EP3133616A1 - Induktives stromübertragungssystem - Google Patents

Induktives stromübertragungssystem Download PDF

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Publication number
EP3133616A1
EP3133616A1 EP15181981.0A EP15181981A EP3133616A1 EP 3133616 A1 EP3133616 A1 EP 3133616A1 EP 15181981 A EP15181981 A EP 15181981A EP 3133616 A1 EP3133616 A1 EP 3133616A1
Authority
EP
European Patent Office
Prior art keywords
coil
conductor
ipt
edges
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15181981.0A
Other languages
English (en)
French (fr)
Inventor
Thomas Gradinger
Bernhard Wunsch
Jürgen Steinke
Bjoern Oedegard
Stefan Saur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Technology AG
Original Assignee
ABB Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Technology AG filed Critical ABB Technology AG
Priority to EP15181981.0A priority Critical patent/EP3133616A1/de
Publication of EP3133616A1 publication Critical patent/EP3133616A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
    • H01F2019/085—Transformer for galvanic isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Definitions

  • the invention relates to the field of power electronic applications such as power or frequency conversion based on power semiconductor switches operated via a gate drive. Specifically, it departs from an inductive power transfer system for providing power to a gate drive on elevated electrical potential.
  • Conventional galvanically insulated power supply systems include transformers with at least two windings that are inductively coupled. A coupling coefficient close to one is indicative of strong or efficient coupling, with the magnetic flux being guided in an essentially closed core around which the windings are wrapped.
  • the electric insulation required between high-voltage winding and core is relatively complex and expensive, often results in a bulky design and even might cause reliability issues.
  • IPT Inductive Power Transfer
  • Fig. 1 depicts a cross section along a vertical system or rotational axis 10 of a conventional Inductive Power Transfer (IPT) system.
  • the IPT System has a first spiral coil 11 with a front side facing a second spiral coil 12 that is displaced along the axis from the first coil by a distance g.
  • the two coils are at different voltage levels and inductively coupled.
  • two plate-shape magnetic core elements 21, 22 may be used as "magnetic shields" to partially guide the magnetic flux.
  • the coils are made of wire material with a circular cross section.
  • the electric insulation between the coils may include a solid dielectric material, or a gas such as air separating the windings.
  • Electric field peaks occur at edges or comers of either the coil or the magnetic core, as exemplarily indicated by the two arrows. Specifically, the edges are the outermost turns and the magnetic core may provoke field peaks that lead to corona discharge, internal partial discharge, and dielectric breakdown.
  • Fig.2 depicts a cross section along a vertical system axis of an IPT system with flat or planar coil conductor traces.
  • the IPT system has a first spiral coil 11 with seven turns and with a front side facing a second spiral coil 12 that is arranged co-axially with and displaced along the system axis from the first coil.
  • the coil conductors are printed traces on planar coil substrates 31, 32 as obtained for instance by conventional Printed Circuit Board (PCB) technology.
  • PCB technology is fully automated and therefore cost efficient and highly reproducible.
  • Optional disc- or plate-shaped magnetic core elements 21, 22 preferably made of ferrite improve the inductive coupling of the two coils. Again, electric field peaks occur at edges or corners of either the coil or the magnetic core, as exemplarily indicated by the two thick arrows.
  • IPT Inductive Power Transfer
  • a flat, two-dimensional conductor trace of a first coil of the IPT system is bent or shaped in a third dimension perpendicular to a coil plane encompassing, or defined by, the turns of the first coil, such that the edges of the conductor point away from a second, opposite coil of the IPT system.
  • a geometric field grading achieved by such a conductor shape moves direction and location of the electric field peaks occurring at the conductor edges away from the opposite coil of the IPT, and thus simplifies the inter-coil insulation tasks.
  • the first coil in an Inductive Power Transfer (IPT) System with a first coil facing a second coil, the first coil includes a conductor trace of essentially homogeneous thickness on, or applied to, a support surface.
  • the conductor trace is delimited by a first and a second, specifically a radially inner and a radially outer, conductor edge wherein adjacent edge sections define a radial extension or width of the conductor trace.
  • A, or even any, non-peripheral centre point of the conductor trace in-between the conductor edges is closer to the second coil than a nearest edge point of the conductor trace, in other words closer to the second coil than the one conductor edge point nearest to the centre point.
  • the above closeness-condition holds at least for any point on the conductor surface facing the second coil.
  • the support surface includes a back surface of an insulating plate or board not facing the second coil.
  • the plate comprises a groove trace of which the inner surface is at least partly coated with a conductive layer to form the conductor trace.
  • the grooves have a rounded cross-section with no corners and continuously narrowing down with increasing groove depth, more preferably the cross-section of the groove is approximately semi-circular with a groove diameter dg.
  • the electric field peak values in a direction of the second coil are further mitigated by the solid dielectric material of the insulating plate.
  • the support surface may be a front surface of the plate facing the second coil and having bumps or embossments coated with a conductive layer.
  • both the first and the second coil of the IPT system include conductor traces made from coated grooves in corresponding first and second insulating plates.
  • the two insulating plates are not separated by an air gap of a specific width to achieve a specific electric insulation strength. Rather, the first and second insulating plates may be joined together or may even be one and the same plate, in which case the conductor trace support surfaces are opposing surfaces of a same dielectric support.
  • an intermediate layer of an intermediate dielectric material having a dielectric constant that is lower than a dielectric constant of the insulating plates may be provided in between the first and the second insulating plates.
  • Such intermediate layer provides for refractive, non-geometrical field grading, and particularly results in lower electric fields in the first and second insulating plates.
  • the IPT system of the preferred embodiment has no additional conductive layer or guard ring for electric field grading between the first and the second insulating plates, excluding specifically the presence of a printed conductive surface or sprayed conductive varnish, and thus simplifying a manufacturing process of the IPT system.
  • a conductor width, or a groove diameter increases towards the inner and/or outer edges of the first coil, in order to further reduce the highest electric field values expected to occur, in case of uniform conductor width within the coil, at the innermost and/or outermost coil turns.
  • the system includes a first core element in the form of a disc of magnetic material facing a rear side of the first coil to improve the magnetic coupling of the two coils.
  • the first core element has a first planar surface area parallel to the first coil plane and delimited by a first circumference. The outermost turn of the first coil extends beyond the first circumference such as to partially screen the first core element.
  • outer turns of the first coil extend axially out of the first coil plane and are bent away from the second coil.
  • the geometric field grading achieved by this arrangement decreases a maximum electric field strength at the surface of the coil conductors, and thus further simplifies the insulation tasks.
  • An average, axial distance of the outermost turn from the first coil plane may even exceed a distance of the first planar surface area of the core element from the first coil plane.
  • the coil is shaped towards and partly enclosing and electrically screening the first core element in order to decrease a maximum electric field strength occurring at the core element.
  • the IPT system is most beneficially employed in a power electronic system for power or frequency conversion, static VAr compensation (Statcom applications), or motor drives.
  • the power electronic system has power semiconductors switches controlled, driven or operated via controllers or gate drives on medium or high potential that in turn are supplied with power via IPT systems from a power source on ground potential.
  • Fig.3 depicts a cross section along a vertical system axis 10 of an exemplary IPT system according to the invention.
  • the IPT system has a first spiral coil 11 with five turns that faces a second spiral coil 12 arranged co-axially with and displaced along the system axis from the first coil.
  • a first electrically insulating plate or board 41 has a rear or back surface 31 facing away from the second coil. The back surface comprises semi-circular grooves, or channels, formed in the insulating plate.
  • a conductor trace 51 of the first coil 11 is formed by coating the inner surfaces of the grooves.
  • the turns of the first coil define a first coil plane 110 for reference purposes.
  • An optional disc- or plate-shaped magnetic core element 21 made of ferrite may be used as "magnetic shield" to partially guide the magnetic flux and improve the inductive coupling of the two coils.
  • a second electrically insulating plate 42 has a rear surface 32 facing away from the first coil.
  • the back surface comprises semi-circular grooves with a diameter dg of a few millimetres formed in the insulating plate.
  • a conductor trace 52 of the second coil 12 is formed by coating the inner surfaces of the grooves. While the conductor traces 52 of the second coil have an almost uniform thickness, the conductor traces 51 of the first coil are shown to be thicker in the middle, however, both traces 51, 52 are shown with an exaggerated thickness for illustrative purposes.
  • Fig.4 depicts a comparison of the simulated maximum electric field strengths on the support surface adjacent to the outer edge of the outermost turn as a function of the distance d in the two configurations of Fig.2 (broken line) and Fig.3 (solid line). Field enhancements at the edge of the conductor trace of the outermost turn are much stronger for flat traces than for conductor traces with edges bent away from the opposite coil.
  • the two insulating support plates 41, 42 may be separated by an air gap as shown in Fig.2 , or may be combined in one plate without air gap in-between as shown in Fig.3 .
  • the diameter or width dg of the grooves can be chosen rather large to obtain a more homogeneous electric field and reduced field peaks.
  • the coating height can then be adapted to the operation frequency and current level. Much less conducting material will be used resulting in lighter, smaller design that is more adapted to the high frequency low power operation.
  • the plates including grooves can be manufactured in various ways, in particular using technologies known for MID (molded interconnect devices), including “laser direct structuring” (LDS), “two-shot molding”, and “hot pressing” where the grooves are formed in a flat plate of thermoplastic material at elevated temperature.
  • MID molded interconnect devices
  • LDS laser direct structuring
  • two-shot molding two-shot molding
  • hot pressing hot pressing
  • Applying conductor traces on non-planar support surfaces may be accomplished by various manufacturing technologies including 3D MID (3 Dimensional Molded Interconnect Device) technology.
  • a molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces.
  • 3D MID technology combines high temperature thermoplastics substrate/housing with structured metallization circuitry into a single part through selective metallization.
  • the conductor traces may be inner layer traces completely surrounded by solid dielectric material, similar to multilayer printed circuit boards that have trace layers inside the board obtained by laminating a stack of materials in a press by applying pressure and heat. Remaining field peaks near the conductor are then located fully within the solid material, which has a higher dielectric strength than air.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
EP15181981.0A 2015-08-21 2015-08-21 Induktives stromübertragungssystem Withdrawn EP3133616A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15181981.0A EP3133616A1 (de) 2015-08-21 2015-08-21 Induktives stromübertragungssystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15181981.0A EP3133616A1 (de) 2015-08-21 2015-08-21 Induktives stromübertragungssystem

Publications (1)

Publication Number Publication Date
EP3133616A1 true EP3133616A1 (de) 2017-02-22

Family

ID=53938249

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15181981.0A Withdrawn EP3133616A1 (de) 2015-08-21 2015-08-21 Induktives stromübertragungssystem

Country Status (1)

Country Link
EP (1) EP3133616A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020053026A1 (en) * 2018-09-14 2020-03-19 Prodrive Technologies B.V. Electric field reducing insulating layer for an inductive coil

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10039707A1 (de) * 2000-08-14 2002-03-07 Alstom Power Conversion Gmbh Energieversorgungseinheit zur Übertragung von Hilfsenergie für eine elektrische Anordnung
US20030179067A1 (en) * 2001-03-05 2003-09-25 Masahiro Gamou Planar coil and planar transformer
WO2004004118A1 (en) * 2002-06-26 2004-01-08 Koninklijke Philips Electronics N.V. Planar resonator for wireless power transfer
US20040130913A1 (en) * 2002-10-23 2004-07-08 International Rectifier Corporation Switching voltage regulator for switch mode power supply with planar transformer
WO2013057913A1 (ja) * 2011-10-17 2013-04-25 パナソニック 株式会社 非接触給電装置及び非接触給電装置の１次コイルブロック
US20140176288A1 (en) * 2012-12-21 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Electromagnetic induction module for wireless charging element and method of manufacturing the same
WO2014096039A1 (de) * 2012-12-21 2014-06-26 Robert Bosch Gmbh Induktivladespulenvorrichtung
DE102013100622A1 (de) * 2013-01-22 2014-07-24 Phoenix Contact Gmbh & Co. Kg Leiterplatte im Lagenaufbau

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10039707A1 (de) * 2000-08-14 2002-03-07 Alstom Power Conversion Gmbh Energieversorgungseinheit zur Übertragung von Hilfsenergie für eine elektrische Anordnung
US20030179067A1 (en) * 2001-03-05 2003-09-25 Masahiro Gamou Planar coil and planar transformer
WO2004004118A1 (en) * 2002-06-26 2004-01-08 Koninklijke Philips Electronics N.V. Planar resonator for wireless power transfer
US20040130913A1 (en) * 2002-10-23 2004-07-08 International Rectifier Corporation Switching voltage regulator for switch mode power supply with planar transformer
WO2013057913A1 (ja) * 2011-10-17 2013-04-25 パナソニック 株式会社 非接触給電装置及び非接触給電装置の１次コイルブロック
US20140176288A1 (en) * 2012-12-21 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Electromagnetic induction module for wireless charging element and method of manufacturing the same
WO2014096039A1 (de) * 2012-12-21 2014-06-26 Robert Bosch Gmbh Induktivladespulenvorrichtung
DE102013100622A1 (de) * 2013-01-22 2014-07-24 Phoenix Contact Gmbh & Co. Kg Leiterplatte im Lagenaufbau

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020053026A1 (en) * 2018-09-14 2020-03-19 Prodrive Technologies B.V. Electric field reducing insulating layer for an inductive coil
NL2021631B1 (en) * 2018-09-14 2020-05-07 Prodrive Tech Bv Electric field reducing insulating layer for an inductive coil
US11551862B2 (en) * 2018-09-14 2023-01-10 Prodrive Technologies Innovation Services B.V. Electric field reducing insulating layer for an inductive coil

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