EP2791259A1 - Silicone solvent - Google Patents

Silicone solvent

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Publication number
EP2791259A1
EP2791259A1 EP12795474.1A EP12795474A EP2791259A1 EP 2791259 A1 EP2791259 A1 EP 2791259A1 EP 12795474 A EP12795474 A EP 12795474A EP 2791259 A1 EP2791259 A1 EP 2791259A1
Authority
EP
European Patent Office
Prior art keywords
fluoride
silicone
salts
solvent
solubilizer according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12795474.1A
Other languages
German (de)
French (fr)
Inventor
Andreas KÖLLNBERGER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of EP2791259A1 publication Critical patent/EP2791259A1/en
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • C11D7/04Water-soluble compounds
    • C11D7/10Salts
    • C11D7/16Phosphates including polyphosphates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31127Etching organic layers
    • H01L21/31133Etching organic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00Chemical paint or ink removers
    • C09D9/005Chemical paint or ink removers containing organic solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • C11D7/04Water-soluble compounds
    • C11D7/08Acids
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/32Organic compounds containing nitrogen
    • C11D7/3209Amines or imines with one to four nitrogen atoms; Quaternized amines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/24Organic compounds containing halogen
    • C11D3/245Organic compounds containing halogen containing fluorine

Definitions

  • the present invention relates to a composition for depolymerization and removal of silicone residues.
  • This composition called a silicone remover, contains a
  • Alkylammonium fluoride an inorganic basic salt and a solvent.
  • the composition of the invention is particularly suitable for removing crosslinked or uncrosslinked, filled or unfilled silicone residues from sensitive surfaces and substrates.
  • the silicone solubilizer can be liquid, pasty or gelatinous in a variety of applications, depending on the application.
  • US 5,008,229 is directed to solutions of phosphonitrilic chlorides in an organic solvent and to the use of such compositions for accelerating the
  • Reaction products of phosphorus-nitrogen-chloride and octamethylcyclotetrasiloxane often have viscosities exceeding several thousand mPa-s (centipoises), which makes the materials less suitable as catalysts for the removal of polydimethylsiloxane backbones.
  • organic acids or alkalis which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for
  • the object of the present invention was therefore a
  • composition which is suitable for removing crosslinked and uncrosslinked polysiloxane residues from various substrates or between substrates, at the same time inert to the substrates, and this does not damage or corrode even in a thin layer during the exposure time, to remove the silicone impurities.
  • This object has surprisingly been achieved by a silicone solubilizer
  • inorganic salts are particularly suitable, the corrosive action of a silicone dissolving composition of an organic tetraalkylammonium fluoride and a solvent
  • the silicone solubilizers according to the invention are particularly well suited for removing polysiloxane residues or layers on or between substrates.
  • the silicone solubilizers according to the invention have the advantage that they act selectively on silicone polymers or polydimethylsiloxane groups. Other plastics are not affected by the mechanism of the reaction.
  • Example of plastics inert to the silicone solubilizer according to the invention :
  • Polyolefin polystyrene, polyvinyl chloride, polyethylene,
  • Silicone solubilizers according to the invention merely dissolve, for example, addition-crosslinked, condensation-crosslinked and peroxydically crosslinked silicone rubbers such as RTV-1, RTV-2, LSR and HTV.
  • the silicone solubilizer according to the invention also works
  • Silicone rubbers depending on the application furthermore
  • Contain components such as fillers, for example hydrophilic or hydrophobic silicic acids, precipitated silicas,
  • Silicone resins aluminum oxides, titanium oxides, carbon blacks, graphites, metals, metal carbonates, diatomaceous earths, metal dusts, fibers such as glass fibers or plastic fibers and other additives such as fungicides, fragrances, corrosion inhibitors,
  • Oxidation inhibitors light stabilizers, flame retardants, dispersing agents, adhesion promoters,
  • component A) corresponds to the general formula (1): wherein
  • the compounds A) have long been known in the art and are commercially available. examples for
  • preferred compounds A) are: tetramethylammonium fluoride, tetraethylammonium fluoride, tetrabutylammonium fluoride,
  • Tetrapentylammonium fluoride Tetrapentylammonium fluoride, tetrahexylammonium fluoride,
  • Tetraheptylammonium fluoride Tetraheptylammonium fluoride, tetraoctylammonium fluoride,
  • Tetraisopropylammonium fluoride Tetraisobutylammonium fluoride, tetra (ter-butyl) ammonium fluoride, tetra (tert-pentyl) ammonium fluoride.
  • M are sodium, potassium, magnesium, calcium and ammonium.
  • Particularly preferred compounds B) are Na 3 PO 4 , Na 2 HPO 4 , NaH 2 PO 4 , MgHPO 4 , Mg 3 (PO 4 ) 2, (NH 4 ) H 2 PO 4 , (NH 4 ) 2 HPO 4 , ( NH 4 ) 3 PO 4 .
  • Component C) is a solvent which is capable of dissolving component A) and at least 0.001% by weight of component B).
  • Examples of the component C) are linear, branched and cyclic ethers which may also contain other heteroatoms such as nitrogen, phosphorus or halogen atoms.
  • dialkyl ethers diethyl ether, di-n-propyl ether, diisopropyl ether, dibutyl ether, dipentyl ether, dihexyl ether, dioctyl ether, 2-ethylhexyl vinyl ether, 4-chlorobutyl ether, dichloromethyl methyl ether, 1, 2 -Dirnethoxypropan, tert. - Amyl methyl ether, tert. Butyl ethyl ether, di-sec. butyl ether, tetraethylene glycol dimethyl ether; cyclic ethers:
  • Oxacyclopentane tetrahydrofuran
  • Benzopyran 1-4-dioxane
  • Ethers containing aromatic groups methyl phenyl ether, 2-nitrophenyl phenyl ether,, 4-dimethoxybenzene, 1, 3, 5-trimethoxybenzene, butyl phenyl ether, 1, 4 -Diethoxybenzol.
  • Another class of compounds which can preferably be used as component C) is the substance class of the ketones which contains linear, branched and cyclic compounds which may additionally contain further heteroatoms such as nitrogen, phosphorus or halogen atoms. Particularly preferred are linear and branched aliphatic molecules.
  • ketones within the meaning of component C are listed below:
  • Another class of compounds that can be used preferably as component C) is the class of esters containing linear, branched and cyclic compounds which
  • hetero atoms such as nitrogen, phosphorus or May contain halogen atoms.
  • hetero atoms such as nitrogen, phosphorus or May contain halogen atoms.
  • Esters which are considered to be dipolar aprotic solvents are considered to be dipolar aprotic solvents.
  • esters within the meaning of component C are listed below:
  • C) is selected from the group of the following
  • Solvents alkyl carboxylates, dialkyl ethers, alkyl aryl ethers, ketones.
  • C) selected from the group: ethyl acetate, propyl acetate,
  • silicone solvents according to the invention may contain thickener D) in order to adjust the viscosity and, for example, prepare pasty masses.
  • thickeners D) are: precipitated silica, hydrophilic or hydrophobic finely divided silica,
  • Alumina, titania, calcium salts of carboxylic acids, carbon blacks or carboxymethylcellulose It is possible to use all thickeners D) known from the prior art which have a water content of less than 5000 ppm. Prefers the water content should be below 2500 ppra and
  • Component A) and the silicone solvent would lose its equilibrium property.
  • D) is preferred from the
  • the preparation of the silicone solvent according to the invention is carried out by mixing A) with B) and C) and possibly D) ideally until the formation of a clear solution.
  • the mixing is usually carried out by intensive stirring of the components between 0.5 and 10 hours at room temperature or elevated temperature (up to 140 ° C).
  • thickeners D are used, this is done by adjusting the viscosity of the silicone solubilizer according to the invention to a defined range. This is the
  • Thickener D in amounts of 0.1 to 30 wt.% Used to 100 wt.% Silicone Solvent. From 0.5 to 10% by weight and more preferably from 1 to 5% by weight of D) are preferably added.
  • Another object of the present invention is the use of the silicone solubilizer according to the invention for
  • the exposure time can be between 10 s and several hours. In a preferred
  • the exposure time is between 30 s and 10 min.
  • Solvent C temperatures between 20 ° C and 150 ° C can be applied, wherein as a preferred temperature range 20 ° C to 100 ° C can be specified. Likewise accelerating acts any circulation of the silicone solubilizer according to the invention, for example by pumping, shaking or by the
  • Embodiment is the exposure time at room temperature using ultrasound between 10 s and 5 min.
  • the exposure time at room temperature using ultrasound between 10 s and 5 min.
  • the cleavage products are washed off with solvent without additives, which may or may not be identical to the solvent C) used in the dissolution reaction.
  • Ultrasonic bath (Bandelin RM 40), by introducing an ultrasonic probe or the like.
  • Trisodium phosphate dissolved in 97.45 g of 2-octanone at room temperature by stirring within 30 min.
  • Trisodium phosphate dissolved in 97.45 g of n-propyl acetate at room temperature by stirring within 30 min.
  • Example 7 silicone dissolving composition 7 (not
  • Example 9 Dissolution of a polydimethylsiloxane composition
  • silicone solubilizer according to the invention are particularly peculiar to remove silicone residues at a significantly reduced aluminum corrosion. Normally it is at

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Abstract

The invention relates to a silicone solvent containing A) at least one tetraalkylammonium fluoride, B) at least one inorganic base which is capable of binding hydrogen ions, and C) at least one solvent which is suitable for dissolving the tetraalkylammonium fluoride A) as well as at least 0.001 wt.% of the inorganic base B).

Description

Siliconlöser  Silicon remover
Die vorliegende Erfindung betrifft eine Zusammensetzung zur Depolymerisation und Entfernung von Siliconrückständen. Diese als Siliconlöser bezeichnete Zusammensetzung enthält ein The present invention relates to a composition for depolymerization and removal of silicone residues. This composition, called a silicone remover, contains a
Alkylammoniumfluorid, ein anorganisches basisches Salz sowie ein Lösungsmittel. Die erfindungsgemäße Zusammensetzung ist zur Entfernung von vernetzten oder unvernetzten, gefüllten oder ungefüllten Siliconrückständen von empfindlichen Oberflächen und Substraten besonders geeignet. Der Siliconlöser kann in den vielfältigen Anwendungen flüssig, pastös oder gelförmig sein, je nach Einsatzbereich.  Alkylammonium fluoride, an inorganic basic salt and a solvent. The composition of the invention is particularly suitable for removing crosslinked or uncrosslinked, filled or unfilled silicone residues from sensitive surfaces and substrates. The silicone solubilizer can be liquid, pasty or gelatinous in a variety of applications, depending on the application.
Im Stand der Technik sind für das Entfernen oder die In the prior art are for the removal or the
Depolymerisation von vernetzten oder unvernetzten Siliconen diverse Methoden und Zusammensetzungen bekannt. Depolymerization of crosslinked or uncrosslinked silicones various methods and compositions known.
• Quellen und entfernen mit Hilfe eines organischen oder • Sources and remove with the help of an organic or
halogenierten organischen Lösungsmittels .  halogenated organic solvent.
• Quellen und entfernen mit Hilfe eines Amins wie • Sources and remove with the help of an amine like
beispielsweise Diisopropylamin.  for example, diisopropylamine.
• Depolymerisation des Polydimethylsiloxans mit Hilfe von alkalischen Lösungen starker Basen wie Natriumhydroxid, Kaliumhydroxid wie beispielsweise in US 2,710,843 Depolymerization of the polydimethylsiloxane with the aid of alkaline solutions of strong bases, such as sodium hydroxide, potassium hydroxide, as described, for example, in US Pat. No. 2,710,843
beschrieben.  described.
• Depolymerisation mit Hilfe von kurzkettigen oder • Depolymerization by means of short-chain or
cyclischen Oligodiorganosiloxanen wie beispielsweise in DE cyclic oligodiorganosiloxanes such as in DE
69122740 T2 beschrieben. 69122740 T2.
• Depolymerisation durch wässrige Lösungen starker Säuren wie beispielsweise Alkylbenzolsulfonsäuren, Schwefelsäure, Fluorwasserstoffsäure wie beispielsweise in JP 8250400 A. beschrieben . Depolymerization by aqueous solutions of strong acids such as alkylbenzenesulfonic acids, sulfuric acid, Hydrofluoric acid as described for example in JP 8250400 A.
• Depolymerisation mit Hilfe einer Zusammensetzung Depolymerization by means of a composition
enthaltend Phosphonitrilhalogenidverbindungen und  containing phosphonitrile halide compounds and
kurzkettige Oligodimethylsiloxane von bis zu 7-Si- Kettenglieder wie beispielsweise in EP 0 884 368 A1 beschrieben. Die gegenteilige Verwendung von cyclischen oder linearen Phosphonitrilhalogenidverbindungen als  short-chain oligodimethylsiloxanes of up to 7-Si chain members as described, for example, in EP 0 884 368 A1. The opposite use of cyclic or linear phosphonitrile halide compounds as
Polymerisations- oder Kondensationskatalysator zur  Polymerization or condensation catalyst for
Herstellung langkettiger Polydimethylsiloxane ist seit langem Stand der Technik ebenso wie die Verwendung des Katalysators zur Equilibrierung von Polydimethylsiloxanen wie in DE 196 07 264 A1 beschrieben.  Preparation of long-chain polydimethylsiloxanes has long been state of the art as well as the use of the catalyst for the equilibration of polydimethylsiloxanes as described in DE 196 07 264 A1.
• US 5,008,229 ist auf Lösungen von Phosphonitrilchloriden in einem organischen Lösungsmittel und den Gebrauch solcher Zusammensetzungen zum Beschleunigen der US 5,008,229 is directed to solutions of phosphonitrilic chlorides in an organic solvent and to the use of such compositions for accelerating the
Kondensation und/oder Äquilibrierung von Hydroxy- Endgruppen aufweisenden Diorganosiloxanen gerichtet.  Condensation and / or equilibration of hydroxy-terminated diorganosiloxanes directed.
Obwohl verbesserte Ergebnisse erzielt werden, wird ein organisches Losungsmittel, wie Ethylacetat, eingesetzt, um die Auflösung des Phosphonitrilchlorids zu erleichtern. DE 37 25 377 beseitigt den Einsatz eines organischen  Although improved results are achieved, an organic solvent such as ethyl acetate is used to facilitate dissolution of the phosphonitrile chloride. DE 37 25 377 eliminates the use of an organic
Lösungsmittels durch Verwenden eines Reaktionsproduktes eines Phosphor-Stickstoff-Chlorids und eines cyclischen Diorganosiloxans , wie Octamethylcyclotetrasiloxan, als Katalysator. Die Erfahrung hat jedoch gezeigt, dass  Solvent by using a reaction product of a phosphorus-nitrogen chloride and a cyclic diorganosiloxane, such as octamethylcyclotetrasiloxane, as a catalyst. However, experience has shown that
Reaktionsprodukte von Phosphor-Stickstoff-Chlorid und Octamethylcyclotetrasiloxan häufig Viskositäten aufweisen, die mehrere Tausend mPa-s (centipoises) übersteigen, was die Materialien weniger geeignet als Katalysatoren für die Entfernung von Polydimethylsiloxanrückstenden macht. Reaction products of phosphorus-nitrogen-chloride and octamethylcyclotetrasiloxane often have viscosities exceeding several thousand mPa-s (centipoises), which makes the materials less suitable as catalysts for the removal of polydimethylsiloxane backbones.
• US 7,232,770 Bl beschreibt Ammoniumfluoride in Kombination mit Aminen in verschiedenen Lösungsmitteln zur Entfernung von Siliconrückständen im Halbleiterbereich. US Pat. No. 7,232,770 Bl describes ammonium fluorides in combination with amines in various solvents for removing silicon residues in the semiconductor sector.
Der Nachteil aller bisher bekannten Zusammensetzungen zum Lösen von Silicon ist, dass sie korrosive Substanzen wie The disadvantage of all previously known compositions for dissolving silicone is that they contain corrosive substances such as
beispielsweise organische Säuren oder Laugen enthalten, die bei der Entfernung von Siliconen von diversen Substraten, zur For example, organic acids or alkalis, which in the removal of silicones from various substrates, for
Oberflächenkorrosion von Metallen führen. Surface corrosion of metals lead.
Aufgabe der vorliegenden Erfindung war es daher eine  The object of the present invention was therefore a
Zusammensetzung zur Verfügung zu stellen, welche zur Entfernung vernetzter und unvernetzter Polysiloxanrückstände von diversen Substraten beziehungsweise zwischen Substraten geeignet ist, gleichzeitig inert gegen die Substrate ist, und diese auch in dünner Schicht während der Einwirkzeit, zur Entfernung der Siliconverunreinigungen, nicht schädigt oder korrodiert. Diese Aufgabe wurde überraschenderweise gelöst durch einen Siliconlöser enthaltend Composition, which is suitable for removing crosslinked and uncrosslinked polysiloxane residues from various substrates or between substrates, at the same time inert to the substrates, and this does not damage or corrode even in a thin layer during the exposure time, to remove the silicone impurities. This object has surprisingly been achieved by a silicone solubilizer
A) mindestens eine Tetraalkylammoniumfluorid, A) at least one tetraalkylammonium fluoride,
B) mindestens eine anorganische Base, die in der Lage ist, Wasserstoffionen zu binden, sowie C) mindestens ein Lösungsmittel, das geeignet ist, sowohl das Tetraalkylammoniumfluorid A) , als auch mindestens 0,001 Gew.% der anorganischen Base B) zu lösen. B) at least one inorganic base capable of binding hydrogen ions and C) at least one solvent capable of dissolving both the tetraalkylammonium fluoride A) and at least 0.001% by weight of the inorganic base B).
Überraschenderweise wurde gefunden, dass sich anorganische Salze besonders gut eignen, die korrosive Wirkung einer siliconlösenden Zusammensetzung aus einem organischen Tetraalkylammoniumfluorid und einem Lösungsmittel zu Surprisingly, it has been found that inorganic salts are particularly suitable, the corrosive action of a silicone dissolving composition of an organic tetraalkylammonium fluoride and a solvent
unterdrücken . suppress .
Die erfindungsgemäßen Siliconlöser sind besonders gut geeignet, um Polysiloxanrückstände oder -Schichten auf oder zwischen Substraten zu entfernen. The silicone solubilizers according to the invention are particularly well suited for removing polysiloxane residues or layers on or between substrates.
Die erfindungsgemäßen Siliconlöser haben den Vorteil, dass sie selektiv auf Siliconpolymere bzw. Polydimethylsiloxangruppen wirkt. Andere Kunststoffe werden, bedingt durch den Mechanismus der Reaktion, nicht angegriffen. Beispiel für Kunststoffe die inert gegenüber den erfindungsgemäßen Siliconlöser sind: The silicone solubilizers according to the invention have the advantage that they act selectively on silicone polymers or polydimethylsiloxane groups. Other plastics are not affected by the mechanism of the reaction. Example of plastics inert to the silicone solubilizer according to the invention:
Polyolefin, Polystyrol, Polyvinylchlorid, Polyethylen, Polyolefin, polystyrene, polyvinyl chloride, polyethylene,
Polypropylen, Polynitril, Acrylnitril-butadien-styrol- copolymere, Polyimide, oder Polyacrylat. Erfindungsgemäße Siliconlöser lösen lediglich beispielsweise additionsvernetzte, kondensationsvernetzte und peroxydisch vernetzte Siliconkautschuke wie RTV-1, RTV-2, LSR und HTV. Die erfindungsgemäße Siliconlöser wirkt auch bei Polypropylene, polynitrile, acrylonitrile-butadiene-styrene copolymers, polyimides, or polyacrylate. Silicone solubilizers according to the invention merely dissolve, for example, addition-crosslinked, condensation-crosslinked and peroxydically crosslinked silicone rubbers such as RTV-1, RTV-2, LSR and HTV. The silicone solubilizer according to the invention also works
Silikonkautschuken, die je nach Anwendungsgebiet weitere Silicone rubbers, depending on the application further
Komponenten enthalten wie Füllstoffe, beispielsweise hydrophile oder hydrophobe Kieselsäuren, gefällte Kieselsäuren, Contain components such as fillers, for example hydrophilic or hydrophobic silicic acids, precipitated silicas,
Siliconharze, Aluminiumoxide, Titanoxide, Ruße, Graphite, Metalle, Metallcarbonate , Diatomeenerden, Metallstäube, Fasern wie Glasfasern oder Kunststofffasern und sonstige Additive wie Fungizide, Duftstoffe, Korrosionsinhibitoren, Silicone resins, aluminum oxides, titanium oxides, carbon blacks, graphites, metals, metal carbonates, diatomaceous earths, metal dusts, fibers such as glass fibers or plastic fibers and other additives such as fungicides, fragrances, corrosion inhibitors,
Oxidationsinhibitoren, Lichtschutzmittel, flammabweisend machende Mittel, Dispergierhilfsmittel , Haftvermittler,  Oxidation inhibitors, light stabilizers, flame retardants, dispersing agents, adhesion promoters,
Pigmente, Weichmacher, organische Poylmere oder Pigments, plasticizers, organic polymers or
Hitzestabilisatoren sein. Auch Copolymere, die Polydiorganosiloxaneinheiten oder Siliconharze enthalten, werden durch den erfindungsgemäßen Siliconlöser abgebaut. Be heat stabilizers. Also copolymers that Polydiorganosiloxaneinheiten or silicone resins are degraded by the silicone solubilizer according to the invention.
In einer bevorzugten Ausführungsform entspricht die Komponente A) der allgemeinen Formel (1) : worin In a preferred embodiment, component A) corresponds to the general formula (1): wherein
n = 1 bis 30, bevorzugt n = 1 bis 18 und besonders bevorzugt n = 1 bis 10 n = 1 to 30, preferably n = 1 to 18 and particularly preferably n = 1 to 10
bedeutet . means.
Die Verbindungen A) sind seit langem im Stand der Technik bekannt und sind kommerziell verfügbar. Beispiele für The compounds A) have long been known in the art and are commercially available. examples for
bevorzugte Verbindungen A) sind: Tetramethylammoniumfluorid, Tetraethylammoniumfluorid, Tetrabutylammoniumfluorid, preferred compounds A) are: tetramethylammonium fluoride, tetraethylammonium fluoride, tetrabutylammonium fluoride,
Tetrapentylammoniumfluorid, Tetrahexylammoniumfluorid, Tetrapentylammonium fluoride, tetrahexylammonium fluoride,
Tetraheptylammoniumfluorid, Tetraoctylammoniumfluorid, Tetraheptylammonium fluoride, tetraoctylammonium fluoride,
Tetranonylammoniumfluorid, Tetradecylammoniumfluorid, Tetranonylammonium fluoride, tetradecylammonium fluoride,
Tetraisopropylammoniumfluorid, Tetraisobutylammoniumfluorid, Tetra (ter-butyl) ammoniumfluorid, Tetra (tert- pentyl ) ammoniumfluorid .  Tetraisopropylammonium fluoride, tetraisobutylammonium fluoride, tetra (ter-butyl) ammonium fluoride, tetra (tert-pentyl) ammonium fluoride.
In einer bevorzugten Ausführungsform wird die Komponente B) aus der folgenden Gruppe anorganischer Salze gewählt, wobei M aus der Gruppe der Alkali- und Erdalkalimetalle sowie einwertiger Kationen wie beispielsweise das Ammoniumion gewählt ist: Salze der Phosphorigen- und der Phosphorsäure MoHpPO3 und MoHpPO4 mit o = l bis 3 (Summenformel exemplarisch bezogen auf ein einwertiges Metallkation) und p = 0 bis 2, In a preferred embodiment, component B) is selected from the following group of inorganic salts, wherein M is selected from the group of alkali metals and alkaline earth metals and monovalent cations such as, for example, the ammonium ion: Salts of the phosphorous and phosphoric acids M o H p PO 3 and M o H p PO 4 with o = 1 to 3 (empirical formula based on a monovalent metal cation, by way of example) and p = 0 to 2,
Salze der schwefeligen- und der Schwefelsäure MqHrSO3, MqHrSO4 mit q = 1 bis 2, r = 0 bis 1, Salts of sulfuric and sulfuric acids M q H r SO 3 , M q H r SO 4 where q = 1 to 2, r = 0 to 1,
Salze der salpetrigen- und der Salpetersäure MN02 und MN03 (Summenformel exemplarisch bezogen auf ein einwertiges Salts of nitrous and nitric acid MN0 2 and MN0 3 (empirical formula based on a monovalent
Metallkation) .Bevorzugt als M sind Natrium, Kalium, Magnesium, Calcium und Ammonium. Besonders bevorzugte Verbindungen B) sind Na3PO4, Na2HPO4, NaH2PO4, MgHPO4, Mg3(PO4)2, (NH4)H2PO4, (NH4)2HPO4, (NH4)3PO4. Metal cation). Preferred as M are sodium, potassium, magnesium, calcium and ammonium. Particularly preferred compounds B) are Na 3 PO 4 , Na 2 HPO 4 , NaH 2 PO 4 , MgHPO 4 , Mg 3 (PO 4 ) 2, (NH 4 ) H 2 PO 4 , (NH 4 ) 2 HPO 4 , ( NH 4 ) 3 PO 4 .
Die Komponente C) stellt ein Lösungsmittel dar, welches in der Lage ist, die Komponente A) und mindestens 0,001 Gew% der Komponente B) zu lösen. Beispiele für die Komponente C) sind lineare, verzweigte und cyclische Ether, welche auch weitere Hetero-Atome wie Stickstoff, Phosphor oder Halogenatome enthalten können. Im Folgenden werden, ohne den Umfang der Erfindung zu beschränken, Beispiele für Ether als Lösungsmittel aufgezählt: Dialkylether : Diethylether, Di-n-propylether, Diisopropylether, Dibutylether , Dipentylether, Dihexylether, Dioctylether, 2-Ethylhexyl-vinylether, 4 -Chlorbutylether, Dichlormethyl-methylether, 1 , 2 -Dirnethoxypropan, tert . - Amylmethylether, tert . -Butylethylether, Di-sec . -butylether, Tetraethylenglykol-dimethylether; cyclische Ether: Component C) is a solvent which is capable of dissolving component A) and at least 0.001% by weight of component B). Examples of the component C) are linear, branched and cyclic ethers which may also contain other heteroatoms such as nitrogen, phosphorus or halogen atoms. The following are, without limiting the scope of the invention, examples of ethers as solvents: dialkyl ethers: diethyl ether, di-n-propyl ether, diisopropyl ether, dibutyl ether, dipentyl ether, dihexyl ether, dioctyl ether, 2-ethylhexyl vinyl ether, 4-chlorobutyl ether, dichloromethyl methyl ether, 1, 2 -Dirnethoxypropan, tert. - Amyl methyl ether, tert. Butyl ethyl ether, di-sec. butyl ether, tetraethylene glycol dimethyl ether; cyclic ethers:
Oxacyclopentan (Tetrahydrofuran) , Oxacycloheptan Oxacyclopentane (tetrahydrofuran), oxacycloheptane
(Tetrahydropyran) , 1-4-Dioxan; Ether, die aromatische Gruppen enthalten: Methyl-phenylether, 2-Nitrophenyl-phenylether, ,4- Dimethoxy-benzol , 1 , 3 , 5 -Trimethoxybenzol , Butyl-phenylether, 1 , 4 -Diethoxybenzol . Eine weitere Substanzklasse, die bevorzugt als Komponente C) verwendet werden kann, ist die Substanzklasse der Ketone, die lineare, verzweigte und cyclische Verbindungen enthält, welche zusätzlich weitere Hetero-Atome wie Stickstoff, Phosphor oder Halogenatome enthalten können. Besonders bevorzugt sind lineare und verzweigte aliphatische Moleküle. (Tetrahydropyran), 1-4-dioxane; Ethers containing aromatic groups: methyl phenyl ether, 2-nitrophenyl phenyl ether,, 4-dimethoxybenzene, 1, 3, 5-trimethoxybenzene, butyl phenyl ether, 1, 4 -Diethoxybenzol. Another class of compounds which can preferably be used as component C) is the substance class of the ketones which contains linear, branched and cyclic compounds which may additionally contain further heteroatoms such as nitrogen, phosphorus or halogen atoms. Particularly preferred are linear and branched aliphatic molecules.
Im Folgenden werden, ohne den Umfang der Erfindung zu In the following, without the scope of the invention
beschränken, Beispiele für Ketone im Sinne der Komponente C) aufgeführt : Examples of ketones within the meaning of component C) are listed below:
2-Propanon, 2-Butanon, 2-Pentanon, 2-Hexanon, 2-Heptanon, 2- Octanon, 2-Nonanon, 2-Decanon, 3-Hexanon, 3-Heptanon, 3- Octanon, 3-Nonanon, 3-Decanon, 2-Methyl-3-butanon, 3,3- dimethyl-2-butanon, 2-Methyl-3-Pentanon, 2 -Methyl-3 -Hexanon, 2- Methyl-3 -Heptanon, 4-Heptanon, 4-Octanon, 4-Nonanon, 4-Decanon, 2 , 2 -Dimethyl-3 -Pentanon, 2 , 4-Dimethyl-3-Pentanon, 5 -Methyl-3- heptanon, 4 , 4 -Dirnethyl-2 -pentanon, 2 , 2 , 4 , 4 , -Tetramethyl-3 - Pentanon, 3 -Methyl-2 -pentanon, 4 -Methyl-2 -pentanon, 3,3- Dimethoxy-2-butanon, 4 , 4-Dimethoxy-2-butanon, 3-Methyl-2- cyclohanon, 3 -Methyl-2 -cyclohexenon, 1 , 3 -Cycloheptandion, 2- Methyl-1, 3-cyclohexandion, 3 -Ethoxy-2 -cyclopenten-l-on, 5- Methyl-1, 3 - cyclohexandion, Triacetylmethan, 2,2- Dimethylcyclopentanon, 2 -Methyl-cyclohexanon, 3- Methylcyclohexanon, 4 -Methylcyclohexanon, Cycloheptanon,  2-propanone, 2-butanone, 2-pentanone, 2-hexanone, 2-heptanone, 2-octanone, 2-nonanone, 2-decanone, 3-hexanone, 3-heptanone, 3-octanone, 3-nonanone, 3 Decanone, 2-methyl-3-butanone, 3,3-dimethyl-2-butanone, 2-methyl-3-pentanone, 2-methyl-3-hexanone, 2-methyl-3-heptanone, 4-heptanone, 4- Octanone, 4-nonanone, 4-decanone, 2, 2-dimethyl-3-pentanone, 2, 4-dimethyl-3-pentanone, 5-methyl-3-heptanone, 4, 4 -dirnethyl-2-pentanone, 2, 2, 4, 4, -tetramethyl-3-pentanone, 3-methyl-2-pentanone, 4-methyl-2-pentanone, 3,3-dimethoxy-2-butanone, 4, 4-dimethoxy-2-butanone, 3 Methyl 2-cyclohexanone, 3-methyl-2-cyclohexenone, 1, 3-cycloheptanedione, 2-methyl-1, 3-cyclohexanedione, 3-ethoxy-2-cyclopenten-1-one, 5-methyl-1,3 cyclohexanedione, triacetylmethane, 2,2-dimethylcyclopentanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone,
Diethylaminoaceton . Diethylaminoacetone.
Eine weitere Substanzklasse, die bevorzugt als Komponente C) verwendet werden kann, ist die Klasse der Ester, die lineare, verzweigte und cyclische Verbindungen enthält, welche Another class of compounds that can be used preferably as component C) is the class of esters containing linear, branched and cyclic compounds which
zusätzlich weitere Hetero-Atome wie Stickstoff, Phosphor oder Halogenatome enthalten können . Besonders bevorzugt werden additionally further hetero atoms such as nitrogen, phosphorus or May contain halogen atoms. Particularly preferred
Ester, welche als dipolar aprotisches Lösungsmittel gelten. Esters which are considered to be dipolar aprotic solvents.
Im Folgenden werden, ohne den Umfang der Erfindung zu In the following, without the scope of the invention
beschränken, Beispiele für Ester im Sinne der Komponente C) aufgeführt: Examples of esters within the meaning of component C) are listed below:
Carbonsäurealkylester Essigsäuremethylester,  Carboxylic acid alkyl ester methyl acetate,
Essigsäureethylester, Essigsäurepropylester, Ethyl acetate, propyl acetate,
Essigsäurebutylester, Essigsäurepentylester, Butyl acetate, pentyl acetate,
Essigsäurehexylester, Essigsäureheptylester, Ethoxylated hexyl ester, heptyl acetate,
Essigsäureoctylester, Essigsäurenonylester, Octyl acetate, acyl acetate,
Propionsäuremethylester, Propionsäureethylester,  Propionic acid methyl ester, ethyl propionate,
Propionsäurepropylester, Propionsäurebutylester, Propionic acid propyl ester, butyl propionate,
Propionsäurepentylester, Propionsäurehexylester, Propionic acid pentyl ester, hexyl propionate,
Propionsäureheptylester, Propionsäureoctylester, Propionic acid heptyl ester, octyl propionate,
Bevorzugt wird C) ausgewählt aus der Gruppe folgender Preferably, C) is selected from the group of the following
Lösungsmittel: Carbonsäurealkylester, Dialkylether, Alkyl- arylether, Ketone . Besonders bevorzugt wir C) ausgewählt aus der Gruppe: Essigsäureethylester, Essigsäurepropylester, Solvents: alkyl carboxylates, dialkyl ethers, alkyl aryl ethers, ketones. We particularly prefer C) selected from the group: ethyl acetate, propyl acetate,
Essigsäureisopropylester, 2-Butanon, 2-0ctanon, Isopropyl- methylketon, Tert-butyl-methylketon. Isopropyl acetate, 2-butanone, 2-octanone, isopropyl methyl ketone, tert-butyl methyl ketone.
Als weiteren optionalen Bestandteil können erfindungsgemäße Siliconlöser Verdickungsmittel D) enthalten um die Viskosität zu einzustellen und beispielsweise pastöse Massen herzustellen. Beispiele für Verdickungsmittel D) sind: gefällte Kieselsäure, hydrophile oder hydrophobe hochdisperse Kieselsäure, As a further optional component, silicone solvents according to the invention may contain thickener D) in order to adjust the viscosity and, for example, prepare pasty masses. Examples of thickeners D) are: precipitated silica, hydrophilic or hydrophobic finely divided silica,
Aluminiumoxid, Titandioxid, Calziumsalze von Carbonsäuren, Ruße oder Carboxymethylcellulose . Es können alle nach dem Stand der Technik bekannten Verdickungsmittel D) verwendet werden, die einen Wassergehalt unterhalb von 5000 ppm aufweisen. Bevorzugt soll der Wassergehalt unterhalb von 2500 ppra liegen und Alumina, titania, calcium salts of carboxylic acids, carbon blacks or carboxymethylcellulose. It is possible to use all thickeners D) known from the prior art which have a water content of less than 5000 ppm. Prefers the water content should be below 2500 ppra and
besonders bevorzugt unterhalb von 1000 ppm. Auch organische aliphatische Alkoholgruppen sind in der Zusammensetzung zu vermeiden, da diese, analog zu Wasser, zur Hydrolyse der more preferably below 1000 ppm. Also, organic aliphatic alcohol groups are to be avoided in the composition, since these, analogous to water, for the hydrolysis of
Komponente A) führen und der Siliconlöser seine Eigenschaft zur Äquilibrierung verlieren würde. Bevorzugt wird D) aus der Component A) and the silicone solvent would lose its equilibrium property. D) is preferred from the
Gruppe der pyrogenen Kieselsäuren ausgewählt. Group of fumed silicas selected.
Die Herstellung des erfindungsgemäßen Siliconlösers erfolgt durch Mischen von A) mit B) und C) und evtl. D) idealerweise bis zur Bildung einer klaren Lösung.  The preparation of the silicone solvent according to the invention is carried out by mixing A) with B) and C) and possibly D) ideally until the formation of a clear solution.
Bevorzugt kommen 0,1 - 10 Gew.% A) besonders bevorzugt 0,1 - 5 Gew.% A) auf 100 Gew.% Siliconlöser. Bevorzugt kommen 0,001 bis 1 Gew.% B) , besonders bevorzugt 0,01 - 0,5 Gew.% B) auf 100 Gew.% Siliconlöser. C) stellt den verbleibenden Rest der 100 Gew.% des Siliconlösers. Preference is given to 0.1 to 10% by weight of A), more preferably 0.1 to 5% by weight of A) to 100% by weight of silicone solvent. Preference is given to 0.001 to 1 wt.% B), particularly preferably 0.01 to 0.5 wt.% B), to 100 wt.% Of silicone solubilizer. C) represents the remainder of the 100% by weight of the silicone solubilizer.
Das Mischen erfolgt üblicherweise durch intensives Rühren der Komponenten zwischen 0,5 und 10 Stunden bei Raumtemperatur oder erhöhter Temperatur (bis zu 140 °C) . The mixing is usually carried out by intensive stirring of the components between 0.5 and 10 hours at room temperature or elevated temperature (up to 140 ° C).
Werden Verdickungsmittel D) eingesetzt, so erfolgt dies um die Viskosität des erfindungsgemäßen Siliconlösers auf einen definierten Bereich einzustellen. Dabei wird das If thickeners D) are used, this is done by adjusting the viscosity of the silicone solubilizer according to the invention to a defined range. This is the
Verdickungsmittel D) in Mengen von 0,1 - 30 Gew.% auf 100 Gew.% Siliconlöser verwendet. Bevorzugt werden 0,5 bis 10 Gew.% und besonders bevorzugt 1 bis 5 Gew.% D) zugegeben. Thickener D) in amounts of 0.1 to 30 wt.% Used to 100 wt.% Silicone Solvent. From 0.5 to 10% by weight and more preferably from 1 to 5% by weight of D) are preferably added.
Ein weiterer Gegenstand der vorliegenden Erfindung ist die Verwendung des erfindungsgemäßen Siliconlösers zur Another object of the present invention is the use of the silicone solubilizer according to the invention for
Depolymerisation und Entfernung von vernetzten oder unvernetzten Siliconrückständen von Oberflächen oder Substraten. Depolymerization and removal of crosslinked or uncrosslinked silicone residues of surfaces or substrates.
Je nach Viskosität des erfindungsgemäßen Siliconlösers - flüssig, pastös oder gelförmig - erfolgt dies auf verschieden Weise, wie beispielsweise aufsprühen oder auftragen des Depending on the viscosity of the silicone solvent according to the invention - liquid, pasty or gel - this is done in various ways, such as spraying or applying the
erfindungsgemäßen Siliconlösers auf den zu reinigenden Silicone Solvent according to the invention to be purified
Gegenstand/Oberfläche/Substrat oder auch durch eintauchen des zu reinigenden Gegenstandes in den erfindungsgemäßen Object / surface / substrate or by immersing the object to be cleaned in the inventive
Siliconlöser . Je nach Schichtdicke und Zusammensetzung der zu entfernenden Siliconrückstände kann die Einwirkzeit zwischen 10 s und mehreren Stunden betragen. In einer bevorzugten Silicone solvent. Depending on the layer thickness and composition of the silicone residues to be removed, the exposure time can be between 10 s and several hours. In a preferred
Ausführungsform beträgt die Einwirkzeit zwischen 30 s und 10 min. Eine Temperaturerhöhung während der Einwirkzeit Embodiment, the exposure time is between 30 s and 10 min. A temperature increase during the exposure time
beschleunigt den Auflösungsprozess . Je nach verwendetem accelerates the dissolution process. Depending on the used
Lösungsmittel C) können Temperaturen zwischen 20 °C und 150 °C angewendet werden, wobei als bevorzugter Temperaturbereich 20 °C bis 100 °C angegeben werden kann. Ebenfalls beschleunigend wirkt jegliche Umwälzung des erfindungsgemäßen Siliconlösers, beispielsweise durch pumpen, schütteln oder durch die Solvent C) temperatures between 20 ° C and 150 ° C can be applied, wherein as a preferred temperature range 20 ° C to 100 ° C can be specified. Likewise accelerating acts any circulation of the silicone solubilizer according to the invention, for example by pumping, shaking or by the
Einwirkung von Ultraschall. In einer bevorzugten Action of ultrasound. In a preferred
Ausführungsform beträgt die Einwirkzeit bei Raumtemperatur unter Verwendung von Ultraschall zwischen 10 s und 5 min. In einer weiteren bevorzugten Ausführungsform beträgt die  Embodiment is the exposure time at room temperature using ultrasound between 10 s and 5 min. In a further preferred embodiment, the
Einwirkzeit bei 50 °C - 120 °C unter der Verwendung von Exposure time at 50 ° C - 120 ° C using
Ultraschall zwischen 10 s und 3 min. Ultrasound between 10 s and 3 min.
Nach der Einwirkzeit werden die Spaltprodukte mit Lösungsmittel ohne Zusätze abgewaschen, welches identisch mit dem bei der Auflösungsreaktion verwendeten Lösungsmittel C) sein kann aber nicht muss . Beispiele After the reaction time, the cleavage products are washed off with solvent without additives, which may or may not be identical to the solvent C) used in the dissolution reaction. Examples
Die Erfindung wird durch die folgenden Beispiele  The invention is illustrated by the following examples
veranschaulicht, ohne dabei einschränkend zu wirken. Die angegebenen Teile beziehen sich, sofern nicht anders angegeben, auf das Gewicht. Die nachstehenden Beispiele werden bei einem Druck der umgebenden Atmosphäre, also etwa bei 1.000 hPa und, sofern nicht anders angegeben, bei Raumptemperatur , also etwa 20 °C, durchgeführt. Bei Applikationsbeispielen zur Auflösung vernetzter Siliconelastomere kann die Angabe „Einwirkung von Ultraschall" durch Einbringen eines Glaskolbens in ein illustrated without being limiting. The parts indicated are by weight unless stated otherwise. The following examples are carried out at a pressure of the surrounding atmosphere, ie at about 1000 hPa and, unless otherwise stated, at room temperature, ie about 20 ° C. In application examples for the dissolution of crosslinked silicone elastomers, the statement "exposure to ultrasound" by introducing a glass flask into a
Ultraschallbad (Bandelin RM 40) , durch das Einbringen eines Ultraschallsonde oder ähnlichem erfolgen.  Ultrasonic bath (Bandelin RM 40), by introducing an ultrasonic probe or the like.
Beispiel 1 : siliconlösende Zusammensetzung 1 Example 1: silicone-dissolving composition 1
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Trinatriumphosphat in 97,45 g 2-Octanon bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst.  Trisodium phosphate dissolved in 97.45 g of 2-octanone at room temperature by stirring within 30 min.
Beispiel 2s siliconlösende Zusammensetzung 2 Example 2s silicone-dissolving composition 2
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Dinatriumhydrogenphosphat in 97,45 g 2-Octanon bei Disodium hydrogen phosphate in 97.45 g of 2-octanone at
Raumtemperatur durch Rühren innerhalb von 30 min gelöst. Room temperature dissolved by stirring within 30 min.
Beispiel 3s siliconlösende Zusammensetzung 3 Example 3s silicone-dissolving composition 3
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Calciumhydroxid in 97,45 g Essigsäure-n-propylester bei  Calcium hydroxide in 97.45 g of acetic acid n-propyl ester at
Raumtemperatur durch Rühren innerhalb von 30 min gelöst. Beispiel 4s siliconlösende Zusammensetzung 4 Room temperature dissolved by stirring within 30 min. Example 4s silicone dissolving composition 4
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Trinatriumphosphat in 97,45 g Essigsäure-n-propylester bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst. Trisodium phosphate dissolved in 97.45 g of n-propyl acetate at room temperature by stirring within 30 min.
Beispiel 5s siliconlösende Zusammensetzung 5 Example 5s silicone dissolving composition 5
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Dinatriumhydrogenphosphat in 97,45 g Essigsäure-n-propylester bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst. Disodium hydrogen phosphate in 97.45 g of n-propyl acetate at room temperature by stirring within 30 min.
Beispiel 5 s siliconlösende Zusammensetzung 6 Example 5 s silicone-dissolving composition 6
Es werden 2,5 g Tetrabutylammoniumfluorid und 0,05 g  There are 2.5 g of tetrabutylammonium fluoride and 0.05 g
Calciumhydroxid in 97,45 g 2-0ctanon bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst. Calcium hydroxide dissolved in 97.45 g of 2-0ctanone at room temperature by stirring within 30 min.
Beispiel 7 : siliconlösende Zusammensetzung 7 (nicht Example 7: silicone dissolving composition 7 (not
erfindungsgemäß) Inventive)
Es werden 2,5 g Tetrabutylammoniumfluorid 97,5 g 2-Octanon bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst.  There are dissolved 2.5 g of tetrabutylammonium fluoride 97.5 g of 2-octanone at room temperature by stirring within 30 min.
Beispiel 8? siliconlösende Zusammensetzung 8 (nicht Example 8? silicone dissolving composition 8 (not
erfindungsgemäß) Inventive)
Es werden 2,5 g Tetrabutylammoniumfluorid 97,5 g Essigsäure-n- propylester bei Raumtemperatur durch Rühren innerhalb von 30 min gelöst.  There are dissolved 2.5 g of tetrabutylammonium fluoride 97.5 g of n-propyl acetate at room temperature by stirring within 30 min.
Beispiel 9; Auflösung einer Polydimethylsiloxan- ZusammensetzungExample 9; Dissolution of a polydimethylsiloxane composition
Jeweils 1 Quadratzentimeter einer 100 um dünnen Schicht einer vernetzten Siliconzusammensetzung (ELASTOSIL® LR 3003/40 von Wacker Chemie AG, München) werden mit jeweils 5 ml Lösung aus den Beispielen 1 bis 8 bei Raumtemperatur überschichtet. Die Zeit bis zur kompletten Auflösung der Folie betrug bei allen Zusammensetzungen jeweils 10-20 Sekunden. Each 1 square centimeter to a 100 thin layer of a crosslinked silicone composition (ELASTOSIL LR 3003/40 ® of Wacker Chemie AG, Munich, Germany) are overlayed with 5 ml each of the solution of Examples 1 to 8 at room temperature. The Time to complete dissolution of the film was 10-20 seconds for each composition.
Beispiel 10s Aluminiumkorrosion Example 10s aluminum corrosion
Zur Beurteilung der Korrosion wurde jeweils 1 Quadratzentimeter einer handelsüblichen Aluminiumfolie in die Lösungen eingelegt und innerhalb der Versuchsreihe zu den angegebenen Zeiten entnommen. Die Beurteilung selbst erfolgte mittels To assess the corrosion, in each case 1 square centimeter of a commercially available aluminum foil was placed in the solutions and removed within the test series at the indicated times. The assessment itself was done by means of
Rasterelektronischer Aufnahmen, wobei in der Tabelle 1 zwischen „Minus" = „-" (keine im REM sichtbare Korrosion) und „Plus" = „+" (sichtbare im REM sichtbare Korrosion, d.h. Lochfraß, stellenweise Auflösung von Aluminium) , unterschieden wird. Scanning electronical recordings, wherein in Table 1 between "minus" = "-" (no visible in the SEM corrosion) and "plus" = "+" (visible visible in the SEM corrosion, ie pitting, localized dissolution of aluminum), a distinction is made.
Tabelle 1 Table 1
Wie aus Tabelle 1 hervorgeht, wurde überraschenderweise gefunden, dass erfindungsgemäße Siliconlöser sich besonders eigenen um bei einer deutlich reduzierten Aluminiumkorrosion Silikonrückstände zu entfernen. Im Normalfall ist bei As is apparent from Table 1, it was surprisingly found that silicone solubilizer according to the invention are particularly peculiar to remove silicone residues at a significantly reduced aluminum corrosion. Normally it is at
Raumtemperatur eine Einwirkzeit von wenigen Minuten  Room temperature, an exposure time of a few minutes
ausreichend .  sufficient .

Claims

Patentansprüche claims
1. Siliconlöser enthaltend 1. containing silicone solvent
A) mindestens eine Tetraalkylamraoniurafluorid, A) at least one tetraalkylammonium fluoride,
B) mindestens eine anorganische Base, die in der Lage ist, Wasserstoffionen zu binden, sowie B) at least one inorganic base capable of binding hydrogen ions, and
C) mindestens ein Lösungsmittel, das geeignet ist, sowohl das Tetraalkylammoniumfluorid A) , als auch mindestens 0,001 Gew.'% der anorganischen Base B) zu lösen. C) at least one solvent which is suitable for both the tetraalkylammonium A), and at least 0.001 wt. '% Of inorganic base B) to be solved.
2. Siliconlöser nach Anspruch 1, wobei 2. A silicone solubilizer according to claim 1, wherein
A) 0,1 - 10 Gew. % A) , A) 0.1-10% by weight of A),
B) 0,001 - 1 Gew. % B) , B) 0.001-1 wt.% B),
C) den Rest der 100 Gew.% des Siliconlösers stellt. C) represents the remainder of the 100% by weight of the silicone solubilizer.
3. Siliconlöser nach Anspruch 2, wobei die Komponente A) ausgewählt wird aus der Gruppe folgender Tetraalkylammoniumverbindungen: 3. The silicone solubilizer according to claim 2, wherein the component A) is selected from the group of the following tetraalkylammonium compounds:
Tetramethylammoniumfluorid, Tetraethylammoniumfluorid,  Tetramethylammonium fluoride, tetraethylammonium fluoride,
Tetrabutylammoniumfluorid, Tetrapentylammoniumfluorid, Tetrabutylammonium fluoride, tetrapentylammonium fluoride,
Tetrahexylammoniumfluorid, Tetraheptylammoniumfluorid, Tetrahexylammonium fluoride, tetraheptylammonium fluoride,
Tetraoctylammoniumfluorid, Tetranonylammoniumfluorid, Tetraoctylammonium fluoride, tetranonylammonium fluoride,
Tetradecylammoniumfluorid, Tetraisopropylammoniumfluorid, Tetradecylammonium fluoride, tetraisopropylammonium fluoride,
Tetraisobutylammoniumfluorid, Tetra (ter-butyl ) ammoniumfluorid, Tetra (tert-pentyl) ammoniumfluorid. Tetraisobutylammonium fluoride, tetra (ter-butyl) ammonium fluoride, tetra (tert-pentyl) ammonium fluoride.
4. Siliconlöser nach Anspruch 2, wobei die Komponente B) ausgewählt wird aus der Gruppe folgender anorganischer Salze: 4. The silicone solubilizer according to claim 2, wherein component B) is selected from the group of the following inorganic salts:
Salze der Phosphorigen- und der Phosphorsäure MoHpPO3 und MoHpPO4, Salze der schwefeligen- und der Schwefelsäure MqHrSO3, MqHrSO4, Salze der salpetrigen- und der Salpetersäure MNO2 und MNO3, wobei M ausgewählt wird aus der Gruppe der Alkali- und Salts of phosphoric and phosphoric acids M o H p PO 3 and M o H p PO 4 , salts of sulfuric and sulfuric acids M q H r SO 3 , M q H r SO 4 , salts of nitrous and nitric acid MNO 2 and MNO 3 , wherein M is selected from the group of alkali and
Erdalkalimetalle sowie einwertiger Kationen. Alkaline earth metals and monovalent cations.
5. Siliconlöser nach Anspruch 2, wobei die Komponente C) ausgewählt wird aus der Gruppe folgender Lösungsmittel : 5. The silicone solubilizer according to claim 2, wherein component C) is selected from the group of the following solvents:
Carbonsäurealkylester, Dialkylether, Alkyl-arylether, Ketone.  Carboxylic acid alkyl esters, dialkyl ethers, alkyl aryl ethers, ketones.
6. Verfahren zur Herstellung des Siliconlösers nach einem der Ansprüche 1 bis 5, durch intensives vermischen der Komponenten A) , B) und C) . 6. A process for the preparation of the silicone solubilizer according to any one of claims 1 to 5, by intensive mixing of the components A), B) and C).
7. Verwendung des erfindungsgemäßen Siliconlösers nach einem der Ansprüche 1 bis 5, zur Depolymerisation und Entfernung von vernetzten oder unvernetzten Siliconrückständen von Oberflächen oder Substraten. 7. Use of the silicone solubilizer according to any one of claims 1 to 5, for the depolymerization and removal of crosslinked or uncrosslinked silicone residues of surfaces or substrates.
EP12795474.1A 2011-12-16 2012-12-06 Silicone solvent Withdrawn EP2791259A1 (en)

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DE102011088885A DE102011088885A1 (en) 2011-12-16 2011-12-16 Silicon remover
PCT/EP2012/074661 WO2013087510A1 (en) 2011-12-16 2012-12-06 Silicone solvent

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