EP3102901A4 - Terminal mobile - Google Patents
Terminal mobile Download PDFInfo
- Publication number
- EP3102901A4 EP3102901A4 EP14881717.4A EP14881717A EP3102901A4 EP 3102901 A4 EP3102901 A4 EP 3102901A4 EP 14881717 A EP14881717 A EP 14881717A EP 3102901 A4 EP3102901 A4 EP 3102901A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- mobile terminal
- mobile
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140012712A KR20150091905A (ko) | 2014-02-04 | 2014-02-04 | 증기 챔버 |
PCT/KR2014/011764 WO2015119366A1 (fr) | 2014-02-04 | 2014-12-03 | Terminal mobile |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3102901A1 EP3102901A1 (fr) | 2016-12-14 |
EP3102901A4 true EP3102901A4 (fr) | 2017-10-18 |
Family
ID=53778142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14881717.4A Withdrawn EP3102901A4 (fr) | 2014-02-04 | 2014-12-03 | Terminal mobile |
Country Status (5)
Country | Link |
---|---|
US (1) | US20160341486A1 (fr) |
EP (1) | EP3102901A4 (fr) |
KR (1) | KR20150091905A (fr) |
CN (1) | CN105940278A (fr) |
WO (1) | WO2015119366A1 (fr) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11026343B1 (en) | 2013-06-20 | 2021-06-01 | Flextronics Ap, Llc | Thermodynamic heat exchanger |
US9374904B2 (en) | 2014-01-10 | 2016-06-21 | i2C Solutions, LLC | Thermal ground planes and light-emitting diodes |
WO2015179089A1 (fr) * | 2014-05-22 | 2015-11-26 | Commscope Technologies Llc | Module amplificateur de chambre à vapeur |
US9826073B2 (en) * | 2014-05-27 | 2017-11-21 | Lg Electronics Inc. | Watch type mobile terminal |
US10698458B2 (en) * | 2014-06-02 | 2020-06-30 | Microsoft Technology Licensing, Llc | Integrated vapor chamber for thermal management of computing devices |
US10458716B2 (en) * | 2014-11-04 | 2019-10-29 | Roccor, Llc | Conformal thermal ground planes |
KR102429811B1 (ko) | 2015-08-13 | 2022-08-08 | 삼성전자주식회사 | 다중 대역 안테나를 포함하는 전자 장치 |
US11059278B2 (en) | 2016-02-28 | 2021-07-13 | Roccor, Llc | Two-phase thermal management devices, methods, and systems |
US10073500B2 (en) * | 2016-10-04 | 2018-09-11 | Google Llc | Vapor chamber with ring geometry |
US20180157297A1 (en) * | 2016-12-07 | 2018-06-07 | Microsoft Technology Licensing, Llc | Thermal management in electronics with metallurgically bonded devices |
CN211903865U (zh) * | 2017-02-07 | 2020-11-10 | 古河电气工业株式会社 | 均热板 |
US10453768B2 (en) | 2017-06-13 | 2019-10-22 | Microsoft Technology Licensing, Llc | Thermal management devices and systems without a separate wicking structure and methods of manufacture and use |
JP6466541B2 (ja) * | 2017-07-12 | 2019-02-06 | エイジア ヴァイタル コンポーネンツ カンパニー リミテッド | 放熱ユニットの製造方法 |
US20190387615A1 (en) * | 2018-06-14 | 2019-12-19 | Microsoft Technology Licensing, Llc | Multi-layer interconnected electro-thermal system having a thermally non-expansive support for mounting positionally related sensor components |
US10823969B1 (en) | 2018-12-14 | 2020-11-03 | Google Llc | Heat transfer through frame component of head-mounted device |
KR20200100973A (ko) * | 2019-02-19 | 2020-08-27 | 삼성전자주식회사 | 열전달 부재 및 이를 포함하는 전자 장치 |
WO2021054953A1 (fr) * | 2019-09-19 | 2021-03-25 | Hewlett-Packard Development Company, L.P. | Composants de châssis |
KR102357788B1 (ko) | 2019-10-30 | 2022-02-07 | 조학래 | 마이크로 채널 진동형 히트파이프이용 주입관없는 스테인레스 박판형 스마트폰 냉각장치 |
EP4089664A4 (fr) * | 2020-01-06 | 2023-11-08 | LG Electronics Inc. | Dispositif d'affichage |
KR102390901B1 (ko) | 2020-04-27 | 2022-04-25 | 엘지전자 주식회사 | 디스플레이 디바이스 |
KR20210138333A (ko) | 2020-05-12 | 2021-11-19 | 한국생산기술연구원 | 분말 사출 성형을 이용한 증기 챔버의 제조방법 |
US11486651B2 (en) * | 2020-08-20 | 2022-11-01 | Huang-Chieh Metal Composite Material Tech. Co., Lt | Vapor chamber |
KR102454071B1 (ko) * | 2020-09-21 | 2022-10-12 | 엘지전자 주식회사 | 디스플레이 디바이스 |
KR20220070859A (ko) * | 2020-11-23 | 2022-05-31 | 삼성전자주식회사 | 열 확산 구조 및 이를 포함하는 전자 장치 |
CN114646232B (zh) * | 2022-02-23 | 2023-09-22 | 太原理工大学 | 一种具有稳定热整流效应的无源热二极管 |
CN114857967B (zh) * | 2022-05-17 | 2024-04-16 | 中国科学院工程热物理研究所 | 超薄均热板及其制备方法、电子设备 |
KR102572046B1 (ko) | 2022-10-07 | 2023-08-29 | 주식회사 화인프리시젼 | 베이퍼챔버 제조장치 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5261861A (en) * | 1975-11-18 | 1977-05-21 | Mitsubishi Heavy Ind Ltd | Manufacturing method of heat pipe |
JPS5687794A (en) * | 1979-12-18 | 1981-07-16 | Fujikura Ltd | Heat pipe |
JP2002022378A (ja) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | ヒートパイプ |
EP1494109A2 (fr) * | 2003-06-09 | 2005-01-05 | Lg Electronics Inc. | Structure de dissipateur de chaleur pour un dispositif mobile |
US20070102070A1 (en) * | 2005-11-07 | 2007-05-10 | 3M Innovative Properties Company | Thermal transfer coating |
US20120008655A1 (en) * | 2010-07-08 | 2012-01-12 | Sony Corporation | Heat sink, method of producing same, and semiconductor laser device |
DE202013007763U1 (de) * | 2013-08-29 | 2013-09-11 | Asia Vital Components Co., Ltd. | Kühlstruktur und tragbares elektronisches Gerät mit dieser Kühlstruktur |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3164518B2 (ja) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | 平面型ヒートパイプ |
TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
JP3659844B2 (ja) * | 1999-09-21 | 2005-06-15 | 株式会社フジクラ | 平板状ヒートパイプ |
US6535386B2 (en) * | 2000-12-05 | 2003-03-18 | Intel Corporation | Electronic assembly having a heat pipe that conducts heat from a semiconductor die |
US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
US7023699B2 (en) * | 2002-06-10 | 2006-04-04 | Visteon Global Technologies, Inc. | Liquid cooled metal thermal stack for high-power dies |
CN1627032A (zh) * | 2003-12-12 | 2005-06-15 | 亚诺超导科技股份有限公司 | 薄板式热管与其制造方法 |
CN100413061C (zh) * | 2004-06-07 | 2008-08-20 | 鸿富锦精密工业(深圳)有限公司 | 一种热管及其制造方法 |
KR100726128B1 (ko) * | 2005-07-22 | 2007-06-12 | 정 현 이 | 영상 투사 기능이 구비된 모바일 단말기 |
CN2903884Y (zh) * | 2006-05-25 | 2007-05-23 | 南京赫特节能环保有限公司 | 金属复合管热管 |
KR100785529B1 (ko) * | 2006-07-31 | 2007-12-13 | 정 현 이 | 제올라이트를 유체전달매체로 이용한 열팽창 전달장치 |
US8069907B2 (en) * | 2007-09-13 | 2011-12-06 | 3M Innovative Properties Company | Flexible heat pipe |
KR100942063B1 (ko) * | 2008-03-03 | 2010-02-11 | 한국생산기술연구원 | 사각 채널형 히트 파이프 |
TW201124068A (en) * | 2009-12-29 | 2011-07-01 | Ying-Tong Chen | Heat dissipating unit having antioxidant nano-film and its method of depositing antioxidant nano-film. |
KR101205715B1 (ko) * | 2010-05-24 | 2012-11-28 | 한국과학기술원 | 플랫형 열 분산기 및 그 제조 방법 |
CN102378547B (zh) * | 2010-08-18 | 2015-07-15 | 中国科学院研究生院 | 均热板 |
CN102811588A (zh) * | 2011-05-30 | 2012-12-05 | 富准精密工业(深圳)有限公司 | 电子设备 |
KR101861278B1 (ko) * | 2012-03-22 | 2018-05-25 | 엘지전자 주식회사 | 이동 단말기 |
KR101969801B1 (ko) * | 2012-05-10 | 2019-04-17 | 엘지전자 주식회사 | 이동 단말기 |
US9042105B2 (en) * | 2012-06-21 | 2015-05-26 | Apple Inc. | Electronic devices with printed circuit boards having padded openings |
KR101994931B1 (ko) * | 2012-07-19 | 2019-07-01 | 삼성전자주식회사 | 기억 장치 |
JP2014185793A (ja) * | 2013-03-22 | 2014-10-02 | Hitachi Metals Ltd | ヒートパイプ及びヒートパイプ用複合材 |
US9247034B2 (en) * | 2013-08-22 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure and handheld electronic device with the heat dissipation structure |
US9244504B2 (en) * | 2013-09-24 | 2016-01-26 | Asia Vital Components Co., Ltd. | Heat dissipation structure for hand-held mobile device |
-
2014
- 2014-02-04 KR KR1020140012712A patent/KR20150091905A/ko not_active Application Discontinuation
- 2014-12-03 EP EP14881717.4A patent/EP3102901A4/fr not_active Withdrawn
- 2014-12-03 US US15/114,699 patent/US20160341486A1/en not_active Abandoned
- 2014-12-03 WO PCT/KR2014/011764 patent/WO2015119366A1/fr active Application Filing
- 2014-12-03 CN CN201480074641.XA patent/CN105940278A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5261861A (en) * | 1975-11-18 | 1977-05-21 | Mitsubishi Heavy Ind Ltd | Manufacturing method of heat pipe |
JPS5687794A (en) * | 1979-12-18 | 1981-07-16 | Fujikura Ltd | Heat pipe |
JP2002022378A (ja) * | 2000-07-06 | 2002-01-23 | Showa Denko Kk | ヒートパイプ |
EP1494109A2 (fr) * | 2003-06-09 | 2005-01-05 | Lg Electronics Inc. | Structure de dissipateur de chaleur pour un dispositif mobile |
US20070102070A1 (en) * | 2005-11-07 | 2007-05-10 | 3M Innovative Properties Company | Thermal transfer coating |
US20120008655A1 (en) * | 2010-07-08 | 2012-01-12 | Sony Corporation | Heat sink, method of producing same, and semiconductor laser device |
DE202013007763U1 (de) * | 2013-08-29 | 2013-09-11 | Asia Vital Components Co., Ltd. | Kühlstruktur und tragbares elektronisches Gerät mit dieser Kühlstruktur |
Non-Patent Citations (1)
Title |
---|
See also references of WO2015119366A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP3102901A1 (fr) | 2016-12-14 |
CN105940278A (zh) | 2016-09-14 |
US20160341486A1 (en) | 2016-11-24 |
KR20150091905A (ko) | 2015-08-12 |
WO2015119366A1 (fr) | 2015-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20160809 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20170918 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H05K 7/20 20060101ALI20170911BHEP Ipc: G06F 1/20 20060101ALI20170911BHEP Ipc: F28D 15/02 20060101AFI20170911BHEP |
|
17Q | First examination report despatched |
Effective date: 20181122 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20190115 |