EP2756276A2 - Verfahren zur temperaturmessung von substraten in einer vakuumkammer - Google Patents
Verfahren zur temperaturmessung von substraten in einer vakuumkammerInfo
- Publication number
- EP2756276A2 EP2756276A2 EP12756380.7A EP12756380A EP2756276A2 EP 2756276 A2 EP2756276 A2 EP 2756276A2 EP 12756380 A EP12756380 A EP 12756380A EP 2756276 A2 EP2756276 A2 EP 2756276A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- temperature
- sensor
- reference body
- substrates
- measured value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 14
- 238000009529 body temperature measurement Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000000969 carrier Substances 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000009489 vacuum treatment Methods 0.000 claims description 2
- 238000000576 coating method Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/10—Arrangements for compensating for auxiliary variables, e.g. length of lead
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/064—Ambient temperature sensor; Housing temperature sensor; Constructional details thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
Definitions
- the present invention relates to a method for non-contact measurement of the temperature of a substrate during its treatment in a chamber, in particular during a surface treatment such as heating, etching, CVD and / or PVD coating in a vacuum chamber.
- the control of the substrate temperature during the performance of CVD and / or PVD coating processes often plays a very important role. This is the case, for example, when temperature-sensitive substrates are provided with a functional coating or even when the temperature prevailing during the coating influences the properties of the coating material, which is generally true.
- the components to be coated are frequently moved to produce a homogeneous layer. Often, especially with complex geometries of the components, a double or triple rotation is realized. This makes it difficult to attach temperature sensors directly to the components to be coated.
- CONFIRMATION COPY a) the emissivity of the surface must be known, b) the window must be protected from layer deposits during the coating and / or subjected to stripping on a regular basis.
- thermocouples The thermocouple must be mounted on the substrate carrier and the cables of the thermocouple must be led through a rotary feedthrough from the vacuum receiver. Such a measurement usually reflects the substrate temperature very well, but the cost of the rotary feedthrough is considerable.
- thermocouples A thermocouple is mounted stationary in the chamber statically between vacuum chamber walls and moving substrate. According to the state of the art, the corresponding measurement, both in terms of time and in terms of absolute temperature, gives limited results with limited accuracy. In order to obtain reasonably accurate measurement results, it is necessary to wait until the vacuum chamber and the substrates are in thermal equilibrium. Experience also shows that the measurement result depends heavily on the position of the sensor.
- the object is achieved in that in addition to the stationary temperature sensor in the vicinity of the sensor, a reference known and / or adjustable temperature is provided in the vacuum chamber.
- the reference shields the temperature sensor from the environment in such a way that only radiation reaches the surface of the temperature sensor, which comes from surfaces of the reference and which comes from surfaces whose temperature is to be determined.
- this can be achieved by making the reference cup-shaped, at the bottom of which the surface of the temperature sensor is thermally insulated from one another, and the cup is oriented so that its opening points in the direction of the substrates to be measured.
- Tsubstratfiache 2 ⁇ Tsensor requirements TR e f erence flg c ie
- the substrate temperature at known temperature of the reference surface and measured temperature of the sensor can be determined by the simple relationship of Equation 1.
- the factor 1.1892 ( ⁇ 2 1 4 ) is called the irradiance in the case of infinite plates.
- other irradiation numbers apply, for which different methods can be used, such as the finite element method or the radiosity method.
- a well-known finite element software is known under the name Ansys.
- FIG. 1 shows a first embodiment of the present invention.
- a cup-shaped reference 3 with reference surface 7 is mounted in a vacuum chamber (not shown), wherein a temperature sensor 5 with sensor surface 6 is provided at the bottom of the cup.
- the thermosensitive surface of the temperature sensor can only reach those rays which either originate in the interior of the cup wall (reference surface 7) or come from a direction which lies within the cone indicated by the dashed line in FIG. If the cup opening is aligned in the direction of substrates 9, as indicated in FIG. 1, the sensor surface receives essentially only radiation from the reference surface and the substrate surfaces.
- the temperature of the reference surface and the surface of the temperature sensor is now measured and attempts to adjust the temperature of the reference surface to the temperature of the surface of the temperature sensor.
- a change in the temperature at the reference surface will result in a change in the temperature of the surface of the temperature sensor due to the radiation emanating from the reference surface, as long as the temperature of the reference surface does not correspond to the temperature of the substrate surfaces.
- reference surface, sensor surface and substrate surfaces Only when the substrate temperature is reached, reference surface, sensor surface and substrate surfaces have the same temperature constant.
- By tracking the reference temperature can thus be very according to the invention very Determine the temperature of the substrates. This works particularly well because, among other things, the whole process takes place under vacuum conditions and does not affect any disturbing influences of an ambient atmosphere. This method is particularly suitable for the measurement of moderate substrate temperatures, as they must prevail, for example, in the coating of plastic substrates.
- thermocouple rotatable (co-rotating) with the substrates and these are brought to different temperatures.
- the reference surface is preferably maintained at a constant temperature and the temperature measured at the sensor surface is related to the temperature measured at the co-rotating thermocouple.
- the Einstrahliere k 1.4 was used, which was determined using the known finite element software Ansys.
- the temperature profile was achieved by heating the substrates. It can be clearly seen from FIG. 2 that, starting from a substrate temperature of 500 ° C., the temperature of the reference surface, which was at 80 ° C., can be neglected.
- a temperature measuring system with a temperature sensor and a reference body has been disclosed in the means for determining temperature changes of the reference body and / or are provided for regulating the temperature of the reference body, wherein the reference body when the temperature measuring system is used in vacuum, the temperature sensor does not form material material thermal bridges and the reference body shields the temperature sensor against the environment that on the surface of the temperature sensor only radiation which comes from surfaces of the reference and which comes from surfaces whose temperature is to be determined.
- the reference body may be formed as a cup with cup bottom and the temperature sensor in the vicinity of the cup bottom of this but be arranged thermally insulated from this.
- a vacuum treatment plant may be equipped with such a temperature measuring system.
- the reference is oriented so that substantially only radiation reaches the surface of the temperature sensor, which comes from the surfaces of the reference and from the surfaces of the substrates to be treated in the vacuum system and optionally the substrate carriers.
- a method for measuring the temperature of substrates in a vacuum processing chamber comprising the following steps:
- the sensor measured value can correspond to the temperature of the sensor and the reference measured value can correspond to the current temperature of the reference body.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161534943P | 2011-09-15 | 2011-09-15 | |
PCT/EP2012/003759 WO2013037467A2 (de) | 2011-09-15 | 2012-09-07 | Verfahren zur temperaturmessung von substraten in einer vakuumkammer |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2756276A2 true EP2756276A2 (de) | 2014-07-23 |
Family
ID=46826431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12756380.7A Withdrawn EP2756276A2 (de) | 2011-09-15 | 2012-09-07 | Verfahren zur temperaturmessung von substraten in einer vakuumkammer |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140369387A1 (de) |
EP (1) | EP2756276A2 (de) |
JP (1) | JP2014532164A (de) |
KR (1) | KR20140060525A (de) |
CN (1) | CN103782142A (de) |
WO (1) | WO2013037467A2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105624636B (zh) * | 2016-03-11 | 2019-07-05 | 京东方科技集团股份有限公司 | 一种溅射成膜的参数调节方法及系统 |
DE102019114249A1 (de) * | 2018-06-19 | 2019-12-19 | Aixtron Se | Anordnung zum Messen der Oberflächentemperatur eines Suszeptors in einem CVD-Reaktor |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794838A (en) * | 1972-02-10 | 1974-02-26 | Barnes Eng Co | Compensation means for ambient temperature changes of a radiation chopper in a radiometer |
JPH0675009B2 (ja) * | 1990-01-26 | 1994-09-21 | 中外炉工業株式会社 | 物体表面の温度制御方法 |
US5988874A (en) * | 1997-09-05 | 1999-11-23 | Advanced Micro Devices, Inc. | Black body reference for RTA |
JPH11258054A (ja) * | 1998-03-12 | 1999-09-24 | Omron Corp | ウエハ温度測定方法とその装置 |
MX2011004364A (es) * | 2008-10-23 | 2011-07-20 | Kaz Inc | Termometro medico sin contacto con proteccion de radiacion parásita. |
DE102009029943B4 (de) * | 2009-06-23 | 2011-04-07 | Testo Ag | Infrarot-Temperaturmessgerät und Verfahren zum Betrieb eines solchen |
-
2012
- 2012-09-07 WO PCT/EP2012/003759 patent/WO2013037467A2/de active Application Filing
- 2012-09-07 JP JP2014530114A patent/JP2014532164A/ja active Pending
- 2012-09-07 EP EP12756380.7A patent/EP2756276A2/de not_active Withdrawn
- 2012-09-07 KR KR1020147006495A patent/KR20140060525A/ko not_active Application Discontinuation
- 2012-09-07 US US14/345,019 patent/US20140369387A1/en not_active Abandoned
- 2012-09-07 CN CN201280044803.6A patent/CN103782142A/zh active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO2013037467A2 * |
Also Published As
Publication number | Publication date |
---|---|
US20140369387A1 (en) | 2014-12-18 |
KR20140060525A (ko) | 2014-05-20 |
WO2013037467A3 (de) | 2013-12-27 |
WO2013037467A2 (de) | 2013-03-21 |
CN103782142A (zh) | 2014-05-07 |
JP2014532164A (ja) | 2014-12-04 |
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Legal Events
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R17P | Request for examination filed (corrected) |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: ESSELBACH, MARKUS Inventor name: KRASSNITZER, SIEGFRIED |
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DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OERLIKON SURFACE SOLUTIONS AG, TRUEBBACH |
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18D | Application deemed to be withdrawn |
Effective date: 20170401 |