Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/565—Moulds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
  • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
  • H01L21/568—Temporary substrate used as encapsulation process aid
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
  • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/93—Batch processes
  • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
  • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12042—LASER
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation

Definitions

• the invention relates to a molding method for manufacturing an electronic box comprising a chip and / or an electronic component and the housing obtained.
• the invention also relates to the manufacture of telecommunication modules for machines, in particular of the M2M type, which can have different form factors.
• Such boxes can be found, for example in the form of smart card modules, with various form factors such as those of small electronic objects of micro-SD (Secure Digital in English) formats, Micro-SIM (Subscriber Identity Module). in English) or SIM plug-in, Mini UICC (Universal Integrated Circuit Card in English).
• micro-SD Secure Digital in English
• SIM Subscriber Identity Module
• Mini UICC Universal Integrated Circuit Card in English
• SMD Surface Digital
• BGA Binary Grid Array English language
• These boxes include a power supply and / or communication interface including electrical contacts or antenna.
• the invention relates more particularly, but in a nonlimiting manner, to the manufacture of secure portable electronic objects such as smart cards or modules which find particular applications in health, banking, telecommunications or still the identity check, the physical and / or logical access control.
• the housings are generally assembled on the same support from a printed circuit substrate (PCB or "lead frame") on which are glued, welded and overmoulded several boxes.
• PCB printed circuit substrate
• the separation of these molded housings requires a cutting separation step using any type of cutting process (mechanical sawing, punching, laser, water jet). This step generates a large part of the manufacturing cost.
• the thickness or size of the current housings being constantly decreasing to allow greater integration in portable devices, telephone, it is necessary for this purpose, to provide a manufacturing process or more suitable arrangement of the housings.
• the invention aims to meet the aforementioned drawbacks of manufacturing cost and / or bulk.
• the principle of the invention is based on a molding of a particular substrate, described below, in which the contacts or circuit tracks or interfaces of supply and / or communication will be detached from a low adhesion support (or whose adhesion can be altered later to allow separation of the substrate from a block) and be transferred into a molding.
• the subject of the invention is a method for manufacturing an electronic box comprising an electronic chip whose face comprises at least conductive metallizations, said method comprising the following steps:
• the method is characterized in that the carrier comprises an adhesive or has a low or inelastic adhesiveness and that the molding is performed at the final size of the housing.
• the invention also relates to a molding equipment according to claims 7 to 8 and the electronic unit obtained according to claim 9.
• FIG. 1 to 7 illustrate a method of manufacturing an electronic box according to an embodiment of the invention
• FIG. 8 to 12 illustrate an installation and a manufacturing method according to a second embodiment of the invention
• FIG. 13 illustrates different views of objects / housings obtained according to one of the embodiments of the invention.
• the method of the invention comprises a step of supplying or realizing at least one set of metallizations comprising conductive tracks or tracks producing a communication interface and / or power supply in particular with electrical contacts and / or radiofrequency antenna, on an adhesive support or low adhesiveness;
• a step of producing at least one set of metallizations 4 comprising copper contacts on a detachable / separable substrate is illustrated.
• the substrate or support is a dielectric film chosen for its low adhesion properties so that the molding is easily detached, for example a PET (polyethylene terephthalate), a PEN (polyethylene naphthalate), an inexpensive substrate of the paper type.
• an antenna In the case of an antenna, it can be made flat as a spiral. The description is made preferentially for metallizations with electrical contacts, but the invention can also be applied to other electrically conductive elements such as tracks, antennas.
• the contact interface 4 can be replaced by an antenna radio frequency interface.
• the support (5) is determined with a plurality of zones for receiving each a set of metallizations and a housing.
• the adhesive may be according to the variants of the method, an adhesive that is slightly adherent in nature or heat-degradable or degradable with UV (ultraviolet) so that each set of metallizations, in particular copper is easily detached.
• the low tack values for the metallizations and the molding to be removable from the support can typically be between 0.5 and 5 Newton / cm in the 90 degree peel strength test.
• the peel rate may be, for example, 30 cm / minute or more.
• the adhesive dielectric (or low adhesiveness) is pierced in particular by punching
• a temporary fixing is carried out, in particular by lamination of a conductive sheet, in particular of copper on the dielectric support;
• the conductive sheet is chemically etched to form the external contacts of the desired housing or circuit
• step 5 it is possible, preferably, to carry out a surface treatment M 1, M 2 of the copper parts, for example in NI / Pd / Au;
• This surface treatment, in particular of metalization (anti-oxidation, passivation) M1 and / or M2 can be carried out on both sides of the copper also through each hole T of the support so that the external contacts are substantially flush with each other.
• the external surface of the case to the thickness of the treatment layer near or the adhesive layer of the support near (infra).
• the surface treatment (treatment metallization) only slightly exceeds the level of the overmoulding surface.
• the layer M2 of the surface treatment comprising a treatment metallization in the hole of the support can have a level higher than the surface level of the face 3 of the overmoulding.
• greater metallization adhesion can be provided in contact with the molding resin.
• the adhesion can be obtained by various known methods: for example, by increasing the roughness of the copper of the circuit, by increasing the surface roughness (the additional metallization type Ni / Pd / Au (nickel, palladium, gold) will follow this roughness, by plasma before molding, by anchoring points of the molding in conductive portions of the metallizations.
• the above substrate may be unpunched, as illustrated in FIG. 2;
• the external contacts 4 may remain copper (possibly protected from oxidation by organic passivation or other surface treatment prior or subsequent).
• the above substrate can be punched, as illustrated in FIG. 1, with a number of holes greater than those necessary to be metallized, in order to facilitate the subsequent separation of the low adhesion support. of the box, the surface facing vis-à-vis being indeed lower
• the contact pads may be perforated to limit adhesion and to save metallizations and / or to allow electromagnetic permeability in the case where the object also comprises a radiofrequency antenna, for example etched on the support.
• an antenna (not shown) is produced, for example at the same level as the contacts or conductive tracks, in particular at the periphery and / or at the center of the contact areas 4 in a central zone 40.
• the antenna which can be a particularly active or passive antenna (relay antenna) may optionally be printed on the molding material on the main surface before or after the molding material.
• an electrically conductive grid (in particular by jet of conductive material) on the support to form electrical contacts and / or tracks and / or at least one antenna.
• an electronic chip 2 with integrated circuits is transferred to the support or conductive elements (tracks, tracks, antenna turns);
• optional operation 6bis before or after the fixing of the chip in particular by gluing, can be used an optional cleaning plasma to improve the adhesion of the molding resin on the metallized contacts;
• the carrier (5) is determined with a plurality of housing receiving areas for making a plurality of packages in series. It is then possible, on such a support, to seize the housings, in particular by suction cups 10V (FIGS. 5, 6) arranged on robotic mobile grippers 10 after heating "C" the support, in particular by infrared lamps, to degrade the adhesion of the adhesive now temporarily housings on the support 5 and thus allow the separation of the housing 1 with its set of metallizations (contacts, tracks), with respect to the support 5;
• the adhesive may be a thermoplastic or heat fusible adhesive.
• FIGS. 8 to 12 there is described an installation and a manufacturing method according to a second embodiment. implementation of the invention.
• a mold M is used (FIG 8), comprising a first lower part DMI for supporting the substrate or support 5 and a corresponding second upper part DMS comprising a plurality of molding cavities (EM) with dimensions and shapes corresponding to the objects. / boxes to get.
• the mold DMS, DMI is closed again following displacement (F) of the upper part DMS against the lower part DMI and against the substrate 5.
• a plurality of molding spaces (EM) corresponding to the molding cavities CM is defined above the substrate and the plurality of electronic chips.
• material is injected into the molding spaces to overmold each electronic chip and form each housing.
• the mold comprises in known manner (not shown) one or more point (s) of injection of material into each molding cavity (EM), for example on the walls of each cavity corresponding to a slice of the objects or rear face (opposite at face 3 carrying contacts 4);
• the upper part DMS of the mold moves away (0) from the lower part to open the mold, the support or substrate 5 being held on the lower part DMI of the mold, in particular by suction. Any other means of maintenance or traction in particular mechanical exerting a separation force of the support 5 relative to the housings during the opening of the mold can be envisaged.
• the molded housings can remain in cavities (EM) or mold compartments (Fig. 11) during the ascent (0) of the upper part of the mold; Ejectors 14 slide (15) in the upper part of the DMS mold above the housings and against their rear face, through each molding cavity (EM), to extract the housings from their cavity and fall into a recovery bowl or directly in a dedicated plate having cells for receiving the housings (FIG. 12).
• the delamination of the housings on the substrate is facilitated because the molding is carried out at high temperature (about 180 ° C.) and the adhesive has been chosen to degrade around this temperature. Ejectors 14 sliding on the upper part DMS of the mold, can maintain this substrate on the lower part of the DMI mold.
• the support carrying the metallizations and at least one connected chip is introduced beforehand in a mold and after overmolding, the support 5 can be removed from the metallizations or be destroyed.
• the support can also be separated from the metallizations by being altered in particular by heat input during overmoulding in a mold.
• the adhesive is therefore preferably alterable rather quickly (for example less than one minute or the injection time a few seconds) to allow the removal of the support just after overmolding.
• the objects / housings here have the form of mini cards 1A, 1B, 1C with electrical contacts 4 flush with their main surface.
• the molding material or resin 7 constituting the insulating body of the card or object comprises a face 3 which can lie at the same level as the contact pads 4.
• the different metallizations are spaced apart from insulating molding material having the same level surface (or substantially the same level as explained above) that of the insulator.
• the metallizations are flush substantially at the same level as the molding material on the face 3.
• the ranges are preferably intended to directly connect a smart card reader connector or communication terminal such as a telephone, a personal assistant, a computer , a camera, or a communication device adapted to receive / connect a communication module SIM, M2M fixed or removable.
• the cards or mini cards or SIM communication module, M2M can be glued / fixed to the reader with conductive material or resin.
• the conductive contact pads may be flush with the main surface by a value between Oym and preferably 25 or even 50 ⁇ m.
• the object 1A may comprise in the center a zone 40 for any metallization (contact, antenna ).
• the object 1B is parallelepiped and the object 1C comprises a polarizer 41 in addition to the previous one.
• the invention it is possible to arrange electrical / electronic components 4 or metallizations of the object before overmolding so that the external surface of the constituents 4 is at the same level (or substantially) as the external surface of the molding material. on the face 3.
• the edge of the housings can be slightly inclined to promote demolding.
• the front surface in contact with the support is slightly greater than the opposite rear surface.
• the thickness of these objects can be reduced as much as possible.
• the chip can be placed directly on one of the metallizations or directly on the support.
• the number of superimposed elements constituting the object is reduced (absence of support film in the final constitution of the object contrary to the prior art).
• it can be glued directly on the low-tack support, unlike FIG 3;
• the fixing adhesive of the chip is at the same level as that of the insulating front surface 3 (molding material) of the housing or substantially at the same level as the metallizations.
• an electronic component such as a fingerprint sensor can come to the surface of the face 3 of the object as mounted as the chip 2 surface directly against the support (including low adhesiveness).
• the two opposite faces of the object are each provided with an overmolded component / element: the invention may provide for contact pads, other metallizations or other electrical / electronic constituents on one face of the object. as described supra while another component, such as a fingerprint sensor or the like, is made on the opposite face while flush with the outer surface of the face.
• a component such as an electronic chip or element performing a fingerprint sensor function, can be mounted so as to provide a flat surface, in particular that of capturing fingerprint to the outside.
• this flat surface referred to above can come into contact with the ceiling of the cavity EM during molding to avoid overmolding over it.
• a removable protective film or other protective layer may be provided on the impression sensor to prevent pollution of the surface during overmolding.
• the molding can implement various processes known to those skilled in the art made hot or cold or reaction (RIM).

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)

Priority Applications (1)

Applications Claiming Priority (3)

Publications (1)

Family

ID=47177860

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Family Applications Before (1)

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Family Cites Families (9)

• 2012
  • 2012-09-18 EP EP12306128.5A patent/EP2709143A1/de not_active Withdrawn
• 2013
  • 2013-09-17 WO PCT/EP2013/069297 patent/WO2014044684A1/fr active Application Filing
  • 2013-09-17 US US14/424,124 patent/US20150228505A1/en not_active Abandoned
  • 2013-09-17 EP EP13762853.3A patent/EP2898528A1/de not_active Ceased

Non-Patent Citations (2)

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