EP2733437A1 - Heat pump water heater - Google Patents
Heat pump water heater Download PDFInfo
- Publication number
- EP2733437A1 EP2733437A1 EP13193291.5A EP13193291A EP2733437A1 EP 2733437 A1 EP2733437 A1 EP 2733437A1 EP 13193291 A EP13193291 A EP 13193291A EP 2733437 A1 EP2733437 A1 EP 2733437A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- hot water
- water tank
- heat
- heat pump
- evaporator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 215
- 239000003507 refrigerant Substances 0.000 claims abstract description 76
- 238000001816 cooling Methods 0.000 claims description 18
- 230000005855 radiation Effects 0.000 abstract description 19
- 238000009413 insulation Methods 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 23
- 238000005192 partition Methods 0.000 description 15
- 230000004907 flux Effects 0.000 description 14
- 239000012774 insulation material Substances 0.000 description 14
- 238000005338 heat storage Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012267 brine Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004794 expanded polystyrene Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H4/00—Fluid heaters characterised by the use of heat pumps
- F24H4/02—Water heaters
- F24H4/04—Storage heaters
Definitions
- the present invention relates to a water heater which heats water using a heat pump.
- a heat pump water heater which produces high temperature fluid (warm water) utilizing condensation latent heat of refrigerant by a radiator of a heat pump unit, and carries out heat storage operation for storing the produced hw in a hot water tank, and which utilizes the produced hot water for heating a room or supplying the produced hot water.
- a heat pump water heater there is one in which a heat pump unit is disposed on an upper portion of a hot water tank unit (see patent document 1 for example).
- Figs. 6 show the heat pump water heater described in patent document 1.
- the heat pump water heater includes a hot water tank unit 200 and a heat pump unit 100.
- the heat pump unit 100 is disposed on an upper portion of the hot water tank unit 200.
- a compressor 110, a radiator 120, an expansion device (not shown) and an evaporator (air heat exchanger) 130 are annularly connected to one another through a refrigerant pipe, and a refrigerant circuit is configured.
- Refrigerant flows through the refrigerant pipe.
- the radiator 120 heat-exchanges between refrigerant which flows through the refrigerant circuit and fluid which flows through a fluid circuit 230.
- a hot water tank 210, a portion of the fluid circuit 230 and a circulation pump 220 are disposed in the hot water tank unit 200.
- the fluid circuit 230 is configured by annularly connecting the radiator 120, the hot water tank 210 and the circulation pump 220 to one another through a fluid pipe through which heat medium such as water flows.
- a lateral width of an evaporator 130 of the heat pump unit 100 is shorter than a lateral width of the hot water tank unit 200 by a lateral width which is required for installing the compressor 110.
- low temperature fluid (water) stored in the hot water tank 210 is conveyed, by the circulation pump 220, from the hot water tank 210 to the heat pump unit 100 through the fluid circuit 230.
- Heat medium (warm water) is heated by the radiator 120 of the heat pump unit 100 and temperature of the heat medium becomes high.
- the heat medium flows out from the heat pump unit 100 through the fluid circuit 230 and then flows into the hot water tank unit 200 and is stored from the fluid circuit 230 which is connected to an upper portion of the hot water tank 210.
- high temperature fluid in an upper portion of the hot water tank 210 flows out from the hot water tank 210 through a pipe (not shown), and the fluid is conveyed to a hot water supply terminal.
- High temperature fluid is produced by the heat pump unit 100 using the hot water tank 210, heat is stored the hot water tank 210, and if it is requested to supply hot water, it is possible to utilize high temperature heat medium which is stored in the hot water tank 210.
- Patent Document 1 Japanese Patent Application Laid-open No. 2011-122752
- the heat pump unit 100 is disposed on the upper portion of the hot water tank unit 200, and the fluid pipe which connects the heat pump unit 100 and the hot water tank unit 200 to each other is disposed on the upper portion of the hot water tank 210.
- the conventional configuration has such a problem that a heat resistance (a reciprocal of a heat passage rate) between the heat pump unit 100 including the low temperature evaporator 130 and the upper portion of the high temperature hot water tank 210 becomes small, heat is prone to move from the hot water tank 210 whose temperature becomes high to the heat pump unit 100 and as a result, a heat radiation amount from the hot water tank 210 increases and energy efficiency is lowered.
- a heat resistance a reciprocal of a heat passage rate
- the present invention has been accomplished to solve the conventional problem, and it is an object of the invention to provide a heat pump water heater which is capable of reducing a heat radiation loss from the hot water tank by appropriately insulating heat between the heat pump unit and the hot water tank unit and which has excellent energy saving performance.
- the present invention provides a heat pump water heater comprising a refrigerant circuit which is formed by annularly connecting a compressor, a radiator, an expansion device and an evaporator to one another through a pipe and through which refrigerant circulates, a heat pump unit in which at least the evaporator of the refrigerant circuit is disposed, and a hot water tank unit including a hot water tank in which warm water produced by the radiator is stored, wherein the heat pump unit is disposed above the hot water tank unit, and heat resistance R1 between the hot water tank and the heat pump unit is greater than heat resistance R2 between the hot water tank and a side of the hot water tank unit.
- a first aspect of the invention provides a heat pump water heater comprising a refrigerant circuit which is formed by annularly connecting a compressor, a radiator, an expansion device and an evaporator to one another through a pipe and through which refrigerant circulates, a heat pump unit in which at least the evaporator of the refrigerant circuit is disposed, and a hot water tank unit including a hot water tank in which warm water produced by the radiator is stored, wherein the heat pump unit is disposed above the hot water tank unit, and heat resistance R1 between the hot water tank and the heat pump unit is greater than heat resistance R2 between the hot water tank and a side of the hot water tank unit.
- the heat resistance R1 between the upper portion of the hot water tank and the heat pump unit becomes greater than the heat resistance R2 between the hot water tank and the side of the hot water tank unit.
- the heat resistance R1 is 1.1 to 2.8 times of the heat resistance R2.
- the evaporator is disposed at a central portion of the heat pump unit with respect to a horizontal direction.
- an area of the evaporator where air and refrigerant which circulates through the evaporator heat-exchanges is increased.
- the heat pump unit further includes a cooling portion for cooling refrigerant, and the cooling portion is disposed below the evaporator.
- high temperature refrigerant before it is decompressed by the expansion device flows into the cooling portion below the evaporator.
- the lower portion of the evaporator is heated by heat which is transmitted from the cooling portion cooled by the high temperature refrigerant. That is, since a temperature difference between the hot water tank and the lower portion of the evaporator is reduced by the cooling portion, a heat moving amount from the hot water tank to the evaporator is reduced, and an energy loss caused by heat radiation from the hot water tank is reduced.
- the heat resistance R1 between the hot water tank and the heat pump unit on an inner side is greater than the heat resistance R1 on an outer side.
- a heat resistance in a region where heat flux is large i.e., in a region between the high temperature hot water tank and the low temperature evaporator can be made greater. Further, as compared with a case where an expensive material having great heat resistance is used entirely, a using amount of material having great heat resistance is reduced. Therefore, it is possible to provide a heat pump water heater in which the heat resistance between the hot water tank and the heat pump unit is inexpensively increased, a heat radiation amount from the hot water tank is reduced and energy efficiency is enhanced.
- Fig. 1 is a schematic block diagram of a heat pump water heater in a first embodiment of the present invention.
- the heat pump water heater 1A includes a heat pump unit 1, a fluid circuit 3, a hot water tank unit 4, and a partition 5 which partitions the heat pump unit 1 and the hot water tank unit 4 from each other. Expanded polypropylene as a first heat insulation material is used as the partition 5.
- the heat pump unit 1 includes a refrigerant circuit 2 through which refrigerant is circulated.
- refrigerant it is possible to use zeotropic refrigerant mixture such as R407C, pseudo azeotropic refrigerant mixture such as R410A, single refrigerant, i.e., HFC-based refrigerant such as R32, and natural refrigerant such as CO 2 .
- a hot water tank 41 is disposed in the hot water tank unit 4.
- a second heat insulation material 6 e.g., expanded polypropylene
- the refrigerant circuit 2 is configured by sequentially and annularly connecting a compressor 21, a radiator (condenser) 22, an expansion device 23 such as an expansion valve and a capillary tube, and an evaporator 24 to one another through a pipe.
- An accumulator 26 for separating gas and liquid from each other is provided between the evaporator 24 and the compressor 21.
- the refrigerant circuit 2 is provided with a four-way valve 25. By switching the four-way valve 25, a heat storage operation for heating the hot water tank 41 and a defrosting operation for eliminating frost generated on the evaporator 24 are carried out.
- the evaporator 24 is disposed above the hot water tank unit 4 and at a substantially central portion of the heat pump unit 1 in the horizontal direction, i.e., on an extension of a top 41 a of the hot water tank 41.
- a radiator 22 is a heat exchanger which exchanges heat between refrigerant and water.
- a portion of the refrigerant circuit 2 and a portion of the fluid circuit 3 are disposed in a radiator 22, and the radiator 22 exchanges heat between refrigerant which circulates through the refrigerant circuit 2 and heat medium such as water and brine which circulates through the fluid circuit 3.
- the fluid circuit 3 is configured by annularly connecting the radiator 22 of the heat pump unit 1, the hot water tank 41 of the hot water tank unit 4, and the circulation pump 31 to one another.
- the radiator 22 and the circulation pump 31 which configure the fluid circuit 3 are accommodated in the heat pump unit 1.
- An air blower 27 is provided in the vicinity of the evaporator 24.
- the air blower 27 sucks air from an air suction port 32 into the heat pump unit 1. Air sucked from the air suction port 32 is discharged from an air discharge port 33.
- arrows show flowing directions of refrigerant and warm water (fluid) at the time of the heat storage operation.
- high pressure and high temperature gas refrigerant discharged from the compressor 21 circulates through the refrigerant circuit 2 and flows into the radiator 22.
- Heat medium which is sent from the hot water tank 41 under pressure by the circulation pump 31 is supplied to the radiator 22.
- the high temperature and high pressure gas refrigerant heats the heat medium in the radiator 22, and the refrigerant is liquefied and condensed.
- the liquefied and condensed high pressure liquid refrigerant flows out from the radiator 22.
- the high pressure liquid refrigerant which flowed out from the radiator 22 is decompressed by the expansion device 23 and expanded and then, the refrigerant flows into the evaporator 24.
- Low pressure gas/liquid two phase refrigerant which flowed into the evaporator 24 absorbs heat from air and is evaporated, and becomes low pressure gas/liquid two phase refrigerant or excessively heated gas refrigerant and flows out from the evaporator 24.
- the low pressure refrigerant which flowed out from the evaporator 24 passes through the four-way valve 25, gas and liquid of the refrigerant are separated from each other in the accumulator 26 and then, gas refrigerant is sucked into the compressor 21.
- Heat medium which is heated in the radiator 22 becomes warm water, and flows out from the radiator 22 and flows into the hot water tank 41. According to this, heat is stored in the hot water tank 41.
- Temperature of environment where the heat pump water heater 1A shown in Fig. 1 is installed is defined as 20°C for example.
- heat resistance R1 (a reciprocal of a heat passage rate) between the upper portion of the hot water tank 41 and the heat pump unit 1 is set greater than heat resistance R2 between the hot water tank 41 and the side (exterior body 7) of the hot water tank unit 4.
- heat resistance R1 is defined as about two times of the heat resistance R2
- an area of an upper surface of the hot water tank unit 4 is defined as A1
- the heat resistance R1 and R2 can be expressed as L1/K1 and L2/K2, respectively.
- the heat resistance R1 and R2 are set to desired values by appropriately adjusting L1, R1, L2 and R2.
- the first heat insulation material of the partition 5 and the second heat insulation material 6 it is possible to use expanded resin such as expanded polystyrene in addition to the expanded polypropylene, fiber material such as glass wool and glass fiber, and a vacuum heat insulation material.
- expanded resin such as expanded polystyrene
- fiber material such as glass wool and glass fiber
- a vacuum heat insulation material By using these heat insulation materials singularly or in combination, and by forming and disposing an air layer between the heat insulation materials, the heat resistance R1 and R2 are set to desired values.
- heat resistance R1 it is also possible to adjust heat resistance of the first heat insulation material used as the partition 5 and heat resistance of the second heat insulation material 6 disposed on the upper portion of the hot water tank 41, and when a heat insulation material is disposed in the heat pump unit 1 and below the evaporator 24, it is also possible to adjust heat resistance of that heat insulation material.
- the heat resistance R1 above the hot water tank 41 is set excessively large as compared with the heat resistance R2 on the side of the hot water tank 41, an amount of heat stored in the hot water tank 41 is transmitted to the side of the hot water tank 41 having low heat resistance and the heat is dissipated. Therefore, it is not possible to effectively reduce the heat radiation amount as the entire hot water tank unit 4. Hence, it is necessary to appropriately adjust a relation between the heat resistance R1 above the hot water tank 41 and the heat resistance R2 on the side of the hot water tank 41 to uniform the heat flux around the hot water tank 41.
- temperature in a room where the heat pump water heater 1A is installed is defined as 20°C in accordance with European Norm EN16147
- temperature of hot water which is heated by the radiator 22 and stored in the hot water tank 41 is defined as 50°C to 90°C on the assumption that heat medium is heated using HFC refrigerant and on the assumption that heat medium is heated using CO2 refrigerant
- a difference ⁇ T between temperature of the evaporator 24 and outside air temperature is defined as 5 K to 15 K. According to this, a relation between heat resistance ratio R1/R2 and outside air temperature becomes as shown in Fig. 2 .
- heat flux q1 from the hot water tank 41 to the evaporator 24 becomes equal to heat flux q2 from the hot water tank 41 to the hot water tank unit 4, and heat flux around the hot water tank 41 is uniformed.
- the evaporator 24 When the evaporator 24 is disposed above the hot water tank unit 4 and at a substantially central portion of the heat pump unit 1 with respect to the horizontal direction, if the hot water tank unit 4 is formed into a rectangular parallelepiped shape, the evaporator 24 can be formed such that its length is equal to a lateral width of the hot water tank unit 4 or is equal to a length of a diagonal line of the hot water tank unit 4 as shown in Figs. 3(a) and 3(b) , and if the hot water tank unit 4 is formed into a columnar shape, the evaporator 24 can be formed such that its length is equal to a length of a diameter of the hot water tank unit 4 as shown in Fig. 3(c) .
- an area where air and refrigerant which circulates through the evaporator 24 are heat-exchanged can be increased.
- a heat absorption amount in the evaporator 24 can be increased and the heating ability in the radiator 22 can be enhanced.
- the heat resistance R1 of the partition 5 is higher in its inner side than its outer side which is on sides of the heat pump unit 1 and the hot water tank unit 4. More specifically, heat resistance of a region S1 of the partition 5 located below the evaporator 24, i.e., heat resistance of the region S1 where the evaporator 24 is located is set greater than heat resistance of other regions S2, i.e., heat resistance of the regions S2 where the evaporator 24 is not located.
- the region S1 where a top 41 a of the hot water tank 41 whose temperature becomes high and the low temperature evaporator 24 are located can be made as the region S1 where having the great heat resistance, and regions around the region S1 can be made as the regions S2 having small heat resistance.
- the heat pump water heater includes the partition 5 which partitions the heat pump unit 1 and the hot water tank unit 4 from each other, and the heat resistance R1 between the upper portion of the hot water tank 41 and the heat pump unit 1 is made greater than the heat resistance R2 between the hot water tank 41 and the side of the hot water tank unit 4. According to this, the following effects can be obtained.
- the heat resistance R1 in a location above the hot water tank 41 having a great heat radiation amount is made greater than the heat resistance R2 of the side of the hot water tank 41, and heat flux around the hot water tank 41 is uniformed. According to this, it is possible to reduce the heat radiation loss only by enhancing the heat insulation of the upper portion of the hot water tank 41, and to enhance the energy efficiency.
- the heat resistance R1 is set 1.1 to 2.8 times of the heat resistance R2. According to this, it is possible to uniform heat flux around the hot water tank 41 throughout the year during which outside air temperature is changed. Even if outside air temperature is changed, it is possible to reduce the heat radiation amount from the hot water tank 41 and to enhance the annual energy efficiency.
- the evaporator 24 is disposed above the hot water tank unit 4 and at the substantially central portion of the hot water tank unit 4 with respect to the horizontal direction. According to this, the area where air and refrigerant which circulates through the evaporator 24 are heat-exchanged can be increased. As a result, the heat absorption amount in the evaporator 24 can be increased and the heating ability in the radiator 22 can be enhanced.
- the heat resistance R1 of the partition 5 at its central portion is made greater than the heat resistance R1 of the peripheral portion of the partition 5. According to this, the region S1 having the great heat resistance is limited to a region between the high temperature hot water tank 41 and the low temperature evaporator 24. Hence, as compared with a case where a material having great heat resistance is used for the entire partition 5, a using amount of material having great heat resistance is reduced, and it is possible to inexpensively reduce the heat radiation amount from the hot water tank 41.
- the air may flow in from a side of the heat pump unit 1.
- the compressor 21, the radiator (condenser) 22, the expansion device 23 such as an expansion valve and a capillary tube and the evaporator 24 are sequentially and annularly connected to one another through the pipe to configure the refrigerant circuit 2, and the refrigerant circuit 2 is accommodated in the heat pump unit 1.
- the radiator (condenser) 22 may be configured by winding a refrigerant pipe around an outer periphery of the hot water tank 41, the radiator (condenser) 22 may be provided in the hot water tank 41, and the radiator (condenser) 22 may not be accommodated in the heat pump unit 1. According to this also, the effects of the present invention are exerted. Therefore, it is not absolutely necessary that the radiator (condenser) 22 is accommodated in the heat pump unit 1.
- Fig. 5 is a schematic block diagram of a heat pump water heater in a second embodiment of the present invention.
- the same symbols are allocated to the same function members as those in the first embodiment, and detailed description thereof will be omitted.
- an evaporator 24 of a heat pump unit 1 is a fin tube heat exchanger, and the evaporator 24 includes an evaporating portion 24a and a cooling portion 24b which cools refrigerant.
- the cooling portion 24b is disposed below the evaporator 24.
- high pressure and high temperature refrigerant discharged from a compressor 21 circulates through a refrigerant circuit 2 and flows into a radiator 22, and the refrigerant dissipates heat.
- Liquefied and condensed high pressure liquid refrigerant flows out from the radiator 22 and flows into the cooling portion 24b.
- the refrigerant heat-exchanges with air in the cooling portion 24b and is cooled.
- the refrigerant flows out from the cooling portion 24b and is decompressed and expanded by an expansion device 23 and then, the refrigerant flows into the evaporating portion 24a, and the refrigerant heat-exchanges with air and is evaporated.
- Low pressure refrigerant which flows out from the evaporator 24 passes through a four-way valve 25, gas and liquid of the refrigerant are separated from each other by an accumulator 26, gas phase refrigerant is sucked into the compressor 21 and is compressed, and the refrigerant again flows into the radiator 22.
- refrigerant before it is decompressed by the expansion device 23 has relatively high temperature as compared with outside air, and this refrigerant flows into the cooling portion 24b disposed below the evaporator 24.
- a lower portion of the evaporator 24 is heated by relatively high temperature refrigerant which flows out from the radiator 22, and the refrigerant dissipates heat to air in the cooling portion 24b and is cooled.
- a heat moving amount from the hot water tank 41 to the evaporator 24 is reduced, it is possible to reduce a heat radiation loss from the hot water tank 41, and to enhance the energy efficiency while making best use of the evaporator 24.
- the present invention is especially useful for a heat pump water heater which heats fluid by a heat pump unit and which supplies the fluid and utilizes the fluid for heating a room.
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- General Engineering & Computer Science (AREA)
- Heat-Pump Type And Storage Water Heaters (AREA)
- Details Of Fluid Heaters (AREA)
Abstract
Description
- The present invention relates to a water heater which heats water using a heat pump.
- Conventionally, there is known a heat pump water heater which produces high temperature fluid (warm water) utilizing condensation latent heat of refrigerant by a radiator of a heat pump unit, and carries out heat storage operation for storing the produced hw in a hot water tank, and which utilizes the produced hot water for heating a room or supplying the produced hot water.
- As such a heat pump water heater, there is one in which a heat pump unit is disposed on an upper portion of a hot water tank unit (see
patent document 1 for example). -
Figs. 6 show the heat pump water heater described inpatent document 1. As shown inFig. 6(a) , the heat pump water heater includes a hotwater tank unit 200 and aheat pump unit 100. Theheat pump unit 100 is disposed on an upper portion of the hotwater tank unit 200. - According to the
heat pump unit 100, acompressor 110, aradiator 120, an expansion device (not shown) and an evaporator (air heat exchanger) 130 are annularly connected to one another through a refrigerant pipe, and a refrigerant circuit is configured. Refrigerant flows through the refrigerant pipe. Theradiator 120 heat-exchanges between refrigerant which flows through the refrigerant circuit and fluid which flows through afluid circuit 230. - A
hot water tank 210, a portion of thefluid circuit 230 and acirculation pump 220 are disposed in the hotwater tank unit 200. Thefluid circuit 230 is configured by annularly connecting theradiator 120, thehot water tank 210 and thecirculation pump 220 to one another through a fluid pipe through which heat medium such as water flows. - As shown in
Fig. 6(b) , a lateral width of anevaporator 130 of theheat pump unit 100 is shorter than a lateral width of the hotwater tank unit 200 by a lateral width which is required for installing thecompressor 110. - In the case of the heat storage operation by which hot water is stored in the
hot water tank 210, low temperature fluid (water) stored in thehot water tank 210 is conveyed, by thecirculation pump 220, from thehot water tank 210 to theheat pump unit 100 through thefluid circuit 230. Heat medium (warm water) is heated by theradiator 120 of theheat pump unit 100 and temperature of the heat medium becomes high. The heat medium flows out from theheat pump unit 100 through thefluid circuit 230 and then flows into the hotwater tank unit 200 and is stored from thefluid circuit 230 which is connected to an upper portion of thehot water tank 210. - When it is requested to supply hot water, high temperature fluid in an upper portion of the
hot water tank 210 flows out from thehot water tank 210 through a pipe (not shown), and the fluid is conveyed to a hot water supply terminal. - High temperature fluid is produced by the
heat pump unit 100 using thehot water tank 210, heat is stored thehot water tank 210, and if it is requested to supply hot water, it is possible to utilize high temperature heat medium which is stored in thehot water tank 210. - [Patent Document 1] Japanese Patent Application Laid-open No.
2011-122752 - According to the conventional configuration, however, the
heat pump unit 100 is disposed on the upper portion of the hotwater tank unit 200, and the fluid pipe which connects theheat pump unit 100 and the hotwater tank unit 200 to each other is disposed on the upper portion of thehot water tank 210. - Therefore, the conventional configuration has such a problem that a heat resistance (a reciprocal of a heat passage rate) between the
heat pump unit 100 including thelow temperature evaporator 130 and the upper portion of the high temperaturehot water tank 210 becomes small, heat is prone to move from thehot water tank 210 whose temperature becomes high to theheat pump unit 100 and as a result, a heat radiation amount from thehot water tank 210 increases and energy efficiency is lowered. - The present invention has been accomplished to solve the conventional problem, and it is an object of the invention to provide a heat pump water heater which is capable of reducing a heat radiation loss from the hot water tank by appropriately insulating heat between the heat pump unit and the hot water tank unit and which has excellent energy saving performance.
- To solve the problems of the conventional technique, the present invention provides a heat pump water heater comprising a refrigerant circuit which is formed by annularly connecting a compressor, a radiator, an expansion device and an evaporator to one another through a pipe and through which refrigerant circulates, a heat pump unit in which at least the evaporator of the refrigerant circuit is disposed, and a hot water tank unit including a hot water tank in which warm water produced by the radiator is stored, wherein the heat pump unit is disposed above the hot water tank unit, and heat resistance R1 between the hot water tank and the heat pump unit is greater than heat resistance R2 between the hot water tank and a side of the hot water tank unit.
- According to this configuration, it is possible to reduce a heat radiation amount from the hot water tank by appropriately insulating heat between the heat pump unit and the upper portion of the hot water tank unit which is heated to higher temperature.
- According to the present invention, it is possible to provide a heat pump water heater which reduces the heat radiation amount from the hot water tank in which heat is stored and which has high energy efficiency.
-
-
Fig. 1 is a schematic block diagram of a heat pump water heater in a first embodiment of the present invention; -
Fig. 2 is a diagram showing a relation between outside air temperature and a heat ratio of the heat pump water heater; -
Fig. 3(a) is a plan view when an evaporator of the heat pump water heater is disposed in a lateral direction,Fig. 3(b) is a plan view when the evaporator of the heat pump water heater is disposed on a diagonal line, andFig. 3(c) is a plan view when the evaporator of the heat pump water heater is disposed in a radial direction; -
Fig. 4 is a plan view showing a configuration of a heat insulation material of the heat pump water heater; -
Fig. 5 is a schematic block diagram of a heat pump water heater in a second embodiment of the present invention; and -
Fig. 6(a) is a schematic side view showing a configuration of a conventional heat pump water heater, andFig. 6(b) is a schematic plan view showing a configuration of the conventional heat pump water heater. -
- 1
- heat pump unit
- 2
- refrigerant circuit
- 4
- hot water tank unit
- 5
- partition
- 1A
- heat pump water heater
- 21
- compressor
- 22
- radiator
- 23
- expansion valve (expansion device)
- 24
- evaporator
- 24a
- evaporating portion
- 24b
- cooling portion
- 41
- hot water tank
- A first aspect of the invention provides a heat pump water heater comprising a refrigerant circuit which is formed by annularly connecting a compressor, a radiator, an expansion device and an evaporator to one another through a pipe and through which refrigerant circulates, a heat pump unit in which at least the evaporator of the refrigerant circuit is disposed, and a hot water tank unit including a hot water tank in which warm water produced by the radiator is stored, wherein the heat pump unit is disposed above the hot water tank unit, and heat resistance R1 between the hot water tank and the heat pump unit is greater than heat resistance R2 between the hot water tank and a side of the hot water tank unit.
- According to this aspect, the heat resistance R1 between the upper portion of the hot water tank and the heat pump unit becomes greater than the heat resistance R2 between the hot water tank and the side of the hot water tank unit. Hence, heat is appropriately insulated between the upper portion of the hot water tank unit whose temperature becomes high and the heat pump unit having the evaporator whose temperature becomes low, and it is possible to reduce the heat radiation amount from the hot water tank. Therefore, it is possible to enhance the energy efficiency by the minimum heat insulation enhancement between the hot water tank and the heat pump unit.
- According to a second aspect of the invention, in the first aspect, the heat resistance R1 is 1.1 to 2.8 times of the heat resistance R2.
- According to this aspect, it is possible to uniform a heat flowing speed between the hot water tank and outside of the hot water tank unit throughout the year during which outside air temperature is changed. Hence, even if the outside air temperature is changed throughout the year, it is possible to reduce the heat radiation from the hot water tank and to enhance the annual energy efficiency.
- According to a third aspect of the invention, in the first or second aspect,
the evaporator is disposed at a central portion of the heat pump unit with respect to a horizontal direction. - According to this aspect, an area of the evaporator where air and refrigerant which circulates through the evaporator heat-exchanges is increased. Hence, it is possible to increase a heat absorption amount in the evaporator, and to enhance the heating ability in the radiator.
- According to a fourth aspect of the invention, in any one of the first to third aspects, the heat pump unit further includes a cooling portion for cooling refrigerant, and the cooling portion is disposed below the evaporator.
- According to this aspect, high temperature refrigerant before it is decompressed by the expansion device flows into the cooling portion below the evaporator. Hence, the lower portion of the evaporator is heated by heat which is transmitted from the cooling portion cooled by the high temperature refrigerant. That is, since a temperature difference between the hot water tank and the lower portion of the evaporator is reduced by the cooling portion, a heat moving amount from the hot water tank to the evaporator is reduced, and an energy loss caused by heat radiation from the hot water tank is reduced.
- According to a fifth aspect of the invention, in any one of the first to fourth aspects, the heat resistance R1 between the hot water tank and the heat pump unit on an inner side is greater than the heat resistance R1 on an outer side.
- According to this aspect, a heat resistance in a region where heat flux is large, i.e., in a region between the high temperature hot water tank and the low temperature evaporator can be made greater. Further, as compared with a case where an expensive material having great heat resistance is used entirely, a using amount of material having great heat resistance is reduced. Therefore, it is possible to provide a heat pump water heater in which the heat resistance between the hot water tank and the heat pump unit is inexpensively increased, a heat radiation amount from the hot water tank is reduced and energy efficiency is enhanced.
- Embodiments of the present invention will be described below with reference to the drawings. The invention is not limited to the embodiments.
-
Fig. 1 is a schematic block diagram of a heat pump water heater in a first embodiment of the present invention. - The heat
pump water heater 1A includes aheat pump unit 1, afluid circuit 3, a hotwater tank unit 4, and apartition 5 which partitions theheat pump unit 1 and the hotwater tank unit 4 from each other. Expanded polypropylene as a first heat insulation material is used as thepartition 5. - The
heat pump unit 1 includes arefrigerant circuit 2 through which refrigerant is circulated. As the refrigerant, it is possible to use zeotropic refrigerant mixture such as R407C, pseudo azeotropic refrigerant mixture such as R410A, single refrigerant, i.e., HFC-based refrigerant such as R32, and natural refrigerant such as CO2. - A
hot water tank 41 is disposed in the hotwater tank unit 4. A second heat insulation material 6 (e.g., expanded polypropylene) is disposed between a periphery of thehot water tank 41 and anexterior body 7 of the hotwater tank unit 4. - The
refrigerant circuit 2 is configured by sequentially and annularly connecting acompressor 21, a radiator (condenser) 22, anexpansion device 23 such as an expansion valve and a capillary tube, and anevaporator 24 to one another through a pipe. Anaccumulator 26 for separating gas and liquid from each other is provided between the evaporator 24 and thecompressor 21. Therefrigerant circuit 2 is provided with a four-way valve 25. By switching the four-way valve 25, a heat storage operation for heating thehot water tank 41 and a defrosting operation for eliminating frost generated on theevaporator 24 are carried out. - The
evaporator 24 is disposed above the hotwater tank unit 4 and at a substantially central portion of theheat pump unit 1 in the horizontal direction, i.e., on an extension of a top 41 a of thehot water tank 41. - A
radiator 22 is a heat exchanger which exchanges heat between refrigerant and water. A portion of therefrigerant circuit 2 and a portion of thefluid circuit 3 are disposed in aradiator 22, and theradiator 22 exchanges heat between refrigerant which circulates through therefrigerant circuit 2 and heat medium such as water and brine which circulates through thefluid circuit 3. Thefluid circuit 3 is configured by annularly connecting theradiator 22 of theheat pump unit 1, thehot water tank 41 of the hotwater tank unit 4, and thecirculation pump 31 to one another. Theradiator 22 and thecirculation pump 31 which configure thefluid circuit 3 are accommodated in theheat pump unit 1. - An
air blower 27 is provided in the vicinity of theevaporator 24. Theair blower 27 sucks air from anair suction port 32 into theheat pump unit 1. Air sucked from theair suction port 32 is discharged from anair discharge port 33. - In the heat
pump water heater 1A having the above-described configuration, action and an effect of the heat storage operation for heating water in thehot water tank 41 will be described. InFig. 1 , arrows show flowing directions of refrigerant and warm water (fluid) at the time of the heat storage operation. - If the heat storage operation is requested, high pressure and high temperature gas refrigerant discharged from the
compressor 21 circulates through therefrigerant circuit 2 and flows into theradiator 22. Heat medium which is sent from thehot water tank 41 under pressure by thecirculation pump 31 is supplied to theradiator 22. The high temperature and high pressure gas refrigerant heats the heat medium in theradiator 22, and the refrigerant is liquefied and condensed. The liquefied and condensed high pressure liquid refrigerant flows out from theradiator 22. - The high pressure liquid refrigerant which flowed out from the
radiator 22 is decompressed by theexpansion device 23 and expanded and then, the refrigerant flows into theevaporator 24. Low pressure gas/liquid two phase refrigerant which flowed into theevaporator 24 absorbs heat from air and is evaporated, and becomes low pressure gas/liquid two phase refrigerant or excessively heated gas refrigerant and flows out from theevaporator 24. The low pressure refrigerant which flowed out from the evaporator 24 passes through the four-way valve 25, gas and liquid of the refrigerant are separated from each other in theaccumulator 26 and then, gas refrigerant is sucked into thecompressor 21. - Heat medium which is heated in the
radiator 22 becomes warm water, and flows out from theradiator 22 and flows into thehot water tank 41. According to this, heat is stored in thehot water tank 41. - Next, concrete examples of temperatures of various portions of the heat
pump water heater 1A when the heat storage operation is carried out will be described below. - Temperature of environment where the heat
pump water heater 1A shown inFig. 1 is installed is defined as 20°C for example. - If the heat storage operation is carried out, high temperature water is stored in the
hot water tank 41, and theevaporator 24 is brought into a low temperature (below zero) state. Here, a temperature difference dT1 (= 65 K) between temperature of the hot water tank 41 (e.g., 55°C) and temperature of the evaporator 24 (e.g., -10°C) is about two times of a temperature difference dT2 (= 35 K) between temperature of a side surface of thehot water tank 41 and temperature of a side surface of the hot water tank unit 4 (e.g., 20°C). - In this embodiment, heat resistance R1 (a reciprocal of a heat passage rate) between the upper portion of the
hot water tank 41 and theheat pump unit 1 is set greater than heat resistance R2 between thehot water tank 41 and the side (exterior body 7) of the hotwater tank unit 4. Here, if the heat resistance R1 is defined as about two times of the heat resistance R2, heat flux (heat moving amount per unit area) q1 (= dT1/R1) from thehot water tank 41 to theheat exchanger evaporator 24 is substantially equal to heat flux q2 (= dT2/R2) from the side surface of thehot water tank 41 and the side surface of the hotwater tank unit 4. - At this time, if an area of an upper surface of the hot
water tank unit 4 is defined as A1, since the area A1 is smaller than an area A2 of the side of the hotwater tank unit 4, a heat moving amount Q1 (= q1×A1) between the high temperaturehot water tank 41 and thelow temperature evaporator 24 becomes smaller than a heat moving amount Q2 (= q2xA2) between thehot water tank 41 and the side of the hotwater tank unit 4. Therefore, since the temperature is high, it is possible to reduce the heat radiation amount from the upper portion of thehot water tank 41 having the large heat flux, and to enhance the energy efficiency. - Here, if the first heat insulation material having thermal conductivity K1 and thickness L1 is used as the
partition 5 and if amaterial 6 having thermal conductivity K2 and thickness L2 is used as the second heat insulation material between the hotwater tank unit 4 and theexterior body 7 of the hotwater tank unit 4, the heat resistance R1 and R2 can be expressed as L1/K1 and L2/K2, respectively. Hence, the heat resistance R1 and R2 are set to desired values by appropriately adjusting L1, R1, L2 and R2. - As the first heat insulation material of the
partition 5 and the secondheat insulation material 6, it is possible to use expanded resin such as expanded polystyrene in addition to the expanded polypropylene, fiber material such as glass wool and glass fiber, and a vacuum heat insulation material. By using these heat insulation materials singularly or in combination, and by forming and disposing an air layer between the heat insulation materials, the heat resistance R1 and R2 are set to desired values. - Concerning the heat resistance R1, it is also possible to adjust heat resistance of the first heat insulation material used as the
partition 5 and heat resistance of the secondheat insulation material 6 disposed on the upper portion of thehot water tank 41, and when a heat insulation material is disposed in theheat pump unit 1 and below theevaporator 24, it is also possible to adjust heat resistance of that heat insulation material. - If the heat resistance R1 above the
hot water tank 41 is set excessively large as compared with the heat resistance R2 on the side of thehot water tank 41, an amount of heat stored in thehot water tank 41 is transmitted to the side of thehot water tank 41 having low heat resistance and the heat is dissipated. Therefore, it is not possible to effectively reduce the heat radiation amount as the entire hotwater tank unit 4. Hence, it is necessary to appropriately adjust a relation between the heat resistance R1 above thehot water tank 41 and the heat resistance R2 on the side of thehot water tank 41 to uniform the heat flux around thehot water tank 41. - Outside air temperature at a location where the heat
pump water heater 1A is installed, environmental temperature thereof, and temperature of hot water stored in thehot water tank 41 are changed throughout the year. Therefore, it is necessary to set the relation between the heat resistance R1 and the heat resistance R2 to uniform the heat flux around thehot water tank 41 so that annual change in temperature can be accommodated. A method thereof will be described below. - The outside air temperature at a location where the heat
pump water heater 1A is installed, environmental temperature thereof, and temperature of hot water stored in thehot water tank 41 are changed throughout the year. Therefore, temperature differences dT1 and dT2 are also changed. Here, if heat flux q1 = q2, dT1/dT2 = R1/R2 is also changed if the outside air temperature is changed. - Here, temperature in a room where the heat
pump water heater 1A is installed is defined as 20°C in accordance with European Norm EN16147, temperature of hot water which is heated by theradiator 22 and stored in thehot water tank 41 is defined as 50°C to 90°C on the assumption that heat medium is heated using HFC refrigerant and on the assumption that heat medium is heated using CO2 refrigerant, and a difference ΔT between temperature of theevaporator 24 and outside air temperature is defined as 5 K to 15 K. According to this, a relation between heat resistance ratio R1/R2 and outside air temperature becomes as shown inFig. 2 . - When heat flux q1 = q2, R1/R2 = dT1/dT2 is in a range of 1.1 to 2.8 with respect to change in outside air temperature in a range of outside air temperature of -20°C to 20°C which is based on assumption of extremely low outside air temperature in a cold weather region.
- That is, when R1/R2 = 1.1 to 2.8, heat flux q1 from the
hot water tank 41 to theevaporator 24 becomes equal to heat flux q2 from thehot water tank 41 to the hotwater tank unit 4, and heat flux around thehot water tank 41 is uniformed. - Therefore, when R1/R2 = 1.1 to 2.8, since it is possible to uniform heat flux throughout the year during which outside air temperature is changed, even if outside air temperature is changed throughout the year, it is possible to reduce the heat radiation amount from the upper portion of the
hot water tank 41. - When the
evaporator 24 is disposed above the hotwater tank unit 4 and at a substantially central portion of theheat pump unit 1 with respect to the horizontal direction, if the hotwater tank unit 4 is formed into a rectangular parallelepiped shape, theevaporator 24 can be formed such that its length is equal to a lateral width of the hotwater tank unit 4 or is equal to a length of a diagonal line of the hotwater tank unit 4 as shown inFigs. 3(a) and 3(b) , and if the hotwater tank unit 4 is formed into a columnar shape, theevaporator 24 can be formed such that its length is equal to a length of a diameter of the hotwater tank unit 4 as shown inFig. 3(c) . Hence, an area where air and refrigerant which circulates through theevaporator 24 are heat-exchanged can be increased. As a result, a heat absorption amount in theevaporator 24 can be increased and the heating ability in theradiator 22 can be enhanced. - As shown in
Fig. 4 , the heat resistance R1 of thepartition 5 is higher in its inner side than its outer side which is on sides of theheat pump unit 1 and the hotwater tank unit 4. More specifically, heat resistance of a region S1 of thepartition 5 located below theevaporator 24, i.e., heat resistance of the region S1 where theevaporator 24 is located is set greater than heat resistance of other regions S2, i.e., heat resistance of the regions S2 where theevaporator 24 is not located. According to this, the region S1 where a top 41 a of thehot water tank 41 whose temperature becomes high and thelow temperature evaporator 24 are located can be made as the region S1 where having the great heat resistance, and regions around the region S1 can be made as the regions S2 having small heat resistance. - According to this, as compared with a case where a material having great heat resistance is used for the
entire partition 5, a using amount of material having great heat resistance is reduced, and it is possible to inexpensively reduce the heat radiation amount from thehot water tank 41. - As described above, in this embodiment, the heat pump water heater includes the
partition 5 which partitions theheat pump unit 1 and the hotwater tank unit 4 from each other, and the heat resistance R1 between the upper portion of thehot water tank 41 and theheat pump unit 1 is made greater than the heat resistance R2 between thehot water tank 41 and the side of the hotwater tank unit 4. According to this, the following effects can be obtained. - That is, the heat resistance R1 in a location above the
hot water tank 41 having a great heat radiation amount is made greater than the heat resistance R2 of the side of thehot water tank 41, and heat flux around thehot water tank 41 is uniformed. According to this, it is possible to reduce the heat radiation loss only by enhancing the heat insulation of the upper portion of thehot water tank 41, and to enhance the energy efficiency. - The heat resistance R1 is set 1.1 to 2.8 times of the heat resistance R2. According to this, it is possible to uniform heat flux around the
hot water tank 41 throughout the year during which outside air temperature is changed. Even if outside air temperature is changed, it is possible to reduce the heat radiation amount from thehot water tank 41 and to enhance the annual energy efficiency. - The
evaporator 24 is disposed above the hotwater tank unit 4 and at the substantially central portion of the hotwater tank unit 4 with respect to the horizontal direction. According to this, the area where air and refrigerant which circulates through theevaporator 24 are heat-exchanged can be increased. As a result, the heat absorption amount in theevaporator 24 can be increased and the heating ability in theradiator 22 can be enhanced. - The heat resistance R1 of the
partition 5 at its central portion is made greater than the heat resistance R1 of the peripheral portion of thepartition 5. According to this, the region S1 having the great heat resistance is limited to a region between the high temperaturehot water tank 41 and thelow temperature evaporator 24. Hence, as compared with a case where a material having great heat resistance is used for theentire partition 5, a using amount of material having great heat resistance is reduced, and it is possible to inexpensively reduce the heat radiation amount from thehot water tank 41. - Although air flows in from the
air suction port 32 of the upper portion of theheat pump unit 1 in the embodiment, the air may flow in from a side of theheat pump unit 1. In the embodiment, thecompressor 21, the radiator (condenser) 22, theexpansion device 23 such as an expansion valve and a capillary tube and theevaporator 24 are sequentially and annularly connected to one another through the pipe to configure therefrigerant circuit 2, and therefrigerant circuit 2 is accommodated in theheat pump unit 1. Alternatively, the radiator (condenser) 22 may be configured by winding a refrigerant pipe around an outer periphery of thehot water tank 41, the radiator (condenser) 22 may be provided in thehot water tank 41, and the radiator (condenser) 22 may not be accommodated in theheat pump unit 1. According to this also, the effects of the present invention are exerted. Therefore, it is not absolutely necessary that the radiator (condenser) 22 is accommodated in theheat pump unit 1. -
Fig. 5 is a schematic block diagram of a heat pump water heater in a second embodiment of the present invention. In the second embodiment, the same symbols are allocated to the same function members as those in the first embodiment, and detailed description thereof will be omitted. - In a heat
pump water heater 1A of the second embodiment, anevaporator 24 of aheat pump unit 1 is a fin tube heat exchanger, and theevaporator 24 includes an evaporatingportion 24a and acooling portion 24b which cools refrigerant. Here, the coolingportion 24b is disposed below theevaporator 24. - Action and an effect of the heat
pump water heater 1A having the above-described configuration will be described below. - If a heat storage operation is requested, high pressure and high temperature refrigerant discharged from a
compressor 21 circulates through arefrigerant circuit 2 and flows into aradiator 22, and the refrigerant dissipates heat. Liquefied and condensed high pressure liquid refrigerant flows out from theradiator 22 and flows into the coolingportion 24b. The refrigerant heat-exchanges with air in the coolingportion 24b and is cooled. The refrigerant flows out from the coolingportion 24b and is decompressed and expanded by anexpansion device 23 and then, the refrigerant flows into the evaporatingportion 24a, and the refrigerant heat-exchanges with air and is evaporated. Low pressure refrigerant which flows out from the evaporator 24 passes through a four-way valve 25, gas and liquid of the refrigerant are separated from each other by anaccumulator 26, gas phase refrigerant is sucked into thecompressor 21 and is compressed, and the refrigerant again flows into theradiator 22. - Here, refrigerant before it is decompressed by the
expansion device 23 has relatively high temperature as compared with outside air, and this refrigerant flows into the coolingportion 24b disposed below theevaporator 24. - As a result, a lower portion of the
evaporator 24 is heated by relatively high temperature refrigerant which flows out from theradiator 22, and the refrigerant dissipates heat to air in the coolingportion 24b and is cooled. - According to this, temperature of the lower portion of the
evaporator 24 rises, a temperature difference between the upper portion of the high temperaturehot water tank 41 and a portion of theevaporator 24, especially the evaporatingportion 24a whose temperature becomes low is reduced. Since refrigerant can be brought into an excessively cooled state by the coolingportion 24b, it is possible to increase an enthalpy difference in the evaporator. - Hence, a heat moving amount from the
hot water tank 41 to theevaporator 24 is reduced, it is possible to reduce a heat radiation loss from thehot water tank 41, and to enhance the energy efficiency while making best use of theevaporator 24. - The present invention is especially useful for a heat pump water heater which heats fluid by a heat pump unit and which supplies the fluid and utilizes the fluid for heating a room.
Claims (5)
- A heat pump water heater comprising
a refrigerant circuit which is formed by annularly connecting a compressor, a radiator, an expansion device and an evaporator to one another through a pipe and through which refrigerant circulates,
a heat pump unit in which at least the evaporator of the refrigerant circuit is disposed, and
a hot water tank unit including a hot water tank in which warm water produced by the radiator is stored, wherein
the heat pump unit is disposed above the hot water tank unit, and
heat resistance R1 between the hot water tank and the heat pump unit is greater than heat resistance R2 between the hot water tank and a side of the hot water tank unit. - The heat pump water heater according to claim 1, wherein the heat resistance R1 is 1.1 to 2.8 times of the heat resistance R2.
- The heat pump water heater according to claim 1 or 2, wherein the evaporator is disposed at a central portion of the heat pump unit with respect to a horizontal direction.
- The heat pump water heater according to any one of claims 1 to 3, wherein the heat pump unit further includes a cooling portion for cooling refrigerant, and
the cooling portion is disposed below the evaporator. - The heat pump water heater according to any one of claims 1 to 4, wherein the heat resistance R1 between the hot water tank and the heat pump unit on an inner side is greater than the heat resistance R1 on an outer side.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012253968A JP2014102030A (en) | 2012-11-20 | 2012-11-20 | Heat-pump hot water supply device |
Publications (2)
Publication Number | Publication Date |
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EP2733437A1 true EP2733437A1 (en) | 2014-05-21 |
EP2733437B1 EP2733437B1 (en) | 2017-06-14 |
Family
ID=49626821
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP13193291.5A Active EP2733437B1 (en) | 2012-11-20 | 2013-11-18 | Heat pump water heater |
Country Status (5)
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EP (1) | EP2733437B1 (en) |
JP (1) | JP2014102030A (en) |
CN (1) | CN103836790B (en) |
AU (1) | AU2013257524A1 (en) |
DK (1) | DK2733437T3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105435480A (en) * | 2015-12-25 | 2016-03-30 | 佛山德众制药机械有限公司 | Vacuum push-pull alcohol concentration system |
EP3462103A1 (en) * | 2017-09-28 | 2019-04-03 | Daikin Industries, Ltd. | Hot-water supply unit and method for manufacturing the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110966749B (en) * | 2018-09-30 | 2022-10-18 | 青岛经济技术开发区海尔热水器有限公司 | Control method of supercharged gas water heater and gas water heater |
CN110966763A (en) * | 2018-09-30 | 2020-04-07 | 青岛经济技术开发区海尔热水器有限公司 | Control method of supercharged gas water heater and gas water heater |
CN110966750A (en) * | 2018-09-30 | 2020-04-07 | 青岛经济技术开发区海尔热水器有限公司 | Supercharged gas water heater and control method |
CN110966769A (en) * | 2018-09-30 | 2020-04-07 | 青岛经济技术开发区海尔热水器有限公司 | Control method of supercharged gas water heater and gas water heater |
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CN202303879U (en) * | 2011-10-08 | 2012-07-04 | 东莞市瑞星空调设备有限公司 | Direct heating and circulating type heat pump hot water unit |
-
2012
- 2012-11-20 JP JP2012253968A patent/JP2014102030A/en active Pending
-
2013
- 2013-11-18 DK DK13193291.5T patent/DK2733437T3/en active
- 2013-11-18 EP EP13193291.5A patent/EP2733437B1/en active Active
- 2013-11-18 AU AU2013257524A patent/AU2013257524A1/en not_active Abandoned
- 2013-11-20 CN CN201310586938.1A patent/CN103836790B/en active Active
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US4320630A (en) * | 1980-11-06 | 1982-03-23 | Atlantic Richfield Company | Heat pump water heater |
JPS5855643A (en) * | 1981-09-26 | 1983-04-02 | Matsushita Electric Ind Co Ltd | Hot water supply device |
DE102004056386A1 (en) * | 2004-11-23 | 2006-05-24 | Stiebel Eltron Gmbh & Co. Kg | Hot water producing device, has condenser provided in hot water tank for condensation of cooling medium in cooling medium circuit, where cooling medium conduit of circuit is isolated from tank and guided through walls of tank |
WO2011025374A1 (en) * | 2009-08-26 | 2011-03-03 | Inventum Holding B.V. | Heat transport device and heat transport system |
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CN105435480A (en) * | 2015-12-25 | 2016-03-30 | 佛山德众制药机械有限公司 | Vacuum push-pull alcohol concentration system |
CN105435480B (en) * | 2015-12-25 | 2017-07-11 | 佛山德众制药机械有限公司 | Vacuum recommends alcohol concentration systems |
EP3462103A1 (en) * | 2017-09-28 | 2019-04-03 | Daikin Industries, Ltd. | Hot-water supply unit and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN103836790A (en) | 2014-06-04 |
AU2013257524A1 (en) | 2014-06-05 |
CN103836790B (en) | 2018-01-05 |
DK2733437T3 (en) | 2017-07-24 |
EP2733437B1 (en) | 2017-06-14 |
JP2014102030A (en) | 2014-06-05 |
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