EP3111295A1

EP3111295A1 - Active heat flow control with thermoelectric layers

Info

Publication number: EP3111295A1
Application number: EP15713037.8A
Authority: EP
Inventors: Hee Jun Park; Victor Adrian Chiriac; Jon James Anderson; Alex Kuang-Hsuan Tu
Original assignee: Qualcomm Inc
Current assignee: Qualcomm Inc
Priority date: 2014-02-25
Filing date: 2015-02-13
Publication date: 2017-01-04
Also published as: WO2015130493A1; CN106030449A; KR20160124869A; CN106030449B; JP2017517777A; US20150241092A1

Abstract

Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

Description

ACTIVE HEAT FLOW CONTROL WITH THERMOELECTRIC LAYERS

BACKGROUND OF THE INVENTION

1. Field of the Invention

[0001] This disclosure is directed to heat flow control.

2. Description of the Related Art

[0002] Most of cases, the max thermal power budget is limited by a hot spot. This can result in poor surface temperature uniformity, which in turn leads to a small thermal power budget and lowered system performance. Thermal Interface Material (TIM) and air gap can have different impacts on thermal performance at skin as well as junction. Various temperature limit levels can depend on the hardware nearby, the point of contact with the user, etc. For example, the temperature thresholds may be skin (45C), memory (85C), and CPU (105-120C). Hot spots can also change with use. For example, the processor and memory while a user is gaming, the camera module when a user is recording a video, the transmitter when a user is making a call, etc.

[0003] The thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa. A thermoelectric device creates voltage when there is a different temperature on each side. Conversely, when a voltage is applied to it, it creates a temperature difference. At the atomic scale, an applied temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side.

[0004] The Peltier effect can be used to create a refrigerator which is compact and has no circulating fluid or moving parts; such refrigerators are useful in applications where their advantages outweigh the disadvantage of their very low efficiency. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler.

SUMMARY

[0005] This disclosure is directed to active heat flow control in a mobile system. [0006] For example, an exemplary embodiment is directed to a method for controlling heat flow in a mobile system, the method comprising: determining a temperature value for each of at least one temperature sensors; determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations; mapping each delta value to a thermoelectric module; calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

[0007] Another exemplary embodiment is directed to a heat flow control apparatus, the apparatus comprising: a memory, the memory comprising: a temperature data module for determining a temperature value for each of at least one temperature sensors, a comparing module for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, a mapping module for mapping each delta value to a thermoelectric module, and a heat flow direction module for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and a processor for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

[0008] Still another exemplary embodiment is directed to a heat flow control apparatus, the apparatus comprising: a memory, the memory comprising: means for determining a temperature value for each of at least one temperature sensors, means for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, means for mapping each delta value to a thermoelectric module, means for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and means for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] A more complete appreciation of aspects of the disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings which are presented solely for illustration and not limitation of the disclosure, and in which:

[0010] FIG. 1 illustrates an exemplary mobile station with hardware that may be used in an operating environment that can control heat flow.

[0011] FIG. 2 illustrates exemplary hardware that can control heat flow in a mobile system, according to one aspect of the disclosure.

[0012] FIG 3 illustrates an operational flow of a method to control heat flow in a mobile system, according to one aspect of the disclosure.

[0013] FIG. 4A illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.

[0014] FIG. 4B illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.

[0015] FIG. 4C illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.

[0016] FIG. 4D illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.

[0017] FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit diagram for active heat flow, according to one aspect of the disclosure.

[0018] FIG. 6 illustrates various thermoelectric array shapes, according to one aspect of the disclosure.

DETAILED DESCRIPTION

[0019] Various aspects are disclosed in the following description and related drawings. Alternate aspects may be devised without departing from the scope of the disclosure. Additionally, well-known elements of the disclosure will not be described in detail or will be omitted so as not to obscure the relevant details of the disclosure. [0020] The words "exemplary" and/or "example" are used herein to mean "serving as an example, instance, or illustration." Any aspect described herein as "exemplary" and/or "example" is not necessarily to be construed as preferred or advantageous over other aspects. Likewise, the term "aspects of the disclosure" does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation.

[0021] Further, many aspects are described in terms of sequences of actions to be performed by, for example, elements of a computing device. It will be recognized that various actions described herein can be performed by specific circuits (e.g., application specific integrated circuits (ASICs)), by program instructions being executed by one or more processors, or by a combination of both. Additionally, these sequence of actions described herein can be considered to be embodied entirely within any form of computer readable storage medium having stored therein a corresponding set of computer instructions that upon execution would cause an associated processor to perform the functionality described herein. Thus, the various aspects of the disclosure may be embodied in a number of different forms, all of which have been contemplated to be within the scope of the claimed subject matter. In addition, for each of the aspects described herein, the corresponding form of any such aspects may be described herein as, for example, "logic configured to" perform the described action.

[0022] FIG. 1 is a block diagram illustrating various components of an exemplary mobile station 100. For the sake of simplicity, the various features and functions illustrated in the box diagram of FIG. 1 are connected together using a common bus which is meant to represent that these various features and functions are operatively coupled together. Those skilled in the art will recognize that other connections, mechanisms, features, functions, or the like, may be provided and adapted as necessary to operatively couple and configure an actual portable wireless device. Further, it is also recognized that one or more of the features or functions illustrated in the example of FIG. 1 may be further subdivided or two or more of the features or functions illustrated in FIG. 1 may be combined.

[0023] The mobile station 100 may include one or more wide area network (WAN) transceiver(s) 104 that may be connected to one or more antennas 102. The WAN transceiver 104 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from WAN-WAPs, and/or directly with other wireless devices within a network. In one aspect, the WAN transceiver 104 may comprise a CDMA communication system suitable for communicating with a CDMA network of wireless base stations; however in other aspects, the wireless communication system may comprise another type of cellular telephony network, such as, for example, TDMA or GSM. Additionally, any other type of wide area wireless networking technologies may be used, for example, WiMAX (802.16), etc. The mobile station 100 may also include one or more local area network (LAN) transceivers 106 that may be connected to one or more antennas 102. The LAN transceiver 106 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from LAN-WAPs, and/or directly with other wireless devices within a network. In one aspect, the LAN transceiver 106 may comprise a WLAN (802.11 x) communication system suitable for communicating with one or more wireless access points; however in other aspects, the LAN transceiver 106 comprise another type of local area network, personal area network, (e.g., Bluetooth). Additionally, any other type of wireless networking technologies may be used, for example, Ultra Wide Band, ZigBee, wireless USB etc.

[0024] As used herein, the abbreviated term "wireless access point" (WAP) may be used to refer to LAN-WAPs and/or WAN-WAPs. Specifically, in the description presented below, when the term "WAP" is used, it should be understood that embodiments may include a mobile station 100 that can exploit signals from a plurality of LAN-WAPs, a plurality of WAN-WAPs, or any combination of the two. The specific type of WAP being utilized by the mobile station 100 may depend upon the environment of operation. Moreover, the mobile station 100 may dynamically select between the various types of WAPs in order to arrive at an accurate position solution. In other embodiments, various network elements may operate in a peer-to-peer manner, whereby, for example, the mobile station 100 may be replaced with the WAP, or vice versa. Other peer-to-peer embodiments may include another mobile station (not shown) acting in place of one or more WAP. An SPS receiver 108 may also be included in the mobile station 100. The SPS receiver 108 may be connected to the one or more antennas 102 for receiving satellite signals.

[0025] A heat flow control memory 1 14 may be coupled to a processor 1 10 to control heat flow using thermoelectric layers. The heat flow control memory 114 can comprise a temperature data module 126, a threshold database 124, a comparing module 1 18, a mapping module 128, and a heat flow direction module 116. In some embodiments, the temperature data module 126 can receive data from at least on temperature sensor and determine the temperature from that data. The comparing module 1 18 can determine a delta value of the temperature and a temperature threshold, which can be provided from the threshold database 124. The mapping module 128 can map the delta value to thermal module. The heat flow direction module 1 18 can then calculate a heat flow direction signal to minimize positive delta values. The heat flow control memory 1 14 can then transmit the heat flow direction signal to at least one thermoelectric module. The method In some embodiments, the heat flow control memory 1 14 can operate using real-time data.

[0026] The processor 110 may include one or more microprocessors, microcontrollers, and/or digital signal processors that provide processing functions, as well as other calculation and control functionality. The processor 110 may also include heat flow control memory 1 14 for storing data and software instructions for executing programmed functionality within the mobile station 100. The heat flow control memory 114 may be on-board the processor 110 (e.g., within the same IC package), and/or the memory 114 may be external memory to the processor 1 10 and functionally coupled over a data bus. The functional details associated with aspects of the disclosure will be discussed in more detail below.

[0027] A number of software modules and data tables may reside in heat flow control memory 1 14 and be utilized by the processor 110 in order to manage both communications and positioning determination functionality. Memory 1 14 may include and/or otherwise receive a heat flow direction module 1 16, a comparing module 118, and a mapping module 128. One should appreciate that the organization of the memory contents as shown in FIG. 1 is merely exemplary, and as such the functionality of the modules and/or data structures may be combined, separated, and/or be structured in different ways depending upon the implementation of the mobile station 100.

[0028] While the modules shown in FIG. 1 are illustrated in the example as being contained in the heat flow control memory 1 14, it is recognized that in certain implementations such procedures may be provided for or otherwise operatively arranged using other or additional mechanisms. For example, all or part of the heat flow direction module 116 and/or the comparing module 1 18 may be provided in firmware. Additionally, while in this example the comparing module 1 18 and the heat flow direction module 1 16 are illustrated as being separate features, it is recognized, for example, that such procedures may be combined together as one procedure or perhaps with other procedures, or otherwise further divided into a plurality of sub-procedures.

[0029] The processor 110 may include any form of logic suitable for performing at least the techniques provided herein. For example, the processor 1 10 may be operatively configurable based on instructions in the heat flow control memory 1 14 to selectively initiate one or more routines that exploit heat flow control data for use in other portions of the mobile device.

[0030] The mobile station 100 may include a user interface 150 which provides any suitable interface systems, such as a microphone/speaker 152, keypad 154, and display 156 that allows user interaction with the mobile station 100. The microphone/speaker 152 provides for voice communication services using the WAN transceiver 104 and/or the LAN transceiver 106. The keypad 154 comprises any suitable buttons for user input. The display 156 comprises any suitable display, such as, for example, a backlit LCD display, and may further include a touch screen display for additional user input modes.

[0031] As used herein, the mobile station 100 may be any portable or movable device or machine that is configurable to acquire wireless signals transmitted from, and transmit wireless signals to, one or more wireless communication devices or networks. By way of example but not limitation, the mobile station 100 may include a radio device, a cellular telephone device, a computing device, a personal communication system (PCS) device, or other like movable wireless communication equipped device, appliance, or machine. Also, "mobile station" is intended to include all devices, including wireless devices, computers, laptops, etc. which are capable of communication with a server, such as via the Internet, WLAN, or other network, and regardless of whether satellite signal reception, assistance data reception, and/or position-related processing occurs at the device, at a server, or at another device associated with the network. Any operable combination of the above is also considered a "mobile station."

[0032] As used herein, the term "wireless device" may refer to any type of wireless communication device which may transfer information over a network and also have position determination and/or navigation functionality. The wireless device may be any cellular mobile terminal, personal communication system (PCS) device, personal navigation device, laptop, personal digital assistant, or any other suitable mobile device capable of receiving and processing network and/or SPS signals.

[0033] As illustrated in FIG. 2, an embodiment can include a heat flow control apparatus for controlling heat flow in a mobile system 200. The heat flow control apparatus can include thermoelectric devices such as thermoelectric arrays 202, 204, 206, with a plurality of thermoelectric modules 202A, 202B, 202C, heat spreaders 208, 210, and a printed circuit board (PCB) 212 comprising a processor. In some embodiments, the mobile system 200 can include a power source 214. The mobile system 200 can also include a top case 216 and a bottom case 218.

[0034] In some embodiments, the thermoelectric arrays 202, 204, 206 can have different module locations and patterns. Each of the thermoelectric modules 202A, 202B, 202C can receive a heat flow direction signal. In some embodiments, the heat flow direction signal can transmit one of four states: off, light cooling, strong cooling, and reverse cooling.

[0035] As illustrated in FIG. 3, an embodiment can include a method for controlling heat flow in a mobile system, comprising: determining a temperature value for each of at least one temperature sensors - Block 302; determining a delta value of the temperature value and a temperature threshold at each of the plurality of locations - Block 304; mapping each delta value to a thermoelectric module (e.g., a thermoelectric cooler) - Block 306; calculating a heat flow direction signal to minimize positive delta values (e.g., wherein the method uses a system level model or an IC level thermal model) - Block 308; and transmitting the heat flow direction signal (e.g., a pulse-width modulation signal to control intensity and direction of the state of at least one of four states) to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor - Block 310.

[0036] As illustrated in FIG. 4A, a mobile device 400 comprises a PCB 402, a battery 404, a heat spreader 406, a top thermoelectric array 408 with multiple thermoelectric modules 408A-G, a bottom thermoelectric array 410 with multiple thermoelectric modules 410A-G, a top case 412 and a bottom case 414.

[0037] FIG. 4A shows an example of a situation where the temperature of the top case 412 is greater than a temperature threshold while the bottom case 414 is below the temperature threshold at a given time. The thermoelectric modules 408A-D of the top thermoelectric array 408 will receive a signal to execute a first state to turn on to direct heat flow to the bottom case 414. The thermoelectric modules 410A-D of the bottom thermoelectric array 410 will receive a signal to execute a second state to turn off to minimize upward heat flow.

[0038] As illustrated in FIG. 4B, a mobile device 420 comprises a PCB 422, a battery 424, a heat spreader 426, a top thermoelectric array 428 with multiple thermoelectric modules 428A-G, a bottom thermoelectric array 430 with multiple thermoelectric modules 430A-G, a top case 432 and a bottom case 434.

[0039] FIG. 4B shows an example of a situation where the temperature of the bottom case 434 is greater than a temperature threshold. The thermoelectric modules 430A-D of the bottom thermoelectric array 410 will receive a signal to turn on to direct heat flow to the top case 432. The thermoelectric modules 428A-D of the top thermoelectric array 428 will receive a signal to turn off to minimize downward heat flow.

[0040] As illustrated in FIG. 4C, a mobile device 440 comprises a PCB 442, a battery 444, a top heat spreader 446, a top thermoelectric array 448 with multiple thermoelectric modules 448A-G, a bottom thermoelectric array 450 with multiple thermoelectric modules 450A-G, a middle heat spreader 452, a middle thermoelectric array 454 with multiple thermoelectric modules 454A-G, a top case 456 and a bottom case 458.

[0041] FIG. 4C shows an example of a situation where the temperature of the middle of the mobile device 440 is greater than a temperature threshold. The thermoelectric modules 448A-E of the top thermoelectric array 448 and the thermoelectric modules 454A-D of the middle thermoelectric array 454 will receive a signal to turn off to minimize downward heat flow. The thermoelectric modules 450A-D of the bottom thermoelectric array 450 will receive a signal to turn off to minimize upward heat flow

[0042] As illustrated in FIG. 4D, a mobile device 460 comprises a PCB 462, a battery 464, a top heat spreader 466, a top thermoelectric array 468 with multiple thermoelectric modules 468A-G, a bottom thermoelectric array 470 with multiple thermoelectric modules 470A-G, a middle heat spreader 472, a middle thermoelectric array 474 with multiple thermoelectric modules 474A-G, a top case 476 and a bottom case 478.

[0043] FIG. 4D shows an example of a situation where the temperature of the top case 476 and the bottom case 478 are greater than corresponding temperature thresholds. The thermoelectric modules 468B-D of the top thermoelectric array 468 and the thermoelectric module 474B of the middle thermoelectric array 474 will receive a signal to turn off and thermoelectric modules 468A and E-G of the top thermoelectric array 468 and the thermoelectric modules 474A and C-G of the middle thermoelectric array 474 will receive a signal to turn on to maximize heat flow away from the top outside heat source. The thermoelectric modules 470B-C of the bottom thermoelectric array 470 will receive a signal to turn off and thermoelectric modules 470A and D-G of the bottom thermoelectric array 470 will receive a signal to turn on to maximize heat flow away from the bottom outside heat source.

[0044] In some embodiments, a current temperature threshold for one location can be different than a current temperature threshold for another location. For example, the temperature threshold for the middle of the mobile system can be lower than the temperature threshold for the top case or bottom case. Conversely, the top and bottom cases may have lower temperature thresholds so as not to injure the user.

[0045] FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit model for active heat flow, according to one aspect of the disclosure. As shown, each solid arrow 502, 504 indicate a point in an RC circuit 500 where the current temperature value is above a temperature threshold for that point. Each dotted arrow 506, 508, 510 indicates a point in the RC circuit 500 where the current temperature value is below a temperature threshold for that point. As shown between the solid arrows 502, 504, there is active heat flow 512, 514, 516 to actively remove heat from the points determine to be above their thresholds to points where the temperature is below their temperature thresholds.

[0046] FIG. 6 illustrates various thermoelectric device shapes, according to one aspect of the disclosure. As shown, a mobile system 600 can have various thermoelectric array shapes. For example, the mobile system 600 can have an "L" shaped thermoelectric array 602, an oval thermoelectric array 604, a rectangular thermoelectric array 606, and a ring-shaped thermoelectric array 608. Such different shapes can be used with various types of hardware in the mobile system. For example, the ring-shaped thermoelectric array 608 can be used to surround a camera lens.

[0047] In some embodiments, at least one thermoelectric module can be positioned to the outer portion of the device. For example, a mobile system can comprise a thermoelectric module accessory and a mobile device.

[0048] Those of skill in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0049] Further, those of skill in the art will appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

[0050] The various illustrative logical blocks, modules, and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0051] The methods, sequences and/or algorithms described in connection with the aspects disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in an electronic object. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.

[0052] In one or more exemplary aspects, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, includes CD, laser disc, optical disc, DVD, floppy disk and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0053] While the foregoing disclosure shows illustrative aspects of the disclosure, it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the aspects of the disclosure described herein need not be performed in any particular order. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.

Claims

CLAIMS What is claimed is:

1. A method for controlling heat flow in a mobile system, the method comprising: determining a temperature value for each of at least one temperature sensors; determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations;

mapping each delta value to a thermoelectric module;

calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

2. The method of claim 1, wherein the heat flow direction signal transmits one of four states: off, light cooling, strong cooling, and reverse cooling.

3. The method of claim 2, wherein the heat flow direction signal is a pulse-width modulation signal to control intensity and direction of the state of at least one of the four states.

4. The method of claim 2, wherein the heat flow direction signal transmits a first state of the four states to a first of the at least one thermoelectric module and a second state of the four states to a second of the at least one thermoelectric module.

5. The method of claim 1, wherein, at a given time, one of the temperature thresholds for each of the plurality of locations differs from another temperature threshold.

6. The method of claim 1 , wherein the method for controlling heat flow is performed using real-time data.

7. The method of claim 1, wherein the at least one thermoelectric module is positioned to an outer portion of a thermoelectric device.

8. The method of claim 1, wherein the at least one thermoelectric module is a thermoelectric cooler.

9. The method of claim 1, wherein a first thermoelectric device, which comprises the at least one thermoelectric module, has at least one of a different location and a pattern than a second thermoelectric device.

10. The method of claim 1, wherein a shape of a thermoelectric device, which comprises the at least one thermoelectric module, can be non-rectangular.

11. A heat flow control apparatus, the apparatus comprising:

a memory, the memory comprising:

a temperature data module for determining a temperature value for each of at least one temperature sensors,

a comparing module for determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations,

a mapping module for mapping each delta value to a thermoelectric module, and

a heat flow direction module for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and

a processor for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

12. The apparatus of claim 1 1, wherein the heat flow direction signal transmits one of four states: off, light cooling, strong cooling, and reverse cooling.

13. The apparatus of claim 12, wherein the heat flow direction signal is a pulse- width modulation signal to control intensity and direction of the state of at least one of the four states.

14. The apparatus of claim 12, wherein the heat flow direction signal transmits a first state of the four states to a first of the at least one thermoelectric module and a second state of the four states to a second of the at least one thermoelectric module.

15. The apparatus of claim 11, wherein, at a given time, one of the temperature thresholds for each of the plurality of locations differs from another temperature threshold.

16. The apparatus of claim 11, wherein the apparatus performs using real-time data.

17. The apparatus of claim 11, wherein the at least one thermoelectric module is positioned to an outer portion of a thermoelectric device.

18. The apparatus of claim 11, wherein the at least one thermoelectric module is a thermoelectric cooler.

19. The apparatus of claim 1 1, wherein a first thermoelectric device, which is comprised of the at least one thermoelectric module, has at least one of a different location and a pattern than a second thermoelectric device.

20. A heat flow control apparatus, the apparatus comprising:

means for determining a temperature value for each of at least one temperature sensors,

means for determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations,

means for mapping each delta value to a thermoelectric module,

means for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and

means for transmitting the heat flow direction signal to at least one

thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.