Inorganic materials 0.000 claims abstract description 37
- 239000004332 silver Substances 0.000 claims abstract description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 36
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- ZUPBPXNOBDEWQT-UHFFFAOYSA-N [Si].[Ni].[Cu] Chemical compound [Si].[Ni].[Cu] ZUPBPXNOBDEWQT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 143
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 29
- 239000000463 material Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 2
- 206010011906 Death Diseases 0.000 description 1
- 235000016936 Dendrocalamus strictus Nutrition 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 210000002414 leg Anatomy 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7064—Press fitting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
Definitions
- the invention relates to an electrical contact element.
- the invention relates to a press-in pin which is pressed into a socket.
- the invention relates to a socket into which a press-in pin is pressed.
- the invention relates to a leadframe or stamped grid.
- Press-fit contacts are usually coated with tin or tin alloys, it being known that such layers tend to form whiskers. Above all, when tensions occur, e.g. Compressive stresses, such a
- whiskers burn through, but to achieve such burning through the flow can already to
- End-of-life vehicles fix substance bans and limit values of substances for use in materials and components of motor vehicles. Accordingly, the
- the object of the present invention is to provide an electrical contact element which has a lower tendency to whisker growth.
- Another object of the present invention is to provide a press-fit pin, which in a bush is pressed, specify, with this press-in connection should have the lowest possible tendency to whisker growth.
- the electrical contact element according to the invention comprises a main body and a coating at least partially covering the body, wherein the coating comprises an inner layer and an outer layer, wherein the inner layer on the base body and the outer layer is applied to the inner layer and at least partially a surface the electrical contact element forms, wherein the inner layer of tin and the outer layer of silver is formed, and the outer layer has a thickness of 50 nm to 5.0 ⁇ .
- the electrical contact element has at least one main body and, in sections, an additional coating, wherein the coating is formed from at least two coating layers.
- the basic body can also consist of several layers.
- the inner layer may be applied to a nickel layer. In other words, an under-nickeling of the additional coating is possible.
- the coating has at least one inner layer and one outer layer, wherein the outer layer forms the surface of the electrical contact element at least in sections. In other words, the inner layer of the coating between the main body and the outer layer of the
- the inner layer is made of tin and the outer layer of silver, wherein the outer layer of silver has a thickness of 75 nm to 2.5 pm, in particular from 80 nm to 1.0 ⁇ , in particular from 90 nm to 500 nm, in particular from 100 nm to 200 nm.
- the outer layer of silver is very thin. Tin is a very soft metal.
- the very thin outer layer of silver can be mechanically mixed or mixed with the inner layer. Such a pressed or contacted electrical contact element is much less prone to whisker growth.
- the coating of the thin outer layer of silver with the inner layer of tin can be referred to as whiskerarme coating.
- the coating according to the invention even in the unpressed or non-pressed state, has the property of being much less prone to whisker growth. This is due to the formation of tin oxides. The formation of tin oxides is favored by the only thin outer layer of silver.
- the inner layer is preferably of pure tin, i. made of tin with minimal impurities.
- the outer layer is preferably formed of pure silver, i. made of silver with as few impurities as possible.
- the inner layer may have a thickness of 0.5 ⁇ m to 10.0 ⁇ m.
- the electrical contact element has a contacting section for making electrical contact with a further electrical contact element.
- the contacting portion may be a portion of the outer circumferential surface.
- the electrical contact element in the formation of the electrical contact element as an electrically conductive socket, it may be in the Contacting section around the inner peripheral surface of a circular and / or elliptical and / or polygonal hollow cylindrical section act.
- the coating with an inner layer and an outer layer is formed at least in the contacting section of the electrical contact element. It is also possible that the coating completely covers the main body of the electrical contact element.
- the main body of the electrical contact element may be formed from copper or a copper-based alloy, in particular from bronze, in particular from a copper-nickel-silicon alloy. According to the invention is on the
- Base body made of a copper-based alloy applied a first tin layer, wherein on this inner layer of tin, an outer, very thin layer of silver is formed. Additionally it is possible that between the
- Copper-based alloy and the first tin layer is formed a nickel layer.
- the basic body can itself consist of one material or of several layers.
- the base body comprises a layer of nickel, on which preferably the inner layer of the coating is applied.
- the inner layer and / or the outer layer is preferably deposited galvanically on the base body.
- the electrical contact element according to the invention can be designed as a press-fit pin or press-fit contact or as an electrically conductive socket.
- the invention relates to a press-fit pin which is pressed into a bush
- the press-in pin comprises a base body and a coating at least partially covering the base body, wherein the coating has an inner layer and an outer layer, and the inner layer on the Base body and the outer layer is applied to the inner layer, wherein the inner layer of tin and the outer layer of silver is formed, wherein the outer layer and the inner layer are at least partially mixed together due to the pressing into the socket. Due to such mechanical mixing of the tin and silver particles of the inner layer and the outer layer, an electrical connection is formed between the press-fit pin and the bush, which has a reduced tendency to whisker growth.
- the mechanical mixing or mechanical mixing of the tin and silver particles of the inner layer and the outer layer is due to the prevailing when pressing the press-fit pin into the socket
- the base body of the injection pin In connection with the nickel plating, it is possible for the base body of the injection pin to comprise a nickel layer on which the base body of the injection pin
- the invention relates to a socket into which a press-in pin is pressed, wherein the socket a
- Base body and the base body at least partially covering coating, wherein the coating comprises an inner layer and an outer layer, and the inner layer is applied to the base body and the outer layer on the inner layer, wherein the inner layer of tin and the outer Layer is formed of silver, wherein the outer layer and the inner layer are at least partially mixed together due to the pressing of the press-fit pin.
- the bushing according to the invention comprises an inner peripheral surface defining a cavity portion into which the press-fit pin is pressed.
- the outer layer of silver accordingly forms, at least in sections, the surface of the bushing, the outer layer and the inner layer due to the
- the invention relates to a leadframe or a stamped grid, comprising at least one contacting recess or contacting opening with an inner circumferential surface delimiting the contacting recess or the contacting aperture and a coating covering the inner circumferential surface at least in sections, wherein the coating comprises an inner layer and an outer layer wherein the inner layer is applied to the inner peripheral surface and the outer layer is applied to the inner layer and at least partially forms a contacting surface, wherein the inner layer of tin and the outer layer of silver is formed, and the outer layer has a thickness of 50 nm to 5.0 ⁇ , in particular from 75 nm to 2.5 ⁇ , in particular from 80 nm to 1.0 ⁇ , in particular from 90 nm to 500 nm, in particular from 100 nm to 200 nm.
- the inner layer of the coating is preferably made of pure tin and / or the outer layer of the coating of pure silver.
- Pure tin is tin material with the lowest possible impurity levels. at
- Pure silver is silver material with as little as possible
- the inner layer may have a thickness of 0.5 to 10.0 ⁇ .
- FIG 1 shows an inventive electrical contact element, designed as Einpresst.
- FIG. 2 shows an inventive electrical contact element, designed as an electrically conductive socket.
- Fig. 1 shows an electrical contact element 10 ⁇ which is designed as a press-fit pin.
- the electrical contact element 10 comprises a main body 11 with a press-fit portion 13 which is formed in the form of two legs 15 separated by a gap 14.
- the press-fit portion 13 is flexible.
- the main body 11 is covered in sections with a coating 12, the coating 12 comprising an inner layer 21 and an outer layer 22.
- the inner layer 21 is applied on the base body 11 and the outer layer 22 on the inner layer 21.
- the outer layer 22 of the coating 12 forms at least in sections a surface or a part of the surface 16 of the electrical contact element 10 ⁇
- the illustrated thickness ratios of Coating 12 in relation to the main body 11 are only for
- the inner layer 21 is made of pure tin and the outer layer 22 of silver.
- the outer layer 22 has a thickness of 100 nm to 200 nm.
- the coating 12 is in the example shown only in the region of
- Einpressabiteses 13 formed. It is alternatively also possible for the coating 12 to completely cover the main body 11.
- the press-fit section 13 serves as a contacting section for electrical contacting with a further electrical contact element, wherein in the present case the further electrical contact element is preferably a socket or a contacting recess or a contacting opening.
- the press-in section 13 can have an under-nickel coating, so that a nickel layer is formed below the coating 12, in particular below the inner layer 21.
- the main body 11 can therefore in
- Press-in section 13 comprise a nickel layer (not shown), on which the inner layer 21 is applied.
- the thin outer layer 22 and the soft inner layer 21 at least partially mixed together. Silver particles of the outer layer 22 are thus pressed into the inner layer 21.
- the whisker formation is due to the formation of the invention
- the main body 11 is preferably made of copper or of a
- the surface 16 is formed by the base body 11 and its material.
- the application of the inner layer 21 and the outer layer 22 is carried out by electroplating, preferably in a strip galvanic plant, in which, for example, a substantially band-shaped stamped grid, in which the
- FIG. 2 shows an electrical contact element 10 "according to the invention, which is designed as an electrically conductive bushing
- the electrical contact element 10" comprises a base body 11 which has a hollow cylindrical shape. Also visible are the inner peripheral surface 17 and the
- the main body 11 is on the
- Inner circumferential surface 17 completely or in full of a
- Coating 12 is covered, wherein the coating 12 comprises an inner layer 21 and an outer layer 22, wherein the inner layer 21 on the
- the outer layer 22 forms at least in sections a part of the surface 16 of the electrical contact element 10 "
- the outer peripheral surface 18 is also formed as part of the surface 16 of the electrical contact element 10 ".In addition, an under-nickeling of the coating 12 is conceivable
- the inner layer 21 is made of pure tin and the outer layer of silver, wherein the outer layer 22 has a thickness of 50 nm to 5.0 ⁇ .
- the electrical contact element 10 "comprises a contacting portion 20. In the present case, it is completely to the outermost layer of the coating 12 and the electrical contact element 10" pointing in the direction of the cavity 19.
- the contacting portion 20 completely covers the coating 12.
- FIG. 3 an inventively designed leadframe 30 is shown. This comprises a Mixticiansverianaung 31 and a Mixtechniks trimbruch 32. Both the contacting recess 31 and the
- the inner circumferential surfaces 17 are each provided with a coating 12, the coatings 12 comprising an inner layer 21 and an outer layer 22.
- the inner layers 21 are applied on the inner peripheral surfaces 17 and the outer layers 22 on the inner layers 21.
- contacting surfaces 33 are respectively formed by the outermost layer 22 of the coating 12.
- the bottom 34 of the contacting recess 31 also has a coating 12 with an inner layer 21 and an outer layer 22.
- the inner layers 21 are made of pure tin and the outer layers 22 of silver.
Landscapes
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014117410.0A DE102014117410B4 (de) | 2014-11-27 | 2014-11-27 | Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe |
| PCT/EP2015/076911 WO2016083198A1 (de) | 2014-11-27 | 2015-11-18 | Elektrisches kontaktelement, einpressstift, buchse und leadframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3224909A1 true EP3224909A1 (de) | 2017-10-04 |
Family
ID=54557419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15797081.5A Withdrawn EP3224909A1 (de) | 2014-11-27 | 2015-11-18 | Elektrisches kontaktelement, einpressstift, buchse und leadframe |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20170331205A1 (de) |
| EP (1) | EP3224909A1 (de) |
| CN (1) | CN107004985A (de) |
| DE (1) | DE102014117410B4 (de) |
| WO (1) | WO2016083198A1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017195595A1 (ja) * | 2016-05-12 | 2017-11-16 | 住友電装株式会社 | 端子金具 |
| DE102016124072B4 (de) * | 2016-12-12 | 2020-07-16 | Te Connectivity Germany Gmbh | Kontakteinrichtung und Anordnung |
| DE102017215026A1 (de) * | 2017-08-28 | 2019-02-28 | Robert Bosch Gmbh | Einpresspin für eine elektrische Kontaktieranordnung |
| DE102018109059B4 (de) | 2018-01-15 | 2020-07-23 | Doduco Solutions Gmbh | Elektrischer Einpress-Kontaktstift |
| DE102018203800B4 (de) | 2018-03-13 | 2019-11-21 | Te Connectivity Germany Gmbh | Kontaktstift und Anordnung zur Verbindung von elektrischen Leitern aus Kupfer und Aluminium |
| CN115030958B (zh) * | 2022-06-06 | 2024-02-13 | 浙江江南石化机械有限公司 | 一种高密度熔融泵银轴瓦及其加工方法、设备 |
| DE102024109322B4 (de) * | 2024-04-03 | 2025-10-16 | Enayati Oberflächentechnik GmbH | Einpresspin, Baugruppe und Verfahren zur Herstellung einer solchen Baugruppe |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1257004A1 (de) * | 2001-05-11 | 2002-11-13 | Lucent Technologies Inc. | Metallischer Gegenstand mit mehrlagigem Belag |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5208978A (en) * | 1992-05-07 | 1993-05-11 | Molex Incorporated | Method of fabricating an electrical terminal pin |
| US5497546A (en) * | 1992-09-21 | 1996-03-12 | Matsushita Electric Works, Ltd. | Method for mounting lead terminals to circuit board |
| US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
| US7008272B2 (en) * | 2003-10-23 | 2006-03-07 | Trw Automotive U.S. Llc | Electrical contact |
| DE10349584B4 (de) * | 2003-10-24 | 2005-06-09 | Tyco Electronics Amp Gmbh | Elektrisch leitende Verbindung zwischen einem Einpressstift und einer Buchse |
| DE102006057143A1 (de) * | 2006-12-01 | 2008-06-05 | Tyco Electronics Belgium Ec N.V. | Einpressstift für eine elektrisch leitende Verbindung zwischen dem Einpressstift und einer Buchse |
| DE102007047007A1 (de) * | 2007-10-01 | 2009-04-09 | Tyco Electronics Amp Gmbh | Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben |
| WO2009117639A2 (en) * | 2008-03-20 | 2009-09-24 | Interplex Nas, Inc. | Press fit (compliant) terminal and other connectors with tin-silver compound |
| WO2009140524A2 (en) * | 2008-05-15 | 2009-11-19 | Interplex Industries, Inc. | Tin-silver compound coating on printed circuit boards |
| BR112012027027A2 (pt) * | 2010-04-22 | 2016-07-19 | Universal Electric Corp | barra de barramento de encaixe de pressão melhorada e caminho de barramento empregando a mesma |
| JP6046406B2 (ja) * | 2011-07-26 | 2016-12-14 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 高温耐性銀コート基体 |
| JP2013037791A (ja) * | 2011-08-04 | 2013-02-21 | Sumitomo Wiring Syst Ltd | 回路基板と端子金具の接続構造 |
| DE102011088211A1 (de) * | 2011-12-12 | 2013-06-13 | Robert Bosch Gmbh | Kontaktelement und Verfahren zu seiner Herstellung |
| TWI493798B (zh) * | 2012-02-03 | 2015-07-21 | Jx日鑛日石金屬股份有限公司 | Push-in terminals and electronic parts for their use |
| US8945990B2 (en) * | 2012-04-24 | 2015-02-03 | Infineon Technologies Ag | Chip package and method of forming the same |
| TWI558039B (zh) * | 2012-06-06 | 2016-11-11 | 法國聖戈本玻璃公司 | 帶有電連接元件之板、製造彼之方法、及彼之用途 |
| FR2993579B1 (fr) * | 2012-07-20 | 2015-09-25 | Tyco Electronics France Sas | Procede de revetement et revetement pour contact a insertion a force |
| DE102013111963A1 (de) * | 2012-11-14 | 2014-05-15 | Walter Söhner GmbH & Co. KG | Plattenelement mit Tiefziehbohrung für Einpresskontakte |
| JP6004121B2 (ja) * | 2013-12-04 | 2016-10-05 | 株式会社オートネットワーク技術研究所 | 電気接点およびコネクタ端子対 |
-
2014
- 2014-11-27 DE DE102014117410.0A patent/DE102014117410B4/de not_active Expired - Fee Related
-
2015
- 2015-11-18 US US15/531,150 patent/US20170331205A1/en not_active Abandoned
- 2015-11-18 EP EP15797081.5A patent/EP3224909A1/de not_active Withdrawn
- 2015-11-18 WO PCT/EP2015/076911 patent/WO2016083198A1/de not_active Ceased
- 2015-11-18 CN CN201580064936.3A patent/CN107004985A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1257004A1 (de) * | 2001-05-11 | 2002-11-13 | Lucent Technologies Inc. | Metallischer Gegenstand mit mehrlagigem Belag |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107004985A (zh) | 2017-08-01 |
| WO2016083198A1 (de) | 2016-06-02 |
| DE102014117410B4 (de) | 2019-01-03 |
| DE102014117410A1 (de) | 2016-06-02 |
| US20170331205A1 (en) | 2017-11-16 |
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