EP3102901A4 - Mobiles endgerät - Google Patents

Mobiles endgerät Download PDF

Info

Publication number
EP3102901A4
EP3102901A4 EP14881717.4A EP14881717A EP3102901A4 EP 3102901 A4 EP3102901 A4 EP 3102901A4 EP 14881717 A EP14881717 A EP 14881717A EP 3102901 A4 EP3102901 A4 EP 3102901A4
Authority
EP
European Patent Office
Prior art keywords
mobile terminal
mobile
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14881717.4A
Other languages
English (en)
French (fr)
Other versions
EP3102901A1 (de
Inventor
Yongdae Kim
Youngjoo Yee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of EP3102901A1 publication Critical patent/EP3102901A1/de
Publication of EP3102901A4 publication Critical patent/EP3102901A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP14881717.4A 2014-02-04 2014-12-03 Mobiles endgerät Withdrawn EP3102901A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140012712A KR20150091905A (ko) 2014-02-04 2014-02-04 증기 챔버
PCT/KR2014/011764 WO2015119366A1 (en) 2014-02-04 2014-12-03 Mobile terminal

Publications (2)

Publication Number Publication Date
EP3102901A1 EP3102901A1 (de) 2016-12-14
EP3102901A4 true EP3102901A4 (de) 2017-10-18

Family

ID=53778142

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14881717.4A Withdrawn EP3102901A4 (de) 2014-02-04 2014-12-03 Mobiles endgerät

Country Status (5)

Country Link
US (1) US20160341486A1 (de)
EP (1) EP3102901A4 (de)
KR (1) KR20150091905A (de)
CN (1) CN105940278A (de)
WO (1) WO2015119366A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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US11026343B1 (en) 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US9374904B2 (en) 2014-01-10 2016-06-21 i2C Solutions, LLC Thermal ground planes and light-emitting diodes
US10103692B2 (en) * 2014-05-22 2018-10-16 Commscope Technologies Llc Vapor chamber amplifier module
US9826073B2 (en) * 2014-05-27 2017-11-21 Lg Electronics Inc. Watch type mobile terminal
US10698458B2 (en) 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US10458716B2 (en) 2014-11-04 2019-10-29 Roccor, Llc Conformal thermal ground planes
KR102429811B1 (ko) 2015-08-13 2022-08-08 삼성전자주식회사 다중 대역 안테나를 포함하는 전자 장치
US11059278B2 (en) 2016-02-28 2021-07-13 Roccor, Llc Two-phase thermal management devices, methods, and systems
US10073500B2 (en) * 2016-10-04 2018-09-11 Google Llc Vapor chamber with ring geometry
US20180157297A1 (en) * 2016-12-07 2018-06-07 Microsoft Technology Licensing, Llc Thermal management in electronics with metallurgically bonded devices
CN211903865U (zh) * 2017-02-07 2020-11-10 古河电气工业株式会社 均热板
US10453768B2 (en) 2017-06-13 2019-10-22 Microsoft Technology Licensing, Llc Thermal management devices and systems without a separate wicking structure and methods of manufacture and use
JP6466541B2 (ja) * 2017-07-12 2019-02-06 エイジア ヴァイタル コンポーネンツ カンパニー リミテッド 放熱ユニットの製造方法
US20190387615A1 (en) * 2018-06-14 2019-12-19 Microsoft Technology Licensing, Llc Multi-layer interconnected electro-thermal system having a thermally non-expansive support for mounting positionally related sensor components
US10823969B1 (en) 2018-12-14 2020-11-03 Google Llc Heat transfer through frame component of head-mounted device
CN111366021B (zh) * 2018-12-25 2022-05-06 讯凯国际股份有限公司 均温板以及均温板的制作方法
KR102716243B1 (ko) * 2019-02-19 2024-10-11 삼성전자주식회사 열전달 부재 및 이를 포함하는 전자 장치
WO2021054953A1 (en) * 2019-09-19 2021-03-25 Hewlett-Packard Development Company, L.P. Chassis components
KR102357788B1 (ko) 2019-10-30 2022-02-07 조학래 마이크로 채널 진동형 히트파이프이용 주입관없는 스테인레스 박판형 스마트폰 냉각장치
WO2021102686A1 (zh) * 2019-11-26 2021-06-03 鹏鼎控股(深圳)股份有限公司 均温板及其制造方法
WO2021141148A1 (ko) * 2020-01-06 2021-07-15 엘지전자 주식회사 디스플레이 디바이스
KR102390901B1 (ko) * 2020-04-27 2022-04-25 엘지전자 주식회사 디스플레이 디바이스
KR20210138333A (ko) 2020-05-12 2021-11-19 한국생산기술연구원 분말 사출 성형을 이용한 증기 챔버의 제조방법
US11486651B2 (en) * 2020-08-20 2022-11-01 Huang-Chieh Metal Composite Material Tech. Co., Lt Vapor chamber
KR102454071B1 (ko) * 2020-09-21 2022-10-12 엘지전자 주식회사 디스플레이 디바이스
KR102890022B1 (ko) * 2020-11-23 2025-11-25 삼성전자주식회사 열 확산 구조 및 이를 포함하는 전자 장치
KR102865845B1 (ko) * 2021-09-28 2025-09-30 삼성전자주식회사 방열 구조를 포함하는 전자 장치
CN114646232B (zh) * 2022-02-23 2023-09-22 太原理工大学 一种具有稳定热整流效应的无源热二极管
CN114857967B (zh) * 2022-05-17 2024-04-16 中国科学院工程热物理研究所 超薄均热板及其制备方法、电子设备
US20240118036A1 (en) * 2022-10-07 2024-04-11 Samsung Display Co., Ltd. Vapor chamber and display device including the same
KR102572046B1 (ko) 2022-10-07 2023-08-29 주식회사 화인프리시젼 베이퍼챔버 제조장치
KR20240050548A (ko) * 2022-10-11 2024-04-19 삼성디스플레이 주식회사 표시 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261861A (en) * 1975-11-18 1977-05-21 Mitsubishi Heavy Ind Ltd Manufacturing method of heat pipe
JPS5687794A (en) * 1979-12-18 1981-07-16 Fujikura Ltd Heat pipe
JP2002022378A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
EP1494109A2 (de) * 2003-06-09 2005-01-05 Lg Electronics Inc. Wärmesenkestruktur für ein Mobilgerät
US20070102070A1 (en) * 2005-11-07 2007-05-10 3M Innovative Properties Company Thermal transfer coating
US20120008655A1 (en) * 2010-07-08 2012-01-12 Sony Corporation Heat sink, method of producing same, and semiconductor laser device
DE202013007763U1 (de) * 2013-08-29 2013-09-11 Asia Vital Components Co., Ltd. Kühlstruktur und tragbares elektronisches Gerät mit dieser Kühlstruktur

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JP3164518B2 (ja) * 1995-12-21 2001-05-08 古河電気工業株式会社 平面型ヒートパイプ
TW407455B (en) * 1997-12-09 2000-10-01 Diamond Electric Mfg Heat pipe and its processing method
JP3659844B2 (ja) * 1999-09-21 2005-06-15 株式会社フジクラ 平板状ヒートパイプ
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability
JP2003289191A (ja) * 2002-03-28 2003-10-10 Denso Corp 電子制御装置
US7023699B2 (en) * 2002-06-10 2006-04-04 Visteon Global Technologies, Inc. Liquid cooled metal thermal stack for high-power dies
CN1627032A (zh) * 2003-12-12 2005-06-15 亚诺超导科技股份有限公司 薄板式热管与其制造方法
CN100413061C (zh) * 2004-06-07 2008-08-20 鸿富锦精密工业（深圳）有限公司 一种热管及其制造方法
KR100726128B1 (ko) * 2005-07-22 2007-06-12 정 현 이 영상 투사 기능이 구비된 모바일 단말기
CN2903884Y (zh) * 2006-05-25 2007-05-23 南京赫特节能环保有限公司 金属复合管热管
KR100785529B1 (ko) * 2006-07-31 2007-12-13 정 현 이 제올라이트를 유체전달매체로 이용한 열팽창 전달장치
US8069907B2 (en) * 2007-09-13 2011-12-06 3M Innovative Properties Company Flexible heat pipe
KR100942063B1 (ko) * 2008-03-03 2010-02-11 한국생산기술연구원 사각 채널형 히트 파이프
TW201124068A (en) * 2009-12-29 2011-07-01 Ying-Tong Chen Heat dissipating unit having antioxidant nano-film and its method of depositing antioxidant nano-film.
KR101205715B1 (ko) * 2010-05-24 2012-11-28 한국과학기술원 플랫형 열 분산기 및 그 제조 방법
CN102378547B (zh) * 2010-08-18 2015-07-15 中国科学院研究生院 均热板
CN102811588A (zh) * 2011-05-30 2012-12-05 富准精密工业(深圳)有限公司 电子设备
KR101861278B1 (ko) * 2012-03-22 2018-05-25 엘지전자 주식회사 이동 단말기
KR101969801B1 (ko) * 2012-05-10 2019-04-17 엘지전자 주식회사 이동 단말기
US9042105B2 (en) * 2012-06-21 2015-05-26 Apple Inc. Electronic devices with printed circuit boards having padded openings
KR101994931B1 (ko) * 2012-07-19 2019-07-01 삼성전자주식회사 기억 장치
JP2014185793A (ja) * 2013-03-22 2014-10-02 Hitachi Metals Ltd ヒートパイプ及びヒートパイプ用複合材
US9247034B2 (en) * 2013-08-22 2016-01-26 Asia Vital Components Co., Ltd. Heat dissipation structure and handheld electronic device with the heat dissipation structure
US9244504B2 (en) * 2013-09-24 2016-01-26 Asia Vital Components Co., Ltd. Heat dissipation structure for hand-held mobile device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261861A (en) * 1975-11-18 1977-05-21 Mitsubishi Heavy Ind Ltd Manufacturing method of heat pipe
JPS5687794A (en) * 1979-12-18 1981-07-16 Fujikura Ltd Heat pipe
JP2002022378A (ja) * 2000-07-06 2002-01-23 Showa Denko Kk ヒートパイプ
EP1494109A2 (de) * 2003-06-09 2005-01-05 Lg Electronics Inc. Wärmesenkestruktur für ein Mobilgerät
US20070102070A1 (en) * 2005-11-07 2007-05-10 3M Innovative Properties Company Thermal transfer coating
US20120008655A1 (en) * 2010-07-08 2012-01-12 Sony Corporation Heat sink, method of producing same, and semiconductor laser device
DE202013007763U1 (de) * 2013-08-29 2013-09-11 Asia Vital Components Co., Ltd. Kühlstruktur und tragbares elektronisches Gerät mit dieser Kühlstruktur

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015119366A1 *

Also Published As

Publication number Publication date
KR20150091905A (ko) 2015-08-12
US20160341486A1 (en) 2016-11-24
WO2015119366A1 (en) 2015-08-13
CN105940278A (zh) 2016-09-14
EP3102901A1 (de) 2016-12-14

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