EP2997524A1 - Procédé de fabrication pour des supports de données portatifs - Google Patents

Procédé de fabrication pour des supports de données portatifs

Info

Publication number
EP2997524A1
EP2997524A1 EP14723707.7A EP14723707A EP2997524A1 EP 2997524 A1 EP2997524 A1 EP 2997524A1 EP 14723707 A EP14723707 A EP 14723707A EP 2997524 A1 EP2997524 A1 EP 2997524A1
Authority
EP
European Patent Office
Prior art keywords
film
component
printed
components
portable data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP14723707.7A
Other languages
German (de)
English (en)
Inventor
Thomas Tarantino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP2997524A1 publication Critical patent/EP2997524A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil

Definitions

  • the invention describes a manufacturing method for portable data carriers.
  • the object of the invention is defined by the independent claims 1 and. solved the independent claim 15.
  • Advantageous embodiments are described in the dependent claims.
  • the invention discloses a method for producing a portable data carrier, which is characterized in that at least one spatial structure is printed, wherein the shape and size of the at least one structure corresponds to at least one component to be used in the at least one structure.
  • the advantage of the invention is that a structure can be printed by means of a three-dimensional printing process, as is known, for example, from rapid prototyping, which can be adapted quickly, easily and inexpensively to changed dimensions of a component or to changed customer requirements.
  • the dimensions or shape and size of the components to be inserted into the structure are detected electronically and the structure is appropriately printed. This saves the previously time-consuming and costly effort to adapt material and manufacturing machines for the production of portable data carriers.
  • An advantageous embodiment of the invention is that the at least one structure is printed on at least one first film.
  • the advantage is that the structure can be processed more easily if the structure is printed on a foil.
  • the film offers the possibility of changing a design on the film to an outside of the data carrier.
  • An advantageous embodiment of the invention is that at least one conductor track is applied to the at least one structure, so that the at least one conductor track is electrically conductively connected at least to a component to be used. Depending on the structure and the component used, the position of the printed conductors can thus be adapted flexibly. A pre-production of printed conductors is therefore not necessary.
  • An advantageous embodiment of the invention is that the at least one conductor track is produced by spraying or casting. The spraying or casting of printed conductors has the advantage that it is very easy, inexpensive and flexible conductor tracks can be laid.
  • An advantageous embodiment of the invention is that before inserting the at least one component into the at least one structure, an adhesive is applied to the at least one structure and / or to the at least one component to fix the at least one component and / or unevenness to compensate for the at least one structure and / or to electrically conductively connect the at least one component to at least one conductor track.
  • An advantageous embodiment of the invention is that the inserted into the at least one structure at least one component is at least partially covered by a printed cover, so that a flat outer surface of the data carrier is formed.
  • An advantageous embodiment of the invention is that at least one cavity is formed between the at least one component and the cover.
  • a cavity offers the possibility of obstructing elements which require a certain amount of space for your operation, such as vibrating components.
  • An advantageous embodiment of the invention is that at least a second film is applied to the cover.
  • the outsides can be provided with a particular design on the slides.
  • An advantageous embodiment of the invention is that in the at least one structure as a component, an electronic component is inserted.
  • an electronic component for example, offers a chip and / or an antenna coil and / or a contact surface according to ISO 7810 and / or a sensor and / or an electronic display and / or a button, which is inserted into the structure.
  • An advantageous embodiment of the invention is that at least the first and / or at least the second film is provided as a film sheet or as a developed from a roll of film web.
  • the processing of film as a sheet or wound on a roll film lends itself to be able to produce efficiently and quickly, the processing of the film from the roll is much faster than the processing of the film in the sheet.
  • An advantageous embodiment of the invention is that in the at least one structure and / or in the at least first and / or in the at least second film at least one recess is introduced.
  • the advantage of a recess is that, for example, the portable data carrier can be pre-produced and at a later time a recess suitable for a component to be used can be produced.
  • the at least one recess is advantageously produced by means of a milling cutter and / or a punch and / or a laser and / or a water jet.
  • the recess may, for example, have the form of a chip module to be inserted into the recess.
  • An advantageous embodiment of the invention is that at least the first and / or at least the second film is printed.
  • the advantage of printing on the films, for example during the unwinding of the film is that Any designs can be applied to the film and only as many designs are produced, as currently required.
  • a digital printing method is available, which is also suitable for the in-line production of portable data carriers.
  • An advantageous embodiment of the invention is that at least the first film and / or at least the second film is translucent or opaque.
  • the use of translucent films lends itself, for example, to display cards whose display is protected by a translucent film to the outside.
  • the use of opaque films lends itself to media containing, for example, electronic components that should not be visible from the outside.
  • At least the first film and / or at least the second film comprises at least one film layer.
  • Different film layers can be used, for example, to influence the mechanical properties of the portable data carrier, such as e.g. the elasticity.
  • suitable film materials can be combined to achieve desired mechanical properties.
  • An advantageous embodiment of the invention is that at least the first and / or at least the second film is connected by means of the adhesive to the cover. Bonding the cover and the film with adhesive allows quick connection of the two components.
  • An advantageous embodiment of the invention is that the adhesive cures at room temperature.
  • the advantage of a room temperature curing adhesive is that no additional energy is needed to cure the adhesive at an elevated temperature.
  • An advantageous embodiment of the invention is that the adhesive is an electrically conductive adhesive.
  • An electrically conductive adhesive has the advantage that both a mechanically strong connection and an electrically conductive connection can be produced in one operation.
  • An advantageous embodiment of the invention is that are punched out of the sheet of film or from the sheet media.
  • punching it is advantageously possible to use rotary punches which enable a particularly high throughput of the data carriers to be produced.
  • These punches are particularly suitable for use in a so-called in-line production of portable data carriers, since a film is unwound from the roll and then all processing steps are carried out with the film as a web until the finished media are punched out of the processed film at the end.
  • the invention further describes portable data carriers, which are produced according to the method described above.
  • FIGS. 1 to 8 illustrate the individual steps for producing a portable data carrier according to the method of the invention.
  • FIG. 9 shows an alternative embodiment with a module inserted from the outside.
  • a translucent or an opaque film 2 is provided in FIG. 1 as a sheet or as a film unwound from a roll.
  • a translucent film 2 for display cards or an opaque film 2 for cards with electronic components that should not be visible from the outside is used.
  • a partially transparent film can be used, for. B. a film which has translucent and opaque stripes.
  • a design or an artwork or other imprint 4 is applied in FIG. All suitable printing methods can be used for this.
  • a digital printing process is particularly suitable for a so-called roll-to-roll process, which means that at least one film 2 is provided by the roll for the process.
  • the film 2 is unwound, fed to the process and rewound, for example, after the process to further process the film 2 or to punch out for example from the processed film 2 disk.
  • the film 2 may be printed during a pass through the process, inter alia, by means of the digital printing process.
  • a structure 6 is printed in Figure 3 by means of a three-dimensional printer 8.
  • a printer 8 any suitable printer can be used to create three-dimensional structures.
  • printers for a so-called rapid prototyping method can be used for the present invention.
  • the structure 6 has the shape and size or the dimensions of later to be used in the structure 6 components on.
  • the structure 6 can also be slightly larger than the component to be used.
  • At least one printed conductor 12 is applied in FIG. 4 by means of a dosing head 10.
  • the conductor 12 can be printed or sprayed or poured, for example.
  • the conductor 12 is laid so that the conductor 12 corresponding electrically conductively connects corresponding contacts of later einitzden components.
  • components 14 are inserted into the structure 6 and optionally connected to the conductor track 12.
  • an adhesive can be applied to the component 14 or to the structure 6 in order to fix the component 14 or to compensate for irregularities on the structure 6.
  • a cover 16 is applied to the components 14 by means of the three-dimensional printer 8, as shown in FIGS. 6 and 7.
  • the components 14 are completely enclosed.
  • cavities between the components 14 and the cover 16 may be formed in order to use the cavities for a later function of the components 14, for example for a vibrating component.
  • a film 18 is applied to the cover 16.
  • the film 18 may have an imprint 20 on at least one side.
  • the film 18 itself can be fixed on the cover 16 by means of an adhesive.
  • the adhesive can be heat activated or cured at room temperature.
  • an electrically conductive adhesive can be used, especially in the region of an electrically conductive connection between the contact of a component and the conductor 12.
  • FIG. 9 shows an alternative embodiment with a module 22 inserted from the outside.
  • a recess was provided in the film 2 and in the print 4.
  • the recess has a size to insert a module 22, for example a chip module, from the outside, wherein the size of the recess can also be slightly larger than the module 22 to be used.
  • To mill out the structure 6 to create a recess for the module 22 to avoid the shape or size of the module 22 can be recessed in the printing of the structure 6.
  • Translucent or opaque film or a film that has both translucent and opaque areas design, artwork, imprint

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un support de données portatif, par exemple une carte à puces, qui est caractérisé en ce qu'une structure spatiale (6) est imprimée sur une première feuille (2). Des lignes électroconductrices (12) sont tout d'abord appliquées, par exemple pulvérisées ou coulées, sur la structure (6) et des éléments (14) comme par exemple une puce ou une bobine d'antenne sont ensuite insérés dans la structure (6), cette dernière (6) correspondant aux dimensions, notamment à la forme ou à la grandeur des éléments (14) insérés. Les éléments (14) sont reliés de manière électriquement conductrice aux lignes (12). Une couverture (16) est imprimée sur les éléments (14). Une deuxième feuille (18) peut être appliquée sur la couverture (16), une impression de motif (4, 20) pouvant être appliquée sur les deux feuilles (2, 18). Un évidement peut en outre être pratiqué dans la structure (6) et les feuilles (2, 18) pour insérer par exemple un module de puce (22).
EP14723707.7A 2013-05-16 2014-04-29 Procédé de fabrication pour des supports de données portatifs Ceased EP2997524A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013008506.3A DE102013008506A1 (de) 2013-05-16 2013-05-16 Herstellungsverfahren für tragbare Datenträger
PCT/EP2014/001150 WO2014183836A1 (fr) 2013-05-16 2014-04-29 Procédé de fabrication pour des supports de données portatifs

Publications (1)

Publication Number Publication Date
EP2997524A1 true EP2997524A1 (fr) 2016-03-23

Family

ID=50721737

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14723707.7A Ceased EP2997524A1 (fr) 2013-05-16 2014-04-29 Procédé de fabrication pour des supports de données portatifs

Country Status (4)

Country Link
US (1) US10015886B2 (fr)
EP (1) EP2997524A1 (fr)
DE (1) DE102013008506A1 (fr)
WO (1) WO2014183836A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018105755U1 (de) * 2018-10-08 2019-11-11 Igus Gmbh Kunststoff-Gleitelement mit Sensorfunktion, insbesondere mit Verschleißerkennung
PL3864309T3 (pl) 2018-10-08 2023-08-28 Igus Gmbh Element ślizgowy z tworzywa sztucznego z funkcję czujnika, zwłaszcza z wykrywaniem zużycia

Citations (2)

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Publication number Priority date Publication date Assignee Title
WO2008101529A1 (fr) * 2007-02-19 2008-08-28 Smartrac Ip B.V. Procédé et demi-produit permettant la production d'un inlay
DE102009014343A1 (de) * 2009-03-21 2010-09-23 Deutsche Telekom Ag Verfahren zum Herstellen einer eine kontaktlose und eine kontaktbehaftete Schnittstelle aufweisenden Chipkarte

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US7323634B2 (en) * 1998-10-14 2008-01-29 Patterning Technologies Limited Method of forming an electronic device
DE19854986A1 (de) 1998-11-27 2000-05-31 Giesecke & Devrient Gmbh Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen
GB0127252D0 (en) 2001-11-13 2002-01-02 Vantico Ag Production of composite articles composed of thin layers
WO2008047630A1 (fr) * 2006-10-12 2008-04-24 Dai Nippon Printing Co., Ltd. Étiquette à marqueur à circuits imprimés
BRPI0921628B1 (pt) * 2008-11-03 2020-05-12 Smartrac Technology Gmbh Processo para produção de um produto transponder rfid e produto transponder rfid produzido pelo processo
DE102009006341A1 (de) * 2009-01-27 2010-07-29 Giesecke & Devrient Gmbh Datenträgeranordnung
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
US8770488B2 (en) * 2010-08-12 2014-07-08 Fofitec Ag Method for the production of punched parts in web- or sheet-like print substrates and their further processing
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008101529A1 (fr) * 2007-02-19 2008-08-28 Smartrac Ip B.V. Procédé et demi-produit permettant la production d'un inlay
DE102009014343A1 (de) * 2009-03-21 2010-09-23 Deutsche Telekom Ag Verfahren zum Herstellen einer eine kontaktlose und eine kontaktbehaftete Schnittstelle aufweisenden Chipkarte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014183836A1 *

Also Published As

Publication number Publication date
DE102013008506A1 (de) 2014-11-20
WO2014183836A1 (fr) 2014-11-20
US10015886B2 (en) 2018-07-03
US20160120036A1 (en) 2016-04-28

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