Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
  • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
  • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07773—Antenna details
  • G06K19/07777—Antenna details the antenna being of the inductive type
  • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
  • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

• the present invention relates to a method for manufacturing a plane support of "inlay" type containing a chip and an antenna connected together for example to be integrated in a passport and relates in particular to a method of manufacturing a radio frequency device support consisting of a single layer.
• Radio frequency identification (RFID) devices without contact are increasingly used for the identification of people traveling in areas with controlled access or transiting from one area to another.
• a contactless RFID device is a device consisting of an antenna and a chip connected to the terminals of one antenna. The chip is generally not powered and receives its energy by electromagnetic coupling between the antenna of the reader and the antenna of the RFID device. Information is exchanged between the RFID device and the reader and in particular the information stored in the chip relating to the identification of the owner of the object on which the RFID device is located and its authorization to enter an access zone. control.
• passports may incorporate RFID devices for the identification of the passport holder.
• the memory of the chip contains information such as the identity of the passport holder, his country of origin, his nationality, the visas of the various countries visited, the entry dates, the circulation restrictions, the biometric elements, etc. .
• the RFID device is generally manufactured independently of the passport to be incorporated subsequently by gluing for example between the cover and the lower cover page of the passport.
• the RFID device comprising the antenna and the chip connected together is integrated with an "inlay" of paper, plastic or otherwise.
• the prior art document FR 2 779 255 discloses a method of manufacturing an electronic device such as a contactless smart card whose contact pads consist of conductive ink deposited by printing on the surface of the card. , and extend by conductive tracks along the inclined walls of a cavity of the card and into the bottom thereof. The chip is then transferred to the bottom of the cavity. Such a method completely conceals the relief of the chip relative to its plane support and thus to make it invisible.
• the disadvantage of such a method lies in the difficulty of printing part of the antenna within a cavity. Presentation of the invention
• the object of the invention is to provide a method of manufacturing a radiofrequency device support which completely conceals the relief of the chip and which overcomes the aforementioned drawback.
• the object of the invention is therefore a method of manufacturing a radio frequency identification device (RFID) comprising a substrate provided with an antenna and a chip connected to the antenna, the antenna formed by the winding of several turns comprises a crossing zone of the turns, an insulating strip of dielectric material separating the superposed antenna turns at the crossing, the method comprising the following steps: performing the antenna consisting of printing in several passes and on the first face of the substrate a winding of turns, an insulating strip of dielectric material on a part of the turns, a first conductive ink contact composed of a first connection pad, a first connection and an electrical bridge located on the insulating strip, a second conductive ink contact composed of a second connection pad and a second link, each of the contacts being connected to one of the two ends of the the antenna,
• RFID radio frequency identification device
• FIG. 1 represents a view from above of the radiofrequency device support according to the invention
• FIG. 2 represents a view from above of the connection pads of the antenna
• FIG. 3 represents a perspective view of the element making the impression of the cavity
• FIG. 4 represents a sectional view along the axis AB of FIG. 2 of the cavity in the support
• FIG. 5 represents a sectional view of the layers constituting a passport cover and a radiofrequency device
• FIG. 6 represents a sectional view of the layers constituting a passport cover and a radiofrequency device according to an alternative embodiment.
• FIG. 1 shows a radiofrequency device 10.
• the radiofrequency device 10 comprises a substrate 11 that may be made of paper, synthetic paper, plastic or textile.
• the substrate used is a paper composed of cellulosic fibers, polyester fibers and latex fibers which give it a low density of between 0.5 and 0.9 g / cm 3 and preferably equal to 0.7 g / cm 3. cm3 thanks to a microporous network.
• the substrate 11 has a thickness of, for example, between 350 and 400 ⁇ .
• the use of other types of materials for the substrate 11 is possible without departing from the scope of the invention.
• the substrate 11 may be a synthetic paper consisting of a single unoriented layer of a polymer such as polyethylene or polypropylene loaded with mineral fillers between 40 and 80%.
• the substrate 11 is intended to be integrated in the cover of a security document such as a passport.
• the substrate 11 can be integrated into a valuable document other than a passport such as for example a contactless smart card or a contactless ticket.
• the radiofrequency device is manufactured according to the following steps:
• the first step consists in producing an antenna 13 on the first face 15 of the substrate 11.
• the radiofrequency device operates at high frequencies of the order of 13.56 MHz, so the antenna 13 is formed mainly of a planar winding of at least
• the device according to the invention is not limited to this frequency range and could operate at ultra-high frequencies without departing from the scope of the invention.
• the antenna would be composed of two strands and not a winding of turns.
• the antenna 13 and therefore the turns 12 are produced by offset, serigraphic, heliographic or flexographic printing of a conducting material of the polymer conductive ink type, charged with conductive elements such as silver, copper or carbon.
• the conductive ink used may also be based on nanoparticles.
• a second printing pass consists of producing an electrically insulating layer on the antenna turns 12 such as a dielectric layer 14 so as to form an insulating bridge on the antenna turns.
• This dielectric layer can be performed in one or two printing passes.
• the antenna has two ends 16 and 18.
• a new printing pass consists in making the contacts 27 and 29 of the antenna to which an electronic chip 20 will be connected and also consists in producing an electrical bridge 24 on the dielectric layer 14.
• the contacts 27 and 29 of the Antenna are produced by offset printing, screen printing, heliographic or flexographic printing of a conductive material of the conductive polymer type, loaded with elements conductors such as silver, copper or carbon.
• the conductive ink used may also be based on nanoparticles.
• the contacts 27 and 29 of the antenna are made so that each contact is respectively electrically connected to one of the ends 16 and 18 of the antenna.
• the substrate 11 is heat - treated to freeze the ink and after each printing pass of the dielectric material, the substrate is treated with ultraviolet radiation to crosslink the dielectric material.
• the next step is to make a cavity 22 on the first face 15 of the substrate 11 at the point where the electronic chip will be placed.
• This cavity is non-through and its depth is preferably greater than or equal to the thickness of the electronic chip which will be connected to the contacts so as to hide the chip in the cavity.
• the depth of the cavity 22 is preferably between 100 and 150 ⁇ for a chip thickness between 55 and 150 ⁇ .
• the cavity 22 seen from above has four edges and its shape is preferably rectangular with a side length of 5 mm and 6 mm. Geometrically, each small side of the rectangle forming the cavity 22 spans perpendicularly the conductive track respectively formed by the contacts 27 and 29.
• Each contact 27 and 29 respectively comprises a connection pad 26 and 28 whose shape allows a certain tolerance when connecting of the chip and a link 17 and 19.
• Each link 17 and 19 has a width substantially equal to the width of the antenna coil 12 or slightly wider and is intended to electrically connect each pad 26 and 28 at each of the ends 16 and 18 of the antenna.
• the first contact 27 comprises the first connection pad 26 and the first connection 17 which is extended by the electrical bridge 24.
• the second contact 29 comprises the second connection pad 28 and the second connection 19.
• the cavity 22 is created so as to to be centered on the pads 26 and 28 and so that the area of the flat surface of the bottom of the cavity 22 is greater than the area of the combined surface of the connection pads 26 and 28 and the chip 20.
• the links 17 and 19 are found both on the first face 15 of the substrate 11, on two of the lateral edges of the cavity and on the bottom of the cavity as can be seen in Figures 3 to 6.
• the non-through cavity 22 is obtained by making an impression in the substrate by application of a pressurized element.
• the pressure exerted is between 2400 N / cm 2 and 2700 N / cm 2 and is maintained for a period of 5 to 10 seconds so as to penetrate into the substrate with a depth corresponding to the height of the desired cavity.
• the element 30 shown in Figure 3 is based on a homogeneous and hard material that does not deform. It consists of a base 31 whose shape shown in FIG. 3 is nonlimiting and of a projecting part 32 intended to make the cavity 22 cavity in the substrate 11. The cavity 22 is thus obtained by deformation of the constituent material of the substrate in its thickness.
• the basic shape of the portion 32 of the element 30 is a rectangular parallelepiped whose dimensions are adapted to the dimensions of the desired cavity and some edges have been modified.
• the upper surface 72 of the portion 32 which contacts the surface 15 in parallel is a rectangle whose sides have a length of 5 and 6 mm.
• the two edges of the portion 32 located between the upper surface 72 and the side walls 73 and 75 are respectively replaced by a cylindrical surface 83 and 85 therefore a rounded allowing a smooth transition between the upper surface 72 and each of the walls 73 and 75.
• the curvature radius of the curvature is greater than the desired depth of the cavity, and preferably is twice the depth of the desired cavity. For example, for a cavity 150 ⁇ deep the radius of curvature of the rounded which comes into contact with the substrate must be greater than 300 ⁇ .
• the two cylindrical surfaces 83 and 85 come into contact with the printed connections 17 and 19 which deform under the effect of the pressure exerted but without any risk of to be cracked thanks to the cylindrical surfaces 83 and 85 of the part 32 of the element 30.
• the electrical continuity is ensured between the two ends of each of the links 17 and 19 and therefore between the connection pads and the antenna.
• the two edges between the upper surface 72 and the side walls 74 and 76 remain unchanged so that the side walls 74 and 76 are perpendicular to the upper surface 72.
• the cavity 22 is provided with a plane bottom 42 and two lateral walls and curves 34-1 and 34-2 on the two edges crossed by the links 17 and 19, the two side walls extend between the lower level (the bottom 42) and the upper level of the cavity (the first face 15 of the substrate 11).
• the element 30 is preheated to a temperature of 180 ° C. before being applied to the substrate.
• the pressure applied is between 2400 N / cm 2 and 2700 N / cm 2 and is preferably equal to 2500 N / cm 2 .
• the pressure and temperature are maintained for a period of between 5 and 10 seconds and preferably 6 seconds. According to these characteristics, the depth of the cavity obtained in the substrate is 130 ⁇ .
• the portion 32 of the element 30 could be cylindrical without departing from the scope of the invention.
• the projecting portion 32 has a single cylindrical side wall whose circular edge is replaced by a rounded.
• the next step is to connect the chip
• the chip 20 on the connection pads 26 and 28 of the antenna.
• the chip is commonly connected in a "flip-chip" configuration.
• the chip 20 is always placed on the bottom of the cavity in the central zone, an adhesive tip 33 is placed under the chip in order to immobilize it as can be seen in FIGS. 5 and 6.
• the substrate 11 provided with the antenna and the chip connected together and commonly called “inlay” is assembled to a layer 43 or 53 by means of a layer of adhesive 41.
• the layer 43 or 53 is the cover of a passport.
• the cover layer 43 or 53 has a base of paper or textile covered with a layer of polyester, it can have on its free face 44 a particular grain making it unfalsifiable.
• the substrate 11, the adhesive layer 41 and the layer 43 or 53 are superimposed and pressurized and heat to activate the adhesive properties of the adhesive layer 41 and thus assemble the cover layer 43 or 53 to the substrate 11 so to the inlay.
• the method comprises a variant.
• the cover layer 53 bonded to the substrate 11 has a non-through cavity 62 situated at the location of the chip and intended to compensate for the height of the chip which is not already compensated in the cavity 22 so that the chip is not visible on the free face 44 of the cover layer 53.
• the cavity 62 is preferably of parallelepipedal shape with a depth of between 60 and 100 ⁇ .
• the cavity 62 is made by any means, for example by scratching, by laser or by deformation of the material by hot or cold pressing as for the production of the cavity 22.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Computer Hardware Design (AREA)
• Credit Cards Or The Like (AREA)
• Details Of Aerials (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=54754685

Family Applications (1)

Country Status (6)

Family Cites Families (4)

• 2014
  • 2014-10-16 FR FR1402338A patent/FR3027433A1/fr not_active Withdrawn
• 2015
  • 2015-10-15 MA MA041687A patent/MA41687A/fr unknown
  • 2015-10-16 WO PCT/FR2015/000197 patent/WO2016059304A1/fr active Application Filing
  • 2015-10-16 BR BR112017007716A patent/BR112017007716A2/pt not_active Application Discontinuation
  • 2015-10-16 MX MX2017004865A patent/MX2017004865A/es unknown
  • 2015-10-16 EP EP15802179.0A patent/EP3207502A1/de not_active Withdrawn

Non-Patent Citations (2)

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