EP3012684A1 - Liquid crystal display - Google Patents
Liquid crystal display Download PDFInfo
- Publication number
- EP3012684A1 EP3012684A1 EP15187273.6A EP15187273A EP3012684A1 EP 3012684 A1 EP3012684 A1 EP 3012684A1 EP 15187273 A EP15187273 A EP 15187273A EP 3012684 A1 EP3012684 A1 EP 3012684A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- liquid crystal
- insulating layer
- disposed
- color filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 93
- 230000000903 blocking effect Effects 0.000 claims abstract description 58
- 239000010408 film Substances 0.000 claims abstract description 54
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000010409 thin film Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 277
- 238000005192 partition Methods 0.000 claims description 55
- 239000012044 organic layer Substances 0.000 claims description 14
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 4
- 239000011229 interlayer Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 229910004205 SiNX Inorganic materials 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 239000011368 organic material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000005684 electric field Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polysiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- G02F1/136222—Colour filters incorporated in the active matrix substrate
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- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/52—RGB geometrical arrangements
Definitions
- the present application relates to a liquid crystal display and a manufacturing method thereof.
- a liquid crystal display as one of flat panel display devices that are being widely used includes two display panels, wherein field generating electrodes such as a pixel electrode and a common electrode are formed with a liquid crystal layer interposed therebetween.
- the liquid crystal display generates an electric field in a liquid crystal layer by applying a voltage to the field generating electrodes to determine orientations of liquid crystal molecules of the liquid crystal layer and control polarization of incident light, thereby displaying an image.
- a technique of forming a cavity in a pixel and filling the cavity with liquid crystals to implement a display has been developed for one of the liquid crystal displays. Although two sheets of substrates are used in a conventional liquid crystal display, this technique forms constituent elements on one substrate, thereby reducing weight, thickness, and the like of the device.
- a process of forming the display by filling the liquid crystal molecules in the microcavities includes a step of forming a capping layer after the liquid crystal molecules are injected.
- the capping layer currently employed it is difficult to sufficiently block external oxygen and moisture, thereby generating a reliability problem.
- Embodiments have been made in an effort to provide a liquid crystal display and a manufacturing method thereof, having features of being capable of improving reliability by blocking external oxygen and moisture.
- An exemplary embodiment provides a liquid crystal display including: a substrate configured to include a display area and a peripheral area; a thin film transistor disposed on the substrate; a pixel electrode connected to the thin film transistor; a roof layer disposed to face the pixel electrode; a capping layer disposed on the roof layer; and a blocking film disposed in the peripheral area to surround a lateral surface of the capping layer, wherein a plurality of microcavities are formed between the pixel electrode and the roof layer in the display area, and the microcavities form a liquid crystal layer including a liquid crystal material, wherein a level of a top surface of the blocking film is higher than that of a top surface of the liquid crystal layer.
- the liquid crystal display may further include, in the display area: a lower insulating layer disposed below the roof layer; and an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, and the blocking film may include an organic/inorganic structure layer disposed to correspond to the lower insulating layer, the roof layer, and the upper insulating layer.
- the term organic/inorganic structure layer may define a structure of several layers with at least one organic and at least one inorganic layer.
- the organic/inorganic structure layer may include a first inorganic layer, an organic layer, and a second inorganic layer, the first inorganic layer may be disposed to correspond to the lower insulating layer, the second inorganic layer may be disposed to correspond to the upper insulating layer, and the organic layer includes at least one color filter.
- the first inorganic layer may be connected to the lower insulating layer, and the second inorganic layer may be connected to the upper insulating layer.
- the organic layer may have a structure at which color filters having different colors are stacked.
- the roof layer may include a color filter.
- the microcavities may be partitioned by a partition portion, and the partition portion may be formed by a color filter having a single color among the color filters.
- the partition portion may be a part formed by filling a space between adjacent microcavities with the color filter having the single color.
- the partition portion may be formed along a direction in which a data line connected to the thin film transistor is extended.
- the second inorganic layer may be disposed to cover a top surface and a lateral surface of the organic layer.
- the liquid crystal display may further include a barrier layer disposed on a top surface of the capping layer, and the barrier layer may include silicon nitride.
- Top surfaces of the capping layer and the blocking film may be disposed at a same level.
- the liquid crystal display may further include: a lower insulating layer disposed below the roof layer; and an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, the blocking film may be an organic/inorganic structure layer including the lower insulating layer extended from the display area, an organic layer, and the upper insulating layer extended from the display area, the organic layer may have a structure at which color filters having different colors may be stacked, and one of the color filters may be connected to the roof layer.
- the liquid crystal display may further include a transparent electrode pattern disposed below the organic/inorganic structure layer.
- the liquid crystal display may further include a sacrificial layer remaining pattern disposed below the organic/inorganic structure layer.
- the blocking film and the roof layers disposed in the display area may be separated from each other.
- An exemplary embodiment provides a manufacturing method of a liquid crystal display, including: forming a thin film transistor on a substrate including a display area and a peripheral area; forming a pixel electrode connected to the thin film transistor; forming a sacrificial layer on the pixel electrode; forming a roof layer on the sacrificial layer disposed in the display area; forming a blocking film disposed in the peripheral area; removing the sacrificial layer to form a plurality of microcavities; forming a liquid crystal layer by injecting a liquid crystal material into the microcavities; and forming a capping layer on the roof layer, wherein the forming of the roof layer and the forming of the blocking film are simultaneously performed.
- the forming of the roof layer may include: forming a first color filter on the sacrificial layer; forming a second color filter on the sacrificial layer; and forming a third color filter on the sacrificial layer, and the forming of the blocking film may include stacking the first color filter, the second color filter, and the third color filter in the peripheral area.
- the manufacturing method may further include: forming a lower insulating layer disposed below the roof layer; and forming an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, and the lower insulating layer and the upper insulating layer formed in the display area may extend to form the blocking film together with a color filter disposed in the peripheral area.
- the forming of the sacrificial layer may include forming an open portion disposed according to a data line connected to the thin film transistor, and the open portion may be filled with one of the first color filter, the second color filter, and the third color filter.
- the color filter that fills the open portion may form a partition portion, and the partition portion may partition the microcavities.
- the blocking film may be formed to have a top surface of which a level is higher than that of a top surface of the liquid crystal layer.
- the color filter disposed in the peripheral area may be connected to one of the first color filter, the second color filter, and the third color filter.
- the manufacturing method may further include forming a transparent electrode pattern disposed below the blocking film.
- the forming of the sacrificial layer may further include forming a sacrificial layer remaining pattern in the peripheral area.
- the manufacturing method may further include forming a barrier layer on a top surface of the capping layer, and the barrier layer may include silicon nitride.
- Top surfaces of the capping layer and the blocking film may be disposed at a same level.
- the forming of the roof layer may include forming the roof layer separated from the blocking film.
- the exemplary embodiments it is possible to block moisture and oxygen from penetrating into an edge of a display area by forming a blocking film at a peripheral area to improve the reliability of elements. Further, since the blocking film is formed in the same process when an organic film and an inorganic film are formed at the display area, no additional mask is required.
- FIG. 1 is a top plan view partially illustrating a peripheral area PA and a display area DA in a liquid crystal display according to an exemplary embodiment.
- FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1 .
- the liquid crystal display may include a liquid crystal panel assembly 400, a gate driver (not shown) and a data driver (not shown) connected thereto, a gray voltage generator (not shown) connected to the data driver, a light source unit (not shown) emitting light to the liquid crystal panel assembly 400, a light source driver (not shown) controlling the light source unit, and a signal controller (not shown) controlling them.
- the gate driver or the data driver may be formed on the liquid crystal panel assembly 400, and may be formed as a separate integrated circuit chip.
- a substrate 110 of the liquid crystal panel assembly 400 includes the display area DA and the peripheral area PA positioned to surround the display area DA.
- the display region DA is a region where an actual image is outputted, and in the peripheral region PA, the aforementioned gate driver or data driver is formed, or a gate pad portion 121P, a data pad portion 171P including a gate pad, a data pad, or the like, which is a portion connected to an external circuit, is positioned.
- the gate pad is a wide portion positioned at an end of a gate line 121
- the data pad is a wide portion positioned at an end of a data line 171.
- the liquid crystal display according to the present exemplary embodiment includes a first inorganic layer, sometimes called a lower insulating layer 350, an organic film in which color filters R, G, and B are stacked in the peripheral area PA, and a blocking film EB including a second inorganic layer, sometimes called an upper insulating layer 370.
- the first inorganic layer indicates an inorganic film that is disposed in the display area DA and is extended to be positioned in the peripheral area PA.
- the second inorganic layer indicates an inorganic film that is disposed in the display area DA and is extended to be positioned in the peripheral area PA.
- the blocking film EB having both organic films and inorganic films is described.
- the inventive concept is not limited thereto.
- at least one of the inorganic films may be omitted.
- the lower insulating layer 350 and the upper insulating layer 370 of the inorganic films included in the blocking film EB may include silicon nitride (SiNx).
- the inorganic film included in the blocking film EB may further include a third interlayer insulating layer 180c disposed below the lower insulating layer 350 disposed in the peripheral area PA.
- a roof layer formed as a color filter 230 is disposed on a microcavity 305 serving as a space corresponding to the liquid crystal layer including liquid crystal molecules 310, and a capping layer 390 is disposed on the roof layer.
- a level of a top surface of the blocking film EB may be higher than that of the liquid crystal layer including liquid crystal molecules 310, and the blocking film EB has such a structure so as to surround a lateral surface of the capping layer 390.
- the liquid crystal display according to the present exemplary embodiment as an outer circumferential portion of the display area DA is surrounded by the blocking film EB, moisture and oxygen can be prevented from penetrating into a lateral surface of the display area DA. As a result, it is possible to prevent reliability reduction of elements of the liquid crystal display.
- the roof layer is formed at a portion corresponding to the microcavity 305 to include one color filter.
- the blocking film EB may include one or more color filters.
- FIG. 3 is a top plan view illustrating a region A illustrated in FIG. 1 .
- FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3 .
- FIG. 5 is a cross-sectional view taken along the line V-V of FIG. 3 .
- FIG. 3 shows a 2 ⁇ 2 pixel portion as a center portion of a plurality of pixels, and these pixels may be repeatedly arranged up/down and right/left in the liquid crystal display according to an exemplary embodiment.
- a gate line 121 and a storage electrode line 131 are formed on a substrate 110 made of transparent glass or plastic.
- the gate line 121 includes a gate electrode 124.
- the storage electrode line 131 is mainly extended in a horizontal direction, and transfers a predetermined voltage such as a common voltage Vcom.
- the storage electrode line 131 includes a pair of vertical storage electrode portions 135a substantially extended to be perpendicular to the gate line 121, and a horizontal storage electrode portion 135b connecting ends of the pair of vertical storage electrode portions 135a to each other.
- the vertical and horizontal storage electrode portions 135a and 135b have a structure surrounding a pixel electrode 191.
- a gate insulating layer 140 is formed on the gate line 121 and the storage electrode line 131.
- a semiconductor layer 151 positioned under a data line 171 and a semiconductor layer 154 positioned under source/drain electrodes 173/175 and corresponding to a channel region of a thin film transistor Q are formed on the gate insulating layer 140.
- a plurality of ohmic contacts may be formed between the semiconductor layer 151 and the data line 171, and between the semiconductor layer 154 under the source/drain electrodes 173/175 and corresponding to the channel region and the source/drain electrodes 173/175, and are omitted in the drawings.
- Data conductors including the source electrode 173, the data line 171 connected to the source electrode 173, and the drain electrode 175 are formed on the semiconductor layers 151 and 154 and the gate insulating layer 140.
- the gate electrode 124, the source electrode 173, and the drain electrode 175 form the thin film transistor Q along with the semiconductor layer 154, and the channel of the thin film transistor Q is formed in the exposed portion of the semiconductor layer between the source electrode 173 and the drain electrode 175.
- a first interlayer insulating layer 180a is formed on the data conductors and the exposed semiconductor layer 154.
- the first interlayer insulating layer 180a may include an inorganic insulator such as silicon nitride (SiNx) and silicon oxide (SiOx).
- a second interlayer insulating layer 180b and the third interlayer insulating layer 180c may be positioned on the first interlayer insulating layer 180a.
- the second interlayer insulating layer 180b may be formed of the organic material
- the third interlayer insulating layer 180c may include the inorganic insulator such as the silicon nitride (SiNx) and the silicon oxide (SiOx).
- the second interlayer insulating layer 180b is formed of the organic material thereby reducing or removing a step.
- one or two of the first interlayer insulating layer 180a, the second interlayer insulating layer 180b, and the third interlayer insulating layer 180c may be omitted.
- a contact hole 185 passing through the first interlayer insulating layer 180a, the second interlayer insulating layer 180b, and the third interlayer insulating layer 180c may be formed.
- the pixel electrode 191 positioned on the third interlayer insulating layer 180c may be electrically and physically connected to the drain electrode 175 through the contact hole 185.
- the pixel electrode 191 will be described in detail.
- the pixel electrode 191 may be made of a transparent conductive material such as ITO or IZO.
- An overall shape of the pixel electrode 191 is a quadrangle, and the pixel electrode 191 includes cross stems configured by a horizontal stem 191a and a vertical stem 191b crossing the horizontal stem 191a. Further, the pixel electrode 191 is divided into four sub-regions by the horizontal stem 191a and the vertical stem 191b, and each sub-region includes a plurality of minute branches 191c.
- the pixel electrode 191 may further include an outer stem 191d connecting the minute branches 191c at right and left edges of the pixel electrode 191.
- the outer stem 191d is positioned at the right and left edges of the pixel electrode 191, however it may be positioned to extend to an upper portion or a lower portion of the pixel electrode 191.
- the minute branches 191c of the pixel electrode 191 form an angle of approximately 40 ° to 45 ° with the gate line 121 or the horizontal stem 191a. Further, the minute branches of two adjacent sub-regions may be perpendicular to each other. In addition, a width of each minute branch may be gradually increased, or a distance between the minute branches 191c may be varied.
- the pixel electrode 191 includes an extension 197 which is connected at a lower end of the vertical stem 191b, has a larger area than the vertical stem 191b, and is electrically and physically connected to the drain electrode 175 through the contact hole 185 at the extension 197, thereby receiving the data voltage from the drain electrode 175.
- the thin film transistor Q and the pixel electrode 191 described above are just examples, and a structure of the thin film transistor and a design of the pixel electrode may be modified in order to improve side visibility.
- a light blocking member 220 is disposed on the pixel electrode 191 to cover a region where the thin film transistor Q is formed.
- the light blocking member 220 according to the present exemplary embodiment may be formed along a direction in which the gate line 121 extends.
- the light blocking member 220 may be formed of a material that blocks light.
- An insulating layer 181 may be formed on the light blocking member 220, and the insulating layer 181 covering the light blocking member 220 may extend on the pixel electrode 191.
- the insulating layer 181 may be formed of silicon nitride (SiNx) or silicon oxide (SiOx).
- a lower alignment layer 11 is formed on the pixel electrode 191, and may be a vertical alignment layer.
- An upper alignment layer 21 is disposed at a portion facing the lower alignment layer 11, and the microcavity 305 is formed between the lower alignment layer 11 and the upper alignment layer 21.
- a liquid crystal material including liquid crystal molecules 310 is injected into the microcavity 305, and the microcavity 305 has an entrance region 307.
- the microcavities 305 may be formed along a column direction of the pixel electrode 191, that is, in the vertical direction.
- the alignment material forming the alignment layers 11 and 21 and the liquid crystal material including the liquid crystal molecules 310 may be injected into the microcavity 305 by using capillary force.
- the lower alignment layer 11 and the upper alignment layer 21 are merely distinguished according to position, and may be connected to each other as shown as in FIG. 5 .
- the lower alignment layer 11 and the upper alignment layer 21 may be simultaneously formed.
- the microcavity 305 is divided in the vertical direction by a plurality of liquid crystal injection portions 307FP positioned at a portion overlapping the gate line 121, thereby forming the plurality of microcavities 305, and the plurality of microcavities 305 may be formed along a column direction of the pixel electrode 191, that is, in the vertical direction. Further, the microcavity 305 is divided in the horizontal direction by a partition portion PWP that will be described later, thereby forming the plurality of microcavities 305, and the microcavities 305 may be formed along the row direction of the pixel electrode 191, that is, the horizontal direction in which the gate line 121 extends.
- the formed microcavities 305 may respectively correspond to one or more pixel areas, and the pixel areas may correspond to a region displaying the image.
- a common electrode 270 and the lower insulating layer 350 are positioned on the upper alignment layer 21.
- the common electrode 270 receives the common voltage, and generates an electric field together with the pixel electrode 191 to which the data voltage is applied to determine a direction in which the liquid crystal molecules 310 positioned at the microcavity 305 between the two electrodes 270, 191 are inclined.
- the common electrode 270 forms a capacitor with the pixel electrode 191 to maintain the received voltage even after the thin film transistor Q is turned off.
- the lower insulating layer 350 may be formed of silicon nitride (SiNx) or silicon oxide (SiOx). Referring to FIG. 2 and FIG. 4 , the lower insulating layer 350 may be disposed in both the display area DA and the peripheral area PA.
- the common electrode 270 is formed on the microcavity 305, but in another exemplary embodiment, the common electrode 270 is formed under the microcavity 305, so that liquid crystal driving according to a coplanar electrode (CE) mode is possible.
- CE coplanar electrode
- the color filter 230 also called a roof layer, is disposed on the lower insulating layer 350.
- the color filter 230 of one color forms the partition portion PWP.
- the partition portion PWP is disposed between the microcavities 305 neighboring in the horizontal direction.
- the partition portion PWP is a portion filling the separation space of the microcavities 305 neighboring in the horizontal direction.
- the partition portion PWP completely fills the separation space of the microcavity 305, however it is not limited thereto, and it may partially fill the separation space.
- the partition portion PWP may be formed along the direction that the data line 171 extends.
- the color filters 230 neighboring each other on the partition portion PWP may overlap.
- the boundary surface where the neighboring color filters 230 meet each other may be positioned at the portion corresponding to the partition portion PWP.
- the color filter 230 and the partition portion PWP function as a roof layer supporting the microcavity 305 to maintain the shape thereof.
- the color filter 230 according to an exemplary embodiment will be described with reference to FIG. 6 and FIG. 7 .
- FIG. 6 is a top plan view of a color filter 230 and a partition portion PWP in a liquid crystal display according to an exemplary embodiment.
- FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6 .
- FIG. 6 and FIG. 7 are views to schematically explain the color filter 230 and the partition portion PWP in the liquid crystal display according to an exemplary embodiment, and the constituent elements between the substrate 110 and the microcavity 305 may be applied with the description in FIG. 3 to FIG. 5 as it is.
- the color filter 230 includes a first color filter, a second color filter, and a third color filter, and the first color filter may include a blue color filter B, the second color filter may include a red color filter R, and the third color filter may include a green color filter G.
- the partition portion PWP is formed by any one among the first color filter, the second color filter, and the third color filter.
- the first color filter corresponding to the blue color filter B forms the partition portion PWP.
- the blue color filter B may include the partition portion PWP extended from the portion corresponding to the pixel area PX and the partition portion PWP positioned between the red color filter R and the green color filter G.
- the red color filter R and the green color filter G covering edges opposite to each other in the partition portions PWP are simultaneously adjacent to each other, and may overlap on the partition portion PWP.
- the blue color filter B instead of the blue color filter B, it is possible to form the partition portion PWP made of the red color filter R or the green color filter G.
- the blue color filter B has a larger blocking effect compared with the red color filter R or the green color filter G, and thus there is a merit of reducing reflection of the light if the partition portion PWP is formed of the blue color filter B.
- the blue color filter B has excellent fluidity of a photoresist of the color filter as well as the light blocking effect, thereby obtaining a good taper angle.
- the end of the color filter is slanted with an angle of more than about 45 degrees, so the color filter coated on the partition portion PWP while covering the side wall of the partition portion PWP may be well formed.
- the color filter 230 may be formed to have an island shape to correspond to the pixel area PX.
- color filters 230 which are adjacent to each partition portion PWP may form the partition portions PWP.
- each of the blue color filter B, the red color filter R, and the green color filter G may serve to support the microcavity 305 by forming the roof layer in the display area DA, and may serve as the blocking film EB by forming a structure at which the color filters B, R, and G are stacked in the peripheral area PA.
- the upper insulating layer 370 is disposed on the color filter 230.
- the upper insulating layer 370 may be formed of the silicon nitride (SiNx) or the silicon oxide (SiOx). As shown in FIG. 4 , the side surface of the color filter 230 may be covered. Referring to FIG. 2 and FIG. 4 , the upper insulating layer 370 may be disposed in both the display area DA and the peripheral area PA.
- the capping layer 390 is positioned on the upper insulating layer 370.
- the capping layer 390 is also positioned at the liquid crystal injection portion 307FP and the entrance region 307 of the microcavity 305 exposed by the liquid crystal injection portion 307FP.
- the capping layer 390 includes the organic material or the inorganic material.
- the liquid crystal material is removed in the liquid crystal injection portion 307FP, but the liquid crystal material that remains after being injected to the microcavity 305 may remain at the liquid crystal injection portion 307FP.
- top surfaces of the capping layer 390 and the blocking film EB may be disposed at substantially the same height/level.
- a barrier layer 395 may be formed on the capping layer 390.
- the barrier layer 395 may include silicon nitride (SiNx) and the like to serve to additionally prevent penetration of external moisture and oxygen.
- the partition portions PWP are formed by the color filters 230 having a single color disposed between the microcavities 305 that are adjacent to each other in a horizontal direction.
- the partition portions PWP can partition or define the microcavities 305 by forming partition walls.
- a partition structure such as the partition portions PWP is disposed between the microcavities 305. Accordingly, even though the substrate 110 is bent, less stress may be generated and a degree at which the cell gap is deformed may be reduced.
- FIG. 8 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment of FIG. 5 .
- the present exemplary embodiment is the same as most of the exemplary embodiment described in FIG. 5 .
- the light blocking member 220 is formed along the direction that the data line 171 extends.
- the light blocking member 220 is positioned on the third interlayer insulating layer 180c or the pixel electrode 191.
- the light blocking member 220 that is described herein may be formed of a lattice shape where it is extended in the direction of the gate line 121.
- FIG. 9 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment of FIG. 2 .
- this variation exemplary embodiment is mostly the same as the exemplary embodiment of FIG. 2 .
- a sacrificial layer remaining pattern 300r and a transparent electrode pattern 270r may be disposed at a portion of the peripheral area PA to corresponding to the blocking film EB.
- the sacrificial layer remaining pattern 300r and the transparent electrode pattern 270r are disposed between the insulating layer 181 and the lower insulating layer 350.
- the sacrificial layer remaining pattern 300r may be formed by remaining in the peripheral area PA when the sacrificial layer 300 is patterned in a manufacturing process of a liquid crystal display according to an exemplary embodiment of FIG. 13 which will be described later.
- the sacrificial layer remaining pattern 300r may be formed by employing a photoresist material or an organic material excluding it.
- the transparent electrode pattern 270r may be formed by employing the same material through the same process as those of the common electrode 270 disposed in the display area DA.
- FIG. 10 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment of FIG. 2 .
- this variation exemplary embodiment is mostly the same as the exemplary embodiment of FIG. 2 .
- the blocking film EB and the color filters 230 which form the roof layer are disposed to be separated from each other.
- FIG. 11 to FIG. 37 are top plan views and cross-sectional views illustrating a manufacturing method of a liquid crystal display according to an exemplary embodiment.
- FIGS. 11 , 14 , 17 , 28 , 31 , 32 , and 35 sequentially illustrate the cross-sectional views taken along the line IV-IV of FIG. 3 .
- FIGS. 12 , 15 , 18 , 29 , 33 , and 36 sequentially illustrate the cross-sectional views taken along the line V-V of FIG. 3 .
- FIG. 19 , FIG. 22 , and FIG. 25 are top plan views of a color filter and a partition portion in the manufacturing method of the liquid crystal display according to an exemplary embodiment.
- FIG. 26 are cross-sectional views taken along a line XX-XX of FIG. 19 , a line XXIII-XXIII of FIG. 22 , and a line XXVI-XXVI of FIG. 25 , respectively.
- FIG. 21 , FIG. 24 , and FIG. 27 are respectively cross-sectional views illustrating a stacking process of a color filter in a peripheral area.
- a gate line 121 extending in a horizontal direction and a gate insulating layer 140 on the gate line 121 are formed, semiconductor layers 151 and 154 are formed on the gate insulating layer 140, and a source electrode 173 and a drain electrode 175 are formed.
- the data line 171 connected to the source electrode 173 may be formed to extend in a vertical direction while crossing the gate line 121.
- the first interlayer insulating layer 180a is formed on the data conductors including the source electrode 173, the drain electrode 175, and the data line 171, and the exposed portion of the semiconductor layer 154.
- the second interlayer insulating layer 180b and the third interlayer insulating layer 180c are formed on the first interlayer insulating layer 180a, and the contact hole 185 passing through them is formed.
- the pixel electrode 191 is formed on the third interlayer insulating layer 180c, and the pixel electrode 191 may be electrically and physically connected to the drain electrode 175 through the contact hole 185.
- the light blocking member 220 is formed on the pixel electrode 191 or the third interlayer insulating layer 180c.
- the light blocking member 220 may be formed according to the direction that the gate line 121 extends.
- the light blocking member 220 may be formed of the material blocking the light.
- the insulating layer 181 is formed on the light blocking member 220, and the insulating layer 181 may be extended on the pixel electrode 191 while covering the light blocking member 220.
- a sacrificial layer 300 is formed on the pixel electrode 191.
- an open portion OPN is formed along the direction parallel to the data line 171 in the sacrificial layer 300.
- the color filter 230 may be filled in a following process thereby forming the partition portion PWP.
- the sacrificial layer 300 may be formed of a photoresist or the organic material.
- the gate insulating layer 140, the first interlayer insulating layer 180a, the second interlayer insulating layer 180b, the third interlayer insulating layer 180c, the light blocking member 220, and insulating layer 180 may be formed on the substrate 110.
- the common electrode 270 and the lower insulating layer 350 are sequentially formed on the sacrificial layer 300. As shown in FIG. 15 , the common electrode 270 and the lower insulating layer 350 may cover the open portion OPN. Referring to FIG. 16 , the lower insulating layer 350 of the display area DA may be formed to extend to the peripheral area PA.
- the color filter 230 is formed on the lower insulating layer 350.
- the color filter 230 may be removed in the region corresponding to the light blocking member 220 positioned between the pixel areas adjacent in the vertical direction by the patterning process or the exposure/ developing process.
- the color filter 230 exposes the lower insulating layer 350 to the outside in the region corresponding to the light blocking member 220.
- the color filter 230 forms the partition portion PWP while filling the open portion OPN of the light blocking member 220.
- the color filter 230 filling the open portion OPN is the color filter 230 of one color.
- the color filters 230 neighboring the color filter 230 forming the partition portion PWP may overlap each other on the partition portion PWP.
- the neighboring color filters 230 may be formed to be separated from each other on the partition portion PWP.
- the blue color filter B is formed on the sacrificial layer 300.
- the blue color filter B is formed to fill the separation space between the sacrificial layers 300 separated in the horizontal direction.
- the blue color filter B is formed at the portion corresponding to the pixel area PX, and the blue color filter B formed corresponding to the pixel area PX extends thereby forming the partition portion PWP.
- the partition portion PWP is separately formed between two pixel areas PX where the blue color filter B is not formed.
- the partition portion PWP separated from the partition portion PWP formed by extending the blue color filter B may be formed by using one mask.
- the blue color filter B may be formed on the peripheral area PA.
- the blue color filters B of the display area PA and the peripheral area PA may be formed by employing the same material through the same process, and may be connected to each other.
- the red color filter R is formed on the sacrificial layer 300.
- the red color filter R is formed to overlap the partition portion PWP, and may overlap on the blue color filter B and the partition portion PWP.
- the red color filter R may be formed on the blue color filter B.
- the red color filter R may be formed to cover a side surface of the blue color filter B.
- the green color filter G is formed on the sacrificial layer 300.
- the green color filter G is formed to overlap the partition portion PWP, and may respectively overlap the blue color filter B and the red color filter R on the partition portion PWP.
- the green color filter G may be formed on the red color filter R.
- the green color filter G may be formed to cover side surfaces of the blue color filter B and the red color filter R.
- the formation position and the sequence of the above-described red color filter R and green color filter G may be changed. Further, differently from that shown in FIG. 26 , the thicknesses of the blue color filter B, the red color filter R, and the green color filter G may be different. The reason for differentiating the thicknesses of the blue color filter B, the red color filter R, and the green color filter G is to adjust color coordinates in each color filter. Otherwise, the heights of the blue color filter B, the red color filter R, and the green color filter G may be different. To differentiate the height of each color filter, the thickness of the sacrificial layer 300 corresponding to each color filter R, G, and B may be changed. Next, when the sacrificial layer 300 is removed, the microcavities 305 having the different heights may be formed, and the heights of each color filter positioned thereon may be different.
- the upper insulating layer 370 covering the color filter 230 and the exposed lower insulating layer 350 is formed.
- the upper insulating layer 370 of the display area DA may be formed to extend to the peripheral area PA.
- the upper insulating layer 370 may be formed in the peripheral area PA to cover a side surface and a top surface of an organic layer including the blue color filter B, the red color filter R, and the green color filter G.
- the upper insulating layer 370, the lower insulating layer 350, and the common electrode 270 are etched to partially remove the upper insulating layer 370, the lower insulating layer 350, and the common electrode 270, and to form the liquid crystal injection portion 307FP.
- the upper insulating layer 370 has a structure covering the side surface of the color filter 230, however it is not limited thereto, and the upper insulating layer 370 covering the side surface of the color filter 230 may be removed to expose the side surface of the color filter 230 to the outside.
- the sacrificial layer 300 is removed through the liquid crystal injection portion 307FP by oxygen (O 2 ) ashing treatment or a wet etching method.
- the microcavity 305 having the entrance region 307 is formed.
- the microcavity 305 is an empty space formed when the sacrificial layer 300 is removed.
- the alignment material is injected through the entrance region 307 to form the alignment layers 11 and 21 on the pixel electrode 191 and the common electrode 270.
- a bake process is performed after injecting an alignment material including a solid content and a solvent through the entrance region 307.
- a liquid crystal material including the liquid crystal molecules 310 is injected into the microcavity 305 via the entrance region 307, using an inkjet method and the like.
- the capping layer 390 is formed on the upper insulating layer 370 to cover the entrance region 307 and the liquid crystal injection portion 307FP to form the liquid crystal display illustrated in FIG. 2 , FIG. 4 , and FIG. 5 .
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
Abstract
Description
- The present application relates to a liquid crystal display and a manufacturing method thereof.
- A liquid crystal display as one of flat panel display devices that are being widely used includes two display panels, wherein field generating electrodes such as a pixel electrode and a common electrode are formed with a liquid crystal layer interposed therebetween.
- The liquid crystal display generates an electric field in a liquid crystal layer by applying a voltage to the field generating electrodes to determine orientations of liquid crystal molecules of the liquid crystal layer and control polarization of incident light, thereby displaying an image.
- A technique of forming a cavity in a pixel and filling the cavity with liquid crystals to implement a display has been developed for one of the liquid crystal displays. Although two sheets of substrates are used in a conventional liquid crystal display, this technique forms constituent elements on one substrate, thereby reducing weight, thickness, and the like of the device.
- A process of forming the display by filling the liquid crystal molecules in the microcavities includes a step of forming a capping layer after the liquid crystal molecules are injected. However, in the case of the capping layer currently employed, it is difficult to sufficiently block external oxygen and moisture, thereby generating a reliability problem.
- The above information disclosed in this Background section is only for enhancement of understanding of the background and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.
- Embodiments have been made in an effort to provide a liquid crystal display and a manufacturing method thereof, having features of being capable of improving reliability by blocking external oxygen and moisture.
- An exemplary embodiment provides a liquid crystal display including: a substrate configured to include a display area and a peripheral area; a thin film transistor disposed on the substrate; a pixel electrode connected to the thin film transistor; a roof layer disposed to face the pixel electrode; a capping layer disposed on the roof layer; and a blocking film disposed in the peripheral area to surround a lateral surface of the capping layer, wherein a plurality of microcavities are formed between the pixel electrode and the roof layer in the display area, and the microcavities form a liquid crystal layer including a liquid crystal material, wherein a level of a top surface of the blocking film is higher than that of a top surface of the liquid crystal layer.
- The liquid crystal display may further include, in the display area: a lower insulating layer disposed below the roof layer; and an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, and the blocking film may include an organic/inorganic structure layer disposed to correspond to the lower insulating layer, the roof layer, and the upper insulating layer. The term organic/inorganic structure layer may define a structure of several layers with at least one organic and at least one inorganic layer.
- The organic/inorganic structure layer may include a first inorganic layer, an organic layer, and a second inorganic layer, the first inorganic layer may be disposed to correspond to the lower insulating layer, the second inorganic layer may be disposed to correspond to the upper insulating layer, and the organic layer includes at least one color filter.
- The first inorganic layer may be connected to the lower insulating layer, and the second inorganic layer may be connected to the upper insulating layer.
- The organic layer may have a structure at which color filters having different colors are stacked.
- The roof layer may include a color filter.
- The microcavities may be partitioned by a partition portion, and the partition portion may be formed by a color filter having a single color among the color filters.
- The partition portion may be a part formed by filling a space between adjacent microcavities with the color filter having the single color.
- The partition portion may be formed along a direction in which a data line connected to the thin film transistor is extended.
- The second inorganic layer may be disposed to cover a top surface and a lateral surface of the organic layer.
- The liquid crystal display may further include a barrier layer disposed on a top surface of the capping layer, and the barrier layer may include silicon nitride.
- Top surfaces of the capping layer and the blocking film may be disposed at a same level.
- The liquid crystal display may further include: a lower insulating layer disposed below the roof layer; and an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, the blocking film may be an organic/inorganic structure layer including the lower insulating layer extended from the display area, an organic layer, and the upper insulating layer extended from the display area, the organic layer may have a structure at which color filters having different colors may be stacked, and one of the color filters may be connected to the roof layer.
- The liquid crystal display may further include a transparent electrode pattern disposed below the organic/inorganic structure layer.
- The liquid crystal display may further include a sacrificial layer remaining pattern disposed below the organic/inorganic structure layer.
- The blocking film and the roof layers disposed in the display area may be separated from each other.
- An exemplary embodiment provides a manufacturing method of a liquid crystal display, including: forming a thin film transistor on a substrate including a display area and a peripheral area; forming a pixel electrode connected to the thin film transistor; forming a sacrificial layer on the pixel electrode; forming a roof layer on the sacrificial layer disposed in the display area; forming a blocking film disposed in the peripheral area; removing the sacrificial layer to form a plurality of microcavities; forming a liquid crystal layer by injecting a liquid crystal material into the microcavities; and forming a capping layer on the roof layer, wherein the forming of the roof layer and the forming of the blocking film are simultaneously performed.
- The forming of the roof layer may include: forming a first color filter on the sacrificial layer; forming a second color filter on the sacrificial layer; and forming a third color filter on the sacrificial layer, and the forming of the blocking film may include stacking the first color filter, the second color filter, and the third color filter in the peripheral area.
- The manufacturing method may further include: forming a lower insulating layer disposed below the roof layer; and forming an upper insulating layer disposed on the roof layer, wherein the lower insulating layer and the upper insulating layer may be made of an inorganic film, and the lower insulating layer and the upper insulating layer formed in the display area may extend to form the blocking film together with a color filter disposed in the peripheral area.
- The forming of the sacrificial layer may include forming an open portion disposed according to a data line connected to the thin film transistor, and the open portion may be filled with one of the first color filter, the second color filter, and the third color filter.
- The color filter that fills the open portion may form a partition portion, and the partition portion may partition the microcavities.
- The blocking film may be formed to have a top surface of which a level is higher than that of a top surface of the liquid crystal layer.
- The color filter disposed in the peripheral area may be connected to one of the first color filter, the second color filter, and the third color filter.
- The manufacturing method may further include forming a transparent electrode pattern disposed below the blocking film.
- The forming of the sacrificial layer may further include forming a sacrificial layer remaining pattern in the peripheral area.
- The manufacturing method may further include forming a barrier layer on a top surface of the capping layer, and the barrier layer may include silicon nitride.
- Top surfaces of the capping layer and the blocking film may be disposed at a same level.
- The forming of the roof layer may include forming the roof layer separated from the blocking film.
- According to the exemplary embodiments, it is possible to block moisture and oxygen from penetrating into an edge of a display area by forming a blocking film at a peripheral area to improve the reliability of elements. Further, since the blocking film is formed in the same process when an organic film and an inorganic film are formed at the display area, no additional mask is required.
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FIG. 1 is a top plan view partially illustrating a peripheral area and a display area in a liquid crystal display according to an exemplary embodiment; -
FIG. 2 is a cross-sectional view taken along the line II-II ofFIG. 1 ; -
FIG. 3 is a top plan view illustrating a region A illustrated inFIG. 1 ; -
FIG. 4 is a cross-sectional view taken along the line IV-IV ofFIG. 3 ; -
FIG. 5 is a cross-sectional view taken along the line V-V ofFIG. 3 ; -
FIG. 6 is a top plan view of a color filter and a partition portion in a liquid crystal display according to an exemplary embodiment; -
FIG. 7 is a cross-sectional view taken along the line VII-VII ofFIG. 6 ; -
FIG. 8 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 5 ; -
FIG. 9 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 2 ; -
FIG. 10 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 2 ; -
FIGS. 11 ,12 ,13 ,14 ,15 ,16 ,17 ,18 ,19 ,20 ,21 ,22 ,23 ,24 ,25 ,26 ,27 ,28 ,29 ,30 ,31 ,32 ,33 ,34 ,35 ,36 , and37 are top plan views and cross-sectional views illustrating a manufacturing method of a liquid crystal display according to an exemplary embodiment. - Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the scope of the inventive concept. On the contrary, exemplary embodiments introduced herein are provided to make disclosed contents thorough and complete and to sufficiently transfer the spirit of the inventive concept to those skilled in the art.
- In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It will be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening elements may also be present. Like reference numerals designate like elements throughout the specification.
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FIG. 1 is a top plan view partially illustrating a peripheral area PA and a display area DA in a liquid crystal display according to an exemplary embodiment.FIG. 2 is a cross-sectional view taken along the line II-II ofFIG. 1 . - Referring to
FIG. 1 andFIG. 2 , the liquid crystal display according to the present exemplary embodiment may include a liquidcrystal panel assembly 400, a gate driver (not shown) and a data driver (not shown) connected thereto, a gray voltage generator (not shown) connected to the data driver, a light source unit (not shown) emitting light to the liquidcrystal panel assembly 400, a light source driver (not shown) controlling the light source unit, and a signal controller (not shown) controlling them. - The gate driver or the data driver may be formed on the liquid
crystal panel assembly 400, and may be formed as a separate integrated circuit chip. - A
substrate 110 of the liquidcrystal panel assembly 400 includes the display area DA and the peripheral area PA positioned to surround the display area DA. The display region DA is a region where an actual image is outputted, and in the peripheral region PA, the aforementioned gate driver or data driver is formed, or agate pad portion 121P, adata pad portion 171P including a gate pad, a data pad, or the like, which is a portion connected to an external circuit, is positioned. The gate pad is a wide portion positioned at an end of agate line 121, and the data pad is a wide portion positioned at an end of adata line 171. - The liquid crystal display according to the present exemplary embodiment includes a first inorganic layer, sometimes called a lower insulating
layer 350, an organic film in which color filters R, G, and B are stacked in the peripheral area PA, and a blocking film EB including a second inorganic layer, sometimes called an upper insulatinglayer 370. The first inorganic layer indicates an inorganic film that is disposed in the display area DA and is extended to be positioned in the peripheral area PA. The second inorganic layer indicates an inorganic film that is disposed in the display area DA and is extended to be positioned in the peripheral area PA. When color filters having different color filters are stacked in an organic film, the stacking sequence of the color filters may be varied. - In the present exemplary embodiment, the blocking film EB having both organic films and inorganic films is described. However, the inventive concept is not limited thereto. For example, at least one of the inorganic films may be omitted. The lower
insulating layer 350 and the upper insulatinglayer 370 of the inorganic films included in the blocking film EB may include silicon nitride (SiNx). - The inorganic film included in the blocking film EB may further include a third
interlayer insulating layer 180c disposed below the lower insulatinglayer 350 disposed in the peripheral area PA. - In the present exemplary embodiment, a roof layer formed as a
color filter 230 is disposed on amicrocavity 305 serving as a space corresponding to the liquid crystal layer includingliquid crystal molecules 310, and acapping layer 390 is disposed on the roof layer. In the present exemplary embodiment, a level of a top surface of the blocking film EB may be higher than that of the liquid crystal layer includingliquid crystal molecules 310, and the blocking film EB has such a structure so as to surround a lateral surface of thecapping layer 390. Accordingly, in the liquid crystal display according to the present exemplary embodiment, as an outer circumferential portion of the display area DA is surrounded by the blocking film EB, moisture and oxygen can be prevented from penetrating into a lateral surface of the display area DA. As a result, it is possible to prevent reliability reduction of elements of the liquid crystal display. - The roof layer is formed at a portion corresponding to the
microcavity 305 to include one color filter. However, the blocking film EB may include one or more color filters. - Hereinafter, constituent elements disposed in the display area DA of the liquid crystal display will be described in detail with reference to
FIG. 3 to FIG. 5 . -
FIG. 3 is a top plan view illustrating a region A illustrated inFIG. 1 .FIG. 4 is a cross-sectional view taken along the line IV-IV ofFIG. 3 .FIG. 5 is a cross-sectional view taken along the line V-V ofFIG. 3 . -
FIG. 3 shows a 2 × 2 pixel portion as a center portion of a plurality of pixels, and these pixels may be repeatedly arranged up/down and right/left in the liquid crystal display according to an exemplary embodiment. - Referring to
FIG. 3 to FIG. 5 , agate line 121 and astorage electrode line 131 are formed on asubstrate 110 made of transparent glass or plastic. Thegate line 121 includes agate electrode 124. Thestorage electrode line 131 is mainly extended in a horizontal direction, and transfers a predetermined voltage such as a common voltage Vcom. Thestorage electrode line 131 includes a pair of verticalstorage electrode portions 135a substantially extended to be perpendicular to thegate line 121, and a horizontalstorage electrode portion 135b connecting ends of the pair of verticalstorage electrode portions 135a to each other. The vertical and horizontalstorage electrode portions pixel electrode 191. - A
gate insulating layer 140 is formed on thegate line 121 and thestorage electrode line 131. Asemiconductor layer 151 positioned under adata line 171 and asemiconductor layer 154 positioned under source/drain electrodes 173/175 and corresponding to a channel region of a thin film transistor Q are formed on thegate insulating layer 140. - A plurality of ohmic contacts may be formed between the
semiconductor layer 151 and thedata line 171, and between thesemiconductor layer 154 under the source/drain electrodes 173/175 and corresponding to the channel region and the source/drain electrodes 173/175, and are omitted in the drawings. - Data conductors including the
source electrode 173, thedata line 171 connected to thesource electrode 173, and thedrain electrode 175 are formed on the semiconductor layers 151 and 154 and thegate insulating layer 140. - The
gate electrode 124, thesource electrode 173, and thedrain electrode 175 form the thin film transistor Q along with thesemiconductor layer 154, and the channel of the thin film transistor Q is formed in the exposed portion of the semiconductor layer between thesource electrode 173 and thedrain electrode 175. - A first
interlayer insulating layer 180a is formed on the data conductors and the exposedsemiconductor layer 154. The firstinterlayer insulating layer 180a may include an inorganic insulator such as silicon nitride (SiNx) and silicon oxide (SiOx). - A second
interlayer insulating layer 180b and the thirdinterlayer insulating layer 180c may be positioned on the firstinterlayer insulating layer 180a. The secondinterlayer insulating layer 180b may be formed of the organic material, and the thirdinterlayer insulating layer 180c may include the inorganic insulator such as the silicon nitride (SiNx) and the silicon oxide (SiOx). The secondinterlayer insulating layer 180b is formed of the organic material thereby reducing or removing a step. Differently from the present exemplary embodiment, one or two of the firstinterlayer insulating layer 180a, the secondinterlayer insulating layer 180b, and the thirdinterlayer insulating layer 180c may be omitted. - A
contact hole 185 passing through the firstinterlayer insulating layer 180a, the secondinterlayer insulating layer 180b, and the thirdinterlayer insulating layer 180c may be formed. Thepixel electrode 191 positioned on the thirdinterlayer insulating layer 180c may be electrically and physically connected to thedrain electrode 175 through thecontact hole 185. Hereafter, thepixel electrode 191 will be described in detail. - The
pixel electrode 191 may be made of a transparent conductive material such as ITO or IZO. - An overall shape of the
pixel electrode 191 is a quadrangle, and thepixel electrode 191 includes cross stems configured by ahorizontal stem 191a and avertical stem 191b crossing thehorizontal stem 191a. Further, thepixel electrode 191 is divided into four sub-regions by thehorizontal stem 191a and thevertical stem 191b, and each sub-region includes a plurality ofminute branches 191c. In the present exemplary embodiment, thepixel electrode 191 may further include anouter stem 191d connecting theminute branches 191c at right and left edges of thepixel electrode 191. In the present exemplary embodiment, theouter stem 191d is positioned at the right and left edges of thepixel electrode 191, however it may be positioned to extend to an upper portion or a lower portion of thepixel electrode 191. - The
minute branches 191c of thepixel electrode 191 form an angle of approximately 40 ° to 45 ° with thegate line 121 or thehorizontal stem 191a. Further, the minute branches of two adjacent sub-regions may be perpendicular to each other. In addition, a width of each minute branch may be gradually increased, or a distance between theminute branches 191c may be varied. - The
pixel electrode 191 includes anextension 197 which is connected at a lower end of thevertical stem 191b, has a larger area than thevertical stem 191b, and is electrically and physically connected to thedrain electrode 175 through thecontact hole 185 at theextension 197, thereby receiving the data voltage from thedrain electrode 175. - The thin film transistor Q and the
pixel electrode 191 described above are just examples, and a structure of the thin film transistor and a design of the pixel electrode may be modified in order to improve side visibility. - A
light blocking member 220 is disposed on thepixel electrode 191 to cover a region where the thin film transistor Q is formed. Thelight blocking member 220 according to the present exemplary embodiment may be formed along a direction in which thegate line 121 extends. Thelight blocking member 220 may be formed of a material that blocks light. - An insulating
layer 181 may be formed on thelight blocking member 220, and the insulatinglayer 181 covering thelight blocking member 220 may extend on thepixel electrode 191. The insulatinglayer 181 may be formed of silicon nitride (SiNx) or silicon oxide (SiOx). - A
lower alignment layer 11 is formed on thepixel electrode 191, and may be a vertical alignment layer. Thelower alignment layer 11, as a liquid crystal alignment layer made of a material such as polyamic acid, a polysiloxane, a polyimide, or the like, may include at least one of generally used materials. Further, thelower alignment layer 11 may be a photoalignment layer. - An
upper alignment layer 21 is disposed at a portion facing thelower alignment layer 11, and themicrocavity 305 is formed between thelower alignment layer 11 and theupper alignment layer 21. A liquid crystal material includingliquid crystal molecules 310 is injected into themicrocavity 305, and themicrocavity 305 has anentrance region 307. Themicrocavities 305 may be formed along a column direction of thepixel electrode 191, that is, in the vertical direction. In the present exemplary embodiment, the alignment material forming the alignment layers 11 and 21 and the liquid crystal material including theliquid crystal molecules 310 may be injected into themicrocavity 305 by using capillary force. In the present exemplary embodiment, thelower alignment layer 11 and theupper alignment layer 21 are merely distinguished according to position, and may be connected to each other as shown as inFIG. 5 . Thelower alignment layer 11 and theupper alignment layer 21 may be simultaneously formed. - The
microcavity 305 is divided in the vertical direction by a plurality of liquid crystal injection portions 307FP positioned at a portion overlapping thegate line 121, thereby forming the plurality ofmicrocavities 305, and the plurality ofmicrocavities 305 may be formed along a column direction of thepixel electrode 191, that is, in the vertical direction. Further, themicrocavity 305 is divided in the horizontal direction by a partition portion PWP that will be described later, thereby forming the plurality ofmicrocavities 305, and themicrocavities 305 may be formed along the row direction of thepixel electrode 191, that is, the horizontal direction in which thegate line 121 extends. The formedmicrocavities 305 may respectively correspond to one or more pixel areas, and the pixel areas may correspond to a region displaying the image. - A
common electrode 270 and the lower insulatinglayer 350 are positioned on theupper alignment layer 21. Thecommon electrode 270 receives the common voltage, and generates an electric field together with thepixel electrode 191 to which the data voltage is applied to determine a direction in which theliquid crystal molecules 310 positioned at themicrocavity 305 between the twoelectrodes common electrode 270 forms a capacitor with thepixel electrode 191 to maintain the received voltage even after the thin film transistor Q is turned off. - The lower
insulating layer 350 may be formed of silicon nitride (SiNx) or silicon oxide (SiOx). Referring toFIG. 2 andFIG. 4 , the lower insulatinglayer 350 may be disposed in both the display area DA and the peripheral area PA. - In the present exemplary embodiment, it is described that the
common electrode 270 is formed on themicrocavity 305, but in another exemplary embodiment, thecommon electrode 270 is formed under themicrocavity 305, so that liquid crystal driving according to a coplanar electrode (CE) mode is possible. - In the present exemplary embodiment, the
color filter 230, also called a roof layer, is disposed on the lower insulatinglayer 350. As shown inFIG. 5 , among the color filters neighboring each other, thecolor filter 230 of one color forms the partition portion PWP. The partition portion PWP is disposed between themicrocavities 305 neighboring in the horizontal direction. The partition portion PWP is a portion filling the separation space of themicrocavities 305 neighboring in the horizontal direction. As shown inFIG. 5 , the partition portion PWP completely fills the separation space of themicrocavity 305, however it is not limited thereto, and it may partially fill the separation space. The partition portion PWP may be formed along the direction that thedata line 171 extends. - The color filters 230 neighboring each other on the partition portion PWP may overlap. The boundary surface where the neighboring
color filters 230 meet each other may be positioned at the portion corresponding to the partition portion PWP. - In the present exemplary embodiment, the
color filter 230 and the partition portion PWP function as a roof layer supporting themicrocavity 305 to maintain the shape thereof. - Hereafter, the
color filter 230 according to an exemplary embodiment will be described with reference toFIG. 6 andFIG. 7 . -
FIG. 6 is a top plan view of acolor filter 230 and a partition portion PWP in a liquid crystal display according to an exemplary embodiment.FIG. 7 is a cross-sectional view taken along the line VII-VII ofFIG. 6 . -
FIG. 6 andFIG. 7 are views to schematically explain thecolor filter 230 and the partition portion PWP in the liquid crystal display according to an exemplary embodiment, and the constituent elements between thesubstrate 110 and themicrocavity 305 may be applied with the description inFIG. 3 to FIG. 5 as it is. - Referring to
FIG. 6 andFIG. 7 , thecolor filter 230 according to the present exemplary embodiment includes a first color filter, a second color filter, and a third color filter, and the first color filter may include a blue color filter B, the second color filter may include a red color filter R, and the third color filter may include a green color filter G. - According to the present exemplary embodiment, the partition portion PWP is formed by any one among the first color filter, the second color filter, and the third color filter. In an exemplary embodiment, the first color filter corresponding to the blue color filter B forms the partition portion PWP. The blue color filter B may include the partition portion PWP extended from the portion corresponding to the pixel area PX and the partition portion PWP positioned between the red color filter R and the green color filter G. In this case, the red color filter R and the green color filter G covering edges opposite to each other in the partition portions PWP are simultaneously adjacent to each other, and may overlap on the partition portion PWP.
- Instead of the blue color filter B, it is possible to form the partition portion PWP made of the red color filter R or the green color filter G. However, the blue color filter B has a larger blocking effect compared with the red color filter R or the green color filter G, and thus there is a merit of reducing reflection of the light if the partition portion PWP is formed of the blue color filter B. In addition, the blue color filter B has excellent fluidity of a photoresist of the color filter as well as the light blocking effect, thereby obtaining a good taper angle. Accordingly, compared with a case that an end shape of the color filter forming the partition portion PWP is undercut is vertical, the end of the color filter is slanted with an angle of more than about 45 degrees, so the color filter coated on the partition portion PWP while covering the side wall of the partition portion PWP may be well formed.
- As shown in
FIG. 6 , thecolor filter 230 may be formed to have an island shape to correspond to the pixel area PX. - The inventive concept is not limited to the aforementioned exemplary embodiment. For example,
color filters 230 which are adjacent to each partition portion PWP may form the partition portions PWP. - Referring to
FIG. 2 andFIG. 7 , each of the blue color filter B, the red color filter R, and the green color filter G may serve to support themicrocavity 305 by forming the roof layer in the display area DA, and may serve as the blocking film EB by forming a structure at which the color filters B, R, and G are stacked in the peripheral area PA. - Again referring to
FIG. 4 andFIG. 5 , the upper insulatinglayer 370 is disposed on thecolor filter 230. The upper insulatinglayer 370 may be formed of the silicon nitride (SiNx) or the silicon oxide (SiOx). As shown inFIG. 4 , the side surface of thecolor filter 230 may be covered. Referring toFIG. 2 andFIG. 4 , the upper insulatinglayer 370 may be disposed in both the display area DA and the peripheral area PA. - The
capping layer 390 is positioned on the upper insulatinglayer 370. Thecapping layer 390 is also positioned at the liquid crystal injection portion 307FP and theentrance region 307 of themicrocavity 305 exposed by the liquid crystal injection portion 307FP. Thecapping layer 390 includes the organic material or the inorganic material. Herein, the liquid crystal material is removed in the liquid crystal injection portion 307FP, but the liquid crystal material that remains after being injected to themicrocavity 305 may remain at the liquid crystal injection portion 307FP. Referring toFIG. 2 andFIG. 5 , top surfaces of thecapping layer 390 and the blocking film EB may be disposed at substantially the same height/level. - A
barrier layer 395 may be formed on thecapping layer 390. Thebarrier layer 395 may include silicon nitride (SiNx) and the like to serve to additionally prevent penetration of external moisture and oxygen. - In the present exemplary embodiment, as shown in
FIG. 5 , the partition portions PWP are formed by thecolor filters 230 having a single color disposed between themicrocavities 305 that are adjacent to each other in a horizontal direction. The partition portions PWP can partition or define themicrocavities 305 by forming partition walls. In the present exemplary embodiment, a partition structure such as the partition portions PWP is disposed between themicrocavities 305. Accordingly, even though thesubstrate 110 is bent, less stress may be generated and a degree at which the cell gap is deformed may be reduced. -
FIG. 8 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 5 . - Referring to
FIG. 8 , the present exemplary embodiment is the same as most of the exemplary embodiment described inFIG. 5 . However, thelight blocking member 220 is formed along the direction that thedata line 171 extends. Thelight blocking member 220 is positioned on the thirdinterlayer insulating layer 180c or thepixel electrode 191. Thelight blocking member 220 that is described herein may be formed of a lattice shape where it is extended in the direction of thegate line 121. -
FIG. 9 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 2 . - Referring to
FIG. 9 , this variation exemplary embodiment is mostly the same as the exemplary embodiment ofFIG. 2 . However, in this variation exemplary embodiment, a sacrificiallayer remaining pattern 300r and atransparent electrode pattern 270r may be disposed at a portion of the peripheral area PA to corresponding to the blocking film EB. The sacrificiallayer remaining pattern 300r and thetransparent electrode pattern 270r are disposed between the insulatinglayer 181 and the lower insulatinglayer 350. The sacrificiallayer remaining pattern 300r may be formed by remaining in the peripheral area PA when thesacrificial layer 300 is patterned in a manufacturing process of a liquid crystal display according to an exemplary embodiment ofFIG. 13 which will be described later. The sacrificiallayer remaining pattern 300r may be formed by employing a photoresist material or an organic material excluding it. Thetransparent electrode pattern 270r may be formed by employing the same material through the same process as those of thecommon electrode 270 disposed in the display area DA. -
FIG. 10 is a cross-sectional view of a variation exemplary embodiment of the exemplary embodiment ofFIG. 2 . - Referring to
FIG. 10 , this variation exemplary embodiment is mostly the same as the exemplary embodiment ofFIG. 2 . However, in this variation exemplary embodiment, the blocking film EB and thecolor filters 230 which form the roof layer are disposed to be separated from each other. - Next, an exemplary embodiment for a manufacturing method of the above described liquid crystal display will be described with reference to
FIG. 11 to FIG. 37 . An exemplary embodiment to be described below may be varied as an exemplary embodiment of the manufacturing method. -
FIG. 11 to FIG. 37 are top plan views and cross-sectional views illustrating a manufacturing method of a liquid crystal display according to an exemplary embodiment.FIGS. 11 ,14 ,17 ,28 ,31 ,32 , and35 sequentially illustrate the cross-sectional views taken along the line IV-IV ofFIG. 3 .FIGS. 12 ,15 ,18 ,29 ,33 , and36 sequentially illustrate the cross-sectional views taken along the line V-V ofFIG. 3 .FIG. 19 ,FIG. 22 , andFIG. 25 are top plan views of a color filter and a partition portion in the manufacturing method of the liquid crystal display according to an exemplary embodiment.FIG. 20 ,FIG. 23 , andFIG. 26 are cross-sectional views taken along a line XX-XX ofFIG. 19 , a line XXIII-XXIII ofFIG. 22 , and a line XXVI-XXVI ofFIG. 25 , respectively.FIG. 21 ,FIG. 24 , andFIG. 27 are respectively cross-sectional views illustrating a stacking process of a color filter in a peripheral area. - Referring to
FIG. 3 ,FIG. 11 , andFIG. 12 , to form a generally known switching element on asubstrate 110, agate line 121 extending in a horizontal direction and agate insulating layer 140 on thegate line 121 are formed, semiconductor layers 151 and 154 are formed on thegate insulating layer 140, and asource electrode 173 and adrain electrode 175 are formed. In this case, thedata line 171 connected to thesource electrode 173 may be formed to extend in a vertical direction while crossing thegate line 121. - The first
interlayer insulating layer 180a is formed on the data conductors including thesource electrode 173, thedrain electrode 175, and thedata line 171, and the exposed portion of thesemiconductor layer 154. - The second
interlayer insulating layer 180b and the thirdinterlayer insulating layer 180c are formed on the firstinterlayer insulating layer 180a, and thecontact hole 185 passing through them is formed. Next, thepixel electrode 191 is formed on the thirdinterlayer insulating layer 180c, and thepixel electrode 191 may be electrically and physically connected to thedrain electrode 175 through thecontact hole 185. - The
light blocking member 220 is formed on thepixel electrode 191 or the thirdinterlayer insulating layer 180c. Thelight blocking member 220 may be formed according to the direction that thegate line 121 extends. Thelight blocking member 220 may be formed of the material blocking the light. The insulatinglayer 181 is formed on thelight blocking member 220, and the insulatinglayer 181 may be extended on thepixel electrode 191 while covering thelight blocking member 220. - Next, a
sacrificial layer 300 is formed on thepixel electrode 191. In this case, an open portion OPN is formed along the direction parallel to thedata line 171 in thesacrificial layer 300. In the open portion OPN, thecolor filter 230 may be filled in a following process thereby forming the partition portion PWP. Thesacrificial layer 300 may be formed of a photoresist or the organic material. - Referring to
FIG. 13 , in the peripheral area PA, thegate insulating layer 140, the firstinterlayer insulating layer 180a, the secondinterlayer insulating layer 180b, the thirdinterlayer insulating layer 180c, thelight blocking member 220, and insulating layer 180 may be formed on thesubstrate 110. - Referring to
FIG. 3 ,FIG. 14 , andFIG. 15 , thecommon electrode 270 and the lower insulatinglayer 350 are sequentially formed on thesacrificial layer 300. As shown inFIG. 15 , thecommon electrode 270 and the lower insulatinglayer 350 may cover the open portion OPN. Referring toFIG. 16 , the lower insulatinglayer 350 of the display area DA may be formed to extend to the peripheral area PA. - Referring to
FIG. 3 ,FIG. 17 , andFIG. 18 , thecolor filter 230 is formed on the lower insulatinglayer 350. Thecolor filter 230 may be removed in the region corresponding to thelight blocking member 220 positioned between the pixel areas adjacent in the vertical direction by the patterning process or the exposure/ developing process. As shown inFIG. 17 , thecolor filter 230 exposes the lower insulatinglayer 350 to the outside in the region corresponding to thelight blocking member 220. In this case, as shown inFIG. 18 , thecolor filter 230 forms the partition portion PWP while filling the open portion OPN of thelight blocking member 220. In the present exemplary embodiment, thecolor filter 230 filling the open portion OPN is thecolor filter 230 of one color. The color filters 230 neighboring thecolor filter 230 forming the partition portion PWP may overlap each other on the partition portion PWP. However, as the variation of the exemplary embodiment, the neighboringcolor filters 230 may be formed to be separated from each other on the partition portion PWP. - Hereinafter, the
color filter 230 and the blocking film EB according to an exemplary embodiment will be described in detail with reference toFIG. 19 to FIG. 27 . - Referring to
FIG. 19 andFIG. 20 , the blue color filter B is formed on thesacrificial layer 300. In this case, the blue color filter B is formed to fill the separation space between thesacrificial layers 300 separated in the horizontal direction. The blue color filter B is formed at the portion corresponding to the pixel area PX, and the blue color filter B formed corresponding to the pixel area PX extends thereby forming the partition portion PWP. Further, the partition portion PWP is separately formed between two pixel areas PX where the blue color filter B is not formed. For example, the partition portion PWP separated from the partition portion PWP formed by extending the blue color filter B may be formed by using one mask. - In this case, referring to
FIG. 21 , the blue color filter B may be formed on the peripheral area PA. Herein, the blue color filters B of the display area PA and the peripheral area PA may be formed by employing the same material through the same process, and may be connected to each other. - Referring to
FIG. 22 andFIG. 23 , the red color filter R is formed on thesacrificial layer 300. The red color filter R is formed to overlap the partition portion PWP, and may overlap on the blue color filter B and the partition portion PWP. - In this case, referring to
FIG. 24 , in the peripheral area PA, the red color filter R may be formed on the blue color filter B. The red color filter R may be formed to cover a side surface of the blue color filter B. - Referring to
FIG. 25 andFIG. 26 , the green color filter G is formed on thesacrificial layer 300. The green color filter G is formed to overlap the partition portion PWP, and may respectively overlap the blue color filter B and the red color filter R on the partition portion PWP. - In this case, referring to
FIG. 27 , in the peripheral area PA, the green color filter G may be formed on the red color filter R. The green color filter G may be formed to cover side surfaces of the blue color filter B and the red color filter R. - The formation position and the sequence of the above-described red color filter R and green color filter G may be changed. Further, differently from that shown in
FIG. 26 , the thicknesses of the blue color filter B, the red color filter R, and the green color filter G may be different. The reason for differentiating the thicknesses of the blue color filter B, the red color filter R, and the green color filter G is to adjust color coordinates in each color filter. Otherwise, the heights of the blue color filter B, the red color filter R, and the green color filter G may be different. To differentiate the height of each color filter, the thickness of thesacrificial layer 300 corresponding to each color filter R, G, and B may be changed. Next, when thesacrificial layer 300 is removed, themicrocavities 305 having the different heights may be formed, and the heights of each color filter positioned thereon may be different. - Next, referring to
FIG. 3 ,FIG. 28 , andFIG. 29 , the upper insulatinglayer 370 covering thecolor filter 230 and the exposed lower insulatinglayer 350 is formed. - In this case, referring to
FIG. 30 , the upper insulatinglayer 370 of the display area DA may be formed to extend to the peripheral area PA. The upper insulatinglayer 370 may be formed in the peripheral area PA to cover a side surface and a top surface of an organic layer including the blue color filter B, the red color filter R, and the green color filter G. - Referring to
FIG. 31 , the upper insulatinglayer 370, the lower insulatinglayer 350, and thecommon electrode 270 are etched to partially remove the upper insulatinglayer 370, the lower insulatinglayer 350, and thecommon electrode 270, and to form the liquid crystal injection portion 307FP. In this case, the upper insulatinglayer 370 has a structure covering the side surface of thecolor filter 230, however it is not limited thereto, and the upper insulatinglayer 370 covering the side surface of thecolor filter 230 may be removed to expose the side surface of thecolor filter 230 to the outside. - Referring to
FIG. 32 to FIG. 34 , thesacrificial layer 300 is removed through the liquid crystal injection portion 307FP by oxygen (O2) ashing treatment or a wet etching method. In this case, themicrocavity 305 having theentrance region 307 is formed. Themicrocavity 305 is an empty space formed when thesacrificial layer 300 is removed. - Referring to
FIG. 35 to FIG. 37 , the alignment material is injected through theentrance region 307 to form the alignment layers 11 and 21 on thepixel electrode 191 and thecommon electrode 270. In detail, a bake process is performed after injecting an alignment material including a solid content and a solvent through theentrance region 307. - Next, a liquid crystal material including the
liquid crystal molecules 310 is injected into themicrocavity 305 via theentrance region 307, using an inkjet method and the like. - Thereafter, the
capping layer 390 is formed on the upper insulatinglayer 370 to cover theentrance region 307 and the liquid crystal injection portion 307FP to form the liquid crystal display illustrated inFIG. 2 ,FIG. 4 , andFIG. 5 . - While the inventive concept has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the inventive concept is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the scope of the appended claims.
Claims (15)
- A liquid crystal display comprising:a substrate (110) configured to include a display area (DA) and a peripheral area (PA);a thin film transistor (Q) disposed on the substrate (110);a pixel electrode (191) connected to the thin film transistor (Q);a roof layer disposed to face the pixel electrode (191);a capping layer (390) disposed on the roof layer; anda blocking film (EB) disposed in the peripheral area (PA) to surround a lateral surface of the capping layer (390),wherein a plurality of microcavities (305) are formed between the pixel electrode (191) and the roof layer in the display area (DA), and the microcavities (305) form a liquid crystal layer including a liquid crystal material,wherein a level of a top surface of the blocking film (EB) is higher than that of a top surface of the liquid crystal layer.
- The liquid crystal display of claim 1, further comprising, in the display area (DA):a lower insulating layer (350) disposed below the roof layer; andan upper insulating layer (370) disposed on the roof layer,wherein the lower insulating layer (350) and the upper insulating layer (370) are made of an inorganic film, andthe blocking film (EB) includes an organic/inorganic structure layer disposed to correspond to the lower insulating layer (350), the roof layer, and the upper insulating layer (370).
- The liquid crystal display of claim 2, wherein the organic/inorganic structure layer includes a first inorganic layer, an organic layer, and a second inorganic layer,
wherein the first inorganic layer is disposed to correspond to the lower insulating layer (350), the second inorganic layer is disposed to correspond to the upper insulating layer (370), and the organic layer includes at least one color filter (230, R, G, B). - The liquid crystal display of claim 2, wherein the organic/inorganic structure layer includes a first inorganic layer, an organic layer, and a second inorganic layer,
wherein the first inorganic layer is connected to the lower insulating layer (350), and the second inorganic layer is connected to the upper insulating layer (370). - The liquid crystal display of claim 4, wherein the organic layer has a structure at which color filters (230, R, G, B) having different colors are stacked.
- The liquid crystal display of one of claims 1 to 5, wherein the roof layer includes a color filter (230, R, G, B).
- The liquid crystal display of claim 6, wherein the microcavities (305) are partitioned by a partition portion (PWP), and
the partition portion (PWP) is formed by a color filter (230, R, G, B) having a single color among the color filters (230, R, G, B). - The liquid crystal display of claim 7, wherein the partition portion (PWP) is a part formed by filling a space between adjacent microcavities (305) with the color filter (230, R, G, B) having the single color.
- The liquid crystal display of one of claims 3 to 8, wherein the second inorganic layer is disposed to cover a top surface and a lateral surface of the organic layer.
- The liquid crystal display of one of claims 1 to 9, further comprising:a barrier layer (395) disposed on a top surface of the capping layer (390),wherein the barrier layer (395) includes silicon nitride.
- The liquid crystal display of one of claims 1 to 10, wherein top surfaces of the capping layer (390) and the blocking film (EB) are disposed at a same level.
- The liquid crystal display of claim 1, further comprising:a lower insulating layer (350) disposed below the roof layer; andan upper insulating layer (370) disposed on the roof layer,wherein the lower insulating layer (350) and the upper insulating layer (370) are made of an inorganic film,the blocking film (EB) is an organic/inorganic structure layer including the lower insulating layer (350) extended from the display area (DA), an organic layer, and the upper insulating layer (370) extended from the display area (DA), andthe organic layer has a structure at which color filters (230, R, G, B) having different colors are stacked, and one of the color filters (230, R, G, B) is connected to the roof layer.
- The liquid crystal display of claim 12, further comprising:a transparent electrode pattern (270r) disposed below the organic/inorganic structure layer.
- The liquid crystal display of claim 13, further comprising:a sacrificial layer remaining pattern (300r) disposed below the organic/inorganic structure layer.
- The liquid crystal display of claim 1, wherein the blocking film (EB) and the roof layer disposed in the display area (DA) are separated from each other.
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KR1020140143453A KR101676770B1 (en) | 2014-10-22 | 2014-10-22 | Liquid crystal display and method of manufacturing the same |
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EP (1) | EP3012684B1 (en) |
JP (1) | JP6698308B2 (en) |
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US9541786B2 (en) * | 2014-02-17 | 2017-01-10 | Samsung Display Co., Ltd. | Liquid crystal display and method of manufacturing the same |
US9575349B2 (en) | 2014-05-14 | 2017-02-21 | Samsung Display Co., Ltd. | Liquid crystal display and method of manufacturing the same |
CN205900543U (en) * | 2016-05-18 | 2017-01-18 | 武汉华星光电技术有限公司 | OLED (Organic light emitting diode) display panel |
CN111966241B (en) * | 2017-01-11 | 2023-05-30 | 群创光电股份有限公司 | Touch display device |
KR102347665B1 (en) * | 2017-03-21 | 2022-01-07 | 삼성디스플레이 주식회사 | Display apparatus and method of manufacturing the same |
CN107390402A (en) * | 2017-09-07 | 2017-11-24 | 京东方科技集团股份有限公司 | Mask plate, color membrane substrates and preparation method thereof, display panel, display device |
KR102573550B1 (en) * | 2018-08-31 | 2023-08-31 | 엘지디스플레이 주식회사 | Light Emitting Display Device and Manufacturing Method thereof |
CN114002910A (en) * | 2021-10-29 | 2022-02-01 | 福州京东方光电科技有限公司 | Mask plate assembly, mask plate for ultraviolet treatment and preparation method thereof |
WO2024204580A1 (en) * | 2023-03-31 | 2024-10-03 | ソニーセミコンダクタソリューションズ株式会社 | Display apparatus and electronic device |
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KR20160047648A (en) | 2016-05-03 |
JP6698308B2 (en) | 2020-05-27 |
US10459272B2 (en) | 2019-10-29 |
JP2016085450A (en) | 2016-05-19 |
KR101676770B1 (en) | 2016-11-17 |
US20160116794A1 (en) | 2016-04-28 |
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EP3012684B1 (en) | 2017-11-01 |
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