EP2714407B1 - Druckkopfchip - Google Patents

Druckkopfchip Download PDF

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Publication number
EP2714407B1
EP2714407B1 EP11866663.5A EP11866663A EP2714407B1 EP 2714407 B1 EP2714407 B1 EP 2714407B1 EP 11866663 A EP11866663 A EP 11866663A EP 2714407 B1 EP2714407 B1 EP 2714407B1
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EP
European Patent Office
Prior art keywords
slot
segment
segments
full
length
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EP11866663.5A
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English (en)
French (fr)
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EP2714407A4 (de
EP2714407A1 (de
Inventor
James P. Axtell
Joseph M. Torgerson
Trudy Benjamin
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Priority to PL11866663T priority Critical patent/PL2714407T3/pl
Publication of EP2714407A4 publication Critical patent/EP2714407A4/de
Publication of EP2714407A1 publication Critical patent/EP2714407A1/de
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Publication of EP2714407B1 publication Critical patent/EP2714407B1/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/145—Arrangement thereof
    • B41J2/155—Arrangement thereof for line printing

Definitions

  • Inkjet printheads are widely used in printing mechanisms today. Those mechanisms, in turn, go into many products such desktop printers, portable printers, plotters, copiers, camera printers, transaction printers, video printers, point-of-sale terminals, facsimile machines, and all-in-one devices (e.g. a combination of at least two of a printer, scanner, copier, and fax), to name a few.
  • Printheads typically have a number of liquid ejection elements, often referred to as "nozzles", that are arranged in a linear orientation having a particular length along the major axis of the linear array. This length may be referred to as the "height" of the printhead, although the printhead can be orientated in any direction.
  • the length along the minor axis of the linear array, a direction that is orthogonal to the height of the printhead, may be referred to as the "width". In general, the wider the printhead for a given length, the larger the area of the printhead, and the higher the cost of the printhead.
  • US 2003/052944 A1 describes a printhead assembly which includes a carrier having a fluid manifold defined therein, and a plurality of printhead dies each mounted on the carrier and including a first nozzle set and a second nozzle set.
  • the fluid manifold includes a first chamber and a second chamber such that the first nozzle set of each of the printhead dies communicates with the first chamber of the fluid manifold and the second nozzle set of each of the printhead dies communicates with the second chamber of the fluid manifold.
  • drops are deposited on a print medium, as the printer's printhead, the print medium, or both, are moved relative to each other.
  • the printer may be configured such that the printhead has a height that is at least as large as a corresponding dimension of the print medium.
  • the print medium thus may pass beneath the printhead, and drops may be deposited on the entire printable area in a single pass. This may effectively eliminate the delay otherwise associated with reciprocating the printhead across the print medium to cover the entire printable area.
  • Inkjet printheads typically are fabricated on a substrate, such as a silicon die, using integrated circuit and/or micromachining fabrication techniques. Nozzles may be disposed on either side of a feed slot that is formed completely through the die. The feed slot feeds liquid to the nozzles for ejection.
  • a heating element such as a resistor, rapidly heats a small volume of liquid, forming a bubble which causes at least one drop of the liquid to be ejected.
  • the electrical energy needed to operate the nozzles is typically connected to the die at a surface edge.
  • a “liquid” shall be broadly understood to mean a fluid not composed primarily of a gas or gases.
  • terms of orientation and relative position are not intended to require a particular orientation of any element or assembly, and are used for convenience of illustration and description.
  • these voltage drops can become large enough to prevent the nozzles nearest to the electrical connection to the die, and/or the nozzles furthest from the electrical connection to the die, from operating in their allowable voltage range. If this occurs, the size of the drops ejected from different nozzles may vary, some nozzles may be unable to emit drops, and some nozzles may be damaged. All of these effects result in the quality of the printed output being degraded.
  • example printhead die are illustrated wherein electrical traces provide proper electrical power to the various nozzles of the die in order to produce print output of the desired quality.
  • the die may provide plural feed slots to feed the same liquid to different nozzle subsets within a broader nozzle array. Feed slots, and nozzle subsets may extend along a major axis of the die.
  • the shaping and layout of the various components on the printhead die minimize the width (along a minor axis) of the die while providing proper power distribution to all nozzles, thus reducing the cost of the printhead die.
  • FIG. 1 An example printhead die 10 is shown in FIG. 1 , the printhead die having a slot arrangement in which a full-length slot 20 is formed through a substrate 11, the full-length slot being segmented into a plurality of smaller discrete slot segments 20a-20d for feeding a same liquid (represented generally by cross-hatch in Fig. 1 ) through the die.
  • the slot segments may form plural columns, each column including at least one slot segment.
  • slot segments 20a-20d define two substantially parallel columns 12, 14, each column including a pair of aligned slot segments, parallel to the slot segments in the other column.
  • each column is shown with two slot segments in Fig. 1 , more or fewer slot segments may be employed.
  • slot-to-slot spacing 30 may be approximately 1000 microns. It will be understood that slot-to-slot spacing 30 may be determined, in part, by the desire to run electrical traces between the slot segments. It also will be understood that the slot-to-slot spacing 30 affects the width 35 of die 10. Width 35, in turn, affects the cost of the die.
  • the slot segments may be staggered such that adjacent slot segments are in different rows. Adjacent slot segments (in different columns), such as slot segments 20a, 20b, are also offset from each other along the major axis direction 2. Typically, adjacent slot segments (again, in different columns) are arranged such that adjacent ends of the slot segments are positioned along the same minor axis. For example, the adjacent ends of slot segments 20b, 20c are along the same minor axis 32. Similarly, the adjacent ends of slot segments 20a, 20b are along the same minor axis, as are the adjacent ends of slot segments 20c, 20d, and so on.
  • This positioning facilitates treating the nozzles associated with the slot segments of both columns 12, 14 as a virtual linear array of nozzles of height 37 during printing operations, where the nozzles are equally spaced along the major axis 2.
  • the slot segments thus may act as a single full-length slot.
  • the adjacent ends of adjacent slot segments may overlap the minor axis 32 by a few nozzles in order to allow for compensation of effects such as misdirection of drops ejected from end nozzles or to provide sufficient liquid flow to the end nozzles.
  • the overlapping nozzles that achieve the desired printing performance may be chosen for use during printing operations.
  • the height 37 may be one to four inches, or more.
  • contact pads 42 may be connected to printhead die 10 via contact pads 42.
  • Each contact pad 42 is associated with an individual power connection, data signal, or control signal.
  • at least one contact pad 42 is disposed on die 10 between each two slot segments in a particular column.
  • contact pad 42a is disposed in column 12 between slot segments 20a, 20c.
  • electrical traces 40 are run across die 10 in minor axis direction 4. Since the slot segments pass completely through the die, the electrical traces are routed around the slot segments.
  • the slot-to-slot spacing 30 thus selected to be sufficient to allow, for example, electrical trace 40a to pass between the lower end of slot segment 20a and the upper end of slot segment 20b.
  • Electrical trace 40a thus can be connected to electronics disposed on the side of slot segments 20a, 20b that is opposite contact pad 42a. While not illustrated for reasons of clarity, it is understood that electrical traces from pad 42a also may directly connect to electronics on the side of slot segments 20a, 20b that is nearest contact pad 42a.
  • the total length of electrical trace 40a may be considerably shorter than it would be if, for example, slot segments 20a-20d were all combined into a single slot of height 37. In that case, the trace 40a would be far longer, as it would be routed around the top or bottom end of the die to get to the electronics on the other side of the slot from the pad. In page wide arrays, and particularly for power traces that carry a significant amount of current, such as up to one ampere, this excessive distance would result in unacceptable voltage drops due to the parasitic resistance of the trace.
  • the lengths of electrical traces 40a, 40b are short enough to ensure that the voltages applied to all nozzles, regardless of location, are within tolerance. This, in turn, helps ensure that the size of the drops ejected from different nozzles is consistent, and that all nozzles are able to emit drops, which in turn helps ensure that the printed output is of high quality.
  • nozzle package 50 is disposed adjacent to, or abutting, each long side of a slot.
  • Each nozzle package 50 may be substantially rectangular, and has a height substantially the same as the slot segment height.
  • a "slot cluster” shall be broadly understood to mean the arrangement of a slot segment and at least one nozzle package disposed abutting or adjacent to a long side of the slot segment.
  • a "nozzle package” shall be broadly understood to include an array of spaced nozzles abutting or adjacent to a long side of a slot segment, such that the liquid fed through the slot segment can flow into each nozzle of the nozzle package for subsequent ejection.
  • Each nozzle package also shall be understood to include electronics that receive power, data, and/or control signals that cause drops of the liquid to be controllably ejected from the individual nozzles.
  • the form factor of the electronics is shown as a simple rectangle, but other arrangements are contemplated.
  • the power data and/or control signals are received by the electronics via traces which may be connected to signal source locations such as, for example, pads 42a.
  • the power, data and/or control signals may be routed through a diagonal pathway 70 between adjacent clusters 60a, 60b.
  • each nozzle package may include, for example, a drive switch array disposed adjacent, or abutting, the linear nozzle array.
  • Each nozzle in the linear array is associated with a corresponding drive switch in the drive switch array.
  • a power trace also referred to as a "fire line”
  • the corresponding drive switch is connected to the other side of the firing resistor.
  • the drive switch is also connected to a reference voltage (typically ground) trace.
  • the drive switch controls the flow of current through the firing resistor. When the drive switch is turned on, current sufficient to heat the liquid and eject the drop from the nozzle flows from the power trace, through the firing resistor, to ground.
  • the drive switch is a field-effect transistor (FET) switch in which the firing resistor and ground are connected to the drain-source path of the FET, and the drive switch array is an array of such FETs.
  • FET field-effect transistor
  • the electronics also may include a control logic array disposed adjacent, or abutting, the drive switch array.
  • the control logic array receives data and control signals and determines whether and when drops of the liquid are ejected from a particular nozzle.
  • An output from the control logic array is connected to the control input of each drive switch, such as the gate of a FET switch.
  • the control logic array includes about five to ten logic-type control transistors for each FET drive switch. However, these control transistors each typically occupy a smaller area than the FET drive switch.
  • each slot segment in the minor axis direction 4 is about 150 microns.
  • the height 39 of each slot segment in the major axis direction 2 may be about 15,000 to 30,000 microns.
  • the slot may have an aspect ratio of about 100 to 1, or greater. Consequently, for a page wide printhead die wherein each slot segment has a height of approximately 1 ⁇ 2-inch, there will be eight slot segments in each column (a total of 16 slot segments) in order to for a achieve an 8-inch swath height. It will be appreciated that the drawings of FIGS. 1 through 3 , accordingly, are, for purposes of clarity, not drawn to scale and do not show all of the slot segments.
  • the width 52 of a nozzle package 50 may be about 400 microns.
  • the slot segment width 54 is about 150 microns, as described above, and where there is a nozzle package on each side of the slot segment, the corresponding slot cluster 60a is about 950 microns wide.
  • the slot-to-slot spacing 30 is based not just on the width 52 of the nozzle packages 50a, 50b, however, but also on the width, in minor axis direction 4, of the pathway 70 through which electrical trace 40a is routed to at least nozzle package 50d.
  • power, data and/or control signals may be provided to the electronics of nozzle package 50a via a trace that is coupled to electrical trace 40a (as shown), or connected directly from pad 42a. Such electrical trace could connect to the electronics of nozzle package 50a without being run through pathway 70.
  • the length and the width of trace 40a depend not just on the width of the slot clusters, but also on the slot-to-slot spacing 30 between slot segments 20a and 20b in minor axis direction 4. A longer trace 40a occurs with a larger spacing 30.
  • the width of trace 40a although one trace 40a and pad 42a are illustrated for clarity, it can be appreciated that a number of different traces for power, data, and/or control signals may run through pathway 70.
  • the dimensions of pathway 70 are typically chosen to accommodate the number and the width of the traces that are routed through the pathway 70. Or, stated conversely, the dimensions of the pathway 70 may limit the number and/or the width of the traces that can be routed through the pathway 70.
  • the width of power traces is typically considerably wider than that of data or signal traces, due to the larger amount of current carried by the power traces.
  • the adjacent ends of slot segments 20a, 20b are constrained to remain along the same minor axis 32 in order to maintain the equidistant spacing of nozzles in the major axis direction 2 across both slot segment 20a and slot segment 20b, widening the pathway 70 is accomplished by increasing the slot-to-slot spacing 30.
  • the die may be a rectangular page wide array printhead die 410.
  • the die 410 takes the form of a substrate having an arrangement of generally rectangular printhead slot clusters 460 formed thereon.
  • Each printhead slot cluster 460 has a liquid feed slot 420 that substantially bisects the slot cluster 460 in a bisecting direction 402.
  • Each slot cluster 460 also has a nozzle package 450 adjacent, or abutting, each side of the liquid feed slot segment 420.
  • a nozzle package 450 may include a nozzle array and electronics.
  • Another example of a nozzle package 450 may include a nozzle array, a drive switch array, and a control logic array as described with reference to FIG. 2 above.
  • nozzle packages for a given liquid - such as, for example, a liquid of a particular color - are staggered in two alternating columns 412, 414 in the bisecting direction 402.
  • the die 410 has a diagonal pathway 470a between a first slot cluster 460a for the given liquid in the first column 412 and an adjacent second slot cluster 460b for the given liquid in the second column 414.
  • a electrical trace 440a can be routed from a first location in the first column (i.e.
  • the electrical trace 440a may also connect to one or more of the nozzle package 450a, 450c and 450d.
  • two alternating columns 416, 418 of slot clusters 460e, 460f for a second liquid are spaced apart, in a direction 404 orthogonal to the bisecting direction 402, from the two alternating columns 412, 414 for the given liquid.
  • the slot-to-slot spacing 431 between slot clusters 460 for two different liquids in adjacent columns may be considerably greater than the slot-to-slot spacing 430 between slot clusters 460 for the same liquid in adjacent columns (e.g., columns 412, 414).
  • the spacing 431 is typically related to the size of the physical barriers, such as vertical ribs, between columns 414, 416 that are attached to the back side of the die 410 to keep the two different liquids separated from each other.
  • the slot clusters 460 are arranged on the die 410 in rows and columns. Each pair of adjacent columns is associated with a different liquid. For example, columns 412 and 414 collectively include a full-length slot for delivery of cyan ink, while columns 416 and 418 collectively include a full-length slot for delivery of yellow ink.
  • Each slot cluster 460 is assigned to a particular row.
  • an electrical trace 440a is routed across the die 410 in the row direction 404 between two rows of slot clusters 460.
  • electrical trace 440a follows a serpentine path across the die that passes in a serpentine manner through a diagonal passageway 470a between a slot cluster 460a, 460e in one row and a slot cluster 460b, 460f in the other row.
  • electrical trace 440 is routed between every other adjacent pair of rows.
  • power trace 440b passes in a serpentine manner through a diagonal passageway 470b between a slot cluster 460c in one row and a slot cluster 460d in the other row.
  • Contact pads 442a, 442b may be disposed at or near a vertical edge of the die 410.
  • pad 442a is connected to electrical trace 440a
  • pad 442b is connected to electrical trace 440b.
  • locations for slot segments for a same liquid, staggered in two alternating columns, are defined on the substrate.
  • nozzle electronics are provided on one or both sides of each slot location.
  • the electronics can be fabricated on the die by integrated circuit processing techniques such as a standard NMOS or CMOS silicon fabrication process.
  • the electronics are configured to control ejection of drops of the same liquid from a linear array of nozzles.
  • traces including one or more power traces, are provided from a source point, such as a pad, between two adjacent slot locations in one column, around one end of a third slot location in the other column, to electronics on a far side of the third slot location.
  • the traces can be fabricated on the die using integrated circuit processing techniques the same or similar to those for the electronics.
  • slots are formed through the substrate at each of the slot locations.
  • the slots can be formed through the substrate by techniques such as laser drilling.
  • the slot is typically formed after the electronics and the traces have been fabricated.
  • nozzle arrays are formed on the die between each slot and each electronics.
  • the firing resistors are fabricated using integrated circuit processing techniques, such as NMOS or CMOS techniques.
  • the orifice layer is a metal orifice layer that is attached to the die.
  • the orifice layer is an SU8 MEMS-type orifice layer formed using semiconductor processing techniques such as patterning and etching.
  • the firing resistors may be formed before slot formation, while the orifice layer is formed after slot formation.
  • a number of die may be fabricated on a single silicon wafer, from which an individual die is cut or separated.

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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (13)

  1. Druckkopfprägeplatte, die Folgendes umfasst:
    ein Substrat (11);
    einen Schlitz (20; 420), der durch das Substrat (11) hindurch verläuft, wobei der Schlitz (20; 420) ein erstes Schlitzsegment (20a; 420a) und ein eigenständiges zweites Schlitzsegment (20b; 420b) enthält, wobei das zweite Schlitzsegment (20b; 420b) vom ersten Schlitzsegment (20a; 420a) entlang einer Hauptachse (2) und entlang einer rechtwinklig verlaufenden Nebenachse (4) versetzt ist, wobei der Versatz des ersten Schlitzsegments (20a; 420a) und des zweiten Schlitzsegments (20b; 420b) eine Leitung (70; 470a) zwischen dem ersten Schlitzsegment (20a; 420a) und dem zweiten Schlitzsegment (20b; 420b) definiert; und
    eine elektrische Leiterbahn (40a, 40b; 440a, 440b), die über das Substrat (11) durch die Leitung (70; 470a) führt.
  2. Druckkopfprägeplatte nach Anspruch 1, wobei das erste Schlitzsegment (20a; 420a) und das zweite Schlitzsegment (20b; 420b) benachbarte Enden entlang einer gleichen Nebenachse (4) aufweisen.
  3. Druckkopfprägeplatte nach Anspruch 1, wobei das erste Schlitzsegment (20a; 420a) in einer ersten Säule (12; 412) und das zweite Schlitzsegment (20b; 420b) in einer zweiten Säule (14; 414) parallel zur ersten Säule (12; 412) angeordnet ist.
  4. Druckkopfprägeplatte nach Anspruch 1, wobei der Schlitz (20) weiter ein drittes Schlitzsegment enthält, wobei sich aufeinanderfolgende Schlitzsegmente entlang der Hauptachse (2) zwischen einer ersten Säule (12; 412) und einer zweiten Säule (14; 414) abwechseln.
  5. Druckkopfprägeplatte nach Anspruch 4, wobei jedes Schlitzsegment in einer gegebenen Säule nach allen anderen Schlitzsegmenten in der gegebenen Säule ausgerichtet ist.
  6. Druckkopfprägeplatte nach Anspruch 1, wobei
    der Schlitz (20) Folgendes umfasst:
    einen ersten durchgehenden Schlitz, der in eine Vielzahl von eigenständigen Schlitzsegmenten unterteilt ist, um eine erste Flüssigkeit durch das Substrat (11) zu fördern, wobei der erste durchgehende Schlitz Leitungen (70; 470a) aufweist, die zwischen benachbarten Schlitzsegmenten des ersten durchgehenden Schlitzes definiert sind, und
    einen zweiten durchgehenden Schlitz, der in eine Vielzahl von eigenständigen Schlitzsegmenten aufgeteilt ist, um eine unterschiedliche zweite Flüssigkeit durch das Substrat (11) zu fördern, wobei der zweite durchgehende Schlitz Leitungen (70; 470a) aufweist, die zwischen benachbarten Schlitzsegmenten des zweiten durchgehenden Schlitzes definiert sind; und
    wobei die elektrische Leiterbahn (40a, 40b; 440a, 440b) über das Substrat (11) durch die Leitungen (70; 470a) führt.
  7. Druckkopfprägeplatte nach Anspruch 6, wobei die Schlitzsegmente in Reihen angeordnet sind, wobei jede Reihe ein Schlitzsegment des ersten durchgehenden Schlitzes und ein Schlitzsegment des zweiten durchgehenden Schlitzes enthält.
  8. Druckkopfprägeplatte nach Anspruch 7, wobei die Leitungen (70; 470a) zwischen benachbarten Schlitzsegmenten des ersten durchgehenden Schlitzes und des zweiten durchgehenden Schlitzes einen gewundenen Weg zwischen benachbarten Reihen der Schlitzsegmente definieren.
  9. Druckkopfprägeplatte nach Anspruch 7, wobei die Schlitzsegmente eines jeden durchgehenden Schlitzes in mehreren Säulen angeordnet sind, mit benachbarten Schlitzsegmenten in unterschiedlichen Säulen.
  10. Druckkopfprägeplatte nach Anspruch 9, wobei es sich bei Leitungen (70; 470a), die zwischen benachbarten Schlitzsegmenten eines jeden durchgehenden Schlitzes definiert sind, um diagonale Leitungen (70; 470a) handelt.
  11. Druckkopfprägeplatte nach Anspruch 10, die weiter eine Vielzahl von Düsenpaketen umfasst, wobei jedes Düsenpaket einem Schlitzsegment zugeordnet ist.
  12. Druckkopfprägeplatte nach Anspruch 11, wobei die elektrische Leiterbahn (40a, 40b; 440a, 440b), die über den zwischen benachbarten Schlitzsegmenten des ersten durchgehenden Schlitzes verläuft, in elektrischer Verbindung mit einem Düsenpaket steht, das einem Schlitzsegment des zweiten durchgehenden Schlitzes zugeordnet ist.
  13. Verfahren zum Herstellen einer Druckkopfprägeplatte, das Folgendes umfasst:
    Definieren (702) von Schlitzpositionen auf einem Substrat (11), versetzt zwischen zwei abwechselnden Säulen, für eine Vielzahl von Schlitzsegmenten (20a, 20b; 420a; 420b) zum Abgeben derselben Flüssigkeit durch das Substrat (11) hindurch;
    Bereitstellen (704) einer Elektronik neben jeder Schlitzposition zum Ansteuern einer Anordnung von der Schlitzposition zugeordneten Düsen;
    Bereitstellen (706) einer elektrischen Leiterbahn (40a, 40b; 440a, 440b), beginnend zwischen zwei aneinander angrenzenden Schlitzpositionen in einer Säule, um ein Ende einer dritten Schlitzposition in einer anderen Säule zur Elektronik an einer anderen Seite der dritten Schlitzposition verlaufend;
    Ausbilden (708) von Schlitzen durch das Substrat (11) hindurch an den Schlitzpositionen; und
    Ausbilden (710) von Düsenanordnungen auf der an jeden Schlitz und jede Elektronik angrenzenden Prägeplatte.
EP11866663.5A 2011-05-31 2011-05-31 Druckkopfchip Active EP2714407B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL11866663T PL2714407T3 (pl) 2011-05-31 2011-05-31 Matryca głowicy drukującej

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038540 WO2012166112A1 (en) 2011-05-31 2011-05-31 Printhead die

Publications (3)

Publication Number Publication Date
EP2714407A4 EP2714407A4 (de) 2014-04-09
EP2714407A1 EP2714407A1 (de) 2014-04-09
EP2714407B1 true EP2714407B1 (de) 2016-03-16

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EP (1) EP2714407B1 (de)
CN (1) CN103561958B (de)
ES (1) ES2566000T3 (de)
HU (1) HUE026795T2 (de)
PL (1) PL2714407T3 (de)
TW (1) TWI480173B (de)
WO (1) WO2012166112A1 (de)

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US9782978B2 (en) 2014-05-29 2017-10-10 Hewlett-Packard Development Company, L.P. Serpentine direction reversal in bidirectional error diffusion halftoning
CN108705866B (zh) * 2014-05-30 2020-04-24 惠普发展公司，有限责任合伙企业 流动结构、打印头组件模块和打印杆
US9987845B2 (en) 2014-05-30 2018-06-05 Hewlett-Packard Development Company, L.P. Printhead assembly module
TWI612313B (zh) * 2014-09-05 2018-01-21 惠普發展公司有限責任合夥企業 監測寄生電阻之技術及相關流體噴出裝置與電子控制器

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US6863381B2 (en) * 2002-12-30 2005-03-08 Lexmark International, Inc. Inkjet printhead heater chip with asymmetric ink vias
US7083267B2 (en) * 2003-04-30 2006-08-01 Hewlett-Packard Development Company, L.P. Slotted substrates and methods and systems for forming same
TWI256143B (en) * 2005-10-11 2006-06-01 Integrated Crystal Technology A hybridization packaging structure and method of led chip and multiplexer/driver chip for led printer head

Also Published As

Publication number Publication date
WO2012166112A1 (en) 2012-12-06
TW201302494A (zh) 2013-01-16
CN103561958B (zh) 2017-09-08
PL2714407T3 (pl) 2016-08-31
EP2714407A4 (de) 2014-04-09
TWI480173B (zh) 2015-04-11
ES2566000T3 (es) 2016-04-08
EP2714407A1 (de) 2014-04-09
CN103561958A (zh) 2014-02-05
HUE026795T2 (en) 2016-07-28

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