EP2768920A4 - Aminfreie post-kmp-zusammensetzung und anwendungsverfahren dafür - Google Patents
Aminfreie post-kmp-zusammensetzung und anwendungsverfahren dafürInfo
- Publication number
- EP2768920A4 EP2768920A4 EP11874382.2A EP11874382A EP2768920A4 EP 2768920 A4 EP2768920 A4 EP 2768920A4 EP 11874382 A EP11874382 A EP 11874382A EP 2768920 A4 EP2768920 A4 EP 2768920A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- cmp composition
- amine post
- amine
- post
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3454—Organic compounds containing sulfur containing sulfone groups, e.g. vinyl sulfones
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2011/057287 WO2013058770A1 (en) | 2011-10-21 | 2011-10-21 | Non-amine post-cmp composition and method of use |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2768920A1 EP2768920A1 (de) | 2014-08-27 |
EP2768920A4 true EP2768920A4 (de) | 2015-06-03 |
Family
ID=48141217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11874382.2A Withdrawn EP2768920A4 (de) | 2011-10-21 | 2011-10-21 | Aminfreie post-kmp-zusammensetzung und anwendungsverfahren dafür |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2768920A4 (de) |
KR (1) | KR101914817B1 (de) |
CN (2) | CN103958640B (de) |
WO (1) | WO2013058770A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014089196A1 (en) | 2012-12-05 | 2014-06-12 | Advanced Technology Materials, Inc. | Compositions for cleaning iii-v semiconductor materials and methods of using same |
EP2964725B1 (de) | 2013-03-04 | 2021-06-23 | Entegris, Inc. | Zusammensetzungen und verfahren zum selektiven ätzen von titannitrid |
KR102338550B1 (ko) | 2013-06-06 | 2021-12-14 | 엔테그리스, 아이엔씨. | 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법 |
EP3027709A4 (de) | 2013-07-31 | 2017-03-29 | Entegris, Inc. | Wässrige formulierungen zur entfernung von metallhartmasken und rückständen nach dem ätzen mit cu/w-kompatibilität |
SG11201601158VA (en) | 2013-08-30 | 2016-03-30 | Advanced Tech Materials | Compositions and methods for selectively etching titanium nitride |
EP3060642B1 (de) | 2013-10-21 | 2019-11-06 | FujiFilm Electronic Materials USA, Inc. | Reinigungsformulierungen zur entfernung von rückständen auf oberflächen |
KR102134577B1 (ko) * | 2013-11-12 | 2020-07-16 | 주식회사 동진쎄미켐 | 화학적 기계적 연마 후 세정용 조성물 |
US9562211B2 (en) | 2013-12-06 | 2017-02-07 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
TWI654340B (zh) | 2013-12-16 | 2019-03-21 | 美商恩特葛瑞斯股份有限公司 | Ni:NiGe:Ge選擇性蝕刻配方及其使用方法 |
WO2015095726A1 (en) | 2013-12-20 | 2015-06-25 | Entegris, Inc. | Use of non-oxidizing strong acids for the removal of ion-implanted resist |
WO2015103146A1 (en) | 2013-12-31 | 2015-07-09 | Advanced Technology Materials, Inc. | Formulations to selectively etch silicon and germanium |
WO2015116818A1 (en) | 2014-01-29 | 2015-08-06 | Advanced Technology Materials, Inc. | Post chemical mechanical polishing formulations and method of use |
WO2015119925A1 (en) | 2014-02-05 | 2015-08-13 | Advanced Technology Materials, Inc. | Non-amine post-cmp compositions and method of use |
IL277275B2 (en) | 2018-03-28 | 2023-11-01 | Fujifilm Electronic Mat Usa Inc | cleaning products |
CN115612573B (zh) * | 2022-09-05 | 2023-10-13 | 圣戈班汇杰(杭州)新材料有限公司 | 一种固化硅酮胶的除胶剂配方及其使用方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050245411A1 (en) * | 2004-05-03 | 2005-11-03 | Bo Yang | Methods and composition for cleaning and passivating fuel cell systems |
WO2007047365A2 (en) * | 2005-10-13 | 2007-04-26 | Advanced Technology Materials, Inc. | Metals compatible photoresist and/or sacrificial antireflective coating removal composition |
WO2008039730A1 (en) * | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000044034A1 (en) * | 1999-01-25 | 2000-07-27 | Speedfam-Ipec Corporation | Methods and cleaning solutions for post-chemical mechanical polishing |
US6350393B2 (en) * | 1999-11-04 | 2002-02-26 | Cabot Microelectronics Corporation | Use of CsOH in a dielectric CMP slurry |
AU2003240827A1 (en) * | 2002-06-07 | 2003-12-22 | Mallinckrodt Baker Inc. | Cleaning compositions for microelectronic substrates |
CN102061228B (zh) * | 2002-06-07 | 2013-02-13 | 安万托特性材料股份有限公司 | 包含氧化剂和有机溶剂的微电子清洁组合物 |
KR101444468B1 (ko) * | 2005-10-05 | 2014-10-30 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 에칭후 잔류물을 제거하기 위한 산화성 수성 세정제 |
US20070225186A1 (en) * | 2006-03-27 | 2007-09-27 | Matthew Fisher | Alkaline solutions for post CMP cleaning processes |
JP2009069505A (ja) | 2007-09-13 | 2009-04-02 | Tosoh Corp | レジスト除去用洗浄液及び洗浄方法 |
MY152051A (en) * | 2009-02-25 | 2014-08-15 | Avantor Performance Mat Inc | Multipurpose acidic, organic solvent based microelectronic cleaning composition |
US8754021B2 (en) * | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
US7846265B1 (en) * | 2009-10-13 | 2010-12-07 | Xerox Corporation | Media path universal cleaning fluid composition |
-
2011
- 2011-10-21 CN CN201180075099.6A patent/CN103958640B/zh active Active
- 2011-10-21 CN CN201610274374.1A patent/CN105869997A/zh active Pending
- 2011-10-21 EP EP11874382.2A patent/EP2768920A4/de not_active Withdrawn
- 2011-10-21 KR KR1020147013154A patent/KR101914817B1/ko active IP Right Grant
- 2011-10-21 WO PCT/US2011/057287 patent/WO2013058770A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050245411A1 (en) * | 2004-05-03 | 2005-11-03 | Bo Yang | Methods and composition for cleaning and passivating fuel cell systems |
WO2007047365A2 (en) * | 2005-10-13 | 2007-04-26 | Advanced Technology Materials, Inc. | Metals compatible photoresist and/or sacrificial antireflective coating removal composition |
WO2008039730A1 (en) * | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
Non-Patent Citations (1)
Title |
---|
See also references of WO2013058770A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN103958640A (zh) | 2014-07-30 |
CN103958640B (zh) | 2016-05-18 |
KR101914817B1 (ko) | 2018-12-28 |
EP2768920A1 (de) | 2014-08-27 |
WO2013058770A1 (en) | 2013-04-25 |
CN105869997A (zh) | 2016-08-17 |
KR20140082816A (ko) | 2014-07-02 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20140513 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
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DAX | Request for extension of the european patent (deleted) | ||
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20150508 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C11D 3/43 20060101ALI20150430BHEP Ipc: C11D 7/50 20060101ALI20150430BHEP Ipc: C11D 3/04 20060101ALI20150430BHEP Ipc: C11D 3/20 20060101ALN20150430BHEP Ipc: C11D 7/26 20060101ALN20150430BHEP Ipc: C11D 7/34 20060101ALN20150430BHEP Ipc: C11D 3/34 20060101ALN20150430BHEP Ipc: H01L 21/02 20060101AFI20150430BHEP Ipc: C11D 7/06 20060101ALI20150430BHEP |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: ENTEGRIS INC. |
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17Q | First examination report despatched |
Effective date: 20161206 |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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INTG | Intention to grant announced |
Effective date: 20180713 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C11D 7/06 20060101ALI20180703BHEP Ipc: C11D 3/04 20060101ALI20180703BHEP Ipc: C11D 3/43 20060101ALI20180703BHEP Ipc: C11D 7/34 20060101ALN20180703BHEP Ipc: C11D 7/50 20060101ALI20180703BHEP Ipc: C11D 3/20 20060101ALN20180703BHEP Ipc: C11D 3/34 20060101ALN20180703BHEP Ipc: H01L 21/02 20060101AFI20180703BHEP Ipc: C11D 7/26 20060101ALN20180703BHEP |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20181124 |