EP2844783A2 - Composites including silicon-oxy-carbide layers and methods of making the same - Google Patents
Composites including silicon-oxy-carbide layers and methods of making the sameInfo
- Publication number
- EP2844783A2 EP2844783A2 EP13783121.0A EP13783121A EP2844783A2 EP 2844783 A2 EP2844783 A2 EP 2844783A2 EP 13783121 A EP13783121 A EP 13783121A EP 2844783 A2 EP2844783 A2 EP 2844783A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- composite
- layer
- soc
- polymeric substrate
- obl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 239000011159 matrix material Substances 0.000 claims abstract description 65
- 230000008021 deposition Effects 0.000 claims abstract description 57
- 238000000576 coating method Methods 0.000 claims abstract description 47
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000001301 oxygen Substances 0.000 claims abstract description 37
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 37
- 239000011248 coating agent Substances 0.000 claims abstract description 32
- 230000004888 barrier function Effects 0.000 claims abstract description 30
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims description 78
- 229920001721 polyimide Polymers 0.000 claims description 24
- 239000004642 Polyimide Substances 0.000 claims description 23
- 238000009792 diffusion process Methods 0.000 claims description 19
- 239000012707 chemical precursor Substances 0.000 claims description 18
- 230000004580 weight loss Effects 0.000 claims description 15
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 11
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 150000001282 organosilanes Chemical class 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000004643 cyanate ester Substances 0.000 claims description 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- 230000000052 comparative effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 149
- 239000000463 material Substances 0.000 description 18
- 208000016261 weight loss Diseases 0.000 description 11
- 230000032683 aging Effects 0.000 description 10
- 238000006731 degradation reaction Methods 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 8
- 230000001737 promoting effect Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- -1 siloxanes Chemical class 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010525 oxidative degradation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000009734 composite fabrication Methods 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/453—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Definitions
- the presently disclosed subject matter relates to high-temperature polymer composites including at least one silicon-oxy-carbide film deposited by atmospheric plasma deposition.
- Figure 2 shows a depiction of such increased surface degredation.
- thermo-oxidative stability Intuitively it would seem that protecting a material's surface from oxygen diffusion would improve its thermo-oxidative stability and, indeed, some studies verify this supposition.
- aluminum foil was used to coat Celion 6000/PMR-15 composites and did find that a thin coating did provide significant protection from oxidation.
- the use of an expanded graphite barrier reduced the rate of oxidative degradation of PMR-15 resin such that the thermo-oxidative stability increased by up to 25%.
- high-temperature barrier coatings e.g., oxygen-barrier
- adhesion-promoting coatings e.g., interlay ers
- One or more aspects of the present disclosure may address one or more of the
- thermo-oxidative coating comprises a silicon-oxy-carbide (SOC) layer generally having a thickness from about 50 nm to about 12 microns and covering at least one surface of the polymeric substrate.
- SOC silicon-oxy-carbide
- the SOC layer is formed by atmospheric plasma deposition.
- the SOC layer can be tailored for specific polymeric matrix substrates and/or specific applications for the composite.
- Other technologies to create barrier layers e.g., oxygen- barrier layers
- a composite comprising: a polymeric substrate and a thermo-oxidative barrier coating comprising a silicon-oxy-carbide (SOC) layer having a thickness from about 100 to about 900 nm and covering at least one surface of the polymeric substrate.
- SOC silicon-oxy-carbide
- the SOC layer includes an oxygen content ranging from about 3% to about 50%.
- the SOC layer reduces oxygen diffusion into the polymeric substrate.
- the composite comprises a thermo-oxidative stability (TOS) of less than about 5.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.
- the composite comprises a thermo-oxidative stability (TOS) of less than about 2.0% weight loss relative to a composite comprising the same polymeric substrate and being devoid of the SOC layer.
- the polymeric substrate comprises a polymeric matrix selected from a polyimide, an epoxy, bismaleimide, and a cyanate ester.
- the adhesion-promoting layer can be used to bind a known (or prospective) oxygen-barrier layer (OBL) onto the composite. That is, the OBL can be deposited in a manner substantially (or fully) overlying the adhesion-promoting layer such that the adhesion-promoting layer is sandwiched between the polymeric matrix substrate and the OBL.
- the adhesion-promoting layer functions at least in one respect as a tailorable tie-layer for the polymeric matrix substrate and the OBL.
- the adhesion-promoting layer increases the degree to which the OBL is attached to the composite.
- the adhesion-promoting layer according to aspects of the present disclosure can increase the bond strength of the OBL to the polymeric substrate relative to the bond strength of the same OBL directly deposited onto the same polymeric substrate.
- the SOC layer includes a carbon content ranging from about 3% to about 30%; a silicon content ranging from about 10% to about 50%; and an oxygen content ranging from about 10% to about 50%.
- the OBL reduces oxygen diffusion into the polymeric substrate, said OBL comprising metallic materials, ceramic materials, or combinations thereof.
- the adhesion-promoting layer increases the bond strength of the OBL to the polymeric substrate relative to the bond strength of the same OBL directly deposited onto the same polymeric substrate.
- Preferably composite comprises a thermo-oxidative stability (TOS) of less than about 2.0% weight loss.
- TOS thermo-oxidative stability
- the depositing step comprises the deposition of the SOC layer via atmospheric plasma deposition (APDP).
- APDP atmospheric plasma deposition
- the APDP comprises the use of a chemical precursor of the SOC layer comprising a silane, organosilane, or combination thereof.
- the APDP comprises the use of a chemical precursor of the SOC layer comprising tetramethylcyclotetrasiloxane, octamethylcyclotetrasiloxane, or a combination thereof.
- Figure 2 shows a schematic of surface degradation due to thermo-oxidative aging.
- FIG 5 illustrates a general flow diagram for a method of forming a composite aspect in which an SOC layer is provided as an oxygen-barrier layer (OBL);
- OLB oxygen-barrier layer
- the SOC coatings can include a silicon content comprising at least any of the following: 3, 5, 10, 20, 30, 40, 50, and 60%; and at most about any of the following: 70, 60, 50, 40, 30, 25%, 20%, ands 10% (e.g., 5-70%, 20-70%, 10-40%, 50-70%, 3-50%, 3-25%, 3- 10%, etc.).
- the SOC coatings can include an oxygen content comprising at least any of the following: 3, 5, 10, 20, 30, 40, 50, and 60%; and at most about any of the following: 70, 60, 50, 40, 30, 25%, 20%, ands 10% (e.g., 5-70%, 20-70%, 10-40%, 50-70%, 3-50%, 3-25%, 3- 10%,etc).
- the SOC coating or layers according to aspects of the present disclosure are created via atmospheric plasma deposition.
- a variety of chemical precursors can be used in atmospheric plasma deposition for creating SOC layers according to aspects of the present disclosure.
- siloxanes and organosilanes can be employed in certain aspects.
- a few exemplary chemical precursors can include
- the polymeric matrix substrate comprises a polyimide, preferably a polyimide recognized as being suitable for high-performance and/or high-temperature applications.
- polyimides suitable for composite fabrication according to certain aspects of the present disclosure include those disclosed in U.S. Patent Numbers 3,745,149 (Serafini et al), 5,338,827 (Serafini et al), 5, 171,822 (Pater), 5,081, 198 (Pater et al), 7,041,778 (Curliss et al), 6,958, 192 (Hergenrother et al), 5,412,066
- thermo-oxidative stability test can include placing samples (e.g., SOC-coated polymeric matrix substrates) in a chamber through which a constant flow of air travels at a rate sufficient to refresh the chamber volume at a rate of 5 times/hour.
- the test temperature, pressure, and time can be selected to result in a measurable degradation of an unprotected (uncoated) polymeric matrix substrate for direct comparison.
- the oxygen-barrier capability of the SOC coating can be determined by the weight loss of protected composite samples relative to unprotected composite samples.
- the adhesion-promoting layer increases the degree to which the OBL is attached to the composite.
- the adhesion-promoting layer according to aspects of the present disclosure can increase the bond strength of the OBL to the polymeric substrate relative to the bond strength of the same OBL directly deposited onto the same polymeric substrate.
- Figure 4 illustrates a composite according to one aspect of the present disclosure comprising an adhesion-promoting layer 20 comprising a SOC layer deposited onto at least one surface of a polymeric matrix substrate 10.
- the adhesion-promoting layer 20 is sandwiched between at least one surface of a polymeric matrix substrate 10 and an OBL 30.
- the present disclosure provides methods of fabricating composites according to aspects of the present disclosure.
- methods of forming composites include a step of depositing a thermo-oxidative barrier coating comprising a SOC layer directly onto at least one surface of a polymeric matrix substrate via atmospheric plasma deposition.
- the thermo-oxidative barrier coating beneficially reduces the level and/or rate of oxygen diffusion into the polymeric matrix resin. Consequently, certain aspects of the present disclosure demonstrate an increased level of thermo-oxidative stability relative of composites of the same polymeric substrate being devoid of a thermo-oxidative barrier coating according to aspects of the present disclosure.
- certain aspects of the present disclosure can include a step of providing one or more polymeric substrates 100 followed by depositing a thermo- oxidative barrier coating comprising a SOC layer 150 directly onto at least one surface of the polymeric substrate to provide a composite.
- the polymeric substrates can be pre-cleaned by traditional physical or chemical methods and/or plasma pretreated prior to depositing an SOC layer onto the polymeric substrate.
- the SOC layer can provide adequate thermo-oxidative stability to the resulting composite that a traditionally employed thermo-oxidative barrier layer can be avoided if desired.
- composites are produced by depositing an adhesion-promoting layer comprising a SOC onto at least one surface of a polymeric matrix substrate followed by depositing an OBL substantially overlying the adhesion-promoting layer.
- the adhesion-promoting layer in at least one respect, functions as a tie-layer to facilitate a stronger and longer- lasting bond of the OBL to the polymeric matrix substrate.
- the adhesion-promoting layer can be specifically tailored to tie dissimilar materials (e.g., the OBL layer being dissimilar to the polymeric matrix substrate as realized by a relatively weak or non-existent direct bond between the two components).
- the adhesion-promoting layer beneficially increases the bond strength of the OBL to the polymeric matrix substrate relative to the bond strength of the same OBL when directly deposited onto the same polymeric substrate.
- the SOC layer functions as an interlayer over which a different layer (e.g., a traditional OBL) can be deposited.
- certain aspects of the present disclosure in which the SOC layer is sandwiched between the polymeric substrate and a traditional OBL can include a step of providing one or more polymeric substrates 200 followed by depositing an adhesion- promoting layer comprising a SOC 250 onto at least one surface of the polymeric substrate.
- the SOC coated polymeric substrate can then be subjected to an OBL deposition step 275 in which a traditional OBL is deposited over the top of the SOC layer such that the SOC layer is sandwiched between the OBL and the polymeric substrate to provide a composite according to certain aspects of the present disclosure.
- OBL deposition step 275 in which a traditional OBL is deposited over the top of the SOC layer such that the SOC layer is sandwiched between the OBL and the polymeric substrate to provide a composite according to certain aspects of the present disclosure.
- the polymeric substrates can be pre-cleaned by traditional physical or chemical methods and/or plasma pretreated prior to depositing an SOC layer onto the polymeric substrate.
- the SOC coatings / layers are created by atmospheric plasma deposition.
- One of the benefits of using atmospheric plasma deposition is that the relatively large production of chemically reactive species, such as atomic oxygen, enables the precursor to be mixed downstream in the plasma afterglow where it can react with the reactive neutrals from the plasma to produce a coating on the substrate.
- Atmospheric plasma deposition beneficially generates much greater reactive species concentrations than more traditional deposition techniques and can be used in a remote or downstream mode.
- One suitable atmospheric plasma deposition system suitable for deposited an SOC coating onto a polymeric matrix substrate is ATOMFLOTM Model 400 with Precursor Delivery System from Surfx® Technologies LLC (USA).
- the height of the plasma applicator head from the substrate being coated can be adjusted as desired, for example, from about 1 mm to 1 cm (e.g., 2-7mm, 3-6mm).
- the helium or argon (as the primary gas) flow rate can be varied from about 20 to 50 liters per minute (LPM) (e.g., 20-40, 25-35LPM).
- the plasma power can be varied from about 80W to 180W (e.g, 100-150W, 120-150W).
- Oxygen gas flow can range, for example, from 0.1 to 1 LPM.
- FIG. 7A provides a general schematic of an atmospheric deposition device in accordance with certain aspects of the present disclosure.
- the atmospheric-plasma deposition device 50 includes an outer electrode 52 which is electrically grounded and an inner electrode 54 to which an external voltage is applied.
- the external voltage can be supplied by a high- frequency, high-voltage generator 57.
- the generator 57 can supply the inner electrode 54 with a voltage in the order of, for example, 5 to 30 kV and the frequency of the voltage can range, for example, from 10 to 20 kHz.
- the atmospheric plasma deposition device 50 includes a plasma gas / working gas inlet stream 56 entering a first end of the device 50.
- the plasma gas / working gas inlet stream 56 comprises helium gas, oxygen gas, or a mixture thereof.
- a plasma discharge 58 is generally located at an end of the device 50 opposite to the plasma gas / working gas inlet stream 56.
- a plasma stream 60 exits the plasma discharge 58 of the device 50.
- One or more chemical precursors 62 such as those discussed in the present specification, can be introduced into the plasma steam 60 via precursor inlets 64.
- an SOC layer 15 can be deposited onto the surface of a polymeric substrate 10.
- Figure 7A illustrates a device 50 providing a single discharge steam (e.g., plasma discharge 58 in Figure 7A)
- certain preferred aspects utilize a device comprising a showerhead-type configuration in which multiple plasma discharges are provided.
- Figure 7B illustrates a device comprising a showerhead-type configuration in which multiple plasma discharges are provided.
- an atmospheric -plasma deposition device 50 can comprise a showerhead-type discharge head 152 including multiple discharge orifices 158.
- the power supply 157 and the chemical precursors 162 can be connected to the top of the device 50.
- the chemical precursors can be delivered inside the head to the plasma and the afterglow region 160 is where the chemical reactions and film deposition occur.
- One commercially available device including a showerhead-type configuration in which multiple plasma discharges are provided includes ATOMFLOTM Model 400 from Surfx® Technologies LLC (USA).
- Table 1 The operating variables that were modified from run to run, as well as respective values, are summarized in Table 1 below.
- Table 2 provides a summary of the operating parameters of atmospheric plasma deposition that were held as fixed conditions during all runs. It should be noted, however, that the operating parameters that were selected to be fixed conditions among the eight run need not necessarily be fixed or set at these particular values.
- the height between the plasma-deposition source and the closest surface of the polyimide substrate can readily be varied from the 5-mm height employed in the exemplary runs discussed herein.
- the height of the deposition source above the substrate can be varied from 1 mm to 1 cm.
- Table 3 provides a quick summary of the times used to coat a SOC layer onto a 100mm X 138.5mm polyimide substrate. It should be noted, however, that the deposition rates and /or density of the resulting SOC layer can be tailored by adjusting one or more of the operating parameters of the atmospheric plasma deposition.
- each of the samples was subjected to testing for oxygen-barrier functionality at 450°F for about 7,752 hours with weight loss data obtained after about 3,432 hours of exposure. These tests were conducted to illustrate the ability of the respective SOC coatings to stay attached to the polyimide substrate and the ability to prevent weight loss due to oxidation. As discussed above, the SOC layers were deposited using OMCTS and TMCTS precursors with atmospheric plasma and the "CVD" sample was deposited with OMCTS in a vacuum chamber. The results of this additional testing are summarized in Table 4.
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KR102378021B1 (en) * | 2016-05-06 | 2022-03-23 | 에이에스엠 아이피 홀딩 비.브이. | Formation of SiOC thin films |
US10847529B2 (en) | 2017-04-13 | 2020-11-24 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by the same |
US11158500B2 (en) | 2017-05-05 | 2021-10-26 | Asm Ip Holding B.V. | Plasma enhanced deposition processes for controlled formation of oxygen containing thin films |
US10991573B2 (en) | 2017-12-04 | 2021-04-27 | Asm Ip Holding B.V. | Uniform deposition of SiOC on dielectric and metal surfaces |
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US10787591B2 (en) | 2020-09-29 |
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