EP2780133A4 - Method and apparatus for optimally laser marking articles - Google Patents

Method and apparatus for optimally laser marking articles

Info

Publication number
EP2780133A4
EP2780133A4 EP11875962.0A EP11875962A EP2780133A4 EP 2780133 A4 EP2780133 A4 EP 2780133A4 EP 11875962 A EP11875962 A EP 11875962A EP 2780133 A4 EP2780133 A4 EP 2780133A4
Authority
EP
European Patent Office
Prior art keywords
laser marking
marking articles
optimally
optimally laser
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11875962.0A
Other languages
German (de)
French (fr)
Other versions
EP2780133A1 (en
Inventor
James Brookhyser
Kyle Ball
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of EP2780133A1 publication Critical patent/EP2780133A1/en
Publication of EP2780133A4 publication Critical patent/EP2780133A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
EP11875962.0A 2011-11-17 2011-11-17 Method and apparatus for optimally laser marking articles Withdrawn EP2780133A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/061195 WO2013074105A1 (en) 2011-11-17 2011-11-17 Method and apparatus for optimally laser marking articles

Publications (2)

Publication Number Publication Date
EP2780133A1 EP2780133A1 (en) 2014-09-24
EP2780133A4 true EP2780133A4 (en) 2016-08-24

Family

ID=48430008

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11875962.0A Withdrawn EP2780133A4 (en) 2011-11-17 2011-11-17 Method and apparatus for optimally laser marking articles

Country Status (4)

Country Link
EP (1) EP2780133A4 (en)
JP (1) JP5957087B2 (en)
CN (1) CN103764337A (en)
WO (1) WO2013074105A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2551653B1 (en) * 2014-05-20 2016-09-14 Bsh Electrodomésticos España, S.A. METHOD FOR PRODUCING A DOMESTIC APPLIANCE COMPONENT WITH A HOT STAMPED COATING, AND DOMESTIC APPLIANCE COMPONENT
JP7185402B2 (en) * 2015-05-13 2022-12-07 クラウン パッケイジング テクノロジー インコーポレイテッド Marking tab with two-dimensional code

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29421E (en) * 1971-05-26 1977-09-27 Texas Instruments Incorporated Laser system having electronically selectable gain
JP2000202668A (en) * 1999-01-20 2000-07-25 Nec Corp Method for piercing by q-switch laser
JP2006326618A (en) * 2005-05-24 2006-12-07 Mitsubishi Electric Corp Laser beam machining apparatus
WO2010111089A2 (en) * 2009-03-27 2010-09-30 Electro Scientific Industries, Inc. Laser micromachining with tailored bursts of short laser pulses
WO2013052034A1 (en) * 2011-10-03 2013-04-11 Electro Scientific Industies, Inc. Method and apparatus for optimally laser marking articles

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07246482A (en) * 1994-03-09 1995-09-26 Fuji Electric Co Ltd Laser marking device
JPH10156560A (en) * 1996-11-27 1998-06-16 Nec Corp Laser marking device and its method
US6160568A (en) * 1997-05-27 2000-12-12 Sdl, Inc. Laser marking system and method of energy control
JP3870693B2 (en) * 2000-11-28 2007-01-24 三菱電機株式会社 Laser processing machine
US6972268B2 (en) * 2001-03-29 2005-12-06 Gsi Lumonics Corporation Methods and systems for processing a device, methods and systems for modeling same and the device
JP2003126976A (en) * 2001-10-18 2003-05-08 Y E Data Inc Laser processing equipment
JP2008155471A (en) * 2006-12-22 2008-07-10 Sony Corp Marked painting article, producing method of marked painting article and box of electronic equipment
JP2010280086A (en) * 2009-06-03 2010-12-16 Ishizuka Glass Co Ltd Method of processing glass product having resin coating film
WO2011037787A1 (en) * 2009-09-24 2011-03-31 Esi-Pyrophotonics Lasers, Inc. Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape
US8451873B2 (en) * 2010-02-11 2013-05-28 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29421E (en) * 1971-05-26 1977-09-27 Texas Instruments Incorporated Laser system having electronically selectable gain
JP2000202668A (en) * 1999-01-20 2000-07-25 Nec Corp Method for piercing by q-switch laser
JP2006326618A (en) * 2005-05-24 2006-12-07 Mitsubishi Electric Corp Laser beam machining apparatus
WO2010111089A2 (en) * 2009-03-27 2010-09-30 Electro Scientific Industries, Inc. Laser micromachining with tailored bursts of short laser pulses
WO2013052034A1 (en) * 2011-10-03 2013-04-11 Electro Scientific Industies, Inc. Method and apparatus for optimally laser marking articles

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013074105A1 *

Also Published As

Publication number Publication date
EP2780133A1 (en) 2014-09-24
JP5957087B2 (en) 2016-07-27
WO2013074105A1 (en) 2013-05-23
CN103764337A (en) 2014-04-30
JP2015502258A (en) 2015-01-22

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