EP3211303B1 - Module àled - Google Patents

Module àled Download PDF

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Publication number
EP3211303B1
EP3211303B1 EP17154292.1A EP17154292A EP3211303B1 EP 3211303 B1 EP3211303 B1 EP 3211303B1 EP 17154292 A EP17154292 A EP 17154292A EP 3211303 B1 EP3211303 B1 EP 3211303B1
Authority
EP
European Patent Office
Prior art keywords
heat
led module
module
conducting element
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17154292.1A
Other languages
German (de)
English (en)
Other versions
EP3211303A1 (fr
Inventor
Bernhard Fink
Franz Schrank
Martin PFEILER-DEUTSCHMANN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tridonic Jennersdorf GmbH
Original Assignee
Tridonic Jennersdorf GmbH
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Publication date
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Publication of EP3211303A1 publication Critical patent/EP3211303A1/fr
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Publication of EP3211303B1 publication Critical patent/EP3211303B1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module (light-emitting diode module), in particular an LED spotlight module.
  • the prior art discloses a large number of LED modules, in particular LED spotlight modules.
  • the latter usually comprise at least one housing or housing element and at least one module plate on which the LEDs are arranged.
  • the LEDs are arranged such that they form at least one light field, from which a light emission takes place.
  • the module plate is usually attached to an underside of the housing in a receptacle or on corresponding contact surfaces (for example by means of frictional engagement or by screwing) in such a way that the light field is positioned in or at a light emission opening of the housing.
  • the light field is positioned directly on the light emission opening of the housing, so that at least the more or less immediately adjacent housing parts are exposed to the heat emitted by the LED.
  • the present invention has the object to provide an LED module, in particular an LED spotlight module, in which the above-mentioned disadvantages are avoided or substantially reduced.
  • an LED module is to be provided which is provided with a comparatively favorable, but in contrast, a comparatively thermally only slightly resistant housing material.
  • a module plate according to the invention is in particular a known LED module plate to understand, which usually comprises a printed circuit board (for example, a FR4 composite material) with conductor tracks and terminal pads on a thermally well conductive support plate (for example, a metal such as aluminum, copper or the like) is arranged.
  • a light field according to the invention is to be understood as any LED arrangement on the module plate.
  • the light field or the module plate can be designed such that the light field projects into the light emission opening, flush with the underside of the light emission opening, or that the light field is arranged slightly below the light emission opening.
  • the arrangement of the heat-conducting element on the inside of the light-emitting opening can be effected such that the heat-conducting element is in direct contact with the inside of the light-emitting opening or is spaced from the inside.
  • the heat-conducting element surrounds at least the light field, for example by the heat-conducting element is annular in plan view and thus encloses, for example, a circular light field seen in plan view.
  • the present invention proposes to arrange a heat-conducting element on the inside of the light-emitting opening such that the heat arising from the light field is quasi absorbed by the adjacent housing parts of the housing by the heat-conducting element and is discharged into the carrier plate of the module plate.
  • the present invention thus provides the option of thermally shielding the housing element, in particular the housing parts adjacent to the light field, so that the risk of discoloration, embrittlement or deformation of the housing element can be avoided or considerably reduced, even if further optical elements , which themselves generate heat or which heat up by the operation of the LED can be installed on the housing or at the light-emitting opening. Furthermore, the present invention makes it possible to provide the housing element with a comparatively favorable housing material, which, however, is comparatively thermally only slightly resistant.
  • the heat-conducting element is arranged by means of a press fit in the light-emitting opening.
  • a press fit in the light-emitting opening.
  • the heat-conducting element has a geometry corresponding to the light field, for example a circular or polygonal light field seen in plan view can be encompassed by means of a ring-shaped or polygonal heat-conducting element formed in plan view.
  • the heat-conducting element preferably comprises at least two contact surfaces, which are in thermal contact with the carrier plate or with correspondingly formed two contact surfaces of the carrier plate.
  • the heat-conducting element over its entire Scope rests on the support plate and is in thermal contact with it.
  • the heat-conducting element is in contact with the carrier plate only by means of the two contact surfaces, so that sufficient installation space is available in order to be able to guide electrical conductors to the module plate or to connection pads of the printed circuit board.
  • the at least two contact surfaces of the heat-conducting element can terminate flush with the housing element or protrude beyond the housing element, wherein contact surfaces of the support plate can also be designed correspondingly such that the respective contact surfaces can be brought into contact with each other and thus in thermal contact.
  • recesses or punched holes are preferably provided so that the contact surfaces of the support plate in a simple manner can be brought into contact with the contact surfaces of the heat conduction, without causing the circuit board is in the way.
  • the contact surfaces of the carrier plate may protrude beyond the printed circuit board.
  • the heat-conducting element is step-shaped in cross-section.
  • the step-shaped design is the easy way to arrange the heat conduction optical elements, such as a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate.
  • the heat-conducting element is advantageously made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material, for example made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramic or a plastic with a filler for increasing the thermal conductivity ,
  • the heat-conducting element is preferably made of a material or a material mixture which has a thermal conductivity between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK.
  • As the material for the heat-conducting element in particular an aluminum oxide (Al 2 O 3 ) or substantially pure aluminum can be used.
  • An alumina can, for example, with a Thermal conductivity of about 30 W / mK, pure aluminum with a thermal conductivity of about 300 W / mK can be provided.
  • the base material of the printed circuit board is preferably a FR-4 composite material, wherein the carrier plate is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel.
  • a heat sink is advantageously arranged on the module plate or on the carrier element of the module plate. With such a configuration, heat can thus be conducted from the heat-conducting element via the carrier plate of the module plate into the heat sink.
  • the housing element comprises at least two cable guides.
  • the module plate and the housing element are connected by means of an adhesive, a screw and / or a press connection.
  • screw receptacles for fixing the LED module are provided on the housing element.
  • FIGS. 1 to 3 show a schematic view of a preferred embodiment of an LED module 10 according to the invention in the form of an LED spotlight module.
  • the LED module 10 comprises a circular housing or housing element 11 seen in plan view, in the middle region of which a circular light exit opening 12 is provided, viewed in plan view, wherein a corresponding, circular light field 13 is arranged in or below the light exit opening 12.
  • the light field 13 is formed from a plurality of LED 14, over which a potting compound is provided, which may optionally be provided with a phosphor.
  • the LED 14 are arranged on a module plate which is constructed of a printed circuit board 15 and a support plate 16 and this includes.
  • the printed circuit board can be designed as a printed circuit board (PCB) and the carrier plate as an aluminum or a copper plate.
  • PCB printed circuit board
  • annular heat conducting element 17 is arranged on the inside of the light exit opening 12 a .
  • the heat-conducting element 17 extends (at least in partial regions of the circumference) from the carrier plate 16 to the upper edge of the inside of the light exit opening 12, with which it terminates flush in the preferred embodiment.
  • the heat-conducting element 17 is preferably step-shaped in cross-section, so that further optical elements can be arranged thereon in a simple manner (for example a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate).
  • the heat-conducting element 17 can thus shield the housing element 11 or at least the inside of the light exit opening 12 from the heat of the light field 13 and cause the resulting heat to be transmitted to the carrier plate 16, which thermally contacts it circumferentially in partial areas (cf. FIG. 3 ).
  • the carrier plate 16 thermally contacts it circumferentially in partial areas (cf. FIG. 3 ).
  • the housing member 11 further includes contacting means 18 to lead electrical conductors (not shown) in the housing member 11 and the module plate can. Furthermore, the housing element 11 comprises two screw receptacles 19 for fastening the LED module 10.
  • FIGS. 4 to 6 is a schematic view of the ballasts 17 and the circuit board 15 is shown.
  • the heat-conducting element 17 preferably comprises two contact surfaces 20, which are arranged in two corresponding recesses or punched-21 of the circuit board 15.
  • the heat-conducting element 17 is preferably not in contact over its full circumference with the carrier plate 16, but only with the two contact surfaces 20 (cf. FIG. 3 ).
  • Such a configuration has the particular advantage that there is sufficient space available to lead electrical conductors to the circuit board 15 and attach them to terminal pads 22 of the circuit board 15 and to be able to solder to these.
  • the support plate 16 may be formed as a planar component, on which the contact surfaces 20 rest. However, it is also possible to provide on the support plate 16 also or only on this correspondingly formed contact surfaces.
  • a heat sink (not shown) is preferably arranged, so that the heat from the heat-conducting element 17 can be delivered via the support plate 16 to the heat sink.
  • the heat-conducting element 17 is preferably made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material is provided, in particular made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramics or plastic provided with a filler for increasing the thermal conductivity.
  • the heat-conducting element 17 is preferably made of a material or a material mixture having a thermal conductivity of between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK.
  • the support plate 16 is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel.
  • the circuit board 15 is preferably made of a FR-4 composite material.
  • the present invention is not limited to the previously shown embodiment of an LED module according to the invention, as long as it is encompassed by the subject of the following claims.
  • the present invention is not limited to a specific geometry of the light field or the heat conducting element, as long as the heat conducting element is arranged on the inside of the light emitting opening, that this can shield the housing element from the heat of the LED.
  • the present invention is not limited to a heat conduction member 17 having a specific material.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (15)

  1. Module à DEL (10), en particulier module de spot à DEL, comprenant :
    - un élément de boîtier (11) de préférence en plastique avec au moins une ouverture d'émission de lumière (12) ;
    - au moins une plaque de module avec au moins un champ lumineux (13) sur lequel au moins une diode lumineuse (14) est disposée, dans lequel la plaque de module est disposée sur l'élément de boîtier (11) de telle sorte que le champ lumineux (13) est disposé dans l'ouverture d'émission de lumière (12), ou en-dessous de celle-ci, de l'élément de boîtier (11), et dans lequel la plaque de module comprend un circuit imprimé (15) et une plaque de support (16) ;
    caractérisé en ce que,
    sur le côté intérieur de l'ouverture d'émission de lumière (12), au moins un élément thermoconducteur périphérique (17) est disposé, lequel est en contact thermique avec la plaque de support (16) de la plaque de module,
    et en ce que l'élément thermoconducteur (17) comprend au moins deux surfaces d'appui (20) qui sont en contact thermique avec la plaque de support (16) ou avec des surfaces d'appui réalisées de manière correspondante de la plaque de support (16).
  2. Module à DEL (10) selon la revendication 1, dans lequel l'élément thermoconducteur (17) est disposé dans l'ouverture d'émission de lumière (12) au moyen d'un ajustage serré.
  3. Module à DEL (10) selon l'une des revendications 1 ou 2, dans lequel, en vue de dessus, l'élément thermoconducteur (17) est réalisé de manière annulaire ou polygonale.
  4. Module à DEL (10) selon l'une des revendications précédentes, dans lequel, en vue de dessus, l'ouverture d'émission de lumière (12) et le champ lumineux (13) disposé dans l'ouverture d'émission de lumière (12) sont réalisés de manière circulaire ou polygonale.
  5. Module à DEL (10) selon la revendication 1, dans lequel on prévoit, entre les surfaces d'appui, des évidements dans l'élément thermoconducteur (17) pour amener des conducteurs électriques à la plaque de module, en particulier à des plots de connexion prévus sur le circuit imprimé (15).
  6. Module à DEL (10) selon l'une des revendications 1 ou 5, dans lequel, dans la zone des surfaces d'appui de la plaque de support (16), des évidements correspondants dans le circuit imprimé (15) sont prévus, dans lequel les surfaces d'appui (20) de l'élément thermoconducteur (17) dépassent de préférence du circuit imprimé (15).
  7. Module à DEL (10) selon l'une des revendications précédentes, dans lequel l'élément thermoconducteur (17) est réalisé avec une forme étagée en section transversale.
  8. Module à DEL (10) selon l'une des revendications précédentes, dans lequel des éléments optiques, en particulier un élément réflecteur, un élément diffuseur, un élément de lentille, un recouvrement ou une plaque à phosphore différé, sont disposés sur l'élément thermoconducteur (17).
  9. Module à DEL (10) selon l'une des revendications précédentes, dans lequel l'élément thermoconducteur (17) est préparé en un matériau métallique thermoconducteur, un matériau céramique thermoconducteur ou un matériau plastique thermoconducteur, en particulier est préparé en aluminium, cuivre, acier inoxydable, céramique de nitrure d'aluminium, céramique d'oxyde d'aluminium ou en un plastique avec une matière de remplissage pour augmenter la capacité de conduction thermique.
  10. Module à DEL (10) selon l'une des revendications précédentes, dans lequel l'élément thermoconducteur (17) est fourni en un matériau, ou un mélange de matériaux, lequel présente une capacité de conduction thermique comprise entre 2 et 400 W/mK, de préférence entre 30 et 350 W/mK et de manière particulièrement préférée, entre 150 et 300 W/mK.
  11. Module à DEL (10) selon l'une des revendications précédentes, dans lequel le matériau de base du circuit imprimé (15) est un matériau composite FR-4, et dans lequel la plaque de support (16) est fournie en un matériau métallique thermoconducteur, en particulier en aluminium, cuivre ou un acier inoxydable.
  12. Module à DEL (10) selon l'une des revendications précédentes, dans lequel un dissipateur thermique est disposé sur la plaque de module.
  13. Module à DEL (10) selon les revendications précédentes, dans lequel l'élément de boîtier (11) comprend au moins deux conduites de câbles.
  14. Module à DEL (10) selon l'une des revendications précédentes, dans lequel la plaque de module et l'élément de boîtier (11) sont reliés au moyen d'un assemblage par collage, boulonnage et/ou à ajustage serré.
  15. Module à DEL (10) selon l'une des revendications précédentes, dans lequel on prévoit, sur l'élément de boîtier (11), des logements filetés (19) pour la fixation du module à DEL (10).
EP17154292.1A 2016-02-26 2017-02-02 Module àled Active EP3211303B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202016101026.8U DE202016101026U1 (de) 2016-02-26 2016-02-26 LED-Modul

Publications (2)

Publication Number Publication Date
EP3211303A1 EP3211303A1 (fr) 2017-08-30
EP3211303B1 true EP3211303B1 (fr) 2018-07-25

Family

ID=57965731

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17154292.1A Active EP3211303B1 (fr) 2016-02-26 2017-02-02 Module àled

Country Status (2)

Country Link
EP (1) EP3211303B1 (fr)
DE (1) DE202016101026U1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128070A1 (fr) * 2006-05-10 2007-11-15 Spa Electrics Pty Ltd Ensemble comprenant un dispositif de fixation
US20120120659A1 (en) * 2010-11-16 2012-05-17 Lopez Peter E Board assemblies, light emitting device assemblies, and methods of making the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM402992U (en) * 2009-09-24 2011-05-01 Molex Inc Light module
DE202010009574U1 (de) * 2010-06-22 2010-09-16 Li, Chia-Mao Ringförmige Kapselung
JP6094746B2 (ja) * 2013-03-22 2017-03-15 東芝ライテック株式会社 ランプ装置および照明装置
DE102013107395B4 (de) * 2013-07-12 2016-08-25 Rüdiger Lanz LED-Hochleistungsspot
DE202013007592U1 (de) * 2013-08-26 2013-09-06 Osram Gmbh Halbleiterlampe mit Wärmeleitkörper zwischen Treiber und Treibergehäuse

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128070A1 (fr) * 2006-05-10 2007-11-15 Spa Electrics Pty Ltd Ensemble comprenant un dispositif de fixation
US20120120659A1 (en) * 2010-11-16 2012-05-17 Lopez Peter E Board assemblies, light emitting device assemblies, and methods of making the same

Also Published As

Publication number Publication date
EP3211303A1 (fr) 2017-08-30
DE202016101026U1 (de) 2017-05-29

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