EP2998687B1 - Échangeur de chaleur - Google Patents

Échangeur de chaleur Download PDF

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Publication number
EP2998687B1
EP2998687B1 EP13884903.9A EP13884903A EP2998687B1 EP 2998687 B1 EP2998687 B1 EP 2998687B1 EP 13884903 A EP13884903 A EP 13884903A EP 2998687 B1 EP2998687 B1 EP 2998687B1
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EP
European Patent Office
Prior art keywords
heat transfer
treatment
structure body
heat exchanger
fine structure
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EP13884903.9A
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German (de)
English (en)
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EP2998687A4 (fr
EP2998687A1 (fr
Inventor
Toshinori Kawamura
Hiroshi Nakano
Kazuaki Kito
Akinori Tamura
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Hitachi Ltd
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Hitachi Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0093—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/103—Other heavy metals copper or alloys of copper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/02—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by influencing fluid boundary
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures

Definitions

  • the present invention relates to a heat exchanger.
  • a heat transfer enhancement technique described in PTL 1 is intended to improve convective heat transfer by forming a nanoparticle porous layer on a heat transfer surface and enhancing molecular diffusion at a heat conduction area in a boundary layer.
  • a heat transfer medium including: a dense solid body; a porous lower layer which is formed on a surface of the solid body and is composed of first particles that are formed of copper oxide particulates having an average diameter of 1 ⁇ m or less and have substantially spherical shapes; and a porous upper layer which is formed on the porous lower layer and is composed of second particles that are formed of copper oxide nanoparticles having an average diameter of 0.1 ⁇ m or less and have various shapes.
  • a heat transfer enhancement technique described in PTL 2 is intended to form a nanoporous layer on a heat transfer surface.
  • a heat exchanger having a nanoporous layer formed on at least a part of a heat transfer surface thermally connected with a heat-exchange object such as air or a semiconductor element, wherein at least a part of the heat transfer surface on which the nanoporous layer is formed is provided within an entrance region of a laminar flow.
  • JP H10 26491 A a heat exchanger having fins is described.
  • the fins of the heat exchanger have a hydrophilic surface.
  • a hydrophilic substance is provided on a structure of the heat exchanger fin.
  • DE 20 2010 015447 U1 relates to a heat exchanger using a gas as medium and having heat exchange elements being in contact with bio ethanol.
  • a heat transfer member body is formed of a steel pipe for a heat exchanger and needle form bodies are protruded from one or both of the inner and outer surfaces of the steel pipe to form a heat transfer member.
  • An object of the present invention is to provide a heat exchanger capable of improving heat transfer performance.
  • a heat exchanger includes a heat transfer unit configured to perform heat exchange by contact with gas, and a contact surface of the heat transfer unit to be in contact with the gas is provided with a fin structure body which has a height of 10 ⁇ m or less and a surface area of 10 times or more of a smooth surface.
  • a heat exchanger is a so-called air-cooled heat exchanger which performs heat exchange using gas.
  • a heat exchanger include a shell and tube type heat exchanger, a fin type heat exchanger (heat sink) for a power semiconductor, or a cross fin type heat exchanger for a radiator in an automobile or an air conditioner, though the present invention is not limited thereto.
  • a heat transfer unit provided in a heat exchanger takes various forms depending on the form of a heat exchanger.
  • a tube member heat transfer tube
  • a fin may be or may be not provided on at least one of an outer surface and an inner surface thereof spirally or parallel along the longitudinal direction, preferably without disturbing the gas flow.
  • a plurality of fins provided on a surface on the reverse side of a surface attached to a heat source, a base material surface between fins, or the like correspond to a heat transfer unit in the case of a heat sink.
  • a fin which is penetrated a plurality of times by hollow linear tubes connected by hollow U-shaped tubes corresponds to a heat transfer unit in the case of a cross fin type heat exchanger.
  • a fine structure body having specific conditions is provided on a surface of a heat transfer unit to be in contact with gas, that is, a surface of a heat transfer tube, a surface of a fin, a base material surface between fins, and the like. It is to be noted that the fine structure body having specific conditions will be described later.
  • Gas may flow in forced convection or in free convection.
  • Force convection means a gas flow generated forcibly by external force
  • free convection means a gas flow in a case where a flow by external force is week or external force does not exist.
  • Re Reynolds number
  • free convection it is generally said that a larger Reynolds number (Re) (e.g., Re of 4, 000 or larger) tends to cause a turbulent flow
  • a smaller Reynolds number e.g., Re of 2,300 or smaller
  • a laminar flow tends to be caused.
  • a turbulent flow means a spatially and temporally irregular flow
  • a laminar flow means a flow wherein the stream line of gas in a tube is always parallel to the tube axis, for example.
  • FIG. 1 is a sectional view illustrating one aspect of a heat exchanger 100 according to this embodiment. It is to be noted that the heat exchanger 100 is a shell and tube type heat exchanger.
  • Such a heat exchanger 100 is provided with tube plates 103 and 104 configured to support heat transfer units 102, respectively on an upper side and a lower side of a circular or polygonal shell 101.
  • a number of tube holes 105 through which the heat transfer units 102 pass are arranged zigzag.
  • Each heat transfer unit 102 is inserted into each tube hole 105 and fixed to the tube plates 103 and 104 at both ends thereof. It is to be noted that such a heat transfer unit 102 is provided in a shell and tube type heat exchanger, and thus is a heat transfer tube having a circular or rectangular cross section as described above.
  • a water chamber 106 is provided above the upper tube plate 103.
  • the water chamber 106 is provided with a nozzle 108 configured to introduce water vapor 107, which is an object of heat exchange and is high-temperature fluid.
  • a water chamber 109 is provided below the lower tube plate 104.
  • the water chamber 109 is provided with a nozzle 111 configured to discharge condensed water 110, which is generated by condensation of water vapor 107 exposed to heat transfer, from the device.
  • a nozzle 113 configured to introduce gas (air) 112, which is low-temperature fluid, into the device is provided on a lower side surface of the shell 101.
  • a nozzle 114 configured to discharge gas 112', which has been introduced into the device, from the device is provided on an upper side surface of the shell 101.
  • each heat transfer unit 102 described above is desirably formed of copper or copper alloy having excellent heat conductivity.
  • the respective components of the heat exchanger 100 other than the heat transfer units 102 may be formed using stainless steel, copper, aluminum, nickel, titanium, or alloy thereof.
  • each heat transfer unit 102 is provided with a contact surface 102a to be in contact with gas 112 in order to improve the heat transfer performance.
  • FIG. 2 is a schematic diagram which provides an enlarged view of a surface of a heat transfer unit 102 at a side to be in contact with gas 112 in order to describe a fine structure body 102b.
  • FIGS. 3 to 6 are Scanning Electron Microscopy (SEM) images illustrating concrete examples of a fine structure body 102b;
  • FIG. 3 is an SEM image obtained by imaging a surface of a fine structure body 102b according to one aspect
  • FIG. 4 is an SEM image obtained by imaging a cross section of the same fine structure body 102b.
  • FIG. 5 is an SEM image obtained by imaging a surface of a fine structure body 102b according to another aspect, while FIG. 6 is an SEM image obtained by imaging a cross section of the same fine structure body 102b.
  • a scale bar in each of FIGS. 3 to 6 indicates 1 ⁇ m.
  • Each of the fine structural bodies 102b illustrated in FIGS. 2 to 6 has a height h (see FIG. 2 ) of 10 ⁇ m or less and a surface area of ten times or more of a smooth surface.
  • the heat transfer performance can be improved when a condition that the height h of a fine structure body 102b is 10 ⁇ m or less and a condition that the surface area is ten times or more of a case of a smooth surface are simultaneously satisfied.
  • the heat transfer performance cannot be improved when the height h of a fine structure body 102b exceeds 10 ⁇ m or when the surface area is smaller than ten times of a smooth surface. It is to be noted that, although the height h of a fine structure body 102b exceeding a boundary layer can provide a high cooling effect, pressure loss occurs as a trade-off therefor. When pressure loss occurs, the heat transfer performance is sometimes not improved totally. Moreover, when the surface area is smaller than ten times of a smooth surface, high heat transfer performance cannot be obtained. It is to be noted that a boundary layer means a thin layer which exists in the vicinity of a boundary of a contact surface 102a and in which gas viscosity cannot be neglected (which is strongly influenced by gas viscosity).
  • the heat transfer performance of the heat exchanger 100 can be improved even when the gas flow is a laminar flow
  • the gas flow is desirably a turbulent flow since the heat transfer performance of the heat exchanger 100 can be further improved.
  • the Reynolds number of gas is 30,000 or larger. In such a case, it is possible to improve the heat transfer performance of the heat exchanger 100 more reliably.
  • the Reynolds number of gas can be 30,000 by increasing the flow rate of gas introduced through the nozzle 113 into the device.
  • the fine structure body 102b is made of the same material as the base material of the heat transfer units 102, i.e., copper or copper alloy, and is more desirably not made of an oxide thereof.
  • the heat conductivity lowers and the heat transfer performance of the heat exchanger 100 lowers.
  • heat conductivity equal to or larger than the base material can be provided. That is, heat transferred through the heat transfer units 102 can be efficiently transferred to gas.
  • the shape of the fine structure body 102b is a dendritic structure or a needle-like structure.
  • a dendritic structure means a structure having branches from the center toward the outside, while a needle-like structure literally means a structure like a needle.
  • Such structures can enlarge the surface area and improve the heat transfer performance of the heat exchanger 100 more reliably.
  • the length L of the heat transfer unit 102 provided with the fine structure body 102b is 25 times or more of the characteristic length of the flow.
  • a characteristic length of a flow in this embodiment corresponds to the hydraulic equivalent diameter of a flow along tube holes 104 (tubes).
  • a hydraulic equivalent diameter means the diameter of a circular tube equivalent to a cross section of a flow passage and can be represented as 4S 1 /L 1 .
  • S 1 denotes a flow passage cross sectional area
  • L 1 denotes a cross sectional length.
  • a contact surface which is a rear surface of the contact surface 102a, to be in contact with water vapor 107
  • a fine structure body similar to the above-described fine structure body 102b may be or may be not provided.
  • a fine structure body having a shape, size, surface area, height or the like different from that of the fine structure body 102b can be provided on the contact surface to be in contact with water vapor 107.
  • One suitable method to form the above-described fine structure body 102b on a surface of the heat transfer unit 102 is Multibond treatment or blackening reduction treatment, and the fine structure body 102b is desirably formed by such treatment.
  • Multibond treatment can be achieved by using cleaning liquid, pre-dip liquid and Multibond liquid manufactured by Nippon MacDermid Co., Ltd., for example, and performing treatment in this order.
  • Conditions for treatment with cleaning liquid can be a liquid temperature of 50°C and a treatment time of 3 minutes, for example.
  • Conditions for treatment with pre-dip liquid can be a liquid temperature of 25°C and a treatment time of 1 minute, for example.
  • Conditions for treatment with Multibond liquid can be a liquid temperature of 32°C, a treatment time of 2 minutes, and the like, for example. It is to be noted that these conditions can be modified as appropriate, and washing with water or drying can be performed as appropriate after each treatment.
  • etching with copper etching liquid including ammonium persulfate may be performed after degreasing with degreasing liquid including NaOH, for example; an oxide film may be then removed by oxide film removing liquid including sulfuric acid; blackening treatment with blackening treatment liquid including sodium chlorite, sodium hydroxide and sodium phosphate may be then performed; and reduction treatment with reduction treatment liquid including dimethylamine borane may be then performed.
  • Conditions for treatment with degreasing liquid can be a liquid temperature of 60°C and a treatment time of 3 minutes, for example, and conditions for treatment with copper etching liquid can be a liquid temperature of 25°C and a treatment time of 1 minute, for example.
  • conditions for treatment with oxide film removing liquid can be a liquid temperature of 25°C and a treatment time of 3 minutes, for example, and conditions for treatment with blackening treatment liquid can be a liquid temperature of 70°C and a treatment time of 8 minutes, for example.
  • conditions for treatment with reduction treatment liquid can be a liquid temperature of 25°C and a treatment time of 5 minutes, for example. It is to be noted that these conditions can be modified as appropriate, and washing with water or drying can be performed as appropriate after each treatment.
  • the fine structure body 102b illustrated in FIGS. 3 and 4 can be obtained.
  • the fine structure body 102b illustrated in FIGS. 5 and 6 can be obtained.
  • the contact surface 102a of the heat transfer unit 102 to be in contact with gas 112 is provided with the above-described fine structure body 102b, and therefore high heat transfer performance can be exhibited even when the gas flow is a laminar flow. In addition, further higher heat transfer performance can be exhibited when the gas flow is a turbulent flow.
  • the heat exchanger 100 according to this embodiment therefore can improve heat transfer performance without increasing the number of heat transfer units. Accordingly, it is possible to decrease the number of heat transfer units required to obtain target heat transfer performance, and therefore costs for a heat exchanger can be reduced. In addition, it is also possible to realize miniaturization and weight reduction of a heat exchanger.
  • Treatment No. 1 Treatment by Multibond Treatment
  • a dendritic structure body smaller than the boundary layer thickness was formed on a surface of a specimen prepared from a copper plate (C1020 prescribed in JIS H 3100) having the same chemical composition as that of a copper tube to be used as a heat transfer tube of a shell and tube type heat exchanger.
  • Such a dendritic structure body was formed using Multibond from Nippon MacDermid Co., Ltd., and was specifically formed as follows.
  • a copper plate was treated at a liquid temperature of 50°C for a treatment time of 3 minutes with cleaning liquid (MB-115; concentration of 100 mL/L), and was then washed with water.
  • cleaning liquid MB-115; concentration of 100 mL/L
  • the copper plate was treated at a liquid temperature of 25°C for a treatment time of 1 minute with pre-dip liquid (MB-100B; concentration of 20 mL/L, MB-100C; concentration of 29 mL/L).
  • pre-dip liquid MB-100B; concentration of 20 mL/L, MB-100C; concentration of 29 mL/L.
  • the copper plate was treated at a liquid temperature of 32°C for a treatment time of 2 minutes with Multibond liquid (MB-100A; concentration of 100 mL/L, MB-100B; concentration of 80 mL/L, MB-100C; concentration of 43 mL/L, sulfuric acid concentration of 50 mL/L), and was then washed with water and dried.
  • Multibond liquid MB-100A; concentration of 100 mL/L, MB-100B; concentration of 80 mL/L, MB-100C; concentration of 43 mL/L, sulfuric acid concentration of 50 mL/L
  • the SEM image in FIG. 3 was obtained by imaging a surface of the copper plate with an SEM after performing the Multibond treatment, and the SEM image in FIG. 4 was obtained by imaging a cross section of the copper plate.
  • Treatment No. 2 Treatment by Blackening Reduction Treatment. This example does not form part of the invention.
  • Treatment No. 2 a needle-like structure body smaller than the boundary layer thickness was formed on a surface of a specimen prepared from the same copper plate as that of Treatment No. 1.
  • Such a needle-like structure body was formed by exposing the copper plate to blackening reduction treatment, and was specifically formed as follows.
  • the copper plate was treated at a liquid temperature of 60°C for a treatment time of 3 minutes with degreasing liquid (NaOH concentration of 40 g/L), and was then washed with water.
  • degreasing liquid NaOH concentration of 40 g/L
  • the copper plate was treated at a liquid temperature of 25°C for a treatment time of 1 minute with copper etching liquid (Ammonium persulfate concentration of 200 g/L, sulfuric acid concentration of 5 mL/L), and was then washed with water.
  • copper etching liquid Ammonium persulfate concentration of 200 g/L, sulfuric acid concentration of 5 mL/L
  • the copper plate was treated at a liquid temperature of 25°C for a treatment time of 3 minutes with oxide film removing liquid (sulfuric acid concentration of 30 mL/L), and was then washed with water.
  • the copper plate was treated at a liquid temperature of 70°C for a treatment time of 8 minutes with blackening treatment liquid (sodium chlorite concentration of 90 g/L, sodium hydroxide concentration of 30 g/L, sodium phosphate concentration of 15 g/L), and was then washed with water.
  • blackening treatment liquid sodium chlorite concentration of 90 g/L, sodium hydroxide concentration of 30 g/L, sodium phosphate concentration of 15 g/L
  • the copper plate was treated at a liquid temperature of 25°C for a treatment time of 5 minutes with reduction treatment liquid (dimethylamine borane concentration of 30 g/L), and was then washed with water and dried.
  • reduction treatment liquid dimethylamine borane concentration of 30 g/L
  • the SEM image in FIG. 5 was obtained by imaging a surface of the copper plate with an SEM after performing the blackening reduction treatment, and the SEM image in FIG. 6 was obtained by imaging a cross section of the copper plate.
  • needle-like structure body was densely formed.
  • a needle-like structure body having a width of 0.1 ⁇ m or less was continuously formed on the base material of the copper plate. It is to be noted that the needle-like structure body is copper as with the base material.
  • Treatment No. 3 Treatment not by Reduction Treatment but only by Blackening Treatment.
  • Treatment No. 3 a needle-like structure body smaller than the boundary layer thickness was formed on a surface of a specimen prepared from the same copper plate as that of Treatment No. 1 in a way similar to Treatment No. 2.
  • the treatment with reduction treatment liquid described in Treatment No. 2 was not performed. That is, the copper plate was exposed to blackening treatment with blackening treatment liquid, and was then washed with water and dried, and all treatment was completed.
  • a surface of the copper plate was imaged with an SEM after performing such blackening treatment, and it was confirmed that a fine needle-like structure body similar to that of Treatment No. 2 was densely formed. It was also confirmed that, on a surface of such a copper plate, a needle-like structure having a width of 0.1 ⁇ m or less was continuously formed on the base material as the copper plate as with the copper plate of Treatment No. 2. It is to be noted that the needle-like structure body is copper oxide.
  • FIG. 7 is a block diagram of a testing device 200 used for conducting a heat transfer test.
  • FIG. 8 is a sectional view taken along line A-A of FIG. 7 .
  • such a testing device 200 is provided with a rectangular tube 201, an air compressor 202, a panel heater 203 (see FIG. 8 ), an inlet thermometer 204, a specimen thermometer 205 and a mass flowmeter 206.
  • the rectangular tube 201 is made of stainless steel, and has an entrance region 207 at an upstream part thereof and a heating region 208 at a central part thereof.
  • a specimen 209 treated in Treatment No. 1 - 3 was located at an upper part of a heating region 208 of the rectangular tube 201 as illustrated in FIG. 8 , and the panel heater 203 was located on an upper surface of the specimen 209. It is to be noted that the specimen 209 was located with a surface treated in Treatment No. 1 - 3 (contact surface 102a in the present invention) existing inside the rectangular tube 201.
  • a surface on which the panel heater 203 is located is a smooth surface.
  • thermocouple for temperature measurement is located in the entrance region 207 of the rectangular tube 201 as the inlet thermometer 204, and the other thermocouple is located inside the specimen 209 as the specimen thermometer 205.
  • the flow velocity of gas is 8 - 55 m/s, and the Reynolds number is 30,000 - 180,000.
  • the boundary layer thickness under these conditions is estimated to be 60 - 300 ⁇ m.
  • the heat transfer coefficient calculated from a temperature measured in the heat transfer test was evaluated as the rate of improvement of heat conduction on the basis of a specimen having a smooth surface which has not been exposed to surface treatment.
  • the surface area was measured by a krypton gas adsorption method. It is to be noted that the krypton gas adsorption method was performed according to JIS Z 8830. The measured surface area was evaluated as a surface area ratio based on a specimen having a smooth surface which has not been exposed to surface treatment.
  • Table 1 The result of evaluation on the rate of improvement of heat conduction and the surface area ratio is shown in Table 1. It is to be noted that Table 1 additionally shows the height of a fine structure body calculated from an SEM image and the material of a fine structure body and the base material of a copper plate (described as "fine structure body/base material” in Table 1). [Table 1] Rate of Improvement of Heat Conduction Surface Area Ratio Height of Fine Structure Body Fine Structure Body/Base Material Treatment No. 1 11% 58 times 2.3 ⁇ m Copper/Copper Treatment No. 2 10% 48 times 0.7 ⁇ m Copper/Copper Treatment No. 3 0% 48 times 0.7 ⁇ m Copper Oxide/Copper
  • the rate of improvement of heat conduction was 11% in Treatment No. 1, 10% in Treatment No. 2, and 0% in Treatment No. 3.
  • the surface area ratio was 58 times in Treatment No. 1, and 48 times in Treatment Nos. 2 and 3.
  • the height of a fine structure body was 2.3 ⁇ m in Treatment No. 1, and 0.7 ⁇ m in Treatment Nos. 2 and 3.
  • the fine structure body/base material was copper/copper in Treatment Nos. 1 and 2, and copper oxide/copper in Treatment No. 3.
  • the height is 10 ⁇ m or less and the surface area is 10 times or more of a smooth surface
  • a fine structure body was made of the same material as that of the base material or, when the material of a fine structure body was different from that of the base material, heat conductivity was equal to or larger than that of the base material, in order to improve the heat transfer performance of a heat exchanger configured to perform heat exchange between gas and a heat transfer unit in a gas flow state where the Reynolds number of gas is 30,000 or larger.
  • a method of forming a fine structure body having a height of 10 ⁇ m or less and a surface area of 10 times or more of a smooth surface is not limited to the method described above but may be achieved by machining or the like.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Claims (3)

  1. Échangeur de chaleur (100) comprenant une unité de transfert de chaleur (102) configurée pour effectuer un échange de chaleur par contact avec un gaz (112), dans lequel une surface de contact (102a) de l'unité de transfert de chaleur (102) destinée à être en contact avec le gaz (112) et dotée d'un corps à structure fine (102b) qui a une hauteur de 10 µm ou moins et une aire superficielle qui est 10 fois ou plus celle d'une surface lisse,
    caractérisé en ce que
    le corps à structure fine (102b) a la forme d'une structure dendritique,
    le corps à structure fine (102b) est formé du même matériau que celui d'un matériau de base formant la surface de contact (102a), et
    le matériau de base formant la surface de contact (102a) est du cuivre ou un alliage de cuivre.
  2. Utilisation de l'échangeur de chaleur selon la revendication 1, dans lequel le gaz (112) a un nombre de Reynolds égal à 30 000 ou plus.
  3. Utilisation de l'échangeur de chaleur selon la revendication 1, dans lequel l'unité de transfert de chaleur (102) a une longueur qui est 25 fois ou plus qu'une longueur caractéristique d'un écoulement.
EP13884903.9A 2013-05-17 2013-05-17 Échangeur de chaleur Active EP2998687B1 (fr)

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KR20190087632A (ko) * 2016-12-13 2019-07-24 더 텍사스 에이 앤드 엠 유니버시티 시스템 증기 압축 담수화에 특정 용도를 갖는 현열교환기 및 잠열교환기

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EP2998687A4 (fr) 2017-02-01
WO2014184964A1 (fr) 2014-11-20
JPWO2014184964A1 (ja) 2017-02-23
US20160091254A1 (en) 2016-03-31
EP2998687A1 (fr) 2016-03-23

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