EP3110990A2 - Électrodes permettant de réaliser des micro- et/ou nanostructures sur des matériaux - Google Patents

Électrodes permettant de réaliser des micro- et/ou nanostructures sur des matériaux

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Publication number
EP3110990A2
EP3110990A2 EP15712075.9A EP15712075A EP3110990A2 EP 3110990 A2 EP3110990 A2 EP 3110990A2 EP 15712075 A EP15712075 A EP 15712075A EP 3110990 A2 EP3110990 A2 EP 3110990A2
Authority
EP
European Patent Office
Prior art keywords
layer
substrate
conductive
electrode
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP15712075.9A
Other languages
German (de)
English (en)
Inventor
Cord Winkelmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensosurf GmbH
Original Assignee
Individual
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Filing date
Publication date
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Publication of EP3110990A2 publication Critical patent/EP3110990A2/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B23H3/04—Electrodes specially adapted therefor or their manufacture
    • B23H3/06—Electrode material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/008—Surface roughening or texturing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/10—Working turbine blades or nozzles

Definitions

  • the invention relates to electrodes suitable for the production of micro and / or
  • Nanostructures on materials are suitable.
  • Thermal ablation processes (such as laser structuring) have the disadvantage that they thermally influence the component and are therefore not suitable for hardened steels.
  • micro-milling In the lithography often used in microsystem technology with subsequent etching, there are great challenges in curved
  • electrochemical processes so-called electrochemical machining processes (ECM) or electrochemical micro-machining processes (EMM) are based on the electrochemical removal of metallic material of the surface to be structured.
  • ECM electrochemical machining processes
  • EMM electrochemical micro-machining processes
  • Electro-structuring methods are called, the material is connected as an anode and placed in an electrolyte solution.
  • the desired removal of material is achieved in that between the anode-contacted material and a separate cathode, a sufficient voltage is applied, which to
  • the electrolytic solution causes the formation of metal ions, which cause an ablation of the surface material on the workpiece via an electrochemical reaction.
  • the electro-structuring method allows the material to be processed at room temperature, thus avoiding a loss of hardness, which can occur, for example, when machining hardened steels.
  • a typical application of the electro-structuring process of materials on a large scale For example, the benchmark is the production of turbine blades. In recent years, an increasing number of attempts has been made to adapt this process for the production of microstructures. In this context, especially the
  • the surface of the material (the anode) is provided with a mask via a photo-lithographic process or via a screen-printing process.
  • the material outlet is made possible by an electrolyte flow, which flows through an electrolyte between the anode and cathode, and takes place exclusively only at the points where this mask has openings.
  • all surfaces to be structured must first be masked, which is costly and time-consuming.
  • Another significant disadvantage of this method is the increased scattering of the electric field on the workpiece. This can lead to the individual structures influencing each other and the lateral resolution being insufficiently low (compare, for example, EP 1368152 B1).
  • a modification of the electrostructuring with mask represents the maskless
  • Electro structuring with structured counter electrode The technical principle of this Elektro Modellier method is similar to that of the through-mask EMM, but here is the photoresist (photoresist) material and thus the electrical
  • Workpiece can be between 20 ⁇ to 500 ⁇ and is about a
  • Structuring especially at the edges, leads.
  • Another disadvantage of the known method is that not as many structures simultaneously introduced and different structures can be made exactly aligned with each other. Also, the structure depths are not variably adjustable.
  • the above-mentioned problems are solved by the electrodes according to the invention.
  • the electrode according to the invention makes it possible to provide a structuring of curved material surfaces in a very simple manner. Furthermore, various different structures with improved structure resolution and possibly with different structural depths can be provided by the electrodes according to the invention. In addition, an optimization of costs and process times is achieved.
  • a first aspect of the invention relates to an electrode suitable for the production of micro- and / or nanostructures on materials which comprises a substrate having at least one first conductive layer on its surface, or an electrode comprising a substrate comprising a conductive substrate layer wherein at least one first insulating layer is formed on the at least one first conductive layer or the conductive substrate layer, wherein the first insulating layer is the at least one first conductive layer or the conductive substrate layer only
  • a second aspect of the invention relates to an electrode suitable for the production of microstructures and / or nanostructures on materials, comprising a substrate which has a plurality of layers of conductor layers and insulation layers, wherein in each case one layer is formed from a conductor layer and an insulation layer.
  • the substrate has at least one first conductor layer on the surface of the substrate, and at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer is the first
  • Line layer covers only partially and at least one structuring element is formed in the first layer.
  • the electrode has at least one second conductor layer on the surface of the first insulation layer, wherein the second conductor layer partially covers the first insulation layer in such a way that the structuring element of the first layer is not covered, and the electrode has at least one second surface on the surface of the second conductor layer Insulating layer which covers the second conductive layer in sections such that the structuring element of the first layer is not covered and at least one
  • Structuring element is formed in the second layer.
  • a third aspect of the invention relates to a fluidic channel for conducting a
  • Electrolytes for an electrode suitable for the production of micro and / or
  • Nanostructures on materials having a base area that has a flow area for the electrolyte, which increases or decreases along the longitudinal extension direction of the fluidic channel.
  • a fourth aspect of the invention relates to an electrode suitable for the production of microstructures and / or nanostructures on materials, comprising a fluidic channel for conducting an electrolyte and at least one structuring element, the fluidic channel having a base area which is at least one
  • the fluidic channel has a flow area for the electrolyte, which increases or decreases along the longitudinal extension direction of the fluidic channel.
  • a fifth aspect of the invention relates to a method for producing micro- and / or nanostructures on materials, comprising the steps
  • a material is understood to mean a final or intermediate product, such as a tube, for example, wherein the material has an electrically conductive material at least in sections.
  • the material may consist essentially of an electrically conductive material.
  • a conductive layer is understood to mean an electrically conductive layer.
  • An insulating layer is understood in the context of the invention to mean an electrically insulating layer.
  • a substrate is understood to mean the support on which the further layers are applied.
  • the first aspect of the invention relates to an electrode which is suitable for the
  • Substrate layer forms, wherein
  • Conductive layer or the conductive substrate layer is formed
  • the first insulating layer only partially covers the at least one first conductive layer or the conductive substrate layer and at least one
  • the substrate has a substantially curved shape
  • the formation of a plurality of different structuring elements within this layer is possible within a layer consisting of conductor layer and insulation layer.
  • Substrate layer) by means of the insulating layer is a structuring element is formed, which has a non-insulated conductive layer as the base, which with a further electrode in a proper use a
  • Sectional covering in the sense of the invention can be understood as covering a layer arranged directly below the insulating layer, such as, for example, the first conductive layer, as well as covering further, underlying layers, such as, for example, the conductive substrate view. It is essential that partially cover by the insulation layer at a
  • an electric field only between the uncovered conductive layer (conductive layer or conductive substrate layer) of the structuring element and a further electrode can be formed.
  • the substrate is formed from an electrically conductive material ("conductive substrate”), in particular a metal or a metal alloy, thus forming a conductive substrate layer
  • Substrate layer only partially covers and forms a first patterning element, wherein the substrate has a substantially rigid, curved shape.
  • the conductive substrate layer may be regarded as a first conductor layer on which a first insulation layer is applied; the attachment of an additional conductor layer is therefore not necessary.
  • the conductive substrate is a conductive transition metal, a semi-metal or a metal alloy, in particular selected from the 4th, 6th, 8th, 11th, 13th or 14th group of the Periodic Table of the Elements.
  • the conductive substrate is selected from the group consisting of titanium (Ti), chromium (Cr), tungsten (W), iron (Fe), copper (Cu), silver (Ag), gold (Au), aluminum (Al ) or germanium (Ge) or alloys thereof. In some embodiments, the conductive substrate is selected from the group
  • the substrate has a thickness of between 0.1 and 5.0 mm, in particular between 0.2 and 2.5 mm, preferably between 0.3 and 1.0 mm.
  • the conductive substrate comprises a conductive metal alloy, in particular bronze (CuSn, copper-tin), brass (CuZn, copper-zinc), or iron-nickel (FeNi).
  • bronze bronze
  • CuZn copper-tin
  • copper-zinc brass
  • FeNi iron-nickel
  • the conductive substrate is made of an electrically conductive material, in particular a metal or a metal alloy, and on the surface of the substrate at least a first conductive layer is additionally formed. Furthermore, at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer only partially covers the first conductor layer and forms at least one first patterning element, wherein the substrate has a substantially rigid, curved shape.
  • the material of the first conductive layer is other than that of
  • the first insulation layer is located on the surface of the at least first conductor layer, wherein the substrate is covered with the conductor layer such that the structuring element has the conductor layer as the base surface.
  • the first conductor layer may be arranged in sections on the substrate, wherein the first insulation layer completely covers the first conductor layer but only partially covers the first substrate layer, so that a
  • Substrate layer has.
  • the first insulating layer partially covers the first conductive layer or the conductive substrate layer in such a way that at least one
  • Structuring element is formed.
  • the first insulation layer covers the first conductor layer or the conductive substrate layer in sections such that a plurality of, in particular different, structuring elements are formed.
  • the base of the first structuring element thus consists of the surface of the first conductive layer or of the surface of the substrate.
  • a structuring element with a conductive base which is used for Training an electric field is suitable. This ensures that a defined electric field can be formed.
  • the structuring is determined by the shape of the structuring elements.
  • Insulation layer form a layer in which at least one
  • a layer may have several, in particular different, structuring elements, wherein the arrangement of the layers is completed with an insulating layer.
  • the uppermost layer of a layer, or the last layer of the electrode is an insulating layer.
  • the structuring elements located on one layer can have the same or different shapes, which can each be controlled differently with current.
  • the arrangement of different and individually controllable structuring elements thus allows the formation of different electric fields, resulting in different strong local material outflows or material deposits on the material.
  • said additional first conductive layer (when using a conductive substrate) is a metallization coating consisting of an electrically conductive metal or alloy layer. It can, for example, serve for corrosion protection.
  • the selection of the components of the first conductive layer depends on the material of the workpiece and the electrolyte, with those skilled in the art readily selecting the appropriate components based on their expertise. Reference is made to the later explanations and definitions relating to the conductor layers.
  • the substrate is made of a non-conductive material, in particular a polymer, especially a thermoplastic polymer ("non-conductive substrate”) and at least one of these is on the substrate
  • At least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer only partially covers the first conductor layer and forms at least one first patterning element, wherein the substrate has a substantially rigid, curved shape.
  • the non-conductive substrate is a polymer.
  • the non-conductive substrate is a thermoplastic
  • the non-conductive substrate is a thermoplastic polymer (thermoplastic) selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • thermoplastic selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • PET Polyethylene terephthalate
  • PE polyethylene
  • PS polypropylene
  • PEEK polyetheretherketone
  • PVC polyvinyl chloride
  • the non-conductive substrate is a polyurethane polymer.
  • Polyblends include in particular ABS / PA, PC, acrylic / PVC ("Kydex”),
  • Acrylic ester styrene-acrylonitrile / polyvinyl chloride (ASA / PC), polypropylene / ethylene-propylene-diene rubber (PP / EPDM), polycarbonate / polybutylene terephthalate (PC / PBT), and PS / PE.
  • Thermoplastics are polymers that consist of linear or branched chain molecules. They have a low strength, are elastic and very deformable, and can form an amorphous or semi-crystalline molecular structure. Thermoplastics are plastically deformable at a certain temperature range, wherein below this temperature range these polymers can not be plastically deformed (irreversibly). This process can be repeated as often as long as there is no overheating, which leads to the thermal decomposition of the material.
  • thermoplastics relevant to this invention are selected as needed.
  • the non-conductive substrate between 1 ⁇ and 1 mm thick.
  • the non-conductive substrate between 1 ⁇ and 0.5 mm, in particular between 10 ⁇ and 100 ⁇ thick, the substrate thickness depends largely on the mechanical requirement and the material properties of the substrate. The person skilled in the art can easily select a material thickness which is appropriate to the requirements on the basis of his specialist knowledge.
  • the non-conductive substrate between 20 ⁇ and 50 ⁇ thick.
  • a (first) electrical conduction layer is applied to the non-conductive substrate, as explained above.
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 1 mm.
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 0.5 mm.
  • the conductor layers have a height in a range of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ on
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 100 ⁇ , in particular between 0.4 ⁇ and 80 ⁇ , preferably with a total thickness of between 0.2 ⁇ and 50 ⁇ .
  • the electrical conduction layer between 0.5 ⁇ and 1 ⁇ thick.
  • the structuring element can be made by partially covering said
  • Conductive layer can be formed with a first electrically non-conductive insulating layer through a mask or stencil.
  • the substrate is formed from a non-conductive material, in particular a polymer, above all a thermoplastic polymer ("plastic substrate"), and at least one first conductor layer is formed on the substrate on the surface thereof formed the surface of the first conductive layer, wherein the first
  • the first conductive layer only partially covers and at least forms a first patterning element, wherein the substrate has a substantially planar shape, which is plastically deformable.
  • the plastic substrate is formed of a polymer. In certain embodiments, the plastic substrate is a thermoplastic polymer according to the aspects mentioned above.
  • the electrode Due to the plastic deformability of the substrate, the electrode can be adapted to the shape of the materials or workpieces to be treated (irreversible). The irreversible deformability of the substrate leads to the formation of a substantially rigid electrode.
  • the substrate is non-conductive and formed of an elastic polymer ("elastic substrate"), and at least a first conductive layer is formed on the surface of the substrate Further, at least a first insulating layer is formed on the surface of the first conductive layer The first insulating layer covers the first line layer only in sections, and at least one first structuring element is formed, wherein the substrate has a substantially planar shape, which is elastically (reversibly) deformable.This is a "flexible” electrode. Due to the elastic deformability of the substrate, the electrode can be reversibly adapted to the shape of the materials to be treated.
  • the elastic substrate is an elastic polymer
  • the elastic substrate is a thermoplastic elastomer.
  • the elastic substrate is an elastomer selected from natural rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, chloroprene rubber, butadiene rubber, and ethylene-propylene-diene rubber.
  • the elastic substrate is an olefin-based thermoplastic elastomer (TPE) (TPE-O), an olefin-based crosslinked thermoplastic elastomer (TPE-V), a thermoplastic polyester elastomer (TPE-E), a thermoplastic copolyester (TPC), styrene block copolymers (TPE-S), a thermoplastic copolyamide (TPE-a) or an elastomeric alloy ( "polyblend”).
  • TPE thermoplastic elastomer
  • TPE-O thermoplastic elastomer
  • TPE-V thermoplastic polyester elastomer
  • TPC thermoplastic copolyester
  • TPE-S thermoplastic copolyester
  • TPE-a thermoplastic copolyamide
  • polyblend elastomeric alloy
  • TPE-0 and TPE-V include, for example PP / EPDM
  • TPE-e and TPC include Hytrel ® and Riteflex ®
  • TPE-S for example, styrene-butadiene-styrene or methyl acrylate-butadiene-styrene, including styrene, Styroflex ®, Septon ® and thermal load ®
  • TPE-a comprises, for example PEBAX ®, a polyether block amide.
  • the elastic substrate is a thermoplastic elastomer on urethane (TPE-U), comprising Desmopan ®, Texin ® and Utechllan ® as well as a polyester-urethane rubber compound comprising Baytec ®, Cellasto ®, Vulkollan ®, Elasturan ®, Sylomer ® , Sylodyn ® , and Urepan ® .
  • TPE-U thermoplastic elastomer on urethane
  • Elastomers are dimensionally stable, but elastically deformable plastics whose glass transition point below the
  • the plastics can deform elastically under tensile and compressive loading, but then return to their original shape.
  • Thermoplastic elastomers are polymers that behave like classic elastomers at room temperature, but are plastically deformable when heat is applied. Most thermoplastic elastomers include copolymers consisting of a soft elastomeric and a hard thermoplastic component.
  • the elastic substrate is a polymer, in particular a polymethylmethacrylate, novolak, and polymethylglutarimide, or an epoxy resin.
  • the non-conductive substrate is an epoxy based polymer, particularly SU-8.
  • the non-conductive substrate is a photoresist ("photoresist substrate") or a photoresist
  • the photoresist substrate is selected from SU-8 or the Conformask series, particularly the Conformask 2500 or 3300 series.
  • Photoresists are used in the photolithographic structuring of material surfaces for the production of structures in the micrometre and submicrometer ranges, as well as in the
  • Starting materials are polymers such as
  • Photoresist SU-8 Polymethylmethacrylate, novolac, and polymethylglutarimide, or epoxy resins such as photoresist SU-8.
  • the photoresist of the resist can be selectively processed via exposure through an exposure mask or photo stencil. A photochemical reaction causes the solubility of the photoresist to be locally altered. Photoresists are divided into negative and positive varnish. Exposure of the
  • Negative varnish leads to its polymerization, which reduces the solubility of the paint.
  • the already solidified paint becomes soluble again by exposure.
  • Positive lacquers are easier to remove from the surface of the material compared to negative lacquers by solvents, which enables the reusability of the material.
  • Positive coatings are usually not permanently resistant to solvents. If the production of permanent structures on material surfaces is desired, as is the case, for example, in the micromachine and submicron range in microsystem technology, it is preferred to use negative coatings such as SU-8.
  • SU-8 has high durability and can be easily, quickly and inexpensively processed. The choice of photoresist is thus dependent on the use and the objective. The person skilled in the art should readily be able to select the appropriate photoresist based on his specialist knowledge.
  • the electrical conduction layer comprises at least one conductive metal layer or a metal alloy.
  • the line layer has a total thickness of between 0.1 ⁇ and 1000 ⁇ .
  • the conductor layer has a total thickness of between 0.1 ⁇ m and 100 ⁇ m, in particular of between 0.4 ⁇ m and 80 ⁇ m, preferably between 0.2 ⁇ m and 50 ⁇ m.
  • Insulation layer existing position the formation of a structuring element or more, in particular different structuring elements possible.
  • the non-conductive substrate is elastically (reversibly) deformable. Due to the elasticity of the substrate, the electrode according to the invention can be adapted to curved material surfaces. Curved material surfaces have a radius of between 1 mm and 10 m, in particular 10 mm and 1 m, preferably between 10 mm and 0.5 m. Due to the flexible (elastic) behavior of the electrode, the electrode can be adapted to the workpiece to be machined (curved) by means of a suitable holder. The holder is designed so that the electrical
  • the bracket can by means of clamping, screws, through
  • an elastic substrate is advantageously suitable for the attachment of structures on curved materials, since the electrode can be particularly easily adapted to the shape of the materials.
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ .
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 1 ⁇ to 100 ⁇ .
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 10 ⁇ to 100 ⁇ , in particular from 15 ⁇ to 80 ⁇ , preferably from 20 ⁇ to 50 ⁇ .
  • the elastic substrate comprises an elastic polymer, wherein the elastic polymer at room temperature (20 ° C) a modulus of elasticity in a range of between 0.3 and 5 kN / mm 2 , in particular in a range of between 1 and 5 kN / mm 2 , having.
  • the elastic substrate comprises an elastic polymer, wherein the elastic polymer has a modulus of elasticity in a range of between 1.5 and 3 kN / mm 2 at room temperature (20 ° C).
  • the amount of modulus of elasticity is greater, the more resistance a material opposes its elastic deformation.
  • the resistance that a material has against elastic deformation by an applied force or torque is referred to as stiffness.
  • the modulus of elasticity of a particular material depends on various environmental conditions, such as temperature, humidity, or strain rate.
  • One High modulus material such as steel, has a higher stiffness than a material of identical geometric dimensions, which has a low modulus of elasticity, such as rubber.
  • the stiffness of a material therefore depends on the material used and the processing, but also on its geometry, such as the width and the height, wherein the height is equivalent to the thickness of a material.
  • the modulus (E) value of a material is the ratio between stress ( ⁇ ) and strain ( ⁇ ), where stress is the ratio between force and cross-sectional area (see formula 1) and strain is the ratio between change in length (I). l 0 ) and material length (l 0 ) (see formula 2).
  • the modulus of elasticity of a certain material can be determined in the bending test (according to DIN EN ISO 178) and in the tensile test (according to DIN EN ISO 527). Because the
  • Deformability of polymers depends strongly on the duration of use and the temperature, the deformation and strength values must always be stated in conjunction with the stated values of the test temperature and the deformation rate.
  • the tensile stiffness of a material (D) (see formula 3) has the unit Newton (N) and is the product of its Young's modulus (E) in the loading direction and its cross-sectional area (A) perpendicular to the load direction.
  • the tensile stiffness is independent of the shape of the cross section.
  • the transverse contraction indicates the deformation of a solid material at approximately constant volumes and describes the behavior of the solid material under the influence of a tensile or compressive force. In the direction of force, the solid material reacts with a change in length ⁇ , perpendicular to it with a reduction or increase in its diameter d or his thickness around ad.
  • the measurement of the transverse contraction number can be mechanical in the
  • the transverse contraction applies only to linear elastic deformations (elasticity), that is, when the elastic deformation of a solid material is proportional to the applied load, which is described by Hooke's Law. This is for example the case with small loads of metals and hard, brittle materials such. As silicon, where increasing mechanical stress often lead to breakage. The mechanical stress in these materials causes a deviation of the molecular or
  • Atomic arrangement which is reversible up to a certain material tension, but destroy the molecular or atomic arrangement at higher loading effect.
  • the relationship between the strain in the solid material and the resulting stress in the material is described by the Elastic Law, assuming a homogeneous solid material.
  • the flexural rigidity (B) (see formula 4) is the product of the elastic modulus of a solid and the moment of area moment (I) of the cross section (A), which is -m
  • tensile stiffness essentially depends on the shape of the cross section.
  • the bending stiffness is given in Newtons times square millimeters (N * mm 2 ) and describes the flexibility according to the invention.
  • N * mm 2 the flexibility according to the invention.
  • the area moment of inertia (I) is a geometric quantity derived from the cross-section (A) of a body, which is used for its deformation and stress calculation under flexural and torsional loading.
  • the cross-sectional area of a square body is determined by its width (b) and height (h), both sizes being identical in the case of a square and being referred to as the side length (a).
  • the side length (a) can also be described by the square diameter (see formula 5).
  • the cross-sectional area (A) is described by the width (b) times the height (h) of the body (see formula 6).
  • the cross-sectional dependence in the bending of a body under load is described in summary with the axial area moment of inertia (I a ). It is true that the bending and the internal stresses arising in the cross section in a body are the smaller, the larger the axial area moment of inertia (I a ).
  • the essential measure in cross section is the expansion in the direction of the attacking force. For example, a rectangular shaped body (of a particular differing height and width) is less bent by a vertical load (a force normal to its surface) when the body is upright rather than flat.
  • the axial area moment of inertia (I a ) is the sum of the axial
  • Second-order moments of inertia (I y and I z ), which can be described by formula 7 and formula 8 and have the unit m 4 .
  • the stiffness of a material depends on its geometry.
  • the width of the non-conductive substrate material is dependent on the electrode itself in the electrode according to the invention and is therefore considered as a variable size.
  • the width of the non-conductive, elastic substrate is therefore limited by the technical production possibility of the electrode and can theoretically few
  • the area moment of inertia (I) of the rectangular-shaped, non-conductive elastic substrate material is calculated at a thickness of at least 1 ⁇ and a maximum of 5 mm and a variable width according to formula 11 and formula 12:
  • E modulus Young's modulus (E modulus; E) of 1 kN / mm 2 and a maximum modulus of elasticity of 5 kN / mm 2 (see Formula 13 and Formula 14):
  • the elastic substrate is Conformask, in particular
  • the electrode according to the invention has two layers
  • the first conductor layer and the first insulation layer form a first layer, wherein at least one structuring element is formed within the first layer.
  • a second conductor layer and a second insulation layer are arranged on the electrode, which form a second layer.
  • the second conductor layer is formed on the surface of the first insulation layer, wherein the second conductor layer, the first
  • Insulating layer so partially covering that at least one
  • Structuring element of the first layer is not covered. Furthermore, the
  • the electrode according to the invention has a plurality of layers of conductor layers and insulation layers, the further conductor layers and insulation layers being formed such that the structuring elements of the underlying layers are not covered and at least one structuring element is formed in the respective layer, the arrangement of the layers is completed with an insulation layer.
  • the preceding structuring elements are thus not covered by further conduction and insulation layer, so that in the case of multiple layers, all located on the previous, lower layers
  • the structuring elements located on different layers thus have different distances the material, which leads to a formation of different structural depths on the workpiece.
  • the structuring elements, which are located on the uppermost layer of the electrode form the deepest structures, since here the electric field has an increased effect and the electric field scattering is lower.
  • the conductive layer (s) consist of an electrically conductive metal layer or a metal alloy layer.
  • the conductive layer (s) are made of a metal selected from the group of gold, silver, copper, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, zinc, aluminum, or alloys thereof. In some embodiments, the conductive layers are made respectively
  • the conductor layers each consist of the same materials.
  • the conductive layer (s) are made of a metal selected from the group consisting of gold (Au), silver (Ag), and platinum (Pt) or alloys thereof.
  • the conductive layer (s) are made of gold (Au).
  • the conductor layers have a height (total thickness) in a range of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ on.
  • the conductor layer (s) (each) have a total thickness of between 100 nm and 100 ⁇ (0.1 ⁇ and 100 ⁇ ), in particular of between 0.4 ⁇ and 80 ⁇ , preferably between 0.2 ⁇ and 50 ⁇ on.
  • the second conductive layer is formed on the surface of the first insulating layer so that the structuring element of the first layer (consisting of first conductive layer and partially covering the first
  • Insulation layer is not completely covered. Furthermore, the second one
  • Insulating layer formed in sections on the surface of the second conductive layer, that at least one structuring element within the second layer (consisting of second conductive layer with partially covering second
  • Insulation layer is formed.
  • the structuring elements may differ in their structure, widths and thicknesses.
  • the structuring elements have geometrically shaped structures, such as circular, elliptical, square, rectangular, and triangular to octagonal structures.
  • the electrode has at least one electrical contacts.
  • the electrical contact (s) allows (enable) a control of the
  • the electrical contact can be formed such that individual structuring elements within a layer separated from each other with current can be controlled, resulting in the formation of different electric fields.
  • the strength of the electric field influences, as already described, the local material outlet.
  • the electrical contacting in the electrode according to the invention in a use according to the invention, allows for the individual
  • the electrical contacts are formed so that they are only in contact with the corresponding line layers, which makes it possible to generate different current flows independently in the individual line layers.
  • This can also be done by suitable insulation.
  • the insulation layers can be applied in such a way that you not only separate the conductor layers from one another, but also insulate the respective electrical contacts with respect to the other conductor layers.
  • This embodiment makes it possible to vary the depths of the individual structuring elements by the targeted and variable power supply, whereby the resulting electric field can be variably adjusted. It also offers the possibility of controlling structuring elements within a layer both individually and jointly and in combinations (individual structuring elements and all structuring elements in one layer) to drive variable and thus complex structures
  • the electrode according to the invention is produced by the methods of microsystem technology, the positioning of the different layers (conducting and insulating layers) relative to each other depends only on the accuracy of the production method and is usually one to two orders of magnitude below the achievable with the micro-electrostructuring resolutions , In some embodiments, a third conductive layer on the second
  • Insulating layer laid so that the second and structuring element remain free. Furthermore, a third insulation layer is applied to the third conductor layer such that the second and the structuring element remain free and at least one third structuring element is formed.
  • This alternating arrangement of conductive and insulating layers can be repeated as often as desired, so that any number of structuring elements is possible, resulting in a multilayer electrode. This arrangement is possible both for multilayer rigid, planar electrodes and multilayer, flexible electrodes.
  • the electrode according to the invention comprises further layers of conductor layers and insulation layers, wherein the further conductor layers and insulation layers are formed such that the structuring elements of the underlying layers are not covered and in the respective layer at least one structuring element is formed, wherein the arrangement of the layers is completed with an insulation layer.
  • the further conductor layers are formed in sections on the insulation layers such that the underlying structuring elements are not covered.
  • the insulation layers are formed in sections on the line layers such that the underlying structuring elements are not covered, and at least one other
  • Structuring element is formed in the respective layer.
  • the depth of the structuring elements can be made variable.
  • Conduction layers can, as described, be controlled separately from one another, which leads to the formation of different electric fields, and therefore to different degrees of local material outlets.
  • This "multi-layering" of the electrode allows precise machining of materials, allowing different depths to be realized on the material in an improved and simpler manner than heretofore possible: multilayer planar as well as multilayer flexible electrodes
  • Electrode is greatly facilitated the machining of molded materials, such as cylindrically shaped materials.
  • the minimum structure resolution is in the range of the layer thickness of the photoresist
  • the lateral structure sizes are limited downwards by the possibility of lithography, while upwards there are no limits.
  • the feature sizes are based on the resolution of the Elektromilaier- process, which in turn the distance between the electrode and the
  • the further conductive layers consist of a conductive metal layer or a conductive metal alloy layer.
  • the conductive layer (s) are made of a metal selected from the group of gold, silver, copper, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, zinc, aluminum, or alloys thereof.
  • the further conductive layers consist of gold (Au).
  • the conductive layers are made respectively
  • individual conductor layers each consist of the same materials. In some embodiments, the conductor layers each consist of the same materials.
  • the further conductive layers have a total thickness between 0.1 ⁇ m and 1000 ⁇ m, in particular 100 nm to 500 ⁇ m, preferably from 100 nm to 100 ⁇ m.
  • the further conductive layers have a total thickness of between 100 nm and 100 ⁇ m (0.1 ⁇ m and 100 ⁇ m), in particular between 0.4 ⁇ m and 80 ⁇ m, preferably between 0.2 ⁇ m and 50 ⁇ m.
  • the further conductive layers have a total thickness of between 0.2 ⁇ and 10 ⁇ on.
  • Insulation layer existing layer the formation of several different substances
  • the at least first conductive layer is formed of an electrically conductive material, which together with the material and the
  • Electrolytic solution forms a galvanic cell.
  • a galvanic cell is a device for spontaneous conversion of chemical into electrical energy, consisting of a combination of two different electrodes with an electrolyte, wherein the electrodes of two metals with different Oxidationsbestreben (redox potential) are constructed. If the two metals are added to an electrolyte solution, an electrical voltage or a so-called potential difference is formed between them due to a redox reaction. The voltage of a galvanic cell is greater, the more the two metals in their
  • Metals with greater tendency to oxidize emit electrons and pass as ions into the electrolyte solution. They form the negative terminal (anode) of the galvanic cell. Metals with lower Oxidation efforts (noble metals) form the positive pole (cathode). At the cathode, electrons are released to the positively charged metal ions of the electrolyte solution. The metal ions are thereby discharged, resulting in charge balance in the solution, and the metal atoms settle on the positive pole.
  • Embodiments consist of individual conductor layers of the same materials in each case.
  • the conductor layers each consist of the same materials. Conductive layers of the same materials are preferred.
  • the selection of the conductor layers depends on the material of the workpiece and the electrolyte. A person skilled in the art can readily rely on his expertise,
  • the electrode according to the invention can also be used for electroplating
  • Electroforming of material materials are used, provided that during the process, the necessary ions are not obtained from the material of the electrode but from the electrolyte and the electrical connections are reversed, wherein the workpiece is cathode-poled and the electrode as an anode
  • the workpiece is cathode-poled and the electrode as an anode
  • Electroplating is a patterning form of the ionized state wherein a metal is electrolytically deposited from an aqueous salt bath on the electrically conductive and cathode-poled workpiece.
  • This form of structuring is used mainly for producing metallic coatings or for producing self-supporting metallic workpieces.
  • the conductive layer (s) comprise a material having a resistivity at 20 ° C between 0.01 Q * mm 2 / m and 1 Q * mm 2 / m.
  • the resistivity rho (p) of the conductor should correlate with the area of the conductor layer so that the conductor layer can withstand the currents and a constant field is formed without overheating the conductor.
  • the surface resistivity (R spe z.) Of a conductor with the unit Ohm ( ⁇ ) describes the electrical resistance of a resistive layer, when it is traversed parallel to the layer of current. This happens when the electricity is on a narrow Side surface on and exits on the opposite narrow side surface again.
  • the sheet resistivity (R spe z.) Of a homogeneous conductor is dependent on the thickness of the resistive layer (d) of the conductor and its resistivity (p) (see formula 16).
  • the specific resistance (p) with the SI unit ⁇ * ⁇ (or ⁇ mm 2 / m) is a temperature-dependent material constant and is mainly used to calculate the electrical resistance of a homogeneous electrical conductor.
  • the reciprocal of the resistivity is the electrical conductivity (electrical conductance) kappa ( ⁇ ) (see formula 17) and has the unit Siemensmeters per square millimeter (S * m / mm 2 ). Both values are temperature-dependent material constants and are usually given for 20 ° C (293.15 Kelvin, room temperature) or 25 ° C.
  • the electrical resistance (Reie k tr.) Of a conductor is dependent on the cross-sectional area of the conductor and is inversely proportional to its electrical conductivity.
  • As a cross section (A) is a two-dimensional layer as a sectional view of a
  • the electrical resistance of a conductor is thus determined by the cross-sectional area (A) of a conductor, calculated from its diameter (d), the length of the conductor (I), the
  • the conductive layers of the invention are conductive layers of the invention.
  • Electrode adhesion layer on your top and / or bottom.
  • the adhesion promoting layer is formed of a hydrophobic material.
  • the primer layer is a metal that forms a closed oxide layer on its surface under atmospheric oxygen, thereby forming a metal oxide compound.
  • the adhesion promoting layer is a metal or a metal alloy selected from the group of copper (Cu), chromium (Cr), or tantalum (Ta).
  • the adhesion-promoting layer is helpful so that the newly added conductor layers rest precisely and permanently on the corresponding layers and the individual layers remain in their position even when used in accordance with the invention.
  • the adhesion-promoting layer should furthermore have a very good adhesion to both the conductor layer and the insulation layer.
  • the water-repellent property of the adhesion mediation is helpful to ensure a firm adhesive retention of the insulation layers.
  • the primer layer has a height in the range of 10 nm and 20 nm, in particular 15 nm.
  • the insulating layer is formed of an electrically non-conductive material, which is electrically insulating, and has a small
  • the insulating layer is an epoxy resin-based polymer.
  • the insulating layer is an electrically insulating metal oxide comprising alumina (Al 2 O 3 ), zinc oxide (ZnO), silicon dioxide (SiO 2 ), and
  • BeO Beryllium oxide
  • Beryllerde mixed metal oxides
  • the insulating layer is a metal that by means of oxidation, for example, under atmospheric oxygen or by a targeted chemical
  • Oxidation reaction forms an insulating metal oxide compound.
  • the conductive layer also includes the insulating layer, wherein the conductive layer is formed of a metal or a metal alloy, and the insulating layer is formed directly on the surface of the conductive layer or the conductive substrate by oxidation, e.g. B. under atmospheric oxygen, or by a targeted chemical oxidation reaction, as a metal oxide layer is formed in sections.
  • the insulating layer is a photoresist polymer (photoresist).
  • the insulating layer is a solder mask, such as the Conformask series or a photoresist, such as SU-8.
  • the insulating layer is a polyblend. In certain embodiments, the layer thickness of the insulating layer between 50 nm and 10 ⁇ (0.05 ⁇ and 10 ⁇ ), in particular between 0.5 ⁇ and 5 ⁇ thick.
  • insulating layer is constructed of different materials.
  • an insulating layer of one layer may consist of a particular polymer (e.g., conformant) and another polymer (e.g., SU-8).
  • the insulating layer of a layer thus effectively consists of two "layers" of polymers.
  • multiple layers are conceivable or a combination of an insulating polymer and an insulating oxide layer. This applies to all aspects of the invention.
  • the insulating layer must have a chemically high resistance in order to ensure that its properties do not change in further processing steps or even that the layer decomposes.
  • a thin layer of the insulating layer is preferably deposited and patterned.
  • the layer should be as thin as possible, so that a slight disturbance of the electrolyte flow takes place and the reaction products can be effectively removed.
  • SU-8 is characterized by its high durability as well as its simple, quick and inexpensive processing and is therefore preferred.
  • the electrode according to the invention has a fluidic channel, which is designed to conduct an electrolyte, wherein the fluidic channel a
  • Base surface which comprises at least the structuring elements of the electrode, wherein the fluidic channel has a flow area extending along the
  • Lengthwise direction of the fluidic channel enlarged or reduced.
  • the wall of the fluidic channel consists of a chemically and mechanically resistant and electrically non-conductive material.
  • the wall of the fluidic channel consists of a
  • the wall of the fluidic channel consists of a photoresist or a solder mask, in particular from the Conformask series or SU-8.
  • the wall of the fluidic channel has a height of 1 ⁇ to 1 mm, in particular 20 ⁇ .
  • the width of the fluidic channel is determined by the desired structure and at least as wide as the resulting structure on the workpiece surface.
  • the fluidic channel is integrated on the electrode and thus an integral part of it. It can be given as the last layer on the at least one metallization and insulation layers of the electrode and should not cover all existing structuring elements.
  • the thickness of the fluidic channel depends on the requirement profile and can be easily determined by the person skilled in the art. About the height of the fluidic channel of the working distance between the electrode and the workpiece can be adjusted. The higher the channel, the greater the distance to the structuring elements. Through this
  • the width of the fluidic channel varies.
  • the fluidic channel thus has a varying along the flow direction of the electrolyte
  • Electrolyte speed can be influenced.
  • Electrolyte speed it is possible to influence the metal ion concentration between the electrode and the workpiece, which in turn changes the local material removal on the workpiece.
  • the abraded material is transported away continuously through the fluidic channel flow.
  • the electrode according to the invention a substrate having a plurality of layers of wiring layers and insulating layers, wherein the substrate has at least a first conductive layer on its surface, and
  • At least one first insulation layer on the first conductor layer wherein the first insulation layer only partially covers the first conductor layer and forms a first structuring element.
  • a second aspect of the invention relates to an electrode suitable for the production of microstructures and / or nanostructures on materials, comprising a substrate which has a plurality of layers of conductor layers and insulation layers, wherein in each case one layer is formed from a conductor layer and an insulation layer.
  • the substrate has at least one first conductor layer on the surface of the substrate, and at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer covers the first conductor layer only in sections and at least one structuring element is formed in the first position.
  • the electrode has at least one second conductor layer on the surface of the first insulation layer, wherein the second conductor layer partially covers the first insulation layer in such a way that the structuring element of the first layer is not covered, and the electrode has at least one second surface on the surface of the second conductor layer Insulating layer which covers the second conductive layer in sections so that the Structuring element of the first layer is not covered and at least one
  • Structuring element is formed in the second layer.
  • the structuring elements located on different layers thus have different distances from the material, which leads to the formation of different structure depths on the workpiece.
  • the structuring elements, which are located on the uppermost layer of the electrode form the deepest structures, since here the electric field has an increased effect and the electric field scattering is lower.
  • the substrate has a substantially curved shape. In some embodiments, the substrate is plastically deformable
  • the substrate is elastically deformable.
  • Substrate layer) by means of the insulating layer is a structuring element is formed, which has a non-insulated conductive layer as the base, which with a further electrode in a proper use a
  • Sectional covering in the sense of the invention can be understood as covering a layer arranged directly below the insulating layer, such as, for example, the first conductive layer, as well as covering further, underlying layers, such as, for example, the conductive substrate view. It is essential that partially cover by the insulation layer at a
  • an electric field can be formed only between the uncovered conductive layer (wiring layer) of the structuring element and another electrode.
  • the substrate is formed from an electrically conductive material ("conductive substrate”), in particular a metal or a metal alloy, thus forming a conductive substrate layer
  • the conductive substrate layer formed, wherein the first insulating layer, the conductive Substrate layer only partially covers and forms a first structuring element in the first layer.
  • the conductive substrate layer may be regarded as a first conductor layer on which a first insulation layer is applied; the attachment of an additional conductor layer is therefore not necessary.
  • the conductive substrate is a conductive transition metal, a semi-metal or a metal alloy, in particular selected from the 4th, 6th, 8th, 11th, 13th or 14th group of the Periodic Table of the Elements.
  • the conductive substrate is selected from the group consisting of titanium (Ti), chromium (Cr), tungsten (W), iron (Fe), copper (Cu), silver (Ag), gold (Au), aluminum (Al ) or germanium (Ge) or alloys thereof.
  • the conductive substrate is selected from the group consisting of aluminum or copper or alloys thereof.
  • the substrate has a thickness of between 0.1 and 5.0 mm, in particular between 0.2 and 2.5 mm, preferably between 0.3 and 1.0 mm.
  • the conductive substrate comprises a conductive metal alloy, in particular bronze (CuSn, copper-tin), brass (CuZn, copper-zinc), or iron-nickel (FeNi).
  • bronze bronze
  • CuZn copper-tin
  • copper-zinc brass
  • FeNi iron-nickel
  • the conductive substrate is formed from an electrically conductive material, in particular a metal or a metal alloy, and at least one first conductor layer is additionally formed on the substrate. Furthermore, at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer only the first conductor layer
  • the material of the first conductive layer is other than that of the substrate layer.
  • the first insulation layer is located on the
  • the first conductor layer may be arranged in sections on the substrate, wherein the first insulation layer completely covers the first conductor layer but only partially covers the substrate layer, so that a structuring element is formed, which serves as the base surface
  • Substrate layer has.
  • an insulation layer covers a conductor layer in sections such that at least one structuring element is formed.
  • the insulating layer covers a line layer in sections so that several, in particular different, structuring elements are formed.
  • the base of the structuring elements thus consists of the surface of the conductive layer.
  • Structuring element with a conductive base which is suitable for the formation of an electric field. This ensures that a defined electric field can be formed.
  • the structuring is determined by the shape of the structuring elements.
  • Insulating layer form layers in which at least one structuring element is arranged.
  • a layer can have several, in particular different,
  • Insulation layer is completed.
  • the uppermost layer of a layer, or the last layer of the electrode is an insulating layer.
  • the structuring elements located on one layer can have the same or different shapes, which can each be controlled differently with current.
  • the arrangement of different and individually controllable structuring elements thus allows the formation of different electric fields, resulting in different strong local material outflows or material deposits on the material.
  • said additional first conductive layer is a
  • Metallization coating consisting of an electrically conductive metal or alloy layer.
  • the substrate is formed of a non-conductive material, in particular a polymer, especially a thermoplastic polymer ("non-conductive substrate").
  • the non-conductive substrate is a polymer.
  • the non-conductive substrate is a thermoplastic
  • the non-conductive substrate is a thermoplastic polymer (thermoplastic) selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • thermoplastic selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • PET Polyethylene terephthalate
  • PE polyethylene
  • PS polypropylene
  • PEEK polyetheretherketone
  • PVC polyvinyl chloride
  • the non-conductive substrate is a polyurethane polymer.
  • Polyblends include in particular ABS / PA, PC, acrylic / PVC ("Kydex”),
  • Acrylic ester styrene-acrylonitrile / polyvinyl chloride (ASA / PC), polypropylene / ethylene-propylene-diene rubber (PP / EPDM), polycarbonate / polybutylene terephthalate (PC / PBT), and PS / PE.
  • Thermoplastics are polymers that consist of linear or branched chain molecules. They have a low strength, are elastic and very deformable, and can form an amorphous or semi-crystalline molecular structure. Thermoplastics are plastically deformable at a certain temperature range, wherein below this temperature range these polymers can not be plastically deformed (irreversibly). This process can be repeated as often as long as there is no overheating, which leads to the thermal decomposition of the material.
  • thermoplastics relevant to this invention are selected as needed.
  • the non-conductive substrate between 1 ⁇ and 0.5 mm, in particular between 10 ⁇ and 100 ⁇ thick, the substrate thickness depends largely on the mechanical requirement and the material properties of the substrate. The person skilled in the art can easily select a material thickness which is appropriate to the requirements on the basis of his specialist knowledge.
  • the non-conductive substrate between 20 ⁇ and 50 ⁇ thick.
  • an electrically conductive layer is further applied to the non-conductive substrate.
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ .
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 0.5 mm. In certain embodiments, this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 100 ⁇ , in particular between 0.4 ⁇ and 80 ⁇ , preferably with a total thickness of between 0.2 ⁇ and 50 ⁇ .
  • the electrical conduction layer between 0.5 ⁇ and 1 ⁇ thick.
  • the structuring element can be made by partially covering said
  • Conductive layer can be formed with an electrically non-conductive insulating layer through a mask or stencil.
  • the substrate is formed of a non-conductive material, in particular a polymer, especially a thermoplastic polymer ("plastic substrate").
  • the plastic substrate is formed of a polymer. In certain embodiments, the plastic substrate is a thermoplastic polymer according to the aspects mentioned above.
  • the electrode Due to the plastic deformability of the substrate, the electrode can be adapted to the shape of the materials or workpieces to be treated (irreversible). The irreversible deformability of the substrate leads to the formation of a substantially rigid electrode.
  • the substrate is non-conductive and formed of an elastic polymer ("elastic substrate"), the substrate having a substantially planar shape that is elastically (reversibly) deformable, and is a "flexible” electrode. Due to the elastic deformability of the substrate, the elastic substrate is a substantially planar shape that is elastically (reversibly) deformable, and is a “flexible” electrode. Due to the elastic deformability of the substrate, the elastic substrate is reversibly deformable. Due to the elastic deformability of the substrate, the
  • Electrode be reversibly adapted to the shape of the materials to be treated.
  • the elastic substrate is an elastic polymer
  • the elastic substrate is a thermoplastic elastomer.
  • the elastic substrate is an elastomer selected from natural rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, chloroprene rubber, butadiene rubber, and ethylene-propylene-diene rubber.
  • the elastic substrate is an olefin-based thermoplastic elastomer (TPE) (TPE-O), an olefin-based crosslinked thermoplastic elastomer (TPE-V), a thermoplastic polyester elastomer (TPE-E), a thermoplastic copolyester (TPC), styrene block copolymers (TPE-S), a thermoplastic copolyamide (TPE-a) or an elastomeric alloy ( "polyblend”).
  • TPE thermoplastic elastomer
  • TPE-O thermoplastic elastomer
  • TPE-V thermoplastic polyester elastomer
  • TPC thermoplastic copolyester
  • TPE-S thermoplastic copolyester
  • TPE-a thermoplastic copolyamide
  • polyblend elastomeric alloy
  • TPE-0 and TPE-V include, for example PP / EPDM
  • TPE-e and TPC include Hytrel ® and Riteflex ®
  • TPE-S include for example, styrene-butadiene-styrene or methyl acrylate-butadiene-styrene, including styrene, Styroflex ®, Septon ® and thermal load ®
  • TPE-A comprises, for example PEBAX ®, a polyether block amide.
  • the elastic substrate is a thermoplastic elastomer on urethane (TPE-U), comprising Desmopan ®, Texin ® and Utechllan ® as well as a polyester-urethane rubber compound comprising Baytec ®, Cellasto ®, Vulkollan ®, Elasturan ®, Sylomer ® , Sylodyn ® , and Urepan ® .
  • TPE-U thermoplastic elastomer on urethane
  • Elastomers are dimensionally stable, but elastically deformable plastics whose glass transition point is below the operating temperature. The plastics can deform elastically under tensile and compressive loading, but then return to their original shape.
  • Thermoplastic elastomers are polymers that behave like classic elastomers at room temperature, but are plastically deformable when heat is applied. Most thermoplastic elastomers include copolymers consisting of a soft elastomeric and a hard thermoplastic component.
  • the elastic substrate is a polymer, in particular a polymethylmethacrylate, novolak, and polymethylglutarimide, or an epoxy resin.
  • the non-conductive substrate is an epoxy based polymer, particularly SU-8.
  • the non-conductive substrate is a photoresist ("photoresist substrate") or a photoresist
  • Solder mask (solder mask).
  • the photoresist substrate is selected from SU-8 or the Conformask series, particularly the Conformask 2500 or 3300 series.
  • Photoresists are used in the photolithographic structuring of material surfaces for the production of structures in the micrometre and submicrometer ranges, as well as in the
  • Starting materials are polymers such as
  • Photoresist SU-8 Polymethylmethacrylate, novolac, and polymethylglutarimide, or epoxy resins such as photoresist SU-8.
  • the photoresist of the resist can be selectively processed via exposure through an exposure mask or photo stencil. A photochemical reaction causes the solubility of the photoresist to be locally altered. Photoresists are divided into negative and positive varnish. Exposure of the
  • Negative varnish leads to its polymerization, which reduces the solubility of the paint.
  • the already solidified paint becomes soluble again by exposure.
  • Positive lacquers are easier to remove from the surface of the material compared to negative lacquers by solvents, which enables the reusability of the material.
  • Positive coatings are usually not permanently resistant to solvents. Is the production of permanent structures on material surfaces desirable, like this For example, in the micro and Submikrometer Symposium in microsystems technology is the case, preferably negative-tone coatings such as SU-8 are used. SU-8 has high durability and can be easily, quickly and inexpensively processed. The choice of photoresist is thus dependent on the use and the objective. The person skilled in the art should readily be able to select the appropriate photoresist based on his specialist knowledge.
  • the electrical conduction layer comprises at least one conductive metal layer or a metal alloy.
  • the line layer has a total thickness of between 0.1 ⁇ and 1000 ⁇ , in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ on.
  • the conductor layer has a total thickness of between 0.1 ⁇ m and 100 ⁇ m, in particular of between 0.4 ⁇ m and 80 ⁇ m, preferably between 0.2 ⁇ m and 50 ⁇ m.
  • Insulation layer existing position the formation of a structuring element or more, in particular different structuring elements possible.
  • the non-conductive substrate is elastically (reversibly) deformable. Due to the elasticity of the substrate, the electrode according to the invention can be adapted to curved material surfaces. Curved material surfaces have a radius of between 1 mm and 10 m, in particular 10 mm and 1 m, preferably between 10 mm and 0.5 m.
  • the electrode can be adapted to the workpiece to be machined (curved) by means of a suitable holder.
  • the holder is designed so that the electrical
  • the bracket can by means of clamping, screws, through
  • an elastic substrate is advantageously suitable for the attachment of structures on curved materials, since the electrode can be particularly easily adapted to the shape of the materials.
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ . In some embodiments, the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 1 ⁇ to 100 ⁇ .
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 10 ⁇ to 100 ⁇ , in particular from 15 ⁇ to 80 ⁇ , preferably from 20 ⁇ to 50 ⁇ .
  • the elastic substrate comprises an elastic polymer, wherein the elastic polymer at room temperature (20 ° C) a modulus of elasticity in a range of between 0.3 and 5 kN / mm 2 , in particular in a range of between 1 and 5 kN / mm 2 , having.
  • the elastic substrate is Conformask, in particular
  • the conductive layer (s) consist of an electrically conductive metal layer or a metal alloy layer.
  • the conductive layer (s) are made of a metal selected from the group of gold, silver, copper, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, zinc, aluminum, or alloys thereof. In some embodiments, the conductive layers are made respectively
  • the conductor layers each consist of the same materials.
  • the conductive layer (s) are made of a metal selected from the group consisting of gold (Au), silver (Ag), and platinum (Pt) or alloys thereof.
  • the conductive layer (s) are made of gold (Au).
  • the conductor layers have a total thickness between 0.1 ⁇ and 1000 ⁇ , in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ on.
  • the conductor layer (s) (each) have a total thickness of between 100 nm and 100 ⁇ (0.1 ⁇ and 100 ⁇ ), in particular of between 0.4 ⁇ and 80 ⁇ , preferably between 0.2 ⁇ and 50 ⁇ on.
  • the conductor layer With regard to suitable materials for the conductor layer (s), reference is made to the above-mentioned embodiments. In some embodiments, the Conduction layers of different materials. In some embodiments, the Conduction layers of different materials.
  • Embodiments consist of individual conductor layers of the same materials in each case.
  • the conductor layers each consist of the same materials. Conductive layers of the same materials are preferred.
  • the selection of the conductor layers depends on the material of the workpiece and the electrolyte. A person skilled in the art can readily rely on his expertise,
  • the conductive layer (s) comprise a material having a resistivity at 20 ° C between 0.01 Q * mm 2 / m and 1 Q * mm 2 / m.
  • Insulation layer is not completely covered. There is more
  • Insulating layer formed in sections on the surface of the further conductive layer, that at least one structuring element within the further layer (consisting of the further conductive layer with partially covering another
  • Insulation layer is formed.
  • the structuring elements may differ in their structure, widths and thicknesses.
  • This alternating arrangement of conductive and insulating layers can be repeated as often as desired, so that any number of structuring elements is possible, resulting in a multilayer electrode.
  • This arrangement is for both multilayer rigid planar electrodes as well
  • the structuring elements have geometrically shaped structures, such as circular, elliptical, square, rectangular, and triangular to octagonal structures.
  • the electrode has at least one electrical contacts.
  • the electrical contact (s) allows (enable) a control of the
  • the electrical contact can be formed such that individual structuring elements within a layer separated from each other with current can be controlled, resulting in the formation of different electric fields.
  • the strength of the electric field influences, as already described, the local one Matenalabgang.
  • the electrical contacting in the electrode according to the invention in a use according to the invention, allows for the individual
  • the electrical contacts are formed so that they are only in contact with the corresponding line layers, which makes it possible to generate different current flows independently in the individual line layers.
  • This can also be done by suitable insulation.
  • the insulation layers can be applied in such a way that you not only separate the conductor layers from one another, but also insulate the respective electrical contacts with respect to the other conductor layers.
  • This embodiment makes it possible to vary the depths of the individual structuring elements by the targeted and variable power supply, whereby the resulting electric field can be variably adjusted. It also offers the possibility of controlling structuring elements within a layer both individually and jointly and in combinations (individual structuring elements and all structuring elements in one layer) to drive variable and thus complex structures
  • the depth of the structuring elements can be made variable.
  • Conduction layers can, as described, be controlled separately from one another, which leads to the formation of different electric fields, and therefore to different degrees of local material outlets.
  • This "multi-layering" of the electrode allows precise machining of materials, allowing different depths to be realized on the material in an improved and simpler manner than heretofore possible: multilayer planar as well as multilayer flexible electrodes
  • Electrode is greatly facilitated the machining of molded materials, such as cylindrically shaped materials.
  • the positioning of the different layers (conducting and insulating layers) relative to each other depends only on the accuracy of the production method and is usually one to two orders of magnitude below the achievable with the micro-electrostructuring resolutions ,
  • the minimum structure resolution is in the range of the layer thickness of the photoresist
  • the lateral structure sizes are limited downwards by the possibility of lithography, while upwards there are no limits.
  • the feature sizes are based on the resolution of the Elektromilaier- process, which in turn the distance between the electrode and the
  • Insulation layer existing layer the formation of several different substances
  • the conductor layer is formed of an electrically conductive material, which forms a galvanic cell together with the material and the electrolyte solution.
  • an electrically conductive material which forms a galvanic cell together with the material and the electrolyte solution.
  • the electrode according to the invention can also be used for electroplating
  • Electroforming of material materials are used, provided that during the process, the necessary ions are not obtained from the material of the electrode but from the electrolyte and the electrical connections are reversed, wherein the workpiece is cathode-poled and the electrode as an anode
  • the workpiece is cathode-poled and the electrode as an anode
  • Electroplating is a patterning form of the ionized state wherein a metal is electrolytically deposited from an aqueous salt bath on the electrically conductive and cathode-poled workpiece.
  • This form of structuring is used mainly for producing metallic coatings or for producing self-supporting metallic workpieces.
  • the conductive layers of the invention are conductive layers of the invention.
  • Electrode adhesion layer on your top and / or bottom.
  • the adhesion promoting layer is formed of a hydrophobic material.
  • the primer layer is a metal that forms a closed oxide layer on its surface under atmospheric oxygen, thereby forming a metal oxide compound.
  • the adhesion promoting layer is a metal or a metal alloy selected from the group of copper (Cu), chromium (Cr), or tantalum (Ta).
  • the adhesion-promoting layer is helpful so that the newly added conductor layers rest precisely and permanently on the corresponding layers and the individual layers remain in their position even when used in accordance with the invention.
  • the adhesion-promoting layer should furthermore have a very good adhesion to both the conductor layer and the insulation layer.
  • the water-repellent property of the adhesion mediation is helpful to ensure a firm adhesive retention of the insulation layers.
  • the primer layer has a height in the range of 10 nm and 20 nm, in particular 15 nm.
  • the insulating layer is formed of an electrically non-conductive material, which is electrically insulating, and has a small
  • the insulating layer is an epoxy resin-based polymer.
  • the insulating layer is an electrically insulating metal oxide comprising alumina (Al 2 O 3 ), zinc oxide (ZnO), silicon dioxide (SiO 2 ), and
  • BeO Beryllium oxide
  • Beryllerde mixed metal oxides
  • the insulating layer is a metal that by means of oxidation, for example, under atmospheric oxygen or by a targeted chemical
  • Oxidation reaction forms an insulating metal oxide compound.
  • the conductive layer also includes the insulating layer, wherein the conductive layer is formed of a metal or a metal alloy, and the insulating layer directly on the surface of the conductive layer or the conductive substrate by oxidation, e.g. under atmospheric oxygen, or by a targeted chemical oxidation reaction, as a metal oxide layer is formed in sections.
  • the insulating layer is a photoresist polymer (photoresist).
  • the insulating layer is a solder mask, such as the Conformask series or a photoresist, such as SU-8.
  • the insulating layer is a polyblend. In certain embodiments, the layer thickness of the insulating layer between 50 nm and 10 ⁇ (0.05 ⁇ and 10 ⁇ ), in particular between 0.5 ⁇ and 5 ⁇ thick.
  • the insulating layer must have a chemically high resistance in order to ensure that its properties do not change in further processing steps or even that the layer decomposes.
  • a thin layer of the insulating layer is preferably deposited and patterned.
  • the layer should be as thin as possible, so that a slight disturbance of the electrolyte flow takes place and the reaction products can be effectively removed.
  • SU-8 is characterized by its high durability as well as its simple, quick and inexpensive processing and is therefore preferred.
  • the electrode according to the invention has a fluidic channel, which is designed to conduct an electrolyte, wherein the fluidic channel has a base area that comprises at least the structuring elements of the electrode, wherein the fluidic channel has a flow area extending along the
  • Lengthwise direction of the fluidic channel enlarged or reduced.
  • the wall of the fluidic channel consists of a chemically and mechanically resistant and electrically non-conductive material.
  • the wall of the fluidic channel consists of a
  • the wall of the fluidic channel consists of a photoresist or a solder mask, in particular from the Conformask series or SU-8.
  • the wall of the fluidic channel has a height of 1 ⁇ to 1 mm, in particular 20 ⁇ .
  • the width of the fluidic channel is determined by the desired structure and at least as wide as the resulting structure on the workpiece surface.
  • the fluidic channel is integrated on the electrode and thus an integral part of it. It can be given as the last layer on the at least one metallization and insulation layers of the electrode and should not cover all existing Strukturticianseiemente.
  • the thickness of the fluidic channel depends on the requirement profile and can be from
  • the width of the fluidic channel varies.
  • the fluidic channel thus has a varying along the flow direction of the electrolyte
  • Electrolyte speed can be influenced.
  • Electrolyte speed it is possible to influence the metal ion concentration between the electrode and the workpiece, which in turn changes the local material removal on the workpiece.
  • the abraded material is transported away continuously through the fluidic channel flow.
  • a third aspect of the invention relates to a fluidic channel for conducting a
  • Electrolytes for an electrode suitable for the production of micro and / or
  • Nanostructures on materials comprising a base surface having a flow area for the electrolyte, which increases or decreases along the longitudinal direction of the fluidic passage.
  • a fourth aspect of the invention relates to an electrode suitable for micro- or
  • Nanostructuring of materials comprising a fluidic channel for conducting an electrolyte and at least one structuring element, wherein the fluidic channel has a base surface comprising at least the one structuring element, and wherein the fluidic channel has a flow area for the electrolyte, which along the longitudinal direction of the fluidic channel enlarged or reduced
  • the wall of the fluidic channel consists of a chemically and mechanically resistant and electrically non-conductive material.
  • the wall of the fluidic channel consists of a
  • the wall of the fluidic channel consists of a photoresist or a solder mask, in particular from the Conformask series or SU-8.
  • the wall of the fluidic channel has a height of 1 ⁇ to 1 mm, in particular 20 ⁇ .
  • the width of the fluidic channel is determined by the desired structure and at least as wide as the resulting structure on the workpiece surface.
  • the fluidic channel is integrated on the electrode and thus an integral part of it. It can be given as the last layer on the at least one metallization and insulation layers of the electrode and should not cover all existing structuring elements.
  • the thickness of the fluidic channel depends on the requirement profile and can be easily determined by the person skilled in the art. About the height of the fluidic channel of the working distance between the electrode and the workpiece can be adjusted. The higher the channel, the greater the distance to the structuring elements. Through this
  • the width of the fluidic channel varies.
  • the fluidic channel thus has a varying along the flow direction of the electrolyte
  • Electrolyte speed can be influenced.
  • Electrolyte speed it is possible to influence the metal ion concentration between the electrode and the workpiece, which in turn changes the local material removal on the workpiece.
  • the abraded material is transported away continuously through the fluidic channel flow.
  • the electrode includes a substrate having at least a first conductive layer on the surface of the substrate, or a substrate forming a conductive substrate layer
  • Conductive layer or the conductive substrate layer is formed
  • the first insulating layer only partially covers the at least one first conductive layer or the conductive substrate layer and at least one
  • Structuring element is formed.
  • the substrate has a substantially curved shape.
  • the substrate is plastically deformable.
  • the substrate is elastically deformable.
  • the formation of a plurality of different structuring elements within this layer is possible within a layer consisting of conductor layer and insulation layer.
  • Substrate layer) by means of the insulating layer is a structuring element is formed, which has a non-insulated conductive layer as the base, which can form an electric field with a further electrode in a proper use, which is limited by the further isolation of the conductive layer of this electric field. It is thus possible to form a localized and defined electric field.
  • Sectional covering in the sense of the invention can be understood as covering a layer arranged directly below the insulating layer, such as, for example, the first conductive layer, as well as covering further, underlying layers, such as, for example, the conductive substrate view. It is essential that partially cover by the insulation layer at a
  • an electric field can be formed only between the uncovered conductive layer (wiring layer) of the structuring element and another electrode.
  • the substrate is formed from an electrically conductive material ("conductive substrate”), in particular a metal or a metal alloy, thus forming a conductive substrate layer
  • Substrate layer only partially covers and forms a first patterning element.
  • the conductive substrate layer may be used as a first
  • Conduction layer are considered, on which a first insulating layer is applied; the attachment of an additional conductor layer is therefore not necessary.
  • the conductive substrate is a conductive transition metal, a semi-metal or a metal alloy, in particular selected from the 4th, 6th, 8th, 11th, 13th or 14th group of the Periodic Table of the Elements.
  • the conductive substrate is selected from the group consisting of titanium (Ti), chromium (Cr), tungsten (W), iron (Fe), copper (Cu), silver (Ag), gold (Au), aluminum (Al ) or germanium (Ge) or alloys thereof.
  • the conductive substrate is selected from the group consisting of aluminum or copper or alloys thereof.
  • the substrate has a thickness of between 0.1 and 5.0 mm, in particular between 0.2 and 2.5 mm, preferably between 0.3 and 1.0 mm.
  • the conductive substrate comprises a conductive metal alloy, in particular bronze (CuSn, copper-tin), brass (CuZn, copper-zinc), or iron-nickel (FeNi).
  • bronze bronze
  • CuZn copper-tin
  • copper-zinc brass
  • FeNi iron-nickel
  • the conductive substrate is made of an electrically conductive
  • Material in particular a metal or a metal alloy, and formed on the Substrate is additionally formed at least a first conductive layer. Furthermore, at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer only the first conductor layer
  • the material of the first conductive layer is other than that of
  • the first insulation layer is located on the surface of the at least first conductor layer, wherein the substrate is covered with the conductor layer such that the structuring element has the conductor layer as the base surface.
  • the first conductor layer may be arranged in sections on the substrate, wherein the first insulation layer completely covers the first conductor layer but only partially covers the first substrate layer, so that a
  • Structuring element is formed, which as a base, the conductive
  • Substrate layer has.
  • the insulating layer partially covers the first conductive layer or the conductive substrate layer in such a way that at least one
  • Structuring element is formed.
  • the insulating layer covers the first conductive layer or the conductive substrate layer in sections such that a plurality of, in particular different, structuring elements are formed.
  • the base of the first structuring element thus consists of the surface of the first conductive layer or of the surface of the substrate.
  • Structuring element with a conductive base which is suitable for the formation of an electric field. This ensures that a defined electric field can be formed.
  • the structuring is determined by the shape of the structuring elements.
  • Insulation layer form a layer in which at least one
  • a layer may have several, in particular different, structuring elements, wherein the arrangement of the layers is completed with an insulating layer.
  • the uppermost layer of a layer, or the last layer of the electrode is an insulating layer.
  • the structuring elements located on one layer can have the same or different shapes have, which are each controlled differently with current.
  • the arrangement of different and individually controllable structuring elements thus allows the formation of different electric fields, resulting in different strong local material outflows or material deposits on the material.
  • said additional first conductive layer is a
  • Metallization coating consisting of an electrically conductive metal or alloy layer.
  • the selection of the components of the first conductive layer depends on the material of the workpiece and the electrolyte, with those skilled in the art readily selecting the appropriate components based on their expertise. Reference is made to the later explanations and definitions relating to the conductor layers.
  • the substrate is made of a non-conductive material, in particular a polymer, especially a thermoplastic polymer ("non-conductive substrate”) and at least one of these is on the substrate
  • Conductive layer formed on the surface thereof. Furthermore, at least one first insulation layer is formed on the surface of the first conductor layer, wherein the first insulation layer only partially covers the first conductor layer and forms at least one first patterning element.
  • the non-conductive substrate is a polymer.
  • the non-conductive substrate is a thermoplastic
  • the non-conductive substrate is a thermoplastic polymer (thermoplastic) selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • thermoplastic selected from acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polyactate (PLA), polymethylmethacrylate (PMMA), polycarbonate (PC),
  • PET Polyethylene terephthalate
  • PE polyethylene
  • PS polypropylene
  • PEEK polyetheretherketone
  • PVC polyvinyl chloride
  • the non-conductive substrate is a polyurethane polymer.
  • Polyblends include in particular ABS / PA, PC, acrylic / PVC ("Kydex”),
  • Acrylic ester styrene-acrylonitrile / polyvinyl chloride (ASA / PC), polypropylene / ethylene-propylene-diene rubber (PP / EPDM), polycarbonate / polybutylene terephthalate (PC / PBT), and PS / PE.
  • Thermoplastics are polymers that consist of linear or branched chain molecules. They have a low strength, are elastic and very deformable, and can form an amorphous or semi-crystalline molecular structure. Thermoplastics are plastically deformable at a certain temperature range, wherein below this temperature range, these polymers can not be plastically deformed (irreversibly). This process can be repeated as often as long as there is no overheating, which leads to the thermal decomposition of the material.
  • thermoplastics relevant to this invention are selected as needed.
  • the non-conductive substrate between 1 ⁇ and 1 mm thick.
  • the non-conductive substrate between 1 ⁇ and 0.5 mm, in particular between 10 ⁇ and 100 ⁇ thick, the substrate thickness depends largely on the mechanical requirement and the material properties of the substrate. The person skilled in the art can easily select a material thickness which is appropriate to the requirements on the basis of his specialist knowledge.
  • the non-conductive substrate between 20 ⁇ and 50 ⁇ thick.
  • an electrically conductive layer is further applied to the non-conductive substrate.
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 1 mm, in some embodiments, the non-conductive substrate between 1 ⁇ and 0.5 mm.
  • this conductor layer consists of at least one conductive metal layer (or a conductive metal alloy) with a total thickness of between 0.1 ⁇ and 100 ⁇ , in particular between 0.4 ⁇ and 80 ⁇ , preferably with a total thickness of between 0.2 ⁇ and 50 ⁇ .
  • the electrical conduction layer between 0.5 ⁇ and 1 ⁇ thick.
  • the structuring element can be made by partially covering said
  • Conductive layer can be formed with a first electrically non-conductive insulating layer through a mask or stencil.
  • the substrate is formed from a non-conductive material, in particular a polymer, above all a thermoplastic polymer ("plastic substrate"), and at least one first conductor layer is formed on the substrate on the surface thereof formed the surface of the first conductive layer, wherein the first
  • Insulating layer covers the first line layer only partially and at least forms a first patterning element.
  • the plastic substrate is formed of a polymer.
  • the plastic substrate is a thermoplastic polymer according to the aspects mentioned above.
  • the electrode Due to the plastic deformability of the substrate, the electrode can be adapted to the shape of the materials or workpieces to be treated (irreversible). The irreversible deformability of the substrate leads to the formation of a substantially rigid electrode.
  • the substrate is non-conductive and formed of an elastic polymer ("elastic substrate"), and at least a first conductive layer is formed on the surface of the substrate Further, at least a first insulating layer is formed on the surface of the first conductive layer The first insulating layer covers the first line layer only in sections and at least one first structuring element is formed, which is a "flexible" electrode.
  • elastic substrate an elastic polymer
  • first insulating layer is formed on the surface of the first conductive layer
  • the first insulating layer covers the first line layer only in sections and at least one first structuring element is formed, which is a "flexible" electrode.
  • the electrode Due to the elastic deformability of the substrate, the electrode can be reversibly adapted to the shape of the materials to be treated.
  • the elastic substrate is an elastic polymer
  • the elastic substrate is a thermoplastic elastomer.
  • the elastic substrate is an elastomer selected from natural rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, chloroprene rubber, butadiene rubber, and ethylene-propylene-diene rubber.
  • the elastic substrate is an olefin-based thermoplastic elastomer (TPE) (TPE-O), an olefin-based crosslinked thermoplastic elastomer (TPE-V), a thermoplastic polyester elastomer (TPE-E), a thermoplastic
  • TPC Copolyester
  • TPE-S styrene block copolymer
  • TPE-A thermoplastic copolyamide
  • polyblend an elastomer alloy
  • TPE-0 and TPE-V include, for example, PP / EPDM
  • TPE-E and TPC include Hytrel ® and Riteflex ®
  • TPE-S for example, styrene-butadiene-styrene or methyl acrylate-butadiene-styrene, including styrene, Styroflex ®, Septon ® and thermal load ®
  • TPE-a comprises, for example PEBAX ®, a polyether block amide.
  • the elastic substrate is a thermoplastic elastomer on urethane (TPE-U), comprising Desmopan ®, Texin ® and Utechllan ® as well as a polyester-urethane rubber compound comprising Baytec ®, Cellasto ®, Vulkollan ®, Elasturan ®, Sylomer ® , Sylodyn ® , and Urepan ® .
  • TPE-U thermoplastic elastomer on urethane
  • Desmopan ®, Texin ® and Utechllan ® as well as a polyester-urethane rubber compound comprising Baytec ®, Cellasto ®, Vulkollan ®, Elasturan ®, Sylomer ® , Sylodyn ® , and Urepan ® .
  • Elastomers are dimensionally stable, but elastically deformable plastics whose glass transition point below the Operating temperature is. The plastics can deform elastically under
  • Thermoplastic elastomers are polymers that behave like classic elastomers at room temperature, but are plastically deformable when heat is applied. Most thermoplastic elastomers include copolymers consisting of a soft elastomeric and a hard thermoplastic component.
  • the elastic substrate is a polymer, in particular a polymethylmethacrylate, novolak, and polymethylglutarimide, or an epoxy resin.
  • the non-conductive substrate is an epoxy based polymer, particularly SU-8.
  • the non-conductive substrate is a photoresist ("photoresist substrate") or a photoresist
  • Solder mask (solder mask).
  • the photoresist substrate is selected from SU-8 or the Conformask series, particularly the Conformask 2500 or 3300 series.
  • the electrical conduction layer comprises at least one conductive metal layer or a metal alloy.
  • the line layer has a total thickness of between 0.1 ⁇ and 1000 ⁇ , in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ on.
  • the conductor layer has a total thickness of between 0.1 ⁇ m and 100 ⁇ m, in particular of between 0.4 ⁇ m and 80 ⁇ m, preferably between 0.2 ⁇ m and 50 ⁇ m.
  • Insulation layer existing position the formation of a structuring element or more, in particular different structuring elements possible.
  • the non-conductive substrate is elastically (reversibly) deformable. Due to the elasticity of the substrate, the electrode according to the invention can be adapted to curved material surfaces. Curved material surfaces have a radius of between 1 mm and 10 m, in particular 10 mm and 1 m, preferably between 10 mm and 0.5 m.
  • the electrode Due to the flexible (elastic) behavior of the electrode, the electrode, by means of suitable holder, respectively on the (curved) workpiece to be machined be adjusted.
  • the holder is designed so that the electrical
  • the bracket can by means of clamping, screws, through
  • an elastic substrate is advantageously suitable for the attachment of structures on curved materials, since the electrode can be particularly easily adapted to the shape of the materials.
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 1 ⁇ to 100 ⁇ .
  • the non-conductive, elastic substrate is formed of an elastic polymer, wherein the elastic polymer has a height in a range of 10 ⁇ to 100 ⁇ , in particular from 15 ⁇ to 80 ⁇ , preferably from 20 ⁇ to 50 ⁇ .
  • the elastic substrate comprises an elastic polymer, wherein the elastic polymer at room temperature (20 ° C) a modulus of elasticity in a range of between 0.3 and 5 kN / mm 2 , in particular in a range of between 1 and 5 kN / mm 2 , having.
  • the elastic substrate is Conformask, in particular Conformask of the 2500 or 3300 series.
  • the electrode according to the invention has two layers
  • the first conductor layer and the first insulation layer form a first layer, wherein at least one structuring element is formed within the first layer. Furthermore, a second
  • the second conductor layer is formed on the surface of the first insulation layer, wherein the second conductor layer, the first
  • Insulating layer so partially covering that at least one
  • Structuring element of the first layer is not covered. Furthermore, the
  • the electrode according to the invention has a plurality of layers of conductor layers and insulation layers, wherein the further conductor layers and insulation layers are formed such that the structuring elements of the underlying layers are not covered and in the respective layer at least one structuring element is formed, wherein the arrangement of the layers is completed with an insulation layer.
  • the preceding structuring elements are thus not covered by further conduction and insulation layer, so that in the case of multiple layers, all located on the previous, lower layers
  • the structuring elements located on different layers thus have different distances from the material, which leads to the formation of different structure depths on the workpiece.
  • the structuring elements, which are located on the uppermost layer of the electrode form the deepest structures, since here the electric field has an increased effect and the electric field scattering is lower.
  • the conductive layer (s) consist of an electrically conductive metal layer or a metal alloy layer.
  • the conductive layer (s) are made of a metal selected from the group of gold, silver, copper, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, zinc, aluminum, or alloys thereof. In some embodiments, the conductive layers are made respectively
  • the conductor layers each consist of the same materials.
  • the conductive layer (s) are made of a metal selected from the group consisting of gold (Au), silver (Ag), and platinum (Pt) or alloys thereof.
  • the conductive layer (s) are made of gold (Au).
  • the conductive layer (s) (each) has a total thickness of 100 nm to 1 mm, in particular 100 nm to 500 ⁇ , preferably from 100 nm to 100 ⁇ .
  • the line layer (s) (each) a total thickness of between 100 nm and 100 ⁇ (0.1 ⁇ and 100 ⁇ ), in particular of between 0.4 ⁇ and 80 ⁇ , preferably between 0.2 ⁇ and 50 ⁇ on.
  • the second conductive layer is formed on the surface of the first insulating layer so that the structuring element of the first layer (consisting of first conductive layer and partially covering the first
  • Insulation layer is not completely covered. Furthermore, the second one
  • Insulating layer formed in sections on the surface of the second conductive layer, that at least one structuring element within the second layer (consisting of second conductive layer with partially covering second
  • Insulation layer is formed.
  • the structuring elements may differ in their structure, widths and thicknesses.
  • the structuring elements have geometrically shaped structures, such as circular, elliptical, square, rectangular, and triangular to octagonal structures.
  • the electrode has at least one electrical contacts.
  • the electrical contact (s) allows (enable) a control of the
  • the electrical contact can be formed such that individual structuring elements within a layer separated from each other with current can be controlled, resulting in the formation of different electric fields.
  • the strength of the electric field influences, as already described, the local material outlet.
  • the electrical contacting in the electrode according to the invention in a use according to the invention, allows for the individual
  • the electrical contacts are formed so that they are only in contact with the corresponding line layers, which makes it possible to generate different current flows independently in the individual line layers.
  • This can also be done by suitable insulation.
  • the insulation layers can be applied in such a way that you not only separate the conductor layers from one another, but also insulate the respective electrical contacts with respect to the other conductor layers.
  • This embodiment makes it possible to vary the depths of the individual structuring elements by the targeted and variable power supply, whereby the resulting electric field can be variably adjusted. It also offers the possibility of controlling structuring elements within a layer both individually and jointly and in combinations (individual structuring elements and all structuring elements in one layer) to drive variable and thus complex structures
  • the electrode according to the invention is produced by the methods of microsystem technology, the positioning of the different layers (line and
  • Insulation layers to each other depends only on the accuracy of the production method and is usually one to two orders of magnitude below the achievable with the micro-Elektro Wegtechnik resolutions.
  • Insulating layer laid so that the second and structuring element remain free. Furthermore, a third insulation layer is applied to the third conductor layer such that the second and the structuring element remain free and at least one third structuring element is formed.
  • This alternating arrangement of conductive and insulating layers can be repeated as often as desired, so that any number of structuring elements is possible, resulting in a multilayer electrode. This arrangement is possible both for multilayer rigid, planar electrodes and multilayer, flexible electrodes.
  • the electrode according to the invention comprises further layers of conductor layers and insulation layers, wherein the further conductor layers and insulation layers are formed such that the structuring elements of the underlying layers are not covered and in the respective layer at least one structuring element is formed, wherein the arrangement of the layers is completed with an insulation layer.
  • the further conductor layers are formed in sections on the insulation layers such that the underlying structuring elements are not covered.
  • the insulation layers are formed in sections on the line layers such that the underlying structuring elements are not covered, and at least one other
  • Structuring element is formed in the respective layer.
  • the depth of the structuring elements can be made variable.
  • Conduction layers can, as described, be controlled separately from one another, which leads to the formation of different electric fields, and therefore to different degrees of local material outlets.
  • This "multi-layering" of the electrode allows precise machining of materials, with different depths on the
  • Multi-layer planar as well as multilayer flexible electrodes allow the user to create several, different ones in one set-up
  • Electrode is greatly facilitated the machining of molded materials, such as cylindrically shaped materials.
  • the minimum structure resolution is in the range of the layer thickness of the photoresist polymer.
  • the lateral structure sizes are limited downwards by the possibility of lithography, while upwards there are no limits.
  • the feature sizes are based on the resolution of the Elektromilaier- process, which in turn the distance between the electrode and the
  • the further conductive layers consist of a conductive metal layer or a conductive metal alloy layer.
  • the conductive layer (s) are made of a metal selected from the group of gold, silver, copper, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, zinc, aluminum, or alloys thereof.
  • the further conductive layers consist of gold (Au).
  • the conductive layers are made respectively
  • individual conductor layers each consist of the same materials. In some embodiments, the conductor layers each consist of the same materials.
  • the further conductive layers have a total thickness between 0.1 ⁇ m and 1000 ⁇ m, in particular 100 nm to 500 ⁇ m, preferably from 100 nm to 100 ⁇ m.
  • the further conductive layers have a total thickness of between 100 nm and 100 ⁇ m (0.1 ⁇ m and 100 ⁇ m), in particular between 0.4 ⁇ m and 80 ⁇ m, preferably between 0.2 ⁇ m and 50 ⁇ m.
  • the further conductive layers have a total thickness of between 0.2 ⁇ and 10 ⁇ on.
  • Insulation layer existing layer the formation of several different substances
  • the at least first conductive layer is formed of an electrically conductive material, which together with the material and the Electrolytic solution forms a galvanic cell. Reference is made to the above explanations regarding the galvanic cell.
  • Embodiments consist of individual conductor layers of the same materials in each case.
  • the conductor layers each consist of the same materials. Conductive layers of the same materials are preferred.
  • the selection of the conductor layers depends on the material of the workpiece and the electrolyte. A person skilled in the art can readily rely on his expertise,
  • the electrode according to the invention can also be used for electroplating
  • Electroforming of material materials are used, provided that during the process, the necessary ions are not obtained from the material of the electrode but from the electrolyte and the electrical connections are reversed, wherein the workpiece is cathode-poled and the electrode as an anode
  • the workpiece is cathode-poled and the electrode as an anode
  • Electroplating is a patterning form of the ionized state wherein a metal is electrolytically deposited from an aqueous salt bath on the electrically conductive and cathode-poled workpiece.
  • This form of structuring is used mainly for producing metallic coatings or for producing self-supporting metallic workpieces.
  • the conductive layer (s) comprise a material having a resistivity at 20 ° C between 0.01 Q * mm 2 / m and 1 Q * mm 2 / m. Reference is made to the above explanations for the specific resistance.
  • the conductive layers of the invention are conductive layers of the invention.
  • Electrode adhesion layer on your top and / or bottom.
  • the adhesion promoting layer is formed of a hydrophobic material.
  • the primer layer is a metal that forms a closed oxide layer on its surface under atmospheric oxygen, thereby forming a metal oxide compound.
  • the adhesion promoting layer is a metal or a metal alloy selected from the group of copper (Cu), chromium (Cr), or tantalum (Ta).
  • the adhesion-promoting layer is helpful so that the newly added conductor layers rest precisely and permanently on the corresponding layers and the individual layers remain in their position even when used in accordance with the invention.
  • the adhesion-promoting layer should furthermore have a very good adhesion to both the conductor layer and the insulation layer.
  • the water-repellent property of the adhesion mediation is helpful to ensure a firm adhesive retention of the insulation layers.
  • the primer layer has a height in the range of 10 nm and 20 nm, in particular 15 nm.
  • the insulating layer is formed of an electrically non-conductive material, which is electrically insulating, and has a small
  • the insulating layer is an epoxy resin-based polymer.
  • the insulating layer is an electrically insulating metal oxide comprising alumina (Al 2 O 3 ), zinc oxide (ZnO), silicon dioxide (SiO 2 ), and
  • BeO Beryllium oxide
  • Beryllerde mixed metal oxides
  • the insulating layer is a metal that by means of oxidation, for example, under atmospheric oxygen or by a targeted chemical
  • Oxidation reaction forms an insulating metal oxide compound.
  • the conductive layer also includes the insulating layer, wherein the conductive layer is formed of a metal or a metal alloy, and the insulating layer directly on the surface of the conductive layer or the conductive substrate by oxidation, e.g. under atmospheric oxygen, or by a targeted chemical oxidation reaction, as a metal oxide layer is formed in sections.
  • the insulating layer is a photoresist polymer (photoresist).
  • the insulating layer is a solder mask, such as the Conformask series or a photoresist, such as SU-8.
  • the insulating layer is a polyblend. In certain embodiments, the layer thickness of the insulating layer between 50 nm and 10 ⁇ (0.05 ⁇ and 10 ⁇ ), in particular between 0.5 ⁇ and 5 ⁇ thick.
  • the insulating layer must have a chemically high resistance in order to ensure that its properties do not change in further processing steps or even that the layer decomposes.
  • a thin layer of the insulating layer is preferably deposited and patterned.
  • the layer should be as thin as possible, so that a slight disturbance of the electrolyte flow takes place and the reaction products can be effectively removed.
  • SU-8 is characterized by its high durability as well as its simple, quick and inexpensive processing and is therefore preferred.
  • a fifth aspect of the invention relates to a method for producing micro- and / or nanostructures on materials, comprising the steps
  • the patterning process is a (P) ECM (Pulsed Electrochemical Machining) process whose process steps are known to those skilled in the art.
  • Steps identified under (a) relate to the production of flexible counterelectrodes, while steps (b) describe the preparation of multilayer counterelectrodes.
  • Analogous steps are applicable to thermoplastic substrates or conductive substrates. However, in this case, the substrate of the electrode is provided directly in step 1 and steps 2a to 4a are omitted, wherein in the case of a conductive substrate also step 5 can be dispensed with.
  • Steps 2 to 6 can be omitted in the production of electrically conductive substrates. However, it is advantageous to protect the substrate with a layer of a noble metal from corrosion.
  • silicon wafers e.g., silicon wafers
  • metal wafers are suitable for this.
  • the dry film resist is applied according to the manufacturer's instructions, whereby the upper protective film is not removed contrary to the manufacturer's instructions.
  • the application of the photoresist takes place via the process of spin-coating according to the manufacturer's instructions.
  • the photoresist is used to protect the protective film of the Laminar E8015 from chemicals and solvents during further processing.
  • Photoresist covers the edge of the substrate during spin coating and seals it.
  • the processing of the substrate is carried out according to the manufacturer's instructions.
  • the substrate is laminated to the layers consisting of base structure, dry film resist, and the protective film and can be optionally structured.
  • the conducting layer in the electrode according to the invention consists of an electrically conductive metal or a metal alloy, for example gold, and is sputtered with a height of between 100 nm and 1000 nm, in particular with a height of 500 nm.
  • a chromium layer having a height of between 10 nm and 20 nm, in particular 15 nm is sputtered beforehand or subsequently both on the upper side and underside of the conductor layer. In this step, it would also be possible to evaporate the metal layer for structural formation.
  • the structuring elements can also be deposited via a galvanization process.
  • This step is optional. In this way it is possible to produce structures which are electrically separated from one another in a layer and which can be controlled separately from one another by means of contacts (see Figure 1, structures 6, 6 ⁇ , Figure 2, structures 60, 60 ⁇ 60 "and contacts 8, 80).
  • the structuring takes place by lithography and subsequent etching of the chromium-gold-chromium layer package Both production steps are known in the art (see, for example, US Pat
  • a 1 ⁇ thick layer of photoresist material in particular SU- 8 2, according to the manufacturer's instructions by spin coating applied and
  • At least one structuring element is formed (shown with a cross in FIGS. 6 and 7).
  • Insulation layer of step 7 allows the provision of contact (s) (see Figure 1, contact 8) which allow driving the structuring elements within a layer. With regard to a separate control within a position, reference is made to step 6.
  • the conduction layer (gold layer) is exposed, which is the contact to the
  • step 8 may be done only once before step 10. Then, the other layers are provided by repeating steps 5 through 7.
  • the additional conductive layers are laid on the underlying layers to produce a multilayer electrode.
  • the excess of conductive layer material must then be removed in the region of the structuring elements (see Figure 1, structures 6, 6 ⁇ , Figure 2, structures 60, 60 ⁇ 60 ") and possibly on the outside to avoid short circuits between the layers
  • the layer of chromium serves not only as an adhesion-promoting layer, but also as an etch-stop layer during gold etching, thus ensuring that the deeper-lying conductor layers are not removed during structuring of the overlying conductor layers. 10. Separation and structuring of the fluidic channel.
  • a photoresist polymer especially SU-8 or a conforming photoresist
  • the fluidic channel consists of one or more layers of this photoresist material, whereby the working distance can be adjusted
  • the finished electrode can now be detached from the basic structure.
  • the SU-8 layer from step 3 is scratched on the edge and the protective film of the dry film resist from step 2 is dissolved down. This film can either remain on the counter electrode or be peeled off as well.
  • the complete basic structure could also be etched away.
  • the advantage of the dry resist peeling method is that this method is much faster compared to the deposition of a sacrificial layer.
  • the removal of the dry film resist at the end of the manufacturing process of the electrode is completed within a few seconds, while an undercut or the etching of a complete substrate layer takes several hours.
  • material costs of, for example, etching solutions can be saved.
  • FIGS. 6 and 7 show the production methods for flexible counterelectrodes (FIG. 6) and for multilayer counterelectrodes (FIG. 7). The optional step 6 is not listed here.
  • the electrode according to the invention offers the following advantages in the case of the micro-electrostructuring method in comparison to the methods known in the prior art:
  • the micro-electro-structuring method which is made possible by the electrode according to the invention offers, in comparison to the conventional lithography method
  • the electrode shortens process times by 200 times; the process is typically completed in 10 to 20 seconds.
  • Using the lithographic process for curved surfaces is relatively expensive and requires expensive equipment.
  • the lithographic process for curved surfaces is relatively expensive and requires expensive equipment.
  • the process can be carried out by the electrode according to the invention at room temperature. There is thus no thermal influence on the material (as is the case with hardened steels, for example) is). Furthermore, the process speeds are independent of the surface to be structured.
  • the advantages of the methods enabled here by the electrode according to the invention over other microstructuring methods furthermore include the possibility of producing three-dimensional structures on planar as well as molded (for example
  • cylindrically shaped surfaces the easier positioning and alignment of several structures to each other, which is particularly important in the processing of molded surfaces in weight, as well as the possibility of the structure depth over the
  • the electrode is placed on the workpiece with the aid of a corresponding tool holder and positioned, for example, by means of stops.
  • the tool holder ensures that the electrode is pressed against the workpiece with sufficient force to counteract the back pressure through the workpiece
  • Electrolytes compensate and ensure the seal between the workpiece and electrode. Subsequently, the electrolyte supply is turned on, which the
  • Electrolyte pumps through the fluidic channel are selected according to the material of the workpiece to be structured. In the area of
  • the effective current density in the conductor layers of the electrode decreases and thus the thermal load is lower.
  • the electric field can be focused by the current pulsation and thereby smaller structures can be produced.
  • the effective concentration of dissolved metal ions in the fluidic channel decreases and thus the increase of the conductivity of the electrolyte by the additional metal ions is less.
  • the process can be controlled so that no dissolved metal ions are deposited on the electrode in the course of the channel, as they reach the end of the channel beforehand and be flushed away with the electrolyte.
  • the current densities used are of the material to be structured, the
  • Structure depth and the requirements of the roughness of the structure are typically between 1 A / cm 2 and 100 A / cm 2 .
  • the amount of material removed is at very high current densities proportional to the amount of charge flowed
  • the electrolyte flow is switched off.
  • the component is then rinsed. This can either be done in a separate system or else the rinsing fluid can also be pumped through the fluidic channel of the counterelectrode as long as the workpiece is still in the clamping position.
  • the electrode can also be used for electroplated, structured deposition of materials, as long as the process obtains the necessary ions from the electrolyte and not from the material of the electrode. The process sequence is similar to the previously described steps; only the polarity of the electrical connections is reversed.
  • Fig. 1 a cross section of a first embodiment of the electrode according to the invention
  • Fig. 2 a schematic representation of a curved electrode according to the invention
  • Fig. 3 the curved electrode of FIG. 1 in a plan view
  • Fig. 4 describes a multilayer electrode according to the invention in a planar form
  • Fig. 5 the multilayer electrode of FIG. 4 in a plan view
  • FIG. 6 shows the production method for flexible counterelectrodes
  • Fig. 7 the manufacturing method for multilayer counter electrodes.
  • FIG. 1 shows a cross section of a first embodiment of the electrode according to the invention with a first conductor layer and a first insulation layer. For the sake of clarity, a curvature is not shown. A schematic representation of a curved electrode can be taken from FIG.
  • the electrode according to the invention has a substrate 3 as the main body.
  • a substrate 3 As the substrate 3, a thin layer of metal, a metal alloy, a thermoplastic polymer or an elastic polymer may be used.
  • the substrate is flexible, so that it can be treated with suitable holders 4 to be treated
  • Workpiece 5 can be arranged.
  • the workpiece 5 is thereby switched as an anode (positive pole), while the electrode acts as a cathode (negative pole).
  • the holder 4 is located on the underside of the substrate 3 and is adapted to the workpiece and to the electrode as needed. In addition, the holder 4 is formed so that the electrical contacting of the electrode and a continuous supply of electrolyte are ensured.
  • the electrode can be attached to the holder 4 by means of clamping, screws, by gluing or by other types of fastening.
  • On the substrate 3 is a wiring layer (a metallization layer) 1.
  • the insulating layer 2 On the first conductor layer 1 is the insulating layer 2. Die
  • Conductive layer 1 and the insulating layer 2 form a first layer A.
  • Suitable materials for forming the insulating layer 2 can be taken from the description of this invention.
  • the insulating layer 2 is formed so that
  • Structuring elements 6, 6 ⁇ arise. It should be noted that within a Line layer and insulation layer (first layer A) different
  • Structuring elements can be formed (present are two
  • the electrolyte supply 7 may, for example, be in the form of a channel and conducts an electrolyte solution into the fluidic channel 9.
  • the electrolyte supply 7 may, for example, be in the form of a channel and conducts an electrolyte solution into the fluidic channel 9.
  • Electrolyte supply also be routed laterally (through the wall of the channel) in the channel or the channel is longer than the workpiece, so that the electrolyte is passed from one side of the workpiece to the other side through the channel.
  • the first electrical contact 8 electrically actuates the first conductor layer.
  • the fluidic channel 9 is mounted directly on the uppermost layer of the electrode (here the insulating layer 2), so that the electrode can be pressed onto the workpiece in principle "like a stamp.”
  • the boundary 90 of the fluidic channel 9 are designed such that the channel width (and thus the flow area) in the flow direction of
  • Electrolyte varies. This leads to different electrolyte velocities and to the different distribution of metal ions dissolved in the channel
  • the illustrated electrode is particularly well suited for its curved shape
  • Patterning of shaped surfaces such as cylindrically shaped workpieces.
  • the width of the fluidic channel 9 can be varied, whereby indirectly different current densities can be generated.
  • the electrode according to the invention also makes it possible to provide a very small distance to the workpiece. This results in a considerably lower scattering of the electric field, which significantly improves the lateral resolution of the individual structures. This contributes especially in combination with the curved shape to a significant improvement in the patterning options of molded material surfaces.
  • FIG. Figure 3 shows the curved
  • Electrode of Figure 1 in a plan view. Regarding the elements with the same
  • FIG. 4 describes a multilayer electrode in a planar form.
  • the multilayer electrode can also be curved, plastically deformable or elastically deformable (flexible).
  • the basic structure corresponds to the structure of Figure 1. Reference is made to the above explanations.
  • first insulation layer 2 On the first conductor layer 1 is the first insulating layer 2, both forming a first layer A. Materials which can be used to form the insulating layer have been explained in detail in the description of the invention.
  • the first insulation layer 2 is partially structured in such a way that a first structure with the two structuring elements 6, 6 ⁇ is also formed here.
  • a second conductive layer 10 and a second insulating layer 20 are formed on the first insulating layer 2.
  • the second conductor layer 10 is mounted such that the first structuring element 6, 6 ⁇ are not covered.
  • Conduction layer 10 is partially attached with a second insulation layer 20 such that a second structure consisting of three structuring elements 60, 60 ⁇ 60 "is formed.
  • Insulation layer 20 form a second layer B from.
  • Structuring elements 60, 60 ⁇ are limited by the second insulating layer 20 and the first structuring elements 6, 6 ⁇ .
  • the second insulating layer 20 is formed such that the first structuring elements 6, 6 ⁇ and the
  • Structuring elements 60, 60 ⁇ are not covered.
  • other layers of conductive and insulating layers are possible. In the case of two and more conduction and isolation levels, this is called a multilayer electrode.
  • the electrode according to the invention has a first electrical contact 8, which is designed to selectively electrically drive the first line layer 1, and a second electrical contact 80, which is designed to selectively electrically drive the second line layer.
  • the electrical contacts 8, 80 are formed so that they are only in contact with the corresponding line layers to different
  • insulation layers 2, 20 can be applied in such a way that they not only separate the conductor layers 1, 10 from one another, but also insulate the respective electrical contacts 8, 80 from the other conductor layers.
  • the electrolyte supply 7 takes place, as already described, via corresponding channels.
  • the fluidic channel 9 allows the immediate removal of the removed material.
  • the width of the fluidic channel may be varied via the restriction device 90 as described.
  • Structuring elements in one layer for example, layer A
  • current drive which leads to the formation of a constant electric field and the simultaneous removal of material in one layer.
  • the multilayer structure of the electrode additionally makes it possible to control the processing of individual structuring elements within different layers (for example layer A and layer B) separately from one another, which leads to the formation of different electric fields and thus results in a targeted variable material removal of different structuring elements in different layers Has. Furthermore, it allows the electrical contact in the
  • electrode to the individual structuring elements during the current process to produce a power supply. All of these designs can also be combined with each other arbitrarily, what the possibilities of
  • the electrode according to the invention can also be used for galvanic
  • Structuring of material may be used, provided that during the process, the necessary ions are not obtained from the material of the electrode but from the electrolyte and the electrical connections are reversed polarity, the workpiece would be cathode-poled and the electrode connected as an anode In this arrangement, it is possible to produce layer thicknesses in the nanometer range up to several millimeters on the surface of the material.
  • the multi-layer electrode arrangement thus enables the precise and simultaneous structuring of multiple locations on a material surface. Due to the minimum working distance between the workpiece and the electrode, the scattering of the electric field is considerably minimized and the structure resolution is significantly improved compared to previously known methods. Due to the flexibility of the electrode, a simplified and accurate machining of molded material surfaces is also achieved.
  • FIG. 5 shows the multilayer electrode from FIG. 4 in a plan view.
  • FIG. 6 shows schematically the production method for flexible counterelectrodes:
  • FIG. 7 shows schematically the production method for multilayer counterelectrodes:
  • steps 5-8 can be repeated several times in analogy to FIG. 6 in order to produce a plurality of layers.
  • steps for attaching a second layer are shown. 10) applying the second conductive layer; 11) applying and structuring a photoresist layer; 12) etching the second wiring layer package and removing the photoresist layer; 13) applying the second insulation layer; while the first structuring element and the second layer remain free; 14) etching the
  • Conductive layer surface 15) applying and structuring the fluidic channel; 16) Peel off the protective film of the dry film resist.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
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  • Laminated Bodies (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
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Abstract

L'invention concerne une électrode, permettant de réaliser des micro- et/ou nanostructures sur des matériaux, qui comprend un substrat possédant au moins une première couche de conduction sur la surface du substrat ou un substrat qui constitue une couche de substrat conductrice. Au moins une première couche isolante est formée sur la ou les premières couches de conduction ou sur la couche de substrat conducteur. Cette première couche isolante recouvre par endroits seulement la ou les premières couches de conduction ou la couche de substrat conducteur et au moins un élément de structuration est formé. Le substrat a une forme sensiblement incurvée ou il est déformable plastiquement ou élastiquement. Un autre aspect concerne une électrode multicouche ainsi qu'une électrode qui comporte un conduit fluidique sont la section de passage augmente ou diminue dans le sens de son extension longitudinale.
EP15712075.9A 2014-02-27 2015-02-27 Électrodes permettant de réaliser des micro- et/ou nanostructures sur des matériaux Withdrawn EP3110990A2 (fr)

Applications Claiming Priority (2)

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DE102014102550.4A DE102014102550A1 (de) 2014-02-27 2014-02-27 Elektroden geeignet für die Herstellung von Mikro- und/oder Nanostrukturen auf Werkstoffen
PCT/EP2015/054221 WO2015128501A2 (fr) 2014-02-27 2015-02-27 Électrodes permettant de réaliser des micro- et/ou nanostructures sur des matériaux

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CN110640242A (zh) * 2018-06-27 2020-01-03 鸿富锦精密工业(衡阳)有限公司 电火花加工方法
CN113649657B (zh) * 2021-06-01 2022-10-04 清华大学 一种电解加工用的纳米尺度多晶硅工具电极及其制备方法

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EP1068921A1 (fr) * 1999-07-14 2001-01-17 Eun Sang Lee Dispositif pour usiner par électrochimie des rainures sur la surface interne d'un palier aérodynamique
WO2002070183A1 (fr) * 2001-03-07 2002-09-12 Robert Bosch Gmbh Procede pour structurer une surface

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US3485744A (en) * 1966-11-21 1969-12-23 Westinghouse Electric Corp Zirconium electrode for electro-chemical machining
JPS5848039B2 (ja) * 1976-04-17 1983-10-26 大日本印刷株式会社 電解食刻方法
GB0416600D0 (en) 2004-07-24 2004-08-25 Univ Newcastle A process for manufacturing micro- and nano-devices
US8597489B2 (en) * 2010-07-08 2013-12-03 General Electric Company Method, apparatus and system for flexible electrochemical processing

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Publication number Priority date Publication date Assignee Title
EP1068921A1 (fr) * 1999-07-14 2001-01-17 Eun Sang Lee Dispositif pour usiner par électrochimie des rainures sur la surface interne d'un palier aérodynamique
WO2002070183A1 (fr) * 2001-03-07 2002-09-12 Robert Bosch Gmbh Procede pour structurer une surface

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Title
See also references of WO2015128501A2 *

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