EP3122922A1 - Procédé de croissance d' éléments allongés (nanofils, microfils) parallèles à partir d'un substrat comportant pour chaque élément allongé un germe formé dans un creux d'une couche de nucléation ou d'un plot de nucléation - Google Patents
Procédé de croissance d' éléments allongés (nanofils, microfils) parallèles à partir d'un substrat comportant pour chaque élément allongé un germe formé dans un creux d'une couche de nucléation ou d'un plot de nucléationInfo
- Publication number
- EP3122922A1 EP3122922A1 EP15711194.9A EP15711194A EP3122922A1 EP 3122922 A1 EP3122922 A1 EP 3122922A1 EP 15711194 A EP15711194 A EP 15711194A EP 3122922 A1 EP3122922 A1 EP 3122922A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- nucleation
- seed
- mask
- pit
- growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/186—Epitaxial-layer growth characterised by the substrate being specially pre-treated by, e.g. chemical or physical means
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/005—Growth of whiskers or needles
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/62—Whiskers or needles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1246—III-V nitrides, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
Definitions
- the invention relates to the growth of an elongate element, in particular of the microfil or nanowire type, in the field of electronics, in particular of optoelectronics.
- the subject of the invention is more particularly a method of growing an elongated element, in particular a wire of the nanowire or microfilming type.
- one possibility is on the one hand to use a substrate, in particular made of silicon, and on the other hand to make light-emitting diode structures based on microfilts / nanowires to avoid the critical step of planar growth, for example. example of GaN on Si.
- the controlled growth of perfectly vertical microfilms is essential for the optimal realization of all the subsequent technological steps necessary for the manufacture of the component. It is known to use a nucleation layer on which it is formed a mask.
- the mask has a plurality of openings each for delimiting a growth site of a microfilament.
- the object of the present invention is to propose a solution that overcomes all or part of the disadvantages listed above.
- This goal is aimed in particular by the use of a method of growing an elongate element, in particular a nanowire or microfil wire, which comprises the following steps:
- the step of forming the nucleation surface comprises a step of forming the mask on a nucleation layer, an opening of said mask forming, with a part of the nucleation layer, a blind hole whose bottom formed by said portion of the nucleation layer corresponds to the nucleation surface.
- the following steps are successively carried out: a modification of the topology of the nucleation layer so as to form the said at least one nucleation pit, the stage of formation of the mask, the stage of nucleation of the nucleus, the stage of growth of the elongated element.
- the method comprises a step of providing a substrate on which a nucleation layer is formed, and the step of forming the nucleation surface comprises the following steps:
- said mask surrounding said pad, in particular at its base disposed at the angle of said pad with the substrate.
- the method comprises successively the following steps: a modification of the topology of the nucleation layer so as to form the said at least one nucleation pit, the etching of the nucleation layer, the formation of mask, nucleation stage of the seed, the growth step of the elongated element.
- the method comprises a step of forming said at least one germination trough carried out such that said at least one nucleation trough defines a nucleation zone of the germ having a variation of energy necessary for the formation of said germ, at the level of the nucleation zone alone, less than the variation of energy necessary for the formation of the same nucleus at the angle between the mask and the nucleation surface.
- the step of forming the nucleation surface is such that it comprises a step of determining the shape of said at least one nucleation pit, taking into account a first wettability factor of the material intended to form the seed on the material used to form the nucleation surface and a second wettability factor of the material for forming the seed on the material used to form the mask, and a step of forming said at least one seed pit in the determined form.
- the seed pit adopts, in particular in all or part, the shape of a cone, in particular of revolution or pyramid, whose surface is defined by a generating line passing through a fixed point belonging to a secant main axis, perpendicular to the plane including a guide curve of said cone, and the method comprises a step of determining an angle a / 2, in particular maximum, between the generating line and said main axis, said angle a / 2 being determined from the first and second wetting factors.
- the step of forming the nucleation surface is such that said at least one nucleation pit adopts, in particular wholly or partly, the shape of a cone, in particular of revolution or pyramid, the surface of which is defined by a generating line passing through a fixed point belonging to a secant main axis, in particular perpendicular to the plane including a guide curve of said cone, the maximum angle a / 2 between the generative line and the main axis being less than 53 degrees.
- the invention also relates to a method of manufacturing an electronic device, in particular an optoelectronic device, which comprises a step of implementing the method of growth of an elongate element as described, and a step of functionalizing said elongated element of so that the latter participates in the emission, or reception, of photons.
- the invention also relates to a functionalized substrate for the growth of an elongate element, in particular a nanowire or microfil wire, said substrate comprising a nucleation surface for the growth of the elongate element, a mask delimiting at least part of said nucleation surface, said nucleation surface comprising at least one nucleation pit located at a distance from the mask.
- said at least one nucleation pit is in the form of a cone, in particular of revolution or pyramid, all or part of the surface of which is defined by a generating straight line passing through a fixed point belonging to a main axis intersecting, in particular perpendicular to the plane including a guide curve of said cone, the maximum angle a / 2 between the generating line (d1) and the main axis being less than 53 degrees.
- the invention also relates to an electronic device, in particular an optoelectronic device, comprising an elongate element extending from a nucleation surface, said at least one nucleation pit belonging to the nucleation surface is filled with the elongated element.
- the device comprises a transmitting member or photon receiver, said member having a P-N junction of which a portion is formed by said elongate member.
- FIGS. 1 to 3 are sectional views of different stages of growth of a microfilm according to the prior art
- FIGS. 4 to 6 are sectional views of different growth stages of an elongated element according to a particular embodiment of the invention
- FIGS. 7 to 11 are sectional views of different growth stages of an elongated element according to another embodiment of the invention.
- FIG. 12 schematically represents the formation of a crystalline seed in the form of a spherical cap
- FIGS. 13 and 14 illustrate two nucleation variants of a seed
- FIG. 15 illustrates in more detail the shape of a nucleation pit formed on the nucleation surface
- FIGS. 16 and 17 illustrate the variation of ⁇ ⁇ "- ⁇ ⁇ as a function of the angle a / 2
- FIG. 18 illustrates a sectional view of an optoelectronic device capable of transmitting or receiving photons.
- the present invention differs from what has been described in the prior art in that it is proposed to control the surface topology of the nucleation layer (layer which will allow the growth of the son, in particular GaN) to control the phenomenon of germination of GaN and improve the verticality of said son.
- the surface topology of the nucleation layer layer which will allow the growth of the son, in particular GaN
- tests have shown that by using a substrate 1 on which a mask 2 is formed so as to leave a nucleation surface 3 coming from the substrate 1 free of access, it was possible to observe that the problem of non-verticality of the threads came from a phenomenon occurring in the first instants of the germination phase of a wire, for example GaN on a silicon substrate (formed at least in part by the substrate 1).
- the seed 4 tends to form at the angle between the mask 2 and the nucleation surface 3. Consequently, the seed is not centered on the nucleation surface, and it is this behavior that generates a non-vertical growth of wire 5 with respect to the substrate 1 (FIG. 3).
- the seed would be more likely to form at the level of the nucleation pit and not at the angle between the mask 2 and the nucleation surface 3.
- this germination hollow is formed away from the mask 2.
- a wire it is possible to extend this notion of wire to any elongated element.
- the elongated element may be a wire, for example of the nanowire or microfilter type.
- microfil or "nanowire” in the following description, preferably means a three-dimensional structure of elongated shape whose longitudinal dimension is at least greater than once the transverse dimension or dimensions, preferably at least five times and even more preferably at least ten times.
- the transverse dimension or dimensions are between 5 nm and 2.5 ⁇ m. In some embodiments, the transverse dimensions may be less than or equal to about 1 ⁇ , preferably between 100 nm and 300 ⁇ m. nm. In some embodiments, the height of each nanowire, or microfilts, may be greater than or equal to 500 nm, preferably between 1 ⁇ and 50 ⁇ .
- the method of growing an elongated element 5, in particular a wire, for example of the nanowire or microfilter type comprises a step of forming a nucleation surface 3 (in particular thus forming a preferred growth zone 6 of said elongated element 5) having at least one germination site adopting the shape of a nucleation hollow 7.
- the nucleation surface 3 is delimited at least in part by a mask 2.
- Said at least one hollow germination 7 is located at a distance from the mask 2.
- the growth method comprises a nucleation step, or also called in the germination step field (it is understood that in the present description the terms nucleation and germination have the same direction), (FIG.
- the method comprises a step of growing said elongate element 5 from the seed 4.
- the germination hollow located at a distance from the mask it is meant that the germination hollow 7 is not situated at the angle between the mask 2 and the nucleation surface 3 but at a certain distance from said mask 2.
- “Certain distance” means that the germination hollow 7 is situated at a distance from the mask 2 at least once, twice, five times, or ten times, the width of the germination hollow 7.
- the hollow germination 7 is located substantially in the center of the nucleation surface 3 whose periphery is delimited by the mask 2.
- nucleation surface is meant at least a part of an outer surface of an element such as a pad, or a layer, formed in a material compatible with the formation of a seed 4 in order to allow the growth of the elongate element 5.
- the growth step is preferably such that the elongated element extends along its direction of elongation from said nucleation surface 3 while moving away from said nucleation surface 3.
- the step of forming the nucleation surface 3 comprises a step of forming the mask 2 on a nucleation layer 8, an opening of said mask 2 forming, with a part of the nucleation layer 8, a blind hole whose bottom formed by said part of the nucleation layer 8 corresponds to the nucleation surface 3 delimited by the mask 2.
- the following steps are successively carried out: a modification of the topology of the nucleation layer 8 so as to form the said at least one nucleation hollow 7, the formation step of the mask 2, the nucleation step of the seed 4, the growth step of the elongated element 5.
- the method comprises a step of providing a substrate 9 on which a nucleation layer 8 is formed (FIG. 7), and the step of forming the surface of nucleation 3 comprises the following steps: an etching of the nucleation layer 8 to the substrate 9 so as to form a stud 10 (FIG. 9); a formation of the mask 2 on the substrate 9, said mask 2 surrounding said stud 10, in particular at its base disposed at the angle of said stud 10 with the substrate 9.
- the stud 10 can form a protrusion with respect to the mask 2, but preferably the stud 10 is flush with the mask 2.
- the substrate provided may also directly include the pad 10 (obtained in any manner).
- the method comprises successively the following steps: a modification of the topology of the nucleation layer 8 (FIG. 8) so as to form the said at least one seed pit 7, etching the nucleation layer 8, the formation of the mask 2 (FIG. 9), the nucleation step of the seed 4 (FIG. 10), the growth step of the elongated element 5 (FIG. 11).
- the nucleation layer may comprise, or consist of, aluminum nitride, or a nitride of a transition metal, for example selected from TaN, ZrN, HfN, NbN , etc., whose thickness may be between 10 nm and 100 nm.
- this nucleation layer 8 (for example prepared ex-situ) can be formed in two stages: firstly the metal (Ta, Zr, Hf, Nb, etc.) is deposited on the substrate 9 (substrate visible to FIGS.
- the substrate 9 is n doped silicon, in particular doped n +. This makes it possible, for example, to inject charge carriers via the silicon substrate into the active part of the device that will be located at the level of the elongated element 5.
- the n + doped substrates have a very low electrical resistance, of the order of some mQ.cm.
- the step of modifying the topology of the nucleation layer 8 so as to form said at least one seed pit 7 is carried out by indentation.
- indentation is meant that the step involves the use of a tip whose end is shaped so as to partially penetrate the nucleation layer 8 so that after withdrawal of the tip, the hollow of germination 7 obtained has a predetermined shape.
- the method generally comprises and applicable to all its embodiments a step of modifying the topology of the nucleation layer, in particular carried out in the manner as described above, to form said at least one nucleation pit .
- this step of modifying the topology of the nucleation layer is carried out after formation of said nucleation layer.
- the modification of the topology of the nucleation layer consists in forming a nucleation pit whose properties allow the seed to come to form automatically at the level of said corresponding seed pit.
- the step of modifying the topology is such that the seed pit is of depth approaching the thickness of the nucleation layer but without exceeding it.
- the thickness of the nucleation layer is of the order of 20 nm and the depth of the germination hollow is between 5 nm and the thickness of the nucleation layer minus 1 nm.
- the nucleation pit is not comparable to a simple surface roughness and may be such that it comprises a bottom delimited by a part of the nucleation layer.
- nucleated nucleus 4 during the nucleation step is made of gallium nitride.
- the nucleation step of the seed 4 is carried out according to the MOCVD technique.
- MOCVD being the acronym for "Metalorganic chemical vapor deposition” meaning in French chemical vapor deposition using metallo-organic precursor.
- the elongated element 5 obtained at the end of the growth step may be preferably gallium nitride doped n. Growth can be achieved using the MOCVD technique.
- the mask 2 can be deposited on the nucleation layer 8.
- the deposit can be random (for example in situ using, for example, Si x N y ) or organized (for example, If 3 N 4 , SiO 2 , ).
- the substrate 9, preferably in silicon has visible areas where the etching has been performed. These apparent zones delimit the pad or pads 10.
- the mask 2 it is possible to form the mask 2 by implementing a step of nitriding NH 3 apparent areas of the silicon substrate (the mask is then Si x N y ). It is understood from what has been said above that the presence of the germination hollow 7 makes it possible to promote the vertical growth of an elongated element relative to the plane in which the mask or the substrate 9 is formed.
- vertical growth of the elongate element 5 is understood to mean that the latter has two opposite longitudinal ends, one of which is in contact with the nucleation layer 3 and the other is at a distance from said nucleation layer 3, the elongation direction being substantially perpendicular to the plane including the nucleation surface 3 and / or at a plane including the substrate 9.
- the nucleation phenomenon of a gallium nitride seed on a substrate can be understood by a purely thermodynamic approach involving an energy balance of the surfaces and interfaces.
- the heterogeneous germination of GaN on a substrate 9 can be schematized by a crystalline embryo (corresponding to the seed 4 described above) whose shape is that of a spherical cap formed on a planar substrate as shown in FIG. 12.
- G is the interfacial tension for the crystal-gas surface
- ⁇ S G the interfacial tension for the substrate-gas surface
- S c the substrate-crystal interface energy.
- ⁇ corresponds to 6 Ga N / cN.
- Figures 13 and 14 each illustrate a nucleation layer 8 preferably carried by a substrate 9 and on which a mask 2 is formed.
- the seed 4 is formed at the angle between the nucleation layer 8 (at the nucleation surface 3) and the mask 2, and in FIG. 14 the seed 4 is formed at the center of the surface nucleation 3 (here devoid of the seed pit 7 according to the invention).
- f1 represents the wettability factor of gallium nitride on nucleation layer 8 (Ta x N y in the case of the example) with 0 ⁇ f1 ⁇ 1
- f2 the wettability factor of GaN on the mask 2 (Si x N y in the case of the example) with -1 ⁇ f2 ⁇ 0.
- this is a constant and positive prefactor that includes a reference distance ⁇ .
- ri the radius of the seed (especially visible in Figures 13 and 14) and has GaN the surface energy of GaN when the seed is GaN.
- the equation can then be written by replacing a GaN by GM where GM represents the surface energy of the material M forming the seed.
- the method comprises a step of forming said at least one seed pit 7 made such that said at least one seed pit 7 defines a nucleation zone of the seed 4 having a variation of energy necessary for the formation of said seed, at the nucleation zone alone, less than the variation of energy necessary for the formation of the same seed at the angle between the mask 2 and the nucleation surface 3.
- the step of forming the nucleation surface 3 may be such that it comprises a step of determining the shape of said at least one nucleation pit 7 taking into account a first wetting factor f1 of the material intended to form the seed 4 on the material used to form the nucleation surface 3 and a second wetting factor f2 of the material material for forming the seed 4 on the material used to form the mask 2, and a step of forming said at least one seed pit 7 according to the determined shape.
- said at least one seed pit 7 has a general shape of a cone of revolution
- the method comprises a step of determining an angle a / 2, in particular maximum, of the straight line generator d1 of the cone with respect to the axis of rotation A1 of said generating line d1 from the first and second wetting factors f1, f2.
- the seed pit 7 can be characterized by an angle a representing in fact twice the angle of the generating line d1 of the cone typically defined by the angle between the generating line d1 and the axis of rotation A1 of the generating line d1.
- maximum angle ⁇ / 2 it is meant that the seed pit 7 will preferably be shaped so that the angle of the generating line d1 of the cone with respect to the axis of rotation A1 of said generating line d1 is less than a / 2.
- a / 2 is strictly greater than 0.
- a / 2 is greater than 5 ° or 10 °.
- a seed pit 7 in the general shape of a cone of revolution this example is not limiting in the sense that the seed pit 7 may also have a cone-shaped pyramid.
- a cone has a regulated surface defined by a generating line passing through a fixed point called a vertex and a variable point describing a closed plane curve called the directing curve.
- This guide curve can take the form of a circle (cone of revolution) of a square (cone shaped pyramid), any shape, etc.
- the seed pit 7 can adopt, in particular in whole or in part, the shape of a cone, in particular of revolution or in pyramid, the surface of which is defined by a passing generating line by a fixed point belonging to a secant main axis, in particular perpendicular to the plane including a guide curve of said cone.
- the method comprises a step of determining an angle a / 2, in particular maximum, between the generating line (d1) and said main axis, said angle a / 2 being determined from the first and second wetting factors f1 , f2.
- a structuring that is to say a hollow of the nucleation layer whose morphology can be characterized by a reference distance r and an angle ⁇ (FIG. 15)
- a reference distance r is set as an arbitrary variable. In practice r may be of the order of a few nanometers to some tens of nanometers.
- the graph in Figure 16 shows the evolution of ⁇ '"- AE 1 as a function of the angle ⁇ / 2 (that is to say the angle between the generating line d1 of the cone of revolution and the axis of rotation A1 of the line d1) for different values of the expression f 1 -f 2 So we see that in the case where f1 and f2 are known, the equation:
- AE m - AE 1 ctel * - - (fl - fl) sin - + 2 * 1 - cos - - - gives access to a threshold value a si ii of the angle a.
- a seu ii, ⁇ '"- ⁇ ' ⁇ o and the nucleation of the GaN nucleus on the structured nucleation layer is favored (Note: the value of the angle a seu ii for which ⁇ '" - ⁇ ' ⁇ o is independent of GaN surface energy)
- ⁇ 1 must be less than or equal to 0, with cte2 greater than 0, f1 the first wettability factor such that 0 ⁇ f1 ⁇ 1, and f2 the second wettability factor such that -1 ⁇ f2 ⁇ 0.
- n 2 r 2 sin a / 2.
- the formation step of the nucleation surface 3 is such that the germination hollow 7 has the general shape of a cone of revolution, the angle of the generating line of the cone of revolution with respect to the axis of rotation of said generator line being less than 53 degrees.
- the germination hollow 7 adopts, in particular in all or part, the shape of a cone, in particular of revolution or pyramid, whose surface is defined by a generating line passing through a fixed point belonging to a secant main axis, in particular perpendicular to the plane including a guide curve of said cone, the maximum angle a / 2 between the generating line d1 and the main axis being less than 53 degrees.
- this volume corresponds to a cone of revolution whose angle between the generating line d1 and the axis of rotation A1 of said generating line is less than 53 degrees.
- the cone of revolution has a radius dependent on the angle a / 2 and the reference distance r.
- a method of growing an elongate member has been described above.
- this process is not limited to the growth of a single elongated element.
- it is possible to achieve growth, especially simultaneously a plurality of distinct elongate elements from a plurality of distinct growth sites in particular each delimited by the same mask.
- all that has been said above can be applied in the context of a method of growing a plurality of elongated elements comprising the following steps:
- each nucleation surface comprising at least one nucleation pit located at a distance from the mask, nucleation of a nucleus, at each level; nucleation surface, intended to participate in the growth of said corresponding elongate element on said at least one nucleation pit of said corresponding nucleation surface,
- the method of growth of one or more elongated element (s) as described above can be used in the context of a method of manufacturing an electronic device, in particular an optoelectronic device.
- the method of manufacturing the electronic device, in particular the optoelectronic device may comprise a step of implementing the method of growth of an elongate element 5 and a step of functionalizing said elongate element 5 so that the latter is part of the emission, or reception, of photons (thus forming either a light-emitting diode or a solar cell).
- the functionalization step may include a step of forming a detector or light emitter comprising a junction provided with a first doped member of a first type and a second doped member of a second type distinct from the first type, said first member being formed by said elongate member.
- the first and second types are to be chosen from n-type doping or p-type doping.
- the invention may also relate to a functionalized substrate for the growth of an elongate element 5, in particular a nanowire or microfil wire, this substrate comprises a nucleation surface 3 a seed 4 allowing the growth of the elongated element, a mask 2 delimiting at least partially (or even) said nucleation surface.
- Said nucleation surface 3 comprises at least one germination hollow 7 situated at a distance from the mask 2.
- the germination trough can be filled by a corresponding seed configured so as to allow the growth of said elongated element.
- the seed pit 7 is shaped in one of the ways described above.
- This functionalized substrate is then advantageously used as part of the growth process to carry out the nucleation step of the seed 4 and the growth step of the elongate element 5.
- the step of forming the nucleation surface 3 implements a step of forming the functionalized substrate as described above.
- the invention also relates to an electronic device 100, in particular an optoelectronic device, comprising an elongated element 5 extending from a nucleation surface 3, in particular delimited at least in part by a mask 2. At least one nucleation hollow 7 belonging to the nucleation surface 3 is filled with the elongated element 5.
- the device may comprise a photon emitter or receiver member 101, said member 101 comprising a PN junction of which a portion is formed by said elongated element 5.
- the elongate element is then doped with a P type or N.
- the other part of the PN junction may be formed by another element 102 doped oppositely to the elongated element 5, said other doped element 102 covering a part of the elongated element, for example in the manner of a sheath as in Figure 18.
- the invention is not limited to the nucleation of a GaN nucleus on a TaN nucleation layer, it can be applied to all CN nucleation material materials (TiN, VN, CrN, ZrN, NbN, MoN , HfN, TaN) as well as AIN since there may be GaN heteroepitaxy on one of these materials.
- the parameter "f1" which represents the wettability factor of GaN on the nucleation or AlN layer is always between 0 and 1 and the model remains true.
- the dimensions of the germination hollows can be extremely small, of the order of a few nanometers (depth / width between 1 and 10 nm) since only the germination phase is considered here.
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Abstract
Description
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1452629A FR3019188B1 (fr) | 2014-03-27 | 2014-03-27 | Procede de croissance d'un element allonge a partir d'un germe forme dans un creux d'une couche ou d'un plot de nucleation |
| PCT/EP2015/056011 WO2015144602A1 (fr) | 2014-03-27 | 2015-03-20 | Procédé de croissance d' éléments allongés (nanofils, microfils) parallèles à partir d'un substrat comportant pour chaque élément allongé un germe formé dans un creux d'une couche de nucléation ou d'un plot de nucléation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3122922A1 true EP3122922A1 (fr) | 2017-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15711194.9A Pending EP3122922A1 (fr) | 2014-03-27 | 2015-03-20 | Procédé de croissance d' éléments allongés (nanofils, microfils) parallèles à partir d'un substrat comportant pour chaque élément allongé un germe formé dans un creux d'une couche de nucléation ou d'un plot de nucléation |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10781534B2 (fr) |
| EP (1) | EP3122922A1 (fr) |
| KR (1) | KR102386004B1 (fr) |
| CN (1) | CN106414817B (fr) |
| FR (1) | FR3019188B1 (fr) |
| WO (1) | WO2015144602A1 (fr) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9773889B2 (en) * | 2014-07-18 | 2017-09-26 | Taiwan Semiconductor Manufacturing Company Limited | Method of semiconductor arrangement formation |
| US11322652B2 (en) * | 2015-12-14 | 2022-05-03 | Ostendo Technologies, Inc. | Methods for producing composite GaN nanocolumns and light emitting structures made from the methods |
| US11967350B1 (en) * | 2022-01-31 | 2024-04-23 | Ceremorphic,inc. | System and method for current controlled nanowire memory device |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3556916B2 (ja) * | 2000-09-18 | 2004-08-25 | 三菱電線工業株式会社 | 半導体基材の製造方法 |
| JP2005101475A (ja) * | 2003-08-28 | 2005-04-14 | Hitachi Cable Ltd | Iii−v族窒化物系半導体基板及びその製造方法 |
| TWI500072B (zh) | 2004-08-31 | 2015-09-11 | 學校法人上智學院 | 發光元件之製造方法 |
| GB2436398B (en) | 2006-03-23 | 2011-08-24 | Univ Bath | Growth method using nanostructure compliant layers and HVPE for producing high quality compound semiconductor materials |
| GB0701069D0 (en) * | 2007-01-19 | 2007-02-28 | Univ Bath | Nanostructure template and production of semiconductors using the template |
| WO2008105535A1 (fr) * | 2007-03-01 | 2008-09-04 | Nec Corporation | Dispositif semi-conducteur et son procédé de fabrication |
| US8896100B2 (en) | 2007-09-03 | 2014-11-25 | Sophia School Corporation | III nitride structure and method for manufacturing III nitride semiconductor fine columnar crystal |
| US20090315120A1 (en) * | 2008-06-24 | 2009-12-24 | Lucian Shifren | Raised facet- and non-facet 3d source/drain contacts in mosfets |
| US8349715B2 (en) * | 2010-01-29 | 2013-01-08 | International Business Machines Corporation | Nanoscale chemical templating with oxygen reactive materials |
| US9385095B2 (en) * | 2010-02-26 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D semiconductor package interposer with die cavity |
| EP2564191B1 (fr) * | 2010-04-28 | 2017-11-01 | Pacific Biosciences Of California, Inc. | Ouvertures à l'échelle du nanomètre possédant des îlots de fonctionnalité |
| EP2562135A1 (fr) * | 2011-08-22 | 2013-02-27 | ETH Zurich | Procédé de fabrication et d'alignement de nanofils et applications d'un tel procédé |
| US9653286B2 (en) * | 2012-02-14 | 2017-05-16 | Hexagem Ab | Gallium nitride nanowire based electronics |
| US9773724B2 (en) * | 2013-01-29 | 2017-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages |
| JP6227128B2 (ja) * | 2013-06-07 | 2017-11-08 | グロ アーベーGlo Ab | マルチカラーled及びその製造方法 |
| US9455211B2 (en) * | 2013-09-11 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with openings in buffer layer |
| US9384879B2 (en) * | 2014-01-15 | 2016-07-05 | International Business Machines Corporation | Magnetic multilayer structure |
| US9640422B2 (en) * | 2014-01-23 | 2017-05-02 | Intel Corporation | III-N devices in Si trenches |
-
2014
- 2014-03-27 FR FR1452629A patent/FR3019188B1/fr active Active
-
2015
- 2015-03-20 US US15/128,815 patent/US10781534B2/en active Active
- 2015-03-20 KR KR1020167030024A patent/KR102386004B1/ko active Active
- 2015-03-20 CN CN201580026550.3A patent/CN106414817B/zh active Active
- 2015-03-20 EP EP15711194.9A patent/EP3122922A1/fr active Pending
- 2015-03-20 WO PCT/EP2015/056011 patent/WO2015144602A1/fr not_active Ceased
Non-Patent Citations (3)
| Title |
|---|
| BERTNESS ET AL: "Nucleation conditions for catalyst-free GaN nanowires", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 300, no. 1, 28 February 2007 (2007-02-28), pages 94 - 99, XP005915220, ISSN: 0022-0248, DOI: 10.1016/J.JCRYSGRO.2006.10.209 * |
| SCHUMANN T ET AL: "Cathodoluminescence spectroscopy on selectively grown GaN nanowires", GALLIUM NITRIDE MATERIALS AND DEVICES VI, SPIE, 1000 20TH ST. BELLINGHAM WA 98225-6705 USA, vol. 7939, no. 1, 10 February 2011 (2011-02-10), pages 1 - 9, XP060010955, DOI: 10.1117/12.878836 * |
| See also references of WO2015144602A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015144602A1 (fr) | 2015-10-01 |
| FR3019188A1 (fr) | 2015-10-02 |
| CN106414817A (zh) | 2017-02-15 |
| US20170101723A1 (en) | 2017-04-13 |
| US10781534B2 (en) | 2020-09-22 |
| KR102386004B1 (ko) | 2022-04-12 |
| CN106414817B (zh) | 2020-11-03 |
| FR3019188B1 (fr) | 2017-11-24 |
| KR20160138520A (ko) | 2016-12-05 |
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