EP2871525A3 - Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths - Google Patents
Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths Download PDFInfo
- Publication number
- EP2871525A3 EP2871525A3 EP14192305.2A EP14192305A EP2871525A3 EP 2871525 A3 EP2871525 A3 EP 2871525A3 EP 14192305 A EP14192305 A EP 14192305A EP 2871525 A3 EP2871525 A3 EP 2871525A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- exposure device
- exposure
- wavelengths
- lithographic
- lithography
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Die Erfindung betrifft eine Lithografiebelichtungseinrichtung zur lithographischen direkten Belichten eines Musters auf einem Substrat (30), das eine lichtempfindliche Schicht im UV Bereich von 350 nm - 450 nm aufweist, sowie ein entsprechendes Verfahren. Die Lithografiebelichtungseinrichtung umfasst eine Belichtungseinrichtung (10) die eine modulierte Lichtquelle mit einer oder mehreren UV-Laserlichtquellen (11) aufweist, zur Erzeugung eines kollimierten UV-Laserlichts (13) im Wellenlängenbereich von 350 nm - 450 nm. Zudem weist die Lithografiebelichtungseinrichtung eine veränderbare Ablenkeinrichtung (12) auf, mit der das kollimierte UV-Laserlicht (13) abgelenkt wir, um das Muster auf das Substrat (30) zu Belichten. The invention relates to a lithographic exposure apparatus for lithographic direct exposure of a pattern on a substrate (30) having a photosensitive layer in the UV range of 350 nm - 450 nm, and a corresponding method. The lithography exposure device comprises an exposure device (10) which has a modulated light source with one or more UV laser light sources (11) for generating a collimated UV laser light (13) in the wavelength range from 350 nm to 450 nm. In addition, the lithography exposure device has a variable deflection device (12), with which the collimated UV laser light (13) is deflected to expose the pattern to the substrate (30).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16161954.9A EP3096186A3 (en) | 2013-11-08 | 2014-11-07 | Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013018773 | 2013-11-08 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16161954.9A Division EP3096186A3 (en) | 2013-11-08 | 2014-11-07 | Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2871525A2 EP2871525A2 (en) | 2015-05-13 |
EP2871525A3 true EP2871525A3 (en) | 2015-09-23 |
Family
ID=51866079
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16161954.9A Withdrawn EP3096186A3 (en) | 2013-11-08 | 2014-11-07 | Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths |
EP14192305.2A Withdrawn EP2871525A3 (en) | 2013-11-08 | 2014-11-07 | Lithography exposure device for lithographic exposure with single or multi-level laser project units with one or more wavelengths |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16161954.9A Withdrawn EP3096186A3 (en) | 2013-11-08 | 2014-11-07 | Lithography exposure device for lithographic exposure with single or multi-level laser projection units with one or more wavelengths |
Country Status (1)
Country | Link |
---|---|
EP (2) | EP3096186A3 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3197249B1 (en) * | 2016-01-20 | 2022-09-21 | Limata GmbH | Direct exposure device for direct exposure of soldering stop layers in two-dimensional environment with short-term tempering |
DE102017103624A1 (en) * | 2017-02-22 | 2018-08-23 | Manz Ag | exposure system |
CN113597132B (en) * | 2021-09-06 | 2022-08-02 | 深圳市先地图像科技有限公司 | Device and method for controlling laser power according to photosensitive ink of solder mask layer of PCB (printed circuit board) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020141024A1 (en) * | 2001-01-04 | 2002-10-03 | Wolfgang Retschke | Direct pattern writer |
US20050002005A1 (en) * | 2003-07-03 | 2005-01-06 | Fuji Photo Film Co., Ltd. | Image forming apparatus |
DE102006006797A1 (en) * | 2005-03-24 | 2006-09-28 | Hitachi Via Mechanics, Ltd., Ebina | Apparatus and method for structure exposure |
US20090040490A1 (en) * | 2006-07-12 | 2009-02-12 | Nikon Corporation | Illuminating optical apparatus, exposure apparatus and device manufacturing method |
DE102008050547A1 (en) * | 2007-10-26 | 2009-04-30 | Adtec Engineering Co., Ltd. | Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body |
US20100195073A1 (en) * | 2007-07-16 | 2010-08-05 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Scanned writing of an exposure pattern on a substrate |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE9800665D0 (en) * | 1998-03-02 | 1998-03-02 | Micronic Laser Systems Ab | Improved method for projection printing using a micromirror SLM |
JP5080009B2 (en) * | 2005-03-22 | 2012-11-21 | 日立ビアメカニクス株式会社 | Exposure method |
EP1993781A4 (en) * | 2006-02-03 | 2016-11-09 | Semiconductor Energy Lab Co Ltd | Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method |
-
2014
- 2014-11-07 EP EP16161954.9A patent/EP3096186A3/en not_active Withdrawn
- 2014-11-07 EP EP14192305.2A patent/EP2871525A3/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020141024A1 (en) * | 2001-01-04 | 2002-10-03 | Wolfgang Retschke | Direct pattern writer |
US20050002005A1 (en) * | 2003-07-03 | 2005-01-06 | Fuji Photo Film Co., Ltd. | Image forming apparatus |
DE102006006797A1 (en) * | 2005-03-24 | 2006-09-28 | Hitachi Via Mechanics, Ltd., Ebina | Apparatus and method for structure exposure |
US20090040490A1 (en) * | 2006-07-12 | 2009-02-12 | Nikon Corporation | Illuminating optical apparatus, exposure apparatus and device manufacturing method |
US20100195073A1 (en) * | 2007-07-16 | 2010-08-05 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Scanned writing of an exposure pattern on a substrate |
DE102008050547A1 (en) * | 2007-10-26 | 2009-04-30 | Adtec Engineering Co., Ltd. | Direct image exposure device, has exposure table to which exposure object is assigned, where specific section of exposure object is defined by moving device and is exposed by exposed light by illuminating body |
Also Published As
Publication number | Publication date |
---|---|
EP3096186A3 (en) | 2017-04-12 |
EP2871525A2 (en) | 2015-05-13 |
EP3096186A2 (en) | 2016-11-23 |
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