EP3180563A1 - Support de led servant à maintenir un module de led - Google Patents

Support de led servant à maintenir un module de led

Info

Publication number
EP3180563A1
EP3180563A1 EP15750396.2A EP15750396A EP3180563A1 EP 3180563 A1 EP3180563 A1 EP 3180563A1 EP 15750396 A EP15750396 A EP 15750396A EP 3180563 A1 EP3180563 A1 EP 3180563A1
Authority
EP
European Patent Office
Prior art keywords
led
led module
leadframe
holder
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15750396.2A
Other languages
German (de)
English (en)
Inventor
Luca Bordin
Arnulf Rupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP3180563A1 publication Critical patent/EP3180563A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F21V7/26—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F21V7/30—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED holder for holding an LED module having a leadframe.
  • the invention also relates to a light generating device, comprising at least one LED holder, on which at least one LED module
  • the invention is arranged, which LED module is equipped or equipped with at least one LED.
  • the invention further relates to a method for producing an LED holder.
  • the invention also relates to a method for providing a
  • Light-generating device The invention is particularly applicable to LED spotlights and LED headlights.
  • LED light generators are known in which multiple LEDs and a drive or
  • Driver electronics are arranged on a common board and at least the driver electronics is covered by a housing.
  • the LEDs can be equipped as LED chips in the so-called chip-on-board (“CoB”) on the circuit board
  • CoB chip-on-board
  • the LED module must be externally connected to driver electronics of the LED light generator, e.g. via suitable cables.
  • the disadvantage here is the limited or missing functionality, in particular due to lack of sensors such as temperature sensors.
  • An LED module is understood in particular to mean a unit of a plurality of interconnected LEDs.
  • a holder for holding an LED module, comprising a leadframe which is equipped with electrical and / or electronic components for operating the LED module, wherein the leadframe is at least partially surrounded by potting material and at least two exposed first contact areas for electrically contacting the LED module and at least two exposed second contact areas for electrical
  • Such an LED holder has the advantage that the shape of the leadframe (sometimes also referred to as a punched grid) can be retained by the potting material even under external mechanical stress. Depending on the chosen elasticity and / or stiffness of the potting material, the LED holder may be elastically yielding or practically stiff.
  • the potting material protects the leadframe against corrosion and abrasion in a particularly effective manner.
  • an electrically insulating potting material ensures a secure
  • potting material is particularly inexpensive attachable to the leadframe.
  • Potting material preferably has a high thermal conductivity.
  • potting material for example plastic such as silicone, polybutylene terephthalate (Abbreviation PBT), polycaprolactam (abbreviation PA6) or polycarbonate (abbreviation PC), etc.
  • plastic such as silicone, polybutylene terephthalate (Abbreviation PBT), polycaprolactam (abbreviation PA6) or polycarbonate (abbreviation PC), etc.
  • PBT polybutylene terephthalate
  • PA6 polycaprolactam
  • PC polycarbonate
  • Retaining element can advantageously be dispensed with, since the LED holder is self-supporting.
  • LED modules may have different LEDs, for example, in terms of color, power and / or number, and / or with any sensors, e.g. Temperature sensors, the holder can be easily added or replaced.
  • sensors e.g. Temperature sensors
  • Temperature sensor allows, for example, a particularly efficient thermal management.
  • Electrical components may e.g. resistors,
  • Capacitors, coils, diodes, oscillators, etc. include.
  • the electrical components are for a simple
  • SMDs Surface Mounted Devices
  • Electronic devices may include, for example, integrated devices such as microcontrollers, FPGAs, ASICs, and so on.
  • integrated components may also be in the form of bare chips or "bare dies.”
  • the leadframe may, however, also be equipped with an antenna, etc.
  • electrical and / or electronic components may in particular constitute a driver electronics or a part thereof.
  • the potting material may in particular be an injection-moldable potting material. If the potting material has been applied by means of an injection molding process, it may also be referred to as "overmolding".
  • the second contact areas serve a different electrical contact than that of the LED module, in particular for Contacting a connection element such as a
  • the contacting may be solvable or insoluble.
  • the second contact regions are arranged for easy contacting, in particular on a side edge of the leadframe or of the LED holder.
  • the structure of the leadframe or lead frame is not limited and may be made of, for example, a copper alloy, steel, brass, etc., and e.g. coated with nickel, silver, tin, etc.
  • the LED holder has at least one opening for insertion or passage of a respective LED module, in particular a central opening.
  • a shape of the opening is arbitrary and may be e.g. be circular or angular. It preferably corresponds to a shape and size of a Lichtabstrahl Colours the LED module.
  • the opening may comprise an opening in the potting material which is congruent to an opening in the leadframe. The opening in the potting material is preferably slightly smaller than the opening in the leadframe, so that a
  • Leadframe can serve as a plant or stop and / or for accurate positioning of the LED module.
  • the LED holder may have a top view of the opening
  • annular outer contour may in particular a
  • One of Contact area may be used for example for reading sensor data of a temperature sensor.
  • the potting material may in particular for the case that a second contact area of the leadframe a line terminal
  • a "wire trap” may be formed therein with a support mechanism for holding a conduit in the conduit clamp, such as a latching tab
  • the retention mechanism may include, for example, a release mechanism for releasing the otherwise trapped conduit.
  • the potting material may be designed to be at least partially reflective for an increased light output or for a reduced loss of light. This is especially true if the LED holder is intended to be used in a retroreflective environment.
  • the reflective property may be, for example, diffuse or specular
  • the LED holder may be attached to it (e.g.
  • Heatsink in particular holding tabs, the e.g. Have holes for the passage of fasteners, e.g. Screw holes.
  • fasteners e.g. Screw holes.
  • the LED holder likes for this purpose alternatively or additionally elsewhere
  • the LED holder may also be used to attach the at least one LED module serving fasteners or
  • At least one second contact region is formed as a line terminal is. This allows a particularly simple and secure contacting of simple cables, in particular of wires.
  • At least a second contact area as a plug connection (plug,
  • Plug-in element for example, a USB connector, a Firewire connector, a Lightning connector, an Ethernet cable
  • the element which can be connected to the at least one second contact region may also be permanently attached thereto, e.g. be soldered.
  • the second contact areas may be for a particular
  • the insoluble attachment may e.g. by welding, in particular
  • the lead frame basic form may be a quasi-endless leadframe band.
  • At least one, preferably all second contact regions are formed such that one is attached thereto
  • connection lines can be avoided.
  • At least one first contact region is formed as a resilient contact tab.
  • the LED module in particular contact fields thereof, can be pressed on it, which is a particularly simple
  • Contact tab may extend in particular into the opening of the LED holder. Such contact tabs enable
  • a light generating ⁇ device comprising at least one LED holder as described above, on which at least one LED module arranged, in particular fixed, is.
  • the leadframe of the LED holder is electrically connected via its first contact areas with the LED module.
  • the LED module is equipped with at least one light emitting diode (LED). If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white). Also, the light emitted by the at least one light emitting diode, an infrared light
  • IR-LED infrared light
  • UV-LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; e.g. a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor
  • the phosphor may alternatively or additionally be arranged away from the light-emitting diode
  • the at least one light emitting diode may be in the form of at least one individually housed light emitting diode or in 0
  • Form present at least one LED chip Form present at least one LED chip.
  • Several LED chips can be mounted on a common substrate ("submount").
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
  • organic LEDs instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used.
  • OLEDs organic LEDs, for example polymer OLEDs
  • the light-generating device may be any light-generating device.
  • the light-generating device may be any light-generating device.
  • Light generator or "light engine” be.
  • the LED module is a CoB module.
  • a substrate in particular a
  • PCB be equipped with at least one LED chip. Furthermore, at least two contact fields for contacting the first contact regions of the LED holder may be present on the substrate.
  • the at least one LED in particular LED chip, may be encapsulated, in particular with a light-transmissive potting material containing e.g. Epoxy or silicone.
  • the LED module may be an electronic carrier, which allows a particularly simple and inexpensive design.
  • the LED module may be part of electronics for operating the at least one LED of the LED module
  • the LED module has at least one sensor for the thermal management of the LEDs or of the LED module, in particular a temperature sensor, and / or at least one coding device.
  • Temperature sensor may be eg an NTC resistor.
  • the LED module may also be very accurate, for example
  • the LED module for brightness control may e.g. have a brightness sensor.
  • the LED module may alternatively or additionally comprise at least one component as one or part of a coding device which serves to identify it by the LED carrier or the electronics arranged thereon, e.g. a resistor with one for the type of LED module
  • the resistance may be, for example
  • the light generating device may be attached to a heat sink such that the LED holder presses the at least one LED module onto the heat sink.
  • the LED module may press with its front side against the associated first contact regions and rest with its rear side against the heat sink.
  • the LED holder is preferably also with its back or with the back of the overmolded leadframe on the heat sink.
  • Pressing force by means of which the LED holder presses the LED module onto the heat sink, may result, in particular, from an elastic restoring force of the first contact areas bent by the pressing of the LED module.
  • the heat sink may be a component of the light generation device ⁇ . Instead of the heat sink likes the
  • a direct, effective cooling of the housed in the housing components can be achieved, for example by placing the equipped with at least one LED module LED holder with its open back on a heat sink. For example, such a side facing away from the LEDs back of the LED module sit directly and not only on a rear housing wall on the heat sink and thereby cooled.
  • the light generating device may further include a housing
  • the housing may in particular cover a part of the LED holder which has exposed (not molded) electrical and / or electronic components.
  • the housing may in particular have a translucent opening, in particular a central translucent
  • the object is further achieved by a method for
  • the method may include at least the following steps: providing a lead frame by adapting a lead frame basic form; Equipping the leadframe with electrical and / or electronic components; and encapsulating the leadframe with a potting material so that at least two first contact areas for electrical
  • the steps of placement and overmolding may be in this order or in reverse order
  • the method gives the same advantages as the LED holder and can be made analog.
  • the leadframe basic form can be inexpensive
  • the adaptation of the leadframe basic shape, so that it is suitable for use in the LED holder, for example, may include a partial step of unifying the leadframe from the
  • Leadframe basic shape along a desired outer contour of the leadframe and / or a separation of traces for
  • the separation may be e.g. done by punching, laser cutting, etc.
  • the fitting may also be a bending over to make one, for example
  • An additional step may be to firmly connect at least one terminal, e.g. a previously made
  • Line terminal or a connector, with previously separated leadframe include.
  • the encapsulation of the leadframe with the potting material is followed by a step of severing at least one conductor track of the leadframe.
  • the routing of the leadframe can be formed even more diverse.
  • the leadframe can be divided into two or more separate parts without falling apart, since the parts are mechanically held together by the encapsulation. This allows, for example, an admission of the
  • At least one of the parts, in particular at least two of the Parts may be contactable by means of a contact tab or contact spring.
  • the method may also include a step of testing the LED holder.
  • Light generating device in particular one
  • Fig.l shows a plan view in section a
  • FIG. 3 shows a plan view in a sectional view of a
  • Fig.l shows an LED holder 11 after a first
  • Leadframe 12 at least largely surrounding encapsulation 13 of an injection-moldable plastic.
  • the leadframe 12 and its encapsulation 13 and thus also the LED holder 11 have an annular basic shape.
  • the leadframe 12 has for this purpose a circular central recess 14, which is arranged concentrically to a circular central recess 15 of the encapsulation 13.
  • the contact lugs 17 are here distributed equidistant around the circumference of the opening 16 and the recess 14 of the leadframe 12.
  • the contact tabs 17 in particular by a punching and / or forming process of a leadframe basic shape
  • the leadframe 12 has a basically circular
  • the line terminals 20 are on the outside so through the
  • Encapsulation 13 encapsulates that an introduction or a
  • connection cables Wl, W2, W3 in the line terminals 20 is possible.
  • the encapsulation 13 likes there
  • connection cables W1, W2, W3 may be firmly connected to the line terminals 20, e.g. by soldering or welding, or may be releasably supported therein, e.g. by a clamp or a releasable locking.
  • the connecting cables Wl, W2, W3 can be supplied with
  • the leadframe 12 is equipped with electrical and / or electronic components 29, which are used to operate one in the LED Holder 11 to be used LED module 23 are provided.
  • electrical and / or electronic components 29 which are used to operate one in the LED Holder 11 to be used LED module 23 are provided.
  • one is the electrical and / or
  • the electrical and / or electronic components 29 may not be surrounded or encapsulated by the encapsulation 13, which improves their heat dissipation.
  • An LED module 23 is provided for holding by the LED holder 11.
  • the LED module 23 has a substrate 24, e.g. a printed circuit board or a printed circuit board
  • Ceramic substrate Arranged centrally on a front side of the substrate 24 are LEDs (not shown), which are provided by a potting compound 25 containing phosphor, e.g. made of silicone, are covered. Outside the potting compound 25, a plurality of, here: four, contact fields 26 are present on the substrate 24 on the front side. These are electrically connected via printed conductors with the LEDs for their operation. Also, two of the contact pads 26 are connected to the two terminals of a temperature sensor, e.g. an NTC resistor 27, connected. By means of the NTC resistor 27, e.g. a thermal management of the LED chips are made possible. In addition or as an alternative to the NTC sensor 27, for example, a coding element in the form of e.g.
  • a coding resistor for identifying the LED module 23 may be present.
  • the more than two-fold electrical contacting of the LED module 23 allows independent operation of multiple strands of LEDs, e.g. different color, e.g. red, green or blue.
  • the LEDs are preferably LED chips (sometimes also referred to as unhoused LD chips), so that the LED module 23 is designed as a CoB ("chip-on-board") module
  • Another application is that to power the electronics on the LED holder 11 a
  • Center tap is connected to a contact tab.
  • the LED module 23 is inserted with its front side into the recess 14 of the leadframe 12 such that the phosphor containing potting compound 25 projects into or through the recess 14, while the contact pads 26 are pressed against the contact tabs 17, which are thereby elastically bent.
  • the contact tabs 17 thus serve for electrical
  • the substrate 24 of the LED module 23 also has two mounting holes 28 for mounting the LED module 23 to the LED carrier 11, e.g. by means of a
  • the LED holder 11 and the LED module 23 together form a light generating device, in particular a light engine or light generator 11, 23.
  • the light generator 11, 23 can be placed with its back on a base and attached thereto.
  • the pad is preferably a heat sink (not shown).
  • mounting holes 30 are provided in the leadframe 12 and in the overmold 13 in order to secure the LED holder 11, e.g. by means of a
  • FIG. 2 shows a plan view in sectional view of an LED holder 31 according to a second embodiment.
  • the LED holder 31 is constructed similarly to the LED holder 11.
  • the LED holder 31 has a leadframe 32 with an encapsulation 33, each having a four-sided, in particular square, outer contour 34 in plan view.
  • At each of the four straight sides of the outer contour 34 each includes an overmolded
  • Line terminal 20 on the outside. In the line terminals 20 each one of four wires or cables Wl to W4 are used.
  • FIG. 3 shows a sectional plan view of an LED holder 41 according to a third exemplary embodiment.
  • the LED holder 41 is constructed similarly to the LED holder 11, but differs in that a second
  • Plug connection is designed here as a bus-like connection in the form of a USB connection 44.
  • a USB device 45 may be connected to the USB port 44, e.g. a USB memory stick, a radio transmitter / receiver, e.g. for upgrading as Wifi and / or Bluetooth device, or also a USB cable for wired communication.
  • on may be taken to mean a singular or a plurality, in particular in the sense of “at least one” or “one or more”, etc., as long as this is not explicitly excluded, eg by the expression “exactly a ", etc. Also, a number can include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un support de LED (11 ; 31 ; 41) servant à maintenir un module de LED (23), présentant une grille de connexion (12 ; 32 ; 42) qui est munie de composants électriques et/ou électroniques (29) servant à faire fonctionner le module de LED (23). La grille de connexion (12 ; 32 ; 42) est au moins en partie entourée d'un matériau d'enrobage (13 ; 33 ; 43) et présente au moins deux premières zones de contact dégagées (17) pour la mise en contact électrique du module de LED (23) et au moins deux secondes zones de contact dégagées (20 ; 44) pour la mise en contact électrique. Un procédé de fabrication d'un support de LED (11) comprend les étapes suivantes : préparation d'une grille de connexion (12) par adaptation d'une forme de base de grille de connexion, montage de composants électriques et/ou électroniques (29) sur la grille de connexion (12) et enrobage par injection de la grille de connexion (12) avec un matériau d'enrobage (13) de telle manière qu'au moins deux premières zones de contact (17) pour la mise en contact électrique d'un module de LED (23) et au moins deux secondes zones de contact (20 ; 24) restent dégagées.
EP15750396.2A 2014-08-12 2015-08-10 Support de led servant à maintenir un module de led Withdrawn EP3180563A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014215985.7A DE102014215985A1 (de) 2014-08-12 2014-08-12 LED-Halter zum Halten eines LED-Moduls
PCT/EP2015/068391 WO2016023870A1 (fr) 2014-08-12 2015-08-10 Support de led servant à maintenir un module de led

Publications (1)

Publication Number Publication Date
EP3180563A1 true EP3180563A1 (fr) 2017-06-21

Family

ID=53836588

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15750396.2A Withdrawn EP3180563A1 (fr) 2014-08-12 2015-08-10 Support de led servant à maintenir un module de led

Country Status (4)

Country Link
US (1) US20170219195A1 (fr)
EP (1) EP3180563A1 (fr)
DE (1) DE102014215985A1 (fr)
WO (1) WO2016023870A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016202982A1 (de) * 2016-02-25 2017-08-31 Osram Gmbh LED-Modul und Verfahren zu dessen Herstellung
WO2018031635A1 (fr) * 2016-08-09 2018-02-15 Eaton Corporation Systèmes et composants hydrauliques comprenant une technologie de commande sans fil
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