EP3168562B1 - Intelligent terminal heat dissipation device and intelligent terminal - Google Patents

Intelligent terminal heat dissipation device and intelligent terminal Download PDF

Info

Publication number
EP3168562B1
EP3168562B1 EP14894606.4A EP14894606A EP3168562B1 EP 3168562 B1 EP3168562 B1 EP 3168562B1 EP 14894606 A EP14894606 A EP 14894606A EP 3168562 B1 EP3168562 B1 EP 3168562B1
Authority
EP
European Patent Office
Prior art keywords
heat pipe
flexible
intelligent terminal
evaporation end
flexible heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14894606.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3168562A4 (en
EP3168562A1 (en
Inventor
Linfang Jin
Nanbo Kang
Jie Zou
Xiaowei HUI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP3168562A1 publication Critical patent/EP3168562A1/en
Publication of EP3168562A4 publication Critical patent/EP3168562A4/en
Application granted granted Critical
Publication of EP3168562B1 publication Critical patent/EP3168562B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat dissipation technologies, and in particular, an intelligent terminal, according to claim 1.
  • a wearable terminal is an intelligent terminal product emerging after a tablet computer and a smartphone.
  • Intelligent wearable terminals emerging in recent years include Google Glass, smart headbands, smart shoes, widely popular smart watches, and the like. Emergence of the intelligent wearable terminal indicates coming of a wearable era.
  • functions such as Bluetooth, a Global Positioning System (Global Positioning System, GPS for short), a Wireless Fidelity technology (Wireless Fidelity, Wi-Fi for short), and 3rd Generation communication (Third Generation, 3G for short)
  • generated heat of the intelligent wearable terminal increases from 0 W to more than 3 W.
  • the generated heat of the intelligent wearable device is centralized, easily forming a partial hot area.
  • the intelligent wearable terminal When the intelligent wearable terminal is in contact with human skin for a long time, the intelligent wearable terminal is likely to scald the human skin. Therefore, it is necessary to control a heat generation problem of the intelligent wearable terminal, so as to quickly decrease a temperature of the intelligent wearable terminal, and avoid scalding the human skin.
  • US 6,474,074B2 refers to an apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
  • the apparatus includes an evaporator region, a condenser region, and a capillary region.
  • the evaporator region includes one or more hot point elements used to transfer heat from a heat source to a transport fluid.
  • the transport fluid changes state to a vapor when heat is applied to the transport fluid.
  • the vapor travels to the condenser region via vapor channels and is condensed to a fluid once again by transferring heat from the vapor to a heat sink.
  • the condensed fluid is then returned to the evaporator region by way of capillary forces and capillaries formed in a capillary structure.
  • the capillaries formed in the capillary structure have a tree-like or fractal geometry.
  • the apparatus may further include a flexible region that allows the apparatus to be bent around corners and edges.
  • a flexible heat pipe is used to perform heat dissipation for a wearable terminal with a centralized heat source.
  • the heat pipe is capable of changing a dot heat source into a line heat source, so as to reduce a risk of scaling a human body by the centralized heat source.
  • the flexible heat pipe is bendable and is capable of performing heat dissipation in a bendable device.
  • a structure of the flexible heat pipe is shown in FIG. 1 , including an evaporation section L1, a flexible body section L2, and a condensation section L3.
  • ⁇ r is a diameter of the flexible heat pipe, and the evaporation section L1 and the condensation section L3 are rigid parts of the flexible heat pipe.
  • the flexible body section L2 is a flexible part of the flexible heat pipe.
  • the existing flexible heat pipe can be substantially bent only within the flexible body section L2, and other sections (the evaporation section L1 and the condensation section L3) are easily invalid after being bent and cannot perform heat dissipation for a device.
  • An intelligent wearable terminal and a bendable smartphone have many bendable areas, and therefore, a heat dissipation effect is relatively poor when the existing flexible heat pipe is used to dissipate heat for the intelligent wearable terminal and a future bendable smartphone.
  • the present invention provides an intelligent terminal heat dissipation apparatus and an intelligent terminal, to resolve a technical problem that a heat dissipation effect is relatively poor when an existing heat dissipation device dissipates heat for a bendable device having many bent areas.
  • an intelligent terminal comprising a terminal heat dissipation apparatus and an intelligent terminal body
  • the terminal heat dissipation apparatus comprises: at least one flexible heat pipe, wherein two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, each condensation end comprises one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end comprises at least one heat pipe rigid part, and the intelligent terminal body is mounted on the evaporation end.
  • the terminal heat dissipation apparatus comprises two flexible heat pipes: a first flexible heat pipe and a second flexible heat pipe, the first flexible heat pipe and the second flexible heat pipe are connected in parallel, and the intelligent terminal body is mounted on an evaporation end of the first flexible heat pipe and/or an evaporation end of the second flexible heat pipe.
  • the terminal heat dissipation apparatus comprises two flexible heat pipes: a first flexible heat pipe and a second flexible heat pipe, an evaporation end of the first flexible heat pipe and an evaporation end of the second flexible heat pipe are connected in series, and the intelligent terminal body is mounted on the evaporation end of the first flexible heat pipe and/or the evaporation end of the second flexible heat pipe.
  • a first capillary structure in the first flexible heat pipe and a second capillary structure in the second flexible heat pipe are interconnected between the evaporation end of the first flexible heat pipe and the evaporation end of the second flexible heat pipe by using a third capillary structure.
  • a first capillary structure in the first flexible heat pipe and a second capillary structure in the second flexible heat pipe are connected in parallel, multiple fourth capillary structures are disposed between the evaporation end of the first flexible heat pipe and the evaporation end of the second flexible heat pipe, and the fourth capillary structures are disposed vertically.
  • the evaporation end further comprises: a heat pipe flexible part, wherein the intelligent terminal body is mounted on the heat pipe flexible part and/or the heat pipe rigid part of the evaporation end.
  • the heat pipe flexible part comprises multiple sections of hoses.
  • the intelligent terminal body is mounted on the evaporation end of the terminal heat dissipation apparatus in a top-down demountable manner; or the intelligent terminal body is mounted on the evaporation end of the terminal heat dissipation apparatus in a left-right demountable manner; or the intelligent terminal body is fastened on the evaporation end of the terminal heat dissipation apparatus.
  • the intelligent terminal heat dissipation apparatus has condensation ends disposed on two ends of a flexible heat pipe and an evaporation end disposed in the middle of the flexible heat pipe.
  • the condensation end includes multiple heat pipe rigid parts and multiple heat pipe flexible parts that are arranged alternately.
  • the evaporation end includes at least one heat pipe rigid part. Therefore, flexible heat dissipation is implemented for a bendable device having many bent areas, thereby resolving a technical problem that a heat dissipation effect is relatively poor when an existing heat dissipation device dissipates heat for a bendable device having many bent areas.
  • FIG. 2 is a schematic structural diagram of Embodiment 1 of an intelligent terminal heat dissipation apparatus according to the present invention.
  • FIG. 3 is a schematic diagram of a capillary structure in the intelligent terminal heat dissipation apparatus shown in FIG. 2 .
  • capillary structures in the heat dissipation apparatus are usually multiple bundles of bendable metal wires that are winded by multiple lines and that traverse a rigid part and a flexible part to form continuous capillary structures, so that a cooled liquid flows back by means of a capillary force to an evaporation end for evaporation again.
  • the intelligent terminal heat dissipation apparatus may be applied to an intelligent terminal for heat dissipation and may be further applied to a bendable intelligent wearable terminal and a further bendable smartphone for heat dissipation.
  • the intelligent terminal heat dissipation apparatus includes: at least one flexible heat pipe, that is, the intelligent terminal heat dissipation apparatus may include one flexible heat pipe or multiple flexible heat pipes.
  • the intelligent terminal body includes multiple heating devices, multiple flexible heat pipes may be used, and the multiple flexible heat pipes may be connected in parallel or in series.
  • the flexible heat pipe in this embodiment may be replaced by a high heat conducting material, such as a built-in copper foil, graphite tube, or high heat conducting braided fabric, but a heat pipe is preferred.
  • two ends of the flexible heat pipe are condensation ends 201, and the middle of the flexible heat pipe is an evaporation end 202.
  • the condensation ends 201 on the two ends of the flexible heat pipe may include one heat pipe rigid part and multiple heat pipe flexible parts that are arranged alternately, or multiple heat pipe rigid parts and multiple heat pipe flexible parts that are arranged alternately, or multiple heat pipe rigid parts and one heat pipe flexible part that are arranged alternately, or one heat pipe rigid part and one heat pipe flexible part that are arranged alternately.
  • the condensation end may be set according to a structure of an intelligent terminal related in actual application, and this is not limited in this embodiment.
  • the evaporation end 202 in the middle of the flexible heat pipe may include only a heat pipe rigid part or may include a heat pipe rigid part and a heat pipe flexible part, and FIG. 2 shows only a rigid part of the evaporation end 202.
  • a capillary structure 30 is disposed in the flexible heat pipe.
  • the capillary structure 30 is a flexible sealed device by using a vacuum design.
  • the capillary structure 30 is filled with an evaporable liquid with a low boiling point.
  • the liquid flows back to the evaporation end 202 by means of a capillary force of a multihole capillary material, and circulation goes on likewise, to dissipate heat for a heat source of the intelligent terminal body by means of heat conduction.
  • the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, flexible heat dissipation can be performed for a bendable device.
  • the intelligent terminal heat dissipation apparatus has condensation ends disposed on two ends of a flexible heat pipe and an evaporation end disposed in the middle of the flexible heat pipe.
  • the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts that are arranged alternately.
  • the evaporation end includes at least one heat pipe rigid part. Therefore, flexible heat dissipation is implemented for a bendable device having many bent areas, thereby resolving a technical problem that a heat dissipation effect is relatively poor when an existing heat dissipation device dissipates heat for a bendable device having many bent areas.
  • FIG. 4 is a schematic structural diagram of Embodiment 2 of an intelligent terminal heat dissipation apparatus according to the present invention.
  • the intelligent terminal heat dissipation apparatus includes multiple flexible heat pipes. To describe a relationship between the multiple flexible heat pipes, an example in which the intelligent terminal heat dissipation apparatus includes two flexible heat pipes is used for description in this embodiment.
  • the intelligent terminal heat dissipation apparatus includes: a first flexible heat pipe 41 and a second flexible heat pipe 42. The first flexible heat pipe 41 and the second flexible heat pipe 42 are distributed in parallel.
  • An intelligent terminal body 43 may be mounted on an evaporation end of the first flexible heat pipe 41, or on an evaporation end of the second flexible heat pipe 42, or on an evaporation end of the first flexible heat pipe 41 and on an evaporation end of the second flexible heat pipe 42. Specifically, a mounting position may be selected according to a size of the intelligent terminal body 43.
  • the intelligent terminal body 43 is mounted on the evaporation end of the first flexible heat pipe 41 and the evaporation end of the second flexible heat pipe 42, the evaporation end of the first flexible heat pipe 41 and the evaporation end of the second flexible heat pipe 42 can perform heat dissipation for different heat sources of the same intelligent terminal body 43.
  • FIG. 5 is a schematic structural diagram of Embodiment 3 of an intelligent terminal heat dissipation apparatus according to the present invention.
  • FIG. 6 is a schematic diagram A of a capillary structure in the intelligent terminal heat dissipation apparatus shown in FIG. 5 .
  • FIG. 7 is a schematic diagram B of a capillary structure in the intelligent terminal heat dissipation apparatus shown in FIG. 5 .
  • the intelligent terminal heat dissipation apparatus includes multiple flexible heat pipes. To describe a relationship between the flexible heat pipes, an example in which the intelligent terminal heat dissipation apparatus includes two flexible heat pipes is used for description. In this embodiment, as shown in FIG.
  • the intelligent terminal heat dissipation apparatus includes a first flexible heat pipe 51 and a second flexible heat pipe 52.
  • An evaporation end of the first flexible heat pipe 51 and an evaporation end of the second flexible heat pipe 52 are interconnected in series, that is, the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52 are communicated.
  • An intelligent terminal body 53 may be mounted on the evaporation end of the first flexible heat pipe 51 and/or the evaporation end of the second flexible heat pipe 52.
  • a first capillary structure 54 in the first flexible heat pipe 51 and a second capillary structure 55 in the second flexible heat pipe 52 are shown in FIG. 6 .
  • the first capillary structure 54 and the second capillary structure 55 are interconnected by using a third capillary structure 56a at a serial connection point between the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52.
  • the third capillary structure 56a is of a mesh structure.
  • the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52 are interconnected in series, and the first capillary structure 54 in the first flexible heat pipe 51 and the second capillary structure 55 in the second flexible heat pipe 52 are also interconnected in series. Therefore, there are more capillary structures to dissipate heat for different heat sources of the same intelligent terminal body 53, and a heat dissipation effect is improved.
  • FIG. 7 a connection relationship between the first capillary structure 54 in the first flexible heat pipe 51 and the second capillary structure 55 in the second flexible heat pipe 52 is shown in FIG. 7 .
  • the first capillary structure 54 and the second capillary structure 55 are connected in parallel, and multiple fourth capillary structures 56b are disposed between the evaporation end of the first flexible heat pipe 51 and the evaporation end of the second flexible heat pipe 52.
  • the fourth capillary structures 56b are disposed vertically.
  • a heated liquid that is on the top of the fourth capillary structure 56b and that is close to a heat source of the intelligent terminal body 53 evaporates, and vapor vertically flows to the bottom of the fourth capillary structure 56b and releases heat and condenses into a liquid again.
  • the liquid flows back to the top of the fourth capillary structure 56b by means of a capillary force of a multihole capillary material, and circulation goes on likewise, to dissipate heat for the heat source of the intelligent terminal body 53.
  • a heat dissipation manner of the fourth capillary structure 56b reference may be made to an existing cold plate heat dissipation technology.
  • FIG. 8 is a schematic structural diagram of Embodiment 1 of an intelligent terminal according to the present invention.
  • FIG. 9 is a schematic mounting diagram A of an intelligent terminal according to the present invention.
  • FIG. 10 is a schematic mounting diagram B of an intelligent terminal according to the present invention.
  • the intelligent terminal includes an intelligent terminal body 81 and a mobile terminal heat dissipation apparatus 80 provided in any one of the foregoing embodiments. Two ends of the mobile terminal heat dissipation apparatus 80 are condensation ends 801 and the middle of the mobile terminal heat dissipation apparatus 80 is an evaporation end 802.
  • the intelligent terminal body 81 is mounted on the evaporation end 802 of the mobile terminal heat dissipation apparatus 80.
  • the intelligent terminal body 81 may be mounted on the evaporation end 802 in a top-down demountable manner of a method shown in FIG. 9 ; or may be mounted on the evaporation end 802 in a left-right demountable manner of a method shown in FIG. 10 ; or the intelligent terminal body 81 may be directly fastened on the evaporation end 802.
  • the mobile terminal heat dissipation apparatus 80 may act as a wrist strap, a watch strap, or a lanyard of an intelligent wearable terminal, that is, a user can use a body of the intelligent wearable terminal when it is mounted on the mobile terminal heat dissipation apparatus 80.
  • the program may be stored in a computer-readable storage medium.
  • the foregoing storage medium includes: any medium that can store program code, such as a ROM, a RAM, a magnetic disk, or an optical disc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP14894606.4A 2014-06-12 2014-06-12 Intelligent terminal heat dissipation device and intelligent terminal Active EP3168562B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/079725 WO2015188343A1 (zh) 2014-06-12 2014-06-12 智能终端散热装置及智能终端

Publications (3)

Publication Number Publication Date
EP3168562A1 EP3168562A1 (en) 2017-05-17
EP3168562A4 EP3168562A4 (en) 2017-11-01
EP3168562B1 true EP3168562B1 (en) 2019-08-07

Family

ID=52612517

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14894606.4A Active EP3168562B1 (en) 2014-06-12 2014-06-12 Intelligent terminal heat dissipation device and intelligent terminal

Country Status (5)

Country Link
US (1) US10088879B2 (zh)
EP (1) EP3168562B1 (zh)
CN (1) CN104396357B (zh)
CA (1) CA2961277C (zh)
WO (1) WO2015188343A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160201994A1 (en) * 2015-01-12 2016-07-14 Asia Vital Components Co., Ltd. Carrier with heat dissipation structure
US9733680B1 (en) * 2016-03-16 2017-08-15 Microsoft Technology Licensing, Llc Thermal management system including an elastically deformable phase change device
KR20190013008A (ko) * 2017-07-31 2019-02-11 송영석 플렉시블 히트 쿨러
JP2021012590A (ja) * 2019-07-08 2021-02-04 レノボ・シンガポール・プライベート・リミテッド サーマルモジュール、電子機器
US20210254899A1 (en) * 2020-02-14 2021-08-19 Hamilton Sundstrand Corporation Compliant oscillating heat pipes
TWM603524U (zh) * 2020-07-27 2020-11-01 華碩電腦股份有限公司 導熱裝置
BR112022003043A2 (pt) * 2020-08-03 2022-05-17 Samsung Electronics Co Ltd Dispositivo eletrônico incluindo placa de circuito impresso flexível
CN113983840B (zh) * 2021-09-13 2023-12-15 江苏大学 一种具有刚性特性的可移植的仿生汗腺及智能机器人
CN114501928A (zh) * 2021-12-29 2022-05-13 联想(北京)有限公司 散热装置及电子设备
US20230309265A1 (en) * 2022-03-22 2023-09-28 Meta Platforms Technologies, Llc Flexible thermal system
CN115406275B (zh) * 2022-07-28 2024-07-09 西安空间无线电技术研究所 一种可控快速响应相变储热系统、加工方法及传热方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6474074B2 (en) 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
WO2003087695A1 (fr) * 2002-04-16 2003-10-23 Yoshiro Miyazaki Conduit calorique vibratoire a auto-excitation et calculateur le contenant
US7647961B2 (en) * 2004-10-25 2010-01-19 Thermal Corp. Heat pipe with axial and lateral flexibility
CN2831018Y (zh) 2005-05-25 2006-10-25 娄晓洲 软体热管装置
CN2836080Y (zh) 2005-06-15 2006-11-08 娄晓洲 集中散热式热管机箱装置
US7369410B2 (en) * 2006-05-03 2008-05-06 International Business Machines Corporation Apparatuses for dissipating heat from semiconductor devices
TWM319361U (en) * 2006-10-20 2007-09-21 Tai Sol Electronics Co Ltd Flexible heat pipe
CN101173843A (zh) 2006-11-01 2008-05-07 富准精密工业(深圳)有限公司 柔性热管
US8069907B2 (en) * 2007-09-13 2011-12-06 3M Innovative Properties Company Flexible heat pipe
CN201138148Y (zh) 2007-11-08 2008-10-22 大连熵立得传热技术有限公司 柔性热管
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure
CN201649064U (zh) 2010-01-11 2010-11-24 大连熵立得传热技术有限公司 一种利用柔性热棒作为散热机构的多年冻土区埋地管道
CN201660877U (zh) 2010-01-11 2010-12-01 大连熵立得传热技术有限公司 利用埋地式柔性热棒作为散热机构的多年冻土区埋地管道
US20110220328A1 (en) 2010-03-09 2011-09-15 Kunshan Jue-Chung Electronics Co., Ltd. Flexible heat pipe and manufacturing method thereof
US20120111537A1 (en) * 2010-11-04 2012-05-10 Chen Chih-Peng Flexible heat dissipation module
CN102748971A (zh) 2011-04-18 2012-10-24 中国科学院理化技术研究所 一种基于低熔点金属关节的柔性导热装置
US10598442B2 (en) * 2012-03-12 2020-03-24 Cooler Master Development Corporation Flat heat pipe structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
CA2961277C (en) 2019-05-28
EP3168562A4 (en) 2017-11-01
US20170220082A1 (en) 2017-08-03
WO2015188343A1 (zh) 2015-12-17
EP3168562A1 (en) 2017-05-17
US10088879B2 (en) 2018-10-02
CN104396357B (zh) 2017-01-25
CA2961277A1 (en) 2015-12-17
CN104396357A (zh) 2015-03-04

Similar Documents

Publication Publication Date Title
EP3168562B1 (en) Intelligent terminal heat dissipation device and intelligent terminal
US11789505B2 (en) Loop heat pipe
JP7138660B2 (ja) 移動通信システムにおけるＱｏＳ Ｆｌｏｗの設定方法及び装置
CN108278915B (zh) 具有不一致的横截面的热管
WO2017189156A3 (en) Wickless capillary driven constrained vapor bubble heat pipes for application in heat sinks
JP4653187B2 (ja) 薄型ヒートパイプおよびその製造方法
EP2784811B1 (en) Heat pipe sink with heating unit
CA2907056C (en) Heat pipe assembly with bonded fins on the baseplate hybrid
MX2019001403A (es) Sistema de enfriamiento activo/pasivo.
CN109253642B (zh) 环路热管及其制造方法
JP2013243249A (ja) 沸騰冷却用伝熱面および沸騰冷却装置
EP2757584A3 (en) Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
WO2009072698A1 (en) The flat plate type micro heat spreading device
JP3203322U (ja) 繊維状毛細管構造を有する熱管
EP2814106A3 (en) Thermal conductivity control devices
US11193718B2 (en) Heat dissipation unit and heat dissipation device using same
EP3263177A3 (en) Skin treatment device
EP2778576A3 (en) System for cooling electronic components
US9062920B2 (en) Heat pipe with sealed vesicle
US20190191589A1 (en) Three-Dimensional Electronic Structure with Integrated Phase-Change Cooling
TWI604173B (zh) Heat sink device applied to loop heat pipe and manufacturing method of its shell
US9476652B2 (en) Thin heat pipe structure having enlarged condensing section
US20130160976A1 (en) Heat pipe with composite wick structure
EP2860476A3 (en) Cooling gel pad
CN107608048B (zh) 一种低辐射可变光阑的降温装置

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20170314

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20171004

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 7/20 20060101ALI20170927BHEP

Ipc: F28D 15/04 20060101AFI20170927BHEP

Ipc: F28D 15/02 20060101ALI20170927BHEP

Ipc: G06F 1/20 20060101ALI20170927BHEP

Ipc: H01L 23/34 20060101ALI20170927BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/34 20060101ALI20181128BHEP

Ipc: H01L 23/427 20060101ALI20181128BHEP

Ipc: F28D 15/02 20060101ALI20181128BHEP

Ipc: H05K 7/20 20060101ALI20181128BHEP

Ipc: G06F 1/20 20060101ALI20181128BHEP

Ipc: F28D 15/04 20060101AFI20181128BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20190103

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 1164531

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190815

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602014051576

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191209

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191107

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191107

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1164531

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191108

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191207

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200224

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602014051576

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG2D Information on lapse in contracting state deleted

Ref country code: IS

26N No opposition filed

Effective date: 20200603

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200612

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20200630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200630

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200612

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190807

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240515

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240502

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240502

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20240513

Year of fee payment: 11

Ref country code: FR

Payment date: 20240509

Year of fee payment: 11