EP2791259A1 - Silicone solvent - Google Patents
Silicone solventInfo
- Publication number
- EP2791259A1 EP2791259A1 EP12795474.1A EP12795474A EP2791259A1 EP 2791259 A1 EP2791259 A1 EP 2791259A1 EP 12795474 A EP12795474 A EP 12795474A EP 2791259 A1 EP2791259 A1 EP 2791259A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- fluoride
- silicone
- salts
- solvent
- solubilizer according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 49
- 239000002904 solvent Substances 0.000 title claims abstract description 46
- -1 hydrogen ions Chemical class 0.000 claims abstract description 19
- 125000005207 tetraalkylammonium group Chemical group 0.000 claims abstract description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 7
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- FPGGTKZVZWFYPV-UHFFFAOYSA-M tetrabutylammonium fluoride Chemical compound [F-].CCCC[N+](CCCC)(CCCC)CCCC FPGGTKZVZWFYPV-UHFFFAOYSA-M 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 8
- 150000001768 cations Chemical class 0.000 claims description 4
- 150000002576 ketones Chemical class 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 3
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 3
- 150000001983 dialkylethers Chemical class 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical class ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001346 alkyl aryl ethers Chemical class 0.000 claims description 2
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 claims description 2
- 229910017604 nitric acid Chemical class 0.000 claims description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N nitrous oxide Inorganic materials [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 2
- 235000011007 phosphoric acid Nutrition 0.000 claims description 2
- 150000003016 phosphoric acids Chemical class 0.000 claims description 2
- OUSREJFRRGRLDE-UHFFFAOYSA-M tetra(nonyl)azanium;fluoride Chemical compound [F-].CCCCCCCCC[N+](CCCCCCCCC)(CCCCCCCCC)CCCCCCCCC OUSREJFRRGRLDE-UHFFFAOYSA-M 0.000 claims description 2
- KMUYKILZAMVROR-UHFFFAOYSA-M tetra(propan-2-yl)azanium;fluoride Chemical compound [F-].CC(C)[N+](C(C)C)(C(C)C)C(C)C KMUYKILZAMVROR-UHFFFAOYSA-M 0.000 claims description 2
- SAVMTTISRBULOZ-UHFFFAOYSA-N tetradecan-1-amine;hydrofluoride Chemical compound F.CCCCCCCCCCCCCCN SAVMTTISRBULOZ-UHFFFAOYSA-N 0.000 claims description 2
- QSUJAUYJBJRLKV-UHFFFAOYSA-M tetraethylazanium;fluoride Chemical compound [F-].CC[N+](CC)(CC)CC QSUJAUYJBJRLKV-UHFFFAOYSA-M 0.000 claims description 2
- YFECTAVBWYHKGE-UHFFFAOYSA-M tetraheptylazanium;fluoride Chemical compound [F-].CCCCCCC[N+](CCCCCCC)(CCCCCCC)CCCCCCC YFECTAVBWYHKGE-UHFFFAOYSA-M 0.000 claims description 2
- AAIWQSJMMIXYGQ-UHFFFAOYSA-M tetrahexylazanium;fluoride Chemical compound [F-].CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC AAIWQSJMMIXYGQ-UHFFFAOYSA-M 0.000 claims description 2
- XNBUJDBFTMTPME-UHFFFAOYSA-M tetrakis(2-methylbutan-2-yl)azanium fluoride Chemical compound [F-].CCC(C)(C)[N+](C(C)(C)CC)(C(C)(C)CC)C(C)(C)CC XNBUJDBFTMTPME-UHFFFAOYSA-M 0.000 claims description 2
- LXWVMXSKHOPXBJ-UHFFFAOYSA-M tetrakis(2-methylpropyl)azanium;fluoride Chemical compound [F-].CC(C)C[N+](CC(C)C)(CC(C)C)CC(C)C LXWVMXSKHOPXBJ-UHFFFAOYSA-M 0.000 claims description 2
- QGAKFUJUPKPDCN-UHFFFAOYSA-M tetraoctylazanium;fluoride Chemical compound [F-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC QGAKFUJUPKPDCN-UHFFFAOYSA-M 0.000 claims description 2
- DMUXGOVRWIDZEU-UHFFFAOYSA-M tetrapentylazanium;fluoride Chemical compound [F-].CCCCC[N+](CCCCC)(CCCCC)CCCCC DMUXGOVRWIDZEU-UHFFFAOYSA-M 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 22
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- 238000004090 dissolution Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002562 thickening agent Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000002604 ultrasonography Methods 0.000 description 4
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N 3-methyl-2-pentanone Chemical compound CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 235000011837 pasties Nutrition 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Chemical group 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LKUDPHPHKOZXCD-UHFFFAOYSA-N 1,3,5-trimethoxybenzene Chemical compound COC1=CC(OC)=CC(OC)=C1 LKUDPHPHKOZXCD-UHFFFAOYSA-N 0.000 description 2
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- HIGGFWFRAWSMBR-UHFFFAOYSA-N 2-Methyl-3-hexanone Chemical compound CCCC(=O)C(C)C HIGGFWFRAWSMBR-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- LFSAPCRASZRSKS-UHFFFAOYSA-N 2-methylcyclohexan-1-one Chemical compound CC1CCCCC1=O LFSAPCRASZRSKS-UHFFFAOYSA-N 0.000 description 2
- IITQJMYAYSNIMI-UHFFFAOYSA-N 3-Methyl-2-cyclohexen-1-one Chemical compound CC1=CC(=O)CCC1 IITQJMYAYSNIMI-UHFFFAOYSA-N 0.000 description 2
- XJLDYKIEURAVBW-UHFFFAOYSA-N 3-decanone Chemical compound CCCCCCCC(=O)CC XJLDYKIEURAVBW-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- RHLVCLIPMVJYKS-UHFFFAOYSA-N 3-octanone Chemical compound CCCCCC(=O)CC RHLVCLIPMVJYKS-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- IYTXKIXETAELAV-UHFFFAOYSA-N Aethyl-n-hexyl-keton Natural products CCCCCCC(=O)CC IYTXKIXETAELAV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical class [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- HYTRYEXINDDXJK-UHFFFAOYSA-N Ethyl isopropyl ketone Chemical compound CCC(=O)C(C)C HYTRYEXINDDXJK-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- RVFBZLFHKFSPRE-UHFFFAOYSA-N N(Cl)(Cl)Cl.[P] Chemical compound N(Cl)(Cl)Cl.[P] RVFBZLFHKFSPRE-UHFFFAOYSA-N 0.000 description 2
- TYBCSQFBSWACAA-UHFFFAOYSA-N Nonan-4-one Chemical compound CCCCCC(=O)CCC TYBCSQFBSWACAA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- UXJHQBVRZUANLK-UHFFFAOYSA-N azanylidyne(dichloro)-$l^{5}-phosphane Chemical class ClP(Cl)#N UXJHQBVRZUANLK-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000019241 carbon black Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 150000004292 cyclic ethers Chemical class 0.000 description 2
- ZAJNGDIORYACQU-UHFFFAOYSA-N decan-2-one Chemical compound CCCCCCCCC(C)=O ZAJNGDIORYACQU-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 2
- 238000011067 equilibration Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- VKCYHJWLYTUGCC-UHFFFAOYSA-N nonan-2-one Chemical compound CCCCCCCC(C)=O VKCYHJWLYTUGCC-UHFFFAOYSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- YLYBTZIQSIBWLI-UHFFFAOYSA-N octyl acetate Chemical compound CCCCCCCCOC(C)=O YLYBTZIQSIBWLI-UHFFFAOYSA-N 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- PJGSXYOJTGTZAV-UHFFFAOYSA-N pinacolone Chemical compound CC(=O)C(C)(C)C PJGSXYOJTGTZAV-UHFFFAOYSA-N 0.000 description 2
- 229940090181 propyl acetate Drugs 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 2
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 2
- 235000019801 trisodium phosphate Nutrition 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- NKJOXAZJBOMXID-UHFFFAOYSA-N 1,1'-Oxybisoctane Chemical compound CCCCCCCCOCCCCCCCC NKJOXAZJBOMXID-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VWGNFIQXBYRDCH-UHFFFAOYSA-N 1,4-diethoxybenzene Chemical compound CCOC1=CC=C(OCC)C=C1 VWGNFIQXBYRDCH-UHFFFAOYSA-N 0.000 description 1
- GDXMMBDEMOUTNS-UHFFFAOYSA-N 1-(diethylamino)propan-2-one Chemical compound CCN(CC)CC(C)=O GDXMMBDEMOUTNS-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- PVBMXMKIKMJQRK-UHFFFAOYSA-N 1-chloro-4-(4-chlorobutoxy)butane Chemical compound ClCCCCOCCCCCl PVBMXMKIKMJQRK-UHFFFAOYSA-N 0.000 description 1
- PZHIWRCQKBBTOW-UHFFFAOYSA-N 1-ethoxybutane Chemical compound CCCCOCC PZHIWRCQKBBTOW-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- VNHGETRQQSYUGZ-UHFFFAOYSA-N 1-nitro-2-phenoxybenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1OC1=CC=CC=C1 VNHGETRQQSYUGZ-UHFFFAOYSA-N 0.000 description 1
- AOPDRZXCEAKHHW-UHFFFAOYSA-N 1-pentoxypentane Chemical compound CCCCCOCCCCC AOPDRZXCEAKHHW-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- FTGZMZBYOHMEPS-UHFFFAOYSA-N 2,2-dimethylcyclopentan-1-one Chemical compound CC1(C)CCCC1=O FTGZMZBYOHMEPS-UHFFFAOYSA-N 0.000 description 1
- VLNUTKMHYLQCQB-UHFFFAOYSA-N 2,2-dimethylpentan-3-one Chemical compound CCC(=O)C(C)(C)C VLNUTKMHYLQCQB-UHFFFAOYSA-N 0.000 description 1
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 description 1
- XYYMFUCZDNNGFS-UHFFFAOYSA-N 2-methylheptan-3-one Chemical compound CCCCC(=O)C(C)C XYYMFUCZDNNGFS-UHFFFAOYSA-N 0.000 description 1
- UFQBSPGKRRSATO-UHFFFAOYSA-N 3,3-dimethoxybutan-2-one Chemical compound COC(C)(OC)C(C)=O UFQBSPGKRRSATO-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- AUZFRUHVDNDVJI-UHFFFAOYSA-N 3-acetylpentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)C(C)=O AUZFRUHVDNDVJI-UHFFFAOYSA-N 0.000 description 1
- SUQNVCCJLBQVEI-UHFFFAOYSA-N 3-ethoxycyclopent-2-en-1-one Chemical compound CCOC1=CC(=O)CC1 SUQNVCCJLBQVEI-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- NHMJKYVPXYBHSL-UHFFFAOYSA-N 3-hydroxy-2-methylcyclohex-2-en-1-one Chemical compound CC1=C(O)CCCC1=O NHMJKYVPXYBHSL-UHFFFAOYSA-N 0.000 description 1
- PJCCSZUMZMCWSX-UHFFFAOYSA-N 4,4-Dimethoxy-2-butanone Chemical compound COC(OC)CC(C)=O PJCCSZUMZMCWSX-UHFFFAOYSA-N 0.000 description 1
- DMIIMPQQPXUKOO-UHFFFAOYSA-N 5-methylcyclohexane-1,3-dione Chemical compound CC1CC(=O)CC(=O)C1 DMIIMPQQPXUKOO-UHFFFAOYSA-N 0.000 description 1
- PSBKJPTZCVYXSD-UHFFFAOYSA-N 5-methylheptan-3-one Chemical compound CCC(C)CC(=O)CC PSBKJPTZCVYXSD-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- YNMZZHPSYMOGCI-UHFFFAOYSA-N Aethyl-octyl-keton Natural products CCCCCCCCC(=O)CC YNMZZHPSYMOGCI-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Chemical class 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- CEQGYPPMTKWBIU-UHFFFAOYSA-N Octyl propanoate Chemical compound CCCCCCCCOC(=O)CC CEQGYPPMTKWBIU-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- ZCZSIDMEHXZRLG-UHFFFAOYSA-N acetic acid heptyl ester Natural products CCCCCCCOC(C)=O ZCZSIDMEHXZRLG-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000005599 alkyl carboxylate group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical class [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical compound CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000001768 carboxy methyl cellulose Chemical class 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Chemical class 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- DBOVMTXPZWVYAQ-UHFFFAOYSA-N cycloheptane-1,3-dione Chemical compound O=C1CCCCC(=O)C1 DBOVMTXPZWVYAQ-UHFFFAOYSA-N 0.000 description 1
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical compound O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 1
- MKJDUHZPLQYUCB-UHFFFAOYSA-N decan-4-one Chemical compound CCCCCCC(=O)CCC MKJDUHZPLQYUCB-UHFFFAOYSA-N 0.000 description 1
- GRTGGSXWHGKRSB-UHFFFAOYSA-N dichloromethyl methyl ether Chemical compound COC(Cl)Cl GRTGGSXWHGKRSB-UHFFFAOYSA-N 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- DXVYLFHTJZWTRF-UHFFFAOYSA-N ethyl iso-butyl ketone Natural products CCC(=O)CC(C)C DXVYLFHTJZWTRF-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- JPXGPRBLTIYFQG-UHFFFAOYSA-N heptan-4-yl acetate Chemical compound CCCC(CCC)OC(C)=O JPXGPRBLTIYFQG-UHFFFAOYSA-N 0.000 description 1
- BGYICJVBGZQOCY-UHFFFAOYSA-N heptyl propanoate Chemical compound CCCCCCCOC(=O)CC BGYICJVBGZQOCY-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- GOKKOFHHJFGZHW-UHFFFAOYSA-N hexyl propanoate Chemical compound CCCCCCOC(=O)CC GOKKOFHHJFGZHW-UHFFFAOYSA-N 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- MQWCXKGKQLNYQG-UHFFFAOYSA-N methyl cyclohexan-4-ol Natural products CC1CCC(O)CC1 MQWCXKGKQLNYQG-UHFFFAOYSA-N 0.000 description 1
- YWXLSHOWXZUMSR-UHFFFAOYSA-N octan-4-one Chemical compound CCCCC(=O)CCC YWXLSHOWXZUMSR-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- UHHKSVZZTYJVEG-UHFFFAOYSA-N oxepane Chemical compound C1CCCOCC1 UHHKSVZZTYJVEG-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- TWSRVQVEYJNFKQ-UHFFFAOYSA-N pentyl propanoate Chemical compound CCCCCOC(=O)CC TWSRVQVEYJNFKQ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005554 polynitrile Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- MCSINKKTEDDPNK-UHFFFAOYSA-N propyl propionate Chemical compound CCCOC(=O)CC MCSINKKTEDDPNK-UHFFFAOYSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000005624 silicic acid group Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
- C11D7/16—Phosphates including polyphosphates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
Definitions
- the present invention relates to a composition for depolymerization and removal of silicone residues.
- This composition called a silicone remover, contains a
- Alkylammonium fluoride an inorganic basic salt and a solvent.
- the composition of the invention is particularly suitable for removing crosslinked or uncrosslinked, filled or unfilled silicone residues from sensitive surfaces and substrates.
- the silicone solubilizer can be liquid, pasty or gelatinous in a variety of applications, depending on the application.
- US 5,008,229 is directed to solutions of phosphonitrilic chlorides in an organic solvent and to the use of such compositions for accelerating the
- Reaction products of phosphorus-nitrogen-chloride and octamethylcyclotetrasiloxane often have viscosities exceeding several thousand mPa-s (centipoises), which makes the materials less suitable as catalysts for the removal of polydimethylsiloxane backbones.
- organic acids or alkalis which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for example, organic acids or alkalis, which in the removal of silicones from various substrates, for
- the object of the present invention was therefore a
- composition which is suitable for removing crosslinked and uncrosslinked polysiloxane residues from various substrates or between substrates, at the same time inert to the substrates, and this does not damage or corrode even in a thin layer during the exposure time, to remove the silicone impurities.
- This object has surprisingly been achieved by a silicone solubilizer
- inorganic salts are particularly suitable, the corrosive action of a silicone dissolving composition of an organic tetraalkylammonium fluoride and a solvent
- the silicone solubilizers according to the invention are particularly well suited for removing polysiloxane residues or layers on or between substrates.
- the silicone solubilizers according to the invention have the advantage that they act selectively on silicone polymers or polydimethylsiloxane groups. Other plastics are not affected by the mechanism of the reaction.
- Example of plastics inert to the silicone solubilizer according to the invention :
- Polyolefin polystyrene, polyvinyl chloride, polyethylene,
- Silicone solubilizers according to the invention merely dissolve, for example, addition-crosslinked, condensation-crosslinked and peroxydically crosslinked silicone rubbers such as RTV-1, RTV-2, LSR and HTV.
- the silicone solubilizer according to the invention also works
- Silicone rubbers depending on the application furthermore
- Contain components such as fillers, for example hydrophilic or hydrophobic silicic acids, precipitated silicas,
- Silicone resins aluminum oxides, titanium oxides, carbon blacks, graphites, metals, metal carbonates, diatomaceous earths, metal dusts, fibers such as glass fibers or plastic fibers and other additives such as fungicides, fragrances, corrosion inhibitors,
- Oxidation inhibitors light stabilizers, flame retardants, dispersing agents, adhesion promoters,
- component A) corresponds to the general formula (1): wherein
- the compounds A) have long been known in the art and are commercially available. examples for
- preferred compounds A) are: tetramethylammonium fluoride, tetraethylammonium fluoride, tetrabutylammonium fluoride,
- Tetrapentylammonium fluoride Tetrapentylammonium fluoride, tetrahexylammonium fluoride,
- Tetraheptylammonium fluoride Tetraheptylammonium fluoride, tetraoctylammonium fluoride,
- Tetraisopropylammonium fluoride Tetraisobutylammonium fluoride, tetra (ter-butyl) ammonium fluoride, tetra (tert-pentyl) ammonium fluoride.
- M are sodium, potassium, magnesium, calcium and ammonium.
- Particularly preferred compounds B) are Na 3 PO 4 , Na 2 HPO 4 , NaH 2 PO 4 , MgHPO 4 , Mg 3 (PO 4 ) 2, (NH 4 ) H 2 PO 4 , (NH 4 ) 2 HPO 4 , ( NH 4 ) 3 PO 4 .
- Component C) is a solvent which is capable of dissolving component A) and at least 0.001% by weight of component B).
- Examples of the component C) are linear, branched and cyclic ethers which may also contain other heteroatoms such as nitrogen, phosphorus or halogen atoms.
- dialkyl ethers diethyl ether, di-n-propyl ether, diisopropyl ether, dibutyl ether, dipentyl ether, dihexyl ether, dioctyl ether, 2-ethylhexyl vinyl ether, 4-chlorobutyl ether, dichloromethyl methyl ether, 1, 2 -Dirnethoxypropan, tert. - Amyl methyl ether, tert. Butyl ethyl ether, di-sec. butyl ether, tetraethylene glycol dimethyl ether; cyclic ethers:
- Oxacyclopentane tetrahydrofuran
- Benzopyran 1-4-dioxane
- Ethers containing aromatic groups methyl phenyl ether, 2-nitrophenyl phenyl ether,, 4-dimethoxybenzene, 1, 3, 5-trimethoxybenzene, butyl phenyl ether, 1, 4 -Diethoxybenzol.
- Another class of compounds which can preferably be used as component C) is the substance class of the ketones which contains linear, branched and cyclic compounds which may additionally contain further heteroatoms such as nitrogen, phosphorus or halogen atoms. Particularly preferred are linear and branched aliphatic molecules.
- ketones within the meaning of component C are listed below:
- Another class of compounds that can be used preferably as component C) is the class of esters containing linear, branched and cyclic compounds which
- hetero atoms such as nitrogen, phosphorus or May contain halogen atoms.
- hetero atoms such as nitrogen, phosphorus or May contain halogen atoms.
- Esters which are considered to be dipolar aprotic solvents are considered to be dipolar aprotic solvents.
- esters within the meaning of component C are listed below:
- C) is selected from the group of the following
- Solvents alkyl carboxylates, dialkyl ethers, alkyl aryl ethers, ketones.
- C) selected from the group: ethyl acetate, propyl acetate,
- silicone solvents according to the invention may contain thickener D) in order to adjust the viscosity and, for example, prepare pasty masses.
- thickeners D) are: precipitated silica, hydrophilic or hydrophobic finely divided silica,
- Alumina, titania, calcium salts of carboxylic acids, carbon blacks or carboxymethylcellulose It is possible to use all thickeners D) known from the prior art which have a water content of less than 5000 ppm. Prefers the water content should be below 2500 ppra and
- Component A) and the silicone solvent would lose its equilibrium property.
- D) is preferred from the
- the preparation of the silicone solvent according to the invention is carried out by mixing A) with B) and C) and possibly D) ideally until the formation of a clear solution.
- the mixing is usually carried out by intensive stirring of the components between 0.5 and 10 hours at room temperature or elevated temperature (up to 140 ° C).
- thickeners D are used, this is done by adjusting the viscosity of the silicone solubilizer according to the invention to a defined range. This is the
- Thickener D in amounts of 0.1 to 30 wt.% Used to 100 wt.% Silicone Solvent. From 0.5 to 10% by weight and more preferably from 1 to 5% by weight of D) are preferably added.
- Another object of the present invention is the use of the silicone solubilizer according to the invention for
- the exposure time can be between 10 s and several hours. In a preferred
- the exposure time is between 30 s and 10 min.
- Solvent C temperatures between 20 ° C and 150 ° C can be applied, wherein as a preferred temperature range 20 ° C to 100 ° C can be specified. Likewise accelerating acts any circulation of the silicone solubilizer according to the invention, for example by pumping, shaking or by the
- Embodiment is the exposure time at room temperature using ultrasound between 10 s and 5 min.
- the exposure time at room temperature using ultrasound between 10 s and 5 min.
- the cleavage products are washed off with solvent without additives, which may or may not be identical to the solvent C) used in the dissolution reaction.
- Ultrasonic bath (Bandelin RM 40), by introducing an ultrasonic probe or the like.
- Trisodium phosphate dissolved in 97.45 g of 2-octanone at room temperature by stirring within 30 min.
- Trisodium phosphate dissolved in 97.45 g of n-propyl acetate at room temperature by stirring within 30 min.
- Example 7 silicone dissolving composition 7 (not
- Example 9 Dissolution of a polydimethylsiloxane composition
- silicone solubilizer according to the invention are particularly peculiar to remove silicone residues at a significantly reduced aluminum corrosion. Normally it is at
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- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Emergency Medicine (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Detergent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011088885A DE102011088885A1 (en) | 2011-12-16 | 2011-12-16 | Silicon remover |
PCT/EP2012/074661 WO2013087510A1 (en) | 2011-12-16 | 2012-12-06 | Silicone solvent |
Publications (1)
Publication Number | Publication Date |
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EP2791259A1 true EP2791259A1 (en) | 2014-10-22 |
Family
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Family Applications (1)
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EP12795474.1A Withdrawn EP2791259A1 (en) | 2011-12-16 | 2012-12-06 | Silicone solvent |
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US (1) | US9309488B2 (en) |
EP (1) | EP2791259A1 (en) |
JP (1) | JP5951796B2 (en) |
KR (1) | KR101636390B1 (en) |
CN (1) | CN103998537B (en) |
DE (1) | DE102011088885A1 (en) |
TW (1) | TW201326385A (en) |
WO (1) | WO2013087510A1 (en) |
Families Citing this family (18)
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KR101974224B1 (en) * | 2012-11-09 | 2019-05-02 | 동우 화인켐 주식회사 | Composition for removing an adhesive polymer |
WO2014205285A1 (en) * | 2013-06-20 | 2014-12-24 | Dow Corning Corporation | Method of removing silicone resin from a substrate |
US10894935B2 (en) | 2015-12-04 | 2021-01-19 | Samsung Electronics Co., Ltd. | Composition for removing silicone resins and method of thinning substrate by using the same |
MX2018009954A (en) | 2016-02-18 | 2018-11-29 | Ecolab Usa Inc | Solvent application in bottle wash using amidine based formulas. |
WO2019211050A1 (en) | 2018-05-03 | 2019-11-07 | Hfc Prestige International Holding Switzerland S.A.R.L | Multicomponent composition |
EP3817710A1 (en) * | 2018-07-06 | 2021-05-12 | HFC Prestige International Holding Switzerland S.a.r.l. | Multicomponent silicone composition |
US11766394B2 (en) | 2018-07-06 | 2023-09-26 | Wella International Operations Switzerland Sarl | Multicomponent composition (Michael addition) |
US11904042B2 (en) | 2018-07-06 | 2024-02-20 | HFC Prestige International Holding Switzerland S.a.r.l. | Hair coloring composition and methods for its application and removal |
JP7219423B2 (en) * | 2019-02-15 | 2023-02-08 | 日産化学株式会社 | Cleaning composition and cleaning method |
WO2020166703A1 (en) * | 2019-02-15 | 2020-08-20 | 日産化学株式会社 | Cleaning agent composition and cleaning method |
KR102181219B1 (en) * | 2019-04-19 | 2020-11-20 | 동우 화인켐 주식회사 | Composition for removing an adhesive polymer |
WO2021039274A1 (en) | 2019-08-27 | 2021-03-04 | 昭和電工株式会社 | Composition, and method for cleaning adhesive polymer |
JP7284460B2 (en) * | 2019-11-20 | 2023-05-31 | 日産化学株式会社 | A method for producing a cleaning composition, a method for producing a container containing a cleaning composition, and a method for filling and storing a cleaning composition in a container |
JP7299564B2 (en) * | 2019-11-20 | 2023-06-28 | 日産化学株式会社 | Method for improving detergency of detergent composition, method for producing detergent composition, and detergent composition |
KR102192954B1 (en) * | 2020-03-26 | 2020-12-18 | 동우 화인켐 주식회사 | Composition for cleaning polymer |
CN115427547A (en) | 2020-04-09 | 2022-12-02 | 昭和电工株式会社 | Composition and method for cleaning adhesive polymer |
JP2024505552A (en) * | 2021-02-01 | 2024-02-06 | ボーリング・グリーン・ステート・ユニバーシティ | Fluoride-catalyzed polysiloxane depolymerization |
CN116024056A (en) * | 2021-10-25 | 2023-04-28 | 中国石油化工股份有限公司 | Dissolving agent for acetaldehyde polymerization deterioration product, and preparation method and application thereof |
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JPH08250400A (en) | 1995-03-14 | 1996-09-27 | Mitsubishi Electric Corp | Removing method for silicone resin |
JPH10251566A (en) | 1997-03-13 | 1998-09-22 | Toshiba Silicone Co Ltd | Dissolvent for polyorganosiloxane-based cured product and removal of the same cured product |
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KR100655647B1 (en) | 2005-07-04 | 2006-12-08 | 삼성전자주식회사 | Cleaning composition for a semiconductor substrate, method of preparing the cleaning composition, method of cleaning a semiconductor substrate and method of manufacturing a semiconductor device using the cleaning composition |
TW200722505A (en) * | 2005-09-30 | 2007-06-16 | Rohm & Haas Elect Mat | Stripper |
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JP4499751B2 (en) * | 2006-11-21 | 2010-07-07 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | Formulation for removing photoresist, etch residue and BARC and method comprising the same |
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KR101416103B1 (en) * | 2007-11-12 | 2014-07-09 | (주)코미코 | Cleaning solution for removing impurity and method of removing impurity using the same |
US7687447B2 (en) * | 2008-03-13 | 2010-03-30 | Air Products And Chemicals, Inc. | Semi-aqueous stripping and cleaning composition containing aminobenzenesulfonic acid |
-
2011
- 2011-12-16 DE DE102011088885A patent/DE102011088885A1/en not_active Withdrawn
-
2012
- 2012-12-05 TW TW101145600A patent/TW201326385A/en unknown
- 2012-12-06 EP EP12795474.1A patent/EP2791259A1/en not_active Withdrawn
- 2012-12-06 US US14/362,783 patent/US9309488B2/en not_active Expired - Fee Related
- 2012-12-06 CN CN201280062299.2A patent/CN103998537B/en not_active Expired - Fee Related
- 2012-12-06 WO PCT/EP2012/074661 patent/WO2013087510A1/en active Application Filing
- 2012-12-06 JP JP2014546428A patent/JP5951796B2/en not_active Expired - Fee Related
- 2012-12-06 KR KR1020147015999A patent/KR101636390B1/en active IP Right Grant
Non-Patent Citations (1)
Title |
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See references of WO2013087510A1 * |
Also Published As
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US20140336093A1 (en) | 2014-11-13 |
JP5951796B2 (en) | 2016-07-13 |
KR20140096362A (en) | 2014-08-05 |
CN103998537B (en) | 2016-08-17 |
DE102011088885A1 (en) | 2013-06-20 |
CN103998537A (en) | 2014-08-20 |
JP2015505886A (en) | 2015-02-26 |
KR101636390B1 (en) | 2016-07-05 |
WO2013087510A1 (en) | 2013-06-20 |
US9309488B2 (en) | 2016-04-12 |
TW201326385A (en) | 2013-07-01 |
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