EP2936553A1 - Method for producing an electronic assembly - Google Patents

Method for producing an electronic assembly

Info

Publication number
EP2936553A1
EP2936553A1 EP13811837.7A EP13811837A EP2936553A1 EP 2936553 A1 EP2936553 A1 EP 2936553A1 EP 13811837 A EP13811837 A EP 13811837A EP 2936553 A1 EP2936553 A1 EP 2936553A1
Authority
EP
European Patent Office
Prior art keywords
electronic component
encapsulation material
encapsulation
electronic
predetermined value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13811837.7A
Other languages
German (de)
French (fr)
Inventor
Lothar Biebricher
Michael SCHULMEISTER
Jakob Schillinger
Dietmar Huber
Thomas Fischer
Stefan GÜNTHNER
Waldemar BAUMUNG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of EP2936553A1 publication Critical patent/EP2936553A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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Definitions

  • the invention relates to a method for producing an electronic assembly and an electronic assembly.
  • a method of manufacturing an electronic package in which an electronic component carried on a wiring substrate is encapsulated with an encapsulation material comprises the steps of disposing the electronic component on the wiring substrate such that stress entry through the encapsulation material onto the electronic component predetermined value falls below and encapsulating the electronic component with the encapsulation material.
  • the specified method is based on the consideration that the above-mentioned electronic assembly is dimensioned very large, which is due to the fact that the electronic component must first be encapsulated independently and then embedded in a housing with another material for fixing. Accordingly, the structures require a lot of space, whereby the electronic assembly of the type mentioned as space-constrained technical applications such as surface-mounted device (engl: surface-mounted device), hereinafter referred to as SMD, unsuitable.
  • SMD surface-mounted device
  • the given method is based on the idea to use the embedding of the electronic component directly as a housing, so that can be dispensed with an extra housing to the embedding. This would noticeably reduce the necessary installation space for the entire electronic assembly.
  • the predetermined value for the stress entry can result directly or indirectly in the dimensioning.
  • a direct specification can be realized, for example, in the context of a simulation in which the predetermined value is specified directly.
  • Indirect specification can be realized, for example, by means of a series of comparison tests, in the context of which only an expected result, such as a certain reliability is specified and from which the predetermined value then implicitly results.
  • the encapsulation material has a thermal expansion coefficient which is in the range of a thermal expansion coefficient of the electronic component, so that the encapsulation material and the electronic assembly encapsulated therewith expand in the same way and thus have no or only minimal mechanical stress against one another muster.
  • the encapsulation material may comprise a curable resin, in particular an epoxy resin, so that the encapsulation of the electronic component can be carried out in a manner known to the person skilled in the art by means of transfer molding.
  • the electronic component can be arranged at a zero position of the wiring substrate, on which cancel the heat movements of the encapsulation material. In this way, a stress entry can also be reduced.
  • the electronic component can be an evaluation circuit for evaluating measurement signals from at least two encoder elements, wherein the two encoder elements can be arranged symmetrically about the evaluation circuit. In this way, a stress entry on the donor elements and an associated possible measurement error due to the known symmetry can be subsequently considered.
  • an encapsulation geometry can be selected for encapsulating the electronic component with the encapsulation material, in which a thermal movement of the encapsulation material falls below a predetermined value at least in one direction.
  • This geometry can be chosen in any desired manner, wherein the encapsulation geometry is particularly preferably selected such that a wall thickness of the encapsulation material on at least one wall of the electronic component falls below a predetermined value, so that the applied by the wall mechanical stress remains limited to a value dependent on this predetermined value of stress.
  • the disclosed method includes the step of wrapping the electronic component with a mechanical decoupling material prior to encapsulation.
  • the mechanical decoupling material further reduces the stress entry into the electronic assembly and thus reduces the mechanical stress on the electronic component.
  • Decoupling material set at least thixotropic In this way, the mechanical decoupling material can be poured onto the electronic component in a simple manner, but has sufficient stability in the cast-on state to completely encase the electronic component.
  • the wiring carrier comprises a connection for electrically contacting the electronic component with a printed circuit board and an electrical shielding layer
  • the specified method comprises the step of arranging the electronic component on the wiring support such that the electronic component is in at least one direction of the electrical assembly seen between the electrical shielding layer and the terminal is added.
  • the wiring substrate can be simultaneously used for improving the electromagnetic compatibility, called EMC, without requiring an extra electric shielding layer.
  • an electronic subassembly comprises an electronic component supported on a wiring support, which is encapsulated with a encapsulation material, wherein the electronic component is arranged on the wiring support such that a stress entry by the encapsulation material to the electronic component falls below a predetermined value.
  • the specified electronic assembly can be extended to features that correspond to the dependent claims of the specified method mutatis mutandis.
  • the specified electronic assembly is designed as an inertial sensor.
  • the specified electronic assembly can preferably be produced by a specified method.
  • a vehicle comprises a specified electronic module, in particular for detecting vehicle dynamics data.
  • 1 is a schematic view of a vehicle with a vehicle dynamics control
  • FIG. 2 shows a schematic view of an inertial sensor formed as an SMD component from FIG. 1, FIG.
  • Fig. 3 is a schematic view of an intermediate product of an inertial sensor of Fig. 1;
  • FIG. 4 shows a schematic view of an inertial sensor from FIG. 1 on a printed circuit board
  • FIG. and Fig. 5 shows a further schematic view of the inertial sensor of Fig. 1 show.
  • Fig. 1 shows a schematic view of a vehicle 2 with a known vehicle dynamics control. Details of this driving dynamics control can be found for example in DE 10 2011 080 789 AI.
  • the vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).
  • ABS antilock braking system
  • ESP electronic stability program
  • the vehicle 2 for speed sensors 10 on the wheels 6, which detect a rotational speed 12 of the wheels 6. Furthermore, the vehicle 2 has an inertial sensor 14 which detects driving dynamics data 16 of the vehicle 2, from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a longitudinal acceleration and / or a vertical acceleration can be output in a manner known per se to a person skilled in the art ,
  • a controller 18 can determine, in a manner known to the person skilled in the art, whether the vehicle 2 slips on the road or even deviates from the abovementioned predetermined trajectory and correspond with a known regulator output signal 20 to respond.
  • the regulator output signal 20 can then be used by an actuator 22 to control actuators 24, such as the brakes 8, to respond to slippage and deviation from the given trajectory in a manner known per se by means of actuating signals.
  • the controller 18 may be integrated, for example, in a known motor control of the vehicle 2. Also, the controller 18 and the actuator 22 as a common
  • Control device formed and optionally be integrated into the aforementioned engine control.
  • the inertial sensor 14 is shown as an external device outside the controller 18. In such a case, one speaks of an inertial sensor 14 designed as a satellite. In the present embodiment, however, the inertial sensor 14 is to be constructed as an SMD component so that it can be integrated into a housing of the controller 18, for example.
  • the inertial sensor 14 comprises at least one microelectromechanical system 26, termed MEMS 26, as a sensor which, in a manner known per se, transmits a signal, not further represented by the driving dynamics data 16, via bonding wires 28 to two signal evaluation circuits 30 in the form of application-specific integrated circuit 30 , ASIC 30 (English: application-specific integrated circuit) called outputs.
  • MEMS 26 microelectromechanical system 26
  • ASIC 30 application-specific integrated circuit
  • the MEMS 26 and the ASIC 30 are supported on a circuit board 32 and electrically contacted with various electrical leads 34 formed on the circuit board 32.
  • the circuit board 32 may be formed as a leadframe, which will be discussed in more detail later.
  • Lines 34 can be seen in Fig. 2 only a single line 34 in section.
  • the contacting can be directly, for example via a known FlipChip connection or, as shown in Fig. 2, via a bonding wire 28.
  • the MEMS 26 and the ASIC 30 may further be enveloped by a mechanical decoupling material 36, called globetop mass 36, which in turn may be encapsulated together with the MEMS 26 and the ASIC 30 in a molding material 38, such as an epoxy 38.
  • a mechanical decoupling material 36 called globetop mass 36
  • a molding material 38 such as an epoxy 38.
  • the injection molding material 38 could thus already serve alone as a housing of the inertial sensor 14 and the therein
  • Inertialsensor 14 corresponding contact options, as shown in Fig. 2 solder bumps 40 for electrical contacting with a circuit of the controller 18 is provided.
  • Gull-wing solder connections or J-lead solder connections may be formed, provided that the substrate is formed as a per se known and shown in Fig. 3 leadframe 32.
  • FIG. 3 Reference is made to FIG. 3, with reference to which the internal structure of the inertial sensor 14 is to be explained. To illustrate the many possibilities of how the inertial sensor 14 can be constructed as an SMD component, take place in FIG. 3,
  • Solder beads 40 formed as contact possibilities contact legs 40 as contact options.
  • the MEMS 26 and the ASIC 30 instead of on a
  • Printed circuit board 32 is carried as a wiring support on a leadframe 32 as a wiring support, on the contact legs 40 are formed, via which the MEMS 26 and the ASIC 30 can be electrically connected to the aforementioned circuit of the controller 18. For reasons of clarity, not all of these contact legs are provided with a reference symbol in FIG. 3.
  • the MEMS 26 and the ASIC 30 can be fixed on the leadframe 32 by soldering, gluing and / or adhesive films, such as DAF tapes known per se.
  • the electrical contacting can be done via the fixation and / or via bonding wires 28, of which for the sake of clarity not all are provided with a reference numeral.
  • another MEMS 26 may be carried on the ASIC 30, which may either also be used as a donor element to capture the vehicle dynamics data 16 or as an alternative donor element, for example to detect a temperature or other physical quantity.
  • other electrical components such as passive components could be interconnected on this leadframe.
  • the ASIC 30 and the MEMS 26 may be carried on a metal layer 46 which serves as the electrical shielding layer 46, thus enhancing the EMC of the fusion sensor 14.
  • the EMC of the fusion sensor 14 can be noticeably improved by supporting the entire electronic package on a circuit board 48 shown in FIG. 4 on the one hand and the electrical shielding layer 46 on the other hand.
  • tabs 50 are formed on the leadframe 32, where the leadframe 32 can be mechanically held during the Ummantelungsund / or encapsulation process.
  • Tab a moisture access to the ASIC 30 and the MEMS 26.
  • recesses 51 are formed on the tabs, which have the cross section of the reduce aforementioned penetration of the leadframe 32 by the injection molding material 38 to outside.
  • the injection molding material 38 and thus the encapsulation of the ASIC 30 and the MEMS 26 are further anchored in the recess 51.
  • the individual contact legs 40 in this case have anchoring elements, which in the present embodiment are designed, for example, as notches 52, on which the contact pins 40 are tapered. For the sake of clarity, not all of these notches are provided with a reference numeral in FIG. 3.
  • the notches 52 may be enclosed by the injection molding material 38 to prevent the contact pins 40 are subsequently pulled out of the injection molding material 38.
  • anchoring elements embodied as notches 52 limit the movement of the contact pins 40 due to thermal expansion, vibration, etc. within the injection molding material 38, which prevents damage to the bonding wires 28 or their electrical connection to the contact pins 40, for example, by shear forces generated in this way ,
  • the finished fusion sensor 14 is shown in FIG. 4 supported on the printed circuit board 48 on which, for example, in a manner not shown, the controller 18 may be wired.
  • the volume of the molding material 38 exemplified by the leadframe 32 should be the same on the upper surface 54 and lower surface 56 minus the volume of the ASIC 30 and the MEMS 26 as shown in FIG. 5 or at most 30% apart , In this way, an uneven shrinkage and a reduced distortion is achieved, which keeps the residual stresses of the molded injection molding material 38 low and thus further reduces or even avoids mechanical stresses on the ASIC 30 and the MEMS 26 and the bonding wires.
  • draft angles 58 of at least 5 ° should be formed, of which only one is provided with a reference number in FIG. 5 for the sake of clarity.

Abstract

The invention relates to a method for producing an electronic assembly (14) in which an electronic component (26, 30) supported on a wiring support (32) is encapsulated with an encapsulation material (38), the method comprising: - arranging the electronic component (26, 30) on the wiring support (32) in such a manner that a stress applied onto the electronic component (26, 30) by the encapsulation material (38) falls below a predetermined value; and - encapsulating the electronic component (26, 30) with the encapsulation material (38).

Description

Verfahren zum Herstellen einer elektronischen Baugruppe Method for producing an electronic assembly
Die Erfindung betrifft ein Verfahren zum Herstellen einer elektronischen Baugruppe und eine elektronische Baugruppe. The invention relates to a method for producing an electronic assembly and an electronic assembly.
Aus der DE 10 2007 060 931 AI ist eine elektronische Bau-gruppe mit einem verkapselten elektronischen Bauelement bekannt (in der Druckschrift verkapselte Struktur genannt), das auf einem Substrat in Form einer Leiterplatte mit einer elektrischen Beschaltung gehalten und über Bond-Drähte mit der elektrischen Beschaltung verschalten ist. Das Substrat mit dem elektronischen Bauelement ist in einem Gehäuse fixiert, das mit einem Einbettungsmaterial ausgegossen ist. Das ausgegossene ist mit einem als Schirmung dienenden Deckel verschlossen. From DE 10 2007 060 931 AI an electronic assembly with an encapsulated electronic component is known (called in the document encapsulated structure), which held on a substrate in the form of a printed circuit board with an electrical circuit and via bonding wires with the electrical Circuit is interconnected. The substrate with the electronic component is fixed in a housing which is filled with an embedding material. The poured out is closed with a serving as a shield lid.
Es ist Aufgabe der vorliegenden Erfindung die bekannte elektronische Baugruppe zu verbessern. It is an object of the present invention to improve the known electronic assembly.
Die Aufgabe wird durch die Merkmale der unabhängigen Ansprüche gelöst. Bevorzugte Weiterbildungen sind Gegenstand der abhängigen Ansprüche . The object is solved by the features of the independent claims. Preferred developments are the subject of the dependent claims.
Gemäß einem Aspekt der Erfindung umfasst ein Verfahren zum Herstellen einer elektronischen Baugruppe, in der ein auf einem Verdrahtungsträger getragenes elektronisches Bauelement mit einem Verkapselungsmaterial verkapselt ist die Schritte Anordnen des elektronischen Bauelements auf dem Verdrahtungsträger derart, dass ein Stresseintrag durch das Verkapselungsmaterial auf das elektronische Bauelement einen vorbestimmten Wert unterschreitet und Verkapseln des elektronischen Bauelements mit dem Verkapselungsmaterial . According to one aspect of the invention, a method of manufacturing an electronic package in which an electronic component carried on a wiring substrate is encapsulated with an encapsulation material comprises the steps of disposing the electronic component on the wiring substrate such that stress entry through the encapsulation material onto the electronic component predetermined value falls below and encapsulating the electronic component with the encapsulation material.
Dem angegebenen Verfahren liegt die Überlegung zugrunde, dass die eingangs genannte elektronische Baugruppe sehr groß dimen- sioniert ist, was daran liegt, dass das elektronische Bauelement zunächst eigenständig verkapselt und anschließend zur Fixierung in einem Gehäuse mit einem weiteren Material eingebettet werden muss. Entsprechend benötigen die Strukturen sehr viel Bauraum, wodurch die elektronische Baugruppe der eingangs genannten Art als bauraumknappe technische Anwendungen wie beispielsweise als oberflächenmontiertes Bauelement (engl: surface-mounted de- vice), nachstehend SMD genannt, ungeeignet ist. The specified method is based on the consideration that the above-mentioned electronic assembly is dimensioned very large, which is due to the fact that the electronic component must first be encapsulated independently and then embedded in a housing with another material for fixing. Accordingly, the structures require a lot of space, whereby the electronic assembly of the type mentioned as space-constrained technical applications such as surface-mounted device (engl: surface-mounted device), hereinafter referred to as SMD, unsuitable.
Demgegenüber liegt dem angegebenen Verfahren die Idee zugrunde, die Einbettung des elektronischen Bauelements direkt als Gehäuse zu verwenden, so dass auf ein extra Gehäuse um die Einbettung verzichtet werden kann. Dies würde den notwendigen Bauraum für die gesamte elektronische Baugruppe spürbar senken. In contrast, the given method is based on the idea to use the embedding of the electronic component directly as a housing, so that can be dispensed with an extra housing to the embedding. This would noticeably reduce the necessary installation space for the entire electronic assembly.
Dieser Idee liegt jedoch die Erkenntnis zugrunde, dass die Einbettung eine gewisse Elastizität und/oder Viskosität aufweisen muss, um einen zu hohen mechanischen Stresseintrag auf die elektronische Baugruppe und/oder ihrer elektrischen Anbindungen wie Bonddrähte zu vermeiden, denn dieser mechanische Stresseintrag könnte die elektronische Baugruppe und/oder die elektrischen Anbindungen elektrisch und/oder mechanisch beschädigen, und so zu entsprechenden Fehlfunktionen führen. However, this idea is based on the finding that the embedding must have a certain elasticity and / or viscosity in order to avoid excessive mechanical stress entry on the electronic assembly and / or its electrical connections such as bonding wires, since this mechanical stress entry could be the electronic assembly and / or damage the electrical connections electrically and / or mechanically, and thus lead to corresponding malfunction.
Daher ist es Idee des angegebenen Verfahrens, bei der Vorbereitung der herzustellenden elektronischen Baugruppe den Stresseintrag bei ihrer Dimensionierung zu berücksichtigen und geeignete Vorkehrungen zu treffen, dass der Stresseintrag unterhalb eines Grenzwertes bleibt, bei dem die Funktion der gesamten elektronischen Baugruppe nicht mehr zuverlässig sichergestellt werden kann. Beispiele, wie der Stresseintrag bei der Dimensionierung der elektronischen Baugruppe berücksichtigt werden kann, sind in den Unteransprüchen angegeben. Therefore, it is an idea of the specified method to consider the stress entry in their dimensioning in the preparation of the electronic assembly to be manufactured and to take appropriate precautions that the stress entry remains below a limit at which the function of the entire electronic assembly can no longer be reliably ensured , Examples of how the stress entry can be taken into account in the dimensioning of the electronic module are specified in the subclaims.
Der vorbestimmte Wert für den Stresseintrag kann sich dabei direkt oder indirekt bei der Dimensionierung ergeben. Eine direkte Vorgabe kann beispielsweise im Rahmen einer Simulation realisiert werden, bei der der vorbestimmte Wert direkt vorgegeben wird. Eine indirekte Vorgabe kann beispielsweise anhand einer Reihe von Vergleichstests realisiert werden, im Rahmen derer lediglich ein zu erwartendes Ergebnis, wie beispielsweise eine bestimmte Ausfallsicherheit vorgegeben wird und aus dem sich der vorbestimmte Wert dann implizit ergibt. The predetermined value for the stress entry can result directly or indirectly in the dimensioning. A direct specification can be realized, for example, in the context of a simulation in which the predetermined value is specified directly. Indirect specification can be realized, for example, by means of a series of comparison tests, in the context of which only an expected result, such as a certain reliability is specified and from which the predetermined value then implicitly results.
In einer Weiterbildung des angegebenen Verfahrens weist das Verkapselungsmaterial einen Wärmeausdehnungskoeffizienten auf, der Im Bereich eines Wärmeausdehnungskoeffizienten des elektronischen Bauelements liegt, so dass sich das Verkapse- lungsmaterial und die damit verkapselte elektronische Baugruppe in gleicher Weise ausdehnen und damit keinen oder nur einen minimalen mechanischen Stress gegeneinander aufbringen. In a further development of the specified method, the encapsulation material has a thermal expansion coefficient which is in the range of a thermal expansion coefficient of the electronic component, so that the encapsulation material and the electronic assembly encapsulated therewith expand in the same way and thus have no or only minimal mechanical stress against one another muster.
Das Verkapselungsmaterial kann ein härtbares Harz, insbesondere ein Epoxidharz umfassen, so dass die Verkapselung des elektronischen Bauelements in einer dem Fachmann bekannten Weise mittels Spritzpressen (engl: transfer molding) durchgeführt werden kann . The encapsulation material may comprise a curable resin, in particular an epoxy resin, so that the encapsulation of the electronic component can be carried out in a manner known to the person skilled in the art by means of transfer molding.
In einer anderen Weiterbildung des angegebenen Verfahrens kann das elektronische Bauelement an einer Nullposition des Verdrahtungsträgers angeordnet sein, an denen sich die Wärmebewegungen des Verkapselungsmaterials aufheben. Auf diese Weise kann ebenfalls ein Stresseintrag reduziert werden. In another development of the specified method, the electronic component can be arranged at a zero position of the wiring substrate, on which cancel the heat movements of the encapsulation material. In this way, a stress entry can also be reduced.
Das elektronische Bauelement kann dabei eine Auswerteschaltung zum Auswerten von Messsignalen aus wenigstens zwei Geberelementen sein, wobei die beiden Geberelemente symmetrisch um die Auswerteschaltung angeordnet sein können. Auf diese Weise kann ein Stresseintrag auf die Geberelemente und ein damit verbundener eventueller Messfehler aufgrund der bekannten Symmetrie nachträglich berücksichtigt werden. The electronic component can be an evaluation circuit for evaluating measurement signals from at least two encoder elements, wherein the two encoder elements can be arranged symmetrically about the evaluation circuit. In this way, a stress entry on the donor elements and an associated possible measurement error due to the known symmetry can be subsequently considered.
In einer noch anderen Weiterbildung des angegebenen Verfahrens kann zum Verkapseln des elektronischen Bauelements mit dem Verkapselungsmaterial eine Verkapselungsgeometrie gewählt werden, bei der eine Wärmebewegung des Verkapselungsmaterials wenigstens in einer Richtung einen vorbestimmten Wert unterschreitet. Diese Geometrie kann in beliebiger Weise gewählt werden, wobei die Verkapselungsgeometrie besonders bevorzugt derart gewählt wird, dass eine Wandstärke des Verkapselungs- materials an wenigstens einer Wand des elektronischen Bauelements einen vorbestimmten Wert unterschreitet, so dass der durch die Wand aufgebrachte mechanische Stress auf einen von diesem vorbestimmten Wert abhängigen Stresswert begrenzt bleibt. In yet another development of the specified method, an encapsulation geometry can be selected for encapsulating the electronic component with the encapsulation material, in which a thermal movement of the encapsulation material falls below a predetermined value at least in one direction. This geometry can be chosen in any desired manner, wherein the encapsulation geometry is particularly preferably selected such that a wall thickness of the encapsulation material on at least one wall of the electronic component falls below a predetermined value, so that the applied by the wall mechanical stress remains limited to a value dependent on this predetermined value of stress.
In einer noch anderen Weiterbildung umfasst das angegebene Verfahren den Schritt Umhüllen des elektronischen Bauele-ments mit einem mechanischen Entkopplungsmaterial vor dem Verkapseln. Das mechanische Entkopplungsmaterial reduziert den Stresseintrag in die elektronische Baugruppe weiter und reduziert so die mechanische Beanspruchung des elektronischen Bauelements. In yet another embodiment, the disclosed method includes the step of wrapping the electronic component with a mechanical decoupling material prior to encapsulation. The mechanical decoupling material further reduces the stress entry into the electronic assembly and thus reduces the mechanical stress on the electronic component.
In einer besonderen Weiterbildung ist das mechanische In a special development, the mechanical
Ent-kopplungsmaterial wenigstens thixotrop eingestellt. Auf diese Weise lässt sich das mechanische Entkopplungsmaterial in einfacher Weise auf das elektronische Bauelement aufgießen, weist jedoch im aufgegossenen Zustand eine ausreichende Stabilität auf, das elektronische Bauelement vollständig zu umhüllen . Decoupling material set at least thixotropic. In this way, the mechanical decoupling material can be poured onto the electronic component in a simple manner, but has sufficient stability in the cast-on state to completely encase the electronic component.
In einer zusätzlichen Weiterbildung umfasst der Verdrahtungsträger einen Anschluss zum elektrischen Kontaktieren des elektronischen Bauelementes mit einer Leiterplatte und eine elektrische Schirmschicht, wobei das angegebenen Verfahren den Schritt Anordnen des elektronischen Bauelements auf dem Verdrahtungsträger derart umfasst, dass das elektronische Bauelement in wenigstens einer Richtung der elektrischen Baugruppe gesehen zwischen der elektrischen Schirmschicht und dem Anschluss aufgenommen ist. Auf diese Weise kann der Verdrahtungsträger gleichzeitig zur Verbesserung der elektromagnetischen Verträglichkeit, EMV genannt verwendet werden, ohne dass eine extra elektrische Schirmschicht notwendig wäre. In an additional development, the wiring carrier comprises a connection for electrically contacting the electronic component with a printed circuit board and an electrical shielding layer, wherein the specified method comprises the step of arranging the electronic component on the wiring support such that the electronic component is in at least one direction of the electrical assembly seen between the electrical shielding layer and the terminal is added. In this way, the wiring substrate can be simultaneously used for improving the electromagnetic compatibility, called EMC, without requiring an extra electric shielding layer.
Gemäß einem weiteren Aspekt der Erfindung umfasst eine elektronische Baugruppe, ein auf einem Verdrahtungsträger getragenes elektronisches Bauelement, das mit einem Verkap- selungsmaterial verkapselt ist, wobei das elektronische Bauelement auf dem Verdrahtungsträger derart angeordnet ist, dass ein Stresseintrag durch das Verkapselungsmaterial auf das elektronische Bauelement einen vorbestimmten Wert unterschreitet . According to a further aspect of the invention, an electronic subassembly comprises an electronic component supported on a wiring support, which is encapsulated with a encapsulation material, wherein the electronic component is arranged on the wiring support such that a stress entry by the encapsulation material to the electronic component falls below a predetermined value.
Die angegebene elektronische Baugruppe kann um Merkmale erweitert werden, die den Unteransprüchen des angegebenen Verfahrens sinngemäß entsprechen. The specified electronic assembly can be extended to features that correspond to the dependent claims of the specified method mutatis mutandis.
In einer Weiterbildung der angegebenen elektronischen Baugruppe ist die angegebene elektronische Baugruppe als Inertialsensor ausgebildet . In a development of the specified electronic assembly, the specified electronic assembly is designed as an inertial sensor.
Die angegebene elektronische Baugruppe kann dabei vorzugsweise mit einem angegebenen Verfahren hergestellt werden. The specified electronic assembly can preferably be produced by a specified method.
Gemäß einem weiteren Aspekt der Erfindung umfasst ein Fahrzeug eine angegebene elektronische Baugruppe, insbesondere zur Erfassung von Fahrdynamikdaten. According to a further aspect of the invention, a vehicle comprises a specified electronic module, in particular for detecting vehicle dynamics data.
Die oben beschriebenen Eigenschaften, Merkmale und Vorteile dieser Erfindung sowie die Art und Weise, wie diese erreicht werden, werden klarer und deutlicher verständlich im Zusammenhang mit der folgenden Beschreibung der Ausführungsbeispiele, die im Zusammenhang mit den Zeichnungen näher erläutert werden, wobei : The above-described characteristics, features and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the drawings, in which:
Fig. 1 eine schematische Ansicht eines Fahrzeuges mit einer Fahrdynamikregelung, 1 is a schematic view of a vehicle with a vehicle dynamics control,
Fig. 2 eine schematische Ansicht eines als SMD-Bauteil ausgebildeten Inertialsensors aus Fig. 1, 2 shows a schematic view of an inertial sensor formed as an SMD component from FIG. 1, FIG.
Fig. 3 eine schematische Ansicht eines Zwischenprodukts eines Inertialsensors aus Fig. 1; Fig. 3 is a schematic view of an intermediate product of an inertial sensor of Fig. 1;
Fig. 4 eine schematische Ansicht eines Inertialsensors aus Fig. 1 auf einer Leiterplatte; und Fig. 5 eine weitere schematische Ansicht des Inertialsensors aus Fig. 1 zeigen. FIG. 4 shows a schematic view of an inertial sensor from FIG. 1 on a printed circuit board; FIG. and Fig. 5 shows a further schematic view of the inertial sensor of Fig. 1 show.
In den Figuren werden gleiche technische Elemente mit gleichen Bezugszeichen versehen und nur einmal beschrieben. In the figures, the same technical elements are provided with the same reference numerals and described only once.
Es wird auf Fig. 1 Bezug genommen, die eine schematische Ansicht eines Fahrzeuges 2 mit einer an sich bekannten Fahrdynamikregelung zeigt. Details zu dieser Fahrdynamikregelung können beispielsweise der DE 10 2011 080 789 AI entnommen werden. Reference is made to Fig. 1, which shows a schematic view of a vehicle 2 with a known vehicle dynamics control. Details of this driving dynamics control can be found for example in DE 10 2011 080 789 AI.
Das Fahrzeug 2 umfasst ein Chassis 4 und vier Räder 6. Jedes Rad 6 kann über eine ortsfest am Chassis 4 befestigte Bremse 8 gegenüber dem Chassis 4 verlangsamt werden, um eine Bewegung des Fahrzeuges 2 auf einer nicht weiter dargestellten Straße zu verlangsamen . The vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).
Dabei kann es in einer dem Fachmann bekannten Weise passieren, dass das die Räder 6 des Fahrzeugs 2 ihre Bodenhaftung verlieren und sich das Fahrzeug 2 sogar von einer beispielsweise über ein nicht weiter gezeigtes Lenkrad vorgegebenen Trajektorie durch Untersteuern oder Übersteuern wegbewegt. Dies wird durch an sich bekannte Regelkreise wie ABS (Antiblockiersystem) und ESP (elektronisches Stabilitätsprogramm) vermieden. It can happen in a manner known to those skilled in that lose the wheels 6 of the vehicle 2 their traction and the vehicle 2 even moves away from a predetermined, for example via a not shown steering wheel trajectory by understeer or oversteer. This is avoided by known control circuits such as ABS (antilock braking system) and ESP (electronic stability program).
In der vorliegenden Ausführung weist das Fahrzeug 2 dafür Drehzahlsensoren 10 an den Rädern 6 auf, die eine Dreh-zahl 12 der Räder 6 erfassen. Ferner weist das Fahrzeug 2 einen Inertialsensor 14 auf, der Fahrdynamidaten 16 des Fahrzeuges 2 erfasst aus denen beispielsweise eine Nickrate, eine Wankrate, eine Gierrate, eine Querbeschleunigung, eine Längsbeschleunigung und/oder eine Vertikalbeschleunigung in einer dem Fachmann an sich bekannten Weise ausgegeben werden kann. In the present embodiment, the vehicle 2 for speed sensors 10 on the wheels 6, which detect a rotational speed 12 of the wheels 6. Furthermore, the vehicle 2 has an inertial sensor 14 which detects driving dynamics data 16 of the vehicle 2, from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a longitudinal acceleration and / or a vertical acceleration can be output in a manner known per se to a person skilled in the art ,
Basierend auf den erfassten Drehzahlen 12 und Fahrdynamikdaten 16 kann ein Regler 18 in einer dem Fachmann bekannten Weise bestimmen, ob das Fahrzeug 2 auf der Fahrbahn rutscht oder sogar von der oben genannten vorgegebenen Trajektorie abweicht und entsprechen mit einem an sich bekannten Reglerausgangssignal 20 darauf reagieren. Das Reglerausgangssignal 20 kann dann von einer Stelleinrichtung 22 verwendet werden, um mittels Stellsignalen 24 Stellglieder, wie die Bremsen 8 anzusteuern, die auf das Rutschen und die Abweichung von der vorgegebenen Trajektorie in an sich bekannter Weise reagieren. Based on the detected rotational speeds 12 and vehicle dynamics data 16, a controller 18 can determine, in a manner known to the person skilled in the art, whether the vehicle 2 slips on the road or even deviates from the abovementioned predetermined trajectory and correspond with a known regulator output signal 20 to respond. The regulator output signal 20 can then be used by an actuator 22 to control actuators 24, such as the brakes 8, to respond to slippage and deviation from the given trajectory in a manner known per se by means of actuating signals.
Der Regler 18 kann beispielsweise in eine an sich bekannte Motorsteuerung des Fahrzeuges 2 integriert sein. Auch können der Regler 18 und die Stelleinrichtung 22 als eine gemeinsameThe controller 18 may be integrated, for example, in a known motor control of the vehicle 2. Also, the controller 18 and the actuator 22 as a common
Regeleinrichtung ausgebildet und optional in die zuvor genannte Motorsteuerung integriert sein. Control device formed and optionally be integrated into the aforementioned engine control.
In Fig. 1 ist der Inertialsensor 14 als externe Einrichtung außerhalb des Reglers 18 gezeigt. In einem solchen Fall spricht man von einem als Satelliten ausgebildeten Inertialsensor 14. In der vorliegenden Ausführung soll der Inertialsensor 14 jedoch als SMD-Bauteil aufgebaut werden, damit er beispielsweise in ein Gehäuse des Reglers 18 mit integriert werden kann. In Fig. 1, the inertial sensor 14 is shown as an external device outside the controller 18. In such a case, one speaks of an inertial sensor 14 designed as a satellite. In the present embodiment, however, the inertial sensor 14 is to be constructed as an SMD component so that it can be integrated into a housing of the controller 18, for example.
Der Inertialsensor 14 umfasst mindestens ein mikroelektrome- chanisches System 26, MEMS 26 genannt, als Messaufnehmer, der in an sich bekannter Weise ein von den Fahrdynamikdaten 16 abhängiges, nicht weiter dargestelltes Signal über Bonddrähte 28 an zwei Signalauswerteschaltungen 30 in Form von anwendungsspezifischen integrierte Schaltung 30, ASIC 30 (engl: appli- cation-specific integrated circuit) genannt ausgibt. Die ASIC 30 kann dann basierend auf dem empfangenen, von den Fahrdynamikdaten 16 abhängigen Signal die Fahrdynamikdaten 16 erzeugen. The inertial sensor 14 comprises at least one microelectromechanical system 26, termed MEMS 26, as a sensor which, in a manner known per se, transmits a signal, not further represented by the driving dynamics data 16, via bonding wires 28 to two signal evaluation circuits 30 in the form of application-specific integrated circuit 30 , ASIC 30 (English: application-specific integrated circuit) called outputs. The ASIC 30 may then generate the vehicle dynamics data 16 based on the received signal dependent on the vehicle dynamics data 16.
Das MEMS 26 und die ASIC 30 sind auf einer Leiterplatte 32 getragen und mit verschiedenen, auf der Leiterplatte 32 ausgeformten elektrischen Leitungen 34 elektrisch kontaktiert. Alternativ kann die Leiterplatte 32 auch als Leadframe ausgebildet sein, worauf an späterer Stelle näher eingegangen wird. Von denThe MEMS 26 and the ASIC 30 are supported on a circuit board 32 and electrically contacted with various electrical leads 34 formed on the circuit board 32. Alternatively, the circuit board 32 may be formed as a leadframe, which will be discussed in more detail later. Of the
Leitungen 34 ist in Fig. 2 lediglich eine einzige Leitung 34 im Schnitt zu sehen. Die Kontaktierung kann dabei direkt, beispielsweise über eine an sich bekannte FlipChip-Verbindung oder, wie in Fig. 2 gezeigt, über einen Bonddraht 28 erfolgen. Lines 34 can be seen in Fig. 2 only a single line 34 in section. The contacting can be directly, for example via a known FlipChip connection or, as shown in Fig. 2, via a bonding wire 28.
Das MEMS 26 und die ASIC 30 können ferner von einem mechanischen Entkopplungsmaterial 36, Globetop-Masse 36 genannt, umhüllt sein, die wiederum gemeinsam mit dem MEMS 26 und der ASIC 30 in einem Spritzpressmaterial 38, wie beispielsweise einem Epoxidharz 38 verkapselt sein kann. The MEMS 26 and the ASIC 30 may further be enveloped by a mechanical decoupling material 36, called globetop mass 36, which in turn may be encapsulated together with the MEMS 26 and the ASIC 30 in a molding material 38, such as an epoxy 38.
Das Spritzpressmaterial 38 könnte damit allein bereits als Gehäuse des Inertialsensors 14 dienen und die darin The injection molding material 38 could thus already serve alone as a housing of the inertial sensor 14 and the therein
aufge-nommenen Schaltungskomponenten schützen. Protect received circuit components.
Schließlich sind an dem als SMD-Bauteil ausgebildeten Finally, on the trained as an SMD component
Inertialsensor 14 entsprechende Kontaktmöglichkeiten, wie in Fig. 2 gezeigte Lötperlen 40 zur elektrischen Kontaktierung mit einem Schaltkreis des Reglers 18 vorgesehen. Alternativ könnten die Kontaktmöglichkeiten des als SMD-Bauteil ausgebildeten Inertialsensors 14 aber als an sich bekannte Inertialsensor 14 corresponding contact options, as shown in Fig. 2 solder bumps 40 for electrical contacting with a circuit of the controller 18 is provided. Alternatively, the contact possibilities of the formed as an SMD component inertial sensor 14 but as known per se
Gull-Wing-Lötanschlüsse oder J-Lead-Lötanschlüsse ausgebildet sein, sofern das Substrat als an sich bekannter und in Fig. 3 gezeigter Leadframe 32 ausgebildet ist.  Gull-wing solder connections or J-lead solder connections may be formed, provided that the substrate is formed as a per se known and shown in Fig. 3 leadframe 32.
Es wird auf Fig. 3 Bezug genommen, anhand derer der innere Aufbau des Inertialsensors 14 erläutert werden soll . Zur Verdeutlichung der vielfältigen Möglichkeiten, wie der Inertialsensor 14 als SMD-Bauteil aufgebaut sein kann, sind in Fig. 3 statt Reference is made to FIG. 3, with reference to which the internal structure of the inertial sensor 14 is to be explained. To illustrate the many possibilities of how the inertial sensor 14 can be constructed as an SMD component, take place in FIG
Lötperlen 40 als Kontaktmöglichkeiten Kontaktbeinchen 40 als Kontaktmöglichkeiten ausgebildet . In Fig. 3 sind die MEMS 26 und die ASIC 30 statt auf einerSolder beads 40 formed as contact possibilities contact legs 40 as contact options. In Fig. 3, the MEMS 26 and the ASIC 30 instead of on a
Leiterplatte 32 als Verdrahtungsträger auf einem Leadframe 32 als Verdrahtungsträger getragen, an dem Kontaktbeinchen 40 ausgebildet sind, über die die MEMS 26 und die ASIC 30 mit dem zuvor genannten Schaltkreis des Reglers 18 elektrisch verbunden werden können. Von diesen Kontaktbeinchen sind in Fig. 3 der Übersichtlichkeit halber nicht alle mit einem Bezugszeichen versehen . Die MEMS 26 und die ASIC 30 können auf dem Leadframe 32 durch löten, kleben und/oder Klebefolien, wie an sich bekannte DAF-Tapes fixiert sein. Die elektrische Kontaktierung kann dabei über die Fixierung und/oder über Bonddrähte 28 erfolgen, von denen der Übersichtlichkeit halber nicht alle mit einem Bezugszeichen versehen sind. Printed circuit board 32 is carried as a wiring support on a leadframe 32 as a wiring support, on the contact legs 40 are formed, via which the MEMS 26 and the ASIC 30 can be electrically connected to the aforementioned circuit of the controller 18. For reasons of clarity, not all of these contact legs are provided with a reference symbol in FIG. 3. The MEMS 26 and the ASIC 30 can be fixed on the leadframe 32 by soldering, gluing and / or adhesive films, such as DAF tapes known per se. The electrical contacting can be done via the fixation and / or via bonding wires 28, of which for the sake of clarity not all are provided with a reference numeral.
In der vorliegenden Ausführung kann alternativ oder zusätzlich ein weiteres MEMS 26 auf dem ASIC 30 getragen werden, das entweder ebenfalls als Geberelement zur Erfassung der Fahrdynamikdaten 16 oder als alternatives Geberelement, beispielsweise zur Erfassung einer Temperatur oder einer anderen physikalischen Größe verwendet werden kann. In nicht gezeigter Weise könnten auf diesem Leadframe auch weitere elektrische Bauelemente, wie beispielsweise passive Bauelemente verschaltet werden . In the present embodiment, alternatively or additionally, another MEMS 26 may be carried on the ASIC 30, which may either also be used as a donor element to capture the vehicle dynamics data 16 or as an alternative donor element, for example to detect a temperature or other physical quantity. In a manner not shown, other electrical components such as passive components could be interconnected on this leadframe.
In die Bildebene der Fig. 3 hinein betrachtet können die ASIC 30 und die MEMS 26 auf einer Metallschicht 46 getragen sein, die als elektrische Schirmschicht 46 dient und so die EMV des Fusionssensors 14 steigert. Auf diese Weise kann die EMV des Fusionssensors 14 durch Tragen der gesamten elektronischen Baugruppe auf einer in Fig. 4 gezeigten Leiterplatte 48 einerseits und der elektrischen Schirmschicht 46 andererseits spürbar verbessert werden. As viewed in the image plane of FIG. 3, the ASIC 30 and the MEMS 26 may be carried on a metal layer 46 which serves as the electrical shielding layer 46, thus enhancing the EMC of the fusion sensor 14. In this way, the EMC of the fusion sensor 14 can be noticeably improved by supporting the entire electronic package on a circuit board 48 shown in FIG. 4 on the one hand and the electrical shielding layer 46 on the other hand.
Zum Umhüllen der ASIC 30 und der MEMS 26 mit dem oben genannten Entkopplungsmaterial 36 und/oder zu ihrer Verkapselung mit dem Spritzpressmaterial 38 sind an dem Leadframe 32 Laschen 50 ausgebildet, an denen der Leadframe 32 während des Umhüllungsund/oder Verkapselungsvorgangs mechanisch festgehalten werden kann . For enclosing the ASIC 30 and the MEMS 26 with the above decoupling material 36 and / or for their encapsulation with the injection molding material 38 tabs 50 are formed on the leadframe 32, where the leadframe 32 can be mechanically held during the Ummantelungsund / or encapsulation process.
Da die Laschen 50 eine Durchdringung des Leadframes 32 durch das Spritzpressmaterial 38 zu Außenseite darstellt, bietet dieSince the tabs 50 is a penetration of the leadframe 32 by the injection molding material 38 to outside, offers the
Lasche einen Zugang für Feuchtigkeit zur ASIC 30 und den MEMS 26. Um das Eindringen dieser Feuchtigkeit zu erschweren, sind an den Laschen 50 Aussparungen 51 ausgebildet, die den Querschnitt der zuvor genannten Durchdringung des Leadframes 32 durch das Spritzpressmaterial 38 zu Außenseite reduzieren. Gleichzeitig wird das Spritzpressmaterial 38 und damit die Verkapselung der ASIC 30 und der MEMS 26 in der Aussparung 51 weiter verankert. Tab a moisture access to the ASIC 30 and the MEMS 26. To make it difficult to penetrate this moisture 50 recesses 51 are formed on the tabs, which have the cross section of the reduce aforementioned penetration of the leadframe 32 by the injection molding material 38 to outside. At the same time, the injection molding material 38 and thus the encapsulation of the ASIC 30 and the MEMS 26 are further anchored in the recess 51.
Die einzelnen Kontaktbeinchen 40 weisen dabei Verankerungselemente auf, die in der vorliegenden Ausführung beispielhaft als Einkerbungen 52 ausgebildet sind, an denen die Kontaktbeinchen 40 verjüngt sind. Von diesen Einkerbungen sind in Fig. 3 der Übersichtlichkeit halber nicht alle mit einem Bezugszeichen versehen. Die Einkerbungen 52 können von dem Spritzpressmaterial 38 umschlossen werden, um zu verhindern, dass die Kontaktbeinchen 40 nachträglich aus dem Spritzpressmaterial 38 herausgezogen werden. The individual contact legs 40 in this case have anchoring elements, which in the present embodiment are designed, for example, as notches 52, on which the contact pins 40 are tapered. For the sake of clarity, not all of these notches are provided with a reference numeral in FIG. 3. The notches 52 may be enclosed by the injection molding material 38 to prevent the contact pins 40 are subsequently pulled out of the injection molding material 38.
Darüber hinaus begrenzen die beispielhaft als Einkerbungen 52 ausgebildeten Verankerungselemente die Bewegung der Kontaktbeinchen 40 aufgrund von thermischer Ausdehnung, Vibration, etc innerhalb des Spritzpressmaterials 38, was eine Schädigung der Bonddrähte 28 beziehungsweise ihrer elektrischen Anbindung an die Kontaktbeinchen 40 beispielsweise durch auf diese Weise entstehende Scherkräfte verhindert. In addition, the anchoring elements embodied as notches 52 limit the movement of the contact pins 40 due to thermal expansion, vibration, etc. within the injection molding material 38, which prevents damage to the bonding wires 28 or their electrical connection to the contact pins 40, for example, by shear forces generated in this way ,
Der fertige Fusionssensor 14 ist in Fig. 4 auf der Leiter- platte 48 getragen dargestellt, auf der beispielsweise in nicht weiter dargestellter Weise der Regler 18 verdrahtet sein kann. The finished fusion sensor 14 is shown in FIG. 4 supported on the printed circuit board 48 on which, for example, in a manner not shown, the controller 18 may be wired.
Das Volumen des beispielhaft als Verkapselungsmaterials ausgebildeten Spritzpressmaterials 38 sollte vom Leadframe 32 aus gesehen auf der Oberseite 54 und der Unterseite 56 abzüglich des Volumens der ASIC 30 und der MEMS 26, wie in Fig. 5 gezeigt, gleich sein oder maximal um 30% voneinander abweichen. Auf diese Weise werden ein ungleicher Schwund und einer verringerter Verzug erreicht, was die Eigenspannungen des vergossenen Spritz- pressmaterials 38 gering hält und somit mechanische Belastungen der ASIC 30 und der MEMS 26 sowie der Bonddrähte weiter verringert oder sogar vermeidet . Um die Entformung in einem Werkzeug bei der Herstellung des Fusionssensors 14 sicherzustellen sollten Entformschrägen 58 von mindestens 5° ausgebildet sein, von denen in Fig. 5 der Übersichtlichkeit halber nur eine mit einem Bezugszeichen versehen ist. The volume of the molding material 38 exemplified by the leadframe 32 should be the same on the upper surface 54 and lower surface 56 minus the volume of the ASIC 30 and the MEMS 26 as shown in FIG. 5 or at most 30% apart , In this way, an uneven shrinkage and a reduced distortion is achieved, which keeps the residual stresses of the molded injection molding material 38 low and thus further reduces or even avoids mechanical stresses on the ASIC 30 and the MEMS 26 and the bonding wires. In order to ensure demolding in a tool during the production of the fusion sensor 14, draft angles 58 of at least 5 ° should be formed, of which only one is provided with a reference number in FIG. 5 for the sake of clarity.

Claims

Patentansprüche claims
1. Verfahren zum Herstellen einer elektronischen Baugruppe (14), in der ein auf einem Verdrahtungsträger (32) getragenes elektronisches Bauelement (26, 30) mit einem Verkapselungs- material (38) verkapselt ist, umfassend: A method of manufacturing an electronic package (14) in which an electronic component (26, 30) carried on a wiring substrate (32) is encapsulated with an encapsulant material (38), comprising:
- Anordnen des elektronischen Bauelements (26, 30) auf dem Verdrahtungsträger (32) derart, dass ein Stresseintrag durch das Verkapselungsmaterial (38) auf das elektronische Bauele- ment (26, 30) einen vorbestimmten Wert unterschreitet, und Arranging the electronic component (26, 30) on the wiring carrier (32) such that a stress entry through the encapsulation material (38) to the electronic component (26, 30) falls below a predetermined value, and
- Verkapseln des elektronischen Bauelements (26, 30) mit dem Verkapselungsmaterial (38). - Encapsulating the electronic component (26, 30) with the encapsulation material (38).
2. Verfahren nach Anspruch 1, wobei das Verkapselungsmate- rial (38) einen Wärmeausdehnungskoeffizienten aufweist, der Im2. The method of claim 1, wherein the encapsulation material (38) has a coefficient of thermal expansion which is Im
Bereich eines Wärmeausdehnungskoeffizienten des elektronischen Bauelements (26, 30) liegt. Range of a thermal expansion coefficient of the electronic component (26, 30) is located.
3. Verfahren nach Anspruch 2, wobei das Verkapselungsmaterial ein härtbares Harz, insbesondere ein Epoxidharz umfasst. 3. The method of claim 2, wherein the encapsulating material comprises a curable resin, in particular an epoxy resin.
4. Verfahren nach einem der vorstehenden Ansprüche, wobei das elektronische Bauelement (26, 30) an einer Nullposition des Verdrahtungsträgers (32) angeordnet wird, an denen sich die Wärmebewegungen des Verkapselungsmaterials (38) aufheben. 4. The method according to any one of the preceding claims, wherein the electronic component (26, 30) at a zero position of the wiring substrate (32) is arranged, at which cancel the thermal movements of the encapsulation material (38).
5. Verfahren nach Anspruch 4, wobei das elektronische Bauelement (26, 30) eine Auswerteschaltung (30) zum Auswerten von Messsignalen aus wenigstens zwei Geberelementen (26) ist, die symmetrisch um die Auswerteschaltung (30) angeordnet werden. 5. The method of claim 4, wherein the electronic component (26, 30) is an evaluation circuit (30) for evaluating measurement signals from at least two encoder elements (26), which are arranged symmetrically about the evaluation circuit (30).
6. Verfahren nach einem der vorstehenden Ansprüche, wobei zum Verkapseln des elektronischen Bauelements (26, 30) mit dem Verkapselungsmaterial (38) eine Verkapselungsgeometrie gewählt wird, bei der eine Wärmebewegung des Verkapselungsmaterials (38) wenigstens in einer Richtung einen vorbestimmten Wert unterschreitet . 6. The method according to any one of the preceding claims, wherein for encapsulating the electronic component (26, 30) with the encapsulation material (38) an encapsulation geometry is selected in which a thermal movement of the encapsulation material (38) falls below a predetermined value in at least one direction.
7. Verfahren nach Anspruch 6, wobei die Verkapselungsgeo- metrie gewählt wird, dass eine Wandstärke des Verkapselungs- materials (38) an wenigstens einer Wand des elektronischen Bauelements (26, 30) einen vorbestimmten Wert unterschreitet. 7. The method according to claim 6, wherein the encapsulation geometry is selected such that a wall thickness of the encapsulation material (38) on at least one wall of the electronic component (26, 30) falls below a predetermined value.
8. Verfahren nach einem der vorstehenden Ansprüche, umfassend Umhüllen des elektronischen Bauelements (26, 30) mit einer mechanischen Entkopplungsschicht (36) vor dem Verkapseln. 8. The method according to any one of the preceding claims, comprising wrapping the electronic component (26, 30) with a mechanical decoupling layer (36) before encapsulation.
9. Verfahren nach einem der vorstehenden Ansprüche, wobei der Verdrahtungsträger (32) einen Anschluss (40) zum elektrischen Kontaktieren des elektronischen Bauelementes (26, 30) mit einer Leiterplatte (50) und eine elektrische Schirmschicht (46) umfasst, umfassend Anordnen des elektronischen Bauelements (26, 30) auf dem Verdrahtungsträger (32) derart, dass das elektronische Bauelement (26, 30) in wenigstens einer Richtung der elektrischen Baugruppe (14) gesehen zwischen der elektrischen Schirmschicht (32) und dem Anschluss (40) aufgenommen ist. A method according to any one of the preceding claims, wherein the wiring carrier (32) comprises a terminal (40) for electrically contacting the electronic component (26, 30) with a printed circuit board (50) and an electrical shielding layer (46) comprising arranging the electronic component Device (26, 30) on the wiring support (32) such that the electronic component (26, 30) seen in at least one direction of the electrical assembly (14) between the electrical shield layer (32) and the terminal (40) is accommodated.
10. Elektronische Baugruppe (14), die insbesondere mit einem Verfahren nach einem der vorstehenden Ansprüche hergestellt ist, umfassend : 10. Electronic assembly (14), in particular produced by a method according to one of the preceding claims, comprising:
- ein auf einem Verdrahtungsträger (32) getragenes elektronisches Bauelement (26, 30), das mit einem Verkapselungs- material (38) verkapselt ist,  an electronic component (26, 30) carried on a wiring support (32) and encapsulated with an encapsulation material (38),
- wobei das elektronische Bauelement (26, 30) auf dem Verdrahtungsträger (32) derart angeordnet ist, dass ein Stresseintrag durch das Verkapselungsmaterial (38) auf das elektronische Bauelement (26, 30) einen vorbestimmten Wert unterschreitet.  - Wherein the electronic component (26, 30) on the wiring support (32) is arranged such that a stress entry by the encapsulation material (38) on the electronic component (26, 30) falls below a predetermined value.
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KR20150097628A (en) 2015-08-26
CN104871308B (en) 2018-08-07
CN104871308A (en) 2015-08-26
US9961779B2 (en) 2018-05-01
US20150351252A1 (en) 2015-12-03
DE102012223982A1 (en) 2014-06-26
JP2016504769A (en) 2016-02-12
WO2014095500A1 (en) 2014-06-26

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