EP3153771B1 - Kühlvorrichtung und verfahren zur kühlung einer leuchtmodul - Google Patents
Kühlvorrichtung und verfahren zur kühlung einer leuchtmodul Download PDFInfo
- Publication number
- EP3153771B1 EP3153771B1 EP15188358.4A EP15188358A EP3153771B1 EP 3153771 B1 EP3153771 B1 EP 3153771B1 EP 15188358 A EP15188358 A EP 15188358A EP 3153771 B1 EP3153771 B1 EP 3153771B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- fluid
- heat
- cooling device
- dissipating
- outlets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims description 67
- 239000012530 fluid Substances 0.000 claims description 108
- 238000004891 communication Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 description 24
- 230000000694 effects Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/63—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air using electrically-powered vibrating means; using ionic wind
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- Effective thermal management is one of the biggest engineering problems in relation to LED lighting products.
- the life and performance of LED chips decreases rapidly at increased junction temperatures. For this reason effective thermal management in LED lighting is a crucial aspect of their productivity and reliability.
- This invention relates to the cooling of high-brightness LED lights using an active cooling method.
- the invention consists of a new heat sink design and a synthetic jet mechanism that has been integrated into this.
- LED lighting products are generally cooled in one of two ways, active or passive cooling.
- passive method finned heat sinks manufactured from metals with high thermal conductivity are attached to the LED chips which are the source of the generated heat. By enlarging the heat transfer area in this way and increasing heat transfer, the temperature of the LED junctions is reduced. This method is the most commonly used one, since it is stable and doesn't consume any energy.
- passive cooling is used in high power LED lighting, as the dimensions of the heat sinks increase, there is a parallel, adverse increase in product weight. Consequently, increasing dimensions and weight diminish the functionality of these products which is a disadvantage.
- US2014319239A1 discloses a device which includes a thermally conductive base having first and second major surfaces, a die attached to said first major surface of said base, a heat pipe having a first end which is attached to said second major surface of said base, a plurality of heat fins attached to a second end of said heat pipe, and at least one synthetic jet ejector disposed between said base and said plurality of heat fins.
- US2007/0096118A1 discloses an assembly that comprises a thermally conductive housing, wherein a portion of said housing is equipped with a plurality of fins; an LED disposed in said housing; and a synthetic jet actuator adapted to direct a synthetic jet onto said portion of the housing.
- US2007139938A1 discloses a lamp system comprising a housing, a plurality of LEDs, a heat sink connected to the housing and in thermal communication with the plurality of LEDs, a flexible blade connected to the housing and having a free end spaced from a surface of the heat sink, the blade being moveable to generate a fluid current to cool the heat sink, an electronic actuator operatively associated with the blade for providing a force to oscillate the blade and a circuitry connected to the LEDs and the electronic actuator, the circuitry configured to receive source power from a source to deliver a first power to the electronic actuator and a second power to the plurality of LEDs.
- US2014254093A1 discloses a further cooling system. This cooling system also has the drawback that the resulting dimensions and weight of the cooling device are high.
- the main object of the present invention is to provide a cooling device for light emitting units, in particular high power LED lighting modules, that overcome the drawbacks of existing cooling devices.
- Another aim of the present invention is to provide a cooling device that has smaller dimensions and less weight compared to the existing cooling devices.
- Another aim of the present invention is to provide a cooling device that has is more efficient in terms of energy consumption compared to the existing cooling devices.
- a cooling device for lighting modules at least comprises a fluid jet generating unit, wherein the fluid jet generating unit comprises a housing and a fluid jet generating means arranged in said housing for generating fluid jets, wherein the housing comprises at least two separated outlets for outputting said fluid jets, wherein the outlets are fluidly connected to said fluid jet generating means.
- the cooling device further comprises a heat-dissipating unit attached to the housing of said fluid jet generating unit, wherein the heat-dissipating unit comprises at least one heat-dissipating element having an outer surface and an inner surface.
- the heat-dissipating element comprises at least one fluid communication element, in particular a plurality of holes or slits, for establishing a fluid communication between fluid adjacent the inner surface and fluid adjacent the outer surface for eliminating pressure differences between fluid adjacent the inner surface and fluid adjacent the outer surface, and a first one of said outlets is located adjacent the inner surface of the heat-dissipating element and a second one of said outlets is located adjacent the outer surface of said heat-dissipating element for causing pressure differences between fluid adjacent the inner surface and fluid adjacent the outer surface, wherein air flow to the inner surface is discharged through air vents on a lower surface of the heat-dissipating unit, wherein one light source or multiple light sources can be attached to the lower surface.
- fluid comprises all gases, for example like inert gases or mixtures of gases, and/or liquids, wherein air is a preferred fluid.
- the cooling system comprises a heat-dissipating unit respectively a finned aluminium heat sink, communication elements respectively holes/slits opened in the heat sink and a fluid jet generating unit respectively a synthetic jet mechanism.
- This synthetic jet mechanism preferably operates using the piezo electric effect.
- air flow is supplied simultaneously to both the inner and the outer surfaces of the heat-dissipating unit from the fluid jet generating unit.
- One preferred feature of the design is that the different air velocities at the inner and outer surfaces of the heat sink create a pressure difference between the fluid adjacent to the surfaces.
- the air flow adjacent to the outer surface is preferably sucked towards the inner surface through the holes/slits on the heat sink.
- the thermal boundary layer on the outer surface where the fins are located becomes thinner and a significant improvement in heat transfer is achieved.
- the fluid jet generating means comprises at least two actuators, wherein a first one of said actuators is connected to the first one of said outlets and a second one of said actuators is connected to the second one of said outlets.
- This solution is beneficial since at least two different fluid jets can be generated.
- Such fluid jets can be generated independently or dependently from each other just as necessary. Due to the design of the invented cooling device the fluid jets can be generated in such a manner that pressure differences are generated which cause an increase in fluid flow on the outer surface and therefore an increase in cooling efficiency.
- the fluid jet generating means preferably comprises or consists of two flexible members, in particular diaphragms, preferably made of plastic or metal, in particular brass, two piezo electric materials or elements affixed to these flexible members and a housing for these.
- the housing contains two fluid chambers, in particular air chambers, and two fluid vents, in particular air vents.
- a fluid chamber is provided between each of the flexible members and the respective outlet, wherein each fluid chamber provides a fluid connection between one of the actuators and the respective outlet wherein each of the flexible members has a circular shape and extends in an undeflected state in a plane, wherein the fluid connection extends in an inclined manner, in particular orthogonal, to said plane.
- the heat-dissipating element comprises an at least partially hollow and tube-like main body, wherein the tube-like main body extends from the fluid jet generation unit in its length direction away from the fluid jet generation unit, wherein the inner wall of the heat-dissipating main body has the inner surface and the outer wall of the heat-dissipating main body has at least partially the outer surface and fins are located on the outside surface of said tube-like main body or build as part of the main body and therefore providing at least partially the outside surface of said tube-like main body, wherein the fins are at least partially and preferred mainly orientated in the length direction of the main body.
- tube-like main body preferably defines an at least partially hollow body and preferably a hollow body having a main clearance hole.
- a particular feature of this design is that air flow from one of the outlet channels goes to the inner surface of the heat sink, while the other goes to the outer surface where the fins or further heat-dissipating elements are located.
- the main body consists of a material or an alloy or a material combination at least having a heat conductivity greater than 14 W/mK and preferably greater than 40 W/mK or 50 W/mK or 60 W/mK or 70 W/mK or 80 W/mK or 100 W/mK or 130 W/mK or 160 W/mK or 170 W/mK or 200 W/mK or 230 W/mK or 270 W/mK or 300 W/mK or 400 W/mK or 425 W/mK, wherein the material, alloy or material combination preferably comprises at least one or two or more than two of the materials: steel, iron, nickel, tungsten, zinc, brass, aluminium, gold, silver or copper.
- This solution is beneficial since the active cooling due to the fluid jets is supported by passive cooling properties of the material of the heat-dissipation element.
- a control unit for actuating the piezo electric elements wherein the frequency of each piezo electric element is individually adjustable by providing respective electric signals, wherein each piezo electric element is actuated with a frequency of at least 2 Hz and prefereably with a frequency of at least 10 Hz and most preferably with a frequency of at least 50 Hz.
- the actuators respectively the piezo electric elements can be actuated at a frequency between 2 and 500 Hz, preferably at a frequency between 10 and 400 Hz or most preferred between 20 and 200 Hz, like between 50 and 150 Hz or between 80 and 120 Hz.
- the frequency can be higher than 2 Hz, in particular higher than 20, 35, 50, 80, 120, 250, 200, 400 or 500 Hz. Due to differences in the electric signals that stimulate the piezo electric materials or elements and/or in the size of the fluid chambers in the housing and/or in the flexible members dimensions and/or in the profiles of the fluid outlet channels, the velocity of the air flow to the outer surface of the heat-dissipating unit is lower than that to the inner surface. This creates a pressure difference between the fluid adjacent to the two surfaces.
- the present invention is further directed to a lighting system.
- Said lighting system comprises a light source and a cooling device according to any of the before mentioned claims, wherein the cooling device is coupled with the light source in such a manner that the cooling device cools the light source during operation respectively removes heat from the light source.
- the present invention is also directed to a method for cooling a light source.
- Said method comprises at least the steps: Providing a device or system according to any of the before mentioned claims; Generating fluid jets with the fluid jet generating unit and outputting the fluid jets through the outlets, wherein the fluid jets outputted through the first outlet differ in at least one parameter from the fluid jets outputted through the second outlet, wherein a pressure difference is caused by the differing fluid jets in such a manner that fluid is sucked from the outside through at least one communication element to the inside of the heat-dissipating element.
- This invention therefore sets forth a process that applies the passive and active method together for use in lighting products, in particularly high power LED lighting products.
- a synthetic jet mechanism that operates with piezoelectric activation was designed for the active section.
- a heat sink that thins the thermal boundary layer on the fin side and is more effective that its counterparts was designed.
- a new cooler was designed that combines the active and passive methods and consumes less energy and has smaller dimensions than conventional cooling systems.
- the fluid jet differences are caused by differences in the electric signals that stimulate the individual piezo electric element and/or differences in the size of the individual fluid chambers and/or differences in the sizes of the individual flexible members and/or differences in the profiles of the individual outlets.
- the cooling system 100 consists of a heat dissipating unit 102 that can alternatively be named a heat sink 102 and a synthetic jet mechanism 104, which can be named alternatively a fluid jet generating unit 104.
- the heat sink 102 contains fins 106 in order to increase the surface area and holes/slots 108 to absorb air.
- the synthetic jet mechanism 104 contains air outlet openings 110 and the heat sink 102 contains air vents 112.
- the fins 106 can be alternatively named as further heat-dissipating elements, wherein said heat dissipating elements 106 or fins are attached to a tube like main body 300 (cf. fig. 6 ).
- a plurality of fins 106 is provided, in particular more than 10 fins or more than 15 fins or more than 20 fins.
- the fins 106 preferably separate rows of communication elements 108 respectively holes or slits, wherein said communication elements 108 are part of the tube like main body 300 or are manufactured inside said tube like main body 300.
- the communication elements 108 are preferably shaped as cylindrical holes, wherein alternative shapes are also possible.
- the LED chip which generates the heat is connected to the lower surface 114 of the heat sink 102.
- FIG. 2 shows a cross section of the cooling system 100.
- the synthetic jet mechanism 104 in the cooling system 100 includes a top cover 202 and a bottom cover 204.
- Two diaphragms 206 made of brass have been placed inside the mechanism 104.
- Piezo ceramic disks 208 have been affixed to the diaphragms.
- an upper air chamber 210 is formed between the diaphragms 206 and the top cover 202.
- the upper air chamber 210 can be alternatively named as second fluid chamber.
- a lower air chamber 212 is formed between the diaphragms 206 and the bottom cover 204. Said lower air chamber 212 can be alternatively named as first fluid chamber.
- the synthetic jet mechanism 104 has an upper air channel 214 connected to the upper air chamber 210 respectively a second fluid channel and a lower air channel 216 respectively a first fluid channel connected to the lower air chamber 212.
- the upper air channel 214 provides air flow to the outer surface 220 of the heat sink 102 with the help of the upper air vents 218 in the bottom cover 204.
- the upper air vents 218 can be alternatively named second one of the outlets and the lower air vents can be alternatively named first one of the outlets.
- the lower air channel 216 provides air flow to the inner surface 224 of the heat sink 102 with the help of the lower air vents 222 in the bottom cover 204.
- the air flow flowing from the inner surface 224 is discharged through the air vents 112 on the lower surface 114 of the heat sink 102.
- the air vents 112 can be alternatively named outlets and are preferably designed as slits.
- An at least partially circumferential shape of the air vents 112 is preferred, wherein the air vents 112 can be shaped as a plurality of holes functionally connected to each other.
- Figure 3 shows the bottom cover 204 of the synthetic jet mechanism 104.
- An upper air vent 218 and lower air vent 222 has been included in the lower surface 226 of the cover 204.
- Figure 4 shows the status when negative electrical tension is applied to the piezo ceramic disks 208 in the synthetic jet mechanism 104.
- the diaphragms 206 move outwards.
- An air flow 228 from the upper air vent 218 in the bottom cover 204 of the mechanism 104 to the outer surface 220 of the heat sink 102 occurs.
- Another air flow 230 occurs from the lower air vent 222 in the bottom cover 204 of the mechanism 104 to the inner surface 224 of the heat sink 102.
- air flow 228 velocity at the outer surface 220 is lower than air flow 230 velocity at the inner surface 224.
- a pressure difference between the outer surface 220 and the inner surface 224 is created and a portion 232 of the outer air flow 228 is sucked through the holes/slits 108 on the heat sink 102 towards the inner surface 224.
- momentum and the thermal boundary layer on the outer surface 220 where the fins 106 are located thins out and heat transfer is improved.
- Figure 5 shows the status when positive electrical tension is applied to the piezo ceramic disks 208 in the synthetic jet mechanism 104.
- the diaphragms 206 move inwards.
- air volume in the upper air chamber 210 and the lower air chamber 212 is increased, and an amount of air 234 is sucked inwards through the upper air vent 218 in the bottom cover 204 of the mechanism 104. Since the frequency of the electric current applied is high, the air flows 228-230 on the outer and inner surfaces 220-224 which are very close to the air vents 218-222 are not affected by this suction and in effect a continuous air flow is achieved.
- the air flow 230 to the inner surface 224 is discharged through the air vents 112 on the lower surface 114 of the heat sink 102.
- the lower surface 114 can be alternatively named coupling surface since said surface is preferably coupled to a light source, in particular a LED light source.
- the heat of said light source is preferably conducted through the tube like main body 300 to the fins 106.
- FIG. 6 is a picture of the disassembled cooling system 100.
- the system 100 consists of a heat sink 102 and a synthetic jet mechanism 104.
- the synthetic jet mechanism 104 consists of a top cover 202 respectively a housing, a bottom cover 204 and two diaphragms 206. Piezo ceramic disks 208 are fixed to the diaphragms 206 respectively a flexible member. The diaphragms 206 are affixed to the niches 302 found inside the bottom cover 204.
- the heat sink 102 has fins 106 and holes/slits 108 that allow air absorption.
- Fig. 7 shows a light source 116a coupled to the cooling device 100 of the present invention.
- the light source 116a is preferably a LED light source.
- the light source 116a preferably has a shape similar to a disc or a circular plate.
- the light source 116a is attached to the lower surface 114 of the cooling device 100.
- Preferably air vents 112 are surrounding light source 116a in circumferential direction.
- Light source 116a emits light on one side and is coupled with the lower surface 114 of the cooling device 100 with the other side. Due to the vents 112 air ejected by the upper and lower air chambers 210, 212 is ejected from the tube like main body 300.
- the light source 116a emits heat which is conducted through the material of lower plate 114 to the heat dissipating element 103. Due to the inventive air jet mechanism of the present cooling device 100 heat is in particular dissipated from the tube like main body 300. Since the jet mechanism of the present cooling device 100 increases air flow on the inner and outer surface 224, 220 of the tube like main body 300 the cooling effect is significantly increased compared to state of the art cooling devices.
- Fig. 8 shows an arrangement similar to the arrangement of Fig. 7 , but instead of just one light source 116a a plurality of light sources 116b is arranged on the lower surface 114 of the cooling device 100.
- the plurality of light sources 116b preferably comprises at least two light sources 116b or at least three light sources 116b or at least four light sources 116b or at least eight light sources 116b.
- at least one of said light sources 116 or the majority of said light sources 116b or all of said light sources 116 are LED light sources.
- the light sources 116b emit different light respectively light of different wavelengths or colors.
- at least one light source 116b emits green light and preferably at least one further light source emits red light and preferably at least one further light source emits blue light.
- the present invention concerns a cooling device 100 for lighting modules, in particular LED lighting modules.
- Said cooling device 100 at least comprises a fluid jet generating unit 104, wherein the fluid jet generating unit 104 comprises a housing 202 and a fluid jet generating means 209 arranged in said housing 202 for generating fluid jets, wherein the housing 202 comprises at least two separated outlets 220, 222 for outputting said fluid jets, wherein the outlets 220, 222 are fluidly connected to said fluid jet generating means 209, and a heat-dissipating unit 102 attached to the housing 104 of said fluid jet generating unit 104, wherein the heat-dissipating unit 102 comprises at least one heat-dissipating element 103 having an outer surface 220 and an inner surface 224, wherein the heat-dissipating element 103 comprises at least one fluid communication element 108, in particular a plurality of holes or slits, for establishing a fluid communication between fluid adjacent the inner surface 224 and fluid
- Cooling device or cooling system 212 lower air chamber or first fluid chamber 102 heat-dissipating unit or heat sink 103 heat-dissipating element 214 upper air channel or second fluid channel 104 fluid jet generating unit or synthetic jet mechanism 216 lower air channel or first fluid channel 106 fins or further heat-dissipating element 218 upper air vents or second one of the outlets 108 communication elements or holes or slits 220 outer surface 110 outlet opening 222 lower air vents or first one of the outlets 112 air vent or outlets 224 inner surface 114 lower surface or coupling surface 226 lower surface of cover 116a light source 228 air flow 116b multiple light sources 230 another air flow 202 top cover or housing 232 portion of the outer air flow 204 bottom cover 234 amount of air 206 flexible member or diaphragm 240 first actuator 208 piezo electric element 242 second actuator 209 fluid jet generation means 300 tube like main body 210 upper air chamber or second fluid chamber 302 niches
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Claims (10)
- Kühlvorrichtung (100) für Leuchtmodule, insbesondere LED-Leuchtmodule, die zumindest umfasst:eine Fluidstrahlerzeugungseinheit (104)
wobei die Fluidstrahlerzeugungseinheit (104) ein Gehäuse (202) und ein Fluidstrahlerzeugungsmittel (209) umfasst, das im Gehäuse (202) angeordnet ist, um Fluidstrahlen zu erzeugen,
wobei das Gehäuse (202) zumindest zwei separate Auslässe (218, 222) zum Ausgeben von Fluidstrahlen umfasst,
wobei die Auslässe (218, 222) mit dem Fluidstrahlerzeugungsmittel (209) in Fluidverbindung stehen, undeine Wärmeableiteinheit (102), die am Gehäuse (202) der Fluidstrahlerzeugungseinheit (104) angebracht ist,
wobei die Wärmeableiteinheit (102) zumindest ein Wärmeableitelement (103) mit einer Außenfläche (220) und einer Innenfläche (224) umfasst,
wobei das Wärmeableitelement (103) zumindest ein Fluidverbindungselement (108), insbesondere eine Mehrzahl von Löchern oder Schlitzen, umfasst, um eine Fluidverbindung zwischen Fluid, das der Innenfläche (224) benachbart ist, und Fluid, das der Außenfläche (220) benachbart ist, herzustellen, um Druckunterschiede zwischen Fluid, das der Innenfläche (224) benachbart ist, und Fluid, das der Außenfläche (220) benachbart ist, zu eliminieren,wobei ein erster der Auslässe (222) der Innenfläche (224) des Wärmeableitelements (103) benachbart angeordnet ist und ein zweiter der Auslässe (218) der Außenfläche (220) des Wärmeableitelements (103) benachbart angeordnet ist, um Druckunterschiede zwischen Fluid, das der Innenfläche (224) benachbart ist, und Fluid, das der Außenfläche (220) benachbart ist, zu bewirken,dadurch gekennzeichnet, dass der Luftstrom (230), der aus dem ersten der Auslässe (222) zur Innenfläche (224) auftritt, durch Lüftungsöffnungen (112) auf einer Unterseite (114) der Wärmeableiteinheit (102) abgelassen wird, wobei eine Lichtquelle (116a) oder mehrere Lichtquellen (116b) an der Unterseite (114) anbringbar sind. - Kühlvorrichtung nach Anspruch 1,
dadurch gekennzeichnet, dass
das Fluidstrahlerzeugungsmittel (209) zumindest zwei Aktuatoren (240, 242) umfasst,
wobei ein erster der Aktuatoren (240) mit dem ersten der Auslässe (222) verbunden ist und ein zweiter der Aktuatoren (242) mit dem zweiten der Auslässe (218) verbunden ist. - Kühlvorrichtung nach Anspruch 2,
dadurch gekennzeichnet, dass
zumindest einer der Aktuatoren (240, 242) ein flexibles Element (206), insbesondere eine Membran, umfasst,
wobei das flexible Element (206) mit einem piezoelektrischen Element (208) zum Beugen des flexiblen Elements (206) vor und zurück verbunden ist. - Kühlvorrichtung nach Anspruch 3,
dadurch gekennzeichnet, dass
eine Fluidkammer (210, 212) zwischen jedem der flexiblen Elemente (206) und dem jeweiligen Auslass (218, 222) bereitgestellt ist,wobei jede Fluidkammer (210, 212) eine Fluidverbindung zwischen einem der Aktuatoren (240, 242) und dem jeweiligen Auslass (218, 222) bereitstellt,wobei jedes der flexiblen Elemente (206) eine Kreisform aufweist und sich in einem nicht gebeugten Zustand in einer Ebene erstreckt,wobei sich die Fluidverbindung geneigt, insbesondere orthogonal, zur Ebene erstreckt. - Kühlvorrichtung nach zumindest einem der Ansprüche 1 bis 4,
dadurch gekennzeichnet, dass
das Wärmeableitelement (103) zumindest einen teilweise hohlen und rohrförmigen Hauptkörper umfasst,
wobei sich der rohrförmige Hauptkörper von der Fluidstrahlerzeugungseinheit (104) in der Längsrichtung davon von der Fluidstrahlerzeugungseinheit (104) weg erstreckt,
wobei die Innenwand des wärmeableitenden Hauptkörpers die Innenfläche (224) aufweist und die Außenwand des wärmeableitenden Hauptkörpers zumindest teilweise die
Außenfläche (220) aufweist,
und
wobei Lamellen (106) auf der Außenfläche (220) des rohrförmigen Hauptkörpers angeordnet sind,
wobei die Lamellen (106) zumindest teilweise und bevorzugt hauptsächlich in Längsrichtung des Hauptkörpers ausgerichtet sind. - Kühlvorrichtung nach Anspruch 5,
dadurch gekennzeichnet, dass
der Hauptkörper aus einem Material oder einer Legierung oder einer Materialkombination zumindest mit einer Wärmeleitfähigkeit von mehr als 14 W/mK und vorzugsweise mehr als 40 W/mK oder 50 W/mK oder 60 W/mK oder 70 W/mK oder 80 W/mK oder 100 W/mK oder 130 W/mK oder 160 W/mK oder 170 W/mK oder 200 W/mK oder 230 W/mK oder 270 W/mK oder 300 W/mK oder 400 W/mK oder 425 W/mK besteht,
wobei das Material, die Legierung oder die Materialkombination vorzugsweise zumindest eines oder zwei oder mehr als zwei der Materialien Stahl, Eisen, Nickel, Wolfram, Zink, Messing, Aluminium, Gold, Silber oder Kupfer umfasst. - Kühlvorrichtung nach zumindest einem der Ansprüche 1 bis 6,
die ferner umfasst
eine Steuereinheit zum Betätigen der piezoelektrischen Elemente (208),
wobei die Frequenz jedes piezoelektrischen Elements (208) durch Bereitstellen jeweiliger elektrischer Signal individuell einstellbar ist, wobei jedes piezoelektrische Element mit einer Frequenz von zumindest 2 Hz und vorzugsweise mit einer Frequenz von zumindest 10 Hz und am meisten bevorzugt mit einer Frequenz von zumindest 50 Hz betätigt wird. - Beleuchtungssystem,
das umfasst
eine Lichtquelle, und
eine Kühlvorrichtung (100) nach einem der vorstehenden Ansprüche,
wobei die Lichtquelle mit der Unterseite (114) der Kühlvorrichtung (100) so verbunden ist, dass die Kühlvorrichtung (100) die Lichtquelle während eines Betriebs kühlt. - Verfahren zum Kühlen einer Lichtquelle,
das die Schritte umfasst:- Bereitstellen einer Kühlvorrichtung (100) oder Systems nach einem der vorstehenden Ansprüche,- Erzeugen von Fluidstrahlen mit der Fluidstrahlerzeugungseinheit (104) und Ausgeben der Fluidstrahlen durch die Auslässe (218, 222),∘ wobei die Fluidstrahlen, die durch den ersten Auslass (222) ausgegeben werden, sich zumindest in einem Parameter von den Fluidstrahlen unterscheiden, die durch den zweiten Auslass (218) ausgegeben werden,▪ wobei ein Druckunterschied durch die unterschiedlichen Fluidstrahlen so bewirkt wird, dass Fluid von außerhalb des Wärmeableitelements (103) durch zumindest ein Kommunikationselement (108) in das Innere des Wärmeableitelements (103) gesaugt wird. - Verfahren nach Anspruch 9,
dadurch gekennzeichnet, dass
die Fluidstrahlunterschiede bewirkt werden durch- Unterschiede in den elektrischen Signalen, die das einzelne piezoelektrische Element (208) stimulieren; und/oder- Unterschiede in der Größe der einzelnen Fluidkammern (210, 212), und/oder- Unterschiede in den Größen der einzelnen flexiblen Elemente (206), und/oder- Unterschiede in den Profilen der einzelnen Auslässe (218, 222).
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US7556406B2 (en) | 2003-03-31 | 2009-07-07 | Lumination Llc | Led light with active cooling |
US7932535B2 (en) * | 2005-11-02 | 2011-04-26 | Nuventix, Inc. | Synthetic jet cooling system for LED module |
EP1975505A1 (de) * | 2007-03-26 | 2008-10-01 | Koninklijke Philips Electronics N.V. | Beleuchtungsvorrichtung |
CN101566326B (zh) * | 2008-04-23 | 2012-09-19 | 富准精密工业(深圳)有限公司 | 照明装置及其光引擎 |
US20140319239A1 (en) | 2013-02-22 | 2014-10-30 | Nuventix, Inc. | Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector |
US9184109B2 (en) | 2013-03-01 | 2015-11-10 | Nuventix, Inc. | Synthetic jet actuator equipped with entrainment features |
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