EP3100299A1 - Herstellung von halbleiterfolien - Google Patents
Herstellung von halbleiterfolienInfo
- Publication number
- EP3100299A1 EP3100299A1 EP15700636.2A EP15700636A EP3100299A1 EP 3100299 A1 EP3100299 A1 EP 3100299A1 EP 15700636 A EP15700636 A EP 15700636A EP 3100299 A1 EP3100299 A1 EP 3100299A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- oxide
- process according
- semiconductor
- precursors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000002243 precursor Substances 0.000 claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims abstract description 86
- 239000002184 metal Substances 0.000 claims abstract description 85
- 238000000034 method Methods 0.000 claims abstract description 61
- 239000003446 ligand Substances 0.000 claims abstract description 45
- 230000008569 process Effects 0.000 claims abstract description 45
- 239000010408 film Substances 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 37
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 32
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 25
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 25
- 150000002739 metals Chemical class 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 17
- 239000010409 thin film Substances 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 10
- 239000001301 oxygen Substances 0.000 claims abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 54
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 28
- 239000011701 zinc Substances 0.000 claims description 27
- 229910052798 chalcogen Inorganic materials 0.000 claims description 26
- 150000001787 chalcogens Chemical class 0.000 claims description 26
- 239000011135 tin Substances 0.000 claims description 26
- 229910052738 indium Inorganic materials 0.000 claims description 24
- 238000000354 decomposition reaction Methods 0.000 claims description 21
- 229910052733 gallium Inorganic materials 0.000 claims description 19
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 17
- 229910052718 tin Inorganic materials 0.000 claims description 17
- 238000000137 annealing Methods 0.000 claims description 16
- 229910052739 hydrogen Inorganic materials 0.000 claims description 16
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 15
- 239000011787 zinc oxide Substances 0.000 claims description 13
- 150000004696 coordination complex Chemical class 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 238000005987 sulfurization reaction Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052793 cadmium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910003437 indium oxide Inorganic materials 0.000 claims description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 2
- 229910052693 Europium Inorganic materials 0.000 claims description 2
- 229910052765 Lutetium Inorganic materials 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 2
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052735 hafnium Inorganic materials 0.000 claims description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910003455 mixed metal oxide Inorganic materials 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 125000006732 (C1-C15) alkyl group Chemical group 0.000 claims 1
- 150000004703 alkoxides Chemical class 0.000 claims 1
- 150000007942 carboxylates Chemical class 0.000 claims 1
- 239000011669 selenium Substances 0.000 abstract description 43
- 150000004770 chalcogenides Chemical class 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 23
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract description 21
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 12
- 239000011593 sulfur Substances 0.000 abstract description 10
- -1 or more generally Substances 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 43
- 239000010410 layer Substances 0.000 description 42
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 36
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 36
- OKKJLVBELUTLKV-MZCSYVLQSA-N Deuterated methanol Chemical compound [2H]OC([2H])([2H])[2H] OKKJLVBELUTLKV-MZCSYVLQSA-N 0.000 description 32
- 229910001868 water Inorganic materials 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 20
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 18
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 238000001914 filtration Methods 0.000 description 17
- 239000012071 phase Substances 0.000 description 17
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 14
- 238000000921 elemental analysis Methods 0.000 description 14
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 13
- 238000003756 stirring Methods 0.000 description 13
- 238000005160 1H NMR spectroscopy Methods 0.000 description 12
- 239000007983 Tris buffer Substances 0.000 description 12
- 239000000976 ink Substances 0.000 description 12
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 11
- 238000005507 spraying Methods 0.000 description 11
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000006731 degradation reaction Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000006096 absorbing agent Substances 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 8
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- ATDOYFPHCIRHKH-UHFFFAOYSA-N n-hydroxy-2,2-dimethylpropanamide Chemical compound CC(C)(C)C(=O)NO ATDOYFPHCIRHKH-UHFFFAOYSA-N 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 7
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical class C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000003570 air Substances 0.000 description 6
- WLZCAHBBQPTPRQ-UHFFFAOYSA-N n-hydroxy-2-methylpropanamide Chemical compound CC(C)C(=O)NO WLZCAHBBQPTPRQ-UHFFFAOYSA-N 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 238000010345 tape casting Methods 0.000 description 6
- 238000002411 thermogravimetry Methods 0.000 description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 6
- 229910021529 ammonia Inorganic materials 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000005457 optimization Methods 0.000 description 5
- 229910052714 tellurium Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 238000006644 Lossen rearrangement reaction Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000003618 dip coating Methods 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- MHWZQNGIEIYAQJ-UHFFFAOYSA-N molybdenum diselenide Chemical compound [Se]=[Mo]=[Se] MHWZQNGIEIYAQJ-UHFFFAOYSA-N 0.000 description 4
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 150000003346 selenoethers Chemical class 0.000 description 4
- IYKVLICPFCEZOF-UHFFFAOYSA-N selenourea Chemical compound NC(N)=[Se] IYKVLICPFCEZOF-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005118 spray pyrolysis Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 3
- 238000001354 calcination Methods 0.000 description 3
- 239000013522 chelant Substances 0.000 description 3
- 238000000750 constant-initial-state spectroscopy Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- BJPJMTMWIVUMAK-UHFFFAOYSA-N n-hydroxy-n-methylacetamide Chemical compound CN(O)C(C)=O BJPJMTMWIVUMAK-UHFFFAOYSA-N 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 239000003039 volatile agent Substances 0.000 description 3
- JVSFQJZRHXAUGT-UHFFFAOYSA-N 2,2-dimethylpropanoyl chloride Chemical compound CC(C)(C)C(Cl)=O JVSFQJZRHXAUGT-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052951 chalcopyrite Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- NBTOZLQBSIZIKS-UHFFFAOYSA-N methoxide Chemical compound [O-]C NBTOZLQBSIZIKS-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- RNLYVRKMBPOHNI-UNDPIUDWSA-N (2s)-5-(diaminomethylideneamino)-n-[11-[4-[4-[4-[11-[[2-[4-[(2r)-2-hydroxypropyl]triazol-1-yl]acetyl]amino]undecanoyl]piperazin-1-yl]-6-[2-[2-(2-prop-2-ynoxyethoxy)ethoxy]ethylamino]-1,3,5-triazin-2-yl]piperazin-1-yl]-11-oxoundecyl]-2-[4-[(2s)-2-methylbut Chemical compound N1=NC(C[C@@H](C)CC)=CN1[C@@H](CCCN=C(N)N)C(=O)NCCCCCCCCCCC(=O)N1CCN(C=2N=C(N=C(NCCOCCOCCOCC#C)N=2)N2CCN(CC2)C(=O)CCCCCCCCCCNC(=O)CN2N=NC(C[C@@H](C)O)=C2)CC1 RNLYVRKMBPOHNI-UNDPIUDWSA-N 0.000 description 1
- MGOLNIXAPIAKFM-UHFFFAOYSA-N 2-isocyanato-2-methylpropane Chemical compound CC(C)(C)N=C=O MGOLNIXAPIAKFM-UHFFFAOYSA-N 0.000 description 1
- DGMOBVGABMBZSB-UHFFFAOYSA-N 2-methylpropanoyl chloride Chemical compound CC(C)C(Cl)=O DGMOBVGABMBZSB-UHFFFAOYSA-N 0.000 description 1
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- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 241001247986 Calotropis procera Species 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000012691 Cu precursor Substances 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 238000005169 Debye-Scherrer Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- JIRMQEPRKFTWOK-UHFFFAOYSA-L O.O.O.O.O.O.[Zn+2].CC([O-])=O.CC([O-])=O Chemical compound O.O.O.O.O.O.[Zn+2].CC([O-])=O.CC([O-])=O JIRMQEPRKFTWOK-UHFFFAOYSA-L 0.000 description 1
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- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 1
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- 229910052785 arsenic Inorganic materials 0.000 description 1
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- IEQPZXXXPVAXRJ-UHFFFAOYSA-N butylcarbamodithioic acid Chemical compound CCCCNC(S)=S IEQPZXXXPVAXRJ-UHFFFAOYSA-N 0.000 description 1
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- 239000000969 carrier Substances 0.000 description 1
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- 239000000460 chlorine Substances 0.000 description 1
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- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- PCRGAMCZHDYVOL-UHFFFAOYSA-N copper selanylidenetin zinc Chemical compound [Cu].[Zn].[Sn]=[Se] PCRGAMCZHDYVOL-UHFFFAOYSA-N 0.000 description 1
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- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 1
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- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005595 deprotonation Effects 0.000 description 1
- 238000010537 deprotonation reaction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- CMNGAUGWXGMLDK-UHFFFAOYSA-H digallium;trisulfate;hydrate Chemical compound O.[Ga+3].[Ga+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O CMNGAUGWXGMLDK-UHFFFAOYSA-H 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005189 flocculation Methods 0.000 description 1
- 230000016615 flocculation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910021513 gallium hydroxide Inorganic materials 0.000 description 1
- 229940044658 gallium nitrate Drugs 0.000 description 1
- DNUARHPNFXVKEI-UHFFFAOYSA-K gallium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Ga+3] DNUARHPNFXVKEI-UHFFFAOYSA-K 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052595 hematite Inorganic materials 0.000 description 1
- 239000011019 hematite Substances 0.000 description 1
- XUBMPLUQNSSFHO-UHFFFAOYSA-M hydrogen carbonate;tetraethylazanium Chemical compound OC([O-])=O.CC[N+](CC)(CC)CC XUBMPLUQNSSFHO-UHFFFAOYSA-M 0.000 description 1
- RGZRSLKIOCHTSI-UHFFFAOYSA-N hydron;n-methylhydroxylamine;chloride Chemical compound Cl.CNO RGZRSLKIOCHTSI-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LIKBJVNGSGBSGK-UHFFFAOYSA-N iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Fe+3].[Fe+3] LIKBJVNGSGBSGK-UHFFFAOYSA-N 0.000 description 1
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- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003791 organic solvent mixture Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 239000012704 polymeric precursor Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 239000012453 solvate Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000009718 spray deposition Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 238000003419 tautomerization reaction Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- YZYKBQUWMPUVEN-UHFFFAOYSA-N zafuleptine Chemical compound OC(=O)CCCCCC(C(C)C)NCC1=CC=C(F)C=C1 YZYKBQUWMPUVEN-UHFFFAOYSA-N 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- RZLVQBNCHSJZPX-UHFFFAOYSA-L zinc sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Zn+2].[O-]S([O-])(=O)=O RZLVQBNCHSJZPX-UHFFFAOYSA-L 0.000 description 1
- 229910003158 γ-Al2O3 Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
- C01F7/30—Preparation of aluminium oxide or hydroxide by thermal decomposition or by hydrolysis or oxidation of aluminium compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G15/00—Compounds of gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
- C01G19/006—Compounds containing, besides tin, two or more other elements, with the exception of oxygen or hydrogen
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
- C01G19/02—Oxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C01G3/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G49/00—Compounds of iron
- C01G49/02—Oxides; Hydroxides
- C01G49/06—Ferric oxide [Fe2O3]
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/08—Copper compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/02—Iron compounds
- C07F15/025—Iron compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F3/00—Compounds containing elements of Groups 2 or 12 of the Periodic Table
- C07F3/06—Zinc compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/003—Compounds containing elements of Groups 3 or 13 of the Periodic Table without C-Metal linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
- C07F5/06—Aluminium compounds
- C07F5/069—Aluminium compounds without C-aluminium linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/22—Tin compounds
- C07F7/2224—Compounds having one or more tin-oxygen linkages
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
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Definitions
- This invention relates to a precursor material, which can be decomposed to form semiconductors and metal oxides, or more generally, materials for electronic components.
- the precursors comprise metal complexes of hydroxamato ligands.
- the invention further relates to a preparation process for thin inorganic films comprising various metals (e.g. Cu/ln/Zn/Ga/Sn) and oxygen, selenium and/or sulfur.
- the thin films can be used in photovoltaic panels (solar cells), other semiconductor or electronic devices, and other applications using such films.
- the process uses molecular, metal containing precursor complexes with hydroxamato ligands. These can be combined in the process with chalcogenide sources or oxygen.
- various metal oxides and copper-based chalcopyrites of the l-lll-VI 2 type are prepared with high purity at low temperatures.
- Photovoltaic panels are normally made of either crystalline silicon or thin-film cells. Many currently available solar cells are configured as bulk materials that are subsequently cut into wafers and treated in a "top-down" method of synthesis, with silicon being the most prevalent bulk material. In an attempt to make cheaper panels, other materials are configured as thin-films (inorganic layers, organic dyes, and organic polymers) that are deposited on supporting substrates. l-lll-VI 2 -type copper-based semiconductors (chalcopyrite-type) like CulnSe 2
- CISS and CIGS have a direct bandgap that is tuneable by varying the In/Ga ratio or by varying the S/Se ratio to match the solar spectrum.
- CIGS is one of the most promising semiconductors capable to reaching 20.3 % power conversion efficiency in a thin film solar cell device, comparable to multicrystalline solar cells ⁇ Green et al., Prog. Photovoltaics, 2012, 20, 12).
- the Cu(Zn,Sn)(S,Se) 4 (CZTS) based solar cell is another promising low cost alternative that utilizes cheaper and earth abundant elements, with best reported solar cell efficiency of about 11.1 % (Todorov et al. Adv. Energy Mat, 2013, 3, 34-38).
- Solution processing of CIGS and CZTS offer a potential for cost reduction as compared to vacuum based techniques.
- the high efficiency CIGS devices are usually prepared using a complex vacuum based process i.e. 3-stage co- evaporation of metals under a constant source of selenium.
- the challenges include composition uniformity over large areas, precise control of flux/deposition rates to avoid intermediate phases and low material utilization (material also deposits on walls of the vacuum chamber).
- Solution based deposition methods can provide several
- the absorber layer can be solution processed using a particle based ink or precursor based ink or a mixture of both.
- a 12.0 % efficient device has been demonstrated by conversion of Cu(ln,Ga)S2 nanoparticle film to
- Nanosolar utilized binary metal selenides nanoparticles to achieve 15 % efficient device (1 r International Photovoltaic Science and Engineering Conference, Nanosolar Inc., Tokyo, Japan, 2007).
- IBM has demonstrated 15.2 % efficient CIGS device by processing a precursor ink made by dissolving metal selenides and sulfides in hydrazine (Todorov et al. Prog. Photovolt: Res. Appl., 2012, DOI: 10.1002/pip.1253, US 20090145482A1, US 20090121211, WO 1997023004).
- hydrazine is highly toxic and flammable that could limit the use of this method in a large scale manufacturing environment.
- Spray pyrolysis of metal salts like CuCI, InC , GaCI 3 with selenourea or thiourea and their derivatives is also shown to produce metal chalcogenide films.
- Fujdala et al. (US 2011/0030786 A1) reported synthesis of Cux(ln 1-y Gay)v((Si, z Se z )R)w polymeric precursor where elemental ratio and number of repeat units w could be varied and R represents an organic or inorganic ligand.
- Wang et al. dissolved metal oxides in butyldithiocarbamic acid, forming thermally degradable organometallic molecular precursor inks. Using these inks
- Cu(ln,Ga)(S,Se) 2 thin film solar cells exhibited an average efficiency up to 8.8% (Wang et al. Chem. Mater. 2012, 24, 3993).
- ZTO zinc tin oxide
- IZTO indium zinc tin oxide
- Zinc tin oxide can be obtained from anhydrous tin(ll) chloride or tin(ll) acetate and zinc acetate hexahydrate in the presence of bases, such as
- Indium zinc tin oxide is obtained from anhydrous indium chloride, zinc chloride and tin(ll) chloride in ethylene glycol by reaction with sodium hydroxide solution and subsequent calcination at 600°C (D.H. Lee et al. Journal of Materials Chemistry 2009, 19, 3135-3137).
- chalcogen according to this disclosure is limited to sulfur (S), selenium (Se) and to some degree tellurium (Te). Selenium (Se), sulfur (S) and combinations of S and Se are preferred chalcogens.
- a “chalcogen source” is any type of chalcogen or chalcogen containing compound(s).
- metal chalcogenide stands for metal sulfides, metal selenides or metal tellurides, and their combinations.
- metal stands for metals including main group metals, transition metals, lanthanides and germanium.
- a “binary” chalcogenide is one that is composed of a single metal and a chalcogenide, such as ln 2 S 3 or Cu 2 Se.
- a “ternary” chalcogenide means a material composed of two metals and chalcogenide, like CIS (CulnS 2 ) or
- CISS Culn(S,Se)2
- a "quaternary" chalcogenide analogously stands for a material consisting of three metals and chalcogenide, like CIGS.
- “Multinary” chalcogenides stand analogously for a material consisting of even more metals.
- l-lll-VI type semiconductor usually means a ternary chalcogenide mainly comprising metals from the groups 1 (aka IB) and 13 (aka IIIA), and chalcogenide (group 16).
- group 16 a "l-ll/IV-VI" type
- semiconductor means a quaternary chalcogenide mainly comprising metals from the groups 11 (aka IB) and 12 (aka MB), 14 (aka IVA) and chalcogenide
- CIGS copper indium gallium selenide/sulfide of varying elemental distribution, including the presence of other elements in a smaller amount.
- CZTS copper zinc tin selenide of varying elemental distribution. The compounds are often described alternatively by a variable molecular formula like
- the molecular formulae throughout this disclosure include such variations in the elemental distribution.
- sulfur in replacement of selenium, or vice versa, partly or fully can be present.
- other elements can be present, e.g. Ag replacing Cu, or Sn, Zn, Cd in CIGS, or In, Ge, Cd in CZTS, trace elements like Na, Sb, Te, As, etc.
- the ligands are derived from hydroxamic acids and N-substituted hydroxamic acids by deprotonation. The ligands can bind through this central structure as a bidentate chelate ligand, using the oxygen atoms as binding centers.
- metal complexes comprising hydroxamato ligands
- Metals, to which the hydroxamato ligands are bound include, but are not limited to, indium (In), gallium (Ga), zinc (Zn), tin (Sn), aluminium (Al), germanium (Ge), Yttrium (Y), Lutetium (Lu) and Europium (Eu), further iron (Fe), copper (Cu) and cadmium (Cd).
- precursors comprising one or more metal complexes and a chalcogen source are combined, at least one metal complex comprising at least one hydroxamato ligand, and
- the combined precursors are decomposed, preferably in an inert
- precursors comprising a metal complex comprising at least one hydroxamato ligand are decomposed, preferably in an oxygen containing environment, by heating or radiation with formation of the metal oxide.
- a further aspect of this invention is directed to a precursor comprising at least one metal complex with a hydroxamato ligand, and that precursor can be decomposed to form a semiconductor, electronic component or a metal oxide.
- Still another aspect of the invention is directed to a precursor composition comprising at least one metal complex with a hydroxamato ligand and a chalcogen source and that precursor composition can be decomposed to form a semiconductor.
- R 1 is selected from Ci to C15 alkyl, phenyl or benzyl, preferably alkyl, more preferably Ci to C 6 alkyl, and most preferably methyl, ethyl, iso-propyl or tert-butyl.
- R 2 is selected from H, Ci to C 6 alkyls, preferably H, CH 3 or CH 2 CH 3 , and more preferably H.
- the hydroxamato ligand is a chelate ligand with one negative charge. As a chelate ligand it bonds to the metal via the two oxygen atoms. According to this invention the hydroxamate ligand is not to be confused with the neutral hydroxamic acids of formula LH, which also have some ligand properties.
- the preferred mode for decomposition of the precursors is by heating, including baking, micro-waving, UV radiation and thermal radiation.
- chalcogen according to this invention is limited to sulfur (S), selenium (Se) and to some degree tellurium (Te).
- Selenium (Se), sulfur (S) and combinations of S and Se are preferred chalcogens, whereas
- One, preferably two or all of the metal precursors of a precursor composition according to the invention comprise one or more hydroxamato ligand.
- one or more of the metals can be employed as known precursors, including e.g. acetylacetonates, acetates, oximates and other salts.
- the metal complexes are preferably metal hydroxamato complexes comprising the maximum number of hydroxamato ligands depending from their valence.
- a preferred zinc hydroxamate has e.g. the structure Zn(L)2 with two hydroxamate ligands of the formula (L) described above.
- a complex of formula [Zn(L)(LH)] + would be less preferable, since it requires an additional anion.
- the complexes have two, three or more hydroxamato ligands.
- Metals which are preferably used with hydroxamato ligands, include aluminium, gallium, cadmium, copper, germanium, neodymium, ruthenium, magnesium, hafnium, indium, silver, tin, zirconium and zinc, preferably copper, indium, gallium, indium, zinc, aluminium, germanium, or tin.
- the semiconductors containing chalcogenide and which are formed in the process according to the invention are preferably of the I-III-VI2 or I-II/IV-VI2 type.
- the l-lll-VI 2 type semiconductors one or more (+111) valency metals are used, preferably selected from In and Ga, more preferably In and In combined with Ga.
- the monovalent metal is preferably copper.
- the trivalent metals are preferably indium or gallium. Mixtures of these metals can be employed for tuning the band-gap of the semiconductor.
- the tervalent metal can be exchanged partly or completely against a mixture of divalent and tetravalent metals (l-ll/IV-VI 2 -type semiconductor, e.g.
- Divalent metals are preferably cadmium or zinc, tetravalent metals are preferably germanium or tin.
- the metal oxides formed in the process according to the invention are preferably copper oxide, indium oxide, gallium oxide, indium oxide, zinc oxide, aluminium oxide, germanium oxide, tin oxide and mixed metal oxides such as indium tin oxide, indium zinc oxide, gallium zinc oxide, indium gallium zinc oxide, aluminium zinc oxide etc. These metal oxides have various useful applications in electronics as conductors or semiconductors.
- the precursors are preferably combined in a liquid phase, preferably a solvent providing good solubility of the components, and thus complete mixing of the metals with the optional chalcogen source is assured.
- the liquid phase preferably comprises an organic solvent or a mixture of two or more organic solvents. Usually the solvent evaporates quickly when the mixture is applied to a substrate and heated to at least above the boiling point of the solvents.
- the precursor composition is preferably deposited on a substrate prior to decomposition, preferably by dip coating, spray coating, rod coating, spin coating, slit coating, drop casting, doctor blading, ink-jet printing or
- the semiconductor or metal oxide is made by spray pyrolysis.
- the coating step is preferably repeated, intermitted or not by decomposition and /or heating of the material.
- the semiconductor materials consist of almost pure selenide/sulfide phases of the metals.
- a source of chalcogen in the process usually a pure chalcogenide phase is formed.
- the level of impurities of the elements C/N/CI is considerable lower than observed with methods according to prior art.
- the precursors are very stable in solution even at neutral conditions. This is a benefit over solutions made from metal chlorides and thiourea/selenourea which cause flocculation and have a considerable content of halogen. Alternatively an amount of acid or ethanolamine has to be added to stabilize those solutions.
- all of the current process steps can be performed under ambient pressure, which is a great economic benefit over previous vacuum deposition methods.
- the precursor composition consists of a liquid phase containing the precursor materials.
- the liquid phase can easily be processed by transferring it to surfaces to be covered with semiconducting material by spraying, dropping, dipping, printing etc.
- the liquid phase may preferably comprise organic solvents and solvent mixtures, more preferably solvents in which the precursors are soluble, mostly preferred polar-aprotic solvents like dimethylformamide (DMF), dimethyl sulfoxide (DMSO), etc and protic solvents like methanol, ethanol, 2-methoxyethanol, isopropanol etc.
- DMF dimethylformamide
- DMSO dimethyl sulfoxide
- the thermal decomposition temperature of the precursor system according to the invention is as low as 150 °C and the end product after decomposition contains very low amounts of impurity elements like C or N ( ⁇ 1 %).
- the semiconductor layer typically has a thickness of 5 nm to 5 ⁇ , preferably 30 nm to 2 ⁇ .
- the layer thickness is dependent on the coating technique used in each case and the parameters thereof. In the case of spin coating, these are, for example, the speed and duration of rotation. In the case of spraying, the thickness can be increased with spraying time. In the case of rod coating and doctor blading the thickness can be increased by repeated deposition steps.
- the substrate can be either a rigid
- substrate such as glass, ceramic, metal or a plastic substrate, or a flexible substrate, in particular plastic film or metal foil.
- substrate such as glass, ceramic, metal or a plastic substrate, or a flexible substrate, in particular plastic film or metal foil.
- substrate coated with plastic film or metal foil preference is given to the use of a substrate coated with plastic film or metal foil.
- molybdenum which is very effective for the performance of solar cells.
- the present invention furthermore relates to a process for the production of an electronic structure, preferably a device comprising a layered
- Steps a) and b) can be performed concurrently by e.g. spraying on a hot substrate (spray pyrolysis). Repeating of step a) can be intermitted by one or more of steps b), which is preferred.
- the process produces semiconducting or electronic components and optionally the connections of the components in a electronic structure.
- the electronic structure can be part of a photovoltaic device, wherein the absorber layer comprises the produced semiconductor.
- Certain metal oxides made easily accessible by the current invention are useful as transparent conductors or photoconductors.
- photovoltaic device is fabricated by depositing a precursor composition according to the invention, which is preferably solvent-based, onto a substrate and thermally decomposing the one or more precursors to obtain the semiconductor layer.
- a precursor composition according to the invention which is preferably solvent-based
- thermally decomposing the one or more precursors to obtain the semiconductor layer.
- a copper-selenium precursor and an indium precursor are co-deposited and heated in an inert or air environment afterwards in order to obtain a CIS layer.
- the precursor composition comprises relative amounts of the metal precursors which are equivalent to the stoichiometry of the desired semiconductor.
- the precursor composition comprises relative amounts of the metal precursors which are equivalent to the stoichiometry of the desired semiconductor.
- equimolar amounts of copper and indium precursor would be employed.
- the copper and indium precursor ratios can also be adjusted to make either slightly copper poor or copper rich CIS layers. Slightly copper poor CIS compositions have been shown in literature to have better photovoltaic performance (S. Siebentritt et ai, Solar Energy Materials & Solar Cells 2013, 119, 18-25).
- an additional compound comprising S, Se and/or Te and not comprising a metal is added into the process. It may be added at step a) by adding the compound to the combined precursors (the precursor composition) or during/after
- This optional source of S/Se/Te which adds additional chalcogen, is preferably selected from organic compounds comprising selenium or sulphur or elemental selenium, sulphur or tellurium, more preferably from selenourea/thiourea or their derivatives by exchanging hydrogen with other organic groups, thioacetamide, or elemental S/Se/Te dissolved or suspended as a powder in amines (like hydrazine,
- chalcogens Sulfur and selenium are preferred chalcogens in this specification.
- the precursor composition for chalcogenide formation comprises at least an amount of the chalcogen components relative to the amount of metal which is equivalent to the stoichiometry of the desired semiconductor or more.
- an excess amount of the chalcogen can be used, because some of the selenium or sulfur may be lost due to the chalcogen volatility during annealing and decomposing the precursor composition.
- the amount of chalcogen is preferably 100 % (stoichiometric, 0% excess) to 400 % (300 % excess) relative to the theoretical metal content, more preferably 10 - 50 % excess.
- stoichiometric amounts of sulfur and additional selenium is included in the precursor comprising the first metal.
- the precursor composition can be deposited on a "hot" substrate to
- Another method to produce the semiconductor or oxide material or the absorber layer is to deposit the precursor solution onto a substrate held at a temperature below the temperature of decomposition, typically at room temperature. This step is followed by annealing the films preferably in inert environment at the decomposition temperature of the precursors to convert the precursor films into a semiconductor layer, e.g. a CIS layer.
- intermediate step can be the evaporation of the liquid carrier. This method provides more time to evenly distribute the precursor composition in the required form or thickness onto a substrate.
- the precursor composition is spray dried into hot inert gas providing a fine powder or grains of the semiconductor.
- the thermal conversion of the metal complex precursor into the functional semiconductor layer is carried out at a temperature > 150°C, preferably ⁇ 200 °C and more preferably > 300 °C.
- the temperature is preferably between 150 and 400°C. Oxides made by one of the inventive processes may be
- the first decomposition step can be followed by further annealing steps to improve the electronic properties and
- crystallinity and/or grain size of the semiconductor preferably the layer of semiconductor (more preferably CIS or CIGS layer).
- the grain size of the semiconductor film can be increased by increasing the annealing
- the process for the manufacture of a photovoltaic device according to the invention is free of any additional selenization and/or sulfurization step at temperatures above 250 °C. This way the temperatures in a process can be kept at 200 °C or lower.
- the inventive process according to the invention includes as a further step a selenization and/or sulfurization step and/or an annealing step after the decomposition of the precursors.
- the amount of chalcogen in the annealed films can be controlled by the initial chalcogen content in the precursor solution, by the amount and type of chalcogen present in the vapor phase and by the annealing/decomposition temperature and time.
- the conversion of the metal complex precursor or the precursor composition into the functional semiconductor layer is carried out in a further preferred embodiment by irradiation, preferably electromagnetic irradiation, including microwaves, IR, and UV, with preference to UV light at wavelengths ⁇ 400 nm.
- the wavelength is preferably between 150 and 380 nm.
- the advantage of UV irradiation is that the layers produced thereby have lower surface roughness.
- the electronic component is provided with contacts to the semiconductor or metal oxide and completed in a conventional manner.
- a transparent top electrode made from e.g. ZnO or indium-tin oxide and a metal grid is provided.
- Conventional means may be employed to optimize the photovoltaic device performance.
- Selenization/sulfurization (see above), treatment with aqueous cyanide to remove traces of copper selenide or copper sulfide, a
- thioacetamide/lnCl 3 wash for band gap optimization and application of various contact layers may be employed to the
- the present invention furthermore relates to the use of the metal complex or precursor composition according to the invention for the production of one or more functional layers, preferably the absorber layer, in a photovoltaic device.
- the precursors or complexes are formed at room temperature by reaction of a hydroxamic acid with at least one metal salt, such as, for example, nitrates, chlorides, oxichlorides, etc. in the presence of a base, such as, for example, ammonia, tetraethylammonium hydrogencarbonate or sodium
- hydroxamic acids are lower alkyl derivatives (Ci - CQ), wherein the alkyl group can be branched or linear.
- Hydroxamic acids can be prepared in a known manner from the reaction of carbonic acid chlorides with hydroxylamine or N-alkylhydroxylamines or their respective salts.
- GaCI 3 (1.439 g, 8.17 mmol) was dissolved in 20 ml of water, and 17 ml of a 1 molar solution of ammonia was added under stirring.
- pivalohydroxamic acid (2.9 g, 24.8 mmol) in ethanol (60 ml) was added to this mixture, followed by another 7.8 ml of 1 molar ammonia solution. All volatiles were removed under vacuum after stirring the mixture for 20 h at room temperature, and the remainder was extracted with a mixture of 400 ml of CH 2 CI 2 and 100ml of ethanol. The extract was cleared from precipitated NH 4 CI by-product by filtration and evaporated to dryness again. The as- obtained white powder was dissolved in 30 ml of hot ethanol, and 100 ml of water was added. The resulting mixture was concentrated in vacuo on a rotary evaporator until the onset of precipitation.
- Aluminium isopropoxide (1.021 g, 5 mmol) was added under stirring to a hot solution of isobutyrohydroxamic acid (1.547 g, 15 mmol) in dry ethanol (30 ml), and the mixture was heated under reflux for 15min.
- the product precipitated partially as a fine white powder already during the dissolution of the aluminium isopropoxide. More product formed upon cooling, which was collected by filtration after stirring at ambient temperature for 5 h. Washing with 5 ml of ethanol and 2 ⁇ 10 ml of ether afforded 1.545 g (4.64 mmol, 92 %) of white powder after drying in vacuo. Elemental analysis calc. (found) for
- Solid stannous methoxide (1 g, 5.52 mmol) was added in portions to a solution of isobutyrohydroxamic acid (1.14 g, 1 1 .1 mmol) in dry ethanol (40 ml), and the mixture was stirred at 40°C until dissolution was completed.
- White needles formed within 24 h at -20°C after concentration to 20 ml in vacuo and dilution with an equal volume of ether. Filtration, washing with 2 ⁇ 10 ml of ether and drying in vacuo afforded 1 .064 g (3.30 mmol, 60 %).
- Triethylamine (66 ml, 47.92 g, 474 mmol) was added dropwise to a stirred solution of N-methylhydroxylamine hydrochloride (15.87 g, 190 mmol) in methanol (100 ml) at 0-5°C. After stirring for 30 min, acetyl chloride (17.27 g, 15.6 ml, 220 mmol) was slowly added dropwise, and the resulting slurry was allowed to warm to ambient temperature under stirring. 500 ml of ether was added, and the precipitated triethylammonium chloride was removed by filtration and washed with ether (3 x 100 ml).
- TGA Thermogravimetric analysis
- the extrusion of an organoisocyanate from a hydroxamato ligand in course of the proposed decomposition process leaves a hydroxo ligand on the metal center.
- the resulting metal hydroxides will then convert under subsequent condensation into the finally obtained metal oxide phase.
- the proposed Lossen rearrangement mechanism may also account for the fact that pure metal oxide phases are isolated even if the decomposition is carried out in an inert atmosphere.
- the ceramic yields obtained in almost all studied degradation experiments under helium atmosphere approach the expected values for the respective metal oxide phases which were detected by X-ray diffractometry if the annealing was carried out in air (vide infra).
- the deviation from the expected ceramic yield that was obtained in the degradation of both the pivalo- and isobutyrohydroxamato complexes of Ga(lll) does not indicate the Lossen rearrangement mechanism applies here.
- the ceramic yield of the Ga and In derivatives at 600°C falls below the respective theoretic value distinctly, thereby indicating major mass losses due to sublimation of intact molecules, which in turn points to an increased volatility and thermal robustness of the respective precursor complexes.
- This deviating behavior of the N-methyl-acetohydroxamato metal complexes may be ascribed to the fact that the presence of the methyl substituent on the N atom in this ligand will prevent the necessary
- a stock solution of 5 wt % precursor complex concentration with In/Sn ratio of 9 : 1 was prepared by dissolving tris(0,0-isobutyrohydroxamato)indium (1 17 mg, 0.278 mmol) and bis(0,0-isobutyrohydroxamato)tin (10 mg, 0.031 mmol) in 2.64 ml 2-methoxyethanol under moderate warming.
- the solution was filtered through a 0.2 pm PTFE syringe filter after cooling to ambient temperature directly before use.
- Silicon wafer and alkaline-free glass substrates (15 x 15 mm), as well as quartz substrates (10 ⁇ 10 mm), were cleaned by subsequent washing with acetone and isopropanol in an ultrasonicator, followed by air-plasma treatment for 1 min.
- ITO films were prepared by spin-coating of the stock solution onto the respective substrate (1000 rpm for 6 s, 2500 rpm for 20 s), followed by thermal decomposition on a hotplate in ambient air for 5 min at 400 or 450°C, respectively, and subsequent cooling in an argon stream for 10 s.
- Example 20 A photovoltaic CIGS device made from spray coating an ink based on hydroxamato precursors.
- a CIGS precursor ink was made by dissolving Tris(N-methylaceto- hydroxamato)gallium (CH 3 CON(CH 3 )0) 3 Ga (0.375 mmol), Tris(N- methylacetohydroxamato)indium (CH 3 CON(CH 3 )0)3ln (0.7 mmol),
- Diaquabis(2-hydroxyiminopropionato)copper (0.95 mmol) (copper precursor prepared similar to literature M. Aymaretto, Gazzetta Chimica Italiana, 1927, 57, 648; Kirillova et al., Acta Cryst. 2007, E63, m1670) and selenourea (4 mmol) in 5 ml DMSO. A small amount of ethanolamine (0.05 ml) was added to the above solution to prevent the reaction between copper and selenium precursors. A greenish brown solution without any residues was obtained showing complete dissolution of the precursors.
- the precursor ink was sprayed over a 1" ⁇ 1 " molybdenum coated glass substrate kept at 350 °C in a nitrogen environment with oxygen and moisture levels below 5 ppm.
- An about 2.5 ⁇ thick smooth and crack free CIGS film was prepared by spraying.
- the CIGS film was transferred to a graphite box with a lid (not air tight) with a few selenium shots.
- the graphite box assembly was inserted in an argon filled quartz tube and heated in a tube furnace.
- the tube furnace was maintained at 550 °C and selenization is performed for 50 min under vacuum.
- selenium pellets create selenium vapor over the substrate inside the enclosed graphite box and help to promote grain growth and higher crystallinity in the films.
- Figure 5 shows the x-ray diffraction pattern of sprayed and selenized films.
- Figure 5 part (a) shows a broad peak (112) corresponding to nanoparticulate grain size of sprayed Culn x Ga ( i -X )Se 2 film as well as peak from molybdenum substrate.
- the average grain size of sprayed film was calculated to be 8 nm by Debye-Scherrer formula.
- the (112) peak width also decreases significantly due to grain growth. Further smaller peaks such as (101), (211 ) appear showing chalcopyrite phase and higher crystallinity.
- molybdenum selenide (MoSe 2 ) peaks can also be observed in Figure 5 part (b) due to reaction of molybdenum with selenium vapor during selenization.
- the peak intensity for Mo is smaller after selenization showing that significant amount of the molybdenum is converted to molybdenum selenide.
- Figure 6 shows the scanning electron microscopy (SEM) image of the cross- section of the selenized CIGS layer on molybdenum substrate.
- Majority of the grains are large columnar type > 1 ⁇ in size except for a thin layer in the middle of the film that shows nano size grains.
- SEM scanning electron microscopy
- EDS Energy Dispersive Spectrometry
- Copper poor CIGS films are desirable to achieve high quality photovoltaic- grade semiconductor.
- CdS layer ⁇ 50 nm was deposited from a solution method described elsewhere ⁇ M.A. Contreras et al. Thin Solid Films 2002, 403-404, 204-211). ZnO (50 nm) and ITO (300 nm) thin films were deposited sequentially by RF sputtering. Next a 300 nm thick Ag current collection grid was deposited by DC sputtering.
- Figure 7 shows the IV characteristics under dark and AM1.5 light condition for the solar cell comprising the CIGS thin film made from hydroxamato based precursor ink.
- the efficiency of the solar cells can be improved further by optimization of annealing time/temperature, controlling Se/S vapor pressure during sulfurization or selenization, introducing gallium gradients in the CIGS film, optimization of Na and other dopants, optimization of other layers of the device.
- Fig. 1 TGA traces of a: isobutyrohydroxamato (iBuH) metal complexes; b: pivalohydroxamato (PvH) metal complexes; c: N-methyl-acetohydroxamato (MeAcH) metal complexes. All TG experiments were performed under helium atmosphere at a heating rate of 10°C min "1 .
- Fig. 2 X-ray powder diffractograms of pivalohydroxamato metal complexes after annealing at various temperatures.
- Fig. 3 X-ray powder diffractograms of isobutyrohydroxamato metal complexes after annealing at various temperatures.
- the reference spectrum (ICSD) is reproduced on the baseline.
- AI(lll)iBuH the baseline shows alpha and gamma-A ⁇ Os, and the graphs 3 and 4 are in good agreement with the gamma-Al 2 O 3 reference spectrum.
- Fig. 4 X-Ray diffractograms of ten-layer ITO thin films on alkaline-free glass supports annealed at a: 400°C; and b: 450°C, measured in reflection mode.
- Fig. 5 The graphs shows X-ray diffraction patterns (intensity plotted against diffraction angle 2 theta) of films according to the invention for a) CIGS film sprayed using hydroxamato precursor based ink and b) CIGS film after selenization of sprayed CIGS film by replacement of S by Se,
- Fig. 6 This figure shows the scanning electron microscopy (SEM) image of the cross-section of the selenized CIGS layer on molybdenum substrate.
- SEM scanning electron microscopy
- Fig. 7 The graph shows the photovoltaic device response under dark and AM .5 light condition of a CIGS solar cell described in device Example 20.
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