EP2867575A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP2867575A1
EP2867575A1 EP13729030.0A EP13729030A EP2867575A1 EP 2867575 A1 EP2867575 A1 EP 2867575A1 EP 13729030 A EP13729030 A EP 13729030A EP 2867575 A1 EP2867575 A1 EP 2867575A1
Authority
EP
European Patent Office
Prior art keywords
illuminating device
lens
circuit board
heat sink
bottom wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13729030.0A
Other languages
German (de)
English (en)
Other versions
EP2867575B1 (fr
Inventor
Guoan HE
Xu Zhao
MingTao WANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2867575A1 publication Critical patent/EP2867575A1/fr
Application granted granted Critical
Publication of EP2867575B1 publication Critical patent/EP2867575B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an illuminating device.
  • a LED retrofit lamp gener ⁇ ally has a heat sink, a circuit board arranged in the heat sink and a lens arranged at the light emergent opening of the heat sink, wherein a LED chip is arranged on the circuit board, and the lens is capable of processing light rays of the LED chip, to fulfill different illuminating effects.
  • the present invention provides an illuminating device, which has a few components, low cost and is easy to be assembled. Further ⁇ more, after a long running time of the illuminating device according to the present invention, each component of the il ⁇ luminating device still has relative high connection reli ⁇ ability.
  • the illuminating device comprises a heat sink having a bottom wall and a circumferential wall extending from the bottom wall, defining an accommodating cavity; a lens arranged at an opening of the accommodating cavity; and a circuit board having a light source and being arranged on the bottom wall, wherein the lens includes at least one snap-fit structure and at least one pressing portion, and the snap-fit structure snaps into the circumferential wall to fix the lens to the heat sink and the lens presses the circuit board against the bottom wall through the pressing portion.
  • the lens can be directly snapped at the heat sink through the snap-fit structure, without additional mechanical structures, such as bolt and hold shield etc.
  • the lens comprises a baseplate and at least one micro-lens structure formed on the baseplate.
  • the micro-lens structure is more suitable for matching with a light source.
  • a micro-lens structure is individually equipped for each light source, which is advantageous for individually adjusting light rays of a light source.
  • the present inven ⁇ tion it is provided that there is no need to additionally arrange an individual component, when configuring the micro- lens structure as the pressing portion. It reduces to a large extent the structural complexity of the lens and decreases the production cost.
  • the lens further includes at least one positioning column formed on the baseplate, and the positioning column is configured as the pressing portion. It is advantageous that at least one through hole for insertion of the positioning column is formed on the circuit board.
  • the positioning column can help with accurate alignment of the lens and a light source on the circuit board. It has practi ⁇ cal significance particularly for the situation that the il ⁇ luminating device has a plurality of light sources and a plu ⁇ rality of micro-lens structures. Furthermore, instead of mi- cro-lens structure, the positioning column is used as the pressing portion, which reduces to a large extent design difficulty of the micro-lens structure.
  • the positioning column includes a first section capable of being inserted into the through hole and a second section, wherein a connecting part of the first section and the second section forms a stop step, which presses against the circuit board. In an assembled state of the illuminating device, said stop step reliably presses the circuit board against the heat sink.
  • the illuminating device further comprises a bi ⁇ asing device arranged between the lens and the circuit board, which is used to provide a bias force between the lens and the circuit board.
  • the spring After mounting the lens on the heat sink, the spring is extruded and is in a forced state.
  • the lens or the heat sink After a long running time of the illuminating device, the lens or the heat sink might be deformed because of aging. However, the lens is supported on the heat sink in the form of a prestress. Thus, even if the components are deformed, the lens would also be reliably fixed on the heat sink without loosening.
  • the biasing device includes at least one spring and at least one insulation washer, wherein one end of the spring bears against the lens, and the other end bears against the circuit board through the insulation washer.
  • the insulation washer is insulated from the spring and the circuit board, which avoids short circuit of the cir ⁇ cuit board.
  • the spring is nested onto the press ⁇ ing portion.
  • the pressing portion is capable of being used as guiding element of the spring, so as to avoid undesired dis- placement of the spring.
  • the spring is a spiral spring.
  • the spring can also be a spring of another type, for example plate spring.
  • the snap-fit structure is config ⁇ ured as elastic hook.
  • a projection is formed on the circumferential wall, and the elastic hook engages with the projection.
  • the snap-fit structure of such type has a simple structure and easy manufacture. During practical as ⁇ sembly process, it only needs to insert the lens into the opening of the accommodating cavity, while the elastic hook is easy to engage with the projection, wherein the operation is simple and the connection is very tight.
  • the heat sink further includes at least one fin, which radially extends on outer side of the circumferential wall. The fin significantly increases contact area of the heat sink with air of the environment, which im ⁇ proves radiating property of the heat sink.
  • an embedding groove is formed in the bottom wall, and the circuit board is arranged in the embed ⁇ ding groove in a form fitting manner.
  • the circuit board is therefore firmly held in the embedding groove, which prevents undesired movement of the circuit board. If a thermal interface material is arranged between the cir ⁇ cuit board and the bottom surface of the embedding groove, it would be very advantageous for the cooling of the circuit board .
  • the circuit board is a ceramic circuit board, which has good thermal conductivity.
  • the circuit board can also be a circuit board of another type, metal core circuit board for instance.
  • the light source is a LED light source, which has advantages of long service lift, high luminous ef- ficiency and environmental protection.
  • Fig. 1 composed schematic diagram of a first example of the illuminating device according to the present invention
  • FIG. 2 composed schematic diagram of a second example of the illuminating device according to the present invention
  • Fig. 3 sectional view of the illuminating device in an assembled state according to the first example as shown in Fig. 1.
  • Fig. 1 shows a composed schematic diagram of the first exam- pie of the illuminating device 100 according to the present invention.
  • the illuminating device 100 according to the present invention comprises: a heat sink 1 having a bottom wall 111 and a circumferential wall 112 ex ⁇ tending from the bottom wall 111, defining an accommodating cavity 11; a lens 2 arranged at an opening of the accommodat ⁇ ing cavity 11 in the assembled state of the illuminating de ⁇ vice 100 (see Fig. 3); and a circuit board 3 having a light source, wherein the circuit board 3 is arranged on the bottom wall 111 in the assembled state of the illuminating device 100.
  • the circuit board 3 is a ceramic circuit board, and it can also be a cir ⁇ cuit board of another type, such as metal core circuit board etc.
  • the light source arranged on the circuit board 3 is a LED light source 7.
  • the heat sink 1 further includes at least one fin 12, which radially extends on outer side of the circumferential wall 112.
  • an embedding groove 114 is formed in the bottom wall 111, and the circuit board 3 is arranged in the embedding groove 114 in a form fitting manner.
  • a thermal interface material 6 is arranged between the cir ⁇ cuit board 3 and the bottom surface of the embedding groove 114 (see Fig. 3) .
  • the lens 2 includes a baseplate 21 and a micro-lens structure 22 formed on the baseplate 21.
  • the lens 2 includes a baseplate 21 and a micro-lens structure 22 formed on the baseplate 21.
  • only one LED light source 7 is arranged on the circuit board 3.
  • only one micro-lens structure 22 is formed on the baseplate 21, wherein the micro-lens structure 22 is configured as pressing portion, which presses against the circuit board 3 by means of its free end.
  • the lens 2 further in ⁇ cludes at least one elastic hook 24 configured as snap-fit structure.
  • the illuminating device 100 further comprises a biasing device between the lens 2 and the circuit board 3, which is used to provide a bias force between the lens 2 and the circuit board 3.
  • the biasing structure includes a spring 4 configured as spiral spring and an insulation washer 5.
  • Fig. 2 shows a composed schematic diagram of the second exam ⁇ ple of the illuminating device 100 according to the present invention.
  • the heat sink 1 of the illuminating device 100 in the second example has the same structure as that of the il ⁇ luminating device 100 in the first example, thus, it is not described here.
  • the differences between the illuminating de- vices of the two examples lie in the amount of the LED light sources 7 on the circuit board 3 and the structure of the lens 2.
  • a plurality of LED light sources 7 are arranged on the circuit board 3; in the present example, 4 LED light sources 7 are arranged.
  • the struc ⁇ ture of the lens 2 is correspondingly adjusted.
  • 4 micro-lens structures 22 are formed on the baseplate 21 of the lens 2, viz. each LED light source 7 is equipped with one micro-lens structure 22.
  • a plurality of positioning columns 23 are formed on the baseplate 21 of the lens 2, which are used as pressing portion.
  • the po ⁇ sitioning column 23 includes a first section 231 capable of being inserted into the through hole 31 and a second section 232, wherein a connecting part of the first section 231 and the second section 232 forms a stop step 233, which presses against the circuit board 3.
  • the illuminating device 100 also has a biasing device arranged between the lens 2 and the circuit board 3.
  • the biasing device includes tow springs 4, which are nested onto the positioning columns 23, instead of being nested onto the micro-lens structures 22.
  • the bias ⁇ ing device in the second example fails to include an insula ⁇ tion washer 5.
  • an insulation washer 5 can also be additionally arranged between the spring 4 and the circuit board 3.
  • Fig. 3 shows a sectional view of the illuminating device 100 in an assembled state in accordance with the first example as shown in Fig. 1.
  • the elastic hook 24 of the lens 2 engages with the projection 113 formed on the circumferential wall 112 of the accommodating cavity 11 of the heat sink 1, and the micro-lens structure 22 of the lens 2 presses the circuit board 3 against the bottom surface of the embedding groove 114.
  • the spring 4 nested onto the micro-lens structure 22 is compressed between the base ⁇ plate 21 and the insulation washer 5 arranged on the circuit board 3, so that the spring 4 is in a forced state.
  • the lens 2 or the heat sink 1 might be deformed because of aging. How ⁇ ever, the lens 2 is supported on the heat sink 1 in the form of a prestress. Thus, even if the components are deformed, the lens 2 would also be reliably fixed on the heat sink without loosening.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La présente invention se rapporte à un dispositif d'éclairage (100) comprenant : un dissipateur de chaleur (1) possédant une paroi inférieure (111) et une paroi circonférentielle (112) s'étendant depuis la paroi inférieure (111), délimitant une cavité d'accueil (11) ; une lentille (2) agencée dans une ouverture de la cavité d'accueil (11) ; et une carte de circuit imprimé (3) possédant une source de lumière et étant agencée sur la paroi inférieure (111). La lentille (2) comprend au moins une structure d'encliquetage et au moins une partie de pressage, et la lentille (2) s'encliquète dans la paroi circonférentielle (112) afin de fixer la lentille (2) au dissipateur de chaleur (1) et la lentille (2) presse la carte de circuit imprimé (3) contre la paroi inférieure (111) par le biais de la partie de pressage.
EP13729030.0A 2012-06-27 2013-06-14 Dispositif d'éclairage Active EP2867575B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210217834.9A CN103511867B (zh) 2012-06-27 2012-06-27 照明装置
PCT/EP2013/062443 WO2014001110A1 (fr) 2012-06-27 2013-06-14 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP2867575A1 true EP2867575A1 (fr) 2015-05-06
EP2867575B1 EP2867575B1 (fr) 2016-11-02

Family

ID=48626458

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13729030.0A Active EP2867575B1 (fr) 2012-06-27 2013-06-14 Dispositif d'éclairage

Country Status (3)

Country Link
EP (1) EP2867575B1 (fr)
CN (1) CN103511867B (fr)
WO (1) WO2014001110A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2522419B (en) * 2014-01-22 2016-05-11 Collingwood Lighting Ltd Lighting unit
GB2523844B (en) * 2014-03-08 2016-04-27 Lighttherm Ltd LED lamp with embedded circuitry
CN103883908B (zh) * 2014-03-14 2016-05-25 浙江生辉照明有限公司 定向照明led灯
DE102016203400A1 (de) * 2016-03-02 2017-09-07 Ledvance Gmbh Lichtmodul
FR3056699B1 (fr) 2016-09-26 2019-06-28 Valeo Vision Module lumineux et dispositif lumineux pour vehicule auto-mobile comportant un tel module lumineux
IT202000018280A1 (it) * 2020-07-28 2022-01-28 Elica Spa Dispositivo di illuminazione in particolare per cappe di aspirazione
IT202000018289A1 (it) * 2020-07-28 2022-01-28 Elica Spa Dispositivo di illuminazione in particolare per cappe di aspirazione

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2147244B1 (fr) * 2007-05-07 2015-12-02 Koninklijke Philips N.V. Luminaires à base de del pour l'éclairage de surface avec dissipation de chaleur améliorée et faculté de fabrication
JP4447644B2 (ja) * 2008-07-15 2010-04-07 シーシーエス株式会社 光照射装置
FR2962783B1 (fr) * 2010-07-15 2014-11-14 Cooper Technologies Co Dispositif d'eclairage a dissipation thermique
CN101968599B (zh) * 2010-10-09 2012-02-22 厦门华联电子有限公司 红外监控的辅助照明装置
CN202040604U (zh) * 2011-03-23 2011-11-16 东贝光电科技股份有限公司 照明灯
CN202177011U (zh) * 2011-08-10 2012-03-28 许水金 一种汽车激光迎宾灯

Also Published As

Publication number Publication date
WO2014001110A1 (fr) 2014-01-03
EP2867575B1 (fr) 2016-11-02
CN103511867B (zh) 2018-08-28
CN103511867A (zh) 2014-01-15

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