EP2893303A1 - Ultrasonic transducer, and method for producing an ultrasonic transducer - Google Patents

Ultrasonic transducer, and method for producing an ultrasonic transducer

Info

Publication number
EP2893303A1
EP2893303A1 EP13759168.1A EP13759168A EP2893303A1 EP 2893303 A1 EP2893303 A1 EP 2893303A1 EP 13759168 A EP13759168 A EP 13759168A EP 2893303 A1 EP2893303 A1 EP 2893303A1
Authority
EP
European Patent Office
Prior art keywords
ultrasonic transducer
covering means
housing
cavity
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13759168.1A
Other languages
German (de)
French (fr)
Inventor
Oliver Betz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
systec Controls Mess- und Regeltechnik GmbH
systec Controls Mess und Regeltechnik GmbH
Original Assignee
systec Controls Mess- und Regeltechnik GmbH
systec Controls Mess und Regeltechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by systec Controls Mess- und Regeltechnik GmbH, systec Controls Mess und Regeltechnik GmbH filed Critical systec Controls Mess- und Regeltechnik GmbH
Publication of EP2893303A1 publication Critical patent/EP2893303A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142—Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/886—Additional mechanical prestressing means, e.g. springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/028—Treatment by energy or chemical effects using vibration, e.g. sonic or ultrasonic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Definitions

  • the invention relates to an ultrasonic transducer, wherein the ultrasonic transducer comprises a housing and a piezo-element, which is inserted in a cavity of the housing. The cavity is covered by a covering means arranged in the housing. Between the cover and the piezo-element, a spring is arranged, which acts on the piezo-element with a spring force. Furthermore, the invention relates to a method for assembling an ultrasonic transducer and an assembly for installation in the housing of an ultrasonic transducer.
  • ultrasonic transducers are used for a variety of measurements.
  • the ultrasound used for the measurement is generated by exciting a piezoelectric element to vibrate by changing the voltage.
  • the ultrasound thus generated is picked up by a receiver directly or after reflection at an interface.
  • the receiver converts the applied ultrasonic signals back into a voltage change.
  • the ultrasonic transducer of the type mentioned is also suitable as a receiver, so that it can be used both as a generator as well as a receiver of ultrasonic signals.
  • Such ultrasonic transducers are used, for example, as pressure or level sensors. They have proven particularly useful as sensors for flowmeters.
  • the flow rate of a flowing through the conduit medium can be determined easily.
  • Various methods can be used for the measurement; a frequently used method is the propagation time difference measurement of the ultrasonic signals emitted by the ultrasound transducer. From the results obtained, the mass or volume flow in the pipe can be calculated with high precision.
  • ultrasonic flowmeters do not necessarily have to be installed in the pipe to be dimensioned, but also as so-called clamp-on measuring devices can be used. In many cases it is completely sufficient for the measurement to fasten the ultrasonic transducers on the outside of the line.
  • the non-invasive measurement offers the advantage that it is possible to dispense with opening the line required for inserting the sensor. Leakage problems do not even occur here.
  • clamp-on measuring devices do not generate a disturbance in the pipe cross-section and thus there is no danger of falsifying the measurement result by means of a local flow change caused by the sensor
  • the clamp-on flowmeters which are easy to install, are suitable for mobile use at changing measuring locations beyond stationary use. For this, it only needs to be calibrated to the respective pipe cross-section and the material used for the wall of the pipe.
  • An ultrasonic transducer essentially consists of a piezo element that is inserted in a cavity which is formed in the housing of the ultrasonic transducer.
  • the inserted into the cavity piezo element is pressed by spring force from the inside against this outer wall of the housing.
  • To the rest of the housing cavity is closed with a covering, usually it is covered by a simple disc.
  • Such a covering means is required because the interior of the ultrasonic transducer is provided with a potting enclosure after the assembly of the piezoelectric element in the vast majority of cases for safety reasons.
  • the disc covering the cavity is intended to prevent the liquid potting compound from penetrating into the cavity during the casting of the ultrasonic transducer and overriding the effect of the spring element.
  • the disc can be used as an abutment for the spring pressing the piezo element to the housing inner wall.
  • the assembly of these parts is relatively complex.
  • the piezo element Before the housing can be cast, the piezo element must first go outside be contacted. This is done via guided in the housing cable, which connect the piezoelectric element with the provided at the back of the housing terminals of the ultrasonic transducer.
  • an opening or a cable channel In the cavity-covering disc, an opening or a cable channel is provided, through which the cables must be threaded to guide them out of the cavity.
  • the piezoelectric element opposite end of the cable connection is soldered to the housing with the external interface of the ultrasonic transducer, so its connection.
  • impedance matching is almost always required. It is achieved by the interposition of an inductance.
  • the cavity After cabling, the cavity must be sealed off from the rest of the housing. A disk lying only on the cavity would not completely close it, penetration of the potting compound into the cavity would not be safe in this way.
  • the disc In order to ensure the tightness of the cavity as simple as possible, the disc is glued to the housing. For this purpose, the disc is positioned in the desired position over the cavity and fixed there, for example with a split pin. Subsequently, it is provided along the housing with an adhesive which, after curing, connects the disc to the housing and seals the cavity. Also glued and thus sealed is the existing in the disc opening with the guided through them wiring.
  • the object of the present application is to provide an ultrasonic transducer whose production is simpler in comparison with the ultrasonic transducers of the type mentioned above. Furthermore, a prefabricated assembly is proposed with which an ultrasonic transducer can be assembled in a quick and easy way. In addition, a simplifying the assembly of an ultrasonic transducer method is proposed.
  • the ultrasound transducer has a plurality of conductor tracks, respectively electrical conductors, which pass through the covering means.
  • one of the conductor tracks connects a contact surface, which is arranged on the side facing the piezoelectric element of the cover, with a contact surface on the opposite side of the cover.
  • the covering is thus formed as a kind of printed circuit board or board.
  • the electrical conductors are therefore integrated into the covering means, that is, embodied in one piece with the covering means.
  • the piezoelectric element is connected to the covering means on the side facing the cavity, and the external interface of the ultrasonic transducer arranged on the housing is connected to the side opposite the cavity.
  • the cables connecting the piezoelectric element with the external interface thus no longer have to be passed through an opening, instead two separate cables are each contacted with the contact points provided for this purpose on one side of the covering means.
  • a first cable connects the piezo element to the covering means
  • the second cable connects the covering means to the external interface of the ultrasonic transducer.
  • the first and second cables are in turn interconnected by the cover means.
  • the interconnects integrated in the covering means are thus part of an electrical connection which contacts the piezoelement with the external interfaces of the ultrasound transducer arranged on the housing.
  • a very particular advantage of this solution is that it makes it possible to pre-assemble elements of the ultrasonic transducer according to the invention prior to installation in the converter housing as an assembly.
  • the proposed prefabricated assembly has a covering means for closing a cavity provided for receiving a piezoelectric element of the ultrasonic transducer, wherein the Covering means according to the invention comprises electrical conductors which through-contact the covering means and wherein the assembly comprises a piezoelectric element which is connected to the electrical conductors and wherein between the piezo-element and the covering means a spring element is arranged.
  • This assembly is preferably already assembled outside of the ultrasonic transducer, since such an access from all sides is easily possible.
  • the piezoelectric element and the covering means are easily accessible in this way and can be connected to one another without hindrance.
  • the prefabricated module must then only be connected to the external interface of the ultrasonic transducer.
  • the designated contact points of the covering are still easily accessible even after the positioning of the assembly.
  • the assembly of the ultrasonic transducer is thereby significantly simplified.
  • contact points of the conductor tracks are formed as solder surfaces.
  • solder pads additionally facilitates the contacting of the cables and thus accelerate the assembly of the ultrasonic transducer even more.
  • the covering means comprises at least one electrical or electronic component. This makes it possible to provide such a component in the connection of the piezoelectric element and the external interface of the ultrasonic transducer, without it having to be intermediately interposed in the connection.
  • the component can be connected in advance of the assembly with the conductor of the cover, during assembly of the ultrasonic transducer so no additional connections are required except the contacts of the first and second cable.
  • the covering means comprises at least one inductance for impedance matching of the piezoelectric element.
  • An impedance matching is regularly required as described. If the board is already equipped with the inductance inserted in the strip conductor, it is possible to dispense with the freehand wiring of the coil otherwise to be performed during the contacting. It is particularly advantageous if the covering means comprises an active electronic component, for example a sensor detection, which reads out the piezoelectric element used in the ultrasonic transducer.
  • the ultrasonic transducer has a covering means, which is held in the transducer housing by means of a bayonet closure.
  • An essential basic idea of this aspect of the invention is to make the connection between cover and converter housing self-holding.
  • the proposed plug-in rotary connection allows a known manner, a positive connection of the two parts.
  • the cover means is fixed with the closing of the bayonet closure in the desired cavity covering position.
  • the spring element arranged between the covering means and the piezo element additionally assists the sealing of the cavity.
  • the spring force exerted by the spring element on the piezoelectric element presses in the opposite direction the covering means against the housing-side part of the bayonet closure and seals the cavity.
  • the positive connection achieved in this way makes it possible to dispense with the hitherto required additional step of bonding the covering means to the housing.
  • the cover must therefore no longer be held in position, as it was previously required for bonding.
  • the assembly of the ultrasonic transducer is much easier.
  • the specific embodiment of the bayonet principle ie how the covering is inserted into the housing and is moved by means of a rotation between covering and converter housing in a position in which it is held positively on the housing, can without particular difficulties to the respective circumstances be adjusted.
  • the bayonet closure comprises a thread.
  • the thread allows by twisting a Jacobson2020 the housing-side part and the cover center side part of the bayonet lock to the complete system.
  • the two closure parts are thus twisting pressed against each other along the thread, whereby the sealing of the cavity is further improved.
  • the piezo element and the covering means are connected to each other.
  • the piezo element is biased by the spring element, so to speak.
  • the assembly is then secured by means of the bayonet lock on the housing of the ultrasonic transducer, wherein the piezo element is pressed by the spring element against the inside of the housing. After closing the bayonet closure, the piezo element is in the intended position, at the same time the cavity is sealed.
  • the contacts on the side facing away from the cavity of the board must be connected to the electrical or electronic interfaces of the ultrasonic transducer.
  • Dannt is the piezoelectric element via the covering means through-contacting conductor tracks connected to the housing arranged connections of the ultrasonic transducer.
  • the covering means is welded to the housing, in particular by ultrasonic welding.
  • the method of attachment of the covering means can also be considered detached from the formation of the covering means with through-contacting conductor tracks.
  • the described advantages of the fastening types bayonet closure or ultrasonic welding can also be realized independently of the formation of the covering means as a circuit board.
  • the features of the characterizing part of claims 1 and 1 1 are therefore not mandatory for this purpose.
  • Figure 1 A schematic representation of a composite ultrasonic transducer with a cover plate in the form of a board
  • Figure 2 A schematic representation of an ultrasonic transducer with a cover plate in the form of a circuit board, which is held by means of a bayonet closure in the housing.
  • the ultrasonic transducer 1 shown in FIG. 1 has a housing 2 and a connection 3 fastened to the housing 2 for a cable connection, not shown here, for connecting the ultrasonic transducer 1 to a control unit.
  • a piezo element 5 is arranged in a cavity 4.
  • the piezoelectric element 5 is acted upon by a spring 6, which presses it against a wall 7 of the cavity 4.
  • the piezo-element 5 opposite end of the spring 6 abuts a cover 4 covering the cavity 4.
  • the covering means is fastened to the housing 2 by retaining means, not shown here, and seals the cavity against the penetration of potting compound.
  • the covering means 8 has through-contacting printed conductors and is thus formed like a platinum. On the side facing the cavity 4 of the cover 8 conductor tracks are connected via cable 9 to the piezoelectric element 5.
  • the cable 9 run through the spring 6 formed in the form of a helical spring.
  • the covering means 8, the spring 6 and the piezo element 5 connected via the cables 9 to the covering means 8 form an assembly. The assembly may be prefabricated outside the housing 2 and inserted into the converter housing 2 after assembly.
  • the cover means 8 requires no opening for the piezoelectric element 5 outwardly contacting cable. It is self-contained. His the cavity 4 facing away from surface 10 thus has no openings, could penetrate through the potting compound in the cavity 4. On the surface 10 solder pads are provided, are connected via the cable 1 1 with the piezoelectric element 5 through-contacting conductor tracks. The cables 1 1 extend through the housing 2 to the terminal 3, via which the piezo element 5 can be connected to a control unit.
  • FIG. 2 shows a further partially opened ultrasonic transducer 1, in which the holding means of the covering means 8 is a bayonet closure 12.
  • the circularly shaped covering means 8 has on its circumference two projecting pins, which are inserted into slots 13 which are mutually offset by 180 degrees at a likewise circular opening of the housing 2 are arranged above the cavity 4.
  • Adjoining the slots 13 is a lateral slot designed to be transverse, in which the pins are pushed in by twisting the cover means 8.
  • the taken in the transverse slot, shown here in phantom pin 14 undercut the longitudinal slot 13 and thus secure the cover 8 in its position over the cavity 4 so that it can seal the cavity against entered into the housing potting compound.
  • the cables 1 1 are equipped with sufficient clearance, so that they do not hinder the rotation of the cover 8.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Signal Processing (AREA)
  • Acoustics & Sound (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

The invention relates to an ultrasonic transducer (1) comprising a housing (2) and a piezo element (5). The piezo element (5) is inserted into a cavity (4) of the housing, and the housing (2) is equipped with a covering means (8) which covers the cavity (4). A spring element (6) is arranged between the covering means (8) in the piezo element (5), said spring element applying a spring force onto the piezo element (5), and the covering means (8) has multiple conductor paths which establish a contact through the covering means (8).

Description

Ultraschall-Wandler und Verfahren zur Herstellung eines Ultraschall-Wandlers  Ultrasonic transducer and method of making an ultrasonic transducer
Die Erfindung betrifft einen Ultraschall-Wandler, wobei der Ultraschallwandler ein Gehäuse und ein Piezo-Element umfasst, das in einem Hohlraum des Gehäuses eingesetzt ist. Der Hohlraum wird von einem im Gehäuse angeordneten Abdeckmittel abgedeckt. Zwischen dem Abdeckmittel und dem Piezo-Element ist eine Feder angeordnet, welche das Piezo-Element mit einer Federkraft beaufschlagt. Des weiteren betrifft die Erfindung ein Verfahren zum Zusammenbau eines Ultraschall- Wandlers und eine Baugruppe zum Einbau in das Gehäuse eines Ultraschall- Wandlers. The invention relates to an ultrasonic transducer, wherein the ultrasonic transducer comprises a housing and a piezo-element, which is inserted in a cavity of the housing. The cavity is covered by a covering means arranged in the housing. Between the cover and the piezo-element, a spring is arranged, which acts on the piezo-element with a spring force. Furthermore, the invention relates to a method for assembling an ultrasonic transducer and an assembly for installation in the housing of an ultrasonic transducer.
Derartige Ultraschall-Wandler werden für eine Vielzahl von Messungen eingesetzt. Der zur Messung genutzte Ultraschall wird erzeugt, indem ein piezoelektrisches Element durch Spannungsänderung zu Schwingungen angeregt wird. Der so erzeugte Ultraschall wird direkt oder nach einer Reflexion an einer Grenzfläche von einem Empfänger aufgenommen. Der Empfänger wandelt die auf ihn einwirkenden Ultraschall-Signale wieder in eine Spannungsänderung um. Das Ultraschall-Wandler der eingangs genannten Art ist gleichfalls als Empfänger geeignet, so dass er sowohl als Erzeuger wie auch als Empfänger von Ultraschall-Signalen eingesetzt werden kann. Verwendung finden derartige Ultraschall-Wandler beispielsweise als Druckoder Füllstandssensoren. Bewährt haben sie sich insbesondere als Sensoren für Durchflussmesser. Such ultrasonic transducers are used for a variety of measurements. The ultrasound used for the measurement is generated by exciting a piezoelectric element to vibrate by changing the voltage. The ultrasound thus generated is picked up by a receiver directly or after reflection at an interface. The receiver converts the applied ultrasonic signals back into a voltage change. The ultrasonic transducer of the type mentioned is also suitable as a receiver, so that it can be used both as a generator as well as a receiver of ultrasonic signals. Such ultrasonic transducers are used, for example, as pressure or level sensors. They have proven particularly useful as sensors for flowmeters.
Mit einem Ultraschall-Durchflussmesser lässt sich die Strömungsgeschwindigkeit eines durch die Leitung strömenden Mediums ohne großen Aufwand bestimmen. Zur Messung können verschiedene Verfahren eingesetzt werden, eine häufig genutzte Methode ist die Laufzeitdifferenzmessung der vom Ultraschall-Wandler ausgesendeten Ultraschall-Signale. Aus den gewonnenen Messergebnissen lässt sich dann mit hoher Präzision der Massen- bzw. Volumendurchfluss in der Leitung berechnen. With an ultrasonic flowmeter, the flow rate of a flowing through the conduit medium can be determined easily. Various methods can be used for the measurement; a frequently used method is the propagation time difference measurement of the ultrasonic signals emitted by the ultrasound transducer. From the results obtained, the mass or volume flow in the pipe can be calculated with high precision.
Ein besonderer Vorteil von Ultraschall-Durchflussmesser ist, dass sie nicht zwingend in die zu bemessende Leitung eingebaut werden müssen, sondern auch als sogenannte Clamp-on-Messgeräte eingesetzt werden können. In vielen Fällen reicht es zur Messung vollkommen aus, die Ultraschall-Wandler außen an der Leitung zu befestigen. Die nicht-invasive Messung bietet den Vorteil, dass auf eine für das Einsetzen des Sensors erforderliche Öffnung der Leitung verzichtet werden kann. Dichtigkeitsprobleme treten hier erst gar nicht auf. Ein weiterer Vorteil liegt darin, dass Clamp-on-Messgeräte keine Störung im Rohrquerschnitt erzeugen und somit keine Gefahr besteht, durch eine vom Sensor hervorgerufene lokale Strömungsveränderungen das Messergebnis zu verfälschen A particular advantage of ultrasonic flowmeters is that they do not necessarily have to be installed in the pipe to be dimensioned, but also as so-called clamp-on measuring devices can be used. In many cases it is completely sufficient for the measurement to fasten the ultrasonic transducers on the outside of the line. The non-invasive measurement offers the advantage that it is possible to dispense with opening the line required for inserting the sensor. Leakage problems do not even occur here. A further advantage is that clamp-on measuring devices do not generate a disturbance in the pipe cross-section and thus there is no danger of falsifying the measurement result by means of a local flow change caused by the sensor
Die ohne großen Aufwand zu montierenden Clamp-On-Durchflussmesser eignen sich über die stationäre Verwendung hinaus auch für den mobilen Einsatz an wechselnden Messorten. Dafür muss er lediglich auf den jeweiligen Leitungsquerschnitt und das für die Wandung des Rohres verwendete Material kalibriert werden. The clamp-on flowmeters, which are easy to install, are suitable for mobile use at changing measuring locations beyond stationary use. For this, it only needs to be calibrated to the respective pipe cross-section and the material used for the wall of the pipe.
Ein Ultraschall-Wandler besteht im Wesentlichen aus einem Piezo-Element, dass in einem Hohlraum eingesetzt ist, der im Gehäuse des Ultraschall-Wandlers ausgebildet ist. Das in den Hohlraum eingesetzte Piezo-Element wird mit Federkraft von Innen gegen diese Außenwand des Gehäuses gedrückt. Zum übrigen Gehäuse hin ist Hohlraum mit einem Abdeckmittel verschlossen, üblicherweise wird er durch eine einfache Scheibe abgedeckt. An ultrasonic transducer essentially consists of a piezo element that is inserted in a cavity which is formed in the housing of the ultrasonic transducer. The inserted into the cavity piezo element is pressed by spring force from the inside against this outer wall of the housing. To the rest of the housing cavity is closed with a covering, usually it is covered by a simple disc.
Ein solches Abdeckmittel ist erforderlich, da der Innenraum des Ultraschallwandlers nach der Montage des Piezo-Elements in den allermeisten Fällen aus Sicherheitsgründen mit einer Vergusskapselung versehen wird. Die den Hohlraum abdeckende Scheibe soll verhindern, dass beim Vergießen des Ultraschall-Wandlers die flüssige Vergussmasse in den Hohlraum eindringt und die Wirkung des Federelements außer Kraft gesetzt. Zusätzlich kann die Scheibe als Widerlager für die das Piezo-Element an die Gehäuse-Innenwand drückende Feder genutzt werden. Such a covering means is required because the interior of the ultrasonic transducer is provided with a potting enclosure after the assembly of the piezoelectric element in the vast majority of cases for safety reasons. The disc covering the cavity is intended to prevent the liquid potting compound from penetrating into the cavity during the casting of the ultrasonic transducer and overriding the effect of the spring element. In addition, the disc can be used as an abutment for the spring pressing the piezo element to the housing inner wall.
Zwar weist ein Ultraschall-Wandler nur einige wenige Bauteile auf, der Zusammenbau dieser Teile ist hingegen relativ aufwändig. Bevor das Gehäuse vergossen werden kann, muss das Piezo-Element erst einmal nach Außen kontaktiert werden. Dies erfolgt über im Gehäuse geführte Kabel, welche das Piezo- Element mit den an der Rückseite des Gehäuses vorgesehenen Anschlüssen des Ultraschall-Wandlers verbinden. In der den Hohlraum abdeckenden Scheibe ist eine Öffnung oder ein Kabelkanal vorgesehen, durch welche die Kabel gefädelt werden müssen, um sie aus dem Hohlraum zu führen. Das dem Piezo-Element entgegengesetzte Ende der Kabelverbindung wird am Gehäuse mit der externen Schnittstelle des Ultraschall-Wandlers, also dessen Anschluss, verlötet. Zusätzlich ist fast immer eine Impedanzanpassung erforderlich. Sie wird durch das Zwischenschalten einer Induktivität erreicht. Although an ultrasonic transducer has only a few components, the assembly of these parts is relatively complex. Before the housing can be cast, the piezo element must first go outside be contacted. This is done via guided in the housing cable, which connect the piezoelectric element with the provided at the back of the housing terminals of the ultrasonic transducer. In the cavity-covering disc, an opening or a cable channel is provided, through which the cables must be threaded to guide them out of the cavity. The piezoelectric element opposite end of the cable connection is soldered to the housing with the external interface of the ultrasonic transducer, so its connection. In addition, impedance matching is almost always required. It is achieved by the interposition of an inductance.
Nach erfolgter Verkabelung muss der Hohlraum gegenüber dem Rest des Gehäuses abgedichtet werden. Eine lediglich auf dem Hohlraum liegende Scheibe würde ihn nicht vollständig verschließen, ein Eindringen der Vergussmasse in den Hohlraum wäre auf diese Weise nicht sicher auszuschließen. Um die Dichtigkeit des Hohlraums möglichst einfach gewährleisten zu können, wird die Scheibe am Gehäuse verklebt. Hierzu wird die Scheibe in der gewünschte Lage über dem Hohlraum positioniert und dort fixiert, beispielsweise mit einem Splint. Anschließend wird sie entlang des Gehäuses mit einem Klebemittel versehen, welches nach dem Aushärten die Scheibe mit dem Gehäuse verbindet und den Hohlraum abdichtet. Ebenfalls verklebt und damit abgedichtet wird die in der Scheibe vorhandene Öffnung mit der durch sie hindurchgeführten Verkabelung. After cabling, the cavity must be sealed off from the rest of the housing. A disk lying only on the cavity would not completely close it, penetration of the potting compound into the cavity would not be safe in this way. In order to ensure the tightness of the cavity as simple as possible, the disc is glued to the housing. For this purpose, the disc is positioned in the desired position over the cavity and fixed there, for example with a split pin. Subsequently, it is provided along the housing with an adhesive which, after curing, connects the disc to the housing and seals the cavity. Also glued and thus sealed is the existing in the disc opening with the guided through them wiring.
Aufgabe der vorliegenden Anmeldung ist es, einen Ultraschall-Wandler zu schaffen, dessen Fertigung im Vergleich mit dem Ultraschall-Wandlern der eingangs genannten Art einfacher vonstatten geht. Des Weiteren wird eine vorfertigbare Baugruppe vorgeschlagen, mit der ein Ultraschall-Wandler auf schnelle und einfache Weise zusammengebaut werden kann. Zudem wird ein den Zusammenbau eines Ultraschall-Wandlers vereinfachendes Verfahren vorgeschlagen. The object of the present application is to provide an ultrasonic transducer whose production is simpler in comparison with the ultrasonic transducers of the type mentioned above. Furthermore, a prefabricated assembly is proposed with which an ultrasonic transducer can be assembled in a quick and easy way. In addition, a simplifying the assembly of an ultrasonic transducer method is proposed.
Die jeweiligen Aufgaben werden durch die Merkmale der Ansprüche 1 , 9 bzw. 1 1 gelöst. Vorteilhafte Ausgestaltungen ergeben sich aus den dazugehörigen Unteransprüchen. Der Ultraschall-Wandler weist in seiner erfindungsgemäßen Ausgestaltung mehrere das Abdeckmittel durchkontaktierende Leiterbahnen, respektive elektrische Leiter auf. Jeweils eine der Leiterbahnen verbindet eine Kontaktfläche, die auf der dem Piezo-Element zugewandten Seite des Abdeckmittels angeordnet ist, mit einer Kontaktfläche an der abgewandten Seite des Abdeckmittels. Das Abdeckmittel ist damit quasi als eine Art Leiterplatte respektive Platine ausgebildet. Die elektrischen Leiter sind demnach in das Abdeckmittel integriert, also einstückig mit dem Abdeckmittel ausgeführt. An dem Abdeckmittel wird an der dem Hohlraum zugewandten Seite das Piezo-Element und an der dem Hohlraum entgegengesetzten Seite die am Gehäuse angeordnete externe Schnittstelle des Ultraschall-Wandlers angeschlossen. Hierdurch kann nicht nur auf das bisher für die Kontaktierung des Piezo-Elements erforderliche Durchfädeln von Kabeln durch die Öffnung im Abdeckmittel verzichtet werden. Die Öffnung selbst wird nicht mehr benötigt. Damit entfällt auch das ansonsten notwendige Verschließen und abdichten dieser Öffnung vor dem Verguss des Ultraschall-Wandlers. Zum Verschließen des Hohlraums ist es nun mehr lediglich erforderlich, das Abdeckmittel in den Ultraschall- Wandler einzusetzen. The respective objects are achieved by the features of claims 1, 9 and 1 1. Advantageous embodiments will be apparent from the appended subclaims. In its embodiment according to the invention, the ultrasound transducer has a plurality of conductor tracks, respectively electrical conductors, which pass through the covering means. In each case one of the conductor tracks connects a contact surface, which is arranged on the side facing the piezoelectric element of the cover, with a contact surface on the opposite side of the cover. The covering is thus formed as a kind of printed circuit board or board. The electrical conductors are therefore integrated into the covering means, that is, embodied in one piece with the covering means. The piezoelectric element is connected to the covering means on the side facing the cavity, and the external interface of the ultrasonic transducer arranged on the housing is connected to the side opposite the cavity. As a result, not only the previously required for the contacting of the piezoelectric element threading of cables through the opening in the cover can be dispensed with. The opening itself is no longer needed. This eliminates the otherwise necessary closing and sealing this opening before the casting of the ultrasonic transducer. To close the cavity, it is now only necessary to use the covering in the ultrasonic transducer.
Die das Piezo-Element mit der externen Schnittstelle verbindenden Kabel müssen somit nicht mehr durch eine Öffnung geführt werden, stattdessen werden zwei separate Kabel jeweils mit den hierfür vorgesehenen Kontaktstellen an einer Seite des Abdeckmittels kontaktiert. Ein erstes Kabel verbindet das Piezo-Element mit dem Abdeckmittel, das zweite Kabel das Abdeckmittel mit der externen Schnittstelle des Ultraschall-Wandlers. Das erste und das zweite Kabel werden wiederum durch das Abdeckmittel miteinander verbunden. Die in das Abdeckmittel integrierten Leiterbahnen sind somit ein Teil einer elektrischen Verbindung, welche das Piezo- Element mit den am Gehäuse angeordneten externen Schnittstellen des Ultraschallwandlers kontaktiert. The cables connecting the piezoelectric element with the external interface thus no longer have to be passed through an opening, instead two separate cables are each contacted with the contact points provided for this purpose on one side of the covering means. A first cable connects the piezo element to the covering means, the second cable connects the covering means to the external interface of the ultrasonic transducer. The first and second cables are in turn interconnected by the cover means. The interconnects integrated in the covering means are thus part of an electrical connection which contacts the piezoelement with the external interfaces of the ultrasound transducer arranged on the housing.
Ein ganz besonderer Vorteil dieser Lösung ist es, dass sie ermöglicht, Elemente des erfindungsgemäßen Ultraschall-Wandlers vor dem Einbau in das Wandler-Gehäuse als Baugruppe vorab zusammen zu montieren. Die vorgeschlagene vorfertigbare Baugruppe weist ein Abdeckmittel zum Verschließen eines zur Aufnahme eines Piezo-Element vorgesehenen Hohlraumes des Ultraschall-Wandlers auf, wobei das Abdeckmittel erfindungsgemäße elektrische Leiter umfasst, welche das Abdeckmittel durchkontaktieren und wobei die Baugruppe ein Piezo-Element aufweist, welches mit den elektrischen Leitern verbunden ist und wobei zwischen dem Piezo-Element und dem Abdeckmittel ein Feder-Element angeordnet ist. Diese Baugruppe wird vorzugsweise schon außerhalb des Ultraschall-Wandlers zusammengebaut, da so ein Zugang von allen Seiten leicht möglich ist. Insbesondere sind das Piezo-Element und das Abdeckmittel auf diese Weise leicht zugänglich und können ohne Behinderung miteinander verbunden werden. Die vorgefertigte Baugruppe muss dann nur noch mit der externen Schnittstelle des Ultraschall-Wandlers verbunden werden. Die hierfür vorgesehenen Kontaktstellen des Abdeckmittels sind selbst nach der Positionierung der Baugruppe noch leicht zugänglich. Der Zusammenbau des Ultraschall-Wandlers wird hierdurch deutlich vereinfacht. A very particular advantage of this solution is that it makes it possible to pre-assemble elements of the ultrasonic transducer according to the invention prior to installation in the converter housing as an assembly. The proposed prefabricated assembly has a covering means for closing a cavity provided for receiving a piezoelectric element of the ultrasonic transducer, wherein the Covering means according to the invention comprises electrical conductors which through-contact the covering means and wherein the assembly comprises a piezoelectric element which is connected to the electrical conductors and wherein between the piezo-element and the covering means a spring element is arranged. This assembly is preferably already assembled outside of the ultrasonic transducer, since such an access from all sides is easily possible. In particular, the piezoelectric element and the covering means are easily accessible in this way and can be connected to one another without hindrance. The prefabricated module must then only be connected to the external interface of the ultrasonic transducer. The designated contact points of the covering are still easily accessible even after the positioning of the assembly. The assembly of the ultrasonic transducer is thereby significantly simplified.
Vorzugsweise sind zumindest die an der dem Piezo-Element abgewandten Seite des Abdeckmittels angeordnete Kontaktstellen der Leiterbahnen als Lötflächen ausgebildet. Die Ausbildung der Kontaktstellen als Lötflächen, sogenannte Lötpads, erleichtert zusätzlich das Kontaktieren der Kabel und beschleunigen somit den Zusammenbau des Ultraschall-Wandlers noch mehr. Preferably, at least arranged on the side facing away from the piezoelectric element side of the cover means contact points of the conductor tracks are formed as solder surfaces. The formation of the contact points as solder surfaces, so-called solder pads, additionally facilitates the contacting of the cables and thus accelerate the assembly of the ultrasonic transducer even more.
In einer besonders bevorzugten Ausführungsform umfasst das Abdeckmittel zumindest ein elektrisches bzw. elektronisches Bauelement. Dies ermöglicht es, ein solches Bauelement in der Verbindung von Piezo-Element und externer Schnittstelle des Ultraschall-Wandlers vorzusehen, ohne dass es erst aufwendig in die Verbindung zwischengeschaltet werden muss. Das Bauelement kann schon im Vorfeld der Montage mit der Leiterbahn des Abdeckmittels verbunden werden, beim Zusammenbau des Ultraschall-Wandlers sind so außer den Kontaktierungen des ersten und des zweiten Kabels keine zusätzlichen Anschlüsse erforderlich. In a particularly preferred embodiment, the covering means comprises at least one electrical or electronic component. This makes it possible to provide such a component in the connection of the piezoelectric element and the external interface of the ultrasonic transducer, without it having to be intermediately interposed in the connection. The component can be connected in advance of the assembly with the conductor of the cover, during assembly of the ultrasonic transducer so no additional connections are required except the contacts of the first and second cable.
Vorzugsweise umfasst das Abdeckmittel zumindest eine Induktivität zur Impedanzanpassung des Piezo-Elements. Eine Impedanzanpassung ist wie beschrieben regelmäßig erforderlich. Ist die Platine bereits mit der in die Leiterbahn eingefügten Induktivität bestückt, kann auf die ansonsten während der Kontaktierung durchzuführende freihändige Verdrahtung der Spule verzichtet werden. Von besonderem Vorteil ist es, wenn das Abdeckmittel ein aktives elektronisches Bauelement umfasst, beispielsweise eine Sensorerkennung, die das im Ultraschall- Wandler verwendete Piezo-Element ausliest. Preferably, the covering means comprises at least one inductance for impedance matching of the piezoelectric element. An impedance matching is regularly required as described. If the board is already equipped with the inductance inserted in the strip conductor, it is possible to dispense with the freehand wiring of the coil otherwise to be performed during the contacting. It is particularly advantageous if the covering means comprises an active electronic component, for example a sensor detection, which reads out the piezoelectric element used in the ultrasonic transducer.
In einer besonders bevorzugten Ausführungsform weist der Ultraschall-Wandler ein Abdeckmittel auf, das in dem Wandler-Gehäuse mittels eines Bajonettverschlusses gehalten wird. Ein wesentlicher Grundgedanke dieses Aspekts der Erfindung ist es, die Verbindung zwischen Abdeckmittel und Wandler-Gehäuse selbsthaltend auszubilden. Die dazu vorgeschlagene Steck-Dreh-Verbindung ermöglicht auf an sich bekannte Weise eine formschlüssige Verbindung der beiden Teile. In a particularly preferred embodiment, the ultrasonic transducer has a covering means, which is held in the transducer housing by means of a bayonet closure. An essential basic idea of this aspect of the invention is to make the connection between cover and converter housing self-holding. The proposed plug-in rotary connection allows a known manner, a positive connection of the two parts.
Das Abdeckmittel wird mit dem Verschließen des Bajonett-Verschlusses in der gewünschten, den Hohlraum abdeckenden Position fixiert. Das zwischen Abdeckmittel und Piezo-Element angeordnete Feder-Element unterstützt dabei das Abdichten des Hohlraums zusätzlich. Die von dem Feder-Element auf das Piezo- Element ausgeübte Federkraft drückt in Gegenrichtung das Abdeckmittel gegen den gehäuseseitigen Teil des Bajonett-Verschlusses und dichtet den Hohlraum ab. Die so erreichte formschlüssige Verbindung ermöglicht, auf den bisher erforderliche zusätzlichen Arbeitsschritt der Verklebung des Abdeckmittels am Gehäuse zu verzichten. Damit muss das Abdeckmittel damit auch nicht mehr in Position gehalten werden, wie es bisher zum Verkleben erforderlich war. Der Zusammenbau des Ultraschall-Wandlers wird so wesentlich erleichtert. The cover means is fixed with the closing of the bayonet closure in the desired cavity covering position. The spring element arranged between the covering means and the piezo element additionally assists the sealing of the cavity. The spring force exerted by the spring element on the piezoelectric element presses in the opposite direction the covering means against the housing-side part of the bayonet closure and seals the cavity. The positive connection achieved in this way makes it possible to dispense with the hitherto required additional step of bonding the covering means to the housing. Thus, the cover must therefore no longer be held in position, as it was previously required for bonding. The assembly of the ultrasonic transducer is much easier.
Die konkrete Ausgestaltung des Bajonett-Prinzips, also wie das Abdeckmittel in das Gehäuse eingesetzt wird und mittels einer Verdrehung zwischen Abdeckmittel und Wandler-Gehäuse in eine Position bewegt wird, in der es formschlüssig am Gehäuse gehalten wird, kann ohne besondere Schwierigkeiten an die jeweiligen Gegebenheiten angepasst werden. The specific embodiment of the bayonet principle, ie how the covering is inserted into the housing and is moved by means of a rotation between covering and converter housing in a position in which it is held positively on the housing, can without particular difficulties to the respective circumstances be adjusted.
Vorzugsweise umfasst der Bajonettverschluss einen Gewindegang. Der Gewindegang ermöglicht durch das Verdrehen ein Gegeneinanderführen des gehäuseseitigen Teil und des abdeckmittelseitigen Teils des Bajonettverschluss bis zur vollständigen Anlage. Die beiden Verschlussteile werden somit beim Verdrehen entlang des Gewindegangs gegeneinander gepresst, wodurch die Abdichtung des Hohlraums weiter verbessert wird. Preferably, the bayonet closure comprises a thread. The thread allows by twisting a Gegeneinanderführ the housing-side part and the cover center side part of the bayonet lock to the complete system. The two closure parts are thus twisting pressed against each other along the thread, whereby the sealing of the cavity is further improved.
Beim Zusammenbau wird das Piezo-Element und das Abdeckmittel miteinander verbunden. Das Piezo-Element wird durch das Feder-Element sozusagen vorgespannt. Die Baugruppe wird dann mittels des Bajonett-Verschlusses am Gehäuse des Ultraschall-Wandlers befestigt, wobei das Piezo-Element von dem Feder-Element gegen die Innenseite des Gehäuses gedrückt wird. Nach dem Schließen des Bajonettverschlusses ist das Piezo-Element an der vorgesehenen Position, gleichzeitig ist der Hohlraum dicht verschlossen. Vor dem abschließenden Vergießen müssen nur noch die Kontakte an der dem Hohlraum abgewandten Seite der Platine mit den elektrischen oder elektronischen Schnittstellen des Ultraschall- Wandlers verbunden werden. Dannt ist das Piezo-Element über die das Abdeckmittel durchkontaktierenden Leiterbahnen mit den am Gehäuse angeordneten Anschlüssen des Ultraschallwandlers verbunden. During assembly, the piezo element and the covering means are connected to each other. The piezo element is biased by the spring element, so to speak. The assembly is then secured by means of the bayonet lock on the housing of the ultrasonic transducer, wherein the piezo element is pressed by the spring element against the inside of the housing. After closing the bayonet closure, the piezo element is in the intended position, at the same time the cavity is sealed. Before the final casting only the contacts on the side facing away from the cavity of the board must be connected to the electrical or electronic interfaces of the ultrasonic transducer. Dannt is the piezoelectric element via the covering means through-contacting conductor tracks connected to the housing arranged connections of the ultrasonic transducer.
Als alternative Befestigungsart wird das Abdeckmittel mit dem Gehäuse verschweißt, insbesondere per Ultraschallschweißen. Diese Befestigungsform per Stoffschluss dichtet den Hohlraum besonders gut ab. As an alternative method of attachment, the covering means is welded to the housing, in particular by ultrasonic welding. This form of attachment by fabric seal seals the cavity particularly well.
Ganz grundsätzlich kann die Befestigungsart des Abdeckmittels auch losgelöst von der Ausbildung des Abdeckmittels mit es durchkontaktierende Leiterbahnen betrachtet werden. Die beschriebenen Vorteile der Befestigungsarten Bajonettverschluss oder Ultraschallschweißen lassen sich auch unabhängig von der Ausbildung des Abdeckmittels als Platine realisieren. Die Merkmale des kennzeichnenden Teils der Ansprüche 1 und 1 1 sind somit hierfür nicht zwingend erforderlich. In principle, the method of attachment of the covering means can also be considered detached from the formation of the covering means with through-contacting conductor tracks. The described advantages of the fastening types bayonet closure or ultrasonic welding can also be realized independently of the formation of the covering means as a circuit board. The features of the characterizing part of claims 1 and 1 1 are therefore not mandatory for this purpose.
Im weiteren werden zwei besonders bevorzugte Ausführungsformen der Erfindung anhand zweier Zeichnungen näher beschrieben. Dabei zeigen In the following, two particularly preferred embodiments of the invention will be described in more detail with reference to two drawings. Show
Figur 1 : Eine schematische Darstellung eines zusammengesetzten Ultraschall- Wandlers mit einer Abdeckplatte in Form einer Platine und Figur 2: Eine schematische Darstellung eines Ultraschall-Wandlers mit einer Abdeckplatte in Form einer Platine, die mittels eines Bajonett-Verschlusses im Gehäuse gehalten wird. Figure 1: A schematic representation of a composite ultrasonic transducer with a cover plate in the form of a board and Figure 2: A schematic representation of an ultrasonic transducer with a cover plate in the form of a circuit board, which is held by means of a bayonet closure in the housing.
Der von Figur 1 gezeigte Ultraschall-Wandler 1 weist ein Gehäuse 2 und einen an dem Gehäuse 2 befestigten Anschluss 3 für eine hier nicht gezeigte Kabelverbindung zum Anschluss des Ultraschall-Wandlers 1 an ein Steuergerät auf. In dem in teilgeöffneter Darstellung gezeigten Gehäuse 2 ist in einem Hohlraum 4 ein Piezo- Element 5 angeordnet. Das Piezo-Element 5 wird von einer Feder 6 beaufschlagt, die es gegen eine Wandung 7 des Hohlraums 4 drückt. Das dem Piezo-Element 5 entgegengesetzte Ende der Feder 6 liegt an einem den Hohlraum 4 abdeckenden Abdeckmittel 8 an. Das Abdeckmittel ist durch hier nicht gezeigte Haltemittel am Gehäuse 2 befestigt und dichtet den Hohlraum gegen das Eindringen von Vergussmasse ab. The ultrasonic transducer 1 shown in FIG. 1 has a housing 2 and a connection 3 fastened to the housing 2 for a cable connection, not shown here, for connecting the ultrasonic transducer 1 to a control unit. In the housing 2 shown in partially opened illustration, a piezo element 5 is arranged in a cavity 4. The piezoelectric element 5 is acted upon by a spring 6, which presses it against a wall 7 of the cavity 4. The piezo-element 5 opposite end of the spring 6 abuts a cover 4 covering the cavity 4. The covering means is fastened to the housing 2 by retaining means, not shown here, and seals the cavity against the penetration of potting compound.
Das Abdeckmittel 8 weist es durchkontaktierende Leiterbahnen auf und ist damit platinenartig ausgebildet. An der dem Hohlraum 4 zugewandten Seite des Abdeckmittels 8 sind Leiterbahnen über Kabel 9 mit dem Piezo-Element 5 verbunden. Dabei durchlaufen die Kabel 9 die in Form einer Spiralfeder ausgebildete Feder 6. Das Abdeckmittel 8, die Feder 6 und das über die Kabel 9 mit dem Abdeckmittel 8 verbundene Piezo-Element 5 bilden eine Baugruppe. Die Baugruppe kann außerhalb des Gehäuses 2 vorgefertigt werden und nach ihrem Zusammenbau in das Wandler-Gehäuse 2 eingesetzt werden. The covering means 8 has through-contacting printed conductors and is thus formed like a platinum. On the side facing the cavity 4 of the cover 8 conductor tracks are connected via cable 9 to the piezoelectric element 5. The cable 9 run through the spring 6 formed in the form of a helical spring. The covering means 8, the spring 6 and the piezo element 5 connected via the cables 9 to the covering means 8 form an assembly. The assembly may be prefabricated outside the housing 2 and inserted into the converter housing 2 after assembly.
Aufgrund der Leiterbahnen benötigt das Abdeckmittel 8 keine Öffnung für das Piezo- Element 5 nach außen kontaktierende Kabel. Es ist in sich geschlossen ausgebildet. Seine dem Hohlraum 4 abgewandte Fläche 10 weist somit keine Durchbrüche auf, durch die Vergussmasse in den Hohlraum 4 eindringen könnte. An der Fläche 10 sind Lötpads vorgesehen, über die Kabel 1 1 mit den das Piezo-Element 5 durchkontaktierenden Leiterbahnen verbunden sind. Die Kabel 1 1 verlaufen durch das Gehäuse 2 bis zum Anschluss 3, über den das Piezo-Element 5 an ein Steuergerät angeschlossen werden kann. Die Figur 2 zeigt einen weiteren teilgeöffneten Ultraschall-Wandler 1 , bei dem das Haltemittel des Abdeckmittels 8 ein Bajonett- Verschluss 12 ist. Das kreisförmig ausgebildete Abdeckmittel 8 weist an seinem Umfang zwei vorstehende Zapfen auf, die in Schlitze 13 eingesetzt werden, die zueinander um 180 Grad versetzt an einer ebenfalls kreisförmig ausgebildeten Öffnung des Gehäuses 2 über dem Hohlraum 4 angeordnet sind. An die Schlitze 13 schließt ein dazu quer ausgebildeter Seitenschlitz an, in dem die Zapfen durch Verdrehen des Abdeckmittels 8 eingeschoben werden. Die im Querschlitz aufgenommene, hier gestrichelt dargestellten Zapfen 14 hinterschneiden den Längsschlitz 13 und sichern so das Abdeckmittel 8 in seiner Position über dem Hohlraum 4, so dass es den Hohlraum gegen in das Gehäuse eingegebene Vergussmasse abdichten kann. Die Kabel 1 1 sind mit ausreichend Spiel ausgestattet, so dass sie das Verdrehen des Abdeckmittels 8 nicht behindern. Due to the tracks, the cover means 8 requires no opening for the piezoelectric element 5 outwardly contacting cable. It is self-contained. His the cavity 4 facing away from surface 10 thus has no openings, could penetrate through the potting compound in the cavity 4. On the surface 10 solder pads are provided, are connected via the cable 1 1 with the piezoelectric element 5 through-contacting conductor tracks. The cables 1 1 extend through the housing 2 to the terminal 3, via which the piezo element 5 can be connected to a control unit. FIG. 2 shows a further partially opened ultrasonic transducer 1, in which the holding means of the covering means 8 is a bayonet closure 12. The circularly shaped covering means 8 has on its circumference two projecting pins, which are inserted into slots 13 which are mutually offset by 180 degrees at a likewise circular opening of the housing 2 are arranged above the cavity 4. Adjoining the slots 13 is a lateral slot designed to be transverse, in which the pins are pushed in by twisting the cover means 8. The taken in the transverse slot, shown here in phantom pin 14 undercut the longitudinal slot 13 and thus secure the cover 8 in its position over the cavity 4 so that it can seal the cavity against entered into the housing potting compound. The cables 1 1 are equipped with sufficient clearance, so that they do not hinder the rotation of the cover 8.

Claims

Ansprüche claims
1. Ultraschall-Wandler (1), umfassend ein Gehäuse (2) und ein Piezo- Element (5), wobei das Piezo-Element (5) in einem Hohlraum (4) des Gehäuses eingesetzt ist, wobei im Gehäuse (2) ein Abdeckmittel (8) angeordnet ist, welches den Hohlraum (4) abdeckt und wobei zwischen dem Abdeckmittel (8) und dem Piezo-Element (5) ein Feder-Element (6) angeordnet ist, welche das Piezo-Element (5) mit einer Federkraft beaufschlagt, 1. ultrasonic transducer (1), comprising a housing (2) and a piezoelectric element (5), wherein the piezoelectric element (5) in a cavity (4) of the housing is inserted, wherein in the housing (2) a Covering means (8) is arranged, which covers the cavity (4) and wherein between the covering means (8) and the piezo-element (5) a spring element (6) is arranged, which the piezo-element (5) with a Spring force applied,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) mehrere das Abdeckmittel (8) durchkontaktierende Leiterbahnen aufweist.  the covering means (8) has a plurality of conductor tracks through-contacting the covering means (8).
2. Ultraschall-Wandler nach einem der Anspruch 1 , 2. Ultrasonic transducer according to one of claim 1,
dadurch gekennzeichnet,  characterized,
dass an der dem Piezo-Element (5) abgewandten Seite des Abdeckmittels (8) angeordnete Kontaktstellen der durchkontaktierenden Leiterbahnen als Lötflächen ausgebildet sind.  that arranged on the side facing away from the piezoelectric element (5) side of the cover means (8) contact points of the through-contacting conductor tracks are formed as soldering surfaces.
3. Ultraschall-Wandler nach einem der Ansprüche 1 oder 2, 3. Ultrasonic transducer according to one of claims 1 or 2,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) zumindest ein elektrisches Bauelement umfasst.  the covering means (8) comprises at least one electrical component.
4. Ultraschall-Wandler nach Anspruch 3, 4. Ultrasonic transducer according to claim 3,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) zumindest eine Induktivität zur Impedanzanpassung des Piezo-Elements (5) umfasst.  the covering means (8) comprises at least one inductance for impedance matching of the piezo element (5).
5. Ultraschall-Wandler nach Anspruch 4, 5. Ultrasonic transducer according to claim 4,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) eine Sensorerkennung umfasst. in that the covering means (8) comprises a sensor recognition.
6. Ultraschall-Wandler nach einem der Ansprüche 1 bis 5, 6. Ultrasonic transducer according to one of claims 1 to 5,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) in dem Gehäuse (2) mittels eines Bajonettverschlusses (12) gehalten wird.  in that the covering means (8) is held in the housing (2) by means of a bayonet closure (12).
7. Ultraschall-Wandler nach Anspruch 6, 7. Ultrasonic transducer according to claim 6,
dadurch gekennzeichnet,  characterized,
dass der Bajonettverschluss (12) einen Gewindegang aufweist.  that the bayonet closure (12) has a thread.
8. Ultraschall-Wandler nach einem der Ansprüche 1 bis 7, 8. Ultrasonic transducer according to one of claims 1 to 7,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) mit dem Gehäuse (2) verschweißt ist.  in that the covering means (8) is welded to the housing (2).
9. Baugruppe zum Einsetzen in das Gehäuse eines Ultraschall-Wandlers (1), insbesondere einens Ultraschall-Wandlers gemäß einem der Ansprüche 1 bis 7, 9. assembly for insertion into the housing of an ultrasonic transducer (1), in particular an ultrasonic transducer according to one of claims 1 to 7,
dadurch gekennzeichnet,  characterized,
dass die Baugruppe ein Abdeckmittel (8) zum Verschließen eines zur Aufnahme eines Piezo-Element (5) vorgesehenen Hohlraumes (4) des Ultraschall-Wandlers (1) aufweist, wobei das Abdeckmittel (8) elektrische Leiter umfasst, welche das Abdeckmittel (8) durchkontaktieren und wobei die Baugruppe ein Piezo-Element (5) aufweist, welches mit den elektrischen Leitern verbunden ist und wobei zwischen dem Piezo- Element (5) und dem Abdeckmittel (8) ein Feder-Element (6) angeordnet ist.  in that the assembly has a covering means (8) for closing a cavity (4) of the ultrasonic transducer (1) provided for receiving a piezo element (5), the covering means (8) comprising electrical conductors which cover the covering means (8). through-contacting and wherein the assembly comprises a piezoelectric element (5) which is connected to the electrical conductors and wherein between the piezoelectric element (5) and the covering means (8) a spring element (6) is arranged.
10. Baugruppe nach Anspruch 9 10. Assembly according to claim 9
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) zumindest ein elektrisches Bauelement umfasst. the covering means (8) comprises at least one electrical component.
11. Verfahren zum Zusammenbau eines Ultraschall-Wandlers (1), insbesondere eines Ultraschall-Wandlers gemäß einem der vorangegangenen Ansprüche, wobei in dem Gehäuse (2) des Ultraschall- Wandlers (1) ein Hohlraum (4) angeordnet ist, in den ein Piezo-Element (5) eingesetzt wird und wobei der Hohlraum (4) nach dem Einsetzen mit einem Abdeckmittel (8) verschlossen wird, 11. A method for assembling an ultrasonic transducer (1), in particular an ultrasonic transducer according to one of the preceding claims, wherein in the housing (2) of the ultrasonic transducer (1) a cavity (4) is arranged, in which a piezo Element (5) is used and wherein the cavity (4) is closed after insertion with a covering means (8),
dadurch gekennzeichnet,  characterized,
dass das Piezo-Element (5) mit Leiterbahnen verbunden wird, welche das Abdeckmittel (8) durchkontaktieren.  in that the piezo element (5) is connected to conductor tracks which make contact through the covering means (8).
12. Verfahren nach Anspruch 11 , 12. The method according to claim 11,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8), das Feder-Element (6) und das mit dem Abdeckmittel (8) verbundene Piezo-Element (5) als Baugruppe in das Gehäuse eingesetzt wird.  in that the covering means (8), the spring element (6) and the piezo element (5) connected to the covering means (8) are inserted as an assembly in the housing.
13. Verfahren nach einem der Ansprüche 11 oder 12, 13. The method according to any one of claims 11 or 12,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) in das Gehäuse (2) eingesetzt wird und mittels einer Drehbewegung in eine Position bewegt wird, in der es formschlüssig am Gehäuse gehalten wird.  in that the covering means (8) is inserted into the housing (2) and is moved by means of a rotational movement into a position in which it is held in a form-fitting manner on the housing.
14. Verfahren nach Anspruch 13, 14. The method according to claim 13,
dadurch gekennzeichnet,  characterized,
dass die Drehbewegung entlang eines Gewindegangs erfolgt, so dass das Abdeckmittel (8) und das Gehäuse (2) beim Verdrehen gegeneinander gepresst werden.  that the rotational movement takes place along a thread, so that the cover (8) and the housing (2) are pressed against each other during rotation.
15. Verfahren nach einem der Ansprüche 11 oder 12, 15. The method according to any one of claims 11 or 12,
dadurch gekennzeichnet,  characterized,
dass das Abdeckmittel (8) in das Gehäuse (2) eingesetzt wird und mittels Ultraschallschweißen mit dem Gehäuse (2) verbunden wird.  in that the covering means (8) is inserted into the housing (2) and is connected to the housing (2) by means of ultrasonic welding.
EP13759168.1A 2012-09-05 2013-09-03 Ultrasonic transducer, and method for producing an ultrasonic transducer Withdrawn EP2893303A1 (en)

Applications Claiming Priority (2)

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DE102012108254.5A DE102012108254A1 (en) 2012-09-05 2012-09-05 Ultrasonic transducer and method of making an ultrasonic transducer
PCT/EP2013/068203 WO2014037354A1 (en) 2012-09-05 2013-09-03 Ultrasonic transducer, and method for producing an ultrasonic transducer

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EP (1) EP2893303A1 (en)
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US10569303B2 (en) 2020-02-25
US20150209828A1 (en) 2015-07-30

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