EP2739690A4 - Adhésif structurel électroconducteur - Google Patents

Adhésif structurel électroconducteur

Info

Publication number
EP2739690A4
EP2739690A4 EP12819629.2A EP12819629A EP2739690A4 EP 2739690 A4 EP2739690 A4 EP 2739690A4 EP 12819629 A EP12819629 A EP 12819629A EP 2739690 A4 EP2739690 A4 EP 2739690A4
Authority
EP
European Patent Office
Prior art keywords
electrically conductive
structural adhesive
conductive structural
adhesive
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12819629.2A
Other languages
German (de)
English (en)
Other versions
EP2739690B1 (fr
EP2739690A2 (fr
Inventor
Susan L Levondoski
Samuel C Bail
Timothy P Walsh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel IP and Holding GmbH
Original Assignee
Henkel US IP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel US IP LLC filed Critical Henkel US IP LLC
Publication of EP2739690A2 publication Critical patent/EP2739690A2/fr
Publication of EP2739690A4 publication Critical patent/EP2739690A4/fr
Application granted granted Critical
Publication of EP2739690B1 publication Critical patent/EP2739690B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
EP12819629.2A 2011-08-03 2012-06-15 Adhésif structurel électroconducteur Not-in-force EP2739690B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161514724P 2011-08-03 2011-08-03
PCT/US2012/042590 WO2013019326A2 (fr) 2011-08-03 2012-06-15 Adhésif structurel électroconducteur

Publications (3)

Publication Number Publication Date
EP2739690A2 EP2739690A2 (fr) 2014-06-11
EP2739690A4 true EP2739690A4 (fr) 2015-04-15
EP2739690B1 EP2739690B1 (fr) 2016-08-10

Family

ID=47629836

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12819629.2A Not-in-force EP2739690B1 (fr) 2011-08-03 2012-06-15 Adhésif structurel électroconducteur

Country Status (6)

Country Link
US (1) US9493682B2 (fr)
EP (1) EP2739690B1 (fr)
JP (1) JP5959642B2 (fr)
KR (1) KR101819272B1 (fr)
CN (1) CN104053737B (fr)
WO (1) WO2013019326A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102327704B1 (ko) * 2017-05-02 2021-11-16 주식회사 엘지화학 이액형 접착제 조성물
KR102129527B1 (ko) 2018-12-14 2020-07-02 한국과학기술연구원 고유전 탄성구조체 및 그의 제조방법
FI3983460T3 (fi) * 2019-06-12 2024-04-03 Henkel Ag & Co Kgaa Grafeenioksidilla muunnettuja kaksiosaisia syanoakrylaatti- / vapaalla radikaalilla kovetettavia sideainejärjestelmiä

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929119A (ja) * 1982-08-09 1984-02-16 Sanwa Kako Kk 導電性ポリエチレンフォームの接着方法
WO2005087850A1 (fr) * 2004-03-09 2005-09-22 Henkel Corporation Composition adhesive thermoconductrice en deux parties
US20100331462A1 (en) * 2009-06-30 2010-12-30 Henkel Corporation Ultrafast heat/room temperature adhesive composition for bonding applications

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929119B2 (ja) * 1976-10-12 1984-07-18 スズキ株式会社 多層複合メツキ層
JPS6053300B2 (ja) 1978-08-29 1985-11-25 富士写真フイルム株式会社 感光性樹脂組成物
IE51059B1 (en) * 1980-07-11 1986-09-17 Loctite Corp Butadiene toughened adhesive composition
JPS5815503A (ja) 1981-07-20 1983-01-28 Fuji Photo Film Co Ltd 光重合性組成物
JPS61296077A (ja) * 1985-06-25 1986-12-26 Three Bond Co Ltd 二液接触硬化型導電性接着剤
US4777205A (en) * 1987-07-22 1988-10-11 Wacker Silicones Corporation Electrically conductive compositions
US5385958A (en) * 1993-03-05 1995-01-31 Dymax Corporation Activator formulation and composition utilizing same
US6274688B1 (en) 1997-07-28 2001-08-14 Kaneka Corporation Functional groups-terminated vinyl polymers
EP1239015A1 (fr) * 2001-03-08 2002-09-11 Sika AG, vorm. Kaspar Winkler & Co. Compositions d'adhésifs methacryliques aisées à préparer
AR050425A1 (es) * 2004-07-08 2006-10-25 Elan Pharm Inc Antagonistas multivalentes de vla-4 que comprende fracciones polimericas. composiciones farmaceuticas
JP2009054983A (ja) * 2007-01-17 2009-03-12 Mitsubishi Pencil Co Ltd 電波吸収材およびその製造方法
WO2009009009A2 (fr) * 2007-07-06 2009-01-15 Henkel Corporation Adhésifs acryliques
WO2010127053A2 (fr) * 2009-05-01 2010-11-04 Henkel Corporation Accélérateurs de durcissement pour des compositions durcissables anaérobies
JP5674291B2 (ja) * 2009-07-30 2015-02-25 電気化学工業株式会社 仮固定用接着剤組成物、仮固定方法、表面保護方法
JP2011231209A (ja) * 2010-04-27 2011-11-17 Maxell Sliontec Ltd 粘着組成物、及び粘着テープ
JP5929119B2 (ja) 2011-11-21 2016-06-01 Tdk株式会社 フェライト組成物および電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929119A (ja) * 1982-08-09 1984-02-16 Sanwa Kako Kk 導電性ポリエチレンフォームの接着方法
WO2005087850A1 (fr) * 2004-03-09 2005-09-22 Henkel Corporation Composition adhesive thermoconductrice en deux parties
US20100331462A1 (en) * 2009-06-30 2010-12-30 Henkel Corporation Ultrafast heat/room temperature adhesive composition for bonding applications

Also Published As

Publication number Publication date
JP2014529633A (ja) 2014-11-13
WO2013019326A3 (fr) 2013-09-12
WO2013019326A9 (fr) 2014-06-12
US20140220243A1 (en) 2014-08-07
CN104053737B (zh) 2016-09-07
EP2739690B1 (fr) 2016-08-10
CN104053737A (zh) 2014-09-17
JP5959642B2 (ja) 2016-08-02
WO2013019326A2 (fr) 2013-02-07
KR20140063639A (ko) 2014-05-27
US9493682B2 (en) 2016-11-15
EP2739690A2 (fr) 2014-06-11
KR101819272B1 (ko) 2018-01-16

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