EP3171451A1 - Räumlicher leistungskombinator - Google Patents

Räumlicher leistungskombinator Download PDF

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Publication number
EP3171451A1
EP3171451A1 EP16200051.7A EP16200051A EP3171451A1 EP 3171451 A1 EP3171451 A1 EP 3171451A1 EP 16200051 A EP16200051 A EP 16200051A EP 3171451 A1 EP3171451 A1 EP 3171451A1
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EP
European Patent Office
Prior art keywords
power combiner
transmission lines
spatial power
combiner
spatial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16200051.7A
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English (en)
French (fr)
Other versions
EP3171451B1 (de
Inventor
Hadrien THEVENEAU
Matthieu Werquin
Christophe GAQUIÈRE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universite de Lille 1 Sciences et Technologies
Microwave Characterization Center
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Universite de Lille 1 Sciences et Technologies
Microwave Characterization Center
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Publication of EP3171451B1 publication Critical patent/EP3171451B1/de
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/22—Attenuating devices
    • H01P1/23—Attenuating devices using ferromagnetic material

Definitions

  • the present invention relates to a spatial power combiner having a plurality of inputs and an output.
  • a power combiner is a device for combining the power of multiple inputs into a single output.
  • the generation of high power is necessary in some applications, for example in radar systems to emit a high power signal or communication systems to deliver a high power signal to a communication channel.
  • a power combiner is needed to add or combine power outputs from multiple power amplifiers.
  • power combiners are frequently used with a set of power amplifiers, each power amplifier amplifying an input signal and providing an output signal.
  • the power combiner combines the power of the output signals of the power amplifiers and generates a total output power.
  • a spatial power combiner is a type of power combiner consisting of a cavity powered by signals from a set of input transmission lines, respectively. The power from each line is combined and recovered in an output central transmission line.
  • the power combiner inputs are not isolated from each other.
  • each input of the combiner has an influence on the other inputs, a failure at an input or components connected to this input can be propagated at the other inputs.
  • the failure of a single power amplifier can cause significant degradation in the performance of the power combiner, which can cause a failure in the operation of a device in which the power combiner is used.
  • the present invention aims to solve at least one of the aforementioned drawbacks and to provide a spatial power combiner in which the reliability is improved.
  • the present invention proposes according to a first aspect a spatial power combiner comprising a plurality of inputs to which are connected respectively a set of transmission lines, and an output.
  • the spatial power combiner further comprises a cavity forming body, the plurality of transmission lines longitudinally passing through said cavity and being disposed around an absorbing member extending longitudinally in said cavity.
  • the absorbent element makes it possible to isolate the transmission lines from one another, the signals carried by the transmission lines thus having no influence between them.
  • this transmission line has no effect on the other transmission lines of the assembly and the power combiner always delivers a proper output signal, in the worst case. cases, the power output can be reduced.
  • the length of the absorbent element is equivalent to the length of the transmission lines in the spatial power combiner.
  • the absorbent element extends longitudinally over the entire length of the transmission lines, which improves the isolation of the inputs to each other and can facilitate the assembly of the power combiner during its manufacture.
  • the length of the absorbent element is less than the length of the transmission lines in the spatial power combiner.
  • the absorbent element extends starting from the input of said spatial power combiner.
  • the dissipation of the energy dissipated in the form of heat in the power combiner is improved because the heat travels a reduced distance.
  • the absorbent element extends from the output of said spatial power combiner.
  • the spatial power combiner further comprises heat dissipation means extending longitudinally in the cavity, the absorbent element surrounding the dissipation means.
  • the heat dissipation means comprise a metal rod.
  • the absorbent element extends from the inlet and the length of the absorbent element is less than the length of the transmission lines, the distance traveled by the heat along the rod metal is reduced.
  • the transmission lines are microstrip transmission lines.
  • the inputs of the spatial power combiner have a low impedance.
  • connection of the combiner inputs to electronic circuits or components having low impedance outputs is thus ease. Indeed, when the impedance values are close, the implementation of the impedance matching is simplified.
  • the spatial power combiner comprises a thermal evacuation module.
  • This thermal evacuation module assists in the heat dissipation of the spatial power combiner.
  • the spatial power combiner comprises an impedance pre-adaptation module arranged at the input of the spatial power combiner, the impedance pre-adaptation module comprising first portions of the transmission lines of the set of transmission lines. transmission.
  • the value of the impedance of the transmission line varies along the transmission line.
  • the impedance increases along the transmission line.
  • the value of the impedance of a transmission line at the input of the spatial power combiner is less than the value of the impedance of the transmission line at the output of the combiner.
  • the set of layers comprises a third conductive layer serving as a potential reference.
  • the impedance pre-adaptation module comprises a support on which the first parts of the transmission lines are arranged, the support comprising a set of recesses, each first part of the transmission lines of the transmission line. set of transmission lines being respectively disposed on a hollow of the set of recesses.
  • the second conductive layer of each set of layers of each transmission line is in contact with each hollow of the support.
  • the present invention relates to a power amplification assembly formed by a spatial power combiner according to the invention and an amplification structure arranged at the input of said spatial power combiner, the amplification structure. comprising a set of inputs and a set of outputs, the outputs being respectively connected to the inputs of the spatial power combiner.
  • the transmission lines of the spatial power combiner are connected to the outputs of the amplification structure.
  • the spatial power combiner combines the powers present respectively at the outputs of the amplification structure.
  • the input transmission lines of the spatial power combiner correspond respectively to transmission lines at the output of said amplification structure.
  • the amplification structure comprises a set of power amplifiers, each power amplifier being connected to each output of the amplification structure.
  • the input signals of the power combination set are first amplified and then their power is combined by the spatial power combiner into a single output.
  • the outputs of the power amplifiers have a low impedance.
  • the impedance matching between the amplification structure and the power combiner is easily implemented.
  • the power amplification assembly has characteristics and advantages similar to those previously described in connection with the spatial power combiner.
  • a power amplification assembly according to the invention will be described with reference to the figures 1 a and 1 b.
  • the figure 1a represents a power amplification assembly 100 comprising a spatial power combiner 10 and an amplification structure 20.
  • FIG. figure 1 b An exploded view of the power amplifier assembly is shown in FIG. figure 1 b.
  • the spatial power combiner 10 is arranged at the output of the amplification structure 20.
  • the amplification structure 20 comprises a set of inputs 21a, 21b, 21c, ... and a set of outputs 22a, 22b, 22c, ..., the number of inputs and outputs of the sets being identical.
  • the amplification structure 20 further comprises a set of power amplifiers 23, each power amplifier 23 being connected to an input 21 of the amplification structure 20 and to an output 22 of the amplification structure 20.
  • Input transmission lines at 1 , b 1 , c 1 ... respectively connect the inputs 21 of the amplification structure 20 and the power amplifiers 23.
  • Output transmission lines a 2 , b 2 , c 2 ... respectively connect the power amplifiers 23 and the outputs 22 of the amplification structure 20.
  • the power amplifiers 23 respectively amplify the signals at the inputs 21 of the amplification structure 20 and generate amplified signals at the outputs 22.
  • the amplification structure 20 comprises a body 24 enclosing the power amplifiers 23 and the input transmission lines at 1 , b 1 , c 1 ... and at output 2 , b 2 , c 2 ...
  • the body 24 has an octagonal shape
  • the amplification structures comprise eight inputs 21, eight outputs 22, and eight power amplifiers 23.
  • the body of the amplification structure may have different geometric shapes, and the number of inputs, power amplification outputs and transmission lines may be different.
  • the power amplifiers 23 are known to those skilled in the art, will not be described in more detail in this document.
  • the amplification structure 20 comprises cooling means 25 disposed around the periphery of the body 24 in order to dissipate the heat produced by the power components, in particular by the power amplifiers 23.
  • the spatial power combiner 10 is arranged at the output of the amplification structure 20.
  • the outputs 22 of the amplification structure 20 are connected to inputs 11a, 11b, 11c, ... (referred to hereinafter as the document) of the spatial power combiner 10.
  • the powers of the signals at the output of the amplification structure 20 are thus combined by the spatial power combiner 10 into a single power output of the spatial power combiner 10.
  • transmission lines a, b, c, ... are respectively connected to the inputs 11a, 11b, 11c, ... of the power space combiner 10.
  • the transmission lines a, b, c, ... of the spatial power combiner 10 are a continuity of the output transmission lines a 2 , b 2 , c 2 ... of the amplification structure 20.
  • the spatial power combiner 10 further includes an output 12 on which a combined power is generated.
  • Electronic equipment can be connected to the output 12 of the spatial power combiner 10 to use this combined power.
  • the output 12 is high impedance, presenting by way of non-limiting example 50 Ohms.
  • the signal at the output 12 of the spatial power combiner 10 can thus be used, for example in an antenna or as input to a device serving as a transition from a waveguide to a coaxial line, without the need for impedance transformation. , or with an impedance transformation easy to perform.
  • the spatial power combiner 10 comprises a cylindrical body 13 forming a cavity 14.
  • the transmission lines a, b, c,... Comprise a first portion corresponding to the portion of line between the input 11 and the cavity 14 of the spatial power combiner 10.
  • a transmission line a, b, c, ... The first part of a transmission line a, b, c, ... is also called a line of acces aa, ba, ca, ...
  • Each input line a, b, c, ... further comprises a second part ab, bb, cb, ... corresponding to the portion of line between the access line aa, ba, ca ... and the output 12 of the combiner.
  • the second portions of the transmission lines ab, bb, cb, ... pass longitudinally through the cavity 14 from the input 11 of the power space combiner 10 and up to the output 12 of the power space combiner 10.
  • the input transmission lines a, b, c ... are microstrip transmission lines.
  • the connection between the amplification structure 20 and the spatial power combiner 10 can be realized directly and without requiring necessary conversions between different types of power. lines.
  • the spatial power combiner 10 comprises an absorbent element 15 extending longitudinally in the cavity 14.
  • the absorbent element 15 is placed between the input transmission lines a, b, c, ... especially between the second portions of the transmission lines ab, bb, cb, ... in the core of the combiner 101.
  • the second portions of input transmission lines ab, bb, cb, ... are arranged around the absorbent element 15.
  • the absorbent element 15 extends over the entire length of the second portions of the transmission lines ab, bb, cb, ... that is to say that it extends over the entire cavity 14 between the input 11 and the output 12 of the power space combiner 10, more particularly over the entire core of the power space combiner 101.
  • the length of the absorbent element 15 is equivalent to the length of the second portions of the transmission lines ab, bb, cb, ... in the power spatial combiner 10.
  • the length of the absorbent element 15 is less than the length of the second portions of the transmission lines ab, bb, cb, ... in the spatial power combiner 10.
  • the figure 2 represents a spatial power combiner 10 'according to a second embodiment of the invention. Note that the cavity is not shown in this figure.
  • the transmission lines a ', b', c ', ... and in particular the second parts of the transmission lines ab', bb ', cb', ... are arranged around the absorbent member 15 ', the absorbent member 15' extending longitudinally in a portion of the cavity (not shown in the figure).
  • the absorbent element 15 extends from the output 12' of the spatial power combiner 10 'over a predetermined length.
  • the predetermined length may be 50 mm.
  • this predetermined length may be different, this value varying for example depending on the nature of the absorbent element 15 'used.
  • the absorbent member 15 comprises an absorbent material, such as an epoxy resin loaded with particles of a magnetic absorbent, for example ferrite particles.
  • the spatial power combiner 10 'further includes a plastic member 16' extending longitudinally in the cavity, in extension of the absorbent member 15 '.
  • the plastic element 16 ' has a mechanical function, making it possible to keep in place the transmission lines a', b ', c', ....
  • the absorbent member 15 'and the plastic member 16' are secured to each other by means of a threaded rod disposed in a recess 18 'formed in the absorbent member 15' and the plastic member 16 .
  • a first recess portion 18a ' corresponding to the recess made in the plastic element 16', is a threaded longitudinal recess, the walls of the recess 18 'thus forming a thread.
  • a second recess portion 18b ' corresponding to the recess made in the absorbent member 15', is a recess whose walls are smooth.
  • the attachment of the absorbent member 15 'and the plastic member 16' can be achieved by different means.
  • the figure 3 represents a third embodiment of the spatial power combiner 10 ".
  • the absorbent element 15 "extends longitudinally into the cavity (not shown in this figure) while leaving of the input 11 "of the spatial power combiner 10", over a predetermined length.
  • the spatial power combiner may have a length of 300 mm, and the absorbent element of 50 mm.
  • the length of the absorbent element may be 20 mm.
  • the length values of the power space combiner and the absorbing element may be different.
  • the spatial power combiner 10 "comprises heat dissipation means 17" extend longitudinally in the cavity.
  • the heat dissipation means 17 “comprise in one embodiment a metal rod.
  • This embodiment is particularly advantageous when the metal rod allows efficient dissipation of the thermal energy in the form of heat produced in the spatial power combiner 10 ".
  • the absorbent element 15 is disposed so that it surrounds the dissipation means 17" over the predetermined length.
  • the heat dissipation means 17 extend longitudinally throughout the cavity
  • the absorbent element 15 extends over a predetermined length starting from the input 11 "of the spatial power combiner 10".
  • the heat dissipation means 17 are thus surrounded by the absorbent element 15" over the predetermined length.
  • the spatial power combiner 10 (see figure 1 ) further comprises a thermal evacuation module 18.
  • This thermal evacuation module 18 can be used with different spatial combiner structures of power 10, 10 ', 10 ", in particular with the structures represented on the Figures 2 and 3 .
  • This thermal evacuation module 18 makes it possible to dissipate more the heat produced in the spatial power combiner 10.
  • the thermal evacuation module 18 is a conventional module known to those skilled in the art and does not need to be described in detail here.
  • the outputs of the power amplifiers 23 (or outputs 21 of the amplification structure 20) have a low impedance.
  • the inputs 11 of the spatial power combiner 10 also have a low impedance.
  • the combiner output has a high impedance.
  • the spatial power combiner 10 further comprises an impedance pre-adaptation module 102.
  • This impedance pre-adaptation module 102 modifies the value of the impedance present at the input 11 of the spatial power combiner 10.
  • the impedance pre-adaptation module comprises the first parts of the transmission lines aa, ba, ca ... or access lines.
  • Each access line aa, ba, ca ... comprises a printed circuit comprising at least two conductive layers, a conductive layer carrying a signal and a conductive layer serving as potential reference.
  • the figure 4a is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa of the spatial power combiner 10 according to one embodiment.
  • Each access line aa, ba, ca, ... comprises a set of layers superimposed between them.
  • the set of layers comprises a first conductive layer 200, a second conductive layer 400 and a third conductive layer 700.
  • the first conductive layer 200 carries a signal
  • the second 400 and third 700 conductive layers serve as a potential reference.
  • the set of layers further comprises a first insulation layer 300, a second insulation layer 600 and an adhesive layer 500.
  • one of the conductive layers here being the third conductive layer 700, has pads 800 arranged on the edges along the layer.
  • each of the other layers has openings 900 disposed on the edge along the layer, an opening having a shape complementary to a pad 800 of the third conductive layer 700 and being located so a pad 800 can be inserted into an opening 900 of each layer of all the layers forming the access line aa.
  • the assembly formed by the studs 800 and the openings 900 form means for holding or fixing the layers of all the layers together.
  • the number of layers may be different.
  • the first conductive layer 200 has a central portion 201 and two lateral portions 202.
  • the central portion 201 of the first conductive layer 200 carries the signal carried by a transmission line a, the power of which will be combined with that of the other signals carried by the other transmission lines b, c, ....
  • the side portions 202 of the first conductive layer 200, the second conductive layer 400 and the third conductive layer 700 serve as a reference potential.
  • the lateral portions 202 of the first conductive layer 200, the second 400 and third 700 conductive layers are interconnected by the pads 800, these pads being for example metallic.
  • a first insulating layer 300 is disposed between the first 200 and the second 400 conductive layer in order to isolate the latter two.
  • the second insulating layer 600 is disposed between the second layer 400 and the third 700 conductive layers.
  • an adhesive layer 500 is disposed between the second conductive layer 400 and the second insulating layer 600.
  • the first conductive layer 200, the second conductive layer 400 and the first insulating layer 300 form a first set
  • the third conductive layer 700 and the second insulating layer 600 form a second together, the first and the second assembly being held together by means of the adhesive layer 500.
  • the impedance variation is implemented by the first conductive layer 200 and the second conductive layer 400.
  • the width of the first conductive layer 200 decreases along the first portion of the transmission line aa.
  • the width of the first conductive layer 200 thus has a lower value at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or at the input of the power space combiner 10).
  • the second conductive layer 400 has an opening 401.
  • This opening 401 or the width of the opening 401, increases along the first portion of the transmission line aa.
  • the opening 401 of the second conductive layer 400 is thus greater at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or the input of the power space combiner 10).
  • the figure 4b is a simplified illustration of an exploded view of a printed circuit forming the first part of a transmission line or access line aa 'of the spatial power combiner 10 according to a second embodiment.
  • the set of layers forming the access line aa ' comprises a first conductive layer 200', a second conductive layer 400 'and an insulating layer 300'.
  • This access line aa is disposed on a support or soleplate 1000', the second conductive layer 200 'being in contact with the hollow 1001'.
  • the support 1000 ' comprises a set of recesses 1001', each recess 1001 'having a shape suitable for receiving the printed circuit forming the access line aa'.
  • the number of hollows is equal to the number of access lines aa ', ba', ca ', ...
  • the support 1000 ' may be in one piece or be formed by a set of supports, each support being associated with an access line aa', ba ', ca', ...
  • the support 1000 'further comprises a second recess 1002' made in the first recess 1001 ', the second recess 1002' receiving a second insulation layer 600 '.
  • the second insulation layer 600 'and the second cavity 1002' thus have complementary shapes.
  • the support 1000 ' is made of metal.
  • the first conductive layer 200 ' transports the signal carried by a transmission line a', the power of which will be combined with that of the other signals carried by the other transmission lines b ', c' ...
  • the second conductive layer 400 'and the metal support 1000' serve as a reference potential.
  • the second conducting layer 400 ' is in contact with the support 1000'.
  • the insulating layer 300 ' is disposed between the first conductive layer 200' and the second conductive layer 400 'in order to isolate them from each other.
  • the width of the first conductive layer 200 thus has a lower value at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the level of the the input of this module 102, 102 '(or at the input of the power spatial combiner 10').
  • the second conductive layer 400 ' has an opening 401'.
  • This opening 401 ', or the width of the opening 400', increases along the first portion of the transmission line aa '.
  • the opening 401 'of the second conductive layer 400' is thus greater at the output of the impedance pre-adaptation module 102, 102 '(or at the input of the core of the combiner 101, 101') than at the the level of the input of this module 102, 102 '(or the input of the spatial power combiner 10').
  • the impedance variation between the input and the output of the spatial power combiner is implemented only by the coaxial structure of the core of the combiner 101, 101 '.
  • the common mode impedance of the transmission lines of the coaxial structure of the power combiner increases along the coaxial structure of the combiner core 101, 101 '. This increase is implemented by reducing the ratio between diameter formed by all the transmission lines located inside the cylindrical body 13 and the inside diameter of the cylindrical body 13 of the core of the spatial power combiner 10.

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EP16200051.7A 2015-11-23 2016-11-22 Räumlicher leistungskombinator Active EP3171451B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1561267A FR3044171B1 (fr) 2015-11-23 2015-11-23 Combineur spatial de puissance

Publications (2)

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EP3171451A1 true EP3171451A1 (de) 2017-05-24
EP3171451B1 EP3171451B1 (de) 2021-11-10

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FR (1) FR3044171B1 (de)

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US10454433B2 (en) 2017-06-29 2019-10-22 Qorvo Us, Inc. Amplifier assembly and spatial power combining device
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US10720711B2 (en) 2017-08-22 2020-07-21 Qorvo Us, Inc. Antenna structures for spatial power-combining devices
US10164667B1 (en) * 2018-03-21 2018-12-25 Qorvo Us, Inc. Spatial power-combining devices with amplifier connectors
US10833386B2 (en) 2018-04-09 2020-11-10 Qorvo Us, Inc. Waveguide transitions for power-combining devices
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US10855240B2 (en) 2018-11-15 2020-12-01 Qorvo Us, Inc. Structures for spatial power-combining devices
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US11564337B2 (en) * 2020-03-17 2023-01-24 Qorvo Us, Inc. Thermal structures for heat transfer devices and spatial power-combining devices
US11387791B2 (en) 2020-03-17 2022-07-12 Qorvo Us, Inc. Spatial power-combining devices with reduced size
US11621469B2 (en) 2021-02-01 2023-04-04 Qorvo Us, Inc. Power-combining devices with increased output power
US11955687B2 (en) 2022-01-10 2024-04-09 Qorvo Us, Inc. Structural arrangements for spatial power-combining devices
EP4287396A1 (de) * 2022-06-02 2023-12-06 Ion Beam Applications S.A. Hf-leistungskombinator/-teiler

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US10326191B2 (en) 2019-06-18
US20170149113A1 (en) 2017-05-25
EP3171451B1 (de) 2021-11-10
FR3044171B1 (fr) 2018-07-06
FR3044171A1 (fr) 2017-05-26

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