EP3103152A1 - DEPOT METALLIQUE PROFOND DANS UNE MATRICE POREUSE PAR PULVERISATION MAGNETRON PULSEE HAUTE PUISSANCE HiPIMS, SUBSTRATS POREUX IMPREGNES DE CATALYSEUR METALLIQUE ET LEURS UTILISATIONS - Google Patents
DEPOT METALLIQUE PROFOND DANS UNE MATRICE POREUSE PAR PULVERISATION MAGNETRON PULSEE HAUTE PUISSANCE HiPIMS, SUBSTRATS POREUX IMPREGNES DE CATALYSEUR METALLIQUE ET LEURS UTILISATIONSInfo
- Publication number
- EP3103152A1 EP3103152A1 EP15704254.0A EP15704254A EP3103152A1 EP 3103152 A1 EP3103152 A1 EP 3103152A1 EP 15704254 A EP15704254 A EP 15704254A EP 3103152 A1 EP3103152 A1 EP 3103152A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- metal catalyst
- porous
- metal
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 156
- 239000003054 catalyst Substances 0.000 title claims abstract description 102
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 102
- 239000002184 metal Substances 0.000 title claims abstract description 102
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 title abstract description 4
- 239000011159 matrix material Substances 0.000 title description 10
- 238000001465 metallisation Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 80
- 239000000446 fuel Substances 0.000 claims abstract description 24
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 13
- 150000003624 transition metals Chemical class 0.000 claims abstract description 13
- 230000010287 polarization Effects 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 33
- 229910052799 carbon Inorganic materials 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 20
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 17
- 239000011148 porous material Substances 0.000 claims description 14
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 13
- 229910052786 argon Inorganic materials 0.000 claims description 9
- 230000003247 decreasing effect Effects 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 7
- 239000003863 metallic catalyst Substances 0.000 claims description 6
- 239000003014 ion exchange membrane Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 65
- 229910052697 platinum Inorganic materials 0.000 description 31
- 239000010410 layer Substances 0.000 description 26
- 239000012071 phase Substances 0.000 description 23
- 238000000151 deposition Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- 230000003197 catalytic effect Effects 0.000 description 14
- 230000008021 deposition Effects 0.000 description 13
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 13
- 238000000429 assembly Methods 0.000 description 10
- 230000000712 assembly Effects 0.000 description 10
- 238000005137 deposition process Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000035515 penetration Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000007750 plasma spraying Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910003087 TiOx Inorganic materials 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 238000006555 catalytic reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003487 electrochemical reaction Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- 239000002134 carbon nanofiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910002064 alloy oxide Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- ATTFYOXEMHAYAX-UHFFFAOYSA-N magnesium nickel Chemical compound [Mg].[Ni] ATTFYOXEMHAYAX-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- ZMCCBULBRKMZTH-UHFFFAOYSA-N molybdenum platinum Chemical compound [Mo].[Pt] ZMCCBULBRKMZTH-UHFFFAOYSA-N 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- CFQCIHVMOFOCGH-UHFFFAOYSA-N platinum ruthenium Chemical compound [Ru].[Pt] CFQCIHVMOFOCGH-UHFFFAOYSA-N 0.000 description 1
- FHMDYDAXYDRBGZ-UHFFFAOYSA-N platinum tin Chemical compound [Sn].[Pt] FHMDYDAXYDRBGZ-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/8636—Inert electrodes with catalytic activity, e.g. for fuel cells with a gradient in another property than porosity
- H01M4/8642—Gradient in composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/88—Processes of manufacture
- H01M4/8825—Methods for deposition of the catalytic active composition
- H01M4/8867—Vapour deposition
- H01M4/8871—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/90—Selection of catalytic material
- H01M4/9041—Metals or alloys
- H01M4/905—Metals or alloys specially used in fuel cell operating at high temperature, e.g. SOFC
- H01M4/9058—Metals or alloys specially used in fuel cell operating at high temperature, e.g. SOFC of noble metals or noble-metal based alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M8/1007—Fuel cells with solid electrolytes with both reactants being gaseous or vaporised
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
- G01N27/16—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by burning or catalytic oxidation of surrounding material to be tested, e.g. of gas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- the invention relates to porous substrates impregnated with metal catalyst, in particular intended for use as an electrode in a fuel cell such as a proton exchange membrane cell, and more particularly to their method of preparation.
- the necessary condition for the implementation of these electrochemical reactions is the coexistence in the same place of fuel or oxidant (H 2 or O 2 respectively) with a proton conductor and an electronic conductor, all in the presence of the catalyst.
- This singularity is called triple point.
- the catalytic activity at this triple point is then strongly dependent on the amount of the catalyst, its size, its morphology, and its dispersion within the support. It is thus understood that it is advantageous to obtain a catalytic contact surface at the maximum triple point for a given mass of metal.
- the use of dispersed nanoparticles to catalyze the chemical transformation process is fully of interest.
- Thin film deposition processes such as magnetron sputtering, belonging to the family of vapor phase deposition (PVD) processes, have already made it possible to considerably reduce the quantities of catalyst used while maintaining a very catalytic activity. high.
- PVD vapor phase deposition
- This relates to a method for depositing on a substrate a thin metal alloy layer by simultaneous magnetron sputtering of at least two targets which are placed in a chamber containing a plasmagenic gaseous medium and at least one of which contains at least two said elements of the alloy to be deposited, each of the targets being supplied independently of one another by an electric power generator and the obtained substrate coated with a metal alloy in thin film form comprising at least four elements; said alloy being: - an amorphous alloy containing in atomic percentage, at least 50% of the elements Ti and Zr, the proportion of Ti being zero; or a high entropy alloy consisting of solid solutions whose microstructure contains nanocrystallites inserted in a matrix and whose elements are chosen from the group consisting of Al, Co, Cr, Cu, Fe, Ni, Si, Mn, Mo, V, Zr and Ti.
- the international application WO 2009/083472 relates to a method for manufacturing a solid oxide solid oxide fuel cell comprising at least one anode (2), an electrolyte (1) and a cathode (3), said method comprising at least the following steps of magnetron sputtering of an electrolyte (1) on a first electrode (2) and magnetron sputtering deposition of a second electrode (3) on the electrolyte (1) characterized in that at at least one catalyst is incorporated in the first electrode (2) and / or the second electrode (3) during their deposition.
- - Plasma spraying in a vacuum chamber on a gas-diffusing substrate is deposited on a first porous carbon electrode, this electrode also comprising a catalyst, the catalyst being used to accelerate at least one of the chemical reactions taking place in the fuel cell,
- this membrane made of an ionically conductive material is deposited on this first electrode, this membrane preferably having a thickness of less than 20 microns, and
- a second porous carbon electrode is deposited by plasma spraying in a vacuum chamber on the membrane, this second electrode also comprising a catalyst.
- the catalytic support is a porous layer of 500 nm to 20 ⁇ thick, consisting of a matrix of nanoparticles of carbon and PTFE chosen in proportion, which allows a good management of the produced water and the arrival of gases to the catalyst.
- the increase in the amount of catalyst thus deposited necessarily induces the gradual formation of a continuous metal layer on the surface of the support. From a threshold value, depositing more catalyst becomes useless or counterproductive depending on the chosen deposit method.
- the international application WO 2007/063244 relates to a method of manufacturing, by depositing on a carbon electrode support for producing a fuel cell, comprising the steps of depositing alternately and / or simultaneously by plasma spraying in a chamber in vacuum, porous carbon and a catalyst, the thickness of each porous carbon layer (40) being selected such that the catalyst deposited on this carbon layer diffuses through substantially all of this layer, thereby creating a catalyzed carbon layer .
- the total thickness of carbon catalyzed in the electrode is less than 2 micrometers, and preferably at most 1 micrometer.
- the French application FR 2 843 896 relates to a porous substrate (4) containing a metal phase (2) with a concentration gradient, this metallic phase extending into the substrate from a surface thereof, this substrate being characterized in that the concentration of the metal phase varies as a function of the depth in the substrate, this depth being counted from the surface of the substrate.
- the metal phase (2) extends in the substrate (4) to a thickness of less than or equal to 10 ⁇ .
- the application FR 2 843 896 also describes a manufacturing method including a plasma spraying step, especially at high frequency (1-100 MHz) for the synthesis of a metal phase extending in a porous substrate.
- a metal target is sprayed by a plasma deposition process and the atomized atoms condense on the substrate.
- they form on the substrate a continuous layer gradually closing the pores of the substrate, and thus preventing the penetration of newly atomized atoms into the depth of the substrate.
- a strong concentration gradient is thus obtained using a high frequency plasma spraying method as described in the invention.
- the appearance of this continuous layer decreases the active surface of the catalyst and therefore its catalytic activity when it is used as an electrode in a fuel cell.
- Rabat et al discloses porous substrates comprising a plasma deposited metal catalyst.
- the products described are carbon supports coated with a matrix of carbon of columnar structure, and comprising a metal catalyst. Both porous monolayer and multilayer substrates (in catalyst) are described.
- the position of the maximum concentration of catalyst is at the extreme surface, and is not adjustable.
- the substrate obtained can not be considered as an "impregnated" substrate within the meaning of the present invention (see page 10 lines 16-20).
- Coutanceau et al (ECS Transactions, January 2011, pp 1151-1159) describes porous substrates of graphitized carbon ("graphitized”) impregnated with platinum catalyst. However, Coutanceau et al does not mention a concentration gradient. In addition, the maximum concentration of platinum is on the surface of the substrate (see page 1154, lines 6-7).
- WO2011 / 036729 discloses a substrate comprising a thin catalyst layer comprising transition metal alloy oxides (nickel-aluminum or nickel-magnesium).
- the thin layer has a thickness of between 5 and 500 nm.
- the substrate on which the thin layer is sprayed is not porous.
- the process for obtaining the catalysts of WO2011 / 036729 is not an impregnation process: the porous matrix and the metallic phase are either deposited on the support simultaneously, or the large-diameter particles are coated by the catalyst. then used to develop the porous matrix and incidentally the catalytic layer. Thus, in the region of high concentration, all the pores of the porous matrix are lined with catalysts.
- novel porous substrates impregnated with a metal catalyst having improved catalytic performance for the same or less amount of metal especially for applications as fuel cell electrodes. More particularly, novel porous substrates impregnated with a metal catalyst having a larger effective surface area for the same or less amount of metal are desired.
- Such substrates can be obtained by a high power pulsed magnetron sputtering method (HiPIMS or HPPMS), coupled to the polarization of the substrate on which atomized atoms of the target are deposited.
- HiPIMS high power pulsed magnetron sputtering method
- HPPMS high power pulsed magnetron sputtering method
- Such a method of vapor deposition confers novel spray regimes, in particular on the proportion of ionized metal vapor leading to significant changes in the deposition on its support.
- the use of this method combined with the polarization of the substrate allows the modification and modulation of the catalytic deposition profile on the depth.
- the method according to the invention also has the advantage of not necessitating intrinsically modifying the pre-existing deposition installations. No radio frequency loop should be added in the enclosure for example.
- the present invention therefore relates to a porous substrate impregnated with a metal catalyst, characterized in that the metal catalyst is chosen from transition metals and their alloys, and in that the concentration profile of the metal phase in the porous substrate varies. in the depth with a maximum metal phase concentration between the surface and the maximum depth, with a gradient of increasing concentration of the surface at the maximum concentration and a gradient of concentration decreasing from the maximum concentration to the maximum depth.
- the present invention also relates to a process for impregnating a porous metallic catalyst substrate by high-power pulsed magnetron sputtering of one or more metal targets, the target (s) and the substrate being placed in an enclosure containing a plasmagenic gaseous medium, the metal of the target (s) being chosen from transition metals and their alloys, said process comprising the following steps: a) application of a voltage U t drawn from the target b) polarization of the porous substrate by applying a voltage U s pulsed with a delay ⁇ from the beginning of step (a).
- the present invention also relates to a porous substrate impregnated with a metal catalyst that can be obtained by the process according to the present invention, characterized in that the metal catalyst is chosen from transition metals and their alloys, and that the The concentration profile of the metal phase in the porous substrate varies in depth with a maximum concentration of metal phase located between the surface and the maximum depth, with a gradient of increasing concentration of the surface at the maximum concentration and a gradient of concentration decreasing from maximum concentration to maximum depth.
- porous substrate impregnated with metal catalyst according to the present invention as an electrode in a fuel cell, preferably of the ion-exchange membrane type, or as a reactive gas sensor, preferably flammable.
- the present invention also relates to a fuel cell, preferably of the ion exchange membrane type, comprising a porous substrate impregnated with metal catalyst according to the invention, in particular as an electrode.
- FIG. 1 represents an example of an experimental device adapted for the implementation of the invention:
- the high voltage generator assembly electrically connected to a polarizable substrate holder with degrees of freedom in rotation and in translation; - The system allowing the switching of the high voltage coming from the built-in High Voltage generator (in red) on a time chosen and synchronized on the time of the HiPIMS tap;
- FIG. 1 furthermore proposes a simplified representation of the physical mechanisms occurring during the process according to the invention for the particular case of sputtering a platinum target with argon gas.
- FIG. 2 diagrammatically represents the possible regulation of the polarization on the time dimension via the switching module of the high voltage.
- the ordinate axis represents the applied voltage (U s or U t ) in Volts. The values given correspond to a particular embodiment of the invention and can not be considered as limiting.
- the abscissa axis represents the time (in ⁇ ).
- the two diagrams show the voltage U t (thick line down to a value of approximately -1200V) of duration ⁇ , as well as the pulse U s applied to the substrate (fine line down to a value of about -5000V) with a pulse duration ⁇ .
- the first diagram illustrates the offset ⁇ with which the voltage Us is applied (an example in solid line and an example in dotted lines).
- the second diagram illustrates the duration during which the voltage Us is applied to the substrate (an example in solid lines and an example in dotted lines).
- FIG. 3 represents the measurements of the ion current collected on the substrate gate resolved as a function of time (abscissa axis in ⁇ ) and the HiPIMS voltage applied to the magnetron (left ordinate axis, voltage U t expressed in V) and the intensity of the current (right ordinate axis, expressed in A) during the process as implemented in Example 1.
- the substrate holder is positioned at 50 mm from the target to be sprayed and the duration ⁇ of the HiPIMS pulse is 100 ⁇ .
- the shaded area corresponds to unmeasured values.
- FIG. 4 represents the RBS peaks corresponding to the platinum visible in the high energy part of the RBS spectra (Rutherford backscattering spectroscopy or Rutherford Backscattering Spectroscopy) made for the same quantity of platinum deposited on the same carbon substrate according to various methods described in FIG. Example 2.
- the dotted line corresponds to a deposit by the so-called conventional method (DCMS).
- the dashed line corresponds to a deposit by the HiPIMS method at 1500 V without polarization of the substrate.
- the line in solid lines corresponds to a deposit by the HiPIMS method at 1500 V negative polarization of the substrate at 600 volts.
- the abscissa axis represents the energy in keV, and the ordinate axis the number of alpha particles collected by the detector (number of shots). This axis is representative of the depth of the probed area of the sample. The depth probed increases as the energy of the alpha particles decreases.
- FIG. 5 represents the polarization curves of the three different assemblies according to Example 3 at 2 bars absolute and 70 ° C.
- the abscissa represents the current density in mA / cm 2 .
- the y-axis (right) represents the power density in mW / cm 2 ), and the other y-axis (left) represents the cell voltage in Volt.
- the curve obtained with the material obtained by the DCMS method is represented by squares
- the curve obtained with the material obtained by the HiPIMS method without polarization is represented by triangles
- the curve obtained with the material obtained according to the method of the present invention is represented by circles.
- FIG. 6 represents the polarization curves of the three different assemblies according to Example 3 at 3 bars absolute and 70 ° C.
- the abscissa represents the current density in mA / cm 2 .
- the y-axis (right) represents the power density in mW / cm2), and the other y-axis (left) represents the cell voltage in Volt.
- the curve obtained with the material obtained according to the DCMS process is represented by squares
- the curve obtained with the material obtained by the HiPIMS method without polarization is represented by triangles
- the curve obtained with the material obtained according to the method of the present invention is represented by circles.
- a gain of more than 80% in terms of current density and therefore in terms of power density at 0.65 volts is observed for the assembly with the cathode "HiPIMS + deposit polarization" (cathode according to the invention) by compared to the case of a cathode obtained by a conventional DCMS deposition process.
- the term "porous substrate” means substrates whose porosity is open.
- the pore size, of any shape, is greater than 2 nm, preferably between 20 nm and 5 ⁇ .
- the porosity is between 20 and 80%, preferably between 40 and 60%, particularly preferably it is 50%.
- the specific surface of the porous substrate is greater than 10 m 2 / g, preferably greater than 100 m 2 / g.
- the porosity can be either extremely tortuous or on the contrary very oriented in the surface-depth direction according to the distribution of these pores through the volume.
- This substrate is preferably constituted by a random or non-random stack of micrometric and nanometric objects of any shape, preferably spherical (particle and powders) or elongated (wires and tubes).
- open porosity means a porosity such that the voids form a network and communicate with each other. This porosity is therefore accessible to species coming from the surface of the substrate (pulverized species, water, gas).
- the "specific surface” designates the real surface area of the surface of an object as opposed to its apparent surface. It is generally expressed on the surface per unit mass, in particular in square meters per gram (m 2 -g "1 ) .An open pore therefore participates in the specific surface.”
- Surface "of a material is understood to mean sense of the present invention the "apparent surface” of said material.
- porous carbonaceous substrate means a porous substrate comprising carbon, optionally mixed with other materials.
- porous substrates coated or impregnated with a polymer, in particular fluorinated polymer will be mentioned.
- An example of a particular carbonaceous porous substrate is a porous carbon-based substrate comprising between 5 and 20% by weight of PTFE based on the total weight of the substrate.
- impregnated is meant in the sense of the present invention that the specific surface of the substrate is lined with metal catalyst to a certain depth, that is to say that the walls of the pores of said substrate are lined with catalyst.
- the impregnated substrate therefore comprises a catalyst layer which conforms to a certain extent to the shape of the specific surface of the substrate, without obstructing the surface pores.
- the catalyst is therefore not in the core of the material but only on the surface.
- a substrate impregnated with catalyst according to the present invention is different from a substrate in which the metal catalyst would be implanted.
- the term "implantation” is understood to mean the introduction of an atomic concentration into the material constituting the substrate. This introduction leads to a modification of the structural properties of the solid. Unlike impregnation, the implanted atoms do not cover the specific surface, these atoms are found in matter.
- the term “maximum depth” is understood to mean the depth, starting from the surface of the substrate on which the metal phase (ie in the deposition direction) is deposited, beyond which there is no longer any metal phase in the substrate.
- the present invention refers to a "metal catalyst”.
- this metal catalyst may also be called “metal” or "metallic phase”.
- the term "transition metal” means any element included in columns IV to XII of the Mendeleev table. Platinoid type metals are particularly preferred.
- platinumoid metals is understood to mean platinum, palladium, ruthenium, rhodium, osmium, iridium, platinum-like alloys such as platinum-ruthenium, platinum-molybdenum and platinum-tin, preferably platinum.
- alloy in the sense of the present invention a mixture of at least two metals in all proportions.
- the "high power pulsed magnetron sputtering” (also called HiPIMS) is a method of physical vapor deposition of a magnetron sputtering target.
- HIPIMS spraying uses high power densities, of the order of kW.cm -2 , generally in short pulses of several tens of microseconds at a low duty cycle, generally less than 10%. a high ionization rate of the vapor (or particles) sprayed (sprayed) from the target.
- the HiPIMS regime is different from the Direct Current Magnetron Sputtering (DCMS) mode, pulsed or not.
- the powers involved during the HiPIMS regime can ionize a large proportion of the metallic vapor resulting from the sputtering of the metal target, the ionization rate up to 90% of the metal vapor depending on the target element sprayed (Bohlmark et al., Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 23, 18-22 (2005), Samuelsson et al, Surface and Coatings Technology 205, 591-596 (2010)).
- the term "gradient" means the rate of change of the catalyst concentration per unit length in the substrate, from the surface of the substrate to the depth.
- the present invention relates to a porous substrate impregnated with a metal catalyst, characterized in that the metal catalyst is selected from transition metals and their alloys, and in that the concentration profile of the metal phase in the porous substrate varies in depth with a maximum metal phase concentration between the surface and the maximum depth, with a gradient of increasing concentration of the surface at the maximum concentration and a gradient of concentration decreasing from the maximum concentration to the maximum depth.
- the maximum concentration of metal phase is not at the surface.
- the concentration profile of the metal phase in the porous substrate is therefore particularly original compared to that of the substrates known in the prior art, which generally corresponds to a decreasing gradient from the surface to the depth.
- the substrate according to the present invention thus has a larger effective area than prior art substrates, for which generally a surface layer closes off most open pores, significantly reducing the surface area of catalyst-coated substrate.
- the open porosity of the porous impregnated substrate according to the invention is greater than 70%.
- it is a substrate chosen from:
- metal oxides of doped transitions such as Nb-TiOx, SnO2-TiOx and Ru- TiOx.
- the concentration of the metal phase in the substrate is measured in particular by Rutherford backscattering spectroscopy (RBS).
- RBS Rutherford backscattering spectroscopy
- the porous substrate impregnated with metal catalyst according to the invention comprises less than 100 ⁇ g ⁇ cm -2 of metal catalyst, preferably between 10 and 80 ⁇ g ⁇ cm -2 , more preferably between 20 and 80 ⁇ g ⁇ cm. ⁇ 2 , particularly preferably between 20 and 50 ⁇ g.cm ⁇ 2 or between 25 and 50 ⁇ g.cm "2.
- the porous substrate impregnated with metal catalyst according to the invention comprises 20 ⁇ g.cm " 2 of metal catalyst, especially platinum.
- the present invention also relates to a process for impregnating a porous metal catalyst substrate by high power pulsed magnetron sputtering of one or more metal targets, the target (s) and the substrate being placed in a chamber containing a plasmagenic gaseous medium, the metal of the target (s) being selected from transition metals and their alloys, said method comprising the following steps: a) applying a voltage U t pulsed to the target, b polarization of the porous substrate by applying a voltage U s pulsed with a delay ⁇ from the beginning of step (a).
- the values given for the absolute value of U s and U t correspond to the maximum of the absolute value of the applied voltage.
- the target is made of a transition metal alloy.
- the target is a mosaic target.
- the frequency of the voltage U t applied to the target is between 1 and 100 Hz and the pulse duration ⁇ at the target is between 5 and
- the absolute value of the voltage U s is less than 10 kV, preferably between 0.5 kV and 3 kV.
- the pulse duration ⁇ of the voltage U s to the substrate is between 5 and 200 ⁇ .
- the duration ⁇ + ⁇ is less than or equal to the pulse duration ⁇ .
- the plasmagenic medium is constituted by a gas chosen from the group consisting of helium, neon, argon, krypton, xenon, oxygen and their mixtures, preferably by argon.
- the absolute value of the voltage U t is greater than 400 V, preferably between 700 and 2000 V.
- the delay ⁇ is between 5 and 80% of the pulse duration ⁇ , preferably between 5 and 40%.
- the distance between the target and the substrate is less than 3 times the average free path (lpm) of the ions of the metal catalyst, preferably less than 2 times the average free path of the ions of the metal catalyst, particularly preferably less than free path average ions of the metal catalyst.
- the lpm is an exponentially decreasing function of the pressure - distance product P.d.
- the distance between the target and the substrate is between 10 and 1000 mm, preferably between 20 and 100 mm, preferably between 30 and 60 mm.
- the plasma gas partial pressure in the chamber is between 0.05 Pa and 10 Pa, preferably between 0.1 Pa and 5 Pa.
- the voltage U s applied to the substrate, the pulse duration ⁇ and the delay ⁇ are adjusted continuously during the spraying so as to modulate the deposited catalyst concentration profile.
- the porous substrate impregnated with metal catalyst comprises less than 100 ⁇ g.cm -2 metal catalyst, preferably 10 to 80 ⁇ g.cm -2, more preferably between 20 and 80 ⁇ ⁇ g.cm 2 , particularly preferably between 20 and 50 ⁇ g ⁇ cm -2 or between 25 and 50 ⁇ g ⁇ cm -2 .
- the porous substrate impregnated with metal catalyst according to the invention comprises 20 ⁇ g ⁇ cm -2 of metal catalyst, especially platinum. It will be noted in particular that the process according to the present invention can be carried out at low temperature, which makes it possible not to damage the porous carbon substrate during the process. The process according to the present invention is thus advantageously conducted at a temperature below 150 ° C.
- the method according to the present invention does not require any additional device with respect to a conventional device, in particular the method according to the invention does not require any device that can be disruptive in the entire experimental device, such as for example a radio loop. frequency (internal or external), to obtain a high density of ionic charges.
- a radio loop. frequency internal or external
- the process according to the present invention results in substrates impregnated with a metal catalyst having a greater dispersion of the catalyst at depth.
- Step a) is the sputtering of the target via the application of the HiPIMS voltage, which in the present case and a square signal, is superimposed on a continuous pre-ionisation signal whose amplitude determines the absolute value of the voltage U t (varying for Pt from 700 V to 2000 V).
- the high and low values of the voltage U t that can be applied are specific to the nature of the material to be sprayed.
- This step a) can itself be broken down into several parts.
- the initial discharge makes it possible to ionize the noble gas and to pass it into a so-called plasma state.
- the positive charges, which are the argon ions are then energetically attracted by the negative polarization induced on the magnetron target. The impact of these on the target causes its spraying.
- Step b) relates to the polarization of the substrate.
- the polarization thereof is particularly regulated in voltage and time.
- the polarization voltage U s corresponds to the energy given to the charged species coming from the target and going towards the porous substrate.
- the polarization of the substrate is preferably at least 10 after the HiPIMS pulse on the target to allow the plasma discharge to be established, and the duration of the polarization of the substrate is preferably at least 1 ⁇ .
- the method according to the present invention makes it possible to deposit the metallic catalyst resulting from the spraying more deeply in the porous medium, by a precise control of the deposition in the first instants of the process, allowing an optimal penetration of the deposit in the porous substrate.
- the delay ⁇ and the pulse duration ⁇ are thus essential parameters of the method according to the present invention. Indeed, as the conventional magnetron sputtering deposition continues over time, a thin layer of the pulverized material is formed. However, as indicated above, the formation of this layer obstructs the initially opened pores: the structure of the substrate at the surface is then no longer of the porous type. Deposition on the depth of the pulverized material is then not possible.
- the method according to the present invention thanks to the substrate polarization step, partially avoids the formation of this layer on the surface, and to maintain a large effective surface.
- the present invention also relates to a porous substrate impregnated with a metallic catalyst that can be obtained by the process according to the invention, characterized in that that the metal catalyst is selected from transition metals and their alloys, and that the concentration profile of the metal phase in the porous substrate varies in depth with a maximum metal phase concentration between the surface and the maximum depth. , with a gradient of increasing concentration of the surface at the maximum concentration and a gradient of concentration decreasing from the maximum concentration to the maximum depth.
- the present invention also relates to the use of the porous substrate impregnated with metal catalyst according to the invention as an electrode in a fuel cell, preferably of the ion exchange membrane type.
- the present invention also relates to the use of the porous substrate impregnated with metal catalyst according to the invention as a reactive gas sensor, preferably flammable.
- the present invention also relates to a fuel cell, preferably of the ion exchange membrane (or PEMFC) type, comprising a porous substrate impregnated with metal catalyst according to the invention, in particular as an electrode.
- the battery according to the present invention comprises at least one anode, an electrolyte and a cathode.
- Example 1 Deposition Procedure The example given here concerns the sputtering of a platinum target in HiPIMS mode and in argon gas.
- a Huttinger® brand "TPHS 4002" power generator is directly connected to a magnetron that can accommodate 2 inch (5.08 cm) diameter targets.
- the working pressure of argon gas is regulated at an enclosure pressure of 1 Pa.
- the sample holder is positioned at 50 mm from the target and is electrically connected to an Advanced Energy® "DCpinnacle plus” generator via the high voltage switch synchronized to the power generator.
- the HiPIMS voltage U t chosen is - 1500 volts, and the frequency and the pulse duration HiPIMS are respectively 50 Hz and 100 ⁇ .
- the triggering of the high voltage applied to the substrate U s occurs with a delay of 25 with respect to the triggering of the HiPIMS voltage.
- the total duration of the process is defined to obtain an overall loading of 20 ⁇ g.cm -2 platinum on the carbon substrate
- the carbon substrate used is a microporous substrate called carbon substrate by gas diffusion layer GDL Sigracet 10BC ) in which particles of carbon and PTFE are distributed.
- the RBS spectra obtained make it possible to go back to the atomic masses and the concentrations of the elements as a function of the depth of the sample probed. This technique is particularly indicated in the case of detection of heavy elements such as platinum in a lighter matrix as in the GDL (gas diffusion layer) (microporous carbon).
- the platinum concentration profile on the depth of the microporous substrate obtained by the process according to the present invention differs from that obtained by DCMS sputtering or by a HiPIMS type process. but not including a polarization step of the substrate. Platinum is less present at the extreme surface of the impregnated substrate according to the present invention, but much deeper. This variation is all the more remarkable when the polarization of the substrate U s takes a negative value, here -600 V.
- MEAs membrane-electrode assemblies
- the cathode differs depending on the chosen deposition process.
- the electrolyte selected is a Nfonon® membrane of NRE 21 type 1.
- the anode is largely charged with platinum so that it is not limiting during operation in PEMFC cells. This is obtained by a conventional DCMS type deposition process.
- Table 1 Summary of three different assemblies made and tested on the bench.
- the carbonaceous substrate used is a microporous substrate called carbon substrate by gas diffusion layer GDL (Sigracet 10BC) in which particles of carbon and PTFE are distributed.
- the catalyst used is platinum.
- the substrate obtained by the process known as "HiPIMS + polarization" is the substrate of Example 1.
- the assemblies are all tested under identical conditions: the test cell is a Paxitech® cell of 25 cm 2 , the assemblies are mounted dry and are in direct contact with the bipolar plates of the cell tight to 2 Nm The gases are introduced in the cell without pre-humidification thereof. Finally, the test device provides the possibility of regulating the flow of gases, their pressure in the cell and the temperature thereof.
- the cell containing the cathode from the DCMS deposit serves as a reference in this comparative study.
- OCV open circuit cell voltages
- Table 2 Measurements of the OCVs for the three different assemblies as a function of the gas pressure and the cell reference temperature.
- the polarization curves of each assembly are shown in Figures 6 and 7, for a cell temperature of 70 ° C at the pressure of 2 bar absolute and 3 bar absolute.
- the dispersion of the catalyst in the microporous body also induces better water management on the cathode side of the cell, in particular with a high current density.
- the dispersion of the catalyst can influence the water management in the fuel cell, particularly at the membrane / cathode interface, where the amount of catalyst is lowered in the HiPIMS cathodes.
- the more efficient distribution of the catalyst thus appears to lead to a decrease in the conductivity of the membrane in the mean current density range while the catalytic activity at the beginning of the cycle is improved.
- the process according to the invention leads to an improvement of platinum penetration in porous media as detected by Rutherford backscattering spectroscopy (RBS).
- RBS Rutherford backscattering spectroscopy
- the fuel cell start and the deliverable current density are improved.
- the power density is 80% higher for a cathode obtained by the process.
- the amount of catalyst can be slightly increased (greater than 20 ⁇ g.cm -2 ) without the formation of a dense covering layer limiting the penetration of the catalyst.
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FR1400306A FR3017135B1 (fr) | 2014-02-03 | 2014-02-03 | Depot metallique profond dans une matrice poreuse par pulverisation magnetron pulsee haute puissance hipims, substrats poreux impregnes de catalyseur metallique et leurs utilisations |
PCT/EP2015/052207 WO2015114168A1 (fr) | 2014-02-03 | 2015-02-03 | DEPOT METALLIQUE PROFOND DANS UNE MATRICE POREUSE PAR PULVERISATION MAGNETRON PULSEE HAUTE PUISSANCE HiPIMS, SUBSTRATS POREUX IMPREGNES DE CATALYSEUR METALLIQUE ET LEURS UTILISATIONS |
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