EP2780133A1 - Method and apparatus for optimally laser marking articles - Google Patents

Method and apparatus for optimally laser marking articles

Info

Publication number
EP2780133A1
EP2780133A1 EP11875962.0A EP11875962A EP2780133A1 EP 2780133 A1 EP2780133 A1 EP 2780133A1 EP 11875962 A EP11875962 A EP 11875962A EP 2780133 A1 EP2780133 A1 EP 2780133A1
Authority
EP
European Patent Office
Prior art keywords
laser
mark
article
pulse
laser marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11875962.0A
Other languages
German (de)
French (fr)
Other versions
EP2780133A4 (en
Inventor
James Brookhyser
Kyle Ball
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP2780133A1 publication Critical patent/EP2780133A1/en
Publication of EP2780133A4 publication Critical patent/EP2780133A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355Texturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24Ablative recording, e.g. by burning marks; Spark recording
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles ; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic materials
    • B23K2103/42Plastics other than composite materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used

Definitions

  • the present invention relates to laser marking articles.
  • it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating.
  • the mark may also be formed by laser ablating the first or topmost coating layer to reveal a second coating layer underneath forming the mark by the contrast between the revealed second coating and adjacent first coating.
  • Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput.
  • the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput.
  • a mark is defined as contiguous region or area on the surface of the article which contrasts visually with the adjacent surface. Desirable attributes for marking include consistent appearance, durability, and ease of application. Appearance refers to the ability to reliably and repeatably render a mark with a selected shape and uniform color and optical density. Durability is the quality of remaining unchanged in spite of abrasion to the marked surface. Ease of application refers to the cost in materials, time and resources of producing a mark including programmability. Programmability refers to the ability to program the marking device with a new pattern to be marked by changing software as opposed to changing hardware such as screens or masks.
  • Covering an article with two or more layers of coatings and laser ablating a first coating to reveal a second coating underneath is another desirable way to create marks.
  • Laser ablation threshold is the minimum energy required to cause removal of material. This removal may be ablative, where enough energy is put into the material by the laser to cause the material to disassociate into plasma, or thermal, where the material is essentially melted and vaporized, or a combination of the two.
  • the damage threshold is the minimum laser energy required to cause an undesirable change in the appearance of the material.
  • the damage threshold for materials is generally lower and sometimes much lower than the ablation threshold. We define damage as any undesirable change in the appearance of the materials that comprise the article or under lying coating following laser removal of the topmost layer.
  • laser fluence In order to cleanly and completely remove a top layer of material leaving the surface of the article undamaged, laser fluence must be greater than the ablation threshold for the overlying material and less than the ablation or damage threshold for the underlying material or surface of the article. In many cases this difference may be small, requiring precise control of laser fluence.
  • the actual values for ablation and damage thresholds for these materials may vary depending upon location and slight variations in application. Also, actual values for ablation and damage thresholds for these materials may vary as a function of time; as the article is
  • heat generated by the laser removal process may be retained by the article or coatings and influence the ablation or damage thresholds. Therefore, while a single laser fluence may be selected that permits commercially desirable marking to be performed on a particular article at a particular time with a particular laser, any small change in the article or coatings or laser could result in the process no longer producing desirable results.
  • the difference between the minimum fluence that will result in ablation of desired materials and avoid damage to underlying materials is called a process window. In manufacturing it is highly desirable to increase the process window for a particular article and mark to the greatest practical extent in order to handle variations in materials and processing systems without requiring system adjustments which negatively affect system throughput.
  • aspects of this invention create a mark with desired properties on coated articles using a laser marking system.
  • the laser marking system is provided with a controllable beam attenuator that transmits the laser beam at a first attenuation level and then, after a predetermined time interval, changes the attenuation to a second attenuation level thereby creating a laser mark with desired properties.
  • Adding a controllable beam attenuator permits controllable laser fluence. Fluence is defined as the cumulative laser energy applied per unit area and is measured in Joules/cm 2 .
  • Aspects of this invention provide a first laser fluence associated with creating a mark with desired properties on a first portion of the mark.
  • Aspects of this invention then provide a second laser fluence associated with creating a mark with desired properties on a second portion of the mark, thereby creating marks with desired properties.
  • Creating marks on a coated article by ablating a top coating layer to reveal an under layer which may be another coating or the surface of the article requires that the ablation threshold for the material to be ablated be lower than the ablation threshold for the material underneath. In most cases this can be arranged by appropriate selection of materials. For example, a topmost coating or paint that is darker, or less reflective than the under layer will absorb more laser energy and typically will ablate at a lower fluence threshold than the under layer.
  • aspects of this invention consider damage thresholds when marking in order to create marks with desirable appearance.
  • irradiance is adjusted to maximize material removal rates without damaging underlying materials.
  • the irradiance combined with the tool path determines the fluence, since the irradiance measures the rate at which energy is applied to the surface of the article and the tool path indicates how much time the laser beam will directed to each point on the mark.
  • the irradiance and tool path of the laser beam is calculated to be above the ablation threshold of the material to be removed and below the damage threshold of the underlying material while maximizing the rate of travel of the laser beam with respect to the article in order to maximize throughput.
  • Fig 2 shows the results of laser marking an article with a single irradiance and rate of travel, wherein the results are uneven and commercially unacceptable. Choosing a single set of laser parameters which results in commercially desirable appearing mark may be possible but the resulting rate of material removal must not exceed the fastest acceptable removal rate for the all portions of the mark, resulting in unacceptably low throughput. Aspects of this invention provide greater laser fluences at the start of each set of laser pulses in order to remove material that typically remains if a single laser fluence is used.
  • the damage threshold for a material at a particular location is not only dependent upon the laser irradiance being currently directed at the location but also on the recent history of exposure to laser radiation. Therefore simply measuring laser fluence will not properly predict the appearance of the material following laser processing. This is because previous irradiation of the location or nearby locations will tend to heat the material. Based on the calculated residual heating, aspects of this invention alter the laser fluence to compensate for the decreased damage threshold caused by previous laser irradiation by increasing the fluence of the initial laser pulses in a group of laser pulses.
  • aspects of this invention control various laser parameters including laser pulse parameters such as pulse duration or pulse repletion rate, or tool path parameters such as spot size, laser beam location, laser beam speed in order to increase throughput of a laser marking system while avoiding damage to underlying materials.
  • laser pulse parameters such as pulse duration or pulse repletion rate
  • tool path parameters such as spot size, laser beam location, laser beam speed in order to increase throughput of a laser marking system while avoiding damage to underlying materials.
  • a laser is selected and the power, rep rate, pulse temporal shape and pulse duration are selected to provide desired material removal rates.
  • a tool path, or locations and times at which the laser will irradiate the article to form the mark, is then calculated to provide the desired material removal rate while avoiding damage to the underlying material.
  • One tool path calculation is the spacing between subsequent pulses on the article which is controlled by changing the speed of the relative motion between the laser pulses and the article.
  • Another tool path calculation is spot size which controls the irradiance by moving the focal spot in the Z axis to point above or below the surface of the article.
  • a further tool path calculation calculates the spacing between adjacent rows of pulse locations. A tool path is selected which will cover the area to be marked in lines to be traveled in a raster fashion.
  • aspects of this invention control the output of the laser.
  • laser pulse fluence should be attenuated very precisely under the control of the laser marking system.
  • aspects of this invention control the laser irradiance with sufficient precision to permit tool paths which create marks with commercially desirable uniformity, color, texture and shape.
  • An optical switch is used to switch the laser beam on and off rapidly without requiring the laser to be turned off and on.
  • aspects of this invention use an acousto-optic modulator (AOM) to modulate the beam precisely and quickly and thereby direct the beam either to impinge the article or travel harmlessly to a beam dump.
  • AOM acousto-optic modulator
  • aspects of this invention are implemented by adapting an existing laser micromachining system, the ESI Model ML5900 Laser Micromachining System, manufactured by Electro Scientific Industries, Inc., Portland, OR 97229.
  • This system is described in detail in the "ESI Service Guide ML5900", part number 178472A, published October 2009, Electro Scientific Industries, Inc., Portland, OR 97229, and is included herein in its entirety by reference.
  • Adaptations include addition of an electro-optic device to permit more precise control of laser fluence in real time along with software to control these changes in fluence.
  • a method for creating a visible mark with desirable commercial qualities on a coated article and apparatus adapted to perform the method is disclosed herein. Included is a laser processing system having a laser, laser optics, and motion stages all operatively connected to a controller with stored, predetermined laser pulse parameters. Stored laser pulse parameters associated with the desired fluence selected depending upon which region of the mark is being processed to create marks with commercially desirable properties.
  • An embodiment of this invention creates a mark with desired properties on coated articles using a laser marking system.
  • the laser marking system has
  • Embodiments of this invention determine a first laser fluence associated with creating a mark with desired properties on a first portion of the mark. Aspects of this invention then determine a second laser fluence associated with creating a mark with desired properties on a second portion of the mark. These fluences are then stored in the laser marking system's storage. The laser marking system is then directed to mark the article using the stored first laser fluence in the first portion of the mark and using the stored second laser fluence in a second portion of the mark thereby marking the article with desired properties.
  • Embodiments of this invention control laser fluence by controlling various laser parameters including laser pulse parameters such as pulse duration or pulse repletion rate, and tool path parameters such as spot size, laser beam location, or laser beam speed in order to increase throughput of a laser marking system while avoiding damage to underlying materials.
  • laser pulse parameters such as pulse duration or pulse repletion rate
  • tool path parameters such as spot size, laser beam location, or laser beam speed
  • a laser is selected and the power, rep rate, pulse temporal shape and pulse duration are selected to provide desired material removal rates.
  • a tool path is then calculated to provide the desired material removal rate while avoiding damage to the underlying material.
  • embodiments of this invention provide increased laser pulse fluence for the beginning few laser pulses in a set of laser pulses in order to remove material that would otherwise remain on the surface of the article.
  • Embodiments of this invention control the output of the laser.
  • laser pulses should be attenuated very precisely under the control of the laser marking system.
  • Aspects of this invention control the laser irradiance with sufficient precision to permit tool paths which create marks with commercially desirable uniformity, color, texture and shape.
  • Aspects of this invention use an acousto-optic modulator (AOM) to modulate the beam precisely and quickly without requiring the laser to be turned on and off.
  • An embodiment of this invention employs an AOM to modulate the fluence of the laser beam by diffractively redirecting the laser beam from its normal path to a beam dump where the laser beam energy is harmlessly dissipated rather than be directed to the article surface.
  • An AOM is used because it is capable of modulating the laser beam very quickly. Fast modulation is advantageous for embodiments of this invention because it allows the laser marking system to turn the laser beam on and off rapidly and accurately without disturbing the laser itself.
  • Fig 1 shows a tool path used to remove a coating from an article.
  • An article 30 is coated with a coating 31 to be removed within a shaped area 32.
  • the laser begins removing material along the tool path 33 at its start point 34 and removes material as it moves to point 36, represented by the solid line.
  • point 36 the laser is turned off and the laser marking system re-positions the laser beam with respect to the article so that when the laser turns on, it begins removing material at point 38, represented by the dotted line.
  • the laser then proceeds to cut and re-position until the end point 39 is reached.
  • Fig 2 shows the results of removing material as shown in Fig 1.
  • the article 40, with a coating 42 has had the coating removed from the area of the mark 44, exposing material underneath 46.
  • Fig 3 is a microphotograph showing this effect.
  • an article 50 has been coated with a silver coating covered by a layer of black paint 51.
  • a laser has been used to remove the black paint in an area 52.
  • some black paint residue 54 remains in the area 52 where black paint was supposed to have been removed by the laser.
  • Fig 4a shows is a graph of pulse energy vs. time showing groups of prior art laser pulses.
  • the laser pulses would start 62 when the laser beam was positioned at 34, with the pulses ending at 64 when the laser beam reached the end of that stroke 36.
  • the laser beam is repositioned 38 and the laser pulses started again 66.
  • material removal is incomplete.
  • a pulse fluence might be found that removes the material 51 without leaving debris 54
  • the laser fluence used to form the mark in Fig 4a is outside the process window for that particular article at that particular time with that particular laser.
  • An embodiment of this invention solves this problem my tailoring the group pulse profile to provide more energy at the beginning of a stroke while maintaining the specified energy for the remaining portion of the stroke. Tailoring the pulse group envelope in this fashion to form a tailored pulse profile permits commercially desirable marking while maintaining system throughput by using a higher energy pulses at the beginning of the pulse group before changing to pulses with a preselected lower energy to complete the pulse group.
  • This tailored pulse profile creates wider process windows by permitting the use of lower laser fluences without leaving debris. A wider process window permits higher system throughput by reducing the need for system adjustments.
  • An exemplary tailored pulse profile is shown in Fig 4b. In Fig 4b, two groups of tailored pulses 70 are shown. The pulse group 70 starts at time 74 with three pulses 72 at power P2.
  • each group of pulses is tailored in this fashion to have a predetermined number of pulses of predetermined energy emitted at the beginning of each stroke of the laser beam.
  • Fig 5 shows an article 100 coated with a coating 102 with a shape boundary 104 which has been laser processed to remove the coating 106 within the boundary 194 by a tailored pulse groups in accordance with embodiments of this invention. Note that no debris apparently remains nor has damage occurred anywhere on the mark.
  • Fig 6 is a microphotograph of a similar coated article 110 which has been coated with black paint 1 12 that has been laser processed by an embodiment of this invention to cleanly and quickly remove the black paint 1 12 over a desired area to reveal silver paint underneath 114. Note the apparent lack of debris or damage to the underlying surface.
  • Fig 7 shows a diagram of an adapted ESI Model ML5900 laser micromachining system 120 adapted for marking articles as an embodiment of the instant invention.
  • Adaptations include a laser 122, and an AOM fluence attenuator 124.
  • Laser pulses are emitted by the laser 122 and directed by a series of mirrors and other optical elements (not shown) to the AOM 124 fluence attenuator and thereafter directed by another series of mirrors and optical elements (not shown) to the optical head 128.
  • the AOM fluence attenuator includes control electronics which control the fluence of transmitted laser pulses under the direction of the controller 140.
  • the optical head includes the X, Y and Z motion control elements 130 and the galvanometer block 132.
  • the article 138 is fixtured by the rotary stage element 134 which indexes the article 138 from the load/unload position to a position beneath the optical head 138, where it is marked, and then to an optional inspection station 136 where it is inspected prior to indexing back to the load/unload station for unloading.
  • controller 140 which coordinates the operation of the laser 122, the AOM fluence attenuator 124, the motion control elements 130, the galvanometer block 132 and the rotary stage 134 to direct the appropriate laser fluence to the appropriate locations on the article 136 to create a mark with commercially desirable appearance.
  • the adapted laser 122 is a diode pumped Nd: YVO 4 solid state laser operating at a frequency tripled 355 nm wavelength model Vanguard manufactured by Spectra- Physics, Santa Clara, California 95054.
  • the laser 122 is configured to yield up to 2.5 W, but is generally run at an 80 MHz mode locked pulse repetition rate which yields a power of about 1 W.
  • Lasers with power of 0.5 Watts to 100 Watts or more preferably 0.5 Watts to 12 Watts may be used advantageously by embodiments of this invention.
  • Laser repetition rates of 10 KHz to 500 MHz or more preferably 1 MHz to 100 MHz may be used.
  • the laser 122 produces laser pulses with duration of about 1 picosecond to 1 ,000 nanoseconds or more preferably 100 picoseconds to nanosecond to 100 nanoseconds in cooperation with controller 100. Pulse temporal and spatial distributions are typically Gaussian. Motion control elements 130 and galvanometer block 132 combine to provide beam positioning capability with respect to the article. Embodiments of this invention use laser spots as measured on the article ranging from 5 microns to 500 microns, or more preferably in the range from 10 microns to 100 microns.
  • the system uses beam speeds, or relative motion between the laser beam and the article in the range of 10 mm/s to 1 m/s, or more preferably in the range of 50 mm/s to 500 mm/s.
  • the pitch, or spacing between adjacent lines of laser pulses can range from 1 micron to 250 microns, or more preferably in the range from 10 microns to 50 microns.
  • Fig 8 shows an electronic circuit employed to adapt a laser processing system to operate according to an embodiment of this invention.
  • Fig 8 shows an input signal 150 from the controller 140 that indicates the start of a laser beam stroke. This signal is typically a logical signal that indicates TRUE/FALSE with voltage levels.
  • the input signal 150 indicates TRUE, or the beginning of a stroke, the signal is passed to the AOM controller 162 trigger input "T". This indicates that the AOM is active and should be energized to transmit laser pulses.
  • the AOM controller 162 also has an analog voltage input "A” which causes the AOM controller 162 to emit a signal 164 to the AOM (not shown) to transmit laser energy in proportion to the voltage appearing at "A".
  • the trigger signal 150 is also sent to a pulse circuit 154 which produces a pulse with a programmable duration.
  • This pulse is passed to an amplifier 156 which amplifies the pulse produced by pulse circuit 154 to a programmable voltage level.
  • This amplified pulse is conditioned by the signal conditioning filter 158 to remove any undesired components and then combined by the summation circuit 160 with the original pulse voltage 152 output by the controller 140 and sent to the "A" input of the AOM controller 162 for eventual output 164 to the AOM (not shown).
  • Figs 4b and c show the tailored laser pulse groups output from a laser controlled by an AOM control circuit such as Fig 8.
  • the tailored pulse groups 70 have pulses 72 with energy P1 at the beginning of the group and pulses 78 with energy P2 for the rest of the group.
  • Fig 4c shows the tailored pulse groups resulting when the analog input 152 to the circuit in Fig 8 is lowered to a level which produces laser pulses with energy P3. Note that with this embodiment, the energy level of the laser pulses at the beginning of the stroke have constant energy depending upon the programmed setting of amplifier 156.
  • Fig 9 show an additional electronic circuit employed to adapt a laser processing system to operate according to an embodiment of this invention.
  • the trigger input 170 from the controller 140 is sent to the trigger input "T" of the AOM controller 182 and to a pulse circuit 172 that generates a programmable duration pulse from the start of the trigger signal.
  • This pulse is sent to an analog switch 174 which gates the analog signal 172 from the controller 140 that has been amplified by an amplifier 176 with programmable gain.
  • the analog switch 174 transmits the analog signal from 174 when a pulse from pulse circuit 172 is present.
  • the signal then goes to the signal conditioning filter 178 which removes undesired components from the signal and passes it to the combiner 180 which combines the original analog voltage control signal 172 from the controller 140 with the amplified signal from the signal conditioning circuit 178 to form the analog control signal to be sent to the AOM controller 182 for output 184 to the AOM (not shown).
  • This circuit will produce tailored pulses as shown in Fig 4d.
  • Fig 4d shows tailored groups of pulses 90 where the high energy pulses 92 at the beginning of each group 90 are made to be a pre-determined multiple P4 of the energy P3 of the predetermined pulses 94.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)

Abstract

The present invention relates to laser marking articles. In particular it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating. Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput. In particular the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput.

Description

METHOD AND APPARATUS FOR OPTIMALLY LASER MARKING ARTICLES
Technical Field
[0001] The present invention relates to laser marking articles. In particular it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating. The mark may also be formed by laser ablating the first or topmost coating layer to reveal a second coating layer underneath forming the mark by the contrast between the revealed second coating and adjacent first coating. Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput. In particular the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput.
Background of the Invention
[0002] Marketed products commonly require some type of marking on the product for commercial, regulatory, cosmetic or functional purposes. A mark is defined as contiguous region or area on the surface of the article which contrasts visually with the adjacent surface. Desirable attributes for marking include consistent appearance, durability, and ease of application. Appearance refers to the ability to reliably and repeatably render a mark with a selected shape and uniform color and optical density. Durability is the quality of remaining unchanged in spite of abrasion to the marked surface. Ease of application refers to the cost in materials, time and resources of producing a mark including programmability. Programmability refers to the ability to program the marking device with a new pattern to be marked by changing software as opposed to changing hardware such as screens or masks.
[0003] Of particular interest is creating marks on coated or painted articles. Articles made of metal or various types of plastics are often painted or otherwise covered in various industrial coatings to protect and change the appearance of the article's surface. Laser ablating the coating in particular patterns to remove the coating and reveal the surface of the article underneath is a desirable way to create a mark on article.
Covering an article with two or more layers of coatings and laser ablating a first coating to reveal a second coating underneath is another desirable way to create marks.
Marking a product by removing a coating with a laser to reveal the article underneath is discussed in US patent application no. 2008/0152859, inventor Masanori Nagai published June 26, 2008. This method depends upon the brightness of the coating being brighter than the surface of the article. Japanese patent application no. 03- 150842, inventor Iwasaki Noboru, published Oct 29, 1992, describes removing one or more coating layers with a laser to reveal a coating layer underneath.
[0004] One thing that these references have in common is that in order to remove a coating without removing materials beneath the coating layer being removed, the laser ablation threshold for the material being removed must be lower than the laser ablation threshold of the material underneath. Laser ablation threshold is the minimum energy required to cause removal of material. This removal may be ablative, where enough energy is put into the material by the laser to cause the material to disassociate into plasma, or thermal, where the material is essentially melted and vaporized, or a combination of the two. Related to the ablation threshold is the damage threshold. The damage threshold is the minimum laser energy required to cause an undesirable change in the appearance of the material. The damage threshold for materials is generally lower and sometimes much lower than the ablation threshold. We define damage as any undesirable change in the appearance of the materials that comprise the article or under lying coating following laser removal of the topmost layer.
[0005] In order to cleanly and completely remove a top layer of material leaving the surface of the article undamaged, laser fluence must be greater than the ablation threshold for the overlying material and less than the ablation or damage threshold for the underlying material or surface of the article. In many cases this difference may be small, requiring precise control of laser fluence. In addition, the actual values for ablation and damage thresholds for these materials may vary depending upon location and slight variations in application. Also, actual values for ablation and damage thresholds for these materials may vary as a function of time; as the article is
processed, heat generated by the laser removal process may be retained by the article or coatings and influence the ablation or damage thresholds. Therefore, while a single laser fluence may be selected that permits commercially desirable marking to be performed on a particular article at a particular time with a particular laser, any small change in the article or coatings or laser could result in the process no longer producing desirable results. The difference between the minimum fluence that will result in ablation of desired materials and avoid damage to underlying materials is called a process window. In manufacturing it is highly desirable to increase the process window for a particular article and mark to the greatest practical extent in order to handle variations in materials and processing systems without requiring system adjustments which negatively affect system throughput.
[0006] What is desired but undisclosed by the art is a reliable and repeatable method for removing material that does not leave undesired material on the surface of the article or require frequent adjustment of the equipment. What is needed then is a method for reliably and repeatably creating marks having a desired appearance on coated articles using a laser to remove a layer of coating without leaving undesired material on the under laying materials while maintaining acceptable system throughput.
Summary of the Invention
[0007] Aspects of this invention create a mark with desired properties on coated articles using a laser marking system. The laser marking system is provided with a controllable beam attenuator that transmits the laser beam at a first attenuation level and then, after a predetermined time interval, changes the attenuation to a second attenuation level thereby creating a laser mark with desired properties. Adding a controllable beam attenuator permits controllable laser fluence. Fluence is defined as the cumulative laser energy applied per unit area and is measured in Joules/cm2. Aspects of this invention provide a first laser fluence associated with creating a mark with desired properties on a first portion of the mark. Aspects of this invention then provide a second laser fluence associated with creating a mark with desired properties on a second portion of the mark, thereby creating marks with desired properties.
[0008] Creating marks on a coated article by ablating a top coating layer to reveal an under layer which may be another coating or the surface of the article requires that the ablation threshold for the material to be ablated be lower than the ablation threshold for the material underneath. In most cases this can be arranged by appropriate selection of materials. For example, a topmost coating or paint that is darker, or less reflective than the under layer will absorb more laser energy and typically will ablate at a lower fluence threshold than the under layer.
[0009] Aspects of this invention consider damage thresholds when marking in order to create marks with desirable appearance. In order to create marks efficiently, irradiance is adjusted to maximize material removal rates without damaging underlying materials. The irradiance combined with the tool path determines the fluence, since the irradiance measures the rate at which energy is applied to the surface of the article and the tool path indicates how much time the laser beam will directed to each point on the mark. The irradiance and tool path of the laser beam is calculated to be above the ablation threshold of the material to be removed and below the damage threshold of the underlying material while maximizing the rate of travel of the laser beam with respect to the article in order to maximize throughput. The difficulty is that these thresholds can be different for different areas of the mark at different times during the marking process. Laser parameters which provide commercially desirable appearance and acceptable rate of material removal and hence throughput in one area of the mark may damage the underlying material in another area of the mark. Fig 2 shows the results of laser marking an article with a single irradiance and rate of travel, wherein the results are uneven and commercially unacceptable. Choosing a single set of laser parameters which results in commercially desirable appearing mark may be possible but the resulting rate of material removal must not exceed the fastest acceptable removal rate for the all portions of the mark, resulting in unacceptably low throughput. Aspects of this invention provide greater laser fluences at the start of each set of laser pulses in order to remove material that typically remains if a single laser fluence is used.
[0010] The damage threshold for a material at a particular location is not only dependent upon the laser irradiance being currently directed at the location but also on the recent history of exposure to laser radiation. Therefore simply measuring laser fluence will not properly predict the appearance of the material following laser processing. This is because previous irradiation of the location or nearby locations will tend to heat the material. Based on the calculated residual heating, aspects of this invention alter the laser fluence to compensate for the decreased damage threshold caused by previous laser irradiation by increasing the fluence of the initial laser pulses in a group of laser pulses.
[0011] Aspects of this invention control various laser parameters including laser pulse parameters such as pulse duration or pulse repletion rate, or tool path parameters such as spot size, laser beam location, laser beam speed in order to increase throughput of a laser marking system while avoiding damage to underlying materials. A laser is selected and the power, rep rate, pulse temporal shape and pulse duration are selected to provide desired material removal rates. A tool path, or locations and times at which the laser will irradiate the article to form the mark, is then calculated to provide the desired material removal rate while avoiding damage to the underlying material. One tool path calculation is the spacing between subsequent pulses on the article which is controlled by changing the speed of the relative motion between the laser pulses and the article. Another tool path calculation is spot size which controls the irradiance by moving the focal spot in the Z axis to point above or below the surface of the article. A further tool path calculation calculates the spacing between adjacent rows of pulse locations. A tool path is selected which will cover the area to be marked in lines to be traveled in a raster fashion.
[0012] Aspects of this invention control the output of the laser. In order to facilitate application of tool paths as selected by this invention, laser pulse fluence should be attenuated very precisely under the control of the laser marking system. Aspects of this invention control the laser irradiance with sufficient precision to permit tool paths which create marks with commercially desirable uniformity, color, texture and shape. An optical switch is used to switch the laser beam on and off rapidly without requiring the laser to be turned off and on. Aspects of this invention use an acousto-optic modulator (AOM) to modulate the beam precisely and quickly and thereby direct the beam either to impinge the article or travel harmlessly to a beam dump.
[0013] Aspects of this invention are implemented by adapting an existing laser micromachining system, the ESI Model ML5900 Laser Micromachining System, manufactured by Electro Scientific Industries, Inc., Portland, OR 97229. This system is described in detail in the "ESI Service Guide ML5900", part number 178472A, published October 2009, Electro Scientific Industries, Inc., Portland, OR 97229, and is included herein in its entirety by reference. Adaptations include addition of an electro-optic device to permit more precise control of laser fluence in real time along with software to control these changes in fluence.
[0014]To achieve the foregoing with these and other aspects in accordance with the purposes of the present invention, as embodied and broadly described herein, a method for creating a visible mark with desirable commercial qualities on a coated article and apparatus adapted to perform the method is disclosed herein. Included is a laser processing system having a laser, laser optics, and motion stages all operatively connected to a controller with stored, predetermined laser pulse parameters. Stored laser pulse parameters associated with the desired fluence selected depending upon which region of the mark is being processed to create marks with commercially desirable properties.
Brief Description of the Drawings
[0015] Fig 1 Tool path
[0016] Fig 2 Prior art mark
[0017] Fig 3 Microphotograph of prior art laser mark
[0018] Fig 4a Prior art laser pulses
[0019] Fig 4b Laser pulses
[0020] Fig 4c Laser pulses
[0021] Fig 4d Laser pulses [0022] Fig 5 Laser mark
[0023] Fig 6 Microphotograph of laser mark
[0024] Fig 7 Adapted laser marking system
[0025] Fig 8 Pulse circuit
[0026] Fig 9 Pulse circuit
Detailed Description of Preferred Embodiments
[0027]An embodiment of this invention creates a mark with desired properties on coated articles using a laser marking system. The laser marking system has
controllable laser fluence or dose. Embodiments of this invention determine a first laser fluence associated with creating a mark with desired properties on a first portion of the mark. Aspects of this invention then determine a second laser fluence associated with creating a mark with desired properties on a second portion of the mark. These fluences are then stored in the laser marking system's storage. The laser marking system is then directed to mark the article using the stored first laser fluence in the first portion of the mark and using the stored second laser fluence in a second portion of the mark thereby marking the article with desired properties. Embodiments of this invention control laser fluence by controlling various laser parameters including laser pulse parameters such as pulse duration or pulse repletion rate, and tool path parameters such as spot size, laser beam location, or laser beam speed in order to increase throughput of a laser marking system while avoiding damage to underlying materials. Typically, a laser is selected and the power, rep rate, pulse temporal shape and pulse duration are selected to provide desired material removal rates. A tool path is then calculated to provide the desired material removal rate while avoiding damage to the underlying material. In particular embodiments of this invention provide increased laser pulse fluence for the beginning few laser pulses in a set of laser pulses in order to remove material that would otherwise remain on the surface of the article.
[0028] Embodiments of this invention control the output of the laser. In order to facilitate tool paths as selected by this invention, laser pulses should be attenuated very precisely under the control of the laser marking system. Aspects of this invention control the laser irradiance with sufficient precision to permit tool paths which create marks with commercially desirable uniformity, color, texture and shape. Aspects of this invention use an acousto-optic modulator (AOM) to modulate the beam precisely and quickly without requiring the laser to be turned on and off. An embodiment of this invention employs an AOM to modulate the fluence of the laser beam by diffractively redirecting the laser beam from its normal path to a beam dump where the laser beam energy is harmlessly dissipated rather than be directed to the article surface. An AOM is used because it is capable of modulating the laser beam very quickly. Fast modulation is advantageous for embodiments of this invention because it allows the laser marking system to turn the laser beam on and off rapidly and accurately without disturbing the laser itself.
[0029] Fig 1 shows a tool path used to remove a coating from an article. An article 30 is coated with a coating 31 to be removed within a shaped area 32. The laser begins removing material along the tool path 33 at its start point 34 and removes material as it moves to point 36, represented by the solid line. At point 36 the laser is turned off and the laser marking system re-positions the laser beam with respect to the article so that when the laser turns on, it begins removing material at point 38, represented by the dotted line. The laser then proceeds to cut and re-position until the end point 39 is reached. Fig 2 shows the results of removing material as shown in Fig 1. The article 40, with a coating 42 has had the coating removed from the area of the mark 44, exposing material underneath 46. Note that some of the overlying coating remains 48. This is because the particular laser irradiance used, while it is optimal for removing bulk material over the majority of the area to be marked, seems to be less effective in removing material at the beginning of the removal process. Irradiance is the rate at which laser energy is applied to the surface of the article per unit area and is measured in Watts/cm2. One prior art solution to this problem is to adjust the fluence and the speed of the laser with respect to the article which may reduce throughput and is hence undesirable. The fact that adjustment itself is required is also undesirable as it negatively affects system throughput. Fig 3 is a microphotograph showing this effect. In Fig 3 an article 50 has been coated with a silver coating covered by a layer of black paint 51. A laser has been used to remove the black paint in an area 52. Note that some black paint residue 54 remains in the area 52 where black paint was supposed to have been removed by the laser.
[0030] Fig 4a shows is a graph of pulse energy vs. time showing groups of prior art laser pulses. Referring to Fig 1 , the laser pulses would start 62 when the laser beam was positioned at 34, with the pulses ending at 64 when the laser beam reached the end of that stroke 36. The laser beam is repositioned 38 and the laser pulses started again 66. With this group pulse profile, material removal is incomplete. Although a pulse fluence might be found that removes the material 51 without leaving debris 54, the laser fluence used to form the mark in Fig 4a is outside the process window for that particular article at that particular time with that particular laser. An embodiment of this invention solves this problem my tailoring the group pulse profile to provide more energy at the beginning of a stroke while maintaining the specified energy for the remaining portion of the stroke. Tailoring the pulse group envelope in this fashion to form a tailored pulse profile permits commercially desirable marking while maintaining system throughput by using a higher energy pulses at the beginning of the pulse group before changing to pulses with a preselected lower energy to complete the pulse group. This tailored pulse profile creates wider process windows by permitting the use of lower laser fluences without leaving debris. A wider process window permits higher system throughput by reducing the need for system adjustments. An exemplary tailored pulse profile is shown in Fig 4b. In Fig 4b, two groups of tailored pulses 70 are shown. The pulse group 70 starts at time 74 with three pulses 72 at power P2. At time 76 the power is reduced to P2 and five more pulses 78 are directed to the workpiece until time 80. Each group of pulses is tailored in this fashion to have a predetermined number of pulses of predetermined energy emitted at the beginning of each stroke of the laser beam.
[0031] Fig 5 shows an article 100 coated with a coating 102 with a shape boundary 104 which has been laser processed to remove the coating 106 within the boundary 194 by a tailored pulse groups in accordance with embodiments of this invention. Note that no debris apparently remains nor has damage occurred anywhere on the mark. Fig 6 is a microphotograph of a similar coated article 110 which has been coated with black paint 1 12 that has been laser processed by an embodiment of this invention to cleanly and quickly remove the black paint 1 12 over a desired area to reveal silver paint underneath 114. Note the apparent lack of debris or damage to the underlying surface.
[0032] Fig 7 shows a diagram of an adapted ESI Model ML5900 laser micromachining system 120 adapted for marking articles as an embodiment of the instant invention. Adaptations include a laser 122, and an AOM fluence attenuator 124. Laser pulses are emitted by the laser 122 and directed by a series of mirrors and other optical elements (not shown) to the AOM 124 fluence attenuator and thereafter directed by another series of mirrors and optical elements (not shown) to the optical head 128. The AOM fluence attenuator includes control electronics which control the fluence of transmitted laser pulses under the direction of the controller 140. The optical head includes the X, Y and Z motion control elements 130 and the galvanometer block 132. These elements combine to position the laser beam (not shown) with respect to the article 138 being marked to create the 2-dimensional representation of the mark on the surface of the article 138. The article 138 is fixtured by the rotary stage element 134 which indexes the article 138 from the load/unload position to a position beneath the optical head 138, where it is marked, and then to an optional inspection station 136 where it is inspected prior to indexing back to the load/unload station for unloading. All of these operations take place under the control of the controller 140, which coordinates the operation of the laser 122, the AOM fluence attenuator 124, the motion control elements 130, the galvanometer block 132 and the rotary stage 134 to direct the appropriate laser fluence to the appropriate locations on the article 136 to create a mark with commercially desirable appearance.
[0033] The adapted laser 122 is a diode pumped Nd: YVO4 solid state laser operating at a frequency tripled 355 nm wavelength model Vanguard manufactured by Spectra- Physics, Santa Clara, California 95054. The laser 122 is configured to yield up to 2.5 W, but is generally run at an 80 MHz mode locked pulse repetition rate which yields a power of about 1 W. Lasers with power of 0.5 Watts to 100 Watts or more preferably 0.5 Watts to 12 Watts may be used advantageously by embodiments of this invention. Laser repetition rates of 10 KHz to 500 MHz or more preferably 1 MHz to 100 MHz may be used. The laser 122 produces laser pulses with duration of about 1 picosecond to 1 ,000 nanoseconds or more preferably 100 picoseconds to nanosecond to 100 nanoseconds in cooperation with controller 100. Pulse temporal and spatial distributions are typically Gaussian. Motion control elements 130 and galvanometer block 132 combine to provide beam positioning capability with respect to the article. Embodiments of this invention use laser spots as measured on the article ranging from 5 microns to 500 microns, or more preferably in the range from 10 microns to 100 microns. The system uses beam speeds, or relative motion between the laser beam and the article in the range of 10 mm/s to 1 m/s, or more preferably in the range of 50 mm/s to 500 mm/s. The pitch, or spacing between adjacent lines of laser pulses can range from 1 micron to 250 microns, or more preferably in the range from 10 microns to 50 microns.
[0034] Fig 8 shows an electronic circuit employed to adapt a laser processing system to operate according to an embodiment of this invention. Fig 8 shows an input signal 150 from the controller 140 that indicates the start of a laser beam stroke. This signal is typically a logical signal that indicates TRUE/FALSE with voltage levels. When the input signal 150 indicates TRUE, or the beginning of a stroke, the signal is passed to the AOM controller 162 trigger input "T". This indicates that the AOM is active and should be energized to transmit laser pulses. The AOM controller 162 also has an analog voltage input "A" which causes the AOM controller 162 to emit a signal 164 to the AOM (not shown) to transmit laser energy in proportion to the voltage appearing at "A". The trigger signal 150 is also sent to a pulse circuit 154 which produces a pulse with a programmable duration. This pulse is passed to an amplifier 156 which amplifies the pulse produced by pulse circuit 154 to a programmable voltage level. This amplified pulse is conditioned by the signal conditioning filter 158 to remove any undesired components and then combined by the summation circuit 160 with the original pulse voltage 152 output by the controller 140 and sent to the "A" input of the AOM controller 162 for eventual output 164 to the AOM (not shown).
[0035] Figs 4b and c show the tailored laser pulse groups output from a laser controlled by an AOM control circuit such as Fig 8. In Fig 4b, the tailored pulse groups 70 have pulses 72 with energy P1 at the beginning of the group and pulses 78 with energy P2 for the rest of the group. Fig 4c shows the tailored pulse groups resulting when the analog input 152 to the circuit in Fig 8 is lowered to a level which produces laser pulses with energy P3. Note that with this embodiment, the energy level of the laser pulses at the beginning of the stroke have constant energy depending upon the programmed setting of amplifier 156.
[0036] Fig 9 show an additional electronic circuit employed to adapt a laser processing system to operate according to an embodiment of this invention. In this circuit, the trigger input 170 from the controller 140 is sent to the trigger input "T" of the AOM controller 182 and to a pulse circuit 172 that generates a programmable duration pulse from the start of the trigger signal. This pulse is sent to an analog switch 174 which gates the analog signal 172 from the controller 140 that has been amplified by an amplifier 176 with programmable gain. The analog switch 174 transmits the analog signal from 174 when a pulse from pulse circuit 172 is present. The signal then goes to the signal conditioning filter 178 which removes undesired components from the signal and passes it to the combiner 180 which combines the original analog voltage control signal 172 from the controller 140 with the amplified signal from the signal conditioning circuit 178 to form the analog control signal to be sent to the AOM controller 182 for output 184 to the AOM (not shown). This circuit will produce tailored pulses as shown in Fig 4d. Fig 4d shows tailored groups of pulses 90 where the high energy pulses 92 at the beginning of each group 90 are made to be a pre-determined multiple P4 of the energy P3 of the predetermined pulses 94.
[0037] It will be apparent to those of ordinary skill in the art that many changes may be made to the details of the above-described embodiments of this invention without departing from the underlying principles thereof. The scope of the present invention should, therefore, be determined only by the following claims.

Claims

We claim:
1. A method for creating a laser mark with desired properties on a specimen using a laser marking system having a pulsed laser beam; said improvements
comprising:
providing said laser marking system with a controllable beam attenuator; and
directing said controllable beam attenuator to transmit said laser beam at a first attenuation level and then, after a predetermined time interval, changing the attenuation to a second attenuation level thereby creating a laser mark with desired properties.
2. The method of claim 1 wherein said specimen is coated with first and second layers of applied coatings and said desired properties of said mark comprise removing said first layer without damaging said second layer.
3. The method of claim 1 wherein said laser fluences ranges from 1.0 X 10"6
Joules/cm2 to 1.0 Joules/cm2.
4. The method of claim 4 wherein said controllable beam attenuator comprises an acousto-optic modulator.
5. An improved laser marking apparatus for marking a specimen with desired
properties, said apparatus having a laser beam, said improvements comprising: providing said laser marking system with a controllable beam attenuator operative to attenuate said laser beam at a first attenuation level, then, after a predetermined time interval, change the attenuation to a second attenuation level.
6. The apparatus of claim 5 wherein said specimen is coated with first and second layers of applied coatings and said desired properties of said mark comprise removing said first layer without damaging said second layer.
7. The apparatus of claim 5 wherein said pulse fluence ranges from 1.0 X 10"6 Joules/cm2 to 1.0 Joules/cm2.
8. The apparatus of claim 5 wherein said controllable beam attenuator comprises an acousto-optic modulator.
9. A mark with desired properties made on a specimen by a laser marking system having a pulsed laser beam and a controllable beam attenuator, said mark comprising;
a first portion of said mark having been marked by said laser marking system at a first attenuation level; and
a second portion of said mark having been marked by said laser marking system at a second attenuation level.
10. The mark of claim 9 wherein said specimen is coated with first and second layers of applied coatings and said desired properties of said mark comprise removing said first layer without damaging said second layer.
11. The method of claim 4 wherein said controllable beam attenuator comprises an acousto-optic modulator.
EP11875962.0A 2011-11-17 2011-11-17 Method and apparatus for optimally laser marking articles Withdrawn EP2780133A4 (en)

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