EP2871525A3 - Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths - Google Patents

Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths Download PDF

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Publication number
EP2871525A3
EP2871525A3 EP14192305.2A EP14192305A EP2871525A3 EP 2871525 A3 EP2871525 A3 EP 2871525A3 EP 14192305 A EP14192305 A EP 14192305A EP 2871525 A3 EP2871525 A3 EP 2871525A3
Authority
EP
European Patent Office
Prior art keywords
exposure device
exposure
wavelengths
lithographic
lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14192305.2A
Other languages
German (de)
French (fr)
Other versions
EP2871525A2 (en
Inventor
Matthias Nagel
Johann Schönhuber
Attila Heim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Limata GmbH
Original Assignee
Limata GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Limata GmbH filed Critical Limata GmbH
Priority to EP16161954.9A priority Critical patent/EP3096186A3/en
Publication of EP2871525A2 publication Critical patent/EP2871525A2/en
Publication of EP2871525A3 publication Critical patent/EP2871525A3/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Die Erfindung betrifft eine Lithografiebelichtungseinrichtung zur lithographischen direkten Belichten eines Musters auf einem Substrat (30), das eine lichtempfindliche Schicht im UV Bereich von 350 nm - 450 nm aufweist, sowie ein entsprechendes Verfahren. Die Lithografiebelichtungseinrichtung umfasst eine Belichtungseinrichtung (10) die eine modulierte Lichtquelle mit einer oder mehreren UV-Laserlichtquellen (11) aufweist, zur Erzeugung eines kollimierten UV-Laserlichts (13) im Wellenlängenbereich von 350 nm - 450 nm. Zudem weist die Lithografiebelichtungseinrichtung eine veränderbare Ablenkeinrichtung (12) auf, mit der das kollimierte UV-Laserlicht (13) abgelenkt wir, um das Muster auf das Substrat (30) zu Belichten.

Figure imgaf001
The invention relates to a lithographic exposure apparatus for lithographic direct exposure of a pattern on a substrate (30) having a photosensitive layer in the UV range of 350 nm - 450 nm, and a corresponding method. The lithography exposure device comprises an exposure device (10) which has a modulated light source with one or more UV laser light sources (11) for generating a collimated UV laser light (13) in the wavelength range from 350 nm to 450 nm. In addition, the lithography exposure device has a variable deflection device (12), with which the collimated UV laser light (13) is deflected to expose the pattern to the substrate (30).
Figure imgaf001
EP14192305.2A 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths Withdrawn EP2871525A3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16161954.9A EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013018773 2013-11-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP16161954.9A Division EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Publications (2)

Publication Number Publication Date
EP2871525A2 EP2871525A2 (en) 2015-05-13
EP2871525A3 true EP2871525A3 (en) 2015-09-23

Family

ID=51866079

Family Applications (2)

Application Number Title Priority Date Filing Date
EP14192305.2A Withdrawn EP2871525A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths
EP16161954.9A Withdrawn EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP16161954.9A Withdrawn EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Country Status (1)

Country Link
EP (2) EP2871525A3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3197249B1 (en) * 2016-01-20 2022-09-21 Limata GmbH Direct exposure device for direct exposure of soldering stop layers in two-dimensional environment with short-term tempering
DE102017103624A1 (en) * 2017-02-22 2018-08-23 Manz Ag exposure system
CN113597132B (en) * 2021-09-06 2022-08-02 深圳市先地图像科技有限公司 Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020141024A1 (en) * 2001-01-04 2002-10-03 Wolfgang Retschke Direct pattern writer
US20050002005A1 (en) * 2003-07-03 2005-01-06 Fuji Photo Film Co., Ltd. Image forming apparatus
DE102006006797A1 (en) * 2005-03-24 2006-09-28 Hitachi Via Mechanics, Ltd., Ebina Apparatus and method for structure exposure
US20090040490A1 (en) * 2006-07-12 2009-02-12 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
DE102008050547A1 (en) * 2007-10-26 2009-04-30 Adtec Engineering Co., Ltd. Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body
US20100195073A1 (en) * 2007-07-16 2010-08-05 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Scanned writing of an exposure pattern on a substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5080009B2 (en) * 2005-03-22 2012-11-21 日立ビアメカニクス株式会社 Exposure method
EP1993781A4 (en) * 2006-02-03 2016-11-09 Semiconductor Energy Lab Co Ltd Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020141024A1 (en) * 2001-01-04 2002-10-03 Wolfgang Retschke Direct pattern writer
US20050002005A1 (en) * 2003-07-03 2005-01-06 Fuji Photo Film Co., Ltd. Image forming apparatus
DE102006006797A1 (en) * 2005-03-24 2006-09-28 Hitachi Via Mechanics, Ltd., Ebina Apparatus and method for structure exposure
US20090040490A1 (en) * 2006-07-12 2009-02-12 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
US20100195073A1 (en) * 2007-07-16 2010-08-05 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Scanned writing of an exposure pattern on a substrate
DE102008050547A1 (en) * 2007-10-26 2009-04-30 Adtec Engineering Co., Ltd. Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body

Also Published As

Publication number Publication date
EP3096186A3 (en) 2017-04-12
EP3096186A2 (en) 2016-11-23
EP2871525A2 (en) 2015-05-13

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