EP2767509A4 - Copper foil for graphene production and method for producing graphene - Google Patents

Copper foil for graphene production and method for producing graphene

Info

Publication number
EP2767509A4
EP2767509A4 EP12850534.4A EP12850534A EP2767509A4 EP 2767509 A4 EP2767509 A4 EP 2767509A4 EP 12850534 A EP12850534 A EP 12850534A EP 2767509 A4 EP2767509 A4 EP 2767509A4
Authority
EP
European Patent Office
Prior art keywords
graphene
copper foil
production
producing
producing graphene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12850534.4A
Other languages
German (de)
French (fr)
Other versions
EP2767509A1 (en
EP2767509B1 (en
Inventor
Yoshihiro Chiba
Toshiyuki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2767509A1 publication Critical patent/EP2767509A1/en
Publication of EP2767509A4 publication Critical patent/EP2767509A4/en
Application granted granted Critical
Publication of EP2767509B1 publication Critical patent/EP2767509B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/184—Preparation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/182—Graphene
    • C01B32/184—Preparation
    • C01B32/186—Preparation by chemical vapour deposition [CVD]
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
EP12850534.4A 2011-11-15 2012-10-31 Copper foil for producing graphene and method of producing graphene using the same Active EP2767509B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011249469A JP5721609B2 (en) 2011-11-15 2011-11-15 Copper foil for producing graphene and method for producing graphene
PCT/JP2012/078124 WO2013073367A1 (en) 2011-11-15 2012-10-31 Copper foil for graphene production and method for producing graphene

Publications (3)

Publication Number Publication Date
EP2767509A1 EP2767509A1 (en) 2014-08-20
EP2767509A4 true EP2767509A4 (en) 2015-12-02
EP2767509B1 EP2767509B1 (en) 2018-07-11

Family

ID=48429435

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12850534.4A Active EP2767509B1 (en) 2011-11-15 2012-10-31 Copper foil for producing graphene and method of producing graphene using the same

Country Status (8)

Country Link
US (1) US9359212B2 (en)
EP (1) EP2767509B1 (en)
JP (1) JP5721609B2 (en)
KR (1) KR101616214B1 (en)
CN (1) CN103930367B (en)
ES (1) ES2687956T3 (en)
TW (1) TWI585219B (en)
WO (1) WO2013073367A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (en) 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene using the same
JP5850720B2 (en) 2011-06-02 2016-02-03 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5959510B2 (en) 2011-06-02 2016-08-02 Ｊｘ金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5721609B2 (en) 2011-11-15 2015-05-20 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
JP2014227594A (en) * 2013-05-27 2014-12-08 Jx日鉱日石金属株式会社 Copper foil for manufacturing graphene and method for manufacturing graphene
KR101626573B1 (en) * 2014-05-02 2016-06-01 에스 알 씨 주식회사 A copper thin foil for manufacturing graphene and a method of manufacturing graphene using the same
CN104022017B (en) * 2014-06-10 2017-05-10 京东方科技集团股份有限公司 Method of graphene patterning and manufacturing method of display substrate
JP6078024B2 (en) 2014-06-13 2017-02-08 Ｊｘ金属株式会社 Rolled copper foil for producing a two-dimensional hexagonal lattice compound and a method for producing a two-dimensional hexagonal lattice compound
CN105525124B (en) * 2016-02-02 2017-07-07 天津大学 Fabricated in situ three-dimensional grapheme strengthens Cu-base composites preparation method
KR101938874B1 (en) * 2016-07-20 2019-01-15 주식회사 참트론 The heat-treatment device for synthesis of high quality graphene
CN108529605A (en) * 2018-06-26 2018-09-14 东南大学 A kind of preparation method of large area pattern graphite alkene
CN115094358B (en) * 2022-06-30 2023-06-09 国网河南省电力公司电力科学研究院 Surface nanocrystallization method and device for electrical contact material
CN115287757A (en) * 2022-07-08 2022-11-04 中国科学院电工研究所 Preparation method of copper single crystal wafer and single crystal graphene

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JP2006326684A (en) * 2005-04-28 2006-12-07 Nikko Kinzoku Kk High-gloss rolled copper foil for copper-clad laminate substrate
US20090047539A1 (en) * 2006-03-10 2009-02-19 Mitsui Mining & Smelting Co., Ltd Surface-treated electro-deposited copper foil and method for manufacturing the same
US20100038115A1 (en) * 2005-03-31 2010-02-18 Mitsui Mining & Smelting Co., Ltd Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil
WO2011081044A1 (en) * 2009-12-28 2011-07-07 Jx日鉱日石金属株式会社 Copper foil and copper-clad laminate plate using same

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JP3859384B2 (en) 1999-03-08 2006-12-20 日鉱金属株式会社 Rolled copper foil for flexible printed circuit board having excellent flexibility and manufacturing method thereof
JP3521074B2 (en) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 Method for testing physical properties of electrolytic copper foil
JP3552043B2 (en) 2000-08-07 2004-08-11 古河電気工業株式会社 Method for producing oxygen-free copper wire by belt & wheel continuous casting and rolling method and method for producing copper alloy wire
CN1195395C (en) * 2001-01-30 2005-03-30 日鉱金属股份有限公司 Copper alloy foil for integrated board
TWI298988B (en) 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
JP2004074214A (en) 2002-08-16 2004-03-11 Nikko Metal Manufacturing Co Ltd Metallic rolled foil improved in peeling strength with laminated material
CN1286716C (en) 2003-03-19 2006-11-29 清华大学 Method for growing carbon nano tube
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KR20070041402A (en) * 2005-10-14 2007-04-18 미쓰이 긴조꾸 고교 가부시키가이샤 Flexible copper clad laminate, flexible printed circuit manufactured using the same, film carrier tape manufactured using the same, semiconductor device manufactured using the same, method for manufacturing the same, and method for manufacturing the film carrier tape
CN100491000C (en) * 2006-12-25 2009-05-27 上海金地金属制品厂 Method for calendering pure copper foil
KR101344493B1 (en) 2007-12-17 2013-12-24 삼성전자주식회사 Single crystalline graphene sheet and process for preparing the same
US7479590B1 (en) 2008-01-03 2009-01-20 International Business Machines Corporation Dry adhesives, methods of manufacture thereof and articles comprising the same
JP2009215146A (en) 2008-03-13 2009-09-24 Panasonic Corp Metal-containing nanoparticle, carbon nanotube structure grown by using the same, electronic device using the carbon nanotube structure, and method for manufacturing the device
WO2010038641A1 (en) * 2008-09-30 2010-04-08 日鉱金属株式会社 High-purity copper and process for electrolytically producing high-purity copper
JP4972115B2 (en) * 2009-03-27 2012-07-11 Ｊｘ日鉱日石金属株式会社 Rolled copper foil
JP5569769B2 (en) 2009-08-31 2014-08-13 独立行政法人物質・材料研究機構 Graphene film manufacturing method
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JP5822669B2 (en) 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene using the same
JP5959510B2 (en) 2011-06-02 2016-08-02 Ｊｘ金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5850720B2 (en) 2011-06-02 2016-02-03 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5758254B2 (en) 2011-09-27 2015-08-05 Jx日鉱日石金属株式会社 Rolled copper foil
JP5847834B2 (en) 2011-11-04 2016-01-27 Jx日鉱日石金属株式会社 Copper foil for producing graphene, method for producing the same, and method for producing graphene
JP5721609B2 (en) 2011-11-15 2015-05-20 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
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JP5475897B1 (en) 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board
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ZHENGTANG LUO ET AL: "Effect of substrate roughness and feedstock concentration on growth of wafer-scale graphene at atmospheric pressure", CHEMISTRY OF MATERIALS, AMERICAN CHEMICAL SOCIETY, WASHINGTON, DC, US, vol. 23, no. 6, 22 March 2011 (2011-03-22), pages 1441 - 1447, XP002695338, ISSN: 1520-5002, [retrieved on 20110210], DOI: 10.1021/CM1028854 *
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Also Published As

Publication number Publication date
US20140353278A1 (en) 2014-12-04
CN103930367B (en) 2015-11-25
EP2767509A1 (en) 2014-08-20
ES2687956T3 (en) 2018-10-30
TWI585219B (en) 2017-06-01
TW201337007A (en) 2013-09-16
US9359212B2 (en) 2016-06-07
JP2013103861A (en) 2013-05-30
EP2767509B1 (en) 2018-07-11
KR101616214B1 (en) 2016-04-27
WO2013073367A1 (en) 2013-05-23
JP5721609B2 (en) 2015-05-20
CN103930367A (en) 2014-07-16
KR20140092334A (en) 2014-07-23

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