EP2963332A1 - Lampeneinheit und Beleuchtungsvorrichtung - Google Patents

Lampeneinheit und Beleuchtungsvorrichtung Download PDF

Info

Publication number
EP2963332A1
EP2963332A1 EP15150929.6A EP15150929A EP2963332A1 EP 2963332 A1 EP2963332 A1 EP 2963332A1 EP 15150929 A EP15150929 A EP 15150929A EP 2963332 A1 EP2963332 A1 EP 2963332A1
Authority
EP
European Patent Office
Prior art keywords
unit
housing
end side
power circuit
metal housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15150929.6A
Other languages
English (en)
French (fr)
Inventor
Takeshi Hisayasu
Taichi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of EP2963332A1 publication Critical patent/EP2963332A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • FIGS. 1 to 5 a first embodiment will be described with reference to FIGS. 1 to 5 .
  • a virtual lamp center axis which passes through a center of the lamp unit 10 from the globe 15 to the base 17 is included, and descriptions will be made by setting a side on which the globe 15 is located when viewed from the base 17 to one end side, and a side which is opposite to the one end side, and on which the base 17 is located when viewed from the globe 15 to the other end side, in the lamp center axis.
  • the housing 11 includes a resin housing 20 in a hollow shape, and a metal housing 21 which is arranged inside the resin housing 20.
  • the resin housing 20 is formed of a resin material with an insulation property.
  • the resin housing 20 is respectively open on one end side, and on the other end side, and is formed in a cylindrical shape of which a diameter contracts from one end side to the other end side.
  • the resin housing 20 includes one end cylindrical portion 23a which is located on one end side, an inclined cylindrical portion 23b of which a diameter contracts toward the other end side from the one end cylindrical portion 23a, an intermediate cylindrical portion 23c which is located on the other end side of the inclined cylindrical portion 23b, an inclined cylindrical portion 23d of which a diameter contracts from the intermediate cylindrical portion 23c to the other end side, and the other end cylindrical portion 23e which is located on the other end side of the inclined cylindrical portion 23d.
  • a plurality of mounting holes 28 in which first screws 27 as a plurality of screws which jointly fasten and fix the heat radiating plate 12 and the metal housing 21 to the resin housing 20 are screwed are formed in the board mounting unit 25.
  • a plurality of escape holes 30 into which a plurality of second screws 29 which fasten and fix the light emitting module 13 to the heat radiating plate 12 intrude are formed in the board mounting unit 25.
  • a positioning protrusion 31 which positions the metal housing 21 which is incorporated in the resin housing 20, the heat radiating plate 12, and the light emitting module 13, respectively, is provided in a protruding manner, in the board mounting unit 25.
  • the power circuit holding unit 35 is formed by being divided into a first forming region from the one end cylindrical portion 23a of the resin housing 20 to the inclined cylindrical portion 23b and a middle position of the intermediate cylindrical portion 23c, and a second forming region of the other end cylindrical portion 23e.
  • the first forming region is a region corresponding to an arranging region of the metal housing 21 which is arranged inside the resin housing 20.
  • the power circuit holding unit 35 may be continuously formed over the first forming region and the second forming region.
  • the width dimension of the holding wall 36 in the aligning direction of the pair of holding walls 36 is preferably 1 mm or greater, when considering insulation between the power circuit 16 and the metal housing 21, and rigidity of the holding wall 36.
  • the metal housing member 39 cannot obtain sufficient thermal conductivity when the plate thickness does not have a certain thickness, and on the other hand, when the thickness exceeds a certain thickness, only mass increases, and thermal conductivity is not improved much, and therefore it is preferable to set the thickness to approximately 1 mm to 3.5 mm. In addition, it is more preferable to set the plate thickness of the metal housing member 39 to 2 mm.
  • the metal housing member 39 is formed in a half cylindrical shape of which a diameter contracts from one end side to the other end side.
  • the metal housing member includes one end half cylindrical portion 40a which is arranged along the inside of the one end cylindrical portion 23a of the resin housing 20, an inclined half cylindrical portion 40b which is arranged along the inside of the inclined cylindrical portion 23b, and the other end half cylindrical portion 40c which is arranged along the inside of the intermediate cylindrical portion 23c.
  • the length on the other end of the the other end half cylindrical portion 40c is formed to the intermediate position of the intermediate cylindrical portion 23c.
  • a plurality of insertion holes 49 into which the plurality of first screws 27 are inserted, and a plurality of screw holes 50a to which the plurality of second screws 29 are screwed, and a plurality of insertion holes 50b into which the plurality of second screws 29 are inserted are formed on the outer peripheral portion of the heat radiating plate 12.
  • the third screw 51 is configured so as to jointly fasten and fix the cover 14, the light emitting module 13, and the heat radiating plate 12.
  • a positioning groove 58 which is put into the positioning protrusion 31 of the board mounting unit 25 is formed on the outer peripheral portion of the board 55.
  • a plurality of insertion holes 59 into which the plurality of first screws 27 are inserted, and a plurality of insertion holes 60 into which the plurality of second screws 29 are inserted are formed at the outer peripheral portion of the board 55.
  • a plurality of insertion holes 61 into which the third screws 51 are inserted are formed at the inner peripheral portion of the board 55.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP15150929.6A 2014-06-30 2015-01-13 Lampeneinheit und Beleuchtungsvorrichtung Withdrawn EP2963332A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014134630A JP6269951B2 (ja) 2014-06-30 2014-06-30 ランプ装置および照明装置

Publications (1)

Publication Number Publication Date
EP2963332A1 true EP2963332A1 (de) 2016-01-06

Family

ID=52440550

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15150929.6A Withdrawn EP2963332A1 (de) 2014-06-30 2015-01-13 Lampeneinheit und Beleuchtungsvorrichtung

Country Status (3)

Country Link
EP (1) EP2963332A1 (de)
JP (1) JP6269951B2 (de)
CN (1) CN204611393U (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112240491B (zh) * 2019-07-17 2022-08-09 松下知识产权经营株式会社 照明装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2525132A1 (de) * 2010-01-14 2012-11-21 Sharp Kabushiki Kaisha Beleuchtungsgerät
JP2013069441A (ja) * 2011-09-21 2013-04-18 Hitachi Appliances Inc 電球型照明装置
CN103453335A (zh) * 2012-05-30 2013-12-18 深圳市万家照明有限公司 一种灯体及led灯泡

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201314112A (zh) * 2011-09-29 2013-04-01 Foxsemicon Integrated Tech Inc 燈具
JP5283765B2 (ja) * 2012-01-20 2013-09-04 シャープ株式会社 照明装置
WO2013183198A1 (ja) * 2012-06-07 2013-12-12 パナソニック株式会社 ランプおよび照明装置
JP5421504B1 (ja) * 2012-06-07 2014-02-19 パナソニック株式会社 ランプおよび照明装置
JP3179327U (ja) * 2012-08-14 2012-10-25 廈門星際電器有限公司 全方向型ｌｅｄランプ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2525132A1 (de) * 2010-01-14 2012-11-21 Sharp Kabushiki Kaisha Beleuchtungsgerät
JP2013069441A (ja) * 2011-09-21 2013-04-18 Hitachi Appliances Inc 電球型照明装置
CN103453335A (zh) * 2012-05-30 2013-12-18 深圳市万家照明有限公司 一种灯体及led灯泡

Also Published As

Publication number Publication date
JP2016012523A (ja) 2016-01-21
CN204611393U (zh) 2015-09-02
JP6269951B2 (ja) 2018-01-31

Similar Documents

Publication Publication Date Title
JP5799850B2 (ja) ランプ装置および照明器具
US8523410B2 (en) Light source device with thermal dissipating members
US8814399B2 (en) Luminaire having radiator
JP5565583B2 (ja) 電球形ランプおよび照明器具
JP4914511B2 (ja) 照明装置
EP2574838B1 (de) LED-Beleuchtungsvorrichtung und LED-Leuchte
JP2014154230A (ja) ランプ装置、発光装置および照明装置
JP6380759B2 (ja) 照明器具
WO2012008175A1 (ja) 照明装置
JP2014060070A (ja) 照明装置
JP6566189B2 (ja) 照明器具
EP2963332A1 (de) Lampeneinheit und Beleuchtungsvorrichtung
JP6485717B2 (ja) ランプ装置および照明装置
JP2012079708A (ja) 照明装置
JP6688471B2 (ja) ランプ装置および照明装置
JP6332631B2 (ja) ランプ装置および照明装置
JP5283765B2 (ja) 照明装置
JP6222466B2 (ja) ランプ装置および照明器具
JP6173790B2 (ja) 電球型照明装置
JP6719396B2 (ja) 電球型照明装置
JP2018045850A (ja) 電球型照明装置
EP2896873A1 (de) Lampe
JP2015185391A (ja) ランプ装置および照明器具
JP2018116941A (ja) ランプ装置および照明装置
JP2014229394A (ja) ランプ

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160707