EP2871525A3 - Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths - Google Patents

Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths Download PDF

Info

Publication number
EP2871525A3
EP2871525A3 EP14192305.2A EP14192305A EP2871525A3 EP 2871525 A3 EP2871525 A3 EP 2871525A3 EP 14192305 A EP14192305 A EP 14192305A EP 2871525 A3 EP2871525 A3 EP 2871525A3
Authority
EP
European Patent Office
Prior art keywords
exposure device
exposure
wavelengths
lithographic
lithography
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14192305.2A
Other languages
German (de)
French (fr)
Other versions
EP2871525A2 (en
Inventor
Matthias Nagel
Johann Schönhuber
Attila Heim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Limata GmbH
Original Assignee
Limata GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Limata GmbH filed Critical Limata GmbH
Priority to EP16161954.9A priority Critical patent/EP3096186A3/en
Publication of EP2871525A2 publication Critical patent/EP2871525A2/en
Publication of EP2871525A3 publication Critical patent/EP2871525A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Die Erfindung betrifft eine Lithografiebelichtungseinrichtung zur lithographischen direkten Belichten eines Musters auf einem Substrat (30), das eine lichtempfindliche Schicht im UV Bereich von 350 nm - 450 nm aufweist, sowie ein entsprechendes Verfahren. Die Lithografiebelichtungseinrichtung umfasst eine Belichtungseinrichtung (10) die eine modulierte Lichtquelle mit einer oder mehreren UV-Laserlichtquellen (11) aufweist, zur Erzeugung eines kollimierten UV-Laserlichts (13) im Wellenlängenbereich von 350 nm - 450 nm. Zudem weist die Lithografiebelichtungseinrichtung eine veränderbare Ablenkeinrichtung (12) auf, mit der das kollimierte UV-Laserlicht (13) abgelenkt wir, um das Muster auf das Substrat (30) zu Belichten.

Figure imgaf001
The invention relates to a lithographic exposure apparatus for lithographic direct exposure of a pattern on a substrate (30) having a photosensitive layer in the UV range of 350 nm - 450 nm, and a corresponding method. The lithography exposure device comprises an exposure device (10) which has a modulated light source with one or more UV laser light sources (11) for generating a collimated UV laser light (13) in the wavelength range from 350 nm to 450 nm. In addition, the lithography exposure device has a variable deflection device (12), with which the collimated UV laser light (13) is deflected to expose the pattern to the substrate (30).
Figure imgaf001

EP14192305.2A 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths Withdrawn EP2871525A3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP16161954.9A EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013018773 2013-11-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP16161954.9A Division EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Publications (2)

Publication Number Publication Date
EP2871525A2 EP2871525A2 (en) 2015-05-13
EP2871525A3 true EP2871525A3 (en) 2015-09-23

Family

ID=51866079

Family Applications (2)

Application Number Title Priority Date Filing Date
EP16161954.9A Withdrawn EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths
EP14192305.2A Withdrawn EP2871525A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP16161954.9A Withdrawn EP3096186A3 (en) 2013-11-08 2014-11-07 Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths

Country Status (1)

Country Link
EP (2) EP3096186A3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3197249B1 (en) * 2016-01-20 2022-09-21 Limata GmbH Direct exposure device for direct exposure of soldering stop layers in two-dimensional environment with short-term tempering
DE102017103624A1 (en) * 2017-02-22 2018-08-23 Manz Ag exposure system
CN113597132B (en) * 2021-09-06 2022-08-02 深圳市先地图像科技有限公司 Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020141024A1 (en) * 2001-01-04 2002-10-03 Wolfgang Retschke Direct pattern writer
US20050002005A1 (en) * 2003-07-03 2005-01-06 Fuji Photo Film Co., Ltd. Image forming apparatus
DE102006006797A1 (en) * 2005-03-24 2006-09-28 Hitachi Via Mechanics, Ltd., Ebina Apparatus and method for structure exposure
US20090040490A1 (en) * 2006-07-12 2009-02-12 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
DE102008050547A1 (en) * 2007-10-26 2009-04-30 Adtec Engineering Co., Ltd. Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body
US20100195073A1 (en) * 2007-07-16 2010-08-05 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Scanned writing of an exposure pattern on a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9800665D0 (en) * 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
JP5080009B2 (en) * 2005-03-22 2012-11-21 日立ビアメカニクス株式会社 Exposure method
EP1993781A4 (en) * 2006-02-03 2016-11-09 Semiconductor Energy Lab Co Ltd Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020141024A1 (en) * 2001-01-04 2002-10-03 Wolfgang Retschke Direct pattern writer
US20050002005A1 (en) * 2003-07-03 2005-01-06 Fuji Photo Film Co., Ltd. Image forming apparatus
DE102006006797A1 (en) * 2005-03-24 2006-09-28 Hitachi Via Mechanics, Ltd., Ebina Apparatus and method for structure exposure
US20090040490A1 (en) * 2006-07-12 2009-02-12 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
US20100195073A1 (en) * 2007-07-16 2010-08-05 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Scanned writing of an exposure pattern on a substrate
DE102008050547A1 (en) * 2007-10-26 2009-04-30 Adtec Engineering Co., Ltd. Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body

Also Published As

Publication number Publication date
EP3096186A3 (en) 2017-04-12
EP2871525A2 (en) 2015-05-13
EP3096186A2 (en) 2016-11-23

Similar Documents

Publication Publication Date Title
DE102006032810A8 (en) Illumination optics for a microlithography projection exposure apparatus, illumination system with such an illumination optics, microlithography projection exposure apparatus with such an illumination system, microlithographic production method for components and component produced by this method
EP2871525A3 (en) Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths
ATE532105T1 (en) LIGHTING METHOD
EP2886356A3 (en) Method for producing a value document and a security element, the value document and security element obtainable therefrom, and a device for carrying out the method
EP2657077A3 (en) Method and headlamp assembly for compensation of alignment errors a headlamp
BR112013001262A2 (en) method for producing flexographic printing plates, and apparatus for in-line production of flexographic printing plates by digital imaging
EP1586949A3 (en) Exposure apparatus and exposure method using EUV light
EP2770389A3 (en) Method for performing a configuration of a control instrument test system
DE112016002201T5 (en) OPTICALLY SHAPED OBJECT, PRODUCT AND METHOD FOR MANUFACTURING A PRODUCT
ATE492003T1 (en) SYSTEM AND METHOD FOR OPTICAL IMAGING OF OBJECTS ON A DETECTION DEVICE USING A PINFORCED APERTURE
BR112018074368A2 (en) method and apparatus for converting color data into musical notes
TW200715372A (en) Exposure method
WO2010075312A3 (en) Method and apparatus for creating a pattern recognizer
EP3593756A3 (en) Method for producing a prosthesis or partial prosthesis and prosthesis
EP3831415A3 (en) Method and device for disinfecting an area
DE112018001943T5 (en) PSEUDO SPECKLE PATTERN PRODUCTION DEVICE, PSEUDO SPECKLE PATTERN GENERATION METHOD, OBSERVER DEVICE AND OBSERVATION METHOD
EP2988154A3 (en) Method for producing optical element and optical element
EP2056067A3 (en) Arrangement to depict a line-shaped marking
EP3944022A3 (en) Method and device for characterizing a wafer patterned using at least one lithography step
AT517639A5 (en) Apparatus and method for bonding
DE102016013260A1 (en) Method and device for generating a reference image in the characterization of a mask for microlithography
DE112022003092A5 (en) OPTOELECTRONIC COMPONENT, LIGHTING UNIT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
DE102017129096B8 (en) Method for the spectral splitting of a light beam and fluorescent light microscope for carrying out such a method
AT518377A3 (en) Method and device for the treatment of flat glass units on a glass processing plant
AT517776A5 (en) A security document comprising a film with interference effects, a method for determining the authenticity of such a document and a device for carrying out such a method

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20141107

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/20 20060101AFI20150414BHEP

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/20 20060101AFI20150818BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160324