EP3211303B1 - Led-module - Google Patents

Led-module Download PDF

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Publication number
EP3211303B1
EP3211303B1 EP17154292.1A EP17154292A EP3211303B1 EP 3211303 B1 EP3211303 B1 EP 3211303B1 EP 17154292 A EP17154292 A EP 17154292A EP 3211303 B1 EP3211303 B1 EP 3211303B1
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EP
European Patent Office
Prior art keywords
heat
led module
module
conducting element
plate
Prior art date
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EP17154292.1A
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German (de)
French (fr)
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EP3211303A1 (en
Inventor
Bernhard Fink
Franz Schrank
Martin PFEILER-DEUTSCHMANN
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Tridonic Jennersdorf GmbH
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Tridonic Jennersdorf GmbH
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Publication of EP3211303A1 publication Critical patent/EP3211303A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module (light-emitting diode module), in particular an LED spotlight module.
  • the prior art discloses a large number of LED modules, in particular LED spotlight modules.
  • the latter usually comprise at least one housing or housing element and at least one module plate on which the LEDs are arranged.
  • the LEDs are arranged such that they form at least one light field, from which a light emission takes place.
  • the module plate is usually attached to an underside of the housing in a receptacle or on corresponding contact surfaces (for example by means of frictional engagement or by screwing) in such a way that the light field is positioned in or at a light emission opening of the housing.
  • the light field is positioned directly on the light emission opening of the housing, so that at least the more or less immediately adjacent housing parts are exposed to the heat emitted by the LED.
  • the present invention has the object to provide an LED module, in particular an LED spotlight module, in which the above-mentioned disadvantages are avoided or substantially reduced.
  • an LED module is to be provided which is provided with a comparatively favorable, but in contrast, a comparatively thermally only slightly resistant housing material.
  • a module plate according to the invention is in particular a known LED module plate to understand, which usually comprises a printed circuit board (for example, a FR4 composite material) with conductor tracks and terminal pads on a thermally well conductive support plate (for example, a metal such as aluminum, copper or the like) is arranged.
  • a light field according to the invention is to be understood as any LED arrangement on the module plate.
  • the light field or the module plate can be designed such that the light field projects into the light emission opening, flush with the underside of the light emission opening, or that the light field is arranged slightly below the light emission opening.
  • the arrangement of the heat-conducting element on the inside of the light-emitting opening can be effected such that the heat-conducting element is in direct contact with the inside of the light-emitting opening or is spaced from the inside.
  • the heat-conducting element surrounds at least the light field, for example by the heat-conducting element is annular in plan view and thus encloses, for example, a circular light field seen in plan view.
  • the present invention proposes to arrange a heat-conducting element on the inside of the light-emitting opening such that the heat arising from the light field is quasi absorbed by the adjacent housing parts of the housing by the heat-conducting element and is discharged into the carrier plate of the module plate.
  • the present invention thus provides the option of thermally shielding the housing element, in particular the housing parts adjacent to the light field, so that the risk of discoloration, embrittlement or deformation of the housing element can be avoided or considerably reduced, even if further optical elements , which themselves generate heat or which heat up by the operation of the LED can be installed on the housing or at the light-emitting opening. Furthermore, the present invention makes it possible to provide the housing element with a comparatively favorable housing material, which, however, is comparatively thermally only slightly resistant.
  • the heat-conducting element is arranged by means of a press fit in the light-emitting opening.
  • a press fit in the light-emitting opening.
  • the heat-conducting element has a geometry corresponding to the light field, for example a circular or polygonal light field seen in plan view can be encompassed by means of a ring-shaped or polygonal heat-conducting element formed in plan view.
  • the heat-conducting element preferably comprises at least two contact surfaces, which are in thermal contact with the carrier plate or with correspondingly formed two contact surfaces of the carrier plate.
  • the heat-conducting element over its entire Scope rests on the support plate and is in thermal contact with it.
  • the heat-conducting element is in contact with the carrier plate only by means of the two contact surfaces, so that sufficient installation space is available in order to be able to guide electrical conductors to the module plate or to connection pads of the printed circuit board.
  • the at least two contact surfaces of the heat-conducting element can terminate flush with the housing element or protrude beyond the housing element, wherein contact surfaces of the support plate can also be designed correspondingly such that the respective contact surfaces can be brought into contact with each other and thus in thermal contact.
  • recesses or punched holes are preferably provided so that the contact surfaces of the support plate in a simple manner can be brought into contact with the contact surfaces of the heat conduction, without causing the circuit board is in the way.
  • the contact surfaces of the carrier plate may protrude beyond the printed circuit board.
  • the heat-conducting element is step-shaped in cross-section.
  • the step-shaped design is the easy way to arrange the heat conduction optical elements, such as a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate.
  • the heat-conducting element is advantageously made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material, for example made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramic or a plastic with a filler for increasing the thermal conductivity ,
  • the heat-conducting element is preferably made of a material or a material mixture which has a thermal conductivity between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK.
  • As the material for the heat-conducting element in particular an aluminum oxide (Al 2 O 3 ) or substantially pure aluminum can be used.
  • An alumina can, for example, with a Thermal conductivity of about 30 W / mK, pure aluminum with a thermal conductivity of about 300 W / mK can be provided.
  • the base material of the printed circuit board is preferably a FR-4 composite material, wherein the carrier plate is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel.
  • a heat sink is advantageously arranged on the module plate or on the carrier element of the module plate. With such a configuration, heat can thus be conducted from the heat-conducting element via the carrier plate of the module plate into the heat sink.
  • the housing element comprises at least two cable guides.
  • the module plate and the housing element are connected by means of an adhesive, a screw and / or a press connection.
  • screw receptacles for fixing the LED module are provided on the housing element.
  • FIGS. 1 to 3 show a schematic view of a preferred embodiment of an LED module 10 according to the invention in the form of an LED spotlight module.
  • the LED module 10 comprises a circular housing or housing element 11 seen in plan view, in the middle region of which a circular light exit opening 12 is provided, viewed in plan view, wherein a corresponding, circular light field 13 is arranged in or below the light exit opening 12.
  • the light field 13 is formed from a plurality of LED 14, over which a potting compound is provided, which may optionally be provided with a phosphor.
  • the LED 14 are arranged on a module plate which is constructed of a printed circuit board 15 and a support plate 16 and this includes.
  • the printed circuit board can be designed as a printed circuit board (PCB) and the carrier plate as an aluminum or a copper plate.
  • PCB printed circuit board
  • annular heat conducting element 17 is arranged on the inside of the light exit opening 12 a .
  • the heat-conducting element 17 extends (at least in partial regions of the circumference) from the carrier plate 16 to the upper edge of the inside of the light exit opening 12, with which it terminates flush in the preferred embodiment.
  • the heat-conducting element 17 is preferably step-shaped in cross-section, so that further optical elements can be arranged thereon in a simple manner (for example a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate).
  • the heat-conducting element 17 can thus shield the housing element 11 or at least the inside of the light exit opening 12 from the heat of the light field 13 and cause the resulting heat to be transmitted to the carrier plate 16, which thermally contacts it circumferentially in partial areas (cf. FIG. 3 ).
  • the carrier plate 16 thermally contacts it circumferentially in partial areas (cf. FIG. 3 ).
  • the housing member 11 further includes contacting means 18 to lead electrical conductors (not shown) in the housing member 11 and the module plate can. Furthermore, the housing element 11 comprises two screw receptacles 19 for fastening the LED module 10.
  • FIGS. 4 to 6 is a schematic view of the ballasts 17 and the circuit board 15 is shown.
  • the heat-conducting element 17 preferably comprises two contact surfaces 20, which are arranged in two corresponding recesses or punched-21 of the circuit board 15.
  • the heat-conducting element 17 is preferably not in contact over its full circumference with the carrier plate 16, but only with the two contact surfaces 20 (cf. FIG. 3 ).
  • Such a configuration has the particular advantage that there is sufficient space available to lead electrical conductors to the circuit board 15 and attach them to terminal pads 22 of the circuit board 15 and to be able to solder to these.
  • the support plate 16 may be formed as a planar component, on which the contact surfaces 20 rest. However, it is also possible to provide on the support plate 16 also or only on this correspondingly formed contact surfaces.
  • a heat sink (not shown) is preferably arranged, so that the heat from the heat-conducting element 17 can be delivered via the support plate 16 to the heat sink.
  • the heat-conducting element 17 is preferably made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material is provided, in particular made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramics or plastic provided with a filler for increasing the thermal conductivity.
  • the heat-conducting element 17 is preferably made of a material or a material mixture having a thermal conductivity of between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK.
  • the support plate 16 is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel.
  • the circuit board 15 is preferably made of a FR-4 composite material.
  • the present invention is not limited to the previously shown embodiment of an LED module according to the invention, as long as it is encompassed by the subject of the following claims.
  • the present invention is not limited to a specific geometry of the light field or the heat conducting element, as long as the heat conducting element is arranged on the inside of the light emitting opening, that this can shield the housing element from the heat of the LED.
  • the present invention is not limited to a heat conduction member 17 having a specific material.

Description

1. Gebiet der Erfindung1. Field of the invention

Die vorliegende Erfindung betrifft ein LED-Modul (Leuchtdioden-Modul), insbesondere ein LED-Spotlight Modul.The present invention relates to an LED module (light-emitting diode module), in particular an LED spotlight module.

2. Hintergrund 2 . background

Im Stand der Technik ist eine Vielzahl von LED-Modulen, insbesondere von LED-Spotlight Modulen bekannt. Letztere umfassen in der Regel zumindest ein Gehäuse bzw. ein Gehäuseelement und zumindest eine Modulplatte, auf der die LED angeordnet sind. Die LED sind dabei derart angeordnet, dass diese zumindest ein Lichtfeld bilden, von dem eine Lichtabgabe erfolgt. Die Modulplatte wird dabei üblicherweise an einer Unterseite des Gehäuses in einer Aufnahme oder an entsprechenden Anlageflächen derart befestigt (beispielsweise mittels Reibschluss oder durch Verschrauben), dass das Lichtfeld in einer bzw. an einer Lichtabgabeöffnung des Gehäuses positioniert ist. Mit anderen Worten ist das Lichtfeld unmittelbar an der Lichtabgabeöffnung des Gehäuses positioniert, so dass zumindest die mehr oder weniger unmittelbar benachbarten Gehäuseteile der von den LED abgegebenen Wärme ausgesetzt sind. Je nach verwendetem Gehäusematerial besteht dabei die Gefahr, dass die der Wärme der LED ausgesetzten Gehäuseteile sich verfärben, verspröden oder sogar deformieren, was wiederum zu Rissen im Gehäuse, zum Verlust des elektrischen Kontaktes oder zu Änderungen der optischen Eigenschaften des LED-Moduls. Ohne weiteres können auch keine optischen Elemente, die selbst Wärme erzeugen oder die sich durch den Betrieb der LED aufheizen am Gehäuse verbaut werden.The prior art discloses a large number of LED modules, in particular LED spotlight modules. The latter usually comprise at least one housing or housing element and at least one module plate on which the LEDs are arranged. The LEDs are arranged such that they form at least one light field, from which a light emission takes place. The module plate is usually attached to an underside of the housing in a receptacle or on corresponding contact surfaces (for example by means of frictional engagement or by screwing) in such a way that the light field is positioned in or at a light emission opening of the housing. In other words, the light field is positioned directly on the light emission opening of the housing, so that at least the more or less immediately adjacent housing parts are exposed to the heat emitted by the LED. Depending on the housing material used, there is the risk that the housing parts exposed to the heat of the LED will discolor, become brittle or even deform, which in turn leads to cracks in the housing, loss of electrical contact or changes in the optical properties of the LED module. Without further ado, no optical elements which themselves generate heat or which heat up by the operation of the LED can be installed on the housing.

Ausgehend von diesem Stand der Technik stellt sich die vorliegende Erfindung die Aufgabe, ein LED-Modul, insbesondere ein LED-Spotlight Modul bereitzustellen, bei dem die oben genannten Nachteile vermieden bzw. substantiell reduziert werden. Insbesondere soll ein LED-Modul bereitgestellt werden, das mit einem vergleichsweise günstigen, demgegenüber jedoch einem vergleichsweise thermisch nur gering beständigen Gehäusematerial bereitgestellt ist.Based on this prior art, the present invention has the object to provide an LED module, in particular an LED spotlight module, in which the above-mentioned disadvantages are avoided or substantially reduced. In particular, an LED module is to be provided which is provided with a comparatively favorable, but in contrast, a comparatively thermally only slightly resistant housing material.

Diese und andere Aufgaben, die beim Lesen der folgenden Beschreibung noch genannt werden oder vom Fachmann erkannt werden können, werden durch den Gegenstand des unabhängigen Anspruchs gelöst. Die abhängigen Ansprüche bilden dabei den zentralen Gedanken der vorliegenden Erfindung in besonders vorteilhafter Weise weiter. Das Dokument WO 2007/128070 A1 zeigt den Oberbegriff des Anspruchs 1.These and other objects, which will become apparent upon reading the following description or may be recognized by those skilled in the art, are achieved by the subject-matter of the independent claim. The dependent claims form the central idea of the present invention in a particularly advantageous manner on. The document WO 2007/128070 A1 shows the preamble of claim 1.

3. Ausführliche Beschreibung der Erfindung 3 . Detailed description of the invention

Eine erfindungsgemäßes LED-Modul, insbesondere ein LED-Spotlight Modul umfasst:

  • ein Gehäuseelement mit zumindest einer Lichtabgabeöffnung;
  • zumindest eine Modulplatte mit zumindest einem Lichtfeld, auf dem zumindest eine Leuchtdiode angeordnet ist, wobei die Modulplatte derart am Gehäuseelement angeordnet ist, dass das Lichtfeld in der oder unterhalb der Lichtabgabeöffnung des Gehäuseelements angeordnet ist, und wobei die Modulplatte eine Leiterplatte und eine Trägerplatte umfasst;
  • wobei an der Innenseite der Lichtabgabeöffnung zumindest ein umlaufendes Wärmeleitelement angeordnet ist, das mit der Trägerplatte der Modulplatte thermisch in Kontakt steht.
An inventive LED module, in particular an LED spotlight module comprises:
  • a housing member having at least one light emitting opening;
  • at least one module plate having at least one light field, on which at least one light-emitting diode is arranged, wherein the module plate is arranged on the housing element such that the light field is arranged in or below the light emission opening of the housing element, and wherein the module plate comprises a printed circuit board and a carrier plate;
  • wherein on the inside of the light-emitting opening at least one circulating heat-conducting element is arranged, which is in thermal contact with the carrier plate of the module plate.

Unter einer erfindungsgemäßen Modulplatte ist dabei insbesondere eine bekannte LED-Modulplatte zu verstehen, die üblicherweise eine Leiterplatte (beispielsweise aus einem FR4-Verbundmaterial) mit Leiterbahnen und Anschlusspads umfasst, die auf einer thermisch gut leitfähigen Trägerplatte (beispielsweise aus einem Metall, wie Aluminium, Kupfer oder dergleichen) angeordnet ist. Unter einem erfindungsgemäßen Lichtfeld ist dabei jede LED-Anordnung auf der Modulplatte zu verstehen. Das Lichtfeld bzw. die Modulplatte kann dabei derart ausgebildet sein, dass das Lichtfeld in die Lichtabgabeöffnung hineinragt, mit der Unterseite der Lichtabgabeöffnung bündig abschließt, oder dass das Lichtfeld etwas unterhalb der Lichtabgabeöffnung angeordnet ist. Die Anordnung des Wärmeleitelements an der Innenseite der Lichtabgabeöffnung kann dabei derart erfolgen, dass das Wärmeleitelement unmittelbar mit der Innenseite der Lichtabgabeöffnung in Kontakt steht oder von der Innenseite beabstandet ist. Unter einer umlaufenden Anordnung ist dabei zu verstehen, dass das Wärmeleitelement zumindest das Lichtfeld umschließt, beispielsweise indem das Wärmeleitelement in Draufsicht gesehen ringförmig ausgebildet ist und somit beispielsweise ein in Draufsicht gesehenes kreisförmiges Lichtfeld umschließt.Under a module plate according to the invention is in particular a known LED module plate to understand, which usually comprises a printed circuit board (for example, a FR4 composite material) with conductor tracks and terminal pads on a thermally well conductive support plate (for example, a metal such as aluminum, copper or the like) is arranged. A light field according to the invention is to be understood as any LED arrangement on the module plate. The light field or the module plate can be designed such that the light field projects into the light emission opening, flush with the underside of the light emission opening, or that the light field is arranged slightly below the light emission opening. The arrangement of the heat-conducting element on the inside of the light-emitting opening can be effected such that the heat-conducting element is in direct contact with the inside of the light-emitting opening or is spaced from the inside. Under one Circumferential arrangement is to be understood that the heat-conducting element surrounds at least the light field, for example by the heat-conducting element is annular in plan view and thus encloses, for example, a circular light field seen in plan view.

Mit anderen Worten schlägt die vorliegende Erfindung vor, ein Wärmeleitelement derart an der Innenseite der Lichtabgabeöffnung anzuordnen, dass die vom Lichtfeld anfallende Wärme von den benachbarten Gehäuseteilen des Gehäuses durch das Wärmeleitelement quasi abgefangen wird und in die Trägerplatte der Modulplatte abgeleitet wird.In other words, the present invention proposes to arrange a heat-conducting element on the inside of the light-emitting opening such that the heat arising from the light field is quasi absorbed by the adjacent housing parts of the housing by the heat-conducting element and is discharged into the carrier plate of the module plate.

Durch die vorliegende Erfindung besteht somit die Möglichkeit das Gehäuseelement, insbesondere die zum Lichtfeld benachbarten Gehäuseteile, thermisch quasi abzuschirmen, so dass die Gefahr einer Verfärbung, Versprödung oder Deformierung des Gehäuseelements vermieden bzw. erheblich reduziert werden kann und dies selbst dann, wenn weitere optische Elemente, die selbst Wärme erzeugen oder die sich durch den Betrieb der LED aufheizen können am Gehäuse bzw. an der Lichtabgabeöffnung verbaut werden. Ferner besteht durch die vorliegende Erfindung die Möglichkeit, das Gehäuseelement mit einem vergleichsweise günstigen, demgegenüber jedoch einem vergleichsweise thermisch nur gering beständigen Gehäusematerial bereitzustellen.The present invention thus provides the option of thermally shielding the housing element, in particular the housing parts adjacent to the light field, so that the risk of discoloration, embrittlement or deformation of the housing element can be avoided or considerably reduced, even if further optical elements , which themselves generate heat or which heat up by the operation of the LED can be installed on the housing or at the light-emitting opening. Furthermore, the present invention makes it possible to provide the housing element with a comparatively favorable housing material, which, however, is comparatively thermally only slightly resistant.

Vorzugsweise ist das Wärmeleitelement mittels einer Presspassung in der Lichtabgabeöffnung angeordnet ist. Dadurch besteht insbesondere die Möglichkeit, ein Wärmeleitelement verliersicher in einem Gehäuseelement vormontieren zu können.Preferably, the heat-conducting element is arranged by means of a press fit in the light-emitting opening. As a result, it is possible, in particular, to be able to pre-assemble a heat-conducting element captive in a housing element.

Vorteilhafterweise weist das Wärmeleitelement in Draufsicht gesehen eine zum Lichtfeld korrespondierend ausgebildete Geometrie auf, beispielsweise kann ein in Draufsicht gesehenes kreisförmig oder polygonal ausgebildetes Lichtfeld mittels einem in Draufsicht gesehenen ringförmige oder polygonale ausgebildeten Wärmeleitelement umfasst werden.Advantageously, seen in plan view, the heat-conducting element has a geometry corresponding to the light field, for example a circular or polygonal light field seen in plan view can be encompassed by means of a ring-shaped or polygonal heat-conducting element formed in plan view.

Das Wärmeleitelement umfasst vorzugsweise zumindest zwei Anlageflächen, die mit der Trägerplatte oder mit korrespondierend ausgebildeten zwei Anlageflächen der Trägerplatte in thermischen Kontakt stehen. Grundsätzlich besteht die Möglichkeit, dass das Wärmeleitelement über seinen gesamten Umfang auf der Trägerplatte aufliegt und mit diesem derart in thermischen Kontakt steht. Besonders bevorzugt ist allerdings, dass das Wärmeleitelement nur mittels der zwei Anlageflächen mit der Trägerplatte in Kontakt steht, so dass ausreichend Bauraum zu Verfügung steht, um elektrische Leiter an die Modulplatte bzw. an Anschlusspads der Leiterplatte führen zu können.The heat-conducting element preferably comprises at least two contact surfaces, which are in thermal contact with the carrier plate or with correspondingly formed two contact surfaces of the carrier plate. In principle, there is the possibility that the heat-conducting element over its entire Scope rests on the support plate and is in thermal contact with it. However, it is particularly preferred that the heat-conducting element is in contact with the carrier plate only by means of the two contact surfaces, so that sufficient installation space is available in order to be able to guide electrical conductors to the module plate or to connection pads of the printed circuit board.

Die zumindest zwei Anlageflächen des Wärmeleitelements können dabei bündig mit dem Gehäuseelement abschließen oder über das Gehäuseelement hinausragen, wobei Anlageflächen der Trägerplatte ebenfalls derart korrespondierend ausgebildet sein können, dass die jeweiligen Anlageflächen miteinander in Anlage und somit in thermischen Kontakt bringbar sind.The at least two contact surfaces of the heat-conducting element can terminate flush with the housing element or protrude beyond the housing element, wherein contact surfaces of the support plate can also be designed correspondingly such that the respective contact surfaces can be brought into contact with each other and thus in thermal contact.

In der Leiterplatte der Modulplatte sind vorzugsweise Aussparungen bzw. Ausstanzungen vorgesehen, so dass die Anlageflächen der Trägerplatte auf einfache Weise mit den Anlageflächen des Wärmeleitelements in Kontakt bringbar sind, ohne dass dabei die Leiterplatte im Weg steht. Je nach Ausbildung der Anlageflächen des Wärmeleitelements können die Anlageflächen der Trägerplatte dabei über die Leiterplatte hinausragen.In the circuit board of the module plate recesses or punched holes are preferably provided so that the contact surfaces of the support plate in a simple manner can be brought into contact with the contact surfaces of the heat conduction, without causing the circuit board is in the way. Depending on the design of the contact surfaces of the heat-conducting element, the contact surfaces of the carrier plate may protrude beyond the printed circuit board.

Vorzugsweise ist das Wärmeleitelement im Querschnitt stufenförmig ausgebildet. Insbesondere durch die stufenförmige Ausbildung besteht die einfache Möglichkeit am Wärmeleitelement optische Elemente anzuordnen, beispielsweise ein Reflektorelement, ein Diffusorelement, ein Linsenelement, ein Abdeckung oder eine Remote-Phosphor-Platte.Preferably, the heat-conducting element is step-shaped in cross-section. In particular, by the step-shaped design is the easy way to arrange the heat conduction optical elements, such as a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate.

Vorteilhafterweise ist das Wärmeleitelement aus einem wärmeleitfähigen metallischen Material, einem wärmeleitfähigen Keramikwerkstoff oder einem wärmeleitfähigen Kunststoffmaterial bereitgestellt, beispielsweis aus Aluminium, Kupfer, Edelstahl, Aluminiumnitrid-Keramik, Aluminium-Oxyd-Keramik oder aus einem Kunststoff mit einem Füllstoff zur Erhöhung der thermischen Leitfähigkeit bereitgestellt ist. Vorzugsweise ist das Wärmeleitelement aus einem Material bzw. einer Materialmischung bereitgestellt, das eine Wärmeleitfähigkeit zwischen 2 und 400 W/mK aufweist, vorzugsweise zwischen 30 und 350 W/mK und besonders bevorzugt zwischen 150 und 300 W/mK. Als Material für das Wärmeleitelement kann insbesondere ein Aluminiumoxid (Al2O3) oder im Wesentlichen reines Aluminium eingesetzt werden. Ein Aluminiumoxid kann dabei beispielsweise mit einer Wärmeleitfähigkeit von etwa 30 W/mK, reines Aluminium mit einer Wärmeleitfähigkeit von etwa 300 W/mK bereitgestellt werden.The heat-conducting element is advantageously made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material, for example made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramic or a plastic with a filler for increasing the thermal conductivity , The heat-conducting element is preferably made of a material or a material mixture which has a thermal conductivity between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK. As the material for the heat-conducting element, in particular an aluminum oxide (Al 2 O 3 ) or substantially pure aluminum can be used. An alumina can, for example, with a Thermal conductivity of about 30 W / mK, pure aluminum with a thermal conductivity of about 300 W / mK can be provided.

Das Basismaterial der Leiterplatte ist vorzugsweise ein FR-4 Verbundmaterial, wobei die Trägerplatte vorzugsweise aus einem wärmeleitfähigen metallischen Material, insbesondere aus Aluminium, Kupfer oder einem Edelstahl, bereitgestellt ist.The base material of the printed circuit board is preferably a FR-4 composite material, wherein the carrier plate is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel.

An der Modulplatte bzw. am Trägerelement der Modulplatte, ist vorteilhafterweise ein Kühlkörper angeordnet. Bei einer solchen Ausgestaltung kann somit Wärme vom Wärmeleitelement über die Trägerplatte der Modulplatte in den Kühlkörper geführt werden.On the module plate or on the carrier element of the module plate, a heat sink is advantageously arranged. With such a configuration, heat can thus be conducted from the heat-conducting element via the carrier plate of the module plate into the heat sink.

Vorteilhafterweise umfasst das Gehäuseelement zumindest zwei Kabelführungen. Vorzugsweise sind die Modulplatte und das Gehäuseelement mittels einer Klebe-, einer Schraub- und/oder einer Pressverbindung verbunden. Ferner sind am Gehäuseelement vorzugsweise Schraubaufnahmen zur Befestigung des LED-Moduls vorgesehen.Advantageously, the housing element comprises at least two cable guides. Preferably, the module plate and the housing element are connected by means of an adhesive, a screw and / or a press connection. Furthermore, preferably screw receptacles for fixing the LED module are provided on the housing element.

4. Beschreibung einer bevorzugten Ausführungsform4. Description of a preferred embodiment

Nachfolgend wird eine detaillierte Beschreibung der Figuren gegeben. Darin zeigt:

Figur 1
eine schematische Ansicht einer bevorzugten Ausführungsform eines erfindungsgemäßen LED-Moduls;
Figur 2
eine schematische Querschnittsansicht des LED-Moduls aus Figur 1;
Figur 3
eine schematische Querschnittsansicht des LED-Moduls aus Figur 1;
Figur 4
eine schematische Ansicht der Leiterplatte und des Wärmeleitelements des LED-Moduls aus Figur 1;
Figur 5
eine schematische Ansicht der Leiterplatte und des Wärmeleitelements des LED-Moduls aus Figur 1; und
Figur 6
eine schematische Ansicht der Leiterplatte und des Wärmeleitelements des LED-Moduls aus Figur 1.
Hereinafter, a detailed description of the figures will be given. It shows:
FIG. 1
a schematic view of a preferred embodiment of an LED module according to the invention;
FIG. 2
a schematic cross-sectional view of the LED module FIG. 1 ;
FIG. 3
a schematic cross-sectional view of the LED module FIG. 1 ;
FIG. 4
a schematic view of the circuit board and the heat-conducting element of the LED module FIG. 1 ;
FIG. 5
a schematic view of the circuit board and the heat-conducting element of the LED module FIG. 1 ; and
FIG. 6
a schematic view of the circuit board and the heat-conducting element of the LED module FIG. 1 ,

Die Figuren 1 bis 3 zeigen eine schematische Ansicht einer bevorzugten Ausführungsform eines erfindungsgemäßen LED-Moduls 10 in Form eines LED-Spotlight Moduls.The FIGS. 1 to 3 show a schematic view of a preferred embodiment of an LED module 10 according to the invention in the form of an LED spotlight module.

Das LED-Modul 10 umfasst ein in Draufsicht gesehen kreisförmiges Gehäuse bzw. Gehäuseelement 11, in dessen mittleren Bereich eine in Draufsicht gesehen kreisförmige Lichtaustrittsöffnung 12 vorgesehen ist, wobei in der bzw. unterhalb der Lichtaustrittsöffnung 12 ein korrespondierend, kreisförmig ausgebildetes Lichtfeld 13 angeordnet ist.The LED module 10 comprises a circular housing or housing element 11 seen in plan view, in the middle region of which a circular light exit opening 12 is provided, viewed in plan view, wherein a corresponding, circular light field 13 is arranged in or below the light exit opening 12.

Das Lichtfeld 13 ist dabei aus mehreren LED 14 gebildet, über denen eine Vergussmasse vorgesehen ist, wobei diese gegebenenfalls mit einem Leuchtstoff versehen werden kann. Die LED 14 sind dabei auf einer Modulplatte angeordnet, die aus einer Leiterplatte 15 und einer Trägerplatte 16 aufgebaut ist bzw. diese umfasst.The light field 13 is formed from a plurality of LED 14, over which a potting compound is provided, which may optionally be provided with a phosphor. The LED 14 are arranged on a module plate which is constructed of a printed circuit board 15 and a support plate 16 and this includes.

Die Leiterplatte kann als ein Printed Circuit Board (PCB) und die Trägerplatte als eine Aluminium- oder eine Kupferplatte ausgeführt werden.The printed circuit board can be designed as a printed circuit board (PCB) and the carrier plate as an aluminum or a copper plate.

Wie insbesondere in Figur 2 gut zu erkennen ist, ist an der Innenseite der Lichtaustrittsöffnung 12 ein das Lichtfeld 13 umlaufendes, ringförmiges Wärmeleitelement 17 angeordnet. Im Querschnitt erstreckt sich das Wärmeleitelement 17 (jedenfalls in Teilbereichen des Umfangs) von der Trägerplatte 16 bis zur oberen Kante der Innenseite der Lichtaustrittsöffnung 12, mit der es in der bevorzugten Ausführungsform bündig abschließt. Das Wärmeleitelement 17 ist dabei im Querschnitt vorzugsweise stufenförmige ausgebildet, so dass auf einfache Weise weitere optische Elemente an diesem angeordnet werden können (beispielsweise ein Reflektorelement, ein Diffusorelement, ein Linsenelement, ein Abdeckung oder eine Remote-Phosphor-Platte).As in particular in FIG. 2 can be clearly seen, on the inside of the light exit opening 12 a the light field 13 encircling, annular heat conducting element 17 is arranged. In cross-section, the heat-conducting element 17 extends (at least in partial regions of the circumference) from the carrier plate 16 to the upper edge of the inside of the light exit opening 12, with which it terminates flush in the preferred embodiment. The heat-conducting element 17 is preferably step-shaped in cross-section, so that further optical elements can be arranged thereon in a simple manner (for example a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate).

Das Wärmeleitelement 17 kann somit das Gehäuseelement 11 bzw. zumindest die Innenseite der Lichtaustrittsöffnung 12 von der Wärme des Lichtfelds 13 abschirmen und die anfallende Wärme an die Trägerplatte 16 führen, die es umfangseitig in Teilbereichen thermisch kontaktiert (vgl. Figur 3). Somit besteht die Möglichkeit das Gehäuseelement 11, insbesondere die zum Lichtfeld 13 benachbarten Gehäuseteile, thermisch abzuschirmen, so dass die Gefahr einer Verfärbung, Versprödung oder Deformierung des Gehäuseelements 11 vermieden bzw. erheblich reduziert werden kann, und dies selbst dann, wenn weitere optische Elemente, die selbst Wärme erzeugen oder die sich durch den Betrieb der LED 14 aufheizen können am Gehäuseelement 11 bzw. an der Lichtabgabeöffnung 12 verbaut werden. Ferner besteht nunmehr die Möglichkeit, das Gehäuseelement 11 mit einem vergleichsweise günstigen, demgegenüber jedoch einem vergleichsweise thermisch nur gering beständigen Gehäusematerial bereitzustellen.The heat-conducting element 17 can thus shield the housing element 11 or at least the inside of the light exit opening 12 from the heat of the light field 13 and cause the resulting heat to be transmitted to the carrier plate 16, which thermally contacts it circumferentially in partial areas (cf. FIG. 3 ). Thus, it is possible to thermally shield the housing element 11, in particular the housing parts adjacent to the light field 13, so that the risk of discoloration, embrittlement or deformation of the housing element 11 can be avoided or significantly reduced, and this even if other optical elements that generate heat itself or can heat up by the operation of the LED 14 on the housing element 11 and the light emitting opening 12 are installed. Furthermore, it is now possible to provide the housing element 11 with a comparatively low-cost, but in contrast, a comparatively thermally only slightly resistant housing material.

Wie in den Figuren 1 bis 3 ebenfalls gut zu erkennen ist, umfasst das Gehäuseelement 11 weiterhin Kontaktiermittel 18, um elektrische Leiter (nicht gezeigt) in das Gehäuseelement 11 bzw. zur Modulplatte führen zu können. Ferner umfasst das Gehäuseelement 11 zwei Schraubaufnahmen 19 zur Befestigung des LED-Moduls 10.As in the FIGS. 1 to 3 can also be seen well, the housing member 11 further includes contacting means 18 to lead electrical conductors (not shown) in the housing member 11 and the module plate can. Furthermore, the housing element 11 comprises two screw receptacles 19 for fastening the LED module 10.

In den Figuren 4 bis 6 ist eine schematische Ansicht des Wärmeleitelements 17 und der Leiterplatte 15 gezeigt.In the FIGS. 4 to 6 is a schematic view of the Wärmeleitelements 17 and the circuit board 15 is shown.

Wie in Figur 6 besonders gut zu erkennen ist, umfasst das Wärmeleitelement 17 vorzugsweise zwei Anlageflächen 20, die in zwei korrespondierende Aussparungen bzw. Ausstanzungen 21 der Leiterplatte 15 angeordnet sind. Somit steht das Wärmeleitelement 17 vorzugsweise nicht über seinen vollen Umfang mit der Trägerplatte 16 in Kontakt, sondern nur mit den beiden Anlageflächen 20 (vgl. Figur 3). Eine solche Ausgestaltung weist insbesondere den Vorteil auf, dass dadurch ausreichend Bauraum zur Verfügung steht, um elektrische Leiter zur Leiterplatte 15 führen zu können und diese an Anschlusspads 22 der Leiterplatte 15 befestigen bzw. an diesen anlöten zu können.As in FIG. 6 can be seen particularly well, the heat-conducting element 17 preferably comprises two contact surfaces 20, which are arranged in two corresponding recesses or punched-21 of the circuit board 15. Thus, the heat-conducting element 17 is preferably not in contact over its full circumference with the carrier plate 16, but only with the two contact surfaces 20 (cf. FIG. 3 ). Such a configuration has the particular advantage that there is sufficient space available to lead electrical conductors to the circuit board 15 and attach them to terminal pads 22 of the circuit board 15 and to be able to solder to these.

Die Trägerplatte 16 kann dabei als ebenes Bauteil ausgebildet sein, auf dem die Anlageflächen 20 aufliegen. Es besteht allerdings auch die Möglichkeit an der Trägerplatte 16 ebenfalls oder nur an dieser korrespondierend ausgebildete Anlageflächen vorzusehen. An der Trägerplatte 16 wird vorzugsweise ein Kühlkörper (nicht gezeigt) angeordnet, so dass die Wärme vom Wärmeleitelement 17 über die Trägerplatte 16 an den Kühlkörper abgegeben werden kann.The support plate 16 may be formed as a planar component, on which the contact surfaces 20 rest. However, it is also possible to provide on the support plate 16 also or only on this correspondingly formed contact surfaces. On the support plate 16, a heat sink (not shown) is preferably arranged, so that the heat from the heat-conducting element 17 can be delivered via the support plate 16 to the heat sink.

Das Wärmeleitelement 17 ist vorzugsweise aus einem wärmeleitfähigen metallischen Material, einem wärmeleitfähigen Keramikwerkstoff oder einem wärmeleitfähigen Kunststoffmaterial bereitgestellt ist, insbesondere aus Aluminium, Kupfer, Edelstahl, Aluminiumnitrid-Keramik, Aluminium-Oxyd-Keramik oder aus einem Kunststoff mit einem Füllstoff zur Erhöhung der thermischen Leitfähigkeit bereitgestellt. Vorzugsweise wird das Wärmeleitelement 17 aus einem Material bzw. einer Materialmischung mit einer Wärmeleitfähigkeit zwischen 2 und 400 W/mK, vorzugsweise zwischen 30 und 350 W/mK und besonders bevorzugt zwischen 150 und 300 W/mK, bereitgestellt.The heat-conducting element 17 is preferably made of a thermally conductive metallic material, a thermally conductive ceramic material or a thermally conductive plastic material is provided, in particular made of aluminum, copper, stainless steel, aluminum nitride ceramic, aluminum oxide ceramics or plastic provided with a filler for increasing the thermal conductivity. The heat-conducting element 17 is preferably made of a material or a material mixture having a thermal conductivity of between 2 and 400 W / mK, preferably between 30 and 350 W / mK and particularly preferably between 150 and 300 W / mK.

Die Trägerplatte 16 ist vorzugsweise aus einem wärmeleitfähigen metallischen Material bereitgestellt, insbesondere aus Aluminium, Kupfer oder einem Edelstahl. Die Leiterplatte 15 ist vorzugsweise aus einem FR-4 Verbundmaterial bereitgestellt.The support plate 16 is preferably made of a thermally conductive metallic material, in particular of aluminum, copper or a stainless steel. The circuit board 15 is preferably made of a FR-4 composite material.

Die vorliegenden Erfindung ist nicht auf das vorhergehend gezeigte Ausführungsbeispiel eines erfindungsgemäßen LED-Moduls beschränkt, solange sie vom Gegenstand der folgenden Ansprüche umfasst ist. Insbesondere ist die vorliegende Erfindung nicht auf eine spezifische Geometrie des Lichtfelds oder des Wärmeleitelements beschränkt, solange das Wärmeleitelement derart an der Innenseite der Lichtabgabeöffnung angeordnet ist, dass dieses das Gehäuseelement von der Wärme der LED abschirmen kann. Auch ist die vorliegende Erfindung nicht auf ein Wärmeleitelement 17 mit einem bestimmten Material beschränkt.The present invention is not limited to the previously shown embodiment of an LED module according to the invention, as long as it is encompassed by the subject of the following claims. In particular, the present invention is not limited to a specific geometry of the light field or the heat conducting element, as long as the heat conducting element is arranged on the inside of the light emitting opening, that this can shield the housing element from the heat of the LED. Also, the present invention is not limited to a heat conduction member 17 having a specific material.

Claims (15)

  1. LED module (10), in particular LED spotlight module, comprising:
    - a housing element (11) preferably made from plastic, having at least one light emission opening (12);
    - at least one module plate having at least one light field (13) on which at least one light-emitting diode (14) is arranged, wherein the module plate is arranged at the housing element (11) such that the light field (13) is arranged in the or below the light emission opening (12) of the housing element (11), and wherein the module plate comprises a printed circuit board (15) and a carrier plate (16);
    characterized in that at least one circumferential heat-conducting element (17), which is in thermal contact with the carrier plate (16) of the module plate, is arranged at the inside of the light emission opening (12),
    and in that the heat-conducting element (17) comprises at least two contact surfaces (20), which are in thermal contact with the carrier plate (16) or with correspondingly formed contact surfaces of the carrier plate (16).
  2. LED module (10) according to Claim 1, wherein the heat-conducting element (17) is arranged in the light emission opening (12) by way of a press fit.
  3. LED module (10) according to either of Claims 1 and 2, wherein the heat-conducting element (17) has a ringshaped or polygonal form in top view.
  4. LED module (10) according to one of the preceding claims, wherein the light emission opening (12) and the light field (13), which is arranged in the light emission opening (12), have a circular or polygonal form in top view.
  5. LED module (10) according to Claim 1, wherein cutouts are provided in the heat-conducting element (17) between the contact surfaces to guide electrical conductors to the module plate, in particular to connection pads which are provided at the printed circuit board (15).
  6. LED module (10) according to either of Claims 1 and 5, wherein corresponding cutouts are provided in the printed circuit board (15) in the region of the contact surfaces of the carrier plate (16), wherein the contact surfaces (20) of the heat-conducting element (17) preferably project beyond the printed circuit board (15).
  7. LED module (10) according to one of the preceding claims, wherein the heat-conducting element (17) has a step-shaped form in cross section.
  8. LED module (10) according to one of the preceding claims, wherein optical elements are arranged at the heat-conducting element (17), in particular a reflector element, a diffuser element, a lens element, a cover or a remote phosphor plate.
  9. LED module (10) according to one of the preceding claims, wherein the heat-conducting element (17) is provided from a heat-conductive metallic material, a heat-conductive ceramic material or a heat-conductive plastics material, in particular from aluminium, copper, stainless steel, aluminium nitride ceramic, aluminium oxide ceramic or from a plastic with a filler for increasing the thermal conductivity.
  10. LED module (10) according to one of the preceding claims, wherein the heat-conducting element (17) is provided from a material or a material mix that has a heat conductivity between 2 and 400 W/mK, preferably between 30 and 350 W/mK and with particular preference between 150 and 300 W/mK.
  11. LED module (10) according to one of the preceding claims, wherein the base material of the printed circuit board (15) is an FR-4 composite material, and wherein the carrier plate (16) is provided from a heat-conductive metallic material, in particular from aluminium, copper or a stainless steel.
  12. LED module (10) according to one of the preceding claims, wherein a heat sink is arranged at the module plate.
  13. LED module (10) according to the preceding claims, wherein the housing element (11) comprises at least two cable guides.
  14. LED module (10) according to one of the preceding claims, wherein the module plate and the housing element (11) are connected by way of an adhesive connection, a screw connection and/or a press connection.
  15. LED module (10) according to one of the preceding claims, wherein screw receivers (19) for attaching the LED module (10) are provided in the housing element (11).
EP17154292.1A 2016-02-26 2017-02-02 Led-module Active EP3211303B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202016101026.8U DE202016101026U1 (en) 2016-02-26 2016-02-26 LED module

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EP3211303B1 true EP3211303B1 (en) 2018-07-25

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128070A1 (en) * 2006-05-10 2007-11-15 Spa Electrics Pty Ltd Assembly including a fastening device
US20120120659A1 (en) * 2010-11-16 2012-05-17 Lopez Peter E Board assemblies, light emitting device assemblies, and methods of making the same

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TWM409356U (en) * 2009-09-24 2011-08-11 Molex Inc Receptacle for light module
DE202010009574U1 (en) * 2010-06-22 2010-09-16 Li, Chia-Mao Annular encapsulation
JP6094746B2 (en) * 2013-03-22 2017-03-15 東芝ライテック株式会社 Lamp device and lighting device
DE102013107395B4 (en) * 2013-07-12 2016-08-25 Rüdiger Lanz LED high-power spotlight
DE202013007592U1 (en) * 2013-08-26 2013-09-06 Osram Gmbh Semiconductor lamp with heat-conducting body between driver and driver housing

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128070A1 (en) * 2006-05-10 2007-11-15 Spa Electrics Pty Ltd Assembly including a fastening device
US20120120659A1 (en) * 2010-11-16 2012-05-17 Lopez Peter E Board assemblies, light emitting device assemblies, and methods of making the same

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