EP3103895A1 - Aluminum film manufacturing method and manufacturing device - Google Patents
Aluminum film manufacturing method and manufacturing device Download PDFInfo
- Publication number
- EP3103895A1 EP3103895A1 EP15746409.0A EP15746409A EP3103895A1 EP 3103895 A1 EP3103895 A1 EP 3103895A1 EP 15746409 A EP15746409 A EP 15746409A EP 3103895 A1 EP3103895 A1 EP 3103895A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating
- chamber
- substrate
- inert gas
- plating chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 125
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 124
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 53
- 238000007747 plating Methods 0.000 claims abstract description 177
- 229920005989 resin Polymers 0.000 claims abstract description 98
- 239000011347 resin Substances 0.000 claims abstract description 98
- 238000007789 sealing Methods 0.000 claims abstract description 93
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000011261 inert gas Substances 0.000 claims abstract description 56
- 150000003839 salts Chemical class 0.000 claims abstract description 50
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 34
- 239000001301 oxygen Substances 0.000 abstract description 34
- 229910052760 oxygen Inorganic materials 0.000 abstract description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 46
- 229910001873 dinitrogen Inorganic materials 0.000 description 40
- 239000007789 gas Substances 0.000 description 35
- 239000011148 porous material Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 23
- 238000005070 sampling Methods 0.000 description 20
- 239000006260 foam Substances 0.000 description 18
- 239000000725 suspension Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 229910000831 Steel Inorganic materials 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 7
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 7
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 7
- 238000007599 discharging Methods 0.000 description 6
- 239000012799 electrically-conductive coating Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- BMQZYMYBQZGEEY-UHFFFAOYSA-M 1-ethyl-3-methylimidazolium chloride Chemical compound [Cl-].CCN1C=C[N+](C)=C1 BMQZYMYBQZGEEY-UHFFFAOYSA-M 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000004693 imidazolium salts Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- -1 polypropylene Polymers 0.000 description 5
- POKOASTYJWUQJG-UHFFFAOYSA-M 1-butylpyridin-1-ium;chloride Chemical compound [Cl-].CCCC[N+]1=CC=CC=C1 POKOASTYJWUQJG-UHFFFAOYSA-M 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 239000011149 active material Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910017053 inorganic salt Inorganic materials 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UYYXEZMYUOVMPT-UHFFFAOYSA-J 1-ethyl-3-methylimidazol-3-ium;tetrachloroalumanuide Chemical compound [Cl-].Cl[Al](Cl)Cl.CCN1C=C[N+](C)=C1 UYYXEZMYUOVMPT-UHFFFAOYSA-J 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 1
- 229910000625 lithium cobalt oxide Inorganic materials 0.000 description 1
- BFZPBUKRYWOWDV-UHFFFAOYSA-N lithium;oxido(oxo)cobalt Chemical compound [Li+].[O-][Co]=O BFZPBUKRYWOWDV-UHFFFAOYSA-N 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
Definitions
- Aluminum is passivated by the formation of a dense oxide film on its surface to exhibit excellent corrosion resistance. Therefore, corrosion resistance is enhanced by plating surfaces of steel strips and the like with aluminum.
- an aluminum porous body having a three-dimensional mesh-like structure is a promising material for improving the capacity of a positive electrode of a lithium-ion battery.
- an aluminum foil whose surface is coated with an active material, such as lithium cobalt oxide is used as the positive electrode of a lithium-ion battery.
- the positive electrode By forming the positive electrode using a porous body composed of aluminum, the surface area can be increased and the inside of the aluminum porous body can also be filled with the active material. Thereby, even if the thickness of the electrode is increased, the active material utilization ratio does not decrease, and the active material utilization ratio per unit area is improved, enabling improvement in the capacity of the positive electrode.
- the present applicant has proposed, as a manufacturing method for such an aluminum porous body, a method of electroplating a resin molded body having a three-dimensional mesh-like structure with aluminum (refer to Patent Literature 3).
- the existing aluminum molten salt bath needs to be heated to a high temperature. Therefore, when an attempt is made to electroplate the surface of a resin molded body with aluminum, the resin cannot endure the high temperature and melts, which is a problem.
- Patent Literature 2 by mixing an organic chloride salt, such as 1-ethyl-3-methylimidazolium chloride (EMIC) or 1-butylpyridinium chloride (BPC), and aluminum chloride (AlCl 3 ), an aluminum bath that is liquid at room temperature is formed, and it becomes possible to electroplate a resin molded body with aluminum.
- an EMIC-AlCl 3 -based solution exhibits good liquid characteristics and is useful as an aluminum plating solution.
- a molten salt which is a plating solution comes into contact with air, it reacts with and absorbs moisture in air to generate reaction products. As a result, functions required of a plating solution are impaired.
- the molten salt reacts with moisture in air to form hydrogen chloride, causing problems, such as a deterioration in the working environment and corrosion of components of a plating apparatus.
- metallic aluminum is very apt to be oxidized, the aluminum film formed on the surface of a substrate also reacts with a small amount of dissolved oxygen contained in the plating solution to form aluminum oxide. When such reactions occur simultaneously with growth of a plating film, aluminum crystal grains are changed, resulting in problems such as a decrease in the mechanical strength of the plating film and a degradation in electrical conductivity.
- the present inventors have produced an aluminum film manufacturing apparatus, such as the one shown in Fig. 7 , which includes a plating chamber 1 and sealing chambers 4 and 5 disposed in a work piece entrance section and a work piece exit section of the plating chamber 1, each of the sealing chambers 4 and 5 having two pairs of seal rolls and being filled with N 2 gas.
- the N 2 gas pressure in the plating chamber is set to a positive pressure, a resin molded body having a three-dimensional mesh-like structure has been electroplated with aluminum.
- the N 2 gas pressure in the plating chamber is set to a positive pressure
- a manufacturing apparatus for an aluminum film in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a plating chamber; a sealing chamber disposed on the substrate entrance side of the plating chamber and a sealing chamber disposed on the substrate exit side of the plating chamber; an inert gas supply pipe which is provided on the plating chamber and supplies an inert gas into the plating chamber; and an inert gas exhaust pipe which is provided on each of the two sealing chambers and forcibly discharges the inert gas in the sealing chamber.
- the present invention in a manufacturing method and a manufacturing apparatus for an aluminum film in which aluminum is electrodeposited on a substrate using a molten salt electrolytic solution, it is possible to reliably prevent moisture and oxygen from intruding into a plating chamber.
- the present inventors have configured an apparatus such that sealing chambers are disposed on the entrance side and the exit side of a plating chamber containing a plating solution, an exhaust pipe is provided on each of the sealing chambers, and by forcibly discharging an inert gas blowing off from the plating chamber through the exhaust pipe, a gas stream is formed in the sealing chamber. Consequently, it has been possible to prevent intrusion of moisture and oxygen into the plating chamber.
- FIG 8 is a flowchart showing a production process of an aluminum porous body.
- Fig. 9 which corresponds to the flowchart, includes schematic views illustrating the state in which, using, as a core, a porous resin substrate (hereinafter, may be referred to as the "resin porous body") serving as a substrate, an aluminum film is formed.
- a porous resin substrate hereinafter, may be referred to as the "resin porous body”
- Figure 9(a) is an enlarged schematic view showing a surface of a resin porous body having interconnected pores, as an example of a resin porous body. Pores are formed with a resin porous body 31 serving as a skeleton. Next, impartment of electrical conductivity to the surface of the resin porous body 102 is performed. By way of this step, as shown in Fig. 9(b) , a conductive layer 32 composed of an electric conductor is thinly formed on the surface of the resin porous body 1.
- a resin porous body having a three-dimensional mesh-like structure and interconnected pores is prepared.
- any resin can be selected.
- a resin foam molded body of polyurethane, melamine, polypropylene, polyethylene, or the like can be used.
- a resin molded body having any shape can be selected as long as it has continuous pores (interconnected pores).
- a body having a nonwoven fabric-like shape in which resin fibers are entangled with each other can be used instead of the resin foam molded body.
- the resin foam molded body has a porosity of 80% to 98% and a pore diameter of 50 to 500 ⁇ m.
- a urethane foam and a melamine foam have a high porosity, an interconnecting property of pores, and excellent heat decomposability, and thus can be suitably used as a resin foam molded body.
- a carbon coating material as an electrically conductive coating material is prepared.
- a suspension as the electrically conductive coating material preferably contains carbon particles, a binder, a dispersant, and a dispersion medium.
- the suspension In order to perform application of electrically conductive particles uniformly, the suspension needs to maintain a uniformly suspended state. Accordingly, the suspension is preferably maintained at 20°C to 40°C. The reason for this is that, when the temperature of the suspension is lower than 20 °C, the uniformly suspended state is lost, and a layer is formed such that only the binder is concentrated on the surface of the skeleton constituting the mesh-like structure of the resin porous body.
- the layer of carbon particles applied is easily peeled off, and it is difficult to form firmly adhering metal plating.
- the temperature of the suspension exceeds 40°C, the amount of evaporation of the dispersion medium is large, the suspension becomes concentrated as application treatment time passes, and the carbon coating amount is likely to change.
- the particle size of carbon particles is 0.01 to 5 ⁇ m, and preferably 0.01 to 0.5 ⁇ m. When the particle size is large, the particles may clog pores of the resin porous body or block smooth plating. When the particle size is excessively small, it is difficult to secure sufficient electrical conductivity.
- deflector rolls 53 for guiding the strip-shaped resin 51 are appropriately placed.
- the strip-shaped resin 51 having a three-dimensional mesh-like structure is unwound from the supply bobbin 52, guided by a deflector roll 53, and immersed in the suspension 54 in the tank 55.
- the strip-shaped resin 51 immersed in the suspension 54 in the tank 55 is directed upward and travels between the squeezing rolls 57 located above the surface of the suspension 54.
- the distance between the squeezing rolls 57 is smaller than the thickness of the strip-shaped resin 51, and the strip-shaped resin 51 is compressed. Consequently, the excess suspension impregnated in the strip-shaped resin 51 is squeezed out and returns back into the tank 55.
- an organic molten salt which is a eutectic salt of an organic halide and an aluminum halide or an inorganic molten salt which is a eutectic salt of an alkali metal halide and an aluminum halide can be used.
- the resin porous body serving as a substrate can be plated without being decomposed, thus being preferable.
- an imidazolium salt, a pyridinium salt, or the like can be used. Specifically, 1-ethyl-3-methylimidazolium chloride (EMIC) and butylpyridinium chloride (BPC) are preferable.
- EMIC 1-ethyl-3-methylimidazolium chloride
- BPC butylpyridinium chloride
- plating is performed in an inert gas atmosphere, such as nitrogen or argon, and under a sealed environment.
- a seal plate (sealing material) 10 for preventing intrusion of outside air is provided at the substrate entrance of the sealing chamber 4.
- the seal plate is arranged such that the ends thereof are in contact with surfaces of a work piece W, and thereby, outside air is prevented from intruding from the substrate entrance.
- the seal plate can be composed of a material that does not damage the surfaces of the work piece, and is preferably composed of a flexible material.
- a similar seal plate (sealing material) 10 for preventing intrusion of outside air is also provided at the substrate exit of the sealing chamber 5.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
- The present invention relates to a manufacturing method and a manufacturing apparatus for an aluminum film in which a surface of a long, porous resin substrate is electroplated with aluminum to form an aluminum film on the substrate.
- Aluminum is passivated by the formation of a dense oxide film on its surface to exhibit excellent corrosion resistance. Therefore, corrosion resistance is enhanced by plating surfaces of steel strips and the like with aluminum.
- For example, in order to perform aluminum plating on surfaces of a steel strip, first, the steel strip is continuously supplied to a plating chamber, passed around a conductor roll, and made to travel between anodes immersed in a plating solution inside the plating chamber. At this moment, the steel strip itself is electrically connected such that it acts as a cathode. Therefore, electrolysis occurs between the steel strip, which is the cathode, and the anodes, and aluminum is electrodeposited on the surfaces of the steel strip to achieve aluminum plating. The direction of the steel strip travelling in the plating solution is changed by a turn roll, and then, the steel strip travels upward. In this case, plating is also performed between the cathode and the anodes. After the aluminum-plated steel strip leaves the plating chamber, it is passed around another conductor roll and taken out of the system (refer to
Patent Literature 1 and 2). - Furthermore, an aluminum porous body having a three-dimensional mesh-like structure is a promising material for improving the capacity of a positive electrode of a lithium-ion battery. Currently, by utilizing excellent characteristics of aluminum, such as electrical conductivity, corrosion resistance, and lightweight properties, an aluminum foil whose surface is coated with an active material, such as lithium cobalt oxide, is used as the positive electrode of a lithium-ion battery. By forming the positive electrode using a porous body composed of aluminum, the surface area can be increased and the inside of the aluminum porous body can also be filled with the active material. Thereby, even if the thickness of the electrode is increased, the active material utilization ratio does not decrease, and the active material utilization ratio per unit area is improved, enabling improvement in the capacity of the positive electrode.
- The present applicant has proposed, as a manufacturing method for such an aluminum porous body, a method of electroplating a resin molded body having a three-dimensional mesh-like structure with aluminum (refer to Patent Literature 3). The existing aluminum molten salt bath needs to be heated to a high temperature. Therefore, when an attempt is made to electroplate the surface of a resin molded body with aluminum, the resin cannot endure the high temperature and melts, which is a problem. However, according to the method described in
Patent Literature 2, by mixing an organic chloride salt, such as 1-ethyl-3-methylimidazolium chloride (EMIC) or 1-butylpyridinium chloride (BPC), and aluminum chloride (AlCl3), an aluminum bath that is liquid at room temperature is formed, and it becomes possible to electroplate a resin molded body with aluminum. In particular, an EMIC-AlCl3-based solution exhibits good liquid characteristics and is useful as an aluminum plating solution. - In a continuous electroplating apparatus in which a molten salt is used as a plating solution, when the molten salt which is a plating solution comes into contact with air, it reacts with and absorbs moisture in air to generate reaction products. As a result, functions required of a plating solution are impaired. In particular, when a chloride-based molten salt is used for aluminum-based plating, the molten salt reacts with moisture in air to form hydrogen chloride, causing problems, such as a deterioration in the working environment and corrosion of components of a plating apparatus. Furthermore, since metallic aluminum is very apt to be oxidized, the aluminum film formed on the surface of a substrate also reacts with a small amount of dissolved oxygen contained in the plating solution to form aluminum oxide. When such reactions occur simultaneously with growth of a plating film, aluminum crystal grains are changed, resulting in problems such as a decrease in the mechanical strength of the plating film and a degradation in electrical conductivity.
- Accordingly, in a continuous electroplating apparatus in which a molten salt is used as a plating solution, as shown in
Fig. 7 ,sealing chambers plating chamber 1 for a long sheet W (hereinafter also referred to as the "work piece"), and thereby, plating is carried out in a closed system completely blocked off from outside air (refer to Patent Literature 4). -
- PTL 1: Japanese Unexamined Patent Application Publication No.
5-222599 - PTL2: Japanese Unexamined Patent Application Publication No.
5-186892 - PTL 3: Japanese Unexamined Patent Application Publication No.
2012-007233 - PTL 4: Japanese Unexamined Patent Application Publication No.
2000-87287 - The present inventors have produced an aluminum film manufacturing apparatus, such as the one shown in
Fig. 7 , which includes aplating chamber 1 andsealing chambers plating chamber 1, each of thesealing chambers - In view of the problem described above, an object of the present invention is to provide a manufacturing method and a manufacturing apparatus for an aluminum film in which moisture and oxygen do not intrude into a plating chamber.
- The present inventors have performed thorough studies in order to solve the problem described above, and have found that, by providing sealing chambers on the substrate entrance side and substrate exit side of a plating chamber, supplying an inert gas into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and forcibly discharging the inert gas from an inert gas exhaust pipe provided on each of the two sealing chambers, it is possible to prevent intrusion of moisture into the plating chamber. Thus, the present invention has been accomplished.
- In order to solve the problem described above, the present invention employs the following features.
- That is, a manufacturing method for an aluminum film according to the present invention, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a step of transferring the substrate into a plating chamber through a sealing chamber disposed on the entrance side of the plating chamber; a step of electrodepositing an aluminum film on the surface of the substrate in the plating chamber; and a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber through a sealing chamber disposed on the exit side of the plating chamber, in which an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and the inert gas is forcibly discharged from an inert gas exhaust pipe provided on each of the two sealing chambers.
- In another aspect of the present invention, a manufacturing apparatus for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes a plating chamber; a sealing chamber disposed on the substrate entrance side of the plating chamber and a sealing chamber disposed on the substrate exit side of the plating chamber; an inert gas supply pipe which is provided on the plating chamber and supplies an inert gas into the plating chamber; and an inert gas exhaust pipe which is provided on each of the two sealing chambers and forcibly discharges the inert gas in the sealing chamber.
- According to the present invention, in a manufacturing method and a manufacturing apparatus for an aluminum film in which aluminum is electrodeposited on a substrate using a molten salt electrolytic solution, it is possible to reliably prevent moisture and oxygen from intruding into a plating chamber.
-
- [
Fig. 1] Figure 1 is a diagram showing an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - [
Fig. 2] Figure 2 is a diagram showing an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - [
Fig. 3] Figure 3 is a diagram showing an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - [
Fig. 4] Figure 4 is a diagram showing an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - [
Fig. 5] Figure 5 is a diagram showing an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - [
Fig. 6] Figure 6 is a diagram showing an example of a structure of a sealing chamber used in an embodiment of the present invention. - [
Fig. 7] Figure 7 is a diagram showing an aluminum film manufacturing apparatus which does not have the features of the present invention. - [
Fig. 8] Figure 8 is a flowchart showing a production process of an aluminum porous body. - [
Fig. 9] Figure 9 includes cross-sectional schematic views illustrating the production process of an aluminum porous body. - [
Fig. 10] Figure 10 is a diagram illustrating an example of a step of continuously imparting electrical conductivity to surfaces of a resin porous body using an electrically conductive coating material. - [
Fig. 11] Figure 11 is a diagram showing a metal porous body having a three-dimensional mesh-like structure including interconnected pores. - First, contents of embodiments of the present invention will be enumerated and described.
- (1) A manufacturing method for an aluminum film according to an embodiment of the present invention, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes
a step of transferring the substrate into a plating chamber through a sealing chamber disposed on the entrance side of the plating chamber;
a step of electrodepositing an aluminum film on the surface of the substrate in the plating chamber; and
a step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber through a sealing chamber disposed on the exit side of the plating chamber,
in which an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and
the inert gas is forcibly discharged from an inert gas exhaust pipe provided on each of the two sealing chambers.
According to this embodiment, by forcibly discharging moisture and oxygen that have intruded into the sealing chambers by means of an inert gas stream, it is possible to reliably prevent intrusion of moisture and oxygen in outside air into the plating chamber. Therefore, a high-quality aluminum plating film can be obtained, and generation of harmful substances, such as hydrogen chloride, can be prevented. - (2) A manufacturing method for an aluminum film according to an embodiment of the present invention is the manufacturing method for an aluminum film stated in (1) above, in which the inert gas exhaust pipe is provided at the substrate entrance side in the sealing chamber disposed on the entrance side, and the inert gas exhaust pipe is provided at the substrate exit side in the sealing chamber disposed on the exit side.
According to this embodiment, moisture and oxygen intruding from outside into each of the sealing chamber can be discharged together with the inert gas before they intrude into the plating chamber. - (3) A manufacturing method for an aluminum film according to an embodiment of the present invention is the manufacturing method for an aluminum film stated in (1) or (2) above, in which an inert gas supply pipe that supplies an inert gas is further provided on each of the two sealing chambers.
According to this embodiment, since the flow rate of the inert gas in each of the sealing chambers can be increased, it is possible to more reliably prevent intrusion of moisture and oxygen into the plating chamber. - (4) A manufacturing method for an aluminum film according to an embodiment of the present invention is the manufacturing method for an aluminum film stated in (3) above, in which the inert gas supply pipe is provided at the substrate exit side in the sealing chamber disposed on the entrance side, and the inert gas supply pipe is provided at the substrate entrance side in the sealing chamber disposed on the exit side.
According to this embodiment, since the flow rate of the inert gas moving from the plating chamber side toward the exhaust pipe side in each of the sealing chambers can be further increased, it is possible to more reliably prevent intrusion of moisture and oxygen into the plating chamber. - (5) A manufacturing method for an aluminum film according to an embodiment of the present invention is the manufacturing method for an aluminum film stated in any one of (1) to (4) above, in which the substrate entrance and the substrate exit of each of the two sealing chambers are sealed with seal rolls.
According to this embodiment, since the outside air intrusion prevention effect by means of seal rolls is obtained, it is possible to further reliably prevent intrusion of moisture and oxygen into the plating chamber. - (6) A manufacturing apparatus for an aluminum film according to an embodiment of the present invention, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, includes
a plating chamber;
a sealing chamber disposed on the substrate entrance side of the plating chamber and a sealing chamber disposed on the substrate exit side of the plating chamber;
an inert gas supply pipe which is provided on the plating chamber and supplies an inert gas into the plating chamber; and
an inert gas exhaust pipe which is provided on each of the two sealing chambers and forcibly discharges the inert gas in the sealing chamber. - According to this embodiment, by forcibly discharging moisture and oxygen that have intruded into the sealing chambers by means of an inert gas stream, it is possible to reliably prevent intrusion of moisture and oxygen in outside air into the plating chamber. Therefore, a high-quality aluminum plating film can be obtained, and generation of harmful substances, such as hydrogen chloride, can be prevented.
- Note that, in order to prevent the plating solution from mixing with moisture and oxygen, it is necessary to constantly supply the inert gas into the plating chamber or the sealing chambers and forcibly discharge the inert gas in the sealing chambers regardless of the presence or absence of a substrate transferred into the plating chamber. The reasons for this are to prevent a phenomenon in which, when moisture is mixed into the plating solution, the plating solution and moisture react with each other to form reaction products and functions required of a plating solution are impaired, and to prevent a phenomenon in which, when oxygen is mixed into the plating solution, the aluminum film formed during plating reacts with a small amount of dissolved oxygen contained in the plating solution to form aluminum oxide.
- A manufacturing method and a manufacturing apparatus for an aluminum film according to the present invention will be described in detail.
- It is intended that the scope of the present invention is determined not by this but by appended claims, and includes all variations of the equivalent meanings and ranges to the claims.
- In the case where an aluminum film is formed by plating on an ordinary substrate, moisture can be sufficiently blocked by a sealing chamber provided with seal rolls only. However, in the case where a resin molded body having a three-dimensional mesh-like structure (hereinafter, also referred to as the "resin porous body") is electroplated with aluminum, seal rolls alone do not provide a sufficient moisture blocking effect.
- The reason for this is assumed to be that the resin molded body placed between seal rolls is porous with interconnected pores, and moisture and oxygen held in the interconnected pores are introduced into the plating chamber. The other reason for this is assumed to be that because of the concentration gradient between the concentration of moisture and oxygen in the nitrogen atmosphere in the plating chamber and the concentration of moisture or oxygen in outside air, moisture and oxygen pass through the interconnected pores and diffuse into the plating chamber.
- In particular, in the case where a rinsing device is provided at the downstream side of the exit side sealing chamber in order to remove the plating solution remaining on the surface of the substrate having an aluminum film formed thereon, it is assumed that moisture intrudes into the plating chamber because of the phenomenon described above.
- Accordingly, the present inventors have configured an apparatus such that sealing chambers are disposed on the entrance side and the exit side of a plating chamber containing a plating solution, an exhaust pipe is provided on each of the sealing chambers, and by forcibly discharging an inert gas blowing off from the plating chamber through the exhaust pipe, a gas stream is formed in the sealing chamber. Consequently, it has been possible to prevent intrusion of moisture and oxygen into the plating chamber.
- A description will be made on the general outline of steps of producing an aluminum film by electroplating a resin molded body having a three-dimensional mesh-like structure (hereinafter, also referred to as the "resin porous body") with aluminum, and also a detailed description will be made on a specific structure of a sealing chamber in the present invention.
- In a manufacturing apparatus for an aluminum film according to the present invention, a substrate is transferred into a plating solution contained in a plating chamber, and aluminum is electrodeposited on the substrate to form an aluminum film on the substrate.
-
Figure 8 is a flowchart showing a production process of an aluminum porous body. Furthermore,Fig. 9 , which corresponds to the flowchart, includes schematic views illustrating the state in which, using, as a core, a porous resin substrate (hereinafter, may be referred to as the "resin porous body") serving as a substrate, an aluminum film is formed. With reference to the two drawings, the flow of the entire production process will be described. - First, preparation of a resin
porous body 101 is performed.Figure 9(a) is an enlarged schematic view showing a surface of a resin porous body having interconnected pores, as an example of a resin porous body. Pores are formed with a resinporous body 31 serving as a skeleton. Next, impartment of electrical conductivity to the surface of the resinporous body 102 is performed. By way of this step, as shown inFig. 9(b) , aconductive layer 32 composed of an electric conductor is thinly formed on the surface of the resinporous body 1. - Subsequently, aluminum plating in a
molten salt 103 is performed to form analuminum film 33 on the surface of the resin porous body provided with the conductive layer (Fig. 9(c) ). Thereby, an aluminum structure which includes the resin porous body serving as a substrate and thealuminum film 33 formed on the surface thereof is obtained. As necessary, removal of thesubstrate resin 104 from the aluminum structure is performed. - By causing the resin
porous body 31 to disappear by decomposition or the like, an aluminumporous body 33 in which a metal layer only remains can be obtained (Fig. 9(d) ). - The individual steps will be described in order below.
- A resin porous body having a three-dimensional mesh-like structure and interconnected pores is prepared. As the material for the resin porous body, any resin can be selected. For example, a resin foam molded body of polyurethane, melamine, polypropylene, polyethylene, or the like can be used. Although expressed as the resin foam molded body, a resin molded body having any shape can be selected as long as it has continuous pores (interconnected pores). For example, a body having a nonwoven fabric-like shape in which resin fibers are entangled with each other can be used instead of the resin foam molded body. Preferably, the resin foam molded body has a porosity of 80% to 98% and a pore diameter of 50 to 500 µm. A urethane foam and a melamine foam have a high porosity, an interconnecting property of pores, and excellent heat decomposability, and thus can be suitably used as a resin foam molded body.
- A urethane foam is preferable in terms of uniformity of pores, availability, and the like, and a melamine foam is preferable in terms of being able to obtain pores having a small pore diameter.
- In many cases, the resin porous body has residues, such as a foaming agent and unreacted monomers, in the foam production process, and it is preferable to carry out cleaning treatment for the subsequent steps. The substrate resin, which serves as a skeleton, forms a three-dimensional meshes, and thus, as a whole, continuous pores are formed. In the skeleton of the urethane foam, a cross section perpendicular to the direction in which the skeleton extends has a substantially triangular shape. Herein, the porosity is defined by the following formula:
- Furthermore, the pore diameter is determined by a method in which a magnified surface of a resin porous body is obtained by a photomicroscope or the like, the number of pores per inch (25.4 mm) is calculated as the number of cells, and an average value is obtained by the formula: average pore diameter = 25.4 mm/number of cells.
- In order to perform electroplating, the surface of the resin porous body is subjected to electrical conductivity-imparting treatment in advance. In the present invention, electrical conductivity-imparting treatment is carried out by applying an electrically conductive coating material containing electrically conductive particles of carbon or the like to the surface of the resin porous body.
- First, a carbon coating material as an electrically conductive coating material is prepared. A suspension as the electrically conductive coating material preferably contains carbon particles, a binder, a dispersant, and a dispersion medium. In order to perform application of electrically conductive particles uniformly, the suspension needs to maintain a uniformly suspended state. Accordingly, the suspension is preferably maintained at 20°C to 40°C. The reason for this is that, when the temperature of the suspension is lower than 20 °C, the uniformly suspended state is lost, and a layer is formed such that only the binder is concentrated on the surface of the skeleton constituting the mesh-like structure of the resin porous body. In this case, the layer of carbon particles applied is easily peeled off, and it is difficult to form firmly adhering metal plating. On the other hand, when the temperature of the suspension exceeds 40°C, the amount of evaporation of the dispersion medium is large, the suspension becomes concentrated as application treatment time passes, and the carbon coating amount is likely to change. Furthermore, the particle size of carbon particles is 0.01 to 5 µm, and preferably 0.01 to 0.5 µm. When the particle size is large, the particles may clog pores of the resin porous body or block smooth plating. When the particle size is excessively small, it is difficult to secure sufficient electrical conductivity.
- Application of carbon particles to a resin porous body can be performed by immersing the target resin porous body in the suspension, followed by squeezing and drying.
-
Figure 10 is a schematic diagram showing an example of a structure of treatment equipment that imparts electrical conductivity to a strip-shaped resin porous body serving as a skeleton, which is one example of a practical production process. As shown in the drawing, the equipment includes asupply bobbin 52 that supplies a long substrate resin (hereinafter also referred to as the "strip-shaped resin") 51, atank 55 that contains an electrically conductivecoating material suspension 54, a pair of squeezingrolls 57 placed above thetank 55, a plurality ofhot air nozzles 56 disposed on the sides of the travelling strip-shapedresin 51 in an opposing manner, and a take-upbobbin 58 that takes up the treated strip-shapedresin 51. Furthermore, deflector rolls 53 for guiding the strip-shapedresin 51 are appropriately placed. In the equipment having the structure described above, the strip-shapedresin 51 having a three-dimensional mesh-like structure is unwound from thesupply bobbin 52, guided by adeflector roll 53, and immersed in thesuspension 54 in thetank 55. The strip-shapedresin 51 immersed in thesuspension 54 in thetank 55 is directed upward and travels between the squeezingrolls 57 located above the surface of thesuspension 54. At this stage, the distance between the squeezing rolls 57 is smaller than the thickness of the strip-shapedresin 51, and the strip-shapedresin 51 is compressed. Consequently, the excess suspension impregnated in the strip-shapedresin 51 is squeezed out and returns back into thetank 55. - Subsequently, the travelling direction of the strip-shaped
resin 51 is changed again. Then, the dispersion medium and the like of the suspension are removed by hot air jetted from thehot air nozzles 56 including a plurality of nozzles, and after the strip-shapedresin 51 is thoroughly dried, it is taken up by the take-upbobbin 58. Note that the temperature of hot air jetted from thehot air nozzles 56 is preferably in the range of 40°C to 80°C. By using such equipment, electrical conductivity-imparting treatment can be carried out automatically and continuously, and it is possible to form a skeleton having a mesh-like structure free from clogging and provided with a uniform conductive layer. Therefore, the subsequent step of metal plating can be smoothly performed. - Next, electrolytic plating is performed in a molten salt to form an aluminum film on the surface of the resin porous body.
- By performing aluminum plating in a molten salt bath, it is possible to form a thick aluminum film uniformly, in particular, on the surface of a complex skeleton structure, such as a resin porous body having a three-dimensional mesh-like structure.
- Using the resin porous body the surface of which has been imparted with electrical conductivity as a cathode and aluminum as an anode, a DC current is applied in the molten salt.
- Furthermore, as the molten salt, an organic molten salt which is a eutectic salt of an organic halide and an aluminum halide or an inorganic molten salt which is a eutectic salt of an alkali metal halide and an aluminum halide can be used. When a bath of an organic molten salt which melts at a relatively low temperature is used, the resin porous body serving as a substrate can be plated without being decomposed, thus being preferable. As the organic halide, an imidazolium salt, a pyridinium salt, or the like can be used. Specifically, 1-ethyl-3-methylimidazolium chloride (EMIC) and butylpyridinium chloride (BPC) are preferable.
- When moisture or oxygen is mixed into a molten salt, the molten salt is degraded. Therefore, preferably, plating is performed in an inert gas atmosphere, such as nitrogen or argon, and under a sealed environment.
- As the molten salt bath, a nitrogen-containing molten salt bath is preferable, and in particular, an imidazolium salt bath is preferably used. In the case where a salt that melts at a high temperature is used as the molten salt, dissolution into the molten salt or decomposition of the resin proceeds faster than growth of a plating film, and it is not possible to form a plating film on the surface of the resin porous body. An imidazolium salt bath can be used even at a relatively low temperature without affecting the resin. As the imidazolium salt, a salt containing an imidazolium cation having alkyl groups at the 1-and 3-positions is preferably used. In particular, an aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl3-EMIC)-based molten salt is most preferably used because it has high stability and is unlikely to decompose. It is possible to perform plating on a urethane foam, a melamine foam, or the like. The temperature of the molten salt bath is 10°C to 100°C, and preferably 25°C to 45°C. As the temperature decreases, the current density range in which plating can be performed narrows, and it becomes difficult to perform plating over the entire surface of the resin porous body. At a high temperature exceeding 100°C, a problem of deformation of the resin porous body is likely to occur.
- In molten salt aluminum plating onto a surface of a metal, for the purpose of improving smoothness of the plating surface, addition of an additive, such as xylene, benzene, toluene, or 1,10-phenanthroline, to AlCl3-EMIC has been reported. The present inventors have found that, in particular, in the case where aluminum plating is performed on a resin porous body having a three-dimensional mesh-like structure, addition of 1,10-phenanthroline exhibits particular effects in forming an aluminum porous body. That is, a first feature obtained is that the aluminum skeleton constituting the porous body is unlikely to break, and a second feature obtained is that it is possible to perform plating in which the difference in plating thickness between the surface portion and the interior portion of the porous body is small.
- On the other hand, it is also possible to use an inorganic salt bath as the molten salt within a range that the resin is not dissolved or the like. The inorganic salt bath is typically an AlCl3-XCl (X: alkali metal) binary salt system or multicomponent salt system. In such an inorganic salt bath, although the melting temperature is generally high compared with organic salt baths, such as an imidazolium salt bath, environmental conditions, such as moisture and oxygen, are less limited, and low-cost practical implementation is generally possible. In the case where the resin is a melamine foam, use at a high temperature is possible compared with a urethane foam, and an inorganic salt bath at 60°C to 150°C is used.
-
Figure 1 shows an example of an aluminum film manufacturing apparatus according to an embodiment of the present invention. - The aluminum film manufacturing apparatus includes a
plating chamber 1, an entranceside sealing chamber 4 disposed on the substrate entrance side of theplating chamber 1, and an exitside sealing chamber 5 disposed on the substrate exit side of theplating chamber 1. - A substrate W (hereinafter, also referred to as the "work piece") unwound from a
supply bobbin 20 that sends the substrate passes through the entranceside sealing chamber 4 and is transferred into theplating chamber 1. The work piece W on which an aluminum film has been formed in theplating chamber 1 passes through the exitside sealing chamber 5, is water-washed in arinsing device 22, and then is taken up by a take-upbobbin 21. - As shown in
Fig. 1 , theplating chamber 1 contains ananode 2 and aplating solution 3. Theplating chamber 1 is provided with inertgas supply pipes 6 for supplying an inert gas into theplating chamber 1. Thereby, the inside of the plating chamber is in an inert gas atmosphere and has a positive pressure relative to outside air. The inert gas may be a gas that does not react with the molten salt, such as nitrogen gas or argon gas, and use of nitrogen is preferable from the viewpoint of costs. - A case where nitrogen gas is used as the inert gas will be described below.
- As the
plating chamber 1, any existing plating chamber can be used, and a system in which power supply is performed in the liquid or a system in which power supply is performed outside the liquid may be used. - Although
Fig. 1 shows a plating chamber in which the substrate is transferred in the horizontal direction in the plating chamber, it may be possible to use a type of plating chamber in which an aluminum film is formed while transferring a work piece along the circumferential surface of a transfer drum. -
Figure 1 shows sealing chambers according to an embodiment of the present invention. - A nitrogen
gas exhaust pipe 7 is provided on each of the sealingchambers plating chamber 1 through the nitrogengas exhaust pipe 7, a nitrogen gas stream is formed in each of the sealingchambers gas exhaust pipes 7 are preferably disposed at positions far from the plating chamber. That is, in the entrance side sealing chamber, the nitrogengas exhaust pipe 7 is preferably disposed at a position close to the substrate entrance, and in the exit side sealing chamber, the nitrogengas exhaust pipe 7 is preferably disposed at a position close to the substrate exit. By disposing the nitrogengas exhaust pipes 7 at the positions described above, a gas stream that flows from theplating chamber 1 to the substrate entrance is formed in the entrance side sealing chamber, and a gas stream that flows from theplating chamber 1 to the substrate exits side is formed in the exit side sealing chamber. Therefore, the effect of preventing moisture and oxygen from intruding into the plating chamber is increased. -
Figures 2 and3 show sealing chambers according to other embodiments of the present invention. - In the examples shown in
Figs. 2 and3 , a nitrogengas supply pipe 8 is provided on each of the sealingchambers - By supplying nitrogen gas from the nitrogen
gas supply pipe 8, the flow rate of the gas stream formed in each of the sealingchambers - The nitrogen gas supplied by the nitrogen
gas supply pipe 8 is preferably blown to the work piece in an inclined manner with respect to the work piece. By supplying the nitrogen gas in such a manner, a gas stream moving from theplating chamber 1 side toward the nitrogengas exhaust pipe 7 side is likely to be formed, and moisture and oxygen present in pores of the work piece W are replaced by the nitrogen gas and expelled from the work piece. The moisture and oxygen expelled from the work piece are carried off by the gas stream in the sealing chamber and discharged from theexhaust pipe 7. -
Figures 4 and5 show sealing chambers according to other embodiments of the present invention. - In the example shown in
Fig. 4 , two pairs of seal rolls 9 are provided on each of the sealingchambers Fig. 1 , and in the example shown inFig. 5 , two pairs of seal rolls 9 are provided on each of the sealingchambers Fig. 2 . - By providing such seal rolls on the sealing chambers, it is possible to more effectively prevent moisture and oxygen from intruding into the plating chamber.
- In the example shown in
Fig. 6 , a seal plate (sealing material) 10 for preventing intrusion of outside air is provided at the substrate entrance of the sealingchamber 4. The seal plate is arranged such that the ends thereof are in contact with surfaces of a work piece W, and thereby, outside air is prevented from intruding from the substrate entrance. The seal plate can be composed of a material that does not damage the surfaces of the work piece, and is preferably composed of a flexible material. Furthermore, a similar seal plate (sealing material) 10 for preventing intrusion of outside air is also provided at the substrate exit of the sealingchamber 5. - A plated aluminum structure in which an aluminum film is formed on the surface of the resin porous body is subjected to nitrogen blow to remove the plating solution sufficiently, and then cleaning is performed to obtain an aluminum porous body.
- As a cleaning liquid, although water is usually used, an organic solvent may be used.
- Through the steps described above, an aluminum structure (aluminum porous body) including the resin porous body as a core of the skeleton is obtained. This aluminum structure may be used as a resin-metal composite depending on the intended use, such as for various filters and catalyst carriers. In the case where the aluminum structure is used as a metal structure without including the resin owing to usage environment constraints or the like, the resin may be removed. The removal of the resin can be performed by any method, such as decomposition (dissolution) by an organic solvent, a molten salt, or supercritical water, or decomposition by heating. The method of decomposition by high-temperature heating is simple and easy, but causes oxidation of aluminum. Unlike nickel or the like, aluminum is difficult to be subjected to reduction treatment once it is oxidized. Consequently, for example in the case of use as an electrode material for a battery or the like, electrical conductivity is lost due to oxidation, and therefore, the method of decomposition by high-temperature heating cannot be used.
- Accordingly, it is desirable to use a method in which the resin is removed by decomposition by heating in a molten salt, which will be described below, so as to prevent oxidation of aluminum.
- Decomposition by heating in a molten salt is performed by a method described below. The resin porous body provided with the aluminum film on the surface thereof is immersed in a molten salt, and heating is performed while applying a negative potential to the aluminum film to decompose the resin porous body. When a negative potential is applied in a state in which the resin porous body is immersed in the molten salt, it is possible to decompose the resin porous body without oxidizing aluminum. The heating temperature may be appropriately selected in accordance with the type of resin porous body. It is necessary to carry out treatment at a temperature lower than the melting point (660°C) of aluminum so as not to melt aluminum. A preferred temperature range is 500°C to 600°C. Furthermore, the magnitude of the negative potential to be applied is on the negative side with respect to the reduction potential of aluminum and on the positive side with respect to the reduction potential of cations in the molten salt.
- The molten salt used in the decomposition by heating of the resin may be a halide salt of an alkali metal or alkaline earth metal such that the aluminum electrode potential becomes base. Specifically, preferably, the molten salt contains one or more selected from the group consisting of lithium chloride (LiCl), potassium chloride (KCl), sodium chloride (NaCl), and aluminum chloride (AlCl3). By such a method, it is possible to obtain an aluminum porous body having interconnected pores and having a thin oxide layer on the surface thereof with a low oxygen content.
- The present invention will be described in more detail below on the basis of examples. However, the examples are merely illustrative and the present invention are not limited thereto. It is intended that the scope of the present invention is determined by appended claims, and includes all variations of the equivalent meanings and ranges to the claims.
- Using an aluminum film manufacturing apparatus shown in
Fig. 1 according to an embodiment of the present invention, an aluminum plating film was formed on a porous resin substrate. Plating conditions were set as described below. - As a substrate, a urethane foam having a width of 1 m, a thickness of 1 mm, a porosity of 95% by volume, and a number of pores (cells) per inch of about 50 was prepared. By immersing the urethane foam in a carbon suspension, followed by drying, electrical conductivity was imparted thereto. The carbon suspension was composed of 17% by mass of graphite and carbon black and 7% by mass of a resin binder, and further included a penetrant and an antifoamer. The particle size of the carbon black was 0.5 µm.
- Each of the entrance
side sealing chamber 4 and the exit side sealing chamber had a length of 500 mm and a height of 200 mm. - The gas in each of the sealing chambers was sucked off and forcibly discharged from the
exhaust pipe 7. - Nitrogen gas was supplied from two nitrogen
gas supply pipes 6 of theplating chamber 1 at a flow rate of 4.0 m3/min in total. - Plating conditions were set as follows:
- Composition of plating solution: AlCl3/EMIC = 2 mol/l mol
- Applied current: 1,000 A
- Work piece: urethane foam (
thickness 1 mm, width 1,000 mm, pore diameter 0.5 mm) - Work piece speed: 150 mm/min
- Immersion length of work piece: 2 m
- After the plating apparatus was operated for 24 hours, the atmosphere gas (nitrogen gas) in the plating chamber was collected by suction with an air pump, which was defined as a [sampling gas 1], and the atmosphere gas in the vicinity of the supply bobbin in a room where the plating apparatus was stored (hereinafter referred to as the "general room") was collected by suction with an air pump, which was defined as a [sampling gas 2].
- Regarding the [sampling gas 1], the dew point and the oxygen concentration were analyzed with a dew point meter (capacitance type) and an oxygen concentration meter, respectively.
- Furthermore, regarding the [sampling gas 2], the hydrogen chloride concentration was analyzed with a hydrogen chloride concentration meter.
- The analysis results are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 1 except that an aluminum film manufacturing apparatus provided with seal rolls 9 shown in
Fig. 4 according to an embodiment of the present invention was used, and nitrogen gas was supplied from two nitrogengas supply pipes 6 of theplating chamber 1 at a flow rate of 3.5 m3/min in total. - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 1 except that, in Example 1, the
seal plate 10 shown inFig. 6 was disposed on each of the substrate entrance side of the sealingchamber 4 and the substrate exit side of the sealingchamber 5, and nitrogen gas was supplied from two nitrogengas supply pipes 6 of the plating chamber at a flow rate of 3.5 m3/min in total. - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 1 except that an aluminum film manufacturing apparatus shown in
Fig. 2 according to an embodiment of the present invention was used, nitrogen gas was supplied from two nitrogengas supply pipes 6 of theplating chamber 1 at a flow rate of 3.3 m3/min in total, and nitrogen gas was supplied from nitrogengas supply pipes 8 of the sealingchambers - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 1 except that an aluminum film manufacturing apparatus provided with seal rolls 9 shown in
Fig. 5 according to an embodiment of the present invention was used, nitrogen gas was supplied from two nitrogengas supply pipes 6 of theplating chamber 1 at a flow rate of 3.0 m3/min in total, and nitrogen gas was supplied from nitrogengas supply pipes 8 of the sealingchambers - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 1 except that, in Example 1, the gas in each of the sealing
chamber gas exhaust pipe 7. - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 2 except that, in Example 2, the gas in each of the sealing
chamber gas exhaust pipe 7. - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 3 except that, in Example 3, the gas in each of the sealing
chamber gas exhaust pipe 7. - The analysis results for the sampling gases are shown in Table 1.
- A plating apparatus was operated and sampling gases were collected as in Example 4 except that, in Example 4, the gas in each of the sealing
chamber gas exhaust pipe 7. - The analysis results for the sampling gases are shown in Table 1.
- A plating chamber oxygen concentration of less than 0.5% is considered to be within an acceptable range.
- A plating chamber dew point of lower than -30°C is considered to be within an acceptable range.
- When the HCl concentration is less than 0.1 ppm, it is considered that there is no leakage.
[Table 1] Conditions in sealing chambers Conditions in plating chamber Evaluation results Discharging Seal rolls Seal plates N2 flow rate total [m3/min] N2 flow rate total [m3/min] HCl leakage to general room Plating chamber oxygen concentration [vol%] Plating chamber dew point [°C] Example 1 Performed Absent Absent 0 4.0 None 0.40% -34°C Example 2 Performed Present Absent 0 3.5 None 0.20% -40°C Example 3 Performed Absent Present 0 3.5 None 0.20% -39°C Example 4 Performed Absent Absent 0.2 3.3 None 0.20% -42°C Example 5 Performed Present Present 0.2 3.0 None 0.10% -46°C Comparative Example 1 Not performed Absent Absent 0 4.0 Occurred 19.50% +9.5°C Comparative Example 2 Not performed Present Absent 0 3.5 Occurred 0.80% -28°C Comparative Example 3 Not performed Absent Present 0 3.5 Occurred 1.00% -25°C Comparative Example 4 Not performed Absent Absent 0.2 3.3 Occurred 0.70% -39°C -
- 1
- plating chamber
- 2
- anode
- 3
- plating solution
- 4
- entrance side sealing chamber
- 5
- exit side sealing chamber
- 6
- inert gas (nitrogen gas) supply pipe
- 7
- inert gas (nitrogen gas) exhaust pipe
- 8
- inert gas (nitrogen gas) supply pipe
- 9
- seal roll
- 10
- seal plate
- 11
- hold-down roll
- 12
- power supply roll
- 13
- transfer roll
- 14
- storage tank
- 15
- pump
- 20
- supply bobbin
- 21
- take-up bobbin
- 22
- rinsing device
- 31
- resin porous body
- 32
- conductive layer
- 33
- aluminum film
- 51
- long, porous resin substrate (strip-shaped resin)
- 52
- supply bobbin
- 53
- deflector roll
- 54
- electrically conductive coating material suspension
- 55
- tank
- 56
- hot air nozzle
- 57
- squeezing roll
- 58
- take-up bobbin
- W
- work piece
Claims (6)
- A manufacturing method for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, comprising:a step of transferring the substrate into a plating chamber through a sealing chamber disposed on the entrance side of the plating chamber;a step of electrodepositing an aluminum film on the surface of the substrate in the plating chamber; anda step of transferring the substrate having the aluminum film electrodeposited thereon from the plating chamber through a sealing chamber disposed on the exit side of the plating chamber,wherein an inert gas is supplied into the plating chamber such that the plating chamber has a positive pressure relative to outside air, and
the inert gas is forcibly discharged from an inert gas exhaust pipe provided on each of the two sealing chambers. - The manufacturing method for an aluminum film according to Claim 1, wherein the inert gas exhaust pipe is provided at the substrate entrance side in the sealing chamber disposed on the entrance side, and
the inert gas exhaust pipe is provided at the substrate exit side in the sealing chamber disposed on the exit side. - The manufacturing method for an aluminum film according to Claim 1 or 2, wherein an inert gas supply pipe that supplies an inert gas is further provided on each of the two sealing chambers.
- The manufacturing method for an aluminum film according to Claim 3, wherein the inert gas supply pipe is provided at the substrate exit side in the sealing chamber disposed on the entrance side, and the inert gas supply pipe is provided at the substrate entrance side in the sealing chamber disposed on the exit side.
- The manufacturing method for an aluminum film according to any one of Claims 1 to 4, wherein the substrate entrance and the substrate exit of each of the two sealing chambers are sealed with seal rolls.
- A manufacturing apparatus for an aluminum film, in which aluminum is electrodeposited on a surface of a long, porous resin substrate imparted with electrical conductivity in a molten salt electrolytic solution, comprising:a plating chamber;a sealing chamber disposed on the substrate entrance side of the plating chamber and a sealing chamber disposed on the substrate exit side of the plating chamber;an inert gas supply pipe which is provided on the plating chamber and supplies an inert gas into the plating chamber; andan inert gas exhaust pipe which is provided on each of the two sealing chambers and forcibly discharges the inert gas in the sealing chamber.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014019935 | 2014-02-05 | ||
PCT/JP2015/051983 WO2015118977A1 (en) | 2014-02-05 | 2015-01-26 | Aluminum film manufacturing method and manufacturing device |
Publications (3)
Publication Number | Publication Date |
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EP3103895A1 true EP3103895A1 (en) | 2016-12-14 |
EP3103895A4 EP3103895A4 (en) | 2017-02-22 |
EP3103895B1 EP3103895B1 (en) | 2018-07-18 |
Family
ID=53777784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP15746409.0A Active EP3103895B1 (en) | 2014-02-05 | 2015-01-26 | Aluminum film manufacturing method |
Country Status (6)
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US (1) | US20170002474A1 (en) |
EP (1) | EP3103895B1 (en) |
JP (1) | JP6447928B2 (en) |
KR (1) | KR20160119089A (en) |
CN (1) | CN105980606A (en) |
WO (1) | WO2015118977A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3336224A1 (en) * | 2016-12-16 | 2018-06-20 | Hamilton Sundstrand Corporation | Electroplating systems and methods |
EP3421644A1 (en) * | 2017-06-28 | 2019-01-02 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6868375B2 (en) * | 2016-11-22 | 2021-05-12 | 株式会社Uacj | Electrolytic aluminum foil and its manufacturing method |
JP6860339B2 (en) * | 2016-12-16 | 2021-04-14 | 株式会社Uacj | Electrolytic aluminum foil manufacturing method and manufacturing equipment |
US11261533B2 (en) * | 2017-02-10 | 2022-03-01 | Applied Materials, Inc. | Aluminum plating at low temperature with high efficiency |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE26223E (en) * | 1960-06-09 | 1967-06-20 | Base materials coated with an alloy of aujmtnum and manganese | |
JPS61213389A (en) * | 1985-03-18 | 1986-09-22 | Sumitomo Metal Ind Ltd | Electroplating device by molten salt bath |
JPH0317292A (en) * | 1989-06-14 | 1991-01-25 | Nisshin Steel Co Ltd | Aluminum electroplating apparatus with molten salt bath |
JPH04329898A (en) * | 1991-05-07 | 1992-11-18 | Sumitomo Metal Ind Ltd | Device for continuous fused salt electrolytic plating |
JP2806116B2 (en) | 1992-01-10 | 1998-09-30 | 住友金属工業 株式会社 | Molten salt electroplating equipment |
JP2943484B2 (en) | 1992-02-17 | 1999-08-30 | 住友金属工業株式会社 | Method and apparatus for hot-dip plating of aluminum |
JP2000087287A (en) | 1998-09-11 | 2000-03-28 | Sumitomo Metal Ind Ltd | Liquid circulating device between sealed vessels and method therefor |
JP2002030480A (en) * | 2000-07-11 | 2002-01-31 | Casio Micronics Co Ltd | Plating method and device therefor |
JP2012007233A (en) | 2010-04-22 | 2012-01-12 | Sumitomo Electric Ind Ltd | Method for manufacturing aluminum structure and the aluminum structure |
JP5803301B2 (en) * | 2011-06-08 | 2015-11-04 | 住友電気工業株式会社 | Method and apparatus for manufacturing aluminum porous body |
-
2015
- 2015-01-26 KR KR1020167021351A patent/KR20160119089A/en not_active Application Discontinuation
- 2015-01-26 WO PCT/JP2015/051983 patent/WO2015118977A1/en active Application Filing
- 2015-01-26 CN CN201580007478.XA patent/CN105980606A/en active Pending
- 2015-01-26 US US15/114,871 patent/US20170002474A1/en not_active Abandoned
- 2015-01-26 JP JP2015560925A patent/JP6447928B2/en active Active
- 2015-01-26 EP EP15746409.0A patent/EP3103895B1/en active Active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3336224A1 (en) * | 2016-12-16 | 2018-06-20 | Hamilton Sundstrand Corporation | Electroplating systems and methods |
US10954600B2 (en) | 2016-12-16 | 2021-03-23 | Hamilton Sundstrand Corporation | Electroplating systems and methods |
US11542617B2 (en) | 2016-12-16 | 2023-01-03 | Hamilton Sundstrand Corporation | Electroplating systems and methods |
EP4209623A1 (en) * | 2016-12-16 | 2023-07-12 | Hamilton Sundstrand Corporation | Electroplating systems and methods |
EP3421644A1 (en) * | 2017-06-28 | 2019-01-02 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
US10240245B2 (en) | 2017-06-28 | 2019-03-26 | Honeywell International Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
US11118281B2 (en) | 2017-06-28 | 2021-09-14 | Honeywell Inetrnational Inc. | Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces |
Also Published As
Publication number | Publication date |
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US20170002474A1 (en) | 2017-01-05 |
WO2015118977A1 (en) | 2015-08-13 |
JPWO2015118977A1 (en) | 2017-03-23 |
EP3103895A4 (en) | 2017-02-22 |
KR20160119089A (en) | 2016-10-12 |
CN105980606A (en) | 2016-09-28 |
EP3103895B1 (en) | 2018-07-18 |
JP6447928B2 (en) | 2019-01-09 |
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